Integrated module having multiple functions

Abstract

According to an embodiment of the present invention, an integrated module may comprise: a printed circuit board; a first antenna and a second antenna disposed on one side of the top surface of the printed circuit board and configured for Wi-Fi communication or Bluetooth communication; a cover surrounding a part of the printed circuit board except for the first antenna and the second antenna; and a first connector and a second connector disposed on one side of the top surface of the cover to receive terrestrial or satellite broadcasts. The one side on which the first antenna and the second antenna are disposed and the one side on which the first connector and the second connector are disposed may be different side surfaces adjacent to each other, and may be side surfaces, among the side surfaces of the cover, which are formed inside the printed circuit board.

Description

Integrated module with multiple functions

[0001] The present invention relates to an integrated module having multiple functions, and more specifically, to an integrated module capable of receiving broadcast signals and performing Wi-Fi and / or Bluetooth communication.

[0002] In modern times, the functions of TVs are becoming increasingly diverse. Consequently, the internal components of TVs now include modules capable of supporting various functions in addition to the tuner module. For example, as TVs evolve into smart TVs, modules supporting Wi-Fi communication are included to support the internet. Furthermore, modules supporting Bluetooth communication are included to enable the TV to connect with smartphones. However, signals received from outside the TV or signals that need to be transmitted externally can be quite strong. In particular, signals transmitted externally require high signal strength because they must be received by other devices, which can cause interference with other modules within the TV. To address this, each module is configured separately, and modules that could cause interference are spaced apart. Moreover, there were constraints on component placement within the modules themselves. However, while this method poses no problem for large TVs where spatial limitations are absent, it cannot be effectively resolved for small electronic devices and may still remain an issue.

[0003] The technical problem that the present invention aims to solve is to provide an integrated module capable of receiving broadcast signals and performing Wi-Fi and / or Bluetooth communication functions in a compact size.

[0004] The technical problem that the present invention aims to solve is to provide an integrated module that does not experience performance degradation due to interference between broadcast signals and Wi-Fi and / or Bluetooth signals.

[0005] The technical problem that the present invention aims to solve is to provide an integrated module designed with shielding to prevent signal interference between a broadcast signal and a Wi-Fi and / or Bluetooth signal.

[0006] An integrated module according to an embodiment of the present invention comprises a printed circuit board, a first antenna and a second antenna disposed on one side of the upper surface of the printed circuit board for Wi-Fi communication or Bluetooth communication, a cover covering a portion of the printed circuit board excluding the first antenna and the second antenna, and a first connector and a second connector disposed on one side of the upper surface of the cover for receiving terrestrial or satellite broadcasting, wherein the side on which the first antenna and the second antenna are disposed and the side on which the first connector and the second connector are disposed are adjacent sides to each other and may be a side among the sides of the cover disposed inside the printed circuit board.

[0007] In an integrated module according to an embodiment of the present invention, the printed circuit board includes a slot, and the slot may be used to block interference of a signal radiated by the first antenna or the second antenna.

[0008] In an integrated module according to an embodiment of the present invention, the printed circuit board includes a first slot and a second slot, and a protruding portion of the cover may be inserted into the first slot, and the second slot may separate a signal transmitted and received by the first antenna or the second antenna from a signal received through the first connector or the second connector.

[0009] In an integrated module according to an embodiment of the present invention, the first antenna is composed of a plurality of antennas for Wi-Fi communication, the second antenna is an antenna for Bluetooth communication, and the spacing between the first antennas may be narrower than the spacing between the first antenna and the second antenna.

[0010] In an integrated module according to an embodiment of the present invention, a chip for Wi-Fi and Bluetooth communication and a chip for receiving terrestrial signals may be disposed in the area of ​​the upper surface of the printed circuit board that is covered by the cover.

[0011] In an integrated module according to an embodiment of the present invention, a chip for receiving a satellite broadcast signal may be disposed on the lower surface of the printed circuit board.

[0012] In the integrated module according to an embodiment of the present invention, the height of the cover may be higher than the height of the first antenna and the second antenna.

[0013] According to the present invention, antennas for Wi-Fi communication or Bluetooth communication and other components can be separated by a partition so that noise caused by signals radiated through the antennas can be blocked.

[0014] According to the present invention, an antenna adjacent to a configuration for receiving terrestrial or satellite broadcasting is separated by a slot, thereby blocking interference between signals.

[0015] According to the present invention, the components related to the circuit are wrapped with a cover so as to be protected from external impact.

[0016] FIG. 1 is a perspective view of an integrated module according to one embodiment of the present invention.

[0017] FIG. 2 is a drawing showing a printed circuit board in an integrated module according to one embodiment of the present invention, and FIG. 3 is a drawing showing components arranged on the upper surface of a printed circuit board in an integrated module according to one embodiment of the present invention.

