Light-emitting module and lighting device

Abstract

A light-emitting module. The light-emitting module comprises a substrate and a light-emitting assembly disposed on the substrate. A circuit layer is disposed between the substrate and the light-emitting assembly. The circuit layer comprises a jumper wire. The light-emitting assembly comprises a plurality of light-emitting units arranged in rows, and the plurality of light-emitting units in each row are connected in series. In a row of light-emitting units located at an end of the light-emitting assembly, a light-emitting unit located at an end of the row forms a wire-passing gap with the substrate, the jumper wire passing through the wire-passing gap and being connected to another adjacent light-emitting unit.

Description

Light-emitting modules and lighting equipment

[0001] This application claims priority to Chinese Patent Application No. 202411466682.5, filed on October 18, 2024, entitled "Light Emitting Module and Lighting Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to a light-emitting module and lighting device. Background Technology

[0003] The intelligent Adaptive Driving Beam (ADB) headlight system works by using an ADB vision system to control the output light pattern of a matrix LED light source module for illumination. Typically, a matrix LED light source module consists of multiple LED chips integrated onto a substrate to form an LED chip matrix. Wiring is done between adjacent rows and columns of LED chips on the substrate, and the wiring can only be designed in multiple strings or parallels, with outputs from both ends of the array. This chip and wiring arrangement lacks individual chip addressing capabilities, making it unsuitable for intelligent control systems and incompatible with ADB vision systems. Summary of the Invention

[0004] This application provides a light-emitting module and a lighting device, which helps to enable the light-emitting module to have the function of addressing and programming individual light-emitting units, thereby making the control of the light-emitting units of the light-emitting module more diverse and adaptable to the ADB system.

[0005] To achieve the above objectives, according to a first aspect of this application, a light-emitting module is provided, comprising:

[0006] substrate;

[0007] A circuit layer, disposed on the substrate, includes jumper wires;

[0008] A light-emitting component is disposed on the side of the circuit layer away from the substrate and includes a plurality of light-emitting units arranged in rows. The plurality of light-emitting units in each row are connected in series. In a row of light-emitting units located at the end of the light-emitting component, a wire-passing gap is formed between the light-emitting unit located at the end of the row and the substrate. The jumper wire passes through the wire-passing gap and is connected to another adjacent light-emitting unit.

[0009] Optionally, the circuit layer further includes multiple pad groups, each pad group corresponding to one light-emitting unit, each pad group including two pads spaced apart, the two pads being connected to the positive terminal and negative terminal of the light-emitting unit respectively;

[0010] The line gap is formed between the two pads connected to the corresponding light-emitting unit.

[0011] Optionally, the thickness of the solder pad is greater than or equal to the thickness of the jumper wire.

[0012] Optionally, the width of the trace gap is greater than the width of the jumper wire, and the jumper wire is spaced apart from the solder pads on both sides of the trace gap; and / or,

[0013] The width of the jumper wire is set to be greater than or equal to 60 μm; and / or,

[0014] The spacing between the jumper wire and the solder pads on both sides of the wire gap is set to be greater than or equal to 50 μm.

[0015] Optionally, the circuit layer further includes internal connection lines and driving lines, the internal connection lines being disposed between the plurality of light-emitting units, and the driving lines being disposed at the ends of the light-emitting components;

[0016] Multiple light-emitting units in each row are connected in series via the internal connecting lines;

[0017] In a row of light-emitting units located at the end of the light-emitting component, the light-emitting unit located at the end of the row is connected to the drive line.

[0018] Optionally, the plurality of light-emitting units in each row are arranged along the row direction. In a row of light-emitting units located at the end of the light-emitting component, a wire-passing gap is formed between each light-emitting unit and the substrate. A jumper wire is passed through each wire-passing gap, and each jumper wire is connected to another adjacent light-emitting unit.

[0019] Optionally, the plurality of light-emitting units in each row are arranged along the column direction. In a row of light-emitting units located at the end of the light-emitting component, the light-emitting units located at opposite ends of the row are all provided with the wire passing gaps between them and the substrate. Each wire passing gap is provided with a jumper wire, and each jumper wire is connected to another adjacent light-emitting unit.

[0020] Optionally, the light-emitting unit includes a light-emitting device and a fluorescent layer. The light-emitting device is disposed on the side of the circuit layer away from the substrate, and the side of the light-emitting device away from the circuit layer is configured as the light-emitting side. The fluorescent layer is disposed on the light-emitting side.

[0021] Optionally, the light-emitting unit further includes a reflective film disposed on the peripheral side of the light-emitting device and the fluorescent layer.

[0022] Optionally, the light-emitting unit further includes a transflective film sandwiched between the light-emitting device and the fluorescent layer. The transflective film transmits light emitted from the light-emitting side and reflects light excited by the fluorescent layer.

[0023] Optionally, the transflective film includes multiple sub-film layers stacked together, wherein the refractive index of each sub-film layer is different from the refractive index of the other sub-film layers, so that light of different wavelengths has a phase difference after being transmitted between the multiple sub-film layers.

[0024] Optionally, the thickness of the sub-film layer is set to T1, where 20nm ≤ T1 ≤ 900nm; and / or,

[0025] The total thickness of the transflective membrane is set to T2, where 0.5 μm ≤ T2 ≤ 100 μm; and / or,

[0026] The number of sub-film layers is set to N, where 100≤N≤500.

[0027] Optionally, the material of the sub-film layer includes one of ZrO2, SiO2, Ta2O5, and combinations thereof.

[0028] Optionally, the light-emitting device includes a eutectic chip or a flip chip.

[0029] Optionally, the fluorescent layer includes one of a fluorescent glass sheet, a fluorescent film, a fluorescent adhesive layer, and a phosphor layer.

