Imaging device and imaging system

Abstract

There is provided an imaging device. The imaging device according to an embodiment of the present disclosure includes an imaging section, a diagnosis section, and an output section. The imaging section is configured to perform an imaging operation. The diagnosis section is configured to perform diagnosis processing of a defect of the imaging section. The output section is configured to output a first flag signal corresponding to a result of the diagnosis processing. The output section is configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect.

Description

IMAGING DEVICE AND IMAGING SYSTEMCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of Japanese Priority Patent Application JP2024-174290 filed October 3, 2024 the entire contents of which are incorporated herein by reference.

[0002] The present disclosure relates to an imaging device and an imaging system.

[0003] There is an imaging device that detects a defect in a case where the defect (error) occurs, for example, and that notifies a result of the detection (see PTL 1).

[0004] [PTL 1] Japanese Unexamined Patent Application Publication No. 2019-140565Summary

[0005] It is considered that there is some predictor before occurrence of a defect in an imaging device. In order to prevent occurrence of a defect caused by an imaging device in an apparatus mounted with the imaging device, it is desired to detect a predictor before occurrence of a defect in the imaging device and to predict the occurrence of the defect in the imaging device.

[0006] It is therefore desirable to provide an imaging device and an imaging system that make it possible to predict occurrence of a defect.

[0007] An imaging device according to an embodiment of the present disclosure includes an imaging section, a diagnosis section, and an output section. The imaging section is configured to perform an imaging operation. The diagnosis section is configured to perform diagnosis processing of a defect of the imaging section. The output section is configured to output a first flag signal corresponding to a result of the diagnosis processing. The output section is configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect.

[0008] An imaging system according to an embodiment of the present disclosure includes an imaging device and a monitoring device. The monitoring device is configured to monitor an operation of the imaging device. The imaging device includes an imaging section, a diagnosis section, and an output section. The imaging section is configured to perform an imaging operation. The diagnosis section is configured to perform diagnosis processing of a defect of the imaging section. The output section is configured to output a first flag signal corresponding to a result of the diagnosis processing. The output section is configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect.

[0009] In the imaging device or the imaging system according to an embodiment of the present disclosure, in a case where the diagnosis processing of a defect of the imaging section is performed to find that the result of the diagnosis processing indicates a predictor of a defect, the first flag signal corresponding to the result of the diagnosis processing is set to a ground level.

[0010] Fig. 1 is a block diagram schematically illustrating a configuration example of an imaging device according to an embodiment of the present disclosure.Fig. 2 is a circuit diagram schematically illustrating a configuration example of an imaging pixel.Fig. 3 is an explanatory diagram illustrating an example of an operation of scanning a plurality of imaging pixels in a pixel array.Fig. 4 is a circuit diagram illustrating a configuration example of circuits that output an error flag signal and a warning flag signal in the imaging device.Fig. 5 is an explanatory diagram illustrating an example of the error flag signal.Fig. 6 is an explanatory diagram illustrating an example of a warning flag signal XWRN.Fig. 7 is an explanatory diagram illustrating an example of a circuit arrangement in a case where the imaging device is formed in one semiconductor substrate.Fig. 8 is an explanatory diagram illustrating an example in which two semiconductor substrates are coupled in a case where the imaging device is formed in the two semiconductor substrates.Fig. 9 is an explanatory diagram illustrating an example of a circuit arrangement in the lower semiconductor substrate illustrated in Fig. 8.Fig. 10 is a block diagram schematically illustrating a specific example of diagnosis processing using an image signal after AD conversion.Fig. 11 is an explanatory diagram schematically illustrating a specific example of a relationship between a failure notification threshold and a failure prediction threshold for use in the diagnosis processing.Fig. 12 is a block diagram schematically illustrating a specific example of diagnosis processing using a power supply voltage.Fig. 13 is a block diagram schematically illustrating a specific example of diagnosis processing using a ring oscillator.Fig. 14 is a block diagram schematically illustrating a configuration example of the ring oscillator.Fig. 15 is a block diagram schematically illustrating a specific example of diagnosis processing using a temperature sensor.Fig. 16 is an explanatory diagram schematically illustrating an example of processing of switching operation modes of the imaging device in accordance with a result of the diagnosis processing.Fig. 17 is an explanatory diagram illustrating a usage example of the imaging device.Fig. 18 is a block diagram depicting an example of schematic configuration of a vehicle control system.Fig. 19 is a diagram of assistance in explaining an example of installation positions of an outside-vehicle information detecting section and an imaging section.Fig. 20 is a state transition diagram illustrating an example of a transition between operation states of a vehicle.Fig. 21 is an explanatory diagram illustrating exchanges of an error flag signal and a warning flag signal between the imaging device and an ECU.Fig. 22 is a timing diagram illustrating an example of operations of the imaging device.Fig. 23 is a timing diagram illustrating an example of operations of the imaging device.Fig. 24 is a timing diagram illustrating an example of operations of the imaging device.

[0011] Hereinafter, description is given in detail of embodiments of the present disclosure with reference to the drawings. It is to be noted that the description is given in the following order. 1. Embodiment 1.1 Overview of Imaging Device 1.2 Specific Examples of Diagnosis Processing 1.3 Effects 2. Usage Example of Imaging Device 3. Example of Practical Application to Mobile Body 4. Operation Example of Imaging Device Mounted on Vehicle 5. Other Embodiments <1. Embodiment> 1.1 Overview of Imaging Device

[0012] Fig. 1 is a block diagram schematically illustrating a configuration example of an imaging device according to an embodiment of the present disclosure.

[0013] An imaging device 1 includes a pixel array 9, a scanning section 10, a readout section 20, an imaging control section 30, and a signal processing section 40.

[0014] The imaging device 1 is supplied with three power supply voltages VDD (power supply voltages VDDH, VDDM, and VDDL), and the imaging device 1 operates on the basis of these power supply voltages VDD. The power supply voltage VDDH is a power supply voltage to be supplied mainly to an analog circuit in the imaging device 1, and is 3.3 V, for example. The power supply voltage VDDM is a power supply voltage to be supplied mainly to an input / output buffer of the imaging device 1, and is 1.8 V, for example. The power supply voltage VDDL is a power supply voltage to be supplied mainly to a logic circuit in the imaging device 1, and is 1.1 V, for example.

[0015] In the pixel array 9, a plurality of imaging pixels P1 is arranged in matrix. The imaging pixel P1 includes a photodiode PD, and generates a pixel voltage VP related to the imaging pixel P1.

[0016] Fig. 2 is a circuit diagram schematically illustrating a configuration example of the imaging pixel P1.

[0017] The pixel array 9 includes a plurality of control lines TGLL, a plurality of control lines RSTL, a plurality of control lines SELL, and a plurality of signal lines SGL. The control line TGLL extends in a horizontal direction (in a lateral direction in Fig. 1), and the scanning section 10 applies a signal STG to the control line TGLL. The control line RSTL extends in the horizontal direction, and the scanning section 10 applies a signal SRST to the control line RSTL. The control line SELL extends in the horizontal direction, and the scanning section 10 applies a signal SSEL to the control line SELL. The signal line SGL extends in a vertical direction (in a longitudinal direction in Fig. 1), and is coupled to the readout section 20.

[0018] The imaging pixel P1 includes the photodiode PD, a transistor TG, a transistor RST, a floating diffusion FD, a transistor AMP, and a transistor SEL. The transistor TG, the transistor RST, and the transistor SEL are each, for example, an N-type MOS (Metal Oxide Semiconductor) transistor. The photodiode PD is a photoelectric conversion element that generates electric charge of an amount corresponding to a received light amount and that accumulates therein the generated electric charge. An anode of the photodiode PD is grounded, and a cathode thereof is coupled to a source of the transistor TG. A gate of the transistor TG is coupled to the control line TGLL, the source thereof is coupled to the cathode of the photodiode PD, and a drain thereof is coupled to the floating diffusion FD. A gate of the transistor RST is coupled to the control line RSTL, a drain thereof is supplied with the power supply voltage VDD, and a source thereof is coupled to the floating diffusion FD.

[0019] This configuration allows, in the imaging pixel P1, the transistor SEL to be brought into an ON state on the basis of the signal SSEL applied to the control line SELL, thereby allowing the imaging pixel P1 to be electrically coupled to the signal line SGL. Then, the imaging pixel P1 outputs, as a signal SIG, a pixel voltage corresponding to a voltage in the floating diffusion FD to the signal line SGL.

[0020] On the basis of an instruction from the imaging control section 30, the scanning section 10 sequentially drives the imaging pixels P1 in the pixel array 9 in units of pixel lines L. The scanning section 10 includes an address decoder 11, a logic part 12, and a driver part 13. The logic part 12 generates the signals STG, SRST, and SSEL corresponding to respective pixel lines L on the basis of instructions from the address decoder 11. The driver part 13 generates the signals STG, SRST, and SSEL corresponding to the respective pixel lines L on the basis of the signals STG, SRST, and SSEL corresponding to the respective pixel lines L.

[0021] The imaging control section 30 supplies control signals to the scanning section 10, the readout section 20, and the signal processing section 40 to control operations of these circuits, thereby controlling an operation of the imaging device 1.

[0022] The imaging control section 30 includes a temperature sensor 32 that is able to generate a detection signal corresponding to a temperature.

[0023] The readout section 20 includes a plurality of AD (Analog to Digital) converters ADC. The readout section 20 performs AD conversion on the basis of the signal SIG supplied from the pixel array 9 via the signal line SGL to thereby generate an image signal DATA0. The readout section 20 operates on the basis of the power supply voltage VDDH and the power supply voltage VDDL of the supplied three power supply voltages VDD.

