Light-emitting apparatus and display apparatus

Abstract

Disclosed in the present invention are a light-emitting apparatus and a display apparatus. The light-emitting apparatus comprises a transparent layer, a plurality of light-emitting elements arranged at intervals, a driving chip, and two or more pads. The transparent layer comprises a first surface and a second surface disposed opposite each other, and the first surface is a light-emergent surface. The plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer. The driving chip is disposed on the second surface of the transparent layer and spaced apart from the light-emitting elements, and the light-emitting elements are electrically connected to different terminals on the driving chip. The two or more pads are spaced apart from each other above the light-emitting elements and the driving chip, a driving voltage difference between at least one of the plurality of light-emitting elements and the remaining light-emitting elements ranges from 0.2 v to 0.5 v, and at least one light-emitting element is connected to a different pad from the remaining light-emitting elements. Thus, the present invention can reduce device power consumption and improve device reliability.

Description

Light-emitting device and display device TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor devices, in particular to a light-emitting device and a display device. BACKGROUND

[0002] In recent years, new display technologies have been developing rapidly, such as OLED, MicroLED and other technologies have been widely researched and concerned. LED chips are widely used in display devices, vehicle lamps, general lighting lamps and other fields due to their high reliability, long service life and low power consumption. And because of the low power consumption of LED, it has become the mainstream in the field of display screen technology. However, the pixel unit formed by packaging three RGB LED chips currently has the problems of coupling, low gray flicker, high power consumption and low reliability, which need to be overcome. SUMMARY

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a light-emitting device and a display device, which can further eliminate coupling and improve low gray display, and realize high light efficiency, low power consumption and high reliability.

[0004] In order to achieve the above-mentioned purpose and other related purposes, the present application provides a light-emitting device, comprising:

[0005] A transparent layer comprising a first surface and a second surface arranged oppositely, the first surface being a light-out surface;

[0006] A plurality of light-emitting elements arranged at intervals, arranged on the second surface of the transparent layer;

[0007] A driving chip arranged on the second surface of the transparent layer and arranged at intervals with the light-emitting elements, and each light-emitting element forms an electrical connection with a different terminal on the driving chip;

[0008] Two or more pads arranged at intervals above the light-emitting elements and the driving chip, the difference between the driving voltage of at least one light-emitting element in the plurality of light-emitting elements and the driving voltage of the remaining light-emitting elements is between 0.2 v and 0.5 v, and the at least one light-emitting element is connected to different pads from the remaining light-emitting elements.

[0009] According to one aspect of the present application, a light-emitting device is also provided, comprising:

[0010] A transparent layer comprising a first surface and a second surface arranged oppositely, the first surface being a light-out surface;

[0011] Three light-emitting elements arranged at intervals, arranged on the second surface of the transparent layer;

[0012] The driving chip is arranged on the second surface of the transparent layer and is arranged apart from the light emitting elements, eight terminals are arranged on the driving chip, the eight terminals include a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal and an eighth terminal; the first terminal is connected with the second electrode of the first light emitting element, the second terminal is connected with the second electrode of the second light emitting element, and the third terminal is connected with the second electrode of the third light emitting element;

[0013] The first pad is connected with the first electrode of the first light emitting element, the second electrode of the second light emitting element and the first electrode of the third light emitting element, and is connected with the fourth terminal;

[0014] The second pad is connected with the fifth terminal;

[0015] The third pad is connected with the sixth terminal;

[0016] The fourth pad is connected with the seventh terminal;

[0017] The fifth pad is connected with the eighth terminal. According to one aspect of the present application, a display device is also provided, comprising:

[0018] A display substrate;

[0019] At least one light emitting device is arranged on the display substrate, each light emitting device is electrically connected with the display substrate, and the light emitting device is the light emitting device described above.

[0020] Compared with the prior art, the light emitting device and the display device described in the present application have at least the following beneficial effects:

[0021] The light emitting device of the present application comprises a transparent layer, a plurality of light emitting elements arranged apart, a driving chip and two or more pads. The transparent layer comprises a first surface and a second surface arranged oppositely, and the first surface is a light emitting surface. The plurality of light emitting elements arranged apart are arranged on the second surface of the transparent layer. The driving chip is arranged on the second surface of the transparent layer and is arranged apart from the light emitting elements, and each light emitting element is electrically connected with a different terminal on the driving chip. Two or more pads are arranged apart above the light emitting elements and the driving chip, the driving voltage difference between at least one light emitting element and the remaining light emitting elements is between 0.2 v and 0.5 v, and the at least one light emitting element is connected with different pads from the remaining light emitting elements. Furthermore, the light emitting elements with larger driving voltage difference on the light emitting device are driven separately in the present application, so as to avoid unnecessary power consumption caused by inconsistent driving voltage of different light emitting elements, and to avoid damage to the light emitting elements caused by mismatched driving voltage, which is beneficial to the reliability and service life of the light emitting elements.

[0022] The display device of the present application comprises the light emitting device described above, and also has the technical effects described above. Attached Figure Description

[0023] Figure 1 is a schematic diagram of the light-emitting device described in Embodiment 1 of the present invention;

[0024] Figure 2 is an enlarged view of point A in Figure 1;

[0025] Figure 3a is a cross-sectional view along B-B' in Figure 1 of an example of Embodiment 1 of the present invention;

[0026] Figure 3b is a cross-sectional view along B-B' in Figure 1 of another example of Embodiment 1 of the present invention;

[0027] Figure 4 is a schematic diagram of the light-emitting device described in Embodiment 2 of the present invention;

[0028] Figure 5 is a schematic diagram of the light-emitting device described in Embodiment 3 of the present invention;

[0029] Figure 6 is an enlarged view of point C in Figure 5;

[0030] Figure 7 is a schematic diagram of the light-emitting device described in Embodiment 4 of the present invention;

[0031] Figure 8 is an enlarged view of point C in Figure 7.

[0032] List of reference numerals in the attached diagram: Detailed Implementation

[0033] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0034] It should be understood that the illustrations provided in the embodiments of this invention are merely schematic representations of the basic concept of the invention. Although the illustrations only show components relevant to the invention and are not drawn according to the actual number, shape, and size of components in implementation, the shape, quantity, and proportion of each component can be arbitrarily changed in actual implementation, and the component layout may also be more complex. The structures, proportions, sizes, etc., shown in the accompanying drawings are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the invention can produce, should still fall within the scope of the technical content disclosed in this application.