[0030] Optionally, the light-emitting device is configured as a blue LED chip;

[0031] The fluorescent layer is configured with one of the following colors: green, yellow, and red.

[0032] Optionally, the light-emitting module further includes a reflective layer disposed on the substrate, covering the gaps between the lines of the circuit layer; and / or, the light-emitting module further includes an insulating layer covering the jumper wire.

[0033] Optionally, the light-emitting module further includes a baffle wall disposed on the substrate and surrounding the outer periphery of the light-emitting component.

[0034] Optionally, the light-emitting module further includes an encapsulating adhesive layer, which includes a first encapsulating portion and a second encapsulating portion. The first encapsulating portion is filled between two adjacent light-emitting units, and the second encapsulating portion is filled between the outer peripheral side of the light-emitting component and the inner peripheral side of the barrier.

[0035] Optionally, the substrate includes a first surface and a second surface disposed opposite to each other;

[0036] The circuit layer is disposed on the first surface;

[0037] The light-emitting module further includes a heat-dissipating metal layer disposed on the second surface. According to a second aspect of this application, a lighting device is provided, including the above-described light-emitting module.

[0038] In the light-emitting module of this application embodiment, a light-emitting component is disposed on a substrate, and a circuit layer is disposed between the substrate and the light-emitting component. The circuit layer includes jumper wires. The light-emitting component includes multiple light-emitting units arranged in a row.

[0039] Multiple light-emitting units in each row are connected in series, allowing simultaneous control of multiple light-emitting units in that row. Furthermore, in a row of light-emitting units located at the end of the light-emitting component, at least one light-emitting unit at the end of the row has a wire-passing gap between it and the substrate. A jumper wire is passed through this gap and connected to another adjacent light-emitting unit, enabling individual control of that unit. This helps the light-emitting module to have the function of addressing and programming individual light-emitting units, thus making the control of the light-emitting units in the light-emitting module more diverse and suitable for ADB systems.

[0040] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0041] Figure 1 is a plan view of the light-emitting module provided in an exemplary embodiment of this disclosure;

[0042] Figure 2 is a first wiring diagram of a light-emitting module provided in an exemplary embodiment of this disclosure;

[0043] Figure 3 is a second wiring diagram of the light-emitting module provided in an exemplary embodiment of this disclosure;

[0044] Figure 4 is a cross-sectional view of the light-emitting unit provided in an exemplary embodiment of this disclosure;

[0045] Figure 5 is a cross-sectional view of the light-emitting module provided in an exemplary embodiment of this disclosure;

[0046] Figure 6 is a schematic diagram of the structure of the light-emitting unit provided in an exemplary embodiment of this disclosure;

[0047] Figure 7 is an optical path diagram of the light-emitting unit provided in an exemplary embodiment of this disclosure;

[0048] Figure 8 is a schematic diagram of the transflective membrane provided in an exemplary embodiment of this disclosure;

[0049] Figure 9 is a process diagram of the light-emitting module provided in an exemplary embodiment of this disclosure;

[0050] Figure 10 is a structural block diagram of a lighting device provided in an exemplary embodiment of this disclosure. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0052] This application provides a light-emitting module 100. Please refer to Figures 1 and 4. Figure 1 is a plan view of the light-emitting module 100 provided in an exemplary embodiment of this disclosure; Figure 4 is a cross-sectional view of the light-emitting unit 31 provided in an exemplary embodiment of this disclosure.

[0053] The light-emitting module 100 includes a substrate 1, a circuit layer 2, and a light-emitting component 3. The circuit layer 2 is disposed on the substrate 1 and includes jumper wires 21. The light-emitting component 3 is disposed on the side of the circuit layer 2 away from the substrate 1 and includes a plurality of light-emitting units 31 arranged in rows. The plurality of light-emitting units 31 in each row are connected in series. In a row of light-emitting units 31 located at the end of the light-emitting component 3, at least the light-emitting unit 31 located at the end of the row forms a through-wire gap a with the substrate 1. The jumper wire 21 passes through the through-wire gap a and connects to another adjacent light-emitting unit 31.

[0054] It is known that the matrix light source module in ADB (Adaptive Driving Beam) headlights is typically made up of more than 100 light-emitting units 31. In related technologies, taking a matrix light source module including multiple columns of light-emitting units 31 as an example, wiring is done between two adjacent columns of light-emitting units 31, with drive lines 24 extending along the column direction and connecting multiple light-emitting units 31 in the same column in series. The drive lines 24 pass through the two ends of the corresponding column of light-emitting units 31 in the column direction, and the drive lines 24 of adjacent columns are set in parallel. However, this wiring method can only adjust the entire column and does not have the addressing function of a single light-emitting unit 31. It is not suitable for intelligent control systems and cannot be adapted to ADB vision systems.

[0055] In the embodiments of this application, a light-emitting component 3 is disposed on a substrate 1, and a circuit layer 2 is disposed between the substrate 1 and the light-emitting component 3. The circuit layer 2 includes jumper wires 21. The light-emitting component 3 includes multiple light-emitting units 31 arranged in rows, with multiple light-emitting units 31 in each row connected in series, so that multiple light-emitting units 31 in the row can be controlled simultaneously. At the same time, in a row of light-emitting units 31 located at the end of the light-emitting component 3, a wire-passing gap a is formed between the light-emitting unit 31 located at the end of the row and the substrate 1. The jumper wire 21 is passed through the wire-passing gap a and connected to another adjacent light-emitting unit 31, so that the individual control of the light-emitting unit 31 can be realized through the jumper wire 21. In this way, the light-emitting module 100 has the function of addressing and programming a single light-emitting unit 31, thereby making the control of the light-emitting unit 31 of the light-emitting module 100 more diverse and applicable to ADB systems.