[0024] In the imaging device 1, accumulation start drive D1 and readout drive D2 are performed. In the imaging device 1, each of the imaging pixels P1 in the pixel array 9 accumulates electric charge in accordance with a received light amount, and outputs a pixel voltage as the signal SIG.

[0025] Fig. 3 is an explanatory diagram illustrating an example of an operation of scanning the plurality of imaging pixels P1 in the pixel array 9.

[0026] The imaging device 1 performs the accumulation start drive D1 on the plurality of imaging pixels P1 in the pixel array 9 in order from the top in the vertical direction, during a period of timings t0 to t1. In each of the plurality of imaging pixels P1, electric charge is accumulated during an accumulation period T10 until the readout drive D2 is performed.

[0027] Then, during a period of timings t10 to t11, the imaging device 1 performs the readout drive D2 on the plurality of imaging pixels P1 in order from the top in the vertical direction. This allows the plurality of imaging pixels P1 to sequentially output respective pixel voltages. The readout section 20 performs AD conversion on the respective pixel voltages from the plurality of imaging pixels P1.

[0028] The imaging device 1 repeats such accumulation start drive D1 and such readout drive D2. Specifically, as illustrated in Fig. 3, the imaging device 1 performs the accumulation start drive D1 during a period of timings t2 to t3, and performs the readout drive D2 during a period of timings t12 to t13. In addition, the imaging device 1 performs the accumulation start drive D1 during a period of timings t4 to t5, and performs the readout drive D2 during a period of timings t14 to t15.

[0029] The signal processing section 40 includes an image processing section 41 and a diagnosis section 42.

[0030] The image processing section 41 performs predetermined image processing on an image indicated by the image signal DATA0, and outputs the resulting image as an image signal DATA.

[0031] The diagnosis section 42 performs diagnosis processing of a defect of the imaging device 1, and outputs an error flag signal XERR and a warning flag signal XWRN in accordance with a result of the diagnosis. Description is given later of a specific example of the diagnosis processing performed by the diagnosis section 42.

[0032] In Fig. 3, for example, a blanking period T20 of timings t11 to t12 is a so-called vertical blanking period, during which the imaging device 1 does not perform the readout drive D2. The diagnosis section 42 of the imaging device 1 may perform diagnosis processing during this blanking period T20. This enables the diagnosis processing to be performed in the imaging device 1 without influencing an imaging operation.

[0033] Fig. 4 is a circuit diagram illustrating a configuration example of circuits that output the error flag signal XERR and the warning flag signal XWRN in the imaging device 1. Fig. 5 is an explanatory diagram illustrating an example of the error flag signal XERR. Fig. 6 is an explanatory diagram illustrating an example of the warning flag signal XWRN.

[0034] The imaging device 1 is supplied with the three power supply voltages VDD (power supply voltages VDDH, VDDM, and VDDL) and with three ground voltages VSS (ground voltages VSSH, VSSM, and VSSL). The power supply voltage VDDH is a power supply voltage to be supplied mainly to an analog circuit in the imaging device 1, and is 3.3 V, for example. The power supply voltage VDDL is a power supply voltage to be supplied mainly to a logic circuit in the imaging device 1, and is 1.1 V, for example. The power supply voltage VDDM is a power supply voltage to be supplied mainly to an input / output buffer of the imaging device 1, and is 1.8 V, for example. The ground voltages VSSH, VSSL, and VSSM are each 0 V.

[0035] The diagnosis section 42 includes a buffer BF. The buffer BF generates a signal XERR1. The diagnosis section 42 is supplied with the power supply voltage VDDL and the ground voltage VSSL, and thus the buffer BF operates on the basis of the power supply voltage VDDL and the ground voltage VSSL. The signal XERR1 generated by the buffers BF is a logic signal that transitions between the power supply voltage VDDL and the ground voltage VSSL. The signal XERR1 is a signal indicating an error as a result of diagnosis processing in a case where a value of a diagnosis target is outside a second reference range (Fig. 11) as described later. The signal XERR1 is a so-called negative logic signal; in a case where no defect is confirmed by the diagnosis processing in the diagnosis section 42, the signal XERR1 is brought into a high level (power supply voltage VDDL), and, in a case where a defect is confirmed, the signal XERR1 is brought into a low level (ground voltage VSSL). The signal XERR1 becomes a signal indicating an error when being brought into a low level.

[0036] The imaging device 1 includes an output section 420. The output section 420 includes an output buffer BFOUT and an output buffer BFOUT1.

[0037] The output buffer BFOUT generates the error flag signal XERR on the basis of the signal XERR1, and output the generated error flag signal XERR via an output terminal TOUT. The output buffer BFOUT operates on the basis of the power supply voltage VDDM and the ground voltage VSSM. The error flag signal XERR is a logic signal that transitions between the power supply voltage VDDM and the ground voltage VSSM. As illustrated in Fig. 5, the error flag signal XERR is a so-called negative logic signal; in a case where no defect is confirmed by the diagnosis processing in the diagnosis section 42, the error flag signal XERR is brought into a high level (power supply voltage VDDM), and, in a case where a defect is confirmed, the error flag signal XERR is brought into a low level (ground voltage VSSM).

[0038] In addition, the diagnosis section 42 includes a buffer BF1. The buffer BF1 generates a signal XWRN1. The diagnosis section 42 is supplied with the power supply voltage VDDL and the ground voltage VSSL, and thus the buffer BF1 operates on the basis of the power supply voltage VDDL and the ground voltage VSSL. The signal XWRN1 generated by the buffer BF1 is a logic signal that transitions between the power supply voltage VDDL and the ground voltage VSSL. The signal XWRN1 is a signal indicating a predictor of a defect as a result of diagnosis processing in a case where a value of the diagnosis target is outside a first reference range (Fig. 11) as described later. The signal XWRN1 is a so-called negative logic signal; in a case where no predictor of a defect is confirmed by the diagnosis processing in the diagnosis section 42, the signal XWRN1 is brought into a high level (power supply voltage VDDL), and, in a case where a predictor of a defect is confirmed, the signal XWRN1 is brought into a low level (ground voltage VSSL). The signal XWRN1 becomes a signal indicating a predictor when being brought into a low level.

[0039] The output buffer BFOUT1 generates the warning flag signal XWRN on the basis of the signal XWRN1, and output the generated warning flag signal XWRN via an output terminal TOUT1. The output buffer BFOUT1 operates on the basis of the power supply voltage VDDM and the ground voltage VSSM. The warning flag signal XWRN is a logic signal that transitions between the power supply voltage VDDM and the ground voltage VSSM. As illustrated in Fig. 6, the warning flag signal XWRN is a so-called negative logic signal; in a case where no predictor of a defect is confirmed by the diagnosis processing in the diagnosis section 42, the signal warning flag XWRN is brought into a high level (power supply voltage VDDM), and, in a case where a predictor of a defect is confirmed, the warning flag signal XWRN is brought into a low level (ground voltage VSSM).

[0040] Next, description is given of implementation of the imaging device 1. In the imaging device 1, for example, a circuit of the imaging device 1 illustrated in Fig. 1 may be formed in one semiconductor substrate or may be formed in a plurality of semiconductor substrates.

[0041] Fig. 7 is an explanatory diagram illustrating an example of a circuit arrangement in a case where the imaging device 1 is formed in one semiconductor substrate 200.

[0042] The pixel array 9 is formed in the semiconductor substrate 200. As illustrated in Fig. 7, for example, the scanning section 10 is formed on the left side of the pixel array 9. In addition, the readout section 20 and a peripheral circuit section 201 are formed in this order on the upper side of the pixel array 9, for example. The peripheral circuit section 201 corresponds to at least one circuit of the imaging control section 30 and the signal processing section 40. In a region where this peripheral circuit section 201 is formed, for example, the diagnosis section 42 is formed on the right side. In addition, a terminal section 202 where a plurality of pad electrodes is arranged side by side is provided at the left end of the semiconductor substrate 200. A terminal section 203 where a plurality of pad electrodes is arranged side by side is provided at the right end of the semiconductor substrate 200.

[0043] The temperature sensor 32 is formed, for example, in the region where the peripheral circuit section 201 is formed. In the imaging device 1, the signal processing section 40 in the peripheral circuit section 201 is a block having the highest temperature during the operation, and thus the temperature sensor 32 may be formed in a region where the signal processing section 40 is formed to enable detection of a temperature in this signal processing section 40. The temperature sensor 32 may be disposed near the middle of the region where the peripheral circuit section 201 is formed.

[0044] In the terminal section 202, for example, there are disposed: a power supply terminal TVDDH to be supplied with the power supply voltage VDDH; a ground terminal TVSSH to be supplied with the ground voltage VSSH; a power supply terminal TVDDM to be supplied with the power supply voltage VDDM; and a ground terminal TVSSM to be supplied with the ground voltage VSSM. In addition, in the terminal section 202, for example, there are disposed: a power supply terminal TVDDL to be supplied with the power supply voltage VDDL; and a ground terminal TVSSL to be supplied with the ground voltage VSSL.

[0045] The output terminal TOUT from which the error flag signal XERR is outputted and the output terminal TOUT1 from which the warning flag signal XWRN is outputted are disposed at positions closer to the diagnosis section 42 in the terminal section 203, for example. This makes it possible to shorten a signal path between the diagnosis section 42 and each of the output terminal TOUT and the output terminal TOUT1.