[0035] In order to eliminate coupling, improve low-gray display, realize high light efficiency, low power consumption and high reliability, the embodiment provides a light emitting device, comprising:

[0036] A transparent layer comprising a first surface and a second surface arranged oppositely, the first surface being a light emitting surface;

[0037] A plurality of light emitting elements arranged at intervals are arranged on the second surface of the transparent layer;

[0038] A driving chip is arranged on the second surface of the transparent layer and arranged at intervals with the light emitting elements, and each light emitting element forms an electrical connection with a different terminal on the driving chip;

[0039] Two or more pads are arranged at intervals above the light emitting elements and the driving chip, the difference between the driving voltages of at least one light emitting element and the remaining light emitting elements in the plurality of light emitting elements is between 0.2v and 0.5v, and the at least one light emitting element is connected to a different pad from the remaining light emitting elements. Thus, the embodiment separately drives the light emitting elements with a larger driving voltage difference on the light emitting device to avoid unnecessary power consumption caused by inconsistent driving voltages of different light emitting elements, while avoiding damage to the light emitting elements caused by mismatched driving voltages, which is beneficial to the reliability and service life of the light emitting elements.

[0040] Optionally, the pads include a first pad, a second pad, and other pads, the plurality of light emitting elements include a first light emitting element, a second light emitting element, and a third light emitting element, the first light emitting element and the second light emitting element are connected to the first pad, and the third light emitting element is connected to the second pad. The embodiment separately drives the first light emitting element, the second light emitting element, and the third light emitting element with a larger driving voltage difference on the light emitting device to avoid unnecessary power consumption caused by inconsistent driving voltages of different light emitting elements, while being beneficial to the reliability and service life of the light emitting elements.

[0041] Optionally, each light emitting element includes a first electrode and a second electrode arranged at intervals, the first electrode and the second electrode are arranged on a side of the light emitting element away from the transparent layer, the first electrode of the first light emitting element is connected to the first pad, the first electrode of the second light emitting element is electrically connected to the first pad, and the first electrode of the third light emitting element is electrically connected to the second pad.

[0042] Optionally, the plurality of pads arranged at intervals further include a third pad, a fourth pad, and a fifth pad, and the driving chip includes seven terminals, the seven terminals include:

[0043] A first terminal electrically connected to the second electrode of the first light emitting element;

[0044] A second terminal electrically connected to the second electrode of the second light emitting element;

[0045] the third terminal is electrically connected with the second electrode of the third light emitting element;

[0046] the fourth terminal is electrically connected with the second pad;

[0047] the fifth terminal is electrically connected with the third pad;

[0048] the sixth terminal is electrically connected with the fourth pad;

[0049] the seventh terminal is electrically connected with the fifth pad.

[0050] Optionally, the plurality of spaced pads further include a third pad, a fourth pad, a fifth pad and a sixth pad, and the driving chip includes seven terminals, and the seven terminals include:

[0051] the first terminal is electrically connected with the second electrode of the first light emitting element;

[0052] the second terminal is electrically connected with the second electrode of the second light emitting element;

[0053] the third terminal is electrically connected with the second electrode of the third light emitting element;

[0054] the fourth terminal is electrically connected with the sixth pad;

[0055] the fifth terminal is electrically connected with the third pad;

[0056] the sixth terminal is electrically connected with the fourth pad;

[0057] the seventh terminal is electrically connected with the fifth pad.

[0058] The third light emitting element in the embodiment and the driving chip can be driven individually through the second pad and the sixth pad, unnecessary power consumption caused by inconsistent driving voltage of the two can be avoided, high light efficiency and low power consumption can be realized. Further, the light emitting device includes six pads, and every three pads are evenly distributed on two sides of the light emitting device, which is beneficial to uniformity and reliability of subsequent die bonding. In the embodiment, six pads are included, and every three pads are evenly distributed on two sides of the light emitting device, which is beneficial to uniformity and reliability of subsequent die bonding.

[0059] Optionally, the plurality of spaced pads further include a third pad, a fourth pad, a fifth pad and a sixth pad, and the driving chip includes eight terminals, and the eight terminals include:

[0060] the first terminal is electrically connected with the second electrode of the first light emitting element;

[0061] the second terminal is electrically connected with the second electrode of the second light emitting element;

[0062] the third terminal is electrically connected with the second electrode of the third light emitting element;

[0063] the fourth terminal is in electrical connection with the second pad;

[0064] the fifth terminal is in electrical connection with the third pad;

[0065] the sixth terminal is in electrical connection with the fourth pad;

[0066] the seventh terminal is in electrical connection with the fifth pad;

[0067] the eighth terminal is in electrical connection with the sixth pad.

[0068] The eighth terminal in the embodiment is a signal switch terminal, which is equivalent to a signal switch. When the voltage inputted through the sixth pad reaches a preset value, for example, 1.8V, the row data and the column data can directly reach the light emitting device to drive the light emitting device. If there is no EN terminal, the logic signal in front of the driving IC will be complex and the reliability will be low. Further, the embodiment adds the EN terminal on the driving chip as the driving switch of the light emitting device, which can directly drive the light emitting device through the EN terminal, avoiding the situation that other driving modes are relatively complex and lead to low driving reliability. Similarly, the setting of the six pads is beneficial to the subsequent die bonding uniformity and reliability.

[0069] Optionally, the eighth terminal is an EN terminal, and the EN terminal is a signal switch terminal.

[0070] Optionally, the driving chip is an IC chip.

[0071] Optionally, the driving chip is an active driving IC chip, so that the coupling can be completely eliminated and the problem of low gray display can be improved.

[0072] Optionally, the first light emitting element, the second light emitting element and the third light emitting element are three light emitting elements emitting light of different colors from each other, and the third light emitting element is a light emitting element radiating red light.

[0073] Optionally, the first light emitting element is a light emitting element radiating blue light, and the second light emitting element is a light emitting element radiating green light; or the first light emitting element is a light emitting element radiating green light, and the second light emitting element is a light emitting element radiating blue light.