[0056] The circuit layer 2 includes not only jumper wires 21, but also internal connection wires 23 and drive wires 24. The internal connection wires 23 are disposed between multiple light-emitting units 31, and the drive wires 24 are disposed at the end of the light-emitting component 3. Multiple light-emitting units 31 in each row are connected in series through the internal connection wires 23. In a row of light-emitting units 31 located at the end of the light-emitting component 3, the light-emitting unit 31 located at the end of the row is connected to the drive wires 24.

[0057] This application does not impose specific limitations on the arrangement of the light-emitting units 31 or the structure of the circuit layer 2. To facilitate understanding of this application, examples of the arrangement of the light-emitting units 31 and the structure of the circuit layer 2 are given below. It should be understood that this application is not limited thereto.

[0058] Please refer to Figure 2, which is a first wiring diagram of the light-emitting module 100 provided in an exemplary embodiment of this disclosure. In the first embodiment of this application, a plurality of light-emitting units 31 in each row are arranged along the row direction. In a row of light-emitting units 31 located at the end of the light-emitting component 3, a wire-passing gap a is formed between each light-emitting unit 31 and the substrate 1. A jumper wire 21 is passed through each wire-passing gap a, and each jumper wire 21 is respectively connected to another adjacent light-emitting unit 31.

[0059] Taking the multi-row light-emitting unit 31 as an example, the multi-row light-emitting unit 31 is arranged side by side in the column direction, and each row of light-emitting unit 31 includes multiple light-emitting units 31 arranged side by side in the row direction. The multi-row light-emitting unit 31 includes a first row located at the end of the light-emitting component 3 and a second row adjacent to the first row; each light-emitting unit 31 in the first row has a through-line gap a between it and the substrate 1.

[0060] In a row of multiple light-emitting units 31, the positive terminals 31a and negative terminals 31b of the light-emitting units 31 are arranged in the same order, and the positive terminals 31a and negative terminals 31b of adjacent rows of light-emitting units 31 are arranged in the same order. In a row of multiple light-emitting units 31, the positive terminals 31a and negative terminals 31b of two adjacent light-emitting units 31 are connected by an internal connecting line 23, so that the multiple light-emitting units 31 in the row are connected in series.

[0061] The drive line 24 includes multiple drive sub-lines, which are arranged in the row upward to form drive sub-lines 100, 101, 102, etc.; multiple jumper lines 21 are provided, which are arranged in the row upward to form jumper lines 200, 201, 202, etc.

[0062] In the first row, starting from the light-emitting unit 31 at one end, multiple light-emitting units 31 are sequentially labeled as A1, A2, A3... The positive terminal 31a of light-emitting unit A1 is connected to the driving sub-line 100, and the negative terminal 31b of light-emitting unit A1 is connected to the driving sub-line 101. The negative terminals 31b of the remaining light-emitting units A2, A3... are sequentially connected to the driving sub-lines 102, 103...

[0063] Jumper wire 21 is passed through the wire gap a and connected to the corresponding light-emitting unit 31 in the second row. In the second row, starting from the light-emitting unit 31 at one end, multiple light-emitting units 31 are sequentially labeled as B1, B2, B3... The positive terminal 31a of light-emitting unit B1 is connected to jumper wire 200, the positive terminal 31a of light-emitting unit B2 is connected to jumper wire 201...

[0064] Based on the light-emitting module 100 provided in the first embodiment of this application, the addressing method of the light-emitting unit 31 provided in this application is as follows:

[0065] Driver sub-line 100 is configured with a high-level common terminal H;

[0066] By using drive sub-line 100 and drive sub-line 101, the light-emitting unit A1 can be addressed individually, and the lighting and extinguishing of the light-emitting unit A1 can be controlled individually.

[0067] By using drive sub-line 101 and drive sub-line 102, the light-emitting unit A2 can be addressed individually, and the lighting and extinguishing of the light-emitting unit A2 can be controlled independently.

[0068] By using drive sub-line 100 and drive sub-line 102, the light-emitting unit A1 and the light-emitting unit A2 can be addressed in series, and the lighting and extinguishing of the light-emitting unit A1 and the light-emitting unit A2 can be controlled simultaneously.

[0069] The above addressing method can be used to control any combination of light-emitting units 31 in the first row.

[0070] Jumper wire 200 is configured to have a high-level common terminal H;

[0071] By using jumper wires 200 and 201, the light-emitting unit B1 can be addressed individually, and the lighting and extinguishing of the light-emitting unit B1 can be controlled separately.

[0072] By using jumper wires 201 and 202, the light-emitting unit B2 can be addressed individually, and the lighting and extinguishing of the light-emitting unit B2 can be controlled separately.

[0073] By using jumper wires 200 and 202, the light-emitting units B1 and B2 can be addressed in series, thus allowing simultaneous control of the lighting and extinguishing of both units.

[0074] The above addressing method can be used to control any combination of light-emitting units 31 in the second row.

[0075] Please refer to Figure 3, which is a second wiring diagram of the light-emitting module 100 provided in an exemplary embodiment of this disclosure. In the second embodiment of this application, a plurality of light-emitting units 31 in each row are arranged along the column direction. In a row of light-emitting units 31 located at the end of the light-emitting component 3, a wire-passing gap a is formed between the light-emitting units 31 located at opposite ends of the row and the substrate 1. Each wire-passing gap a is provided with a jumper wire 21, and each jumper wire 21 is respectively connected to another adjacent light-emitting unit 31.