[0046] Fig. 8 is an explanatory diagram illustrating an example in which two semiconductor substrates 301 and 302 are coupled to each other in a case where the imaging device 1 is formed in the two semiconductor substrates 301 and 302.

[0047] In the example of Fig. 8, the semiconductor substrates 301 and 302 are overlapped on each other, and are coupled to each other via a plurality of vias 303. For example, the pixel array 9 may be formed in the semiconductor substrate 301. In addition, the scanning section 10, the readout section 20, the imaging control section 30, and the signal processing section 40 may be formed in the semiconductor substrate 302. It is to be noted that the arrangement of the circuits is not limited thereto; for example, the scanning section 10 may be formed in the semiconductor substrate 301.

[0048] Fig. 9 is an explanatory diagram illustrating an example of a circuit arrangement in the semiconductor substrate 302 on the lower side illustrated in Fig. 8.

[0049] A peripheral circuit section 311 is formed near the middle of the semiconductor substrate 302. The peripheral circuit section 311 corresponds to at least one circuit of the imaging control section 30 and the signal processing section 40. In a region where this peripheral circuit section 311 is formed, for example, the diagnosis section 42 is formed at the upper right. In addition, for example, the scanning section 10 is formed on the left side of the peripheral circuit section 311. In addition, for example, the readout section 20 is formed on the upper side of the peripheral circuit section 311. In addition, a terminal section 312 in which a plurality of pad electrodes is arranged side by side is provided at the left end of the semiconductor substrate 302. A terminal section 313 in which a plurality of pad electrodes is arranged side by side is provided at the right end of the semiconductor substrate 302.

[0050] The temperature sensor 32 is formed, for example, in the region where the peripheral circuit section 311 is formed. In the imaging device 1, the signal processing section 40 in the peripheral circuit section 311 is a block having the highest temperature during the operation, and thus the temperature sensor 32 may be formed in a region where the signal processing section 40 is formed to enable detection of a temperature in this signal processing section 40. The temperature sensor 32 may be disposed near the middle of the region where the peripheral circuit section 311 is formed.

[0051] In the terminal section 312, for example, there are disposed: the power supply terminal TVDDH to be supplied with the power supply voltage VDDH; the ground terminal TVSSH to be supplied with the ground voltage VSSH; the power supply terminal TVDDM to be supplied with the power supply voltage VDDM; and the ground terminal TVSSM to be supplied with the ground voltage VSSM. In addition, in the terminal section 312, for example, there are disposed: the power supply terminal TVDDL to be supplied with the power supply voltage VDDL; and the ground terminal TVSSL to be supplied with the ground voltage VSSL.

[0052] The output terminal TOUT from which the error flag signal XERR is outputted and the output terminal TOUT1 from which the warning flag signal XWRN is outputted are disposed at positions closer to the diagnosis section 42 in the terminal section 313, for example. This makes it possible to shorten a signal path between the diagnosis section 42 and each of the output terminal TOUT and the output terminal TOUT1.

[0053] In the imaging device 1 according to an embodiment, the pixel array 9, the scanning section 10, the readout section 20, and the imaging control section 30 correspond to a specific example of an "imaging section" in the present disclosure. The diagnosis section 42 corresponds to a specific example of a "diagnosis section" in the present disclosure. The output section 420 corresponds to a specific example of an "output section" in the present disclosure. The warning flag signal XWRN corresponds to a specific example of a "first flag signal" in the present disclosure. The error flag signal XERR corresponds to a specific example of a "second flag signal" in the present disclosure. 1.2 Specific Examples of Diagnosis Processing (Specific Example 1)

[0054] Here, description is given of a case where the value used as the diagnosis target is a value of the image signal DATA0 after AD conversion. Fig. 10 is a block diagram schematically illustrating a specific example of diagnosis processing using the image signal DATA0 after the AD conversion by the AD converter ADC of the readout section 20. Fig. 11 is an explanatory diagram schematically illustrating a specific example of a relationship between a failure notification threshold and a failure prediction threshold for use in the diagnosis processing. In Fig. 11, a horizontal axis indicates an output value (image signal DATA0) after the AD conversion, and a vertical axis indicates frequency.

[0055] In general, in imaging devices, pixels each including a photodiode are arranged in matrix, and each pixel generates an electric signal corresponding to a received light amount. Then, for example, an AD conversion circuit converts the electric signal (analog signal) generated in each pixel into a digital signal. Some of such imaging devices have a BIST (Built-in self test) function. As described above, the imaging device is desired to perform self-diagnosis using the BIST function of diagnosing presence or absence of a defect.

[0056] In the imaging device 1 according to an embodiment, the image signal DATA0 after the AD conversion by the AD converter ADC of the readout section 20 may be used to perform the diagnosis processing. The diagnosis section 42 may include a failure prediction threshold determiner 431 and a failure notification threshold determiner 432.

[0057] A transistor, in its characteristics, is not brought into failure instantly from a normal state, but the characteristics (Vth and leak) are gradually deteriorated. In that case, as illustrated in Fig. 11, the output value after the AD conversion gradually shifts downward or upward.

[0058] The failure prediction threshold determiner 431 determines whether or not a value of the diagnosis target is outside the first reference range (Fig. 11). In a case where the value of the diagnosis target is outside the first reference range, the diagnosis section 42 outputs the signal XWRN1 (Fig. 4) indicating a predictor of a defect as a result of the diagnosis processing.

[0059] The failure notification threshold determiner 432 determines whether or not a value of the diagnosis target is outside the second reference range. In a case where the value of the diagnosis target is outside the second reference range (Fig. 11), which is wider than the first reference range, the diagnosis section 42 outputs the signal XERR1 (Fig. 4) indicating an error as a result of the diagnosis processing.

[0060] It is to be noted that, as illustrated in Fig. 11, a threshold of the lower limit of the first reference range (lower limit of the failure prediction threshold) is set to be a value larger than a threshold of the lower limit of the second reference range (lower limit of the failure notification threshold). In addition, the threshold of the upper limit of the first reference range (upper limit of the failure prediction threshold) is set to be a value smaller than the threshold of the upper limit of the second reference range (upper limit of the failure notification threshold).

[0061] As described above, in the imaging device 1 according to an embodiment, setting the first reference range for failure prediction inside the second reference range for failure notification enables failure prediction in addition to failure notification.

[0062] The imaging device 1 may be combined with a host 101, which is an external monitoring device that is able to monitor the operation of the imaging device 1, to constitute an imaging system. In a case of failure notification or failure prediction, notification of a result of the diagnosis to a side of the host 101 may be made by embedded data (Embedded data) in an image, or may be made by I2C (Inter Integrated Circuit) communication. In addition, the notification of the result of the diagnosis may be made using a dedicated terminal provided for the warning flag signal XWRN or the error flag signal XERR.

[0063] In the imaging device 1 according to an embodiment, the output section 420 is able to output the warning flag signal XWRN and the error flag signal XERR to the monitoring device to enable the external monitoring device to determine presence or absence of a defect of the imaging device 1 on the basis of the warning flag signal XWRN and the error flag signal XERR.

[0064] The output section 420 may be able to output the first flag from the output terminal TOUT1. The output terminal TOUT1 is an output terminal provided to be dedicated for the warning flag signal XWRN. In addition, the output section 420 may be able to output the error flag signal XERR from the output terminal TOUT. The output terminal TOUT is an output terminal provided to be dedicated for the error flag signal XERR.

[0065] In addition, the output section 420 may be able to output the warning flag signal XWRN and the error flag signal XERR from an image output terminal DOUT. The image output terminal DOUT is an output terminal provided for outputting the image signal DATA.

[0066] In addition, the output section 420 may be able to output the warning flag signal XWRN and the error flag signal XERR from an I2C communication terminal SOUT. The I2C communication terminal SOUT is an output terminal provided for communication of a plurality of signals.

[0067] In the host 101 which is a monitoring device, on the basis of levels of the error flag signal XERR and the warning flag signal XWRN, a judgement concerning a defect may be made, for example, as follows (see Figs. 5 and 6). determined for example, or less. In a case of XERR = Hi, XWRN = Hi: there is no defect In a case of XERR = Hi, XWRN = Low: there is no defect, but there is a predictor of a defect In a case of XERR = Low, XWRN = Low: there is a defect

[0068] In recent years, a failure prediction function has been demanded in an in-vehicle image sensor; however, in general, there is only a failure notification function. In view of a physical phenomenon of aged deterioration, the imaging device 1 according to an embodiment has a structure in which a threshold range is provided, as a threshold range for failure prediction, inside a threshold range for failure notification. In a case where the imaging device 1 according to an embodiment is applied to a vehicle, for example, safety toward automated driving is improved. According to Specific Example 1, the addition of only threshold determination circuits (failure prediction threshold determiner 431 and failure notification threshold determiner 432) enables achievement of failure prediction of the AD converter ADC. (Specific Example 2)

[0069] In recent years, a power supply IC has also been mounted with a function of monitoring a voltage. Not only the imaging section but also the power supply IC may be a diagnosis target. Here, description is given of a case where the value used as the diagnosis target is a value of the power supply voltage. Fig. 12 is a block diagram schematically illustrating a specific example of diagnosis processing using a power supply voltage. Fig. 12 illustrates a case where the values used as the diagnosis target are values of the power supply voltages VDDH, VDDM, and VDDL. It is to be noted that not only the power supply voltages VDDH, VDDM, and VDDL but also an intermediate potential of an internal generation circuit or the like may also be a diagnosis target.

