Camera module and electronic device comprising camera module

Abstract

The camera module of an electronic device according to an embodiment of the present disclosure may comprise: a lens module configured to be driven for optical image stabilization (OIS) and autofocus (AF); and a lens driving unit for moving the lens module along the X-axis, the Y-axis, and the Z-axis. The lens driving unit may comprise: a permanent magnet disposed on a first carrier; a back yoke for fastening the first carrier and the permanent magnet; and a suction yoke for absorbing leakage magnetic flux of the permanent magnet. A first surface of the permanent magnet may face a first surface of the back yoke. The back yoke may comprise a first protruding portion protruding from the first surface of the back yoke. The first protruding portion of the back yoke may be disposed to overlap at least a portion of the permanent magnet. Various other embodiments are also possible.

Description

Camera module and electronic device including the camera module

[0001] The present disclosure relates to a camera module and an electronic device including the camera module.

[0002] Various electronic devices, such as smartphones, tablet PCs, portable multimedia players (PMPs), personal digital assistants (PDAs), laptop personal computers (LCDs), wristwatches, and head-mounted displays (HMDs), include cameras and can capture images. As the number of users taking photos or videos using electronic devices increases, the performance of the cameras included in these devices is also improving. For example, when capturing images using a camera included in an electronic device, it may be necessary to adjust the focus on the subject or correct for shaking (e.g., hand shake) that may occur during shooting in order to obtain a clear image.

[0003] A camera module used in an electronic device may include an autofocus (AF) function that automatically adjusts the lens focus on a subject and / or an optical image stabilizer (OIS) function that corrects shake occurring in the camera module when shooting a subject. The AF function and the optical image stabilizer function of the camera module may be driven based on electromagnetic force using magnets and coils.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] Cameras used in smartphones are generally developed with a focus on high resolution, high specifications, and thinness. Consequently, the actuators of camera modules must contain larger permanent magnets to move lenses that have increased in size and weight. Furthermore, reducing the height of the camera module (e.g., height along the z-axis) to meet thinness requirements necessitates a reduction in the thickness of the components placed inside the module. This reduction in component thickness causes the permanent magnets to shift downward (e.g., along the -z-axis), which can affect the operation of other electronic components (e.g., digitizers) located within the device.

[0006] Furthermore, due to the reduction in thickness of the camera module, the spacing between components decreases. Consequently, the gap between the OIS permanent magnet and the OIS suction yoke is reduced, which may increase the suction force. Although a reduced gap between the permanent magnet and the suction yoke does not significantly affect the magnitude of the generated force, the increased load (e.g., displacement per unit force) may require a greater force to achieve the same driving performance. While the volume of the suction yoke can be reduced to maintain an appropriate suction force, doing so leads to an increase in leakage flux in the downward direction of the camera module (e.g., the -z direction). These changes in the size and position of the permanent magnet increase the leakage flux of the camera module, which can affect the performance of components on the display side opposite the camera module.

[0007] As high-spec and high-resolution technologies are continuously required in mobile phones, the size of magnetic materials inside camera drive systems is steadily increasing, and the correlation with surrounding components is becoming increasingly important.

[0008] According to one embodiment of the present disclosure, a camera drive system for moving a lens group for an autofocus (AF) function and / or an optical image stabilizer (OIS) can be provided in a camera module of an electronic device.

[0009] As the magnetic material of the camera drive system increases, the leakage magnetic flux emitted outward increases, which can cause problems such as increased noise in components outside the camera or inside the camera. Various embodiments of the present disclosure may provide a camera module and an electronic device including the camera module that can reduce the strength of the leakage magnetic flux radiated downward (e.g., towards the digitizer, towards the display) inside the camera module.

[0010] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned can be clearly understood by a person skilled in the art to which this document belongs from the description below.

[0011] A camera module of an electronic device according to one embodiment of the present disclosure may include: a lens module comprising at least one lens configured for optical image stabilization (OIS) and autofocus (AF) functions; and a lens driving unit configured to move the lens module in the x-axis, y-axis, and z-axis directions. The lens driving unit may include a permanent magnet disposed on a first carrier, a back yoke binding the first carrier and the permanent magnet, and an suction yoke absorbing leakage flux of the permanent magnet. A first surface of the permanent magnet may face a first surface of the back yoke. The back yoke may include a first protrusion protruding from the first surface of the back yoke. The first protrusion of the back yoke may be disposed to overlap with at least a portion of the permanent magnet.

[0012] An electronic device including a camera module according to one embodiment of the present disclosure may include a display positioned to display a screen in the front direction of the electronic device, a digitizer positioned on the back side of the display, electronic components positioned on the back side of the display, and a camera module configured to capture an image in the rear direction of the electronic device. The camera module may include a lens module comprising one or more lenses configured to move for optical image stabilization (OIS) and autofocus (AF), and a lens driving unit for moving the lens module along the x-axis, y-axis, and z-axis. The lens driving unit may include a permanent magnet positioned on a first carrier, a back yoke connecting the first carrier and the permanent magnet, and an suction yoke absorbing leakage flux of the permanent magnet. A first surface of the permanent magnet may face a first surface of the back yoke. The first protrusion (1623) of the back yoke (1070, 1620) may be positioned to overlap with at least a portion of the permanent magnet (1080, 1610).

[0013] According to one embodiment, the camera module may be a direct type, a lens lead folded type, or a direct type folded type.

[0014] A camera module and an electronic device including a camera module according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated downward (e.g., towards a digitizer, towards a display) within the camera module by using a back yoke and a suction yoke disposed within the camera module.

[0015] A camera module and an electronic device including a camera module according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated from the camera module toward a digitizer and a display, thereby blocking (or reducing) the influence on the operation of electronic components placed inside the electronic device.

[0016] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0017] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0018] In relation to the description of the drawings, the same (or similar) reference numerals may be used to describe identical (or similar) components, features, and structures.

[0019] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0020] FIG. 2 is a perspective view of a first surface (e.g., front) of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 3 is a perspective view of a second side (e.g., rear) of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 5 is a block diagram of a camera module according to one embodiment of the present disclosure.

[0024] FIG. 6 is a drawing showing a camera module placed in an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 7 is a drawing showing a direct-type camera module according to one embodiment of the present disclosure.

[0026] FIG. 8 is a perspective view of a direct-type camera module according to one embodiment of the present disclosure.

[0027] FIG. 9 is a drawing showing a lens lead folded camera module according to one embodiment of the present disclosure.

[0028] FIGS. 10a to 10c are drawings showing a direct-type folded camera module according to one embodiment of the present disclosure.

[0029] FIGS. 11a and FIGS. 11b are drawings illustrating the control of the tilt and center movement of a permanent magnet relative to a coil using a suction yoke placed in a camera module.

[0030] FIG. 12 is a drawing showing a back yoke for binding permanent magnets of a camera module according to an embodiment of the present disclosure, and an intake yoke for absorbing leakage flux of permanent magnets.

[0031] FIGS. 13 to 15 are drawings showing various shapes of a back yoke of a camera module according to an embodiment of the present disclosure.

[0032] FIGS. 16a and 16b are drawings illustrating the shielding of leakage flux using a back yoke and a suction yoke of a camera module according to an embodiment of the present disclosure.

[0033] FIG. 17 is a drawing showing a cross-section of the permanent magnet, back yoke, and suction yoke shown in FIG. 16a and FIG. 16b.

[0034] Figure 18 is a diagram showing an OIS driving unit using a solenoid force.

[0035] FIGS. 19 and 20 are drawings showing an OIS drive unit using Lorentz force.

[0036] Figure 21 is a diagram showing the shielding of a permanent magnet by the back yoke of the AF drive unit.

[0037] FIG. 22 is a drawing showing a designated area of ​​the bottom surface of a permanent magnet shielded using a back yoke.

[0038] FIG. 23 is a drawing showing the position of a suction yoke applied to a structure that shields a designated range of the bottom surface of a permanent magnet using a back yoke.

[0039] FIG. 24 is a drawing showing that a suction yoke is applied to a structure that overlaps more than a specified range of the bottom surface of a permanent magnet using a back yoke.

[0040] FIG. 25 is a diagram showing shielding a specified range of leakage flux of a permanent magnet using the back yoke and suction yoke of FIG. 24.

[0041] It should be noted that throughout the drawings, the same reference number is used to describe the same or similar elements, features, and structures.

[0042] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0043] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to enable a clear and consistent understanding of this document. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only and is not intended to limit this document as defined by the appended claims and their equivalents.

[0044] The singular form should be understood to include plural referents unless the context clearly indicates otherwise. Thus, for example, a reference to "component surfaces" may include a reference to one or more of such surfaces.

[0045] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0046] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0047] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0048] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0049] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0050] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0051] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0052] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0053] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0054] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0055] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0056] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0057] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0058] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0059] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0060] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0061] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0062] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0063] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0064] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0065] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0066] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0067] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0068] An electronic device according to one embodiment disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiment of this document is not limited to the aforementioned devices.

[0069] The embodiments of the disclosure and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0070] As used in one embodiment of the present disclosure, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0071] One embodiment of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0072] According to one embodiment, the method according to one embodiment disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0073] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0074] According to one embodiment, the display module (160) may include a bar-type or plate-type display (e.g., the display (201) of FIG. 2), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), a digitizer (e.g., the digitizer (460) of FIG. 2 and FIG. 4), and a digitizer driver (e.g., the digitizer driver (470) of FIG. 4).

[0075] According to one embodiment, the electronic device (101) may include a display module (160) and an electronic pen (e.g., a stylus pen) (e.g., the electronic pen (300) of FIG. 2 and FIG. 3). For example, the display module (160) may include a flexible display configured to be foldable or unfoldable. For example, the display module (160) may include a display (e.g., the display (410) of FIG. 4), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), a digitizer (e.g., the digitizer (460) of FIG. 2 and FIG. 4), and a digitizer driver (e.g., the digitizer driver (470) of FIG. 4).