[0076] Taking a multi-column light-emitting unit 31 as an example, the multi-column light-emitting units 31 are arranged side by side in the row direction, and each column of light-emitting units 31 includes multiple light-emitting units 31 arranged side by side in the column direction. The multi-column light-emitting units 31 include a first column located at the end of the light-emitting component 3 and a second column adjacent to the first column; a wire-passing gap a is formed between the light-emitting units 31 at opposite ends in the first column and the substrate 1; a wire-passing gap a is formed between the light-emitting units 31 at opposite ends in the second column and the substrate 1.

[0077] In the multiple light-emitting units 31 in the same column, the positive terminals 31a and negative terminals 31b of the light-emitting units 31 are arranged in different orders, while the positive terminals 31a and negative terminals 31b of the light-emitting units 31 in adjacent columns are arranged in the same order. The positive terminals 31a and negative terminals 31b of two adjacent light-emitting units 31 in the same column are connected by an internal connecting line 23, so that the multiple light-emitting units 31 in the same column are connected in series.

[0078] The drive line 24 includes multiple drive sub-lines, including drive sub-lines 300, 301, 302, 303, 304, 305, 306, 307, 308, ...; multiple jumper wires 21 are provided, including jumper wires 400, 401, 402, 403, ...

[0079] In the first column, starting from the light-emitting unit 31 at one end, multiple light-emitting units 31 are sequentially labeled as C1, C2, ..., Cn-1, Cn. The positive terminal 31a of the light-emitting unit C1 is connected to the driving sub-line 300, and the negative terminal 31b of the light-emitting unit C1 is connected to the driving sub-line 301. The positive terminal 31a of the light-emitting unit Cn is connected to the driving sub-line 303, and the negative terminal 31b of the light-emitting unit Cn is connected to the driving sub-line 304.

[0080] In the second column, starting from the light-emitting unit 31 at one end, multiple light-emitting units 31 are sequentially labeled D1, D2, ..., Dn-1, Dn. The positive terminal 31a of light-emitting unit D1 is connected to the driving sub-line 305, and the negative terminal 31b of light-emitting unit D1 is connected to the driving sub-line 306. The positive terminal 31a of light-emitting unit Dn is connected to the driving sub-line 307, and the negative terminal 31b of light-emitting unit Dn is connected to the driving sub-line 308. Furthermore, in both the first and second columns, the driving sub-lines 303 and 307 are connected in series.

[0081] Jumper wire 21 is passed through the wire gap a and connected to the adjacent light-emitting unit 31. In the first column, jumper wire 400 is passed through the wire gap a and connected to the negative terminal 31b of light-emitting unit C2, and jumper wire 401 is passed through the wire gap a and connected to the positive terminal 31a of light-emitting unit Cn-1; in the second column, jumper wire 403 is passed through the wire gap a and connected to the negative terminal 31b of light-emitting unit D2, and jumper wire 401 is passed through the wire gap a and connected to the positive terminal 31a of light-emitting unit Dn-1.

[0082] Based on the light-emitting module 100 provided in the second embodiment of this application, the addressing method of the light-emitting unit 31 provided in this application is as follows:

[0083] Driver sub-line 300 is configured with a high-level common terminal H;

[0084] The light-emitting unit C1 can be individually addressed by the driver sub-line 300 and driver sub-line 301, which means that the light-emitting unit C1 can be turned on and off independently.

[0085] The light-emitting unit C2 can be individually addressed by using jumper wire 400 and driver sub-wire 301, which means that the light-emitting unit C2 can be individually controlled to light up and turn off.

[0086] The light-emitting unit C3 can be individually addressed using jumper wires 400 and 401, allowing for separate control of its illumination and deactivation.

[0087] The light-emitting unit Cn-1 can be individually addressed by the driver sub-line 303 and the jumper wire 401, which means that the light-emitting unit Cn-1 can be turned on and off independently.

[0088] The light-emitting unit Cn can be individually addressed by driving sub-line 303 and driving sub-line 304, which means that the light-emitting unit Cn can be turned on and off individually.

[0089] The light-emitting unit Dn can be individually addressed by driving sub-line 304 and driving sub-line 308, which means that the light-emitting unit Dn can be turned on and off independently.

[0090] In this way, by connecting the drive sub-line and the jumper line 21 in sequence, the light-emitting units 31 of any combination in the light-emitting component 3 can be controlled.

[0091] This application does not impose specific restrictions on the material of substrate 1. The material of substrate 1 shall meet the requirements of thermal conductivity greater than 150W / mK and surface temperature resistance greater than 290 degrees. Substrate 1 shall also be suitable for processes such as hot-pressing eutectic bonding, flip-chip soldering and upright wire bonding, such as glass materials or high thermal conductivity ceramic materials.

[0092] Please refer to Figure 4. The circuit layer 2 also includes multiple pad groups 22. Each pad group 22 corresponds to a light-emitting unit 31. Each pad group 22 includes two pads 221 spaced apart. The two pads 221 are respectively connected to the positive terminal 31a and the negative terminal 31b of the light-emitting unit 31. The through-line gap a is formed between the two pads 221 connected to the corresponding light-emitting unit 31.

[0093] In other words, in this embodiment, the circuit layer 2 further includes a pad group 22 disposed on the substrate 1. Each pad group 22 includes two pads 221 disposed at intervals. When the light-emitting unit 31 is disposed on the substrate 1, the positive terminal 31a and the negative terminal 31b of the light-emitting unit 31 are respectively soldered to the two pads 221, thereby forming a through gap a between the two pads 221, the substrate 1, and the bottom of the light-emitting unit 31.