[0018] FIG. 4 is a perspective view of a cover of an integrated module according to one embodiment of the present invention.

[0019] FIG. 5 is a layout diagram of the upper surface of the cover of an integrated module according to one embodiment of the present invention.

[0020] FIGS. 6 and FIGS. 7 are drawings of a cover combined with a printed circuit board according to one embodiment of the present invention, viewed from different sides.

[0021] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0022] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0023] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0024] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0025] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0026] In addition, terms such as first, second, A, B, (a), (b), etc. may be used to describe the components of the embodiments of the present invention.

[0027] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0028] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0029] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0030] FIG. 1 is a perspective view of an integrated module according to one embodiment of the present invention.

[0031] Referring to FIG. 1, the integrated module (100) may include a printed circuit board (110), a first antenna (120), a second antenna (130), a cover (140), a first connector (150), and a second connector (160).

[0032] A first antenna (120) and a second antenna (130) may be disposed on one side of a printed circuit board (110). The printed circuit board (110) may be electrically connected to the first antenna (120) and the second antenna (130) to receive or transmit signals. According to one embodiment, the first antenna (120) may be an antenna for transmitting and receiving signals for Wi-Fi communication, and the second antenna (130) may be an antenna for transmitting and receiving signals for Bluetooth communication. In one embodiment, the first antenna (120) may be composed of multiple antennas. According to one embodiment, the first antenna (120) and / or the second antenna (130) may be a Metal Press PIFA (Planar Inverted-F Antenna). Most of the area of ​​the printed circuit board (110) where the first antenna (120) and the second antenna (130) are not disposed may be surrounded by a cover (140). According to one embodiment, the height of the cover (140) may be higher than the height of the first antenna (120) and the second antenna (130).

[0033] The cover (140) can not only protect the components within the printed circuit board (110) but also prevent noise caused by signals radiated from the first antenna (120) and the second antenna (130) from affecting the circuit. According to one embodiment, the cover (140) may be composed of an integrated chassis.

[0034] According to one embodiment, a first connector (150) and a second connector (160) may be disposed on one side of the upper surface of the cover (140). The first connector (150) may be a connector for receiving a terrestrial signal, and the second connector (160) may be a connector for receiving a satellite broadcast signal. For example, the first connector (150) may be a Belling-Lee connector, and the second connector (160) may be an F connector.

[0035] According to one embodiment, the side on which the first antenna (120) and the second antenna (130) are positioned and the side on which the first connector (150) and the second connector (160) are positioned may be different sides. Additionally, the side on which the first antenna (120) and the second antenna (130) are positioned and the side on which the first connector (150) and the second connector (160) are positioned may be adjacent sides.

[0036] According to one embodiment, the size of the integrated module (100) may be 52.8 x 38.7 x 6.7 mm, but is not limited thereto.

[0037] FIG. 2 is a drawing showing a printed circuit board in an integrated module according to one embodiment of the present invention, and FIG. 3 is a drawing showing components arranged on the upper surface of a printed circuit board in an integrated module according to one embodiment of the present invention.

[0038] First, referring to FIG. 2, the printed circuit board (110) may include a plurality of slots (112, 114). The plurality of slots (112, 114) included in the printed circuit board (110) can perform the function of shielding so that terrestrial signals and satellite broadcasting signals and signals for Wi-Fi or Bluetooth communication do not interfere with each other. The slots can cut off electrical signals, thereby blocking interference between them. In addition, the plurality of slots (112, 114) included in the printed circuit board (110) can allow the side of a cover that can perform the function of a partition to be fixed.

[0039] Specifically, among the plurality of slots included in the printed circuit board (110), the first slot (112) may be for inserting a protruding part of the side of the cover. The side of the cover that is positioned above the printed circuit board (110) can function as a partition to block interference between terrestrial signals and satellite broadcast signals and signals for Wi-Fi or Bluetooth communication. Additionally, the partition can block radiated noise that may occur when signals for Wi-Fi or Bluetooth communication are radiated.

[0040] Among the multiple slots included in the printed circuit board (110), the second slot (114) can prevent interference between terrestrial signals and satellite broadcast signals and signals for Wi-Fi or Bluetooth communication that may occur within the printed circuit board (110). In the printed circuit board (110), circuits related to terrestrial signals and satellite broadcast signals may be arranged to the right of the second slot (114), and an antenna for Bluetooth communication may be arranged to the left. By means of the second slot (114), the terrestrial signals and satellite broadcast signals and the signals for Wi-Fi or Bluetooth communication can be separated within the printed circuit board (110), thereby blocking interference between them.