[0076] According to one embodiment, the display module (160) may include a flexible display that is slidably arranged to provide a screen (e.g., a display screen), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), a digitizer (e.g., the digitizer (460) of FIG. 2 and FIG. 4), and a digitizer driver (e.g., the digitizer driver (470) of FIG. 4).

[0077] FIG. 2 is a perspective view of a first surface (e.g., front) of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view of a second surface (e.g., rear) of an electronic device according to one embodiment of the present disclosure.

[0078] Referring to FIGS. 2 and FIGS. 3, an electronic device (200) according to one embodiment of the present disclosure (e.g., electronic device (101) of FIG. 1) may include a first surface (or front) (210A), a second surface (or rear) (210B), and a housing (210).

[0079] An electronic device (200) (e.g., the electronic device (101) of FIG. 1) according to one embodiment of the present disclosure may include a display (201), a display driver IC (e.g., the display driver IC (430) of FIG. 4), a touch circuit (e.g., the touch circuit (450) of FIG. 4), a digitizer (460) (e.g., the digitizer (460) of FIG. 4), a digitizer driver (e.g., the digitizer driver (470) of FIG. 4), and an electronic pen (300) (e.g., a stylus pen).

[0080] According to one embodiment, the display (201) may be supported by a housing (210). For example, the display (201) may include an LCD (liquid crystal display), an OLED (organic light emitting diodes) display, or a micro LED display.

[0081] According to one embodiment, the housing (210) may include a side (210C) that surrounds the space between the first surface (210A) and the second surface (210B). According to one embodiment, the housing (210) may refer to a structure that forms some of the first surface (210A), the second surface (210B), and the side (210C).

[0082] According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate) in which at least a portion is substantially transparent.

[0083] According to one embodiment, the second surface (210B) may be formed by a substantially opaque back plate (211). The back plate (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. However, not limited thereto, the back plate (211) may be formed by transparent glass.

[0084] According to one embodiment, the side (210C) may be formed by a side bezel structure (218) (or "side member") (or "side frame") comprising metal and / or a polymer, which is combined with the front plate (202) and the rear plate (211).

[0085] According to one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metallic material such as aluminum).

[0086] According to one embodiment, the front plate (202) may include two first regions (210D) that are curved and seamlessly extended from the first surface (210A) toward the rear plate (211). The two first regions (210D) may be positioned at both ends of the long edge of the front plate (202).

[0087] According to one embodiment, the rear plate (211) may include two second regions (210E) that are curved and seamlessly extended from the second surface (210B) toward the front plate (202).

[0088] According to one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the first regions (210D) (or the second regions (210E)). According to one embodiment, some of the first regions (210D) or the second regions (210E) may not be included.

[0089] In the embodiments, the side bezel structure (218) when viewed from the side of the electronic device (200) may have a first thickness (or width) on the side that does not include the first regions (210D) or the second regions (210E) as described above. In the embodiments, the side bezel structure (218) when viewed from the side of the electronic device (200) may have a second thickness (or width) that is thinner than the first thickness on the side that includes the first regions (210D) or the second regions (210E).

[0090] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio input device (203) (e.g., input module (150) of FIG. 1, microphone), an audio output device (207, 214) (e.g., audio output module (155) of FIG. 1, speaker) (e.g., audio module), sensor modules (204, 219) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., camera module (180) of FIG. 1), a flash (213), a key input device (217), an indicator (not shown), and connectors (208, 209).

[0091] According to one embodiment, the electronic device (200) may omit at least one of the components (e.g., a key input device (217)) or additionally include other components.

[0092] According to one embodiment, the display (201) can be visually seen through the upper portion of the front plate (202).

[0093] According to one embodiment, at least a portion of the display (201) may be visible through a front plate (202) forming a first area (210D) of a first surface (210A) and a side (210C). For example, the display (201) may be combined with a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer (e.g., the digitizer (460) of FIG. 4) that detects a magnetic field electronic pen (300) (e.g., a stylus pen). For example, the display (201) may be positioned adjacent to the digitizer (460) that detects a magnetic field electronic pen (300) (e.g., a stylus pen).

[0094] For example, a touch sensor (e.g., touch sensor (451) of FIG. 4) may be placed on the upper part (e.g., top) of the display (201) in the z-direction direction. For example, a digitizer (460) may be placed on the lower part (e.g., bottom) of the display (201) in the z-direction direction.

[0095] According to one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0096] According to one embodiment, at least one of a first sensor module (204), camera modules (205, 212) (e.g., an image sensor and a driving circuit for the image sensor), an audio output device (214) (e.g., an audio module), and a fingerprint sensor may be included on the back surface of the screen display area of ​​the display (201).

[0097] According to one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit and a pressure sensor capable of measuring the intensity (pressure) of the touch.

[0098] According to one embodiment, the display (210) may be combined with or placed adjacent to a digitizer (460) that detects a magnetic field type electronic pen (e.g., a stylus pen).

[0099] According to one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device (217) may be placed in the first regions (210D) and / or the second regions (210E).

[0100] According to one embodiment, the acoustic input device (203) may include a microphone. According to one embodiment, the acoustic input device (203) may include a plurality of microphones arranged to detect the direction of sound.

[0101] According to one embodiment, the sound output device (207, 214) may include a sound output device (207) that operates as an external speaker and a sound output device (214) that operates as a receiver for calls.

[0102] In some embodiments, an acoustic input device (203) (e.g., a microphone), an acoustic output device (207, 214), and connectors (208, 209) may be placed in the internal space of the electronic device (200). The acoustic input device (203) (e.g., a microphone), the acoustic output device (207, 214), and the connectors (208, 209) may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the acoustic input device (203) (e.g., a microphone) and the acoustic output device (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates with the hole formed in the housing (210) excluded.

[0103] According to one embodiment, an electronic pen (300) (e.g., a stylus pen) may be housed in the internal space of an electronic device (200). The electronic pen (300) may be inserted and positioned on one side of the space of the electronic device (200). The electronic pen (300) may be inserted (e.g., inserted) or removed (e.g., withdrawn) through a pen hole (not shown) formed on the side of the electronic device (200). When in use, the electronic pen (300) (e.g., a stylus pen) may be removed (e.g., withdrawn) from the inside to the outside of the electronic device (200). When not in use, the electronic pen (300) (e.g., a stylus pen) may be inserted (e.g., inserted) into the inside of the electronic device (200).

[0104] According to one embodiment, an electronic pen (300) (e.g., a stylus pen) may be attached to one side (e.g., the front, back, or side) of an electronic device (200) by magnetic force.

[0105] According to one embodiment, sensor modules (204, 219) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor modules (204, 219) may include a first sensor module (204) (e.g., proximity sensor) disposed on a first surface (210A) of the housing (210) and / or a second sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210) and / or a third sensor module (not shown) (e.g., fingerprint sensor). For example, the fingerprint sensor may be disposed on the first surface (210A) (e.g., display (201)) and / or the second surface (210B) of the housing (210).

[0106] The electronic device (200) may further include at least one of a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor (e.g., a geomagnetic sensor), a 6-axis sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0107] According to one embodiment, camera modules (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200) and a second camera module (212) disposed on a second surface (210B). A flash (213) may be disposed around the camera modules (205, 212). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp.

[0108] According to one embodiment, the first camera module (205) may be placed on the lower part of the display panel of the display (201) in an under-display camera (UDC) manner. According to one embodiment, two or more lenses (wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device (200). According to one embodiment, a plurality of first camera modules (205) may be placed in an under-display camera (UDC) manner on the first side of the electronic device (200) (e.g., the side on which the screen is displayed).

[0109] According to one embodiment, a key input device (217) may be placed on the side (210C) of the housing (210). According to one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). According to one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0110] According to one embodiment, the connectors (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (209, or an earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device. The first connector hole (208) may include a USB (universal serial bus) Type A or USB Type C port. If the first connector hole (208) supports USB Type C, the electronic device (200) (e.g., the electronic device (101) of FIG. 1) may support USB PD (power delivery) charging.

[0111] According to one embodiment, some of the camera modules (205, 212), including the first camera module (205) and / or the first sensor module (204) among the sensor modules (204, 219), may be arranged to be visually visible through the display (201).

[0112] According to one embodiment, when the first camera module (205) is positioned in an under-display camera (UDC) manner, the first camera module (205) may not be visually visible to the outside.

[0113] According to one embodiment, the first camera module (205) may be positioned overlapping with the display area, and may also display a screen in the display area corresponding to the first camera module (205). The first sensor module (204) may be positioned to perform its function without being visually exposed through the front plate (202) in the internal space of the electronic device (200).

[0114] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment.

[0115] Referring to FIG. 4, an electronic device (400) according to one embodiment of the present disclosure may include a processor (120) (e.g., processor (120) of FIG. 1), a memory (130) (e.g., memory (130) of FIG. 1), a sensor module (176), and a display module (160) (e.g., display module (160) of FIG. 1).

[0116] In one embodiment, the memory (130) (e.g., the memory (130) of FIG. 1) may include one or more of HBM (High Bandwidth Memory), DRAM (dynamic random access memory), SRAM (static random access memory), PRAM (phase-change random access memory), MRAM (magnetic random access memory), RRAM (resistive random access memory), flash memory, and / or EEPROM (electrically erasable programmable read-only memory).

[0117] According to one embodiment, a display module (160) (e.g., the display module (160) of FIG. 1) may include a display (410), a display driver IC (hereinafter referred to as 'DDIC') (430) (e.g., a display driver) for driving the display (410), a touch circuit (450), a digitizer (460), a digitizer driver (470), and a sensor module (176) (e.g., the sensor module (176) of FIG. 1). For example, all or part of the sensor module (176) may be included in the display module (160).

[0118] According to one embodiment, the DDIC (430) may include an interface module (431) (e.g., an interface circuit), a memory (433) (e.g., a buffer memory), an image processing module (435) (e.g., an image processing circuit), or a mapping module (437) (e.g., a mapping circuit).

[0119] According to one embodiment, the DDIC (430) can receive image information including image data or an image control signal corresponding to a command for controlling the image data from another component of an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2 and FIG. 3) through an interface module (431).