[0074] Optionally, the light emitting device further comprises:

[0075] a filling layer arranged on the sidewall of the light emitting element and the sidewall of the driving chip.

[0076] Optionally, the light emitting device further comprises:

[0077] a wiring layer arranged on the filling layer, the light emitting element and the driving chip, one end of the wiring layer is in electrical connection with the light emitting element and the driving chip respectively, and the other end of the wiring layer is in electrical connection with the plurality of spaced pads respectively.

[0078] Optionally, the light emitting device further comprises a wiring layer, the wiring layer is arranged above the light emitting elements and the driving chip, the wiring layer comprises nine sub-wirings, the nine sub-wirings comprise:

[0079] a first sub-wiring, one end of which is connected to the first terminal, and the other end of which is connected to the second electrode of the first light emitting element;

[0080] a second sub-wiring, one end of which is connected to the second terminal, and the other end of which is connected to the second electrode of the second light emitting element;

[0081] a third sub-wiring, one end of which is connected to the third terminal, and the other end of which is connected to the second electrode of the third light emitting element;

[0082] a fourth sub-wiring, one end of which is connected to the first electrode of the first light emitting element and the first electrode of the second light emitting element, and the other end of which is connected to the first pad;

[0083] a fifth sub-wiring, one end of which is connected to the first electrode of the third light emitting element, and the other end of which is connected to the second pad;

[0084] a sixth sub-wiring, one end of which is connected to the fourth terminal, and the other end of which is connected to the second pad;

[0085] a seventh sub-wiring, one end of which is connected to the fifth terminal, and the other end of which is connected to the third pad;

[0086] an eighth sub-wiring, one end of which is connected to the sixth terminal, and the other end of which is connected to the fourth pad;

[0087] a ninth sub-wiring, one end of which is connected to the seventh terminal, and the other end of which is connected to the fifth pad.

[0088] Optionally, the light emitting device further comprises a wiring layer, the wiring layer is arranged above the light emitting elements and the driving chip, the wiring layer comprises nine sub-wirings, the nine sub-wirings comprise:

[0089] a first sub-wiring, one end of which is connected to the first terminal, and the other end of which is connected to the second electrode of the first light emitting element;

[0090] a second sub-wiring, one end of which is connected to the second terminal, and the other end of which is connected to the second electrode of the second light emitting element;

[0091] a third sub-wiring, one end of which is connected to the third terminal, and the other end of which is connected to the second electrode of the third light emitting element;

[0092] a fourth sub-wiring, one end of which is connected to the first electrode of the first light emitting element and the first electrode of the second light emitting element, and the other end of which is connected to the first pad;

[0093] a fifth sub-wiring, one end of which is connected to the first electrode of the third light emitting element, and the other end of which is connected to the second pad;

[0094] The sixth sub-wiring has one end connected to the fourth terminal and the other end connected to the sixth pad;

[0095] The seventh sub-wiring has one end connected to the fifth terminal and the other end connected to the third pad;

[0096] The eighth sub-wiring has one end connected to the sixth terminal and the other end connected to the fourth pad;

[0097] The ninth sub-wiring has one end connected to the seventh terminal and the other end connected to the fifth pad.

[0098] Optionally, the light emitting device further comprises a wiring layer, the wiring layer is disposed above the light emitting elements and the driving chip, and the wiring layer comprises ten sub-wirings, the ten sub-wirings comprise:

[0099] The first sub-wiring has one end connected to the first terminal and the other end connected to the second electrode of the first light emitting element;

[0100] The second sub-wiring has one end connected to the second terminal and the other end connected to the second electrode of the second light emitting element;

[0101] The third sub-wiring has one end connected to the third terminal and the other end connected to the second electrode of the third light emitting element;

[0102] The fourth sub-wiring has one end connected to the first electrode of the first light emitting element and the first electrode of the second light emitting element, and the other end connected to the first pad;

[0103] The fifth sub-wiring has one end connected to the first electrode of the third light emitting element and the other end connected to the second pad;

[0104] The sixth sub-wiring has one end connected to the fourth terminal and the other end connected to the second pad;

[0105] The seventh sub-wiring has one end connected to the fifth terminal and the other end connected to the third pad;

[0106] The eighth sub-wiring has one end connected to the sixth terminal and the other end connected to the fourth pad;

[0107] The ninth sub-wiring has one end connected to the seventh terminal and the other end connected to the fifth pad;

[0108] The tenth sub-wiring has one end connected to the eighth terminal and the other end connected to the sixth pad.

[0109] Optionally, the light emitting device further comprises:

[0110] A packaging layer is filled between adjacent sub-wirings and covers part of the wiring layer, and the pads are formed on the exposed wiring layer.

[0111] Optionally, the driving chip is disposed in the central region of the transparent layer.

[0112] Optionally, the thickness of the driving chip is greater than the thickness of the light emitting element, and the thickness of the driving chip is less than or equal to 5 times the thickness of the light emitting element.

[0113] According to an aspect of the present application, there is also provided a light emitting device, comprising:

[0114] a transparent layer comprising a first surface and a second surface arranged oppositely, the first surface being a light emitting surface;

[0115] three light emitting elements arranged at intervals, arranged on the second surface of the transparent layer;

[0116] a driving chip arranged on the second surface of the transparent layer and arranged at intervals with the light emitting elements, the driving chip being provided with eight terminals, the eight terminals comprising a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal and an eighth terminal; the first terminal being connected with the second electrode of the first light emitting element, the second terminal being connected with the second electrode of the second light emitting element, and the third terminal being connected with the second electrode of the third light emitting element;

[0117] a first pad connected with the first electrode of the first light emitting element, the second electrode of the second light emitting element and the first electrode of the third light emitting element, and connected with the fourth terminal;

[0118] a second pad connected with the fifth terminal;

[0119] a third pad connected with the sixth terminal;

[0120] a fourth pad connected with the seventh terminal;

[0121] a fifth pad connected with the eighth terminal.