[0041] According to one embodiment, the printed circuit board (110) may have a portion protruding, and the protruding portion may include a hole. In FIG. 2, the protruding portion is not limited to one place.

[0042] Referring to FIG. 3, an antenna (120) for Wi-Fi communication, a chip (122) for Wi-Fi communication and / or Bluetooth communication, an antenna (130) for Bluetooth communication, a chip (132) for terrestrial broadcasting, and a connector (116) may be disposed on the upper surface of a printed circuit board (110). According to one embodiment, the chip (122) for Wi-Fi communication and / or Bluetooth communication and the chip (132) for terrestrial broadcasting may be disposed in an area covered by a cover. According to one embodiment, a chip (not shown) for satellite broadcasting may be disposed on the lower surface of the printed circuit board (110).

[0043] According to one embodiment, an antenna (120) for Wi-Fi communication and an antenna (130) for Bluetooth communication may be arranged in a line on one side of a printed circuit board (110). The antenna (120) for Wi-Fi communication and the antenna (130) for Bluetooth communication may be placed outside the area enclosed by a cover on the printed circuit board (110). By placing the antenna (120) for Wi-Fi communication and the antenna (130) for Bluetooth communication outside the cover, interference caused by signals radiated from the antenna (120) for Wi-Fi communication and the antenna (130) for Bluetooth communication can be blocked.

[0044] According to one embodiment, the spacing between antennas (120) for Wi-Fi communication may be narrower than the spacing between antennas (120) for Wi-Fi communication and antennas (130) for Bluetooth communication.

[0045] Additionally, the printed circuit board (110) may include a plurality of holes arranged in a row. Pins of a connector (116) may be inserted into the plurality of holes arranged in a row. The connector (116) can transmit a signal generated in the printed circuit board (110) to the outside or transmit a signal transmitted from the outside to a circuit within the printed circuit board (110).

[0046] FIG. 4 is a perspective view of a cover of an integrated module according to one embodiment of the present invention.

[0047] Referring to FIG. 4, the cover (140) may include an upper surface (141), a first side (142), a second side (143), a third side (144), and a fourth side (not shown). Each corner of the upper surface (141) may be connected to the corners of the first side (142), the second side (143), the third side (144), and the fourth side (not shown). Additionally, the corners of the first side (142) and the second side (143), the second side (143) and the third side (144), the third side (144) and the fourth side (not shown), and the fourth side (not shown) and the first side (142) may also be connected to each other to form a cover that encloses at least a portion of the printed circuit board.

[0048] According to one embodiment, the sides can be connected as follows. For example, some of the sides may include a slot, and some of the corners may protrude. In this case, the part of the corner protruding from the side can be inserted into the slot of the other side, so that the two sides can be connected to each other. In FIG. 4, the corner of the second side (143) is protruding, and the first side (142) and the third side (144) include slots. Accordingly, each of the protruding parts from the corner of the second side (143) is inserted into the slots of the first side (142) and the third side (144), respectively, so that the first side (142), the second side (143), and the third side (144) can be connected to each other.

[0049] According to one embodiment, a portion of the side edge parallel to the printed circuit board may also protrude. The protruding portion may be inserted into a hole or slot of the printed circuit board or other components to secure the cover (140) or the integrated module.

[0050] According to one embodiment, the side of the cover (140) that is placed within the printed circuit board can function as a partition. In FIG. 4, the second side (143) is placed within the printed circuit board and can function as a partition. That is, the second side (143) can perform the function of shielding so that terrestrial signals and satellite broadcast signals and signals for Wi-Fi or Bluetooth communication do not interfere with each other.

[0051] FIG. 5 is a layout diagram of the upper surface of the cover of an integrated module according to one embodiment of the present invention.

[0052] Referring to FIG. 5, a first connector (150) and a second connector (160) may be disposed on the upper surface of the cover (140). The first connector (150) and the second connector (160) may be disposed on one side of the upper surface of the cover (140). The first connector (150) and the second connector (160) may be disposed on the edge of the upper surface of the cover (140). The first connector (150) and the second connector (160) may be disposed with a certain distance or more from the upper surface of the cover (140). The distance between the first connector (150) and the second connector (160) may be maximized on one side of the upper surface of the cover (140) where the first connector (150) and the second connector (160) are disposed. That is, the first connector (150) and the second connector (160) may be disposed at both ends of one side of the upper surface of the cover (140).

[0053] According to one embodiment, the first connector (150) may be a connector for receiving a terrestrial signal, and the second connector (160) may be a connector for receiving a satellite broadcast signal. For example, the first connector (150) may be a Belling-Lee connector, and the second connector (160) may be an F connector.