[0120] According to one embodiment, image information may be received from a processor (120) (e.g., the processor (120) of FIG. 1) (e.g., the main processor (121) of FIG. 1) (e.g., an application processor) or an auxiliary processor (e.g., the auxiliary processor (123) of FIG. 1) that operates independently of the functions of the main processor (121) (e.g., a graphics processing unit).

[0121] According to one embodiment, the DDIC (430) can communicate with the touch circuit (450) or sensor module (176) through the interface module (431). Additionally, the DDIC (430) can store at least some of the received image information in the memory (433). As an example, the DDIC (430) can store at least some of the received image information in the memory (433) in frame units.

[0122] According to one embodiment, the image processing module (435) can perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a portion of the image data based on at least the characteristics of the image data or the characteristics of the display (410).

[0123] According to one embodiment, the mapping module (437) can generate a voltage value or a current value corresponding to the image data that has been preprocessed or postprocessed through the image processing module (435). According to one embodiment, the generation of the voltage value or the current value can be performed, for example, based at least partially on the attributes of the pixels of the display (410) (e.g., an array of pixels (RGB stripe or pentile structure), or the size of each of the subpixels).

[0124] According to one embodiment, at least some pixels of the display (410) are driven, for example, based on at least some of the voltage value or current value, so that visual information (e.g., text, image, or icon) corresponding to the image data can be displayed through the display (410).

[0125] According to one embodiment, the touch circuit (450) may include a touch sensor (451) and a touch sensor IC (integrated circuit) (453) for controlling the touch sensor (451).

[0126] According to one embodiment, a touch sensor IC (453) can control a touch sensor (451) to detect a touch input or hovering input for a specific location on the display (410). For example, the touch sensor IC (453) can detect a touch input or hovering input by measuring a change in a signal (e.g., voltage, light intensity, resistance, or charge) for a specific location on the display (410). The touch sensor IC (453) can provide information regarding the detected touch input or hovering input (e.g., location, area, pressure, or time) to a processor (e.g., processor (120) of FIG. 1).

[0127] According to one embodiment, at least a part of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of the DDIC (430) or the display (410).

[0128] According to one embodiment, at least a part of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of another component (e.g., auxiliary processor (123)) placed outside the display module (160).

[0129] According to one embodiment, the display module (160) may further include at least one sensor of the sensor module (176) (e.g., fingerprint sensor, iris sensor, pressure sensor, or light sensor) or a control circuit for the same. In this case, the at least one sensor or the control circuit for the same may be embedded in a part of the display module (160) (e.g., display (410) or DDIC (430)) or a part of the touch circuit (450).

[0130] For example, if the sensor module (176) embedded in the display module (160) includes a biosensor (e.g., fingerprint sensor), the biosensor can obtain biometric information (e.g., fingerprint image) associated with touch input through a portion of the display (410).

[0131] For example, if the sensor module (176) embedded in the display module (160) includes a pressure sensor, the pressure sensor can obtain pressure information associated with touch input through a part or the entire area of ​​the display (410).

[0132] According to one embodiment, a touch sensor (451) or a sensor module (176) may be placed between pixels of a pixel layer of a display (410), or on top of or below the pixel layer.

[0133] According to one embodiment, the display module (160) may include a digitizer (460) for detecting input (e.g., touch input or hovering input) of an electronic pen (300) (e.g., the electronic pen (300) of FIG. 2, stylus pen). For example, the digitizer (460) may convert analog coordinates (e.g., position) of the electronic pen (300) (e.g., stylus pen) into digital coordinate data. The digitizer (460) may transmit the digital coordinate data to a processor (120) and / or a DDIC (430).

[0134] According to one embodiment, the processor (120) can acquire digital coordinate data input from the digitizer (460). Based on the digital coordinate data, the processor (120) can detect input (e.g., touch input or hovering input) through the electronic pen (300) (e.g., stylus pen). For example, the digitizer (460) may include a plurality of x-axis channels and a plurality of y-axis channels. The processor (120) can sense the position of the electronic pen (300) (e.g., stylus pen) using sensing signals (e.g., EMR (electromagnetic resonance) signals) received from the x-axis channels and y-axis channels placed in the digitizer (460). For example, a plurality of x-axis channels and a plurality of y-axis channels may be arranged sequentially in the digitizer (460), and the processor (120) may sense the position of an electronic pen (300) (e.g., a stylus pen) using sensing signals (e.g., EMR signals) received from three consecutive channels (e.g., three adjacent channels).

[0135] According to one embodiment, the digitizer (460) may not be visually visible from the outside due to the display (410), electronic components, and mechanisms.

[0136] For example, the digitizer (460) may be placed integrally with the flat display (410) or placed adjacent to the flat display (410). For example, when the digitizer (460) is applied to the flat display (410), the digitizer (460) may include an electromagnetic resonance (EMR) sheet (or EMR film). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of the electronic pen (300) may be placed on the EMR sheet.

[0137] For example, the digitizer (460) may be placed integrally with the flexible display or foldable display, or placed adjacent to the flexible display or foldable display. For example, the digitizer (460) may be placed at the bottom (e.g., the lower side) of the display (410) (e.g., the display (201) in FIGS. 2 and 3) in the z-axis direction (e.g., the z-axis direction in FIGS. 2 and 3).

[0138] For example, when a digitizer (460) is applied to a flexible display or a foldable display, the digitizer (460) may include a plurality of EMR (electromagnetic resonance) sheets (or EMR films). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of an electronic pen (300) may be arranged in the plurality of EMR sheets.

[0139] According to one embodiment, the processor (120) can control the operation of the digitizer driver (470). The digitizer driver (470) can supply current to the digitizer (460) based on the control of the processor (120). An electromagnetic field (EM) can be generated by supplying current from the digitizer driver (470) to the digitizer (460). The electromagnetic field can be transmitted to an electronic pen (300) (e.g., a stylus pen) to induce a first resonance and generate a first resonance signal.

[0140] For example, if the current supplied to the digitizer (460) is cut off, the primary resonance signal induced in the electronic pen (300) (e.g., stylus pen) may be maintained for a certain period of time and then gradually attenuate. A secondary resonance may be induced in the digitizer (460) by the primary resonance signal that is induced in the electronic pen (300) (e.g., stylus pen) and remains after attenuation, thereby generating a secondary resonance signal. The digitizer driving unit (470) can detect the coordinates (e.g., position) of the electronic pen (300) (e.g., stylus pen) by measuring the current (or voltage) induced by the secondary resonance signal. The digitizer driving unit (470) can provide information regarding the coordinates (e.g., position) of the electronic pen (300) (e.g., stylus pen) to the processor (120).

[0141] For example, a digitizer driver (470) that drives a digitizer (460) may be included as a component of the display module (160). For example, the digitizer driver (470) may be included as a separate component from the display module (160).

[0142] According to one embodiment, an electronic pen (300) (e.g., a stylus pen) may include an AES (active electrostatic solution) method (or, AES active method) and an ECR (electric coupled resonance) method in addition to an EMR method (or EMR passive method).

[0143] FIG. 5 is a block diagram of a camera module according to one embodiment of the present disclosure.

[0144] Referring to FIG. 5, the camera module (180) (e.g., the camera module (180) of FIG. 1) may include a lens assembly (510), a flash (520), an image sensor (530), an image stabilizer (540), a memory (550) (e.g., a buffer memory), or an image signal processor (560).

[0145] According to one embodiment, the lens assembly (510) can collect light emitted from a subject that is the subject of image capture. The lens assembly (510) may include one or more lenses.

[0146] According to one embodiment, the camera module (180) may include a plurality of lens assemblies (510). For example, the camera module (180) may form a dual camera, a 360-degree camera, or a spherical camera. For example, some of the plurality of lens assemblies (510) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, and / or optical zoom). For example, at least one lens assembly may have one or more lens properties different from the lens properties of other lens assemblies. For example, the lens assembly (510) may include a wide-angle lens or a telephoto lens.

[0147] According to one embodiment, the flash (520) may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (520) may include one or more light-emitting diodes (e.g., RGB (red-green-blue) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp.

[0148] According to one embodiment, the image sensor (530) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (510) into an electrical signal. For example, the image sensor (530) may include one image sensor selected from image sensors with different attributes, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same attribute, or a plurality of image sensors having different attributes. For example, each image sensor included in the image sensor (530) may be implemented using a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0149] According to one embodiment, the image stabilizer (540) may move at least one lens or image sensor (530) included in the lens assembly (510) in a specific direction in response to the movement of the camera module (180) or the electronic device including it (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2) or control the operational characteristics of the image sensor (530) (e.g., adjusting read-out timing, etc.). This allows at least some of the image shake caused by the movement to be compensated for in the image being captured.

[0150] According to one embodiment, the image stabilizer (540) can detect the movement of the camera module (180) or the electronic device (101, 200) by using a gyroscope sensor (not shown) or an accelerometer sensor (not shown) placed inside or outside the camera module (180).

[0151] According to one embodiment, the memory (550) may temporarily store at least a portion of an image acquired through the image sensor (530) for the next image processing operation. For example, if image acquisition by the shutter is delayed or multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) may be stored in the memory (550), and a corresponding copy image (e.g., a low-resolution image) may be previewed through the display module (160). Subsequently, when a specified condition is satisfied (e.g., user input or system command), at least a portion of the original image stored in the memory (550) may be acquired and processed by the image signal processor (560). According to one embodiment, the memory (550) may be configured as at least a portion of the memory (130) or as a separate memory that operates independently thereof.

[0152] According to one embodiment, an image signal processor (560) may perform one or more image processing on an image obtained through an image sensor (530) or an image stored in memory (550). The one or more image processing may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softing).

[0153] For example, the image signal processor (560) can perform control (e.g., exposure time control, or readout timing control, etc.) over at least one of the components included in the camera module (180) (e.g., image sensor (530)). The image processed by the image signal processor (560) may be stored back in memory (550) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), an external electronic device (e.g., electronic device (102), electronic device (104) of FIG. 1), or an external server (e.g., server (108) of FIG. 1).