[0094] Typically, the light-emitting unit 31 is provided with a positive electrode pad or a positive electrode welding metal layer to form a positive terminal 31a, and the light-emitting unit 31 is provided with a negative electrode pad or a negative electrode welding metal layer to form a negative terminal 31b; that is, the positive terminal 31a and the negative terminal 31b generally protrude from the bottom of the light-emitting unit 31. After the positive terminal 31a and the negative terminal 31b are welded to the corresponding pad 221, the actual depth of the through-line gap a is greater than the thickness of the pad 221.

[0095] In the embodiments of this application, the thickness of the solder pad 221 is set to be greater than or equal to the thickness of the jumper wire 21; on the one hand, it can ensure that when the jumper wire 21 passes through the wire gap a, the jumper wire 21 will not interfere with the corresponding light-emitting unit 31; on the other hand, it can ensure that the positive terminal 31a and the negative terminal 31b of the light-emitting unit 31 will not have poor bonding during soldering.

[0096] Following the above statement that "the gap a is formed between the two pads 221 that are connected to the corresponding light-emitting unit 31", that is, the jumper wire 21 is located between the two pads 221 that are connected to the corresponding light-emitting unit 31. Taking the arrangement of the two pads 221 of each pad group 22 along the row direction as an example, this will be explained.

[0097] In this application, the width W1 of the wire gap a is greater than the width W2 of the jumper wire 21, and the jumper wire 21 is spaced apart from the solder pads 221 on both sides of the wire gap a; thus, it can be ensured that the jumper wire 21 passes smoothly through the wire gap a and will not come into contact with the solder pads 221 to cause a short circuit.

[0098] In this application, the width W2 of the jumper wire 21 is set to be greater than or equal to 60 μm. It is known that, under the condition of constant current and time, the greater the resistance, the greater the heat generated. Therefore, in order to reduce the heat generated by the circuit, it is necessary to reduce the resistance of the jumper wire 21. At the same time, since the larger the cross-sectional area of ​​the jumper wire 21 is for the same length, the smaller the resistance of the jumper wire 21, the width W2 of the jumper wire 21 can be set to be wider while meeting the space requirements. By setting the width W2 of the jumper wire 21 to be greater than or equal to 60 μm, the heat dissipation requirements of the jumper wire 21 can be met under normal use conditions.

[0099] In this application, the spacing H1 between the jumper wire 21 and the solder pads 221 on both sides of the through-line gap a is set to be greater than or equal to 50 μm. It is known that there are printing tolerances when printing metal lines on the substrate 1 to form circuits. In order to avoid the jumper wire 21 from contacting the solder pads 221 due to printing process errors, the spacing H1 between the jumper wire 21 and the solder pads 221 on both sides of the through-line gap a is set to be greater than or equal to 50 μm. This can prevent the jumper wire 21 from short-circuiting due to contact with the solder pads 221.

[0100] It should be noted that the above three technical features can be set in one, two, or simultaneously. Specifically, in one embodiment, the above three technical features are set simultaneously, which not only makes the arrangement of the jumper wire 21 more reasonable and avoids short circuit caused by the jumper wire 21 contacting the solder pad 221, but also meets the heat dissipation requirements of the jumper wire 21.

[0101] This application does not impose specific restrictions on the material of circuit layer 2. The material of circuit layer 2 can be any material with good electrical and thermal conductivity, such as copper foil or other alloy materials.

[0102] Furthermore, the solder pads 221 and jumper wires 21 can be copper-plated or immersion gold-plated. Since the solder pads 221 and jumper wires 21 have different thicknesses, they can be electroplated separately.

[0103] Following the statement that "for the same length, the larger the cross-sectional area of ​​jumper wire 21, the smaller the resistance of jumper wire 21", it can be inferred that for the same length, the larger the cross-sectional area of ​​positive terminal 31a and negative terminal 31b, the smaller the resistance of positive terminal 31a and negative terminal 31b. Therefore, while meeting space requirements, the width W3 of positive terminal 31a and negative terminal 31b can be set wider. By setting the width W3 of positive terminal 31a and negative terminal 31b to be greater than or equal to 110μm, the heat dissipation requirements of positive terminal 31a and negative terminal 31b can be met under normal use conditions.

[0104] Meanwhile, in order to ensure the reliability of the welding of the light-emitting unit 31, the thickness of the positive terminal 31a and the negative terminal 31b is set to 3-4 μm.

[0105] Furthermore, following the statement that "the width W1 of the gap a is greater than the width W2 of the jumper wire 21", in order to ensure the reliability of the soldering of the light-emitting unit 31, the dimensions of the positive terminal 31a and the negative terminal 31b are usually larger than the dimensions of the corresponding solder pad 221; in order to prevent the light-emitting unit 31 from scraping the jumper wire 21 during soldering, the distance H2 between the positive terminal 31a and the negative terminal 31b needs to be greater than the width W2 of the jumper wire 21.

[0106] In the embodiments of this application, the light-emitting unit 31 includes a light-emitting device 311 and a phosphor layer 312. The light-emitting device 311 is disposed on the side of the circuit layer 2 facing away from the substrate 1, and the side of the light-emitting device 311 facing away from the circuit layer 2 is designated as the light-emitting side. The phosphor layer 312 is disposed on the light-emitting side. The light emitted from the light-emitting device 311 from its light-emitting side is transmitted to the phosphor layer 312, and the phosphor material of the phosphor layer 312 emits light after being excited by the light.

[0107] This application does not impose specific restrictions on the type of light-emitting device 311. The light-emitting device 311 can be a eutectic chip or a flip chip.

[0108] This application does not impose specific limitations on the morphology of the fluorescent layer 312, which may include one of the following: fluorescent glass sheet, fluorescent film, fluorescent adhesive layer, or fluorescent powder layer.