[0122] Optionally, the eighth terminal is an EN terminal, and the EN terminal is a signal switch terminal. The eighth terminal in the embodiment is a signal switch terminal, which is equivalent to a signal switch. When the voltage of the EN terminal input through the sixth pad reaches a preset value, for example, 1.8V, the row data and the column data can directly reach the light emitting device to drive the light emitting device. If there is no EN terminal, the logic signal in front of the driving IC will be very complex, and the reliability is low. Further, the embodiment adds the EN terminal on the driving chip as the driving switch of the light emitting device, which can directly drive the light emitting device through the EN terminal, avoiding the situation that other driving modes are relatively complex, resulting in low driving reliability.

[0123] According to an aspect of the present application, there is also provided a display device, comprising:

[0124] a display substrate;

[0125] At least one light emitting device is arranged on the display substrate, each light emitting device forms an electrical connection with the display substrate, the light emitting device is the light emitting device described above, the display device in the embodiment includes the light emitting device described above, and has the technical effects of the light emitting device described above.

[0126] The application will be described in detail below with reference to specific examples. Embodiment 1

[0127] The embodiment provides a light emitting device. Referring to FIG. 1, the light emitting device includes a transparent layer 100, a plurality of light emitting elements arranged at intervals, a driving chip 300, and two or more pads.

[0128] The transparent layer 100 can have a light transmittance of 60% or more in the visible light range. Alternatively, the transparent layer 100 can be a transparent substrate, which can be a light-transmissive substrate such as PET, glass, quartz, sapphire, transparent ceramic, and the like. The light emitting device needs to have a certain thickness to facilitate use by a client, and therefore the thickness of the transparent layer 100 is preferably greater than 10 μm, and more preferably 30 μm to 50 μm, 50 μm to 100 μm, or 100 μm to 300 μm. Referring to FIG. 3, the transparent layer 100 includes a first surface 101 and a second surface 102 arranged oppositely, and the first surface 101 is a light exit surface of the entire light emitting device. The second surface 102 of the transparent layer 100 is provided with the light emitting elements and the driving chip 300.

[0129] Referring to FIGS. 1 and 3a-3b, the plurality of light emitting elements are arranged on the second surface 102 of the transparent layer 100. Since different light emitting elements usually have different thicknesses, an adhesive layer (not shown in the figure) is arranged between the transparent layer 100 and the light emitting elements, and the material of the adhesive layer can be a material such as silicone that has elasticity. Therefore, the light emitting element part will sink into the adhesive layer to keep the electrode surface of the light emitting element at the same height, and the height difference of the light exit surface of each light emitting element can be reduced, so that the light emitted from the side surface of the light emitting element is absorbed by the filling layer 400 described below as much as possible to improve the contrast of the light emitting device. The thickness of the adhesive layer is preferably 1 μm to 15 μm or 3 μm to 10 μm. If the thickness of the adhesive layer is greater than 15 μm, the alignment accuracy of the light emitting elements can be affected.

[0130] The light emitting element in the embodiment mainly refers to a micron-level light emitting diode, and the width or length thereof ranges from 2 μm to 5 μm, 5 μm to 10 μm, 10 μm to 20 μm, 20 μm to 50 μm, or 50 μm to 100 μm, and the thickness thereof ranges from 2 μm to 15 μm, and is preferably 5 μm to 10 μm.

[0131] Specifically, each light emitting element includes a semiconductor stack layer, which can include a first semiconductor layer, a second semiconductor layer and an active layer arranged between the two in sequence, wherein the first semiconductor layer is an N-type semiconductor layer, the second semiconductor layer is a P-type semiconductor layer, and the active layer is a multi-layer quantum well layer, which can provide red light or green light or blue light radiation. The N-type semiconductor layer, the multi-layer quantum well layer and the P-type semiconductor layer are only basic constituent units of the light emitting element, and on this basis, the light emitting element can further include other functional structure layers which have an optimization effect on the performance of the light emitting element.

[0132] In the present embodiment, referring to FIG. 1, the plurality of light emitting elements include a first light emitting element 201, a second light emitting element 202 and a third light emitting element 203. The first light emitting element 201, the second light emitting element 202 and the third light emitting element 203 respectively radiate light rays of different wavelength ranges and have different driving voltages. For example, the first light emitting element 201 radiates blue light rays, the second light emitting element 202 radiates green light rays, and the third light emitting element 203 radiates red light rays, wherein the driving voltage difference between the light emitting elements radiating blue light and green light rays and the light emitting element radiating red light is large. In an embodiment, different light emitting elements can have different semiconductor stack layers, thereby directly radiating light rays of different wavelength ranges. The specific materials of the semiconductor stack layers are selected according to the wavelengths of the radiated light rays, which include but are not limited to aluminum gallium arsenide, gallium arsenide phosphide, aluminum gallium indium phosphide, gallium nitride, indium gallium nitride, zinc selenide or gallium phosphide. In another embodiment, different light emitting elements can have the same semiconductor stack layer. For example, the semiconductor stack layers in the first light emitting element 201, the second light emitting element 202 and the third light emitting element 203 all radiate blue light rays, and a wavelength conversion layer is arranged on the light emitting surface of the second light emitting element 202 to convert the radiated blue light rays into green light rays, and a wavelength conversion layer is arranged on the light emitting surface of the third light emitting element 203 to convert the radiated blue light rays into red light rays.

[0133] Each light emitting element further includes a first electrode 210 and a second electrode 220. The semiconductor stack layer has a mesa exposing the first semiconductor layer, the first electrode 210 is formed on the mesa and electrically connected to the first semiconductor layer, and the second electrode 220 is formed on the second semiconductor layer and electrically connected to the second semiconductor layer.

[0134] Referring to FIGS. 1 and 3a-3b, the driving chip 300 is also disposed on the second surface 102 of the transparent layer 100 and is spaced apart from the light emitting elements. The driving chip 300 is used to process data signals of the controller and the pixels. The driving chip 300 is provided with a plurality of terminals, and each light emitting element is electrically connected to a different terminal on the driving chip 300. Optionally, the driving chip 300 is an active driving IC chip. The use of an active driving IC chip can improve the display quality of the light emitting module and can drive the light emitting module at a smaller driving voltage, thereby increasing the service life of the display panel.