[0070] The imaging device 1 is supplied with a power supply voltage from a PMIC (Power management IC) 440 that performs power supply control, for example. The PMIC 440 includes a power supply section 450 (power supply IC). The power supply section 450 includes, for example, a DC / DC converter 451 and an LDO (Low Drop Out) regulator 452.

[0071] A transistor, in its characteristics, is not brought into failure instantly from a normal state, but the characteristics (Vth and leak) are gradually deteriorated. In that case, in the same manner as the output value after the AD conversion illustrated in Fig. 11, the values of the power supply voltages VDDH, VDDM, and VDDL also gradually shift downward or upward.

[0072] In the same manner as the foregoing Specific Example 1, in a case where the values of the power supply voltages VDDH, VDDM, and VDDL, which are values of the diagnosis target, are outside the first reference range, the diagnosis section 42 outputs the signal XWRN1 (Fig. 4) indicating a predictor of a defect as a result of the diagnosis processing. In the same manner as the foregoing Specific Example 1, in a case where the values of the power supply voltages VDDH, VDDM, and VDDL, which are values of the diagnosis target, are outside the second reference range, which is wider than the first reference range, the diagnosis section 42 outputs the signal XERR1 (Fig. 4) indicating an error as a result of the diagnosis processing.

[0073] The PMIC 440 may include a failure prediction threshold determiner 461H, a failure prediction threshold determiner 461M, and a failure prediction threshold determiner 461L. The failure prediction threshold determiner 461H determines whether or not the power supply voltage VDDH is outside the first reference range that is a reference of failure prediction of the power supply voltage VDDH. The failure prediction threshold determiner 461M determines whether or not the power supply voltage VDDM is outside the first reference range that is a reference of failure prediction of the power supply voltage VDDM. The failure prediction threshold determiner 461L determines whether or not the power supply voltage VDDL is outside the first reference range that is a reference of failure prediction of the power supply voltage VDDL.

[0074] In addition, the PMIC 440 may include a failure notification threshold determiner 462H, a failure notification threshold determiner 462M, and a failure notification threshold determiner 462L. The failure notification threshold determiner 462H determines whether or not the power supply voltage VDDH is outside the second reference range that is a reference of failure notification of the power supply voltage VDDH. The failure notification threshold determiner 462M determines whether or not the power supply voltage VDDM is outside the second reference range that is a reference of failure notification of the power supply voltage VDDM. The failure notification threshold determiner 462L determines whether or not the power supply voltage VDDL is outside the second reference range that is a reference of failure notification of the power supply voltage VDDL. In a case where the value of the diagnosis target is outside the second reference range (Fig. 11), which is wider than the first reference range, the diagnosis section 42 outputs the signal XERR1 (Fig. 4) indicating an error as a result of the diagnosis processing.

[0075] The diagnosis section 42 may include a failure prediction threshold determiner 431H, a failure prediction threshold determiner 431M, and a failure prediction threshold determiner 431L. The failure prediction threshold determiner 431H determines whether or not the power supply voltage VDDH is outside the first reference range that is a reference of failure prediction of the power supply voltage VDDH. The failure prediction threshold determiner 431M determines whether or not the power supply voltage VDDM is outside the first reference range that is a reference of failure prediction of the power supply voltage VDDM. The failure prediction threshold determiner 431L determines whether or not the power supply voltage VDDL is outside the first reference range that is a reference of failure prediction of the power supply voltage VDDL.

[0076] In addition, the diagnosis section 42 may include a failure notification threshold determiner 432H, a failure notification threshold determiner 432M, and a failure notification threshold determiner 432L. The failure notification threshold determiner 432H determines whether or not the power supply voltage VDDH is outside the second reference range that is a reference of failure notification of the power supply voltage VDDH. The failure notification threshold determiner 432M determines whether or not the power supply voltage VDDM is outside the second reference range that is a reference of failure notification of the power supply voltage VDDM. The failure notification threshold determiner 432L determines whether or not the power supply voltage VDDL is outside the second reference range that is a reference of failure notification of the power supply voltage VDDL.

[0077] As described above, in the imaging device 1 according to an embodiment, setting the first reference range for failure prediction inside the second reference range for failure notification enables failure prediction in addition to failure notification.

[0078] It is to be noted that, in the same manner as the foregoing Specific Example 1, notification of a result of the diagnosis to the side of the host 101, which is a monitoring device, may be made by embedded data in an image, or may be made by I2C communication. In addition, the notification of the result of the diagnosis may be made using a dedicated terminal provided for the warning flag signal XWRN or the error flag signal XERR. In addition, results of the determinations made by each failure prediction threshold determiner and each failure notification threshold determiner in the PMIC 440 may be notified directly to the side of the host 101 without going through the imaging device 1.

[0079] According to Specific Example 2, for example, safety toward automated driving is improved in a case of being applied to a vehicle. Further, the addition of only the threshold determination circuit enables achievement of failure prediction of the power supply voltage and the intermediate potential. (Specific Example 3)

[0080] Here, description is given of a case where the value used as the diagnosis target is an output value from a ring oscillator. Fig. 13 is a block diagram schematically illustrating a specific example of diagnosis processing using a ring oscillator. Fig. 14 is a block diagram schematically illustrating a configuration example of the ring oscillator.

[0081] The imaging device 1 according to an embodiment may include one or a plurality of ring oscillators 470. In the imaging device 1 according to an embodiment, the diagnosis processing may be performed on the basis of an output value from the one or the plurality of ring oscillators 470. The diagnosis section 42 may include the failure prediction threshold determiner 431 and the failure notification threshold determiner 432. The diagnosis section 42 may perform the diagnosis processing on the basis of one output value of the ring oscillator 470, or may perform the diagnosis processing on the basis of a difference between a maximum value and a minimum value of respective output values of the plurality of ring oscillators 470.

[0082] The ring oscillator 470 includes a plurality of inverters INV-1, INV-2, ... , and INV-N, and a counter 471. It is to be noted that N is an odd number. The inverters INV-1, INV-2, ... , and INV-N are coupled in series. An output of the inverter INV-N of the last stage is inputted to the inverter INV-1 of the first stage; the plurality of inverters forms a ring structure as a whole. In addition, an output of the inverter INV-N of the last stage is inputted to the counter 471.

[0083] The ring oscillator 470 outputs a signal of which a frequency varies in accordance with a voltage of an input signal, and is thus effective for measuring a voltage in a chip that constitutes the imaging section, enabling monitoring of a power supply. In a case where the characteristics (Vth and leak) are deteriorated. a transistor, in its characteristics, should cause the voltage inside the chip to fluctuate. In Specific Example 3, the one or the plurality of ring oscillators 470 is arranged in the chip that constitutes the imaging section, to monitor the frequency corresponding to the voltage, thus enabling failure notification and failure prediction.

[0084] The failure prediction threshold determiner 431 determines whether or not an output value of the ring oscillator 470, which is a value of the diagnosis target, is outside the first reference range. In the same manner as the foregoing Specific Example 1, in a case where the output value of the ring oscillator 470, which is the value of the diagnosis target, is outside the first reference range, the diagnosis section 42 outputs the signal XWRN1 (Fig. 4) indicating a predictor of a defect as a result of the diagnosis processing.

[0085] The failure notification threshold determiner 432 determines whether or not an output value of the ring oscillator 470, which is a value of the diagnosis target, is outside the second reference range. In the same manner as the foregoing Specific Example 1, in a case where the output value of the ring oscillator 470, which is the value of the diagnosis target, is outside the second reference range, which is wider than the first reference range, the diagnosis section 42 outputs the signal XERR1 (Fig. 4) indicating an error as a result of the diagnosis processing.

[0086] As described above, in the imaging device 1 according to an embodiment, setting the first reference range for failure prediction inside the second reference range for failure notification enables failure prediction in addition to failure notification.

[0087] It is to be noted that, in the same manner as the foregoing Specific Example 1, notification of a result of the diagnosis to the side of the host 101, which is a monitoring device, may be made by embedded data in an image, or may be made by I2C communication. In addition, the notification of the result of the diagnosis may be made using a dedicated terminal provided for the warning flag signal XWRN or the error flag signal XERR.

[0088] According to Specific Example 3, for example, safety toward automated driving is improved in a case of being applied to a vehicle. Further, the addition of a simple circuit enables achievement of failure prediction of the voltage inside the chip that constitutes the imaging section. (Specific Example 4)

[0089] Here, description is given of a case where the value used as the diagnosis target is a detected value of the temperature sensor 32. Fig. 15 is a block diagram schematically illustrating a specific example of diagnosis processing using the temperature sensor 32.

[0090] In the imaging device 1 according to an embodiment, the diagnosis processing may be performed on the basis of a detected value of the temperature sensor 32. The diagnosis section 42 may include the failure prediction threshold determiner 431 and the failure notification threshold determiner 432. The diagnosis section 42 may perform the diagnosis processing on the basis of a detected value of the temperature sensor 32. It is to be noted that one or a plurality of temperature sensors 32 may be disposed. The diagnosis section 42 may perform the diagnosis processing on the basis of one detected value of the temperature sensor 32, or may perform the diagnosis processing on the basis of a difference between a maximum value and a minimum value of respective detected values of the plurality of temperature sensors 32.

[0091] A transistor, in its characteristics, is not brought into failure instantly from a normal state, but the characteristics (Vth and leak) are gradually deteriorated. In that case, in the same manner as the output value after the AD conversion illustrated in Fig. 11, the detected value of the temperature sensor 32 gradually shifts downward or upward in accordance with power consumption of the imaging section.