[0154] According to one embodiment, the image signal processor (560) may be configured as at least part of the processor (120) or as a separate processor that operates independently of the processor (120). If the image signal processor (560) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (560) may be displayed through the display module (160) as is or after additional image processing by the processor (120).

[0155] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180) each having different attributes (e.g., angle of view) or functions. In this case, for example, the plurality of camera modules (180) may include at least one of a wide-angle camera, a telephoto camera, or an IR camera (e.g., a ToF camera (time of flight camera), a structured light camera). For example, a plurality of camera modules including lenses having different angles of view may be configured, and the electronic device (101, 200) may be controlled to change the angle of view by varying according to the user's selection.

[0156] According to one embodiment, at least one of the plurality of camera modules (180) may be a front camera and at least one other may be a rear camera.

[0157] FIG. 6 is a drawing showing a camera module placed in an electronic device according to one embodiment of the present disclosure.

[0158] Referring to FIGS. 5 and FIGS. 6, an electronic device (600) according to one embodiment of the present disclosure may include a camera module (700) (e.g., the camera module (212) of FIG. 3).

[0159] According to one embodiment, for example, the camera module (700) may include a lens assembly (510), a flash (520), an image sensor (530), an OIS actuator for driving an optical image stabilizer (OIS) (e.g., an image stabilizer (540)), an AF actuator for driving auto focus (AF), a memory (550), and an image signal processor (560).

[0160] According to one embodiment, a camera module (700) (e.g., a rear camera module) may be positioned to photograph the rear direction of the electronic device (600). For example, light incident on the camera module (700) from outside the electronic device (600) may be introduced into the interior through a lens assembly (510). Light introduced into the interior of the camera module (700) may be sensed through an image sensor (530).

[0161] In one embodiment, the camera module (700) can perform an auto focus (AF) function by moving the lens assembly (510) relative to the image sensor (530) based on the control of a processor (e.g., processor (120) of FIG. 1) to automatically adjust the focus of the lens for a subject outside the electronic device (600).

[0162] In one embodiment, the lens drive unit can drive an AF actuator to move along the optical axis of the lens relative to the image sensor (530).

[0163] FIG. 7 is a drawing showing a direct-type camera module according to one embodiment of the present disclosure.

[0164] FIG. 8 is a perspective view of a direct-type camera module according to one embodiment of the present disclosure.

[0165] Referring to FIGS. 7 and 8, a direct-type camera module (700) according to one embodiment of the present disclosure may have a lens module (705) and an image sensor (709) arranged in a vertical direction (e.g., z-axis direction).

[0166] For example, a direct-type camera module (700) may be positioned in the rear direction (e.g., +z-axis direction) of an electronic device (e.g., electronic device (600) of FIG. 6) to photograph the rear direction (e.g., +z-axis direction) of the electronic device (600).

[0167] According to one embodiment, a direct-type camera module (700) may include a carrier (707, OIS carrier) on which components for OIS are placed, a coil (795), an AF carrier (785), an AF suction yoke (770), an OIS suction yoke (780), and a housing (790) on which a flexible printed circuits board (FPCB) is placed.

[0168] According to one embodiment, a direct-type camera module (700) moves a lens module (705) and a prism component for anti-shake and autofocus, and the driving system (701) may include a plurality of permanent magnets (710, 730, 750) and a coil (795).

[0169] For example, a plurality of permanent magnets (710, 730, 750) may include a first permanent magnet (710, OIS x-axis permanent magnet) for movement in the x-axis direction of OIS, a second permanent magnet (730, OIS y-axis permanent magnet) for movement in the y-axis direction of OIS, and a third permanent magnet (750, AF permanent magnet) for AF.

[0170] For example, the OIS suction yoke (780) can prevent the OIS carrier (707) and the AF carrier (785) from moving apart and allow them to move smoothly by means of a ball guide between them. Additionally, the AF suction yoke (770) can absorb leakage flux directed in the x-axis direction (or y-axis direction) of the permanent magnets (710, 730).

[0171] For example, the coil (795) may be positioned to be in contact with the inner wall of the housing (790). For example, the permanent magnets (710, 730, 750) may be positioned to be in contact with the carrier of the object to be moved (e.g., a lens or prism).

[0172] According to one embodiment, a direct-type camera module (700) may include a first back yoke (720, OIS back yoke) that binds a first permanent magnet (710, OIS x-axis permanent magnet), a second back yoke (740, OIS back yoke) that binds a second permanent magnet (730, OIS y-axis permanent magnet), a third back yoke (760, AF back yoke) that binds a third permanent magnet (750, AF permanent magnet), and OIS suction yokes (780).

[0173] For example, the OIS suction yoke (780) can serve to suck the OIS carrier (707) toward the AF carrier (785) (e.g., pulling the OIS permanent magnets (710, 730) downward). The AF suction yoke (770) can suck the OIS carrier (707) toward the AF carrier (785). For example, the OIS suction yoke (780) can pull the carrier (707, OIS carrier) in the downward direction of the z-axis (e.g., -z direction). The OIS suction yoke (780) can absorb (e.g., shield) the leakage flux of the first permanent magnet (710, OIS x-axis permanent magnet) and the second permanent magnet (730, OIS y-axis permanent magnet). For example, the OIS suction yoke (780) can reduce shaking (e.g., tilting) in a direction different from the OIS direction of travel.

[0174] For example, in order to increase the bonding force between the permanent magnets (710, 730, 750) and the body of the drive body (701), a first back yoke (720, OIS back yoke), a second back yoke (740, OIS back yoke), and a third back yoke (760, AF back yoke) may be arranged. For example, the first back yoke (720, OIS back yoke), the second back yoke (740, OIS back yoke), and the third back yoke (760, AF back yoke) may include a magnetic material.

[0175] For example, suction yokes (780) may be positioned to absorb (e.g., shield) the leakage flux of the permanent magnets (710, 730, 750) and to control the tilt and shift of the lens module (705).

[0176] In the case of the direct-type camera module (700) shown in FIG. 8, the image sensor is positioned between the display and the lens driving unit, so the gap may be relatively large. In the lens lead folded type camera module (900) shown in FIG. 9, the structure in which the image sensor is positioned perpendicular to the lens is positioned closer to the display, so interference by magnetic flux may increase.

[0177] A direct-type camera module (700) according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated downward (e.g., towards the digitizer and / or the display) within the camera module (700) by using back yoke (720, 740, 760) and suction yoke (780).

[0178] An electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2, and the electronic device (600) of FIG. 6) including a direct-type camera module (700) according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated from the camera module toward the digitizer and display, thereby blocking (or reducing) the effect on the operation of electronic components placed inside the electronic device.

[0179] FIG. 9 is a drawing showing a lens lead folded camera module according to one embodiment of the present disclosure.

[0180] Referring to FIG. 9, a lens lead folded camera module (900) according to one embodiment of the present disclosure may include a first lens (910), a prism (920), a second lens (930), and an image sensor (940).

[0181] According to one embodiment, a lens lead-folded camera module (900) may be useful for extending or expanding the focal length by having a first lens (910) and a second lens (930) arranged in a curved manner (e.g., arranged at about 90 degrees) with a prism (920) in between.

[0182] For example, the first lens (910) is positioned externally, reducing the thickness of the camera module (900) and allowing the AF drive unit to be positioned further downward, which may result in a larger leakage flux compared to the conventional method. By positioning a suction yoke (950) in this camera module structure, the shielding of the leakage flux can be improved. The AF carrier (e.g., the part where the second lens (930) is mounted) can be pulled in the -z-axis direction by the suction yoke (950).

[0183] In a lens lead-folded camera module (900), an optical component such as a prism (920) is arranged, thereby allowing for the design or arrangement of the first lens (910) and the second lens (930) to be free regardless of the direction in which external light is incident. Therefore, the lens lead-folded camera module (900) can easily extend the focal length. By including an optical image stabilizer in the lens lead-folded camera module (900), the quality of the acquired image can be improved, and the performance of the telephoto camera for shooting distant subjects can be greatly enhanced when combined with the image stabilization function.

[0184] FIGS. 10a to 10c are drawings showing a direct-type folded camera module according to one embodiment of the present disclosure.

[0185] Referring to FIGS. 10a to 10c, a direct-type folded camera module (1000) according to one embodiment of the present disclosure may include a lens (1010), a prism (1055), and an image sensor (1060).

[0186] According to one embodiment, a direct-type folded camera module (1000) may include a first carrier (1030) (e.g., OIS carrier), a second carrier (1040) (e.g., AF carrier), back yokes (1070) (e.g., OIS back yokes) disposed on the first carrier (1030), a plurality of permanent magnets (1080) (e.g., OIS permanent magnets), suction yokes (1090) (e.g., OIS suction yokes) disposed on the second carrier (1040), a housing (1050), and a coil (1020) disposed on the housing (1050).

[0187] According to one embodiment, a direct-type folded camera module (1000) may be positioned in the rear direction (e.g., +z-axis direction) of an electronic device (e.g., electronic device (600) of FIG. 6) to photograph the rear direction (e.g., +z-axis direction) of the electronic device (600).

[0188] According to one embodiment, a direct-type folded camera module (1000) has a prism (1055) placed between a lens (1010) and an image sensor (1060), so that the thickness can be reduced compared to a direct-type camera module (e.g., a direct-type camera module (700) of FIG. 7). In the direct-type folded camera module (1000), the lens (1010) and the image sensor (1060) are arranged in a curved manner (e.g., arranged at an angle of about 90 degrees), which can be useful for extending or expanding the focal length.

[0189] According to one embodiment, in the case where a direct-type folded camera module (1000) has one more prism added and a reflective member added, an image sensor (1060) can be placed at the bottom.

[0190] According to one embodiment, a direct-type folded camera module (1000) moves parts of a lens (1010) and a prism (1055) for anti-shake and autofocus, and the driving system may include a plurality of permanent magnets (1080) (e.g., OIS permanent magnets) and a coil (1020).