[0135] Optionally, the positions of the driving chip 300 and the light emitting elements on the transparent layer 100 can be arbitrary as long as they do not affect the arrangement of other structures. In this embodiment, the driving chip 300 is disposed at the center of the transparent layer 100, and the three light emitting elements are disposed on one side of the driving chip 300 as a light emitting portion. In order to avoid the size of the driving chip 300 being too large and occupying too much space of the light emitting device, the size of the driving chip 300 is between about 1 μm and 100 μm. Specifically, the size of the driving chip 300 can be 5 μm, 10 μm, 20 μm, 50 μm, 70 μm, or 100 μm. Optionally, the thickness of the driving chip 300 is less than 50 μm. In order to facilitate the transfer of the driving chip 300 and the light emitting elements to the transparent layer 100, the thickness difference between the driving chip 300 and the light emitting elements is less than 50 μm, for example, less than 25 μm, or less than 15 μm, which can effectively improve the transfer yield of the driving chip 300 and the light emitting elements transferred to the transparent layer 100. Optionally, the thickness of the driving chip 300 is greater than the thickness of the light emitting elements, and the thickness of the driving chip 300 is less than or equal to 5 times the thickness of the light emitting elements. If the thickness of the driving chip 300 is too much greater than the thickness of the chip, it is not conducive to the preparation of the subsequent laminated structure formed above the two.

[0136] In this embodiment, referring to FIGS. 1 and 2, the driving chip 300 includes seven terminals, which are a first terminal 301, a second terminal 302, a third terminal 303, a fourth terminal 304, a fifth terminal 305, a sixth terminal 306, and a seventh terminal 307. Among them, the first terminal 301 to the third terminal 303 can be connected to the three light emitting elements respectively and used to control the switching of the light emitting elements, the fourth terminal 304 is a positive power terminal, the fifth terminal 305 is a negative power terminal, the sixth terminal 306 is a timing signal input terminal, and the seventh terminal 307 is a data signal input terminal. However, the number and order of the terminals of the driving chip 300 are not limited to this, that is, the number and function of the terminals of the driving chip 300 can be designed according to the needs of the light emitting device function.

[0137] Optionally, referring to FIG. 1 and 3a, 3b, the light emitting device further comprises a filling layer 400, which is arranged on the sidewall of the light emitting element and the sidewall of the driving chip 300, and can prevent color mixing or light interference between adjacent light emitting elements, so as to improve the contrast of the light emitting device. The filling layer 400 is provided as a black glue layer which absorbs light.

[0138] Optionally, referring to FIG. 3a or 3b, the light emitting device further comprises a wiring layer 500, which is arranged on the filling layer 400, the light emitting element and the driving chip 300, and is electrically connected with the light emitting element and the driving chip 300 respectively. The wiring layer 500 comprises a plurality of wirings, and the periphery of the wiring layer 500 is filled with an insulating layer to electrically isolate adjacent wirings. The wiring layer 500 can be a single layer or a plurality of layers made of at least one material selected from titanium, copper, chromium, nickel, gold, platinum, aluminum, titanium nitride, tantalum nitride or tantalum. In the embodiment, the wiring layer 500 comprises a two-layer structure, specifically a first layer 511 and a second layer 512, the first layer 511 directly contacts the light emitting element and the driving chip 300, and the second layer 512 is formed on the first layer 511. The first layer 511 is used to adhere the second layer 512 to the light emitting element, the driving chip 300 and the filling layer 400, and the second layer 512 mainly plays a conductive role. The material of the first layer 511 includes but is not limited to one or more of titanium, nickel, titanium nitride, tantalum nitride or tantalum, and the material of the second layer 512 includes but is not limited to one or more of copper, aluminum or gold. The wiring layer 500 can be prepared by sputtering, evaporation and the like. In the embodiment, the wiring layer 500 comprises nine sub-wirings, including a first sub-wiring 501, a second sub-wiring 502, a third sub-wiring 503, a fourth sub-wiring 504, a fifth sub-wiring 505, a sixth sub-wiring 506, a seventh sub-wiring 507, an eighth sub-wiring 508 and a ninth sub-wiring 509. The sub-wirings are arranged with intervals and are insulated from each other.

[0139] Referring to FIGS. 1 and 3, two or more pads are disposed on the wiring layer 500. The two or more pads include a first pad 701, a second pad 702, and other pads. The first light emitting element 201 and the second light emitting element 202 are connected to the first pad 701, and the third light emitting element 203 is connected to the second pad 702, so as to separately drive the third light emitting element 203 with a driving voltage different from that of the first light emitting element 201 and the second light emitting element 202. In the present embodiment, the other pads include a third pad 703, a fourth pad 704, and a fifth pad 705. The first pad 701 is connected to the first electrode 210 of the first light emitting element 201 and the first electrode 210 of the second light emitting element 202 through the first sub-wiring 501. The second pad 702 is connected to the first electrode 210 of the third light emitting element 203 through the second sub-wiring 502, and is connected to the fourth terminal 304 of the driving chip 300 through the sixth sub-wiring 506. The third pad 703 is connected to the fifth terminal 305 through the seventh sub-wiring 507, the fourth pad 704 is connected to the sixth terminal 306 through the eighth sub-wiring 508, and the fifth pad 705 is connected to the seventh terminal 307 through the ninth sub-wiring. The light emitting elements are also electrically connected to the driving chip 300 through the wiring layer 500. Specifically, the second electrode 220 of the first light emitting element 201 is connected to the first terminal 301 through the third sub-wiring 503, the second electrode 220 of the second light emitting element 202 is connected to the second terminal 302 through the fourth sub-wiring 504, and the second electrode 220 of the third light emitting element 203 is connected to the third terminal 303 through the fifth sub-wiring 505. The first pad 701 (VGB) is electrically connected to the first light emitting element 201 and the second light emitting element 202, and inputs a driving voltage thereto, and the second pad 702 (VR) is electrically connected to the third light emitting element 203 and the driving chip 300, so as to simultaneously input a driving voltage to the third light emitting element 203 and the driving chip 300. The first light emitting element 201 and the second light emitting element 202 are respectively a blue light emitting element and a green light emitting element, and the third light emitting element 203 is a red light emitting element. Since the driving voltage required by the red light emitting element is greatly different from that of the blue light emitting element and the green light emitting element, separately driving the red light emitting element can avoid unnecessary power consumption caused by simultaneous driving, and is conducive to saving energy consumption; and can also avoid damage to the light emitting element caused by mismatched driving voltage, and is conducive to the reliability and service life of the light emitting element. The third pad 703 (Row / Clk) and the fourth pad 704 (Col / Data) input data signals and timing signals to the driving chip 300, the fifth pad 705 (Gnd) is electrically connected to the driving chip 300 for grounding. The first terminal 301, the second terminal 302, and the third terminal 303 control the switching of the three light emitting elements. The light emitting device emits light with a specific brightness based on the driving voltage.