[0092] The failure prediction threshold determiner 431 determines whether or not a detected value of the temperature sensor 32, which is a value of the diagnosis target, is outside the first reference range. In the same manner as the foregoing Specific Example 1, in a case where the detected value of the temperature sensor 32, which is the value of the diagnosis target, is outside the first reference range, the diagnosis section 42 outputs the signal XWRN1 (Fig. 4) indicating a predictor of a defect as a result of the diagnosis processing.

[0093] The failure notification threshold determiner 432 determines whether or not a detected value of the temperature sensor 32, which is a value of the diagnosis target, is outside the second reference range. In the same manner as the foregoing Specific Example 1, in a case where the detected value of the temperature sensor 32, which is the value of the diagnosis target, is outside the second reference range, which is wider than the first reference range, the diagnosis section 42 outputs the signal XERR1 (Fig. 4) indicating an error as a result of the diagnosis processing.

[0094] As described above, in the imaging device 1 according to an embodiment, setting the first reference range for failure prediction inside the second reference range for failure notification enables failure prediction in addition to failure notification. According to the present technology, providing a threshold for failure prediction inside a threshold that has currently been set enables failure prediction in addition to failure notification.

[0095] It is to be noted that, in the same manner as the foregoing Specific Example 1, notification of a result of the diagnosis to the side of the host 101, which is a monitoring device, may be made by embedded data in an image, or may be made by I2C communication. In addition, the notification of the result of the diagnosis may be made using a dedicated terminal provided for the warning flag signal XWRN or the error flag signal XERR.

[0096] According to Specific Example 4, for example, safety toward automated driving is improved in a case of being applied to a vehicle. Further, the addition of only a threshold determination circuit enables achievement of failure prediction by means of a temperature. (Specific Example 5)

[0097] Fig. 16 is an explanatory diagram schematically illustrating an example of processing of switching operation modes of the imaging device 1 in accordance with a result of diagnosis processing.

[0098] In the imaging device 1 according to an embodiment, in a case where the result of the diagnosis processing indicates a predictor of a defect, an imaging operation may be performed in a state (safe-state mode) where an operation is partially limited in accordance with the predictor of the defect.

[0099] As illustrated in Fig. 16, the imaging device 1 may have, as operation modes, a standby mode, a streaming mode, and a safe-state mode.

[0100] In the imaging device 1, the diagnosis processing may be performed in the streaming mode; in a case where failure prediction or failure notification is made, a transition may be made to the safe-state mode. In addition, the diagnosis processing may also be performed at the time of standby before the streaming; in a case where failure prediction or failure notification is made at that time, a transition may be made from the standby mode to the safe-state mode.

[0101] The safe-state mode may include a stop mode and a low-consumption mode. In a case where failure notification is made, a transition may be made to the stop mode in which the imaging operation is stopped. In addition, in a case where failure prediction is made, a transition may be made to the low-consumption mode. The transition to the low-consumption mode enables current consumption to be lowered, thus lowering a temperature. Alternatively, in a case where failure prediction is made, for example, a transition may be made to a limited operation mode to decrease an output angle of view. Decreasing the output angle of view enables an imaging operation that avoids an AD conversion circuit or a pixel of which a failure is predicted. This enables continuation of the imaging operation even after notification of the failure prediction, thus making it possible for a vehicle to move to a safe location while continuing automated driving, for example, in a case of being applied to the vehicle.

[0102] According to Specific Example 5, for example, safety toward automated driving is improved in a case of being applied to a vehicle. In addition, it is possible for a vehicle to continue driving at the time of emergency. 1.3 Effects

[0103] As described hereinabove, according to the imaging device 1 of an embodiment, in a case where diagnosis processing of a defect is performed to find that a result of the diagnosis processing indicates a predictor of a defect, the warning flag signal XWRN as the first flag signal corresponding to the result of the diagnosis processing is set to a ground level. This enables prediction of occurrence of the defect.

[0104] In addition, according to the imaging device 1 of an embodiment, as illustrated in Figs. 4 and 6, the warning flag signal XWRN is allowed to be a so-called negative logic signal; in a case where no predictor of a defect is confirmed by the diagnosis processing in the diagnosis section 42, the warning flag signal XWRN is brought into a high level (power supply voltage VDDM), and, in a case where a predictor of a defect is confirmed, the warning flag signal XWRN is brought into a low level (ground voltage VSSM). This makes it possible to more surely notify occurrence of the predictor of the defect. For example, in a case where the power supply voltage VDDM is not supplied to the imaging device 1 and where the warning flag signal XWRN is brought into a low level, the monitoring device that monitors this warning flag signal XWRN is able to judge that there is an occurrence of a predictor of a defect. That is, it is possible for the imaging device 1 to notify not only the predictor of the defect detected by the diagnosis section 42, but also the predictor of such a defect that the power supply voltage VDDM is not supplied.

[0105] It is to be noted that the effects described herein are merely exemplary and are not limited thereto, and may further include other effects. The same applies to effects of the following other embodiments. <2. Usage Examples of Imaging Device>

[0106] Fig. 17 illustrates a usage example of the imaging device 1 according to the foregoing embodiment. For example, the imaging device 1 described above is usable in a variety of cases of sensing light, including visible light, infrared light, ultraviolet light, and X-rays, as follows.

[0107] - Apparatuses that shoot images for appreciation, including digital cameras and mobile equipment having a camera function - Apparatuses for traffic use, including onboard sensors that shoot images of the front, back, surroundings, inside, and so on of an automobile for safe driving such as automatic stop and for recognition of a driver's state, monitoring cameras that monitor traveling vehicles and roads, and distance measurement sensors that measure distances including a vehicle-to-vehicle distance - Apparatuses for use in home electrical appliances including televisions, refrigerators, and air-conditioners to shoot images of a user's gesture and bring the appliances into operation in accordance with the gesture - Apparatuses for medical treatment and health care use, including endoscopes and apparatuses that shoot images of blood vessels by receiving infrared light - Apparatuses for security use, including monitoring cameras for crime prevention and cameras for individual authentication - Apparatuses for beauty care use, including skin measuring apparatuses that shoot images of skin and microscopes that shoot images of scalp - Apparatuses for sports use, including action cameras and wearable cameras for sports applications and the like - Apparatuses for agricultural use, including cameras for monitoring the states of fields and crops <3. Example of Practical Application to Mobile Body>

[0108] The technology (the present technology) according to the present disclosure is applicable to a variety of products. For example, the technology according to the present disclosure may be achieved as a device mounted on any type of mobile body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility, an aircraft, a drone, a vessel, or a robot.

[0109] Fig. 18 is a block diagram depicting an example of schematic configuration of a vehicle control system as an example of a mobile body control system to which the technology according to an embodiment of the present disclosure can be applied.

[0110] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. In the example depicted in Fig. 18, the vehicle control system 12000 includes a driving system control unit 12010, a body system control unit 12020, an outside-vehicle information detecting unit 12030, an in-vehicle information detecting unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output section 12052, and a vehicle-mounted network interface (I / F) 12053 are illustrated as a functional configuration of the integrated control unit 12050.

[0111] The driving system control unit 12010 controls the operation of devices related to the driving system of the vehicle in accordance with various kinds of programs. For example, the driving system control unit 12010 functions as a control device for a driving force generating device for generating the driving force of the vehicle, such as an internal combustion engine, a driving motor, or the like, a driving force transmitting mechanism for transmitting the driving force to wheels, a steering mechanism for adjusting the steering angle of the vehicle, a braking device for generating the braking force of the vehicle, and the like.

[0112] The body system control unit 12020 controls the operation of various kinds of devices provided to a vehicle body in accordance with various kinds of programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various kinds of lamps such as a headlamp, a backup lamp, a brake lamp, a turn signal, a fog lamp, or the like. In this case, radio waves transmitted from a mobile device as an alternative to a key or signals of various kinds of switches can be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals, and controls a door lock device, the power window device, the lamps, or the like of the vehicle.

[0113] The outside-vehicle information detecting unit 12030 detects information about the outside of the vehicle including the vehicle control system 12000. For example, the outside-vehicle information detecting unit 12030 is connected with an imaging section 12031. The outside-vehicle information detecting unit 12030 makes the imaging section 12031 image an image of the outside of the vehicle, and receives the imaged image. On the basis of the received image, the outside-vehicle information detecting unit 12030 may perform processing of detecting an object such as a human, a vehicle, an obstacle, a sign, a character on a road surface, or the like, or processing of detecting a distance thereto.

[0114] The imaging section 12031 is an optical sensor that receives light, and which outputs an electric signal corresponding to a received light amount of the light. The imaging section 12031 can output the electric signal as an image, or can output the electric signal as information about a measured distance. In addition, the light received by the imaging section 12031 may be visible light, or may be invisible light such as infrared rays or the like.

[0115] The in-vehicle information detecting unit 12040 detects information about the inside of the vehicle. The in-vehicle information detecting unit 12040 is, for example, connected with a driver state detecting section 12041 that detects the state of a driver. The driver state detecting section 12041, for example, includes a camera that images the driver. On the basis of detection information input from the driver state detecting section 12041, the in-vehicle information detecting unit 12040 may calculate a degree of fatigue of the driver or a degree of concentration of the driver, or may determine whether the driver is dozing.

[0116] The microcomputer 12051 can calculate a control target value for the driving force generating device, the steering mechanism, or the braking device on the basis of the information about the inside or outside of the vehicle which information is obtained by the outside-vehicle information detecting unit 12030 or the in-vehicle information detecting unit 12040, and output a control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform cooperative control intended to implement functions of an advanced driver assistance system (ADAS) which functions include collision avoidance or shock mitigation for the vehicle, following driving based on a following distance, vehicle speed maintaining driving, a warning of collision of the vehicle, a warning of deviation of the vehicle from a lane, or the like.