[0191] According to one embodiment, permanent magnets (1080) for OIS (e.g., OIS permanent magnets) may be placed on a first carrier (1030) (e.g., OIS carrier).

[0192] According to one embodiment, back yokes (1070) (e.g., OIS back yokes) are placed on a first carrier (1030) (e.g., OIS carrier) to bind permanent magnets (1080) (e.g., OIS permanent magnets).

[0193] For example, back yokes (1070) (e.g., OIS back yokes) may include a magnetic material.

[0194] According to one embodiment, suction yokes (1090) (e.g., OIS suction yokes) are placed on a second carrier (1040) (e.g., AF carrier) to absorb (e.g., shield) the leakage flux of permanent magnets (1080) (e.g., OIS permanent magnets).

[0195] For example, suction yokes (1090) (e.g., OIS suction yokes) may be spaced apart at a certain distance from the lower side (e.g., -z direction) of the permanent magnets (1080) (e.g., OIS permanent magnets) and the back yokes (1070) (e.g., OIS back yokes).

[0196] A direct-type folded camera module (1000) according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated downward (e.g., towards the digitizer, towards the display) within the camera module through back yokes (1070) (e.g., OIS back yokes) and suction yokes (1090) (e.g., OIS suction yokes).

[0197] An electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2, and the electronic device (600) of FIG. 6) including a direct-type folded camera module (1000) according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated from the camera module toward the digitizer and display, thereby blocking (or reducing) the effect on the operation of electronic components placed inside the electronic device.

[0198] FIGS. 11a and FIGS. 11b are drawings (1100) showing the control of the tilt and center movement of a permanent magnet relative to a coil using a suction yoke placed in a camera module.

[0199] Referring to FIG. 11a, the suction yoke (1130) (e.g., suction yokes (1090) of FIG. 10b and FIG. 10c, OIS suction yokes) can absorb (e.g., shield) the leakage magnetic flux of the permanent magnet (1120) (e.g., permanent magnets (1080) of FIG. 10b and FIG. 10c, OIS permanent magnets) and control the tilt and shift of the permanent magnet relative to the coil (1110).

[0200] FIGS. 11a and FIGS. 11b illustrate an example of a solenoid driving method. For example, a structure in which a suction yoke (1130) (e.g., the suction yokes (1090) of FIGS. 10b and FIGS. 10c, OIS suction yokes) is arranged in a solenoid driving method can be applied in the same (or similar) way to the driving method.

[0201] For example, solenoid drive and Lorentz drive methods may be applied to precisely move the lens to implement autofocus (AF) and optical image stabilization (OIS) functions in cameras placed in electronic devices (e.g., smartphones). For instance, the solenoid drive method utilizes electromagnetic force; by flowing current through a coil (solenoid) to form a magnetic field, the lens can be moved through interaction with a permanent magnet. The solenoid drive method allows for the adjustment of the lens position by controlling the direction and strength of the current. The force generated in the solenoid drive method can be determined by the direction of the magnetic field and the polarity of the magnet attached to the lens. Changing the direction of the current flowing through the coil can change the polarity of the magnetic field, which in turn allows the lens position to move in the z-axis (or -z-axis) direction. For example, the Lorentz drive method utilizes the Lorentz force, which is an electromagnetic force generated when an electric current flows within a magnetic field, and can be used to move the lens. In the Lorentz drive method, since the direction of the current flow (coil) and the direction of the magnetic field (permanent magnet) are perpendicular to each other, the Lorentz force can act perpendicularly to both the direction of the current and the direction of the magnetic field. Therefore, the lens can move freely in the x-axis and y-axis plane directions, and OIS functions can be implemented. The Lorentz drive method allows the lens to move in the x-axis, y-axis, and z-axis directions, enabling shake correction and focus adjustment. The Lorentz drive method allows for fine adjustment of the lens position by controlling the direction and magnitude of the current. For example, when the x-axis and y-axis of the drive unit adjusting the lens position are reversed, a suction yoke (1130) can also be applied to the AF drive unit.For example, in a solenoid drive method, driving force is generated in the direction where the distance between the coil and the magnet changes, while in a Lorentz drive method, driving force can be generated in the left and right directions while the distance between the coil and the magnet is maintained. The drive unit that performs x-axis control in a solenoid drive method can be applied as the drive unit that controls the y-axis in a Lorentz drive method.

[0202] FIG. 12 is a drawing showing a back yoke for binding permanent magnets of a camera module according to an embodiment of the present disclosure, and an intake yoke for absorbing leakage flux of permanent magnets.

[0203] Referring to FIG. 12(a), a back yoke (1220) (e.g., back yokes (1070) of FIG. 10) may be positioned to wrap around at least a portion of the side of a permanent magnet (1210) (e.g., permanent magnets (1080) of FIG. 10) (e.g., two sides). For example, the back yoke (1220) may include a first portion (1221) and a second portion (1222).

[0204] For example, the suction yoke (1230) may be positioned in the lower direction (e.g., the -z-axis direction) of the permanent magnet (1210), and the suction yoke (1230) and the back yoke (1220) may be formed so as not to overlap.

[0205] According to one embodiment, the back yoke (1220) may be positioned to overlap with two sides of the permanent magnet (1210). For example, in the first side direction (1201), the first part (1221) of the back yoke (1220) may be positioned to overlap (e.g., wrap around) the first side (1211) of the permanent magnet (1210). For example, in the second side direction (1202), the second part (1222) of the back yoke (1220) may be positioned to overlap (e.g., wrap around) the second side (1212) of the permanent magnet (1210). In the third side direction (1203) and the fourth side direction (1204), the back yoke (1220) may not overlap with the permanent magnet (1210).

[0206] Referring to FIG. 12(b), the back yoke (1220) may be positioned to overlap three sides of the permanent magnet (1210). For example, the back yoke (1220) (e.g., the back yokes (1070) of FIG. 10) may be positioned to wrap around at least a portion of the sides of the permanent magnet (1210) (e.g., the permanent magnets (1080) of FIG. 10) (e.g., three sides). For example, the back yoke (1220) may include a first part (1221), a second part (1222), and a third part (1223).

[0207] The suction yoke (1230) may be positioned in the lower direction (e.g., the -z-axis direction) of the permanent magnet (1210), and the suction yoke (1230) and the back yoke (1220) may be formed to overlap at least partially.

[0208] According to one embodiment, a first part (1221), a second part (1222), and a third part (1223) of the back yoke (1220) may be arranged to surround three sides (1211, 1212, 1213) of the permanent magnet (1210). For example, in the first side direction (1201), the first part (1221) of the back yoke (1220) may be arranged to overlap with the first side (1211) of the permanent magnet (1210). For example, in the second side direction (1202), the second part (1222) of the back yoke (1220) may be arranged to overlap with the second side (1212) of the permanent magnet (1210). For example, in the third side direction (1203), the third part (1223) of the back yoke (1220) may be positioned to overlap with the third side (1213) of the permanent magnet (1210). For example, in the fourth side direction (1204), the back yoke (1220) may not overlap with the permanent magnet (1210).

[0209] Referring to (c) of FIG. 12, a back yoke (1220) (e.g., back yokes (1070) of FIG. 10) may be positioned to wrap around at least a portion of the side of a permanent magnet (1210) (e.g., permanent magnets (1080) of FIG. 10) (e.g., to wrap around three sides). For example, the back yoke (1220) may include a first part (1221), a second part (1222), and a third part (1223).

[0210] According to one embodiment, a first part (1221), a second part (1222), and a third part (1223) of the back yoke (1220) may be arranged to surround three sides (1211, 1212, 1213) of the permanent magnet (1210). For example, in the first side direction (1201), the first part (1221) of the back yoke (1220) may be arranged to overlap with the first side (1211) of the permanent magnet (1210). For example, in the second side direction (1202), the second part (1222) of the back yoke (1220) may be arranged to overlap with a part of the second side (1212) of the permanent magnet (1210). For example, in the third side direction (1203), the third portion (1223) of the back yoke (1220) may be positioned to overlap with a portion of the third side (1213) of the permanent magnet (1210). For example, in the fourth side direction (1204), the back yoke (1220) may not overlap with the permanent magnet (1210). For example, the back yoke (1220) may include a bending portion (1224) so ​​that the back yoke (1220) can be bent at the corner portion of the permanent magnet (1210). The bending portion (1224) may be formed by a C-cut or an R shape.

[0211] FIGS. 13 to 15 are drawings showing various shapes of a back yoke of a camera module according to an embodiment of the present disclosure.

[0212] Referring to FIG. 13, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include a plurality of back yokes (1300). In FIG. 13, one back yoke (1300) among the plurality of back yokes (1300) is shown.

[0213] According to one embodiment, the back yoke (1300) may include a first surface (1310) that contacts a permanent magnet (e.g., permanent magnet (1210) of FIG. 12), and a protrusion (1311) that protrudes in a vertical direction (e.g., a direction rotated about 90 degrees) from the upper side of the first surface (1310).

[0214] For example, the protrusion (1311) of the back yoke (1300) may overlap with a portion of the upper surface of the permanent magnet (e.g., permanent magnet (1210)) (e.g., to cover a portion of the upper surface of the permanent magnet).

[0215] For example, a permanent magnet (e.g., permanent magnet (1210)) can be connected by the first surface (1310) and the protrusion (1311) of the back yoke (1300).

[0216] Referring to FIG. 14, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include a plurality of back yokes (1300). In FIG. 14, one back yoke (1300) among the plurality of back yokes (1300) is shown.

[0217] According to one embodiment, the back yoke (1300) may include a first surface (1320) that contacts a permanent magnet (e.g., permanent magnet (1210)), and a first protrusion (1322) that protrudes in a substantially vertical direction (e.g., a direction rotated about 90 degrees) from the lower side of the first surface (1320). For example, the back yoke (1300) may include a second protrusion (1321) that protrudes in a substantially vertical direction (e.g., a direction rotated about 90 degrees) from the upper side of the first surface (1320).