[0109] Typically, in the matrix light source module of ADB car headlights, a large number of light-emitting units 31 need to be integrated in a limited space. Therefore, the distance between adjacent light-emitting units 31 is very small, resulting in severe light crosstalk between adjacent light-emitting units 31.

[0110] In one embodiment of this application, referring to Figures 5 to 7, the light-emitting unit 31 further includes a reflective film 313, which is disposed on the peripheral side of the light-emitting device 311 and the phosphor layer 312. Thus, on the one hand, light emitted from the side of the light-emitting device 311 is reflected by the reflective film 313 to the front of the light-emitting device 311, thereby increasing the light transmitted to the phosphor layer 312, and further increasing the light emitted from the phosphor layer 312, thus improving the front light emission of the light-emitting unit 31. On the other hand, the reflection by the reflective film 313 on the side of the phosphor layer 312 not only increases the front light emission of the light-emitting unit 31. The reflective film 313 reduces the light emission angle of the light-emitting device 311 and also reduces the impact of external light on the light-emitting device 311, thus avoiding cross-lighting between adjacent light-emitting units 31 and improving the contrast of the light-emitting component 3. Since the reflective film 313 can solve the cross-lighting problem between adjacent light-emitting units 31, when a part of the matrix light source module of the ADB car headlight is darkened, the darkened area will not be affected by the lit light-emitting unit 31, thereby realizing the dark area control of the matrix light source module of the ADB car headlight.

[0111] This application does not impose specific limitations on the material of the reflective film 313, which may include, but is not limited to, metal materials with high reflectivity such as gold, silver, and aluminum. Furthermore, the reflective film 313 is configured as a single-layer metal thin film, and this application also does not impose specific limitations on the thickness of the reflective film 313, which may be set to 20–900 nm.

[0112] To further improve the front-side light emission effect of the light-emitting unit 31, in one embodiment of this application, as shown in Figures 5 to 7, the light-emitting unit 31 further includes a transflective film 314. The transflective film 314 is sandwiched between the light-emitting device 311 and the phosphor layer 312. The transflective film 314 transmits light emitted from the light-emitting side and reflects light excited by the phosphor layer 312. That is, the light emitted from the light-emitting unit 31 is transmitted through the transflective film 314, and the light radiated by the phosphor layer 312 after being excited is reflected by the transflective film 314 when it hits the transflective film 314, thereby reducing the heat loss of light inside the light-emitting unit 31, thereby increasing the front-side light emission of the light-emitting unit 31 and improving the front-side light emission effect of the light-emitting unit 31.

[0113] In the embodiments of this application, the light-emitting device 311 is configured as a blue LED chip, and the fluorescent material of the phosphor layer 312 is including but not limited to one of green, red, or yellow. The transflective film 314 is configured as a specific wavelength transflective film 314, that is, the short-wavelength light emitted by the light-emitting device 311 can pass through the transflective film 314 to reach the phosphor sheet, while the phosphor sheet emits long-wavelength light after being excited, and the long-wavelength light emitted by the phosphor sheet towards the transflective film 314 is reflected by the transflective film 314.

[0114] This application does not impose specific limitations on the structure of the transflective film 314. In one embodiment, referring to Figure 8, the transflective film 314 includes multiple sub-film layers 3141 stacked together. The refractive index of each sub-film layer 3141 is different from that of the other sub-film layers 3141, so that light of different wavelengths has a phase difference after transmission between the multiple sub-film layers 3141. That is, the transflective film 314 is a coating layer made using the principle of a short-pass dichroic mirror; by stacking multiple sub-film layers 3141 with different refractive indices, a phase difference exists between the film layers for different wavelengths. By stacking multiple sub-film layers 3141, a short-pass filter film can be formed. For example, the transflective film 314 formed by stacking multiple sub-film layers 3141 can transmit blue light with wavelengths less than 500 nm and reflect other light with wavelengths greater than 500 nm.

[0115] In this application, the thickness of the sub-film layer 3141 is set to T1, where 20nm≤T1≤900nm; that is, the transmission wavelength of the formed short-pass filter film can be adjusted by adjusting the thickness of each sub-film layer 3141.

[0116] In this application, the total thickness of the transflective film 314 is set to T2, where 0.5μm≤T2≤100μm; that is, the transmission wavelength of the formed short-pass filter film can be adjusted by adjusting the total thickness of the transflective film 314.

[0117] In this application, the number of sub-film layers 3141 is set to N, where 100≤N≤500; that is, the transmission wavelength of the formed short-pass filter film can be adjusted by adjusting the number of sub-film layers 3141.

[0118] It should be noted that the above three technical features can be set in one, two, or simultaneously. Specifically, in one embodiment, the above three technical features are set simultaneously. That is, the transmission and reflection membrane 314 can reach the preset transmission wavelength by adjusting the thickness of the sub-membrane layer 3141, the number of sub-membrane layers 3141, and the total thickness of the transmissive membrane 314.

[0119] Meanwhile, this application does not limit the material of the sub-film layer 3141. The material of the sub-film layer 3141 includes, but is not limited to, one of ZrO2, SiO2, Ta2O5 and combinations thereof.

[0120] Referring to Figure 4, the light-emitting module 100 also includes a reflective layer 4a, which is disposed on the substrate 1 and covers the gaps between the lines of the circuit layer 2; and / or, the light-emitting module 100 also includes an insulating layer 4b, which covers the jumper wire 21. That is, a reflective layer 4a can be disposed on the substrate 1 to reflect the light emitted by the light-emitting unit 31 towards the substrate 1, thereby improving the light emission effect of the light-emitting component 3; or an insulating layer 4b can be disposed on the substrate 1 to cover the jumper wire 21, thereby insulating the jumper wire 21 from the solder pad 221 and preventing short circuit of the jumper wire 21; or both a reflective layer 4a and an insulating layer 4b can be disposed simultaneously.