[0117] In addition, the microcomputer 12051 can perform cooperative control intended for automated driving, which makes the vehicle to travel automatedly without depending on the operation of the driver, or the like, by controlling the driving force generating device, the steering mechanism, the braking device, or the like on the basis of the information about the outside or inside of the vehicle which information is obtained by the outside-vehicle information detecting unit 12030 or the in-vehicle information detecting unit 12040.

[0118] In addition, the microcomputer 12051 can output a control command to the body system control unit 12020 on the basis of the information about the outside of the vehicle which information is obtained by the outside-vehicle information detecting unit 12030. For example, the microcomputer 12051 can perform cooperative control intended to prevent a glare by controlling the headlamp so as to change from a high beam to a low beam, for example, in accordance with the position of a preceding vehicle or an oncoming vehicle detected by the outside-vehicle information detecting unit 12030.

[0119] The sound / image output section 12052 transmits an output signal of at least one of a sound and an image to an output device capable of visually or auditorily notifying information to an occupant of the vehicle or the outside of the vehicle. In the example of Fig. 18, an audio speaker 12061, a display section 12062, and an instrument panel 12063 are illustrated as the output device. The display section 12062 may, for example, include at least one of an on-board display and a head-up display.

[0120] Fig. 19 is a diagram depicting an example of the installation position of the imaging section 12031.

[0121] In Fig. 19, the imaging section 12031 includes imaging sections 12101, 12102, 12103, 12104, and 12105.

[0122] The imaging sections 12101, 12102, 12103, 12104, and 12105 are, for example, disposed at positions on a front nose, sideview mirrors, a rear bumper, and a back door of the vehicle 12100 as well as a position on an upper portion of a windshield within the interior of the vehicle. The imaging section 12101 provided to the front nose and the imaging section 12105 provided to the upper portion of the windshield within the interior of the vehicle obtain mainly an image of the front of the vehicle 12100. The imaging sections 12102 and 12103 provided to the sideview mirrors obtain mainly an image of the sides of the vehicle 12100. The imaging section 12104 provided to the rear bumper or the back door obtains mainly an image of the rear of the vehicle 12100. The imaging section 12105 provided to the upper portion of the windshield within the interior of the vehicle is used mainly to detect a preceding vehicle, a pedestrian, an obstacle, a signal, a traffic sign, a lane, or the like.

[0123] Incidentally, Fig. 19 depicts an example of photographing ranges of the imaging sections 12101 to 12104. An imaging range 12111 represents the imaging range of the imaging section 12101 provided to the front nose. Imaging ranges 12112 and 12113 respectively represent the imaging ranges of the imaging sections 12102 and 12103 provided to the sideview mirrors. An imaging range 12114 represents the imaging range of the imaging section 12104 provided to the rear bumper or the back door. A bird’s-eye image of the vehicle 12100 as viewed from above is obtained by superimposing image data imaged by the imaging sections 12101 to 12104, for example.

[0124] At least one of the imaging sections 12101 to 12104 may have a function of obtaining distance information. For example, at least one of the imaging sections 12101 to 12104 may be a stereo camera constituted of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0125] For example, the microcomputer 12051 can determine a distance to each three-dimensional object within the imaging ranges 12111 to 12114 and a temporal change in the distance (relative speed with respect to the vehicle 12100) on the basis of the distance information obtained from the imaging sections 12101 to 12104, and thereby extract, as a preceding vehicle, a nearest three-dimensional object in particular that is present on a traveling path of the vehicle 12100 and which travels in substantially the same direction as the vehicle 12100 at a predetermined speed (for example, equal to or more than 0 km / hour). Further, the microcomputer 12051 can set a following distance to be maintained in front of a preceding vehicle in advance, and perform automatic brake control (including following stop control), automatic acceleration control (including following start control), or the like. It is thus possible to perform cooperative control intended for automated driving that makes the vehicle travel automatedly without depending on the operation of the driver or the like.

[0126] For example, the microcomputer 12051 can classify three-dimensional object data on three-dimensional objects into three-dimensional object data of a two-wheeled vehicle, a standard-sized vehicle, a large-sized vehicle, a pedestrian, a utility pole, and other three-dimensional objects on the basis of the distance information obtained from the imaging sections 12101 to 12104, extract the classified three-dimensional object data, and use the extracted three-dimensional object data for automatic avoidance of an obstacle. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that the driver of the vehicle 12100 can recognize visually and obstacles that are difficult for the driver of the vehicle 12100 to recognize visually. Then, the microcomputer 12051 determines a collision risk indicating a risk of collision with each obstacle. In a situation in which the collision risk is equal to or higher than a set value and there is thus a possibility of collision, the microcomputer 12051 outputs a warning to the driver via the audio speaker 12061 or the display section 12062, and performs forced deceleration or avoidance steering via the driving system control unit 12010. The microcomputer 12051 can thereby assist in driving to avoid collision.

[0127] At least one of the imaging sections 12101 to 12104 may be an infrared camera that detects infrared rays. The microcomputer 12051 can, for example, recognize a pedestrian by determining whether or not there is a pedestrian in imaged images of the imaging sections 12101 to 12104. Such recognition of a pedestrian is, for example, performed by a procedure of extracting characteristic points in the imaged images of the imaging sections 12101 to 12104 as infrared cameras and a procedure of determining whether or not it is the pedestrian by performing pattern matching processing on a series of characteristic points representing the contour of the object. When the microcomputer 12051 determines that there is a pedestrian in the imaged images of the imaging sections 12101 to 12104, and thus recognizes the pedestrian, the sound / image output section 12052 controls the display section 12062 so that a square contour line for emphasis is displayed so as to be superimposed on the recognized pedestrian. The sound / image output section 12052 may also control the display section 12062 so that an icon or the like representing the pedestrian is displayed at a desired position.

[0128] The description has been given hereinabove of an example of a vehicle control system to which the technology according to the present disclosure is applicable. The technology according to the present disclosure is applicable to the imaging section 12031 of the configurations described above. This enables the vehicle control system 12000 to diagnose whether or not the imaging section 12031 operates normally by performing self-diagnosis. In a case where a defect occurs to the imaging section 12031, for example, a result of the diagnosis is notified to the microcomputer 12051, to thereby enable the vehicle control system 12000 to grasp the defect having occurred to the imaging section 12031. This enables the vehicle control system 12000 to perform appropriate processing such as alerting a driver, for example, thus making it possible to improve reliability. In addition, the vehicle control system 12000 is able to limit the function of controlling a vehicle on the basis of the result of the diagnosis processing. Specific examples of the function of controlling the vehicle include a collision avoidance or collision mitigation function for the vehicle, a following traveling function based on a vehicle-to-vehicle distance, a vehicle speed maintaining traveling function, a warning function against collision of the vehicle, and a warning function against deviation of the vehicle from a lane. In a case where it is determined that a defect has occurred to the imaging section 12031 as a result of the diagnosis processing, it is possible to limit or prohibit the function of controlling the vehicle. Specifically, the vehicle control system 12000 is able to control braking, an engine output, and a transmission. This enables the vehicle control system 12000 to prevent an accident caused by erroneous detection based on the defect of the imaging section 12031.

[0129] In addition, for example, in a case where the vehicle control system 12000 includes two redundant imaging sections as the imaging section 12031 and where a defect occurs to one of the imaging sections, another of the imaging sections may be allowed to operate. In addition, for example, in a case where the vehicle control system 12000 includes, in addition to the imaging section 12031, a distance measuring section (e.g., a LIDAR device (Light Detection and Ranging) or a TOF (Time Of Flight) image sensor) that detects a distance to an object, this distance measuring section may be operated at the time of occurrence of a defect in the imaging section 12031. In this case, it is possible to detect at least a distance to an object, thus making it possible to prevent an accident caused by erroneous detection based on the defect of the imaging section 12031. <4. Operation Example of Imaging Device Mounted on Vehicle>

[0130] In a vehicle, for example, a microcontroller such as an ECU (Engine Control Unit) controls an operation of the vehicle. In a case where the imaging device 1 is mounted on the vehicle, the ECU also controls an operation of the imaging device 1. Hereinafter, description is given of the operation of the imaging device 1 mounted on the vehicle.

[0131] Fig. 20 is a state transition diagram illustrating an example of a transition between operation states of the vehicle.

[0132] The operating states of the vehicle generally includes a standby state ST1, an accessory-on state ST2, and an ignition-on state ST3. The standby state ST1 is a state where most functions except some functions, such as a door lock function and an anti-theft function, are in an OFF state. The accessory-on state ST2 is a state where electronic apparatuses other than a vehicle drive-train are operable. The ignition-on state ST3 is a state where all components including the vehicle drive-train are operable. In a case where the operation state of the vehicle is the standby state ST1, for example, giving an instruction to the vehicle by a user turning a key or operating an ignition switch allows the operation state to transition from the standby state ST1 to the accessory-on state ST2 and then to transition from the accessory-on state ST2 to the ignition-on state ST3. Likewise, in a case where the operation state of the vehicle is the ignition-on state ST3, for example, giving an instruction to the vehicle by the user allows the operation state to transition from the ignition-on state ST3 to the accessory-on state ST2 and then to transition from the accessory-on state ST2 to the standby state ST1.

[0133] Fig. 21 is an explanatory diagram illustrating exchanges of the error flag signal XERR and the warning flag signal XWRN between the imaging device 1 and an ECU 190.