[0218] For example, the first protrusion (1322) of the back yoke (1300) may overlap with a portion of the lower surface of the permanent magnet (e.g., permanent magnet (1210)) (e.g., to cover a portion of the lower surface of the permanent magnet).

[0219] For example, the second protrusion (1321) of the back yoke (1300) may overlap with a portion of the upper surface of the permanent magnet (e.g., permanent magnet (1210)) (e.g., to cover a portion of the upper surface of the permanent magnet).

[0220] For example, a permanent magnet (e.g., permanent magnet (1210)) can be connected by the first surface (1320), the first protrusion (1322), and the second protrusion (1321) of the back yoke (1300).

[0221] Referring to FIG. 15, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include a plurality of back yokes (1300). In FIG. 15, one back yoke (1300) among the plurality of back yokes (1300) is shown.

[0222] According to one embodiment, the back yoke (1300) may include a first surface (1330) that contacts a permanent magnet (e.g., permanent magnet (1210)), and a first protrusion (1332) that protrudes in a substantially vertical direction (e.g., a direction rotated about 90 degrees) from the lower (or upper) side of the first surface (1330). For example, the back yoke (1300) may include a second protrusion (1331) that protrudes in a substantially vertical direction (e.g., a direction rotated about 90 degrees) from the upper (or lower) side of the first surface (1330).

[0223] For example, the first protrusion (1332) of the back yoke (1300) may overlap with a portion of the lower surface of a permanent magnet (e.g., permanent magnet (1210)) (e.g., to cover a portion of the lower surface of the permanent magnet). For example, the portion (1332a) where the first surface (1330) of the back yoke (1300) and the first protrusion (1332) are connected may be formed in a round shape.

[0224] For example, the second protrusion (1331) of the back yoke (1300) may overlap with a portion of the upper surface of the permanent magnet (e.g., permanent magnet (1210)). The area of ​​the second protrusion (1331) of FIG. 15 may be relatively larger than the area of ​​the second protrusion (1321) of FIG. 14, and the larger area of ​​the second protrusion (1331) may overlap with the upper surface of the permanent magnet (1210).

[0225] For example, a permanent magnet (e.g., permanent magnet (1210)) can be connected by the first surface (1330), the first protrusion (1332), and the second protrusion (1331) of the back yoke (1300).

[0226] FIGS. 16a and FIGS. 16b are drawings (1600) showing shielding of leakage flux using a back yoke and a suction yoke of a camera module according to an embodiment of the present disclosure.

[0227] FIG. 17 is a drawing showing a cross-section of the permanent magnet, back yoke, and suction yoke shown in FIG. 16a and FIG. 16b.

[0228] Referring to FIGS. 16a, 16b, and 17, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include a plurality of permanent magnets (1610), a plurality of back yokes (1620), and a plurality of suction yokes (1630, 1640, 1650). In FIGS. 16a, 16b, and 17, one permanent magnet (1610) among the plurality of permanent magnets (1610) is illustrated. In FIGS. 16a, 16b, and 17, one back yoke (1620) among the plurality of back yokes (1620) is illustrated.

[0229] According to one embodiment, the first surface (1621) of the back yoke (1620) may be formed to be in contact with the first surface (1611) of the permanent magnet (1610).

[0230] For example, the back yoke (1620) may include a first protrusion (1623) (e.g., a bottom protrusion) that protrudes in a substantially vertical direction (e.g., a direction rotated about 90 degrees) from the lower side of the first surface (1621). The first protrusion (1623) of the back yoke (1620) may be formed to overlap at least partially with the bottom surface (1613) of the permanent magnet (1610).

[0231] For example, the back yoke (1620) may include a second protrusion (1622) (e.g., upper surface protrusion) that protrudes in a substantially perpendicular direction (e.g., about 90 degrees angled) from the upper side of the first surface (1621). The second protrusion (1622) of the back yoke (1620) may be formed to overlap at least partially with the upper surface (1612) of the permanent magnet (1610).

[0232] For example, the back yoke (1620) may include a third protrusion (1624) protruding from the first surface (1621) so as to overlap with the side (1614) (e.g., both sides) of the permanent magnet (1610). The third protrusion (1624) may be located between the first protrusion (1623) and the second protrusion (1622).

[0233] According to one embodiment, a suction yoke (1630, 1640, 1650) may be placed at the bottom of the permanent magnet (1610) and the back yoke (1620).

[0234] The suction yoke (1630, 1640, 1650) can be formed in various shapes when viewed from above. For example, the suction yoke (1630, 1640, 1650) can be formed in an 'I' shape, an 'H' shape, or various shapes combining the 'I' shape and the 'H' shape when viewed from above. However, it is not limited thereto, and the suction yoke (1630, 1640, 1650) can be formed in various shapes other than the 'I' shape and the 'H' shape when viewed from above.

[0235] For example, the suction yoke (1630, 1640, 1650) may be positioned to overlap with a part of the first protrusion (1623) of the back yoke (1620) in the z-axis direction.

[0236] For example, the suction yoke (1630, 1640, 1650) may be positioned to overlap the entirety of the first protrusion (1623) of the back yoke (1620). For example, when viewed from the z-axis direction, the suction yoke (1630, 1640, 1650) may overlap at least partially with the first protrusion (1623) of the back yoke (1620).

[0237] According to one embodiment, the performance of absorbing (e.g., shielding) the leakage flux of the permanent magnet (1610) may vary depending on the size (e.g., area) of the suction yoke (1630, 1640, 1650).

[0238] As illustrated in FIG. 16b, for example, a first protrusion (1623a) may be formed to cover 100% of the lower portion of the back yoke (1620). At this time, a suction yoke (1630) may be positioned to overlap with the first protrusion (1623a) of the back yoke (1620) in the z-axis direction. Here, the area of ​​the suction yoke (1630) may be smaller than the area of ​​the first protrusion (1623a) of the back yoke (1620). The area overlapping between the first protrusion (1623a) of the back yoke (1620) and the suction yoke (1630) can be adjusted by adjusting the position of the suction yoke (1630).

[0239] For example, a first protrusion (1623b) may be formed to cover 40% to 60% of the lower portion of the back yoke (1620). At this time, a suction yoke (1640) may be positioned to overlap with the first protrusion (1623b) of the back yoke (1620) in the z-axis direction. Here, the area of ​​the suction yoke (1640) may be larger than the area of ​​the first protrusion (1623b) of the back yoke (1620). The area overlapping between the first protrusion (1623b) of the back yoke (1620) and the suction yoke (1640) can be adjusted by adjusting the position of the suction yoke (1640).

[0240] For example, a first protrusion (1623b) may be formed to cover 40% to 60% of the lower portion of the back yoke (1620). At this time, a suction yoke (1630) may be positioned to overlap with the first protrusion (1623b) of the back yoke (1620) in the z-axis direction. Here, the area of ​​the suction yoke (1630) may be substantially the same as or smaller than the area of ​​the first protrusion (1623a) of the back yoke (1620). The area overlapping between the first protrusion (1623b) of the back yoke (1620) and the suction yoke (1630) can be adjusted by adjusting the position of the suction yoke (1630).

[0241] Referring to Table 1 below, it can be seen that as the size (e.g., area) of the suction yoke (1630, 1640, 1650) increases, the performance of absorbing (e.g., shielding) the leakage flux of the permanent magnet (1610) increases substantially.

[0242] The size (e.g., area) of the suction yoke (1630, 1640, 1650) listed in Table 1 is a relative value, and when the size (e.g., area) of the suction yoke (1630, 1640, 1650) is 0.1605, the leakage flux of the permanent magnet (1610) is 223 and the suction force can be 1.7. Relatively, when the size (e.g., area) of the suction yoke (1630, 1640, 1650) is 1.445, the leakage flux of the permanent magnet (1610) decreases to 168 and the suction force can increase to 63.

[0243]

[0244] FIG. 18 is a drawing showing an OIS driving unit using a solenoid force. Referring to FIG. 18, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include an OIS driving unit (1800).

[0245] According to one embodiment, an OIS driving unit (1800) using a solenoid force may include a plurality of permanent magnets (1810) (e.g., OIS permanent magnets), a plurality of back yokes (1820) (e.g., AF back yokes), a plurality of suction yokes (1830), and a plurality of coils (1840). For example, the OIS driving unit (1800) using a solenoid force may include an x-axis permanent magnet and an x-axis coil for driving in the x-axis direction. The OIS driving unit (1800) using a solenoid force may include a y-axis permanent magnet and a y-axis coil for driving in the y-axis direction. For example, the OIS driving unit (1800) using a solenoid force may apply a force in a horizontal direction to the permanent magnets (1810) and the coils (1840).

[0246] For example, in FIG. 18, one permanent magnet (1810) among a plurality of permanent magnets (1810) is illustrated. In FIG. 18, one back yoke (1820) among a plurality of back yokes (1820) is illustrated. In FIG. 18, one suction yoke (1830) among a plurality of suction yokes (1830) is illustrated.

[0247] According to one embodiment, the back yoke (1820) is positioned to come into contact with the permanent magnet (1810) so as to bind the permanent magnet (1810).

[0248] According to one embodiment, the suction yoke (1830) may be spaced apart at a certain distance from the lower direction (e.g., z-axis direction) of the permanent magnet (1810) and the back yoke (1820).

[0249] A camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) can absorb (e.g., shield) leakage flux of a permanent magnet (1810) (e.g., AF permanent magnet) in the z-axis direction by arranging a back yoke (1820) and a suction yoke (1830) in the OIS driving unit (1800).

[0250] FIGS. 19 and 20 are drawings showing an OIS driving unit using Lorentz force.

[0251] A camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include an OIS driving unit (1900) using a Lorentz force.