[0140] Optionally, the wiring layer 500 further has an insulating layer 600 formed thereon, the insulating layer 600 has openings corresponding to the number of pads, the pads can be arranged in the openings and exposed on the surface of the insulating layer, or can be arranged inside the openings of the insulating layer. In an example, as shown in FIG. 3a, the first pad 701 is arranged on the second layer 512 of the wiring layer 500, and the first pad 701 extends out of the insulating layer 600 and is exposed on the surface of the insulating layer 600. In an example, as shown in FIG. 3b, the first pad 701 is arranged on the second layer 512 of the wiring layer 500, and the first pad 701 has a small thickness and is arranged in the opening of the insulating layer 600 and is not exposed on the surface of the insulating layer 600. At this time, the first pad 701 is a thin metal protective layer plated on the wiring layer 500 to prevent the wiring layer from being oxidized, and also serves as a pad. Optionally, the material of the first pad 701 is NiAu.

[0141] It should be noted that the distance between the pads needs to be controlled within a reasonable range to avoid the influence between adjacent pads and affect the yield of the light emitting device. For example, the distance between adjacent pads can be controlled to be greater than 60 μm to avoid the influence between adjacent pads.

[0142] The encapsulation layer 600 is filled around the pads to electrically isolate adjacent sub-pads. The encapsulation layer 600 is a light-absorbing glue layer, for example, the encapsulation layer 600 is formed by dispersing black filling components in transparent or semi-transparent materials such as silicone, epoxy resin, polyimide, low-temperature glass, polysiloxane, polysilazane, etc. The black filling components in the encapsulation layer 600 include but are not limited to carbon black, titanium nitride, iron oxide, ferric oxide, iron powder, etc. Embodiment 2

[0143] This embodiment provides a light emitting device, which is the same as that of embodiment 1, and the difference is that:

[0144] Referring to FIG. 4, the other pads in this embodiment further include a sixth pad 706. In this embodiment, the second pad 702 is only connected with the first electrode 210 of the third light emitting element 203, and the sixth pad 706 is connected with the fourth terminal 304 of the driving chip 300. This embodiment splits the second pad 702 in embodiment 1 into the second pad 702 and the sixth pad 706 in this embodiment, so that the third light emitting element 203 and the driving chip 300 can be driven separately through different pads, avoiding unnecessary power consumption when the driving voltages of the two are inconsistent. Further, the light emitting device includes six pads, and every three pads are evenly distributed on both sides of the light emitting device, which is beneficial to the uniformity and reliability of subsequent die bonding. Embodiment 3

[0145] The embodiment provides a light emitting device, which is the same as that in the embodiment 1, and the difference is that:

[0146] Referring to FIGS. 5 and 6, the other pads in the embodiment include a sixth pad 706, the terminals on the driving chip 300 further include an eighth terminal 308, and the wiring layer 500 further includes a tenth sub-wiring 510. The sixth pad 706 is electrically connected to the eighth terminal 308 through the tenth sub-wiring 510. The eighth terminal 308 is a signal switch terminal, which is equivalent to a signal switch. When the voltage of the EN terminal input through the sixth pad 706 reaches a preset value, for example, 1.8V, the row data and the column data can directly reach the light emitting device, so as to drive the light emitting device. If there is no EN terminal, the logic signal in front of the driving IC will be complex, and the reliability is low. Further, the embodiment adds the EN terminal on the driving chip 300 as the driving switch of the light emitting device, so that the light emitting device can be directly driven through the EN terminal, the situation that the driving is complex and the reliability is low is avoided, the power consumption of the light emitting device is further reduced, and the reliability of the device is improved. Embodiment 4

[0147] The embodiment provides a light emitting device, which is the same as that in the embodiment 1, and the difference is that:

[0148] Referring to FIGS. 7 and 8, the driving chip in the embodiment is provided with eight terminals, which include a first terminal 301, a second terminal 302, a third terminal 303, a fourth terminal 304, a fifth terminal 305, a sixth terminal 306, a seventh terminal 307 and an eighth terminal 308. The first terminal 301 is connected to the second electrode 220 of the first light emitting element 201, the second terminal 302 is connected to the second electrode 220 of the second light emitting element 202, and the third terminal 303 is connected to the second electrode 220 of the third light emitting element 203. The pads include a first pad 701, a second pad 702, a third pad 703, a fourth pad 704 and a fifth pad 705. The first pad 701 is connected to the first electrode 210 of the first light emitting element 201, the first electrode 210 of the second light emitting element 202 and the first electrode 210 of the third light emitting element 203, and is connected to the fourth terminal 304. The second pad 702 is connected to the fifth terminal 305. The third pad 703 is connected to the sixth terminal 306. The fourth pad 704 is connected to the seventh terminal 307. The fifth pad 705 is connected to the eighth terminal 308.

[0149] Specifically, referring to FIGS. 7 and 8, the wiring layer 500 includes nine sub-wirings, including a first sub-wiring 501, a second sub-wiring 502, a third sub-wiring 503, a fourth sub-wiring 504, a fifth sub-wiring 505, a sixth sub-wiring 506, a seventh sub-wiring 507, an eighth sub-wiring 508, and a ninth sub-wiring 509. The first pad 701 is connected to the first electrodes 210 of the first light emitting element 201, the second light emitting element 202, and the third light emitting element 203 through the first sub-wiring 501, and is also connected to the fourth terminal 304 of the driving chip 300 through the fifth sub-wiring 505. The second electrodes 220 of the first light emitting element 201, the second light emitting element 202, and the third light emitting element 203 are respectively connected to the first terminal 301, the second terminal 302, and the third terminal 303 through the second sub-wiring 502, the third sub-wiring 503, and the fourth sub-wiring 504, respectively. The second pad 702 is connected to the fifth terminal 305 through the sixth sub-wiring 506, the third pad 703 is connected to the sixth terminal 306 through the seventh sub-wiring 507, the fourth pad 704 is connected to the seventh terminal 307 through the eighth sub-wiring 508, and the fifth pad 705 is connected to the eighth terminal 308 through the ninth sub-wiring 509.