[0121] In one embodiment of this application, a high-temperature resistant white oil insulating layer is provided on the substrate 1. The white oil insulating layer covers the gaps between the lines of the circuit layer 2 and covers the jumper wires 21. Thus, the white oil insulating layer can serve as both a reflective layer 4a and an insulating layer 4b.

[0122] Please refer to Figure 5. The light-emitting module 100 also includes a barrier 5, which is disposed on the substrate 1 and surrounds the outer periphery of the light-emitting component 3.

[0123] In one embodiment of this application, the light-emitting module 100 further includes an encapsulating adhesive layer 6, which includes a first encapsulating portion 61 and a second encapsulating portion 62. The first encapsulating portion 61 is filled between two adjacent light-emitting units 31, and the second encapsulating portion 62 is filled between the outer peripheral side of the light-emitting component 3 and the inner peripheral side of the barrier wall 5.

[0124] The light-emitting component 3 is encapsulated by the barrier 5 and the first encapsulation part 61 to protect it and extend the service life of the light-emitting module 100. At the same time, the second encapsulation part 62 fills the gap between two adjacent light-emitting units 31, thereby improving the stability of the light-emitting unit 31.

[0125] In one embodiment of this application, the substrate 1 includes a first surface 11 and a second surface 12 disposed opposite to each other; the circuit layer 2 is disposed on the first surface 11; the light-emitting module 100 further includes a heat-dissipating metal layer 7, which is disposed on the second surface 12.

[0126] Based on the light-emitting component 3 provided in the embodiments of this application, a manufacturing process for the light-emitting component 3 is also provided. Please refer to FIG9, which is a process diagram of the light-emitting module 100 provided in the exemplary embodiments of this disclosure.

[0127] Step S10: Provide a substrate 1 and print a circuit layer 2 on the substrate 1;

[0128] Step S20: Solder multiple light-emitting devices 311 onto the circuit layer 2, and arrange the multiple light-emitting devices 311 in an array;

[0129] Step S30: Provide a fluorescent sheet and deposit a transflective film 314 on one side surface of the fluorescent sheet;

[0130] Step S40: Cut the phosphor sheet according to the size of a single light-emitting device 311 to form multiple phosphor layers 312;

[0131] Step S50: The fluorescent layer 312 is attached to the light-emitting side of the light-emitting device 311, wherein the transflective film 314 is located between the fluorescent layer 312 and the light-emitting device 311;

[0132] Step S60: A reflective film 313 is deposited on the peripheral side of the fluorescent layer 312 and the light-emitting device 311 to form a light-emitting unit 31;

[0133] Step S70: A barrier 5 is provided on the substrate 1, and the barrier 5 is arranged around the periphery of the array of light-emitting devices 311;

[0134] Step S80: An encapsulating adhesive layer 6 is disposed on the substrate 1, wherein the encapsulating adhesive layer 6 includes a first encapsulation portion 61 and a second encapsulation portion 62. The first encapsulation portion 61 is filled between two adjacent light-emitting units 31, and the second encapsulation portion 62 is filled between the outer peripheral side of the light-emitting component 3 and the inner peripheral side of the barrier 5.

[0135] Referring to Figure 10, which is a structural block diagram of a lighting device 1000 provided in an exemplary embodiment of this disclosure, this application also provides a lighting device 1000. The lighting device 1000 includes a light-emitting module 100. It should be noted that the light-emitting module 100 is configured as described above; that is, the light-emitting module 100 includes all the technical features of the aforementioned light-emitting module 100, and the lighting device 1000 includes all embodiments of the aforementioned light-emitting module 100.

[0136] Lighting equipment 1000 includes, but is not limited to, ADB car headlights, smart home lighting, or surgical lights.

[0137] Taking the ADB headlight as an example, the ADB headlight also includes an ADB vision system. The ADB vision system is electrically connected to the light-emitting module 100. In the light-emitting module 100, in a row of light-emitting units 31 located at the end of the light-emitting component 3, at least the light-emitting unit 31 located at the end of the row forms a wire gap a with the substrate 1. The jumper wire 21 is passed through the wire gap a and connected to another adjacent light-emitting unit 31. By connecting the jumper wire 21 to the ADB vision system, the ADB vision system can independently control the light-emitting unit 31. The ADB vision system can address and program a single light-emitting unit 31.

[0138] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0139] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0140] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0141] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A light-emitting module (100), comprising: base(1); A circuit layer (2) is disposed on the substrate (1) and includes jumper wires (21); and The light-emitting component (3) is disposed on the side of the circuit layer (2) away from the substrate (1) and includes a plurality of light-emitting units (31) arranged in a row. The plurality of light-emitting units (31) in each row are connected in series. In a row of light-emitting units (31) located at the end of the light-emitting component (3), a wire-passing gap (a) is formed between the light-emitting unit (31) located at the end of the row and the substrate (1). The jumper wire (21) passes through the wire-passing gap (a) and is connected to another adjacent light-emitting unit (31).

2. The light-emitting module (100) according to claim 1, wherein, The circuit layer (2) also includes multiple pad groups (22), each pad group (22) corresponds to one light-emitting unit (31), each pad group (22) includes two pads (221) spaced apart, the two pads (221) are respectively connected to the positive terminal (31a) and the negative terminal (31b) of the light-emitting unit (31); The line gap (a) is formed between the two pads (221) connected to the corresponding light-emitting unit (31).