[0054] The integrated module can receive a terrestrial broadcast signal through the first connector (150). The frequency band for the terrestrial broadcast signal may be VHF (54 Hz) and / or UHF (470 Hz).

[0055] Additionally, the integrated module can receive satellite broadcast signals through the second connector (160). The frequencies of satellite broadcast signals are distributed by the World Radiocommunication Conference (WRC) by dividing the world into three regions. The frequencies for Region 1, which includes Europe, Russia, and Africa, are 11.7 to 12.5 GHz (800 MHz band), etc.; the frequencies for Region 2, which includes the Americas, are 12.2 to 12.7 GHz, etc.; and the frequencies for Region 3, which includes Asia and Oceania, are 11.7 to 12.2 GHz (500 MHz band), etc., can be used as frequency bands for satellite broadcast signals. Specifically, the satellite broadcast signal can be down-converted to the 2 GHz band and received through the second connector (160). The satellite broadcast signal received through the second connector (160) may be, for example, a signal of 950 to 2150 MHz.

[0056] FIGS. 6 and FIGS. 7 are drawings of a cover combined with a printed circuit board according to one embodiment of the present invention, viewed from different sides.

[0057] Referring to FIGS. 6 and 7, a portion of the second side (143) of the cover (140) located within the printed circuit board (110) may have a shorter vertical length compared to the other side. This may be to prevent the second side (143) of the cover from directly contacting the printed circuit board (110). If the second side (143) of the cover directly contacts the printed circuit board (110), it may become electrically connected, which could cause problems. However, another portion of the second side (143) of the cover may protrude and be inserted into a slot of the printed circuit board (110). In this way, the cover (140) can be fixed to the printed circuit board (110).

[0058] Referring to FIG. 6, the first side (142) of the side of the cover (140) may each include slots on both upper sides. According to one embodiment, at least one of the height, position, and length of each slot may differ, but they may all be the same. The protruding portions of the second side (143) and the fourth side (not shown) of the cover may be inserted into each slot so that the sides of the cover can be fixed to each other. Additionally, the first side (142) of the cover may include a protruding portion on the lower side. The protruding portions on the lower side of the first side (142) may be multiple, and one of them may be inserted into a hole in the printed circuit board (110) to fix the cover (140) to the printed circuit board (110). The protruding portions of the first side (142) may allow the integrated module to be fixed to other configurations.

[0059] Referring to FIG. 7, the third side (144) of the cover (140) may each include slots on both upper sides, similar to the first side (142). According to one embodiment, at least one of the height, position, and length of each slot may differ, but they may all be the same. The protruding portions of the second side (143) and the fourth side (not shown) of the cover may be inserted into each slot so that the sides of the cover can be fixed to each other. Additionally, the third side (144) of the cover may include a protruding portion at the bottom. According to one embodiment, the protruding portions at the bottom of the third side (144) may be multiple. The protruding portions of the third side (144) may allow the integrated module to be fixed to other configurations.

[0060] Although the invention has been described above with reference to embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

1. Printed circuit board; A first antenna and a second antenna disposed on one side of the upper surface of the above printed circuit board for Wi-Fi communication or Bluetooth communication; A cover covering a portion of the printed circuit board excluding the first antenna and the second antenna; and It includes a first connector and a second connector disposed on one side of the upper surface of the above cover for receiving terrestrial or satellite broadcasts, and The side on which the first antenna and the second antenna are positioned and the side on which the first connector and the second connector are positioned are other sides adjacent to each other, and An integrated module, which is a side of the above-mentioned cover that is positioned inside the above-mentioned printed circuit board.

2. In Paragraph 1, The above printed circuit board includes a slot, and The above slot is an integrated module used to block interference of a signal radiated by the first antenna or the second antenna.

3. In Paragraph 1, The above printed circuit board includes a first slot and a second slot, and A protruding part of the cover can be inserted into the first slot above, and The above second slot is an integrated module that separates a signal transmitted and received by the first antenna or the second antenna from a signal received through the first connector or the second connector.

4. In Paragraph 1, The first antenna above is composed of multiple antennas for Wi-Fi communication, and The second antenna mentioned above is an antenna for Bluetooth communication, and An integrated module in which the spacing between the first antennas is narrower than the spacing between the first antenna and the second antenna.

5. In Paragraph 1, An integrated module in which a chip for Wi-Fi and Bluetooth communication and a chip for receiving terrestrial signals are disposed in the area of ​​the upper surface of the printed circuit board covered by the cover.

6. In Paragraph 5, An integrated module having a chip for receiving satellite broadcast signals disposed on the lower surface of the above printed circuit board.

7. In Paragraph 1, An integrated module in which the height of the above cover is higher than the height of the first antenna and the second antenna.

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