[0252] According to one embodiment, an OIS drive unit (1900) using a Lorentz force may include a plurality of permanent magnets (1910) (e.g., OIS permanent magnets), a plurality of back yokes (1920) (e.g., OIS back yokes), a plurality of suction yokes (1930) (e.g., suction yokes (1090) of FIG. 10b and FIG. 10c, OIS suction yokes), and a plurality of coils (1940). For example, an OIS drive unit (1900) using a Lorentz force may include an x-axis permanent magnet and an x-axis coil for driving in the x-axis direction. An OIS drive unit (1900) using a Lorentz force may include a y-axis permanent magnet and a y-axis coil for driving in the y-axis direction. Additionally, the OIS driving unit (1800) using a solenoid force may include a y-axis permanent magnet and a y-axis coil for driving in the y-axis direction.

[0253] For example, the OIS drive unit (1900) using the Lorentz force can apply a force in a direction perpendicular to the permanent magnet (1910) and the coil (1940).

[0254] For example, in FIGS. 19 and 20, one permanent magnet (1910) among a plurality of permanent magnets (1910) is illustrated. In FIGS. 19 and 20, one back yoke (1920) among a plurality of back yokes (1920) is illustrated. In FIGS. 19 and 20, two suction yokes (1930) among a plurality of suction yokes (1930) are illustrated.

[0255] According to one embodiment, the back yoke (1920) is positioned to come into contact with the permanent magnet (1910) so as to bind the permanent magnet (1910).

[0256] According to one embodiment, the suction yoke (1930) may be spaced apart at a certain distance from the lower direction (e.g., z-axis direction) of the permanent magnet (1910) and the back yoke (1920).

[0257] A camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) can absorb (e.g., shield) leakage flux of a permanent magnet (1910) (e.g., AF permanent magnet) in the z-axis direction by placing a back yoke (1920) and a suction yoke (1930) in the OIS driving unit (1900).

[0258] Figure 21 is a diagram showing the shielding of a permanent magnet by the back yoke of the AF drive unit.

[0259] Referring to FIG. 21, the leakage flux of the permanent magnet (2110) can be shielded by the back yoke (2120) of the AF drive unit (2100).

[0260] According to one embodiment, the back yoke (2120) may overlap with at least a portion of the rear surface (2102), upper surface (2103), lower surface (2104), and side surface (2105) of the permanent magnet (2110), excluding the front surface (2101).

[0261] For example, the back yoke (2120) may include a first surface (2121) (e.g., a side) that overlaps with the rear surface (2102) of the permanent magnet (2110). The back yoke (2120) may include a first protrusion (2122) that overlaps with at least a portion of the lower surface of the permanent magnet (2110). The back yoke (2120) may include a second protrusion (2123) that does not overlap with the permanent magnet (2110). The permanent magnet (2110) can be secured by the first surface (2121) (e.g., a side) and the plurality of protrusions (2122) of the back yoke (2120), and the leakage flux of the permanent magnet (2110) can be shielded.

[0262] For example, leakage flux in the lower direction (e.g., -z-axis direction) of the permanent magnet (2110) can be shielded by a first protrusion (2122) of the back yoke (2120) which is positioned to overlap with the rear surface (2102) of the permanent magnet (2110). The number and shape of the multiple protrusions (2122, 2123) of the back yoke (2120) may vary.

[0263] FIG. 22 is a diagram showing a designated area of ​​the bottom surface of a permanent magnet shielded using a back yoke. FIG. 22 illustrates an example in which 40% to 60% of the bottom surface of the permanent magnet is shielded using a back yoke.

[0264] Referring to FIG. 22, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include an OIS driving unit (2200) (or AF driving unit).

[0265] According to one embodiment, the OIS driving unit (2200) may include a permanent magnet (2210), a back yoke (2220), and a suction yoke (2230). A camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may have the back yoke (2220) and suction yoke (2230) arranged to absorb (e.g., shield) the leakage flux of the permanent magnet (2210).

[0266] For example, the back yoke (2220) may be positioned to overlap with at least a portion of the rear, top, and bottom surfaces of the permanent magnet (2210), excluding the front surface.

[0267] For example, the back yoke (2220) may include a first surface (2221) formed to be in contact with the rear surface of the permanent magnet (2210).

[0268] The back yoke (2220) may include a first protrusion (2223) formed to protrude substantially perpendicularly from the first surface (2221) (e.g., a direction rotated about 90 degrees) and overlap at least a portion of the lower surface of the permanent magnet (2210).

[0269] For example, the back yoke (2220) may include a second protrusion (2222) formed to protrude substantially perpendicularly from the first surface (2221) (e.g., a direction rotated about 90 degrees) and overlap at least a portion of the upper surface of the permanent magnet (2210).

[0270] For example, the back yoke (2220) may include a third protrusion (2224) protruding from the first surface (2221) so as to overlap with the side (e.g., both sides) of the permanent magnet (2210). The third protrusion (2224) may be located between the first protrusion (2223) and the second protrusion (2222).

[0271] According to one embodiment, the suction yoke (2230) may be spaced apart at a certain distance from the lower direction of the permanent magnet (2210) and the back yoke (2220).

[0272] According to one embodiment, the second protrusion (2222) of the back yoke (2220) may be formed to overlap with approximately 25-50% of the total area of ​​the upper surface of the permanent magnet (2210) that contacts the surface perpendicular to the surface facing the coil. The first protrusion (2223) of the back yoke (2220) may be formed to overlap with approximately 50% of the total area of ​​the lower surface of the permanent magnet (2210) that contacts the surface perpendicular to the surface facing the coil. In addition, a suction yoke (2230) may be positioned to suction (e.g., shield) the leakage flux of the permanent magnet (2210). The first protrusion (2223), second protrusion (2222), and third protrusion (2224) of the back yoke (2220) overlap with at least a portion of the lower surface, upper surface, and side surface of the permanent magnet (2210), and together with this, the suction yoke (2230) can be positioned to suck (e.g., shield) the leakage flux of the permanent magnet (2210) in the -z-axis direction.

[0273] According to one embodiment, a back yoke (2220) and a suction yoke (2230) are applied to the AF drive unit in the same (or similar) way as the OIS drive unit (2200) so that leakage flux of the permanent magnet can be absorbed (e.g., shielded).

[0274] Referring to Table 2 below, when the area of ​​the permanent magnet (2210) that the protrusions (2222, 2223, 2224) of the back yoke (2220) contact in a plane perpendicular to the plane facing the coil is formed to overlap with at least about 50% of the total area, the amount of leakage flux and suction force (e.g., shielding) of the permanent magnet (2210) can increase as the size (e.g., area) of the suction yoke (2230) increases. The size (e.g., area) of the suction yoke listed in Table 2 is a relative value.

[0275]

[0276] FIG. 23 is a diagram showing the position of the suction yoke applied to a structure that shields a specified range of the bottom surface of a permanent magnet using a back yoke. FIG. 23 illustrates an example in which 40% to 60% of the bottom surface of the permanent magnet is shielded using a back yoke.

[0277] Referring to FIG. 23, the first protrusion (2223), the second protrusion (2222), and the third protrusion (2224) of the back yoke (2220) may overlap with at least a portion of the lower surface, the upper surface, and the side surface of the permanent magnet (2210). At this time, depending on the position where the suction yoke (2240) is placed, the amount of leakage flux and suction force (e.g., shielding) of the permanent magnet (2210) may vary.

[0278] Referring to FIG. 23 (a), for example, the first protrusion (2223), the second protrusion (2222), and the third protrusion (2224) of the back yoke (2220) may overlap with at least a portion of the lower surface, upper surface, and side surface of the permanent magnet (2210), and the suction yoke (2340) may be positioned to overlap with the left side of the permanent magnet (2210).

[0279] Referring to FIG. 23 (b), for example, the first protrusion (2223), the second protrusion (2222), and the third protrusion (2224) of the back yoke (2220) may overlap with at least a portion of the lower surface, upper surface, and side surface of the permanent magnet (2210), and the suction yoke (2350) may be positioned so as to overlap with the center of the permanent magnet (2210).

[0280] Referring to Fig. 23 (c), for example, the first protrusion (2223), the second protrusion (2222), and the third protrusion (2224) of the back yoke (2220) may overlap with at least a portion of the lower surface, upper surface, and side surface of the permanent magnet (2210), and the suction yoke (2360) may be positioned to overlap with the right side of the permanent magnet (2210).

[0281] Referring to Table 3 below, if a first protrusion (2223), a second protrusion (2222), and a third protrusion (2224) are formed on the back yoke (2220) and the suction yoke (2340) is positioned to overlap with the left side of the permanent magnet (2210), the leakage flux of the permanent magnet (2210) can be about 195 [gauss] and the suction force can be about 11.1 mN.

[0282] For example, if a first protrusion (2223), a second protrusion (2222), and a third protrusion (2224) are formed on the back yoke (2220) and the suction yoke (2350) is positioned to overlap with the center of the permanent magnet (2210), the leakage flux of the permanent magnet (2210) can be about 184 [gauss] and the suction force can be about 23.8 mN.

[0283] For example, if a first protrusion (2223), a second protrusion (2222), and a third protrusion (2224) are formed on the back yoke (2220) and the suction yoke (2360) is positioned to overlap with the right side of the permanent magnet (2210), the leakage flux of the permanent magnet (2210) can be about 164 [gauss] and the suction force can be about 17.4 mN.

[0284] For example, under the same conditions, if the first protrusion (2223) of the back yoke (2220) is present, the suction yoke (2340, 2350, 2360) can reduce the leakage flux in the section that the first protrusion (2223) does not cover.

[0285]

[0286] FIG. 24 is a drawing showing a structure in which a suction yoke is applied to a structure that overlaps more than a specified range (e.g., 25% of the bottom surface of the permanent magnet) of the bottom surface of the permanent magnet using a back yoke.

[0287] FIG. 25 is a diagram showing shielding a specified range (e.g., 85% to 90%) of the leakage flux of a permanent magnet using the back yoke and suction yoke of FIG. 24. FIG. 25 illustrates, as an example, shielding 85% to 90% of the bottom surface of the permanent magnet using the back yoke and suction yoke.

[0288] Referring to FIGS. 24 and 25, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may include an OIS driving unit (2400).