[0150] The first terminal 301 to the seventh terminal 307 of the driving chip 300 in this embodiment have the same functions as those in Embodiment 1, and will not be described again. The eighth terminal 308 is a signal switch terminal, which is equivalent to a signal switch. When the voltage input to the EN terminal through the fifth pad 705 reaches a preset value, for example, 1.8V, the row data and the column data can directly reach the light emitting device to drive the light emitting device. If there is no EN terminal, the logic signal in front of the driving IC will be very complex, and the reliability will be low. Further, the EN terminal is added to the driving chip 300 as a driving switch of the light emitting device in this embodiment, the light emitting device can be directly driven through the EN terminal, avoiding the situation that the driving is relatively complex and the driving reliability is low, and further reducing the power consumption of the light emitting device. Embodiment 5

[0151] The display device provided in this embodiment includes a display substrate and at least one light emitting device disposed on the display substrate, and the light emitting device is the light emitting device in any one of Embodiments 1 to 4. The pads of the light emitting device are electrically connected to the display substrate, and the light emitting surface of the light emitting device is away from the display substrate. When there are two or more light emitting devices, the two or more light emitting devices are arranged at intervals on the display substrate, and each light emitting device is electrically connected to the display substrate. Since the display device includes the light emitting device in any one of Embodiments 1 to 4, the display device in this embodiment can also save power consumption, improve reliability, and prolong service life.

[0152] The above embodiments are only illustrative of the principles of the present application and its efficacy, and are not intended to limit the present application. Any modification or change made by any person skilled in the art without departing from the spirit and scope of the present application shall be covered by the claims of the present application.

Claims

1. A light emitting device, characterized by, The application relates to a transparent layer, a plurality of light-emitting elements and a driving chip. The transparent layer comprises a first surface and a second surface arranged oppositely, and the first surface is a light-emitting surface. The plurality of light-emitting elements are arranged at the second surface of the transparent layer. The driving chip is arranged at the second surface of the transparent layer and is arranged apart from the light-emitting elements. Each light-emitting element is electrically connected to a different terminal on the driving chip.

2. The light emitting device of claim 1, wherein The difference between the driving voltage of at least one light-emitting element and the driving voltage of the remaining light-emitting elements is between 0.2 V and 0.5 V.

3. The light emitting device of claim 2, wherein The at least one light-emitting element is connected to a different pad from the remaining light-emitting elements.

4. The light emitting device of claim 3, wherein The pad comprises a first pad, a second pad and other pads. The plurality of light-emitting elements comprise a first light-emitting element, a second light-emitting element and a third light-emitting element. The first light-emitting element and the second light-emitting element are connected to the first pad. The third light-emitting element is connected to the second pad. The difference between the driving voltage of the third light-emitting element and the driving voltage of the first light-emitting element or the second light-emitting element is between 0.2 V and 0.5 V. Each light-emitting element comprises a first electrode and a second electrode arranged apart. The first electrode and the second electrode are arranged at the side of the light-emitting element away from the transparent layer. The first electrode of the first light-emitting element is connected to the first pad.

5. The light emitting device of claim 3, wherein The first electrode of the second light-emitting element is electrically connected to the first pad. The first electrode of the third light-emitting element is electrically connected to the second pad. The other pads comprise a third pad, a fourth pad, a fifth pad and a sixth pad. The driving chip comprises seven terminals. The first terminal is electrically connected to the second electrode of the first light-emitting element. The second terminal is electrically connected to the second electrode of the second light-emitting element. The third terminal is electrically connected to the second electrode of the third light-emitting element. The fourth terminal is electrically connected to the second pad.

6. The light emitting device of claim 3, wherein The fifth terminal is electrically connected to the third pad. The sixth terminal is electrically connected to the fourth pad. The seventh terminal is electrically connected to the fifth pad. The other pads comprise a third pad, a fourth pad, a fifth pad and a sixth pad. The driving chip comprises seven terminals. The first terminal is electrically connected to the second electrode of the first light-emitting element. The second terminal is electrically connected to the second electrode of the second light-emitting element. The third terminal is electrically connected to the second electrode of the third light-emitting element. The fourth terminal is electrically connected to the sixth pad. The fifth terminal is electrically connected to the third pad. The sixth terminal is electrically connected to the fourth pad. The seventh terminal is electrically connected to the fifth pad. The other pads comprise a third pad, a fourth pad, a fifth pad and a sixth pad. The driving chip comprises eight terminals. The first terminal is electrically connected to the second electrode of the first light-emitting element. The second terminal is electrically connected to the second electrode of the second light-emitting element. The third terminal is electrically connected to the second electrode of the third light-emitting element. The fourth terminal is electrically connected to the second pad. The fifth terminal is electrically connected to the third pad. The sixth terminal is electrically connected to the fourth pad. The seventh terminal is electrically connected to the fifth pad. The eighth terminal is electrically connected to the sixth pad. A fifth terminal is electrically connected with the third pad; A sixth terminal is electrically connected with the fourth pad; A seventh terminal is electrically connected with the fifth pad; An eighth terminal is electrically connected with the sixth pad.

7. The light emitting device of claim 6, wherein The eighth terminal is an EN terminal, which is a signal switch terminal.

8. The light emitting device of claim 1, wherein The driving chip is an IC chip.

9. The light emitting device of claim 1, wherein The driving chip is an active driving IC chip.

10. The light emitting device of claim 2, wherein The first, second and third light emitting elements are three light emitting elements emitting light of different colors from each other, and the third light emitting element is a light emitting element radiating red light.