[0134] The ECU 190 supplies the imaging device 1 with a clear signal XCLR, and the imaging device 1 receives this clear signal XCLR. The clear signal XCLR is a so-called negative logic signal; in a case where the operation of the imaging device 1 is stopped, the clear signal XCLR is brought into a low level, and, in a case where the imaging device 1 is operated, the clear signal XCLR is brought into a high level. In addition, the imaging device 1 supplies the ECU 190 with the error flag signal XERR, and the ECU 190 receives this error flag signal XERR. When a defect occurs to the imaging device 1, the ECU 190 performs processing corresponding to the defect on the basis of the error flag signal XERR. In addition, the imaging device 1 supplies the ECU 190 with the warning flag signal XWRN, and the ECU 190 receives this warning flag signal XWRN. When a prediction of a defect for the imaging device 1 is made, the ECU 190 performs processing corresponding to the prediction of the defect, on the basis of the warning flag signal XWRN.

[0135] The ECU 190 includes a diagnosis section 190A. This diagnosis section 190A performs a diagnosis as to whether a voltage of the error flag signal XERR is not fixed during a period when the imaging device 1 performs a start-up operation. In addition, the diagnosis section 190A also has functions of, in a case where the error flag signal XERR is at a high level after the start of an imaging operation by the imaging device 1, detecting a voltage value of the error flag signal XERR and performing a diagnosis as to whether or not the detected voltage value is a desired voltage corresponding to the power supply voltage VDDM. In addition, the diagnosis section 190A performs a diagnosis as to whether a voltage of the warning flag signal XWRN is not fixed during the period when the imaging device 1 performs the start-up operation. In addition, the diagnosis section 190A also has functions of, in a case where the warning flag signal XWRN is at a high level after the start of the imaging operation by the imaging device 1, detecting a voltage value of the warning flag signal XWRN and performing a diagnosis as to whether or not the detected voltage value is a desired voltage corresponding to the power supply voltage VDDM.

[0136] Here, the ECU 190 corresponds to a specific example of a "monitoring device" in the present disclosure.

[0137] Figs. 22 to 24 are each a timing diagram illustrating an example of operations of the imaging device 1. Figs. 22 to 24 each illustrate an example of operations of the imaging device 1 in a case where an operation state of the vehicle transitions from the standby state ST1 to the ignition-on state ST3. (A) of each of Figs. 22 to 24 illustrates operation states of the vehicle. (B) of each of Figs. 22 to 24 illustrates operations of the imaging device 1. (C) of each of Figs. 22 to 24 illustrates waveforms of the power supply voltages VDDH, VDDM, and VDDL. (D) of each of Figs. 22 to 24 illustrates a waveform of the clear signal XCLR. (E) of each of Figs. 22 to 24 illustrates a waveform of the error flag signal XERR. In addition, (F) of each of Figs. 22 to 24 illustrates a waveform of the warning flag signal XWRN.

[0138] Hereinafter, description is given of an example of the operation mainly with reference to Fig. 22. For example, giving an instruction to the vehicle by the user turning a key or operating an ignition switch allows the operation state of the vehicle to transition from the standby state ST1 to the accessory-on state ST2 at a timing t101 ((A) of Fig. 22). This allows the ECU 190 to cause the imaging device 1 to start the start-up operation ((B) of Fig. 22).

[0139] Next, at a timing t102, the three power supply voltages VDDH, VDDM, and VDDL are supplied to the imaging device 1 ((C) of Fig. 22).

[0140] Next, at a timing t103, the ECU 190 changes the clear signal XCLR from a low level (Low) to a high level (Hi) ((D) of Fig. 22). Accordingly, the imaging device 1 performs the start-up operation ((B) of Fig. 22), reads data for use in a start-up test from an OTP (One Time Programmable) memory provided in the imaging device 1, for example, during a period of timings t103 to t104, expands the data into a register, and initializes an SRAM (Static Random Access Memory) included in the signal processing section 40. During this period, the imaging device 1 sets each of the error flag signal XERR and the warning flag signal XWRN to a high level ((E) of Fig. 22 and (F) of Fig. 22).

[0141] Next, the imaging device 1 performs the start-up test during a period of timings t104 to t105 ((B) of Fig. 22). Specifically, the imaging device 1 performs, for example, self-diagnosis of the signal processing section 40 and self-diagnosis of the SRAM included in the signal processing section 40. During this period, the imaging device 1 sets each of the error flag signal XERR and the warning flag signal XWRN to a low level ((E) of Fig. 22 and (F) of Fig. 22).

[0142] Next, the imaging device 1 starts the imaging operation at the timing t105. In a case where no defect is detected at the start-up test performed immediately before, the imaging device 1 changes each of the error flag signal XERR and the warning flag signal XWRN from a low level to a high level.

[0143] It is to be noted that, in a case where a predictor of a defect is detected in the start-up test, the imaging device 1 maintains the warning flag signal XWRN at a low level, as indicated by a broken line in (F) of Fig. 23. In addition, in a case where a defect is detected and a predictor of a defect is detected in the start-up test, the imaging device 1 maintains both of the error flag signal XERR and the warning flag signal XWRN at low levels, as indicated by broken lines in (E) of Fig. 24 and (F) of Fig. 24.

[0144] Next, the imaging device 1 performs the start-up operation again at a timing t106 ((B) of Fig. 22), reads data for use in the imaging operation from the OTP memory provided in the imaging device 1, for example, during a period of timings t106 to t107, expands the data into a register, and initializes the SRAM included in the signal processing section 40.

[0145] Next, the imaging device 1 waits (stands by) during a period of timings t107 to t108. The length of this period is set to a length of time until various analog circuits of the imaging device 1 are each brought into a normally operable state.

[0146] Then, at and after the timing t108, the imaging device 1 starts streaming. The diagnosis section 42 of the imaging device 1 may perform self-diagnosis in the blanking period T20 (Fig. 3) in the streaming period. In a case where the diagnosis section 42 detects a predictor of a defect, the imaging device 1 changes the warning flag signal XWRN from a high level to a low level, as indicated by a broken line in (F) of Fig. 23. In addition, in a case where the diagnosis section 42 detects a defect and detects a predictor of a defect, the imaging device 1 changes each of the error flag signal XERR and and the warning flag signal XWRN from a high level to a low level, as indicated by broken lines in (E) and (F) of Figs. 24.

[0147] Then, at a timing t109 after the imaging device 1 starts streaming, the operation state of the vehicle transitions from the accessory-on state ST2 to the ignition-on state ST3 ((A) of Fig. 22).

[0148] In this sequence, the ECU 190 does not make an error judgement on the basis of the error flag signal XERR during a period until the timing t105 (a judgement stop period T101). That is, in this example, the imaging device 1 sets the error flag signal XERR to a high level during a period of the timings t103 to t104, and sets the error flag signal XERR to a low level during the period of the timings t104 to t105; during this period, the ECU 190 judges that no defect has occurred to the imaging device 1.

[0149] In addition, the ECU 190 does not make a warning judgement on the basis of the warning flag signal XWRN during the period until the timing t105 (judgement stop period T101). That is, in this example, the imaging device 1 sets the warning flag signal XWRN to a high level during the period of the timings t103 to t104, and sets the warning flag signal XWRN to a low level during the period of the timings t104 to t105; during this period, the ECU 190 judges that no predictor of a defect has occurred to the imaging device 1.

[0150] In addition, in the timings t103 to t105 (a fixed diagnosis period T103), the diagnosis section 190A of the ECU 190 performs a diagnosis as to whether the voltage of the error flag signal XERR is not fixed. Specifically, the diagnosis section 190A judges that the voltage of the error flag signal XERR is not fixed in a case where the error flag signal XERR is at a high level during the period of the timings t103 to t104 and where the error flag signal XERR is at a low level during the period of the timings t104 to t105. In addition, the diagnosis section 190A judges that the voltage of the error flag signal XERR is fixed in a case where the error flag signal XERR is maintained at a low level or a high level during the period of the timings t103 to t105. In a case where the voltage of the error flag signal XERR is fixed, the diagnosis section 190A performs processing corresponding to the defect.

[0151] In addition, during the timings t103 to t105 (fixed diagnosis period T103), the diagnosis section 190A of the ECU 190 performs a diagnosis as to whether the voltage of the warning flag signal XWRN is not fixed. Specifically, the diagnosis section 190A judges that the voltage of the warning flag signal XWRN is not fixed in a case where the warning flag signal XWRN is at a high level during the period of the timings t103 to t104 and where the warning flag signal XWRN is at a low level during the period of the timings t104 to t105. In addition, the diagnosis section 190A judges that the voltage of the warning flag signal XWRN is fixed in a case where the warning flag signal XWRN is maintained at a low level or a high level during the period of the timings t103 to t105. In a case where the voltage of the warning flag signal XWRN is fixed, the diagnosis section 190A performs processing corresponding to a predictor of the defect.

[0152] Then, the ECU 190 makes an error judgement on the basis of the error flag signal XERR during the period (judgement period) at and after the timing t105. In a case where a defect occurs to the imaging device 1, the ECU 190 performs processing corresponding to the defect. In addition, the ECU 190 makes a warning judgement on the basis of the warning flag signal XWRN during the judgement period at and after the timing t105. In a case of occurrence of a predictor of a defect to the imaging device 1, the ECU 190 performs processing corresponding to the predictor of the defect.