3. The light-emitting module (100) according to claim 2, wherein, The thickness of the solder pad (221) is greater than or equal to the thickness of the jumper wire (21).

4. The light-emitting module (100) according to claim 2 or 3, wherein, The width of the through-wire gap (a) is greater than the width of the jumper wire (21), and the jumper wire (21) is spaced apart from the solder pads (221) on both sides of the through-wire gap (a); and / or, The width of the jumper wire (21) is set to be greater than or equal to 60 μm; and / or, The spacing H1 between the jumper wire (21) and the solder pads (221) on both sides of the wire gap (a) is set to be greater than or equal to 50 μm.

5. The light-emitting module (100) according to any one of claims 1-4, wherein, The circuit layer (2) also includes internal connection lines (23) and driving lines (24). The internal connection lines (23) are disposed between the plurality of light-emitting units (31), and the driving lines (24) are disposed at the ends of the light-emitting components (3). The multiple light-emitting units (31) in each row are connected in series via the internal connecting line (23); In a row of light-emitting units (31) located at the end of the light-emitting component (3), the light-emitting unit (31) located at the end of the row is connected to the drive line (24).

6. The light-emitting module (100) according to any one of claims 1-5, wherein, Multiple light-emitting units (31) in each row are arranged along the row direction. In a row of light-emitting units (31) located at the end of the light-emitting component (3), a wire gap (a) is formed between each light-emitting unit (31) and the substrate (1). A jumper wire (21) is passed through each wire gap (a). Each jumper wire (21) is connected to another adjacent light-emitting unit (31).

7. The light-emitting module (100) according to any one of claims 1-5, wherein, Multiple light-emitting units (31) in each row are arranged along the column direction. In a row of light-emitting units (31) located at the end of the light-emitting component (3), the light-emitting units (31) located at opposite ends of the row and the substrate (1) are all provided with the wire passing gap (a). Each wire passing gap (a) is provided with the jumper wire (21). Each jumper wire (21) is connected to another adjacent light-emitting unit (31).

8. The light-emitting module (100) according to any one of claims 1-7, wherein, The light-emitting unit (31) includes a light-emitting device (311) and a fluorescent layer (312). The light-emitting device (311) is disposed on the side of the circuit layer (2) away from the substrate (1). The side of the light-emitting device (311) away from the circuit layer (2) is configured as the light-emitting side, and the fluorescent layer (312) is disposed on the light-emitting side.

9. The light-emitting module (100) according to claim 8, wherein, The light-emitting unit (31) further includes a reflective film (313), which is disposed on the peripheral side of the light-emitting device (311) and the fluorescent layer (312).

10. The light-emitting module (100) according to claim 8, wherein, The light-emitting unit (31) further includes a transflective film (314), which is sandwiched between the light-emitting device (311) and the fluorescent layer (312). The transflective film (314) transmits light emitted from the light-emitting side and reflects light excited by the fluorescent layer (312).

11. The light-emitting module (100) according to claim 10, wherein, The transflective film (314) includes a plurality of sub-film layers (3141) stacked together. The refractive index of any one of the sub-film layers (3141) is different from the refractive index of the other sub-film layers (3141) so that light of different wavelengths has a phase difference after being transmitted between the plurality of sub-film layers (3141).

12. The light-emitting module (100) according to claim 11, wherein, The thickness of the sub-film layer (3141) is set to T1, where 20nm ≤ T1 ≤ 900nm; and / or, The total thickness of the transflective membrane (314) is set to T2, wherein 0.5 μm ≤ T2 ≤ 100 μm; and / or, The number of sub-membrane layers (3141) is set to N, where 100≤N≤500.

13. The light-emitting module (100) according to claim 11 or 12, wherein, The material of the sub-film layer (3141) includes one of ZrO2, SiO2, Ta2O5 and combinations thereof.

14. The light-emitting module (100) according to any one of claims 8-13, wherein, The light-emitting device (311) includes a eutectic chip or a flip chip.

15. The light-emitting module (100) according to any one of claims 8-14, wherein, The fluorescent layer (312) includes one of the following: a fluorescent glass sheet, a fluorescent film, a fluorescent adhesive layer, and a fluorescent powder layer.

16. The light-emitting module (100) according to claim 8, wherein, The light-emitting device (311) is configured as a blue LED chip; The fluorescent layer (312) is configured with one of the following colors: green, yellow, and red.

17. The light-emitting module (100) according to any one of claims 1-16, wherein, The light-emitting module (100) further includes a reflective layer (4a) disposed on the substrate (1) and covering the gaps between the lines of the circuit layer (2); and / or, the light-emitting module (100) further includes an insulating layer (4b) covering the jumper wire (21).

18. The light-emitting module (100) according to any one of claims 1-17, wherein, The light-emitting module (100) further includes a barrier (5), which is disposed on the substrate (1) and surrounds the outer periphery of the light-emitting component (3).

19. The light-emitting module (100) according to claim 18, wherein, The light-emitting module (100) further includes an encapsulating adhesive layer (6), which includes a first encapsulating part (61) and a second encapsulating part (62). The first encapsulating part (61) is filled between two adjacent light-emitting units (31), and the second encapsulating part (62) is filled between the outer peripheral side of the light-emitting component (3) and the inner peripheral side of the barrier wall (5).

20. The light-emitting module (100) according to any one of claims 1-19, wherein, The substrate (1) includes a first surface (11) and a second surface (12) disposed opposite to each other; The circuit layer (2) is disposed on the first surface (11); The light-emitting module (100) further includes a heat-dissipating metal layer (7), which is disposed on the second surface (12).

21. A lighting device (1000) comprising a light-emitting module (100) as described in any one of claims 1-20.

Images