11. The light emitting device of claim 10, wherein The first light emitting element is a light emitting element radiating blue light, and the second light emitting element is a light emitting element radiating green light; or the first light emitting element is a light emitting element radiating green light, and the second light emitting element is a light emitting element radiating blue light.

12. The light emitting device of claim 2, wherein The light emitting device further comprises: A filling layer is arranged on the side wall of the light emitting element and the side wall of the driving chip.

13. The light emitting device of claim 12, wherein The light emitting device further comprises: A wiring layer is arranged on the filling layer, the light emitting element and the driving chip, one end of which is electrically connected with the light emitting element and the driving chip respectively, and the other end is electrically connected with the plurality of spaced pads respectively.

14. The light emitting device of claim 4, wherein The light emitting device further comprises a wiring layer arranged above the light emitting element and the driving chip, and the wiring layer comprises nine sub-wirings, which comprise: A first sub-wiring, one end of which is connected with the first terminal, and the other end is connected with the second electrode of the first light emitting element; A second sub-wiring, one end of which is connected with the second terminal, and the other end is connected with the second electrode of the second light emitting element; A third sub-wiring, one end of which is connected with the third terminal, and the other end is connected with the second electrode of the third light emitting element; A fourth sub-wiring, one end of which is connected with the first electrode of the first light emitting element and the first electrode of the second light emitting element, and the other end is connected with the first pad; A fifth sub-wiring, one end of which is connected with the first electrode of the third light emitting element, and the other end is connected with the second pad; A sixth sub-wiring, one end of which is connected with the fourth terminal, and the other end is connected with the second pad; A seventh sub-wiring, one end of which is connected with the fifth terminal, and the other end is connected with the third pad; An eighth sub-wiring, one end of which is connected with the sixth terminal, and the other end is connected with the fourth pad; A ninth sub-wiring, one end of which is connected with the seventh terminal, and the other end is connected with the fifth pad.

15. The light emitting device of claim 5, wherein The light emitting device further comprises a wiring layer arranged above the light emitting element and the driving chip, and the wiring layer comprises nine sub-wirings, which comprise: A first sub-wiring, one end of which is connected with the first terminal, and the other end is connected with the second electrode of the first light emitting element; A second sub-wiring, one end of which is connected with the second terminal, and the other end is connected with the second electrode of the second light emitting element; A third sub-wiring, one end of which is connected with the third terminal, and the other end is connected with the second electrode of the third light emitting element; A fourth sub-wiring, one end of which is connected with the first electrode of the first light emitting element and the first electrode of the second light emitting element, and the other end is connected with the first pad; A fifth sub-wiring, one end of which is connected to the first electrode of the third light emitting element, and the other end of which is connected to the second pad; A sixth sub-wiring, one end of which is connected to the fourth terminal, and the other end of which is connected to the sixth pad; A seventh sub-wiring, one end of which is connected to the fifth terminal, and the other end of which is connected to the third pad; An eighth sub-wiring, one end of which is connected to the sixth terminal, and the other end of which is connected to the fourth pad; A ninth sub-wiring, one end of which is connected to the seventh terminal, and the other end of which is connected to the fifth pad.

16. The light emitting device of claim 6, wherein The light emitting device further comprises a wiring layer, which is arranged above the light emitting elements and the driving chip, and the wiring layer comprises ten sub-wirings, which comprise: A first sub-wiring, one end of which is connected to the first terminal, and the other end of which is connected to the second electrode of the first light emitting element; A second sub-wiring, one end of which is connected to the second terminal, and the other end of which is connected to the second electrode of the second light emitting element; A third sub-wiring, one end of which is connected to the third terminal, and the other end of which is connected to the second electrode of the third light emitting element; A fourth sub-wiring, one end of which is connected to the first electrode of the first light emitting element and the first electrode of the second light emitting element, and the other end of which is connected to the first pad; A fifth sub-wiring, one end of which is connected to the first electrode of the third light emitting element, and the other end of which is connected to the second pad; A sixth sub-wiring, one end of which is connected to the fourth terminal, and the other end of which is connected to the second pad; A seventh sub-wiring, one end of which is connected to the fifth terminal, and the other end of which is connected to the third pad; An eighth sub-wiring, one end of which is connected to the sixth terminal, and the other end of which is connected to the fourth pad; A ninth sub-wiring, one end of which is connected to the seventh terminal, and the other end of which is connected to the fifth pad; A tenth sub-wiring, one end of which is connected to the eighth terminal, and the other end of which is connected to the sixth pad.

17. The light emitting device of claim 1, wherein The light emitting device further comprises: An encapsulation layer, which is filled between adjacent sub-wirings and covers part of the wiring layer, and the pads are formed on the exposed wiring layer.

18. The light emitting device of claim 1, wherein The driving chip is arranged in the central region of the second surface of the transparent layer.

19. The light emitting device of claim 1, wherein The thickness of the driving chip is greater than the thickness of the light emitting elements, and the thickness of the driving chip is less than or equal to 5 times the thickness of the light emitting elements.

20. A light emitting device, characterized by Comprise: A transparent layer, comprising a first surface and a second surface arranged oppositely, and the first surface is a light emitting surface; Three light emitting elements arranged at intervals, arranged on the second surface of the transparent layer; A driving chip, arranged on the second surface of the transparent layer, arranged at intervals with the light emitting elements, and eight terminals are arranged on the driving chip, which comprise a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal and an eighth terminal; the first terminal is connected to the second electrode of the first light emitting element, the second terminal is connected to the second electrode of the second light emitting element, and the third terminal is connected to the second electrode of the third light emitting element; A first pad, connected to the first electrode of the first light emitting element, the second electrode of the second light emitting element and the first electrode of the third light emitting element, and connected to the fourth terminal; A second pad, connected to the fifth terminal; a third pad connected with the sixth terminal; a fourth pad connected with the seventh terminal; a fifth pad connected with the eighth terminal.

21. The light emitting device of claim 20, wherein The eighth terminal is an EN terminal, and the EN terminal is a signal switch terminal.

22. A display device comprising: comprising: a display substrate; at least one light emitting device disposed on the display substrate, each of the light emitting devices being electrically connected with the display substrate, the light emitting device being the light emitting device according to any one of claims 1-21.

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