[0153] In addition, in a case where the error flag signal XERR is at a high level during the period (judgement period) at and after the timing t105, the diagnosis section 190A detects a voltage value (high-level voltage value) of the error flag signal XERR, and performs a diagnosis as to whether or not the high-level voltage value is a desired voltage corresponding to the power supply voltage VDDM. Specifically, the diagnosis section 190A confirms whether or not the high-level voltage value falls within a predetermined voltage range corresponding to the power supply voltage VDDM. In a case where the high-level voltage value is not a desired voltage corresponding to the power supply voltage VDDM, the ECU 190 performs processing corresponding to the defect.

[0154] In addition, in a case where the warning flag signal XWRN is at a high level during the period (judgement period) at and after the timing t105, the diagnosis section 190A detects a voltage value (high-level voltage value) of the warning flag signal XWRN, and performs a diagnosis as to whether or not the high-level voltage value is a desired voltage corresponding to the power supply voltage VDDM. Specifically, the diagnosis section 190A confirms whether or not the high-level voltage value falls within a predetermined voltage range corresponding to the power supply voltage VDDM. In a case where the high-level voltage value is not a desired voltage corresponding to the power supply voltage VDDM, the ECU 190 performs processing corresponding to a predictor of the defect.

[0155] It is to be noted that, on the basis of the levels of the error flag signal XERR and the warning flag signal XWRN, the diagnosis section 190A of the ECU 190 may make a judgement, for example, as follows. In a case of XERR = Hi, XWRN = Hi: there is no defect ((E) and (F) of Fig. 22) In a case of XERR = Hi, XWRN = Low: there is no defect, but there is a predictor of a defect ((E) and (F) of Fig. 23) In a case of XERR = Low, XWRN = Low: there is a defect ((E) and (F) of Fig. 24) <5. Other Embodiments>

[0156] The technology according to the present disclosure is not limited to the foregoing embodiment, and may be modified in a wide variety of ways.

[0157] For example, the present technology may also have the following configurations. According to the present technology of the following configurations, in a case where diagnosis processing of a defect of an imaging section is performed to find that a result of the diagnosis processing indicates a predictor of a defect, a first flag signal corresponding to the result of the diagnosis processing is set to a ground level. This enables prediction of occurrence of the defect.

[0158] (1) An imaging device including: an imaging section configured to perform an imaging operation; a diagnosis section configured to perform diagnosis processing of a defect of the imaging section; and an output section configured to output a first flag signal corresponding to a result of the diagnosis processing, the output section being configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect. (2) The imaging device according to (1), in which the imaging section includes a pixel array including a plurality of imaging pixels, and a readout section that generates an image signal through AD conversion of a signal from the plurality of imaging pixels, and the diagnosis section performs the diagnosis processing on a basis of the image signal generated by the readout section. (3) The imaging device according to (1) or (2), in which the diagnosis section performs the diagnosis processing on a basis of a value of a power supply voltage supplied to the imaging section. (4) The imaging device according to any one of (1) to (3), further including a ring oscillator configured to generate a signal of which a frequency varies in accordance with a voltage of an input signal, in which the diagnosis section performs the diagnosis processing on a basis of an output value of the ring oscillator. (5) The imaging device according to any one of (1) to (4), further including a temperature sensor configured to generate a detection signal corresponding to a temperature, in which the diagnosis section performs the diagnosis processing on a basis of a detected value of the temperature sensor. (6) The imaging device according to any one of (1) to (5), in which, in a case where the result of the diagnosis processing indicates a predictor of the defect, the imaging section is configured to perform the imaging operation in a state where the operation is partially limited in accordance with the predictor of the defect. (7) The imaging device according to any one of (1) to (6), in which the output section is configured to output a second flag signal corresponding to a result of the diagnosis processing, and the output section is configured to set the second flag signal to a ground level in a case where the result of the diagnosis processing indicates an error. (8) The imaging device according to any one of (1) to (7), in which the output section is configured to output the first flag signal and the second flag signal to an external monitoring device to allow the monitoring device to be configured to determine presence or absence of a defect of the imaging section on a basis of the first flag signal and the second flag signal. (9) The imaging device according to (7) or (8), in which the diagnosis section outputs a signal indicating a predictor of a defect as the result of the diagnosis processing in a case where a value of a diagnosis target is outside a first reference range, and the diagnosis section outputs a signal indicating an error as the result of the diagnosis processing in a case where the value of the diagnosis target is outside a second reference range that is wider than the first reference range. (10) The imaging device according to any one of (1) to (9), in which the output section is configured to output the first flag signal from an output terminal provided to be dedicated for the first flag signal. (11) The imaging device according to any one of (1) to (9), in which the output section is configured to output the first flag signal from an output terminal provided for communication of a plurality of signals. (12) The imaging device according to any one of (1) to (9), in which the output section is configured to output the first flag signal from an image output terminal provided for outputting an image signal. (13) An imaging system including: an imaging device; and a monitoring device configured to monitor an operation of the imaging device, the imaging device including an imaging section configured to perform an imaging operation, a diagnosis section configured to perform diagnosis processing of a defect of the imaging section, and an output section configured to output a first flag signal corresponding to a result of the diagnosis processing, the output section being configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect.Reference Numerals List

[0159] 1 imaging device 9 pixel array 10 scanning section 20 readout section 30 imaging control section 32 temperature sensor 40 signal processing section 41 image processing section 42 diagnosis section 101 host (monitoring device) 190 ECU (Engine Control Unit) (monitoring device) 190A diagnosis section 200 semiconductor substrate 201 peripheral circuit section 202 terminal section 203 terminal section 301 semiconductor substrate 302 semiconductor substrate 303 via 311 peripheral circuit section 312 terminal section 313 terminal section 420 output section 431, 431H, 431M, 431L failure prediction threshold determiner 432, 432H,432M, 432L failure notification threshold determiner 440 power management IC (PMIC (Power management IC)) 450 power supply section (power supply IC) 451 DC / DC converter 452 LDO (Low Drop Out) regulator 461H, 461M, 462L failure prediction threshold determiner 462H, 462M, 462L failure notification threshold determiner 470 ring oscillator 471 counter INV-1, INV-2, INV-N inverter 12031 imaging section ADC AD (Analog to Digital) converter DATA0 image signal DATA image signal BF buffer BFOUT output buffer TOUT output terminal BF1 buffer BFOUT1 output buffer TOUT1 output terminal DOUT image output terminal SOUT I2C communication terminal P1 imaging pixel PD photodiode RSTL control line SELL control line TGLL control line SGL signal line STG signal SRST signal SSEL signal SIG signal TG transistor RST transistor AMP transistor SEL transistor VDDH power supply voltage VDDM power supply voltage VDDL power supply voltage VSSH ground voltage VSSM ground voltage VSSL ground voltage XERR1 signal XERR error flag signal (second flag signal) XWRN1 signal XWRN warning flag signal (first flag signal)

Claims

An imaging device comprising:an imaging section configured to perform an imaging operation;a diagnosis section configured to perform diagnosis processing of a defect of the imaging section; andan output section configured to output a first flag signal corresponding to a result of the diagnosis processing, the output section being configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect.The imaging device according to claim 1, whereinthe imaging section includesa pixel array including a plurality of imaging pixels, anda readout section that generates an image signal through AD conversion of a signal from the plurality of imaging pixels, andthe diagnosis section performs the diagnosis processing on a basis of the image signal generated by the readout section.The imaging device according to claim 1, wherein the diagnosis section performs the diagnosis processing on a basis of a value of a power supply voltage supplied to the imaging section.The imaging device according to claim 1, further comprising a ring oscillator configured to generate a signal of which a frequency varies in accordance with a voltage of an input signal, whereinthe diagnosis section performs the diagnosis processing on a basis of an output value of the ring oscillator.The imaging device according to claim 1, further comprising a temperature sensor configured to generate a detection signal corresponding to a temperature, whereinthe diagnosis section performs the diagnosis processing on a basis of a detected value of the temperature sensor.The imaging device according to claim 1, wherein, in a case where the result of the diagnosis processing indicates a predictor of the defect, the imaging section is configured to perform the imaging operation in a state where the operation is partially limited in accordance with the predictor of the defect.The imaging device according to claim 1, whereinthe output section is configured to output a second flag signal corresponding to a result of the diagnosis processing, andthe output section is configured to set the second flag signal to a ground level in a case where the result of the diagnosis processing indicates an error.The imaging device according to claim 7, wherein the output section is configured to output the first flag signal and the second flag signal to an external monitoring device to allow the monitoring device to be configured to determine presence or absence of a defect of the imaging section on a basis of the first flag signal and the second flag signal.The imaging device according to claim 7, whereinthe diagnosis section outputs a signal indicating a predictor of a defect as the result of the diagnosis processing in a case where a value of a diagnosis target is outside a first reference range, andthe diagnosis section outputs a signal indicating an error as the result of the diagnosis processing in a case where the value of the diagnosis target is outside a second reference range that is wider than the first reference range.The imaging device according to claim 1, wherein the output section is configured to output the first flag signal from an output terminal provided to be dedicated for the first flag signal.The imaging device according to claim 1, wherein the output section is configured to output the first flag signal from an output terminal provided for communication of a plurality of signals.The imaging device according to claim 1, wherein the output section is configured to output the first flag signal from an image output terminal provided for outputting an image signal.An imaging system comprising:an imaging device; anda monitoring device configured to monitor an operation of the imaging device,the imaging device includingan imaging section configured to perform an imaging operation,a diagnosis section configured to perform diagnosis processing of a defect of the imaging section, andan output section configured to output a first flag signal corresponding to a result of the diagnosis processing, the output section being configured to set the first flag signal to a ground level in a case where the result of the diagnosis processing indicates a predictor of a defect.

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