[0289] According to one embodiment, the OIS driving unit (2400) may include a permanent magnet (2410), a back yoke (2420), and a suction yoke (2430). By placing the back yoke (2420) and the suction yoke (2430) in the OIS driving unit (2400), the leakage magnetic flux of the permanent magnet (2410) (e.g., OIS permanent magnet) can be absorbed (e.g., shielded).

[0290] According to one embodiment, a camera module according to one embodiment of the present disclosure (e.g., camera module (700) of FIG. 8, camera module (1000) of FIG. 10b) may have a back yoke and a suction yoke arranged in the AF driving unit in the same (or similar) way as the OIS driving unit (2400) to absorb (e.g., shield) the leakage magnetic flux of a permanent magnet (2410) (e.g., AF permanent magnet).

[0291] In FIGS. 24 and 25, one permanent magnet (2410) among a plurality of permanent magnets (2410) is illustrated. In FIGS. 24 and 25, one back yoke (2420) among a plurality of back yokes (2420) is illustrated.

[0292] According to one embodiment, for example, the back yoke (2420) may be positioned to overlap with at least a portion of the rear, top, and bottom surfaces of the permanent magnet (2410), excluding the front surface.

[0293] For example, the back yoke (2420) may include a first surface (2421) formed to be in contact with the rear surface of the permanent magnet (2410).

[0294] For example, the back yoke (2420) may include a first protrusion (2423) formed to protrude substantially perpendicularly from the first surface (2421) (e.g., a direction rotated about 90 degrees) and overlap at least a portion of the lower surface of the permanent magnet (2410).

[0295] For example, the back yoke (2420) may include a second protrusion (2422) formed to protrude substantially perpendicularly from the first surface (2421) (e.g., a direction rotated about 90 degrees) and overlap at least a portion of the upper surface of the permanent magnet (2410).

[0296] For example, the back yoke (2420) may include a third protrusion (2424) protruding from the first surface (2421) so as to overlap with the side (e.g., both sides) of the permanent magnet (2410). The third protrusion (2424) may be located between the first protrusion (2423) and the second protrusion (2422).

[0297] According to one embodiment, the suction yoke (2430) may be spaced apart at a certain distance from the lower direction of the permanent magnet (2410) and the back yoke (2420). According to one embodiment, the area of ​​the permanent magnet (2410) that contacts the first protrusion (2423) of the back yoke (2420) on a surface perpendicular to the surface facing the coil may be formed to overlap with at least 30% of the total area.

[0298] For example, the suction yoke (2430) includes a plurality of protrusions (2422, 2423, 2424) and, when viewed from above, may be formed in an 'I' shape, an 'H' shape, or a combined 'I' shape and an 'H' shape.

[0299] However, not limited to this, the suction yoke (2430) can be formed in various shapes other than an ‘I’ shape and an ‘H’ shape when viewed from above.

[0300] For example, a protrusion (2431) may be additionally formed on at least a portion of the suction yoke (2430). By forming the protrusion (2431) on the suction yoke (2430), leakage flux in the section not covered by the first protrusion (2423) of the back yoke (2420) can be reduced.

[0301] For example, the back yoke (2430) can be positioned so that the protrusions (2422, 2423, 2424) of the back yoke (2420) overlap by more than 30% of the total surface area of ​​the upper, lower, and side surfaces of the permanent magnet (2410), thereby absorbing (e.g., shielding) about 85 to 95% of the leakage flux of the permanent magnet (2410).

[0302] According to one embodiment, a back yoke (2420) and a suction yoke (2430) are applied to the AF drive unit in the same (or similar) way as the OIS drive unit (2400) so that the leakage flux of the permanent magnet can be absorbed (e.g., shielded) by about 85 to 95%.

[0303] A camera module of an electronic device according to one embodiment of the present disclosure may include: a lens module (705, 1010) comprising at least one lens configured to move for optical image stabilization (OIS) and autofocus (AF) functions; and a lens driving unit for moving the lens module (705, 1010) along the x-axis, y-axis, and z-axis. The lens driving unit may include a permanent magnet (1080, 1610) disposed on a first carrier (1030), and an suction yoke (1090) that absorbs leakage magnetic flux between the first carrier (1030) and the permanent magnet (1080, 1610). A first surface of the permanent magnet (1080, 1610) may face a first surface of the back yoke (1070, 1620). The back yoke (1070, 1620) may include a first protrusion (1623) protruding from a first surface of the back yoke. The first protrusion (16230) of the back yoke (1070, 1620) may be positioned to overlap with at least a portion of the permanent magnet.

[0304] According to one embodiment, the first protrusion (1623) of the back yoke (1070, 1620) may be positioned to overlap with at least a portion of the lower part of the permanent magnet (1080, 1610).

[0305] According to one embodiment, the suction yoke (1090) may be positioned at a certain distance from the permanent magnet (1080, 1610). When viewed from the optical axis of the lens module, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are positioned so as not to overlap, thereby shielding the leakage magnetic flux of the permanent magnet (1080, 1610).

[0306] According to one embodiment, the suction yoke (1090) may be positioned at a certain distance from the permanent magnet (1080, 1610). When viewed from the optical axis of the lens module, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are positioned so that at least a portion overlaps, thereby shielding the leakage flux of the permanent magnet (1080, 1610).

[0307] According to one embodiment, the first protrusion (1623) of the back yoke (1070, 1620) overlaps with the suction yoke (1090) over the entire area to shield the leakage flux of the permanent magnet (1080, 1610).

[0308] According to one embodiment, the first protrusion (1623) of the back yoke (1070, 1620) may be positioned to cover at least 25% of the total area of ​​the lower portion of the permanent magnet (1080, 1610).

[0309] According to one embodiment, the suction yoke (1090) may be formed in an 'I' shape, an 'H' shape, or a combined 'I' shape and an 'H' shape when viewed from above.

[0310] An electronic device including a camera module according to one embodiment of the present disclosure may include a display positioned to display a screen in the front direction of the electronic device, a digitizer positioned on the back side of the display, electronic components positioned on the back side of the display, and a camera module (700, 1000) configured to capture an image in the rear direction of the electronic device. The camera module (700, 1000) may include a lens module comprising at least one lens configured to move for optical image stabilization (OIS) and autofocus (AF) functions, and a lens driving unit for moving the lens module along the x-axis, y-axis, and z-axis. The lens driving unit may include a permanent magnet (1080, 1610) positioned on a first carrier (1030), and an suction yoke (1090) that absorbs leakage magnetic flux between the first carrier (1030) and the permanent magnet (1080, 1610). The first surface of the permanent magnet (1080, 1610) may face the first surface of the back yoke (1070, 1620). The back yoke may include a first protrusion (1623) protruding from the first surface of the back yoke (1070, 1620). The first protrusion (1623) of the back yoke (1070, 1620) may be positioned to overlap with at least a portion of the permanent magnet (1080, 1610).

[0311] According to one embodiment, the first protrusion (1623) of the back yoke (1070, 1620) may be positioned to cover at least a portion of the lower part of the permanent magnet (1080, 1610).

[0312] According to one embodiment, the suction yoke (1090) may be positioned at a certain distance from the permanent magnet (1080, 1610). When viewed from the optical axis, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are positioned so as not to overlap, thereby shielding the leakage flux of the permanent magnet (1080, 1610).

[0313] According to one embodiment, the suction yoke (1090) may be positioned at a certain distance from the permanent magnet (1080, 1610). When viewed from the optical axis, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are positioned so that at least a portion overlaps, thereby shielding the leakage flux of the permanent magnet (1080, 1610).

[0314] According to one embodiment, the first protrusion (1623) of the back yoke (1070, 1620) overlaps with the suction yoke (1090) over the entire area to shield the leakage flux of the permanent magnet (1080, 1610).

[0315] According to one embodiment, the first protrusion (1623) of the back yoke (1070, 1620) may be positioned to cover at least 25% of the total area of ​​the lower portion of the permanent magnet (1080, 1610).

[0316] According to one embodiment, the camera module (700, 1000) may be a direct type, a lens lead folded type, or a direct folded type.

[0317] A camera module and an electronic device including a camera module according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated downward (e.g., towards a digitizer, towards a display) within the camera module by using a back yoke and a suction yoke disposed within the camera module.

[0318] A camera module and an electronic device including a camera module according to one embodiment of the present disclosure can reduce the strength of leakage magnetic flux radiated from the camera module toward a digitizer and a display, thereby blocking (or reducing) the influence on the operation of electronic components placed inside the electronic device.

[0319] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

Claims

1. In the camera module (700, 1000), A lens module (705, 1010) comprising at least one lens configured to move for optical image stabilization (OIS) and autofocus (AF) functions; and A lens driving unit for x-axis, y-axis, and z-axis movement of the above lens module (705, 1010); comprising The lens driving unit comprises a permanent magnet (1080, 1610) disposed on a first carrier (1030), a back yoke (1070) connecting the first carrier (1030) and the permanent magnet (1080, 1610), and an intake yoke (1090) absorbing leakage magnetic flux of the permanent magnet (1080, 1610). The first surface of the permanent magnet (1080, 1610) faces the first surface (1621) of the back yoke (1070, 1620), and The above back yoke (1070, 1620) includes a first protrusion (1623) protruding from a first surface (1621) of the above back yoke (1070, 1620), and The first protrusion (1623) of the back yoke (1070, 1620) is positioned to overlap with at least a portion of the permanent magnet (1080, 1610), Camera module of an electronic device (700, 1000).

2. In Paragraph 1, The first protrusion (1623) of the back yoke (1070, 1620) is positioned to overlap with at least a portion of the lower part of the permanent magnet (1080, 1610), Camera module of an electronic device (700, 1000).

3. In any one of paragraphs 1 to 2, The suction yoke (1090) is positioned at a certain distance from the permanent magnet (1080, 1610), and When viewed from the optical axis of the lens module, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are arranged so as not to overlap, thereby shielding the leakage magnetic flux of the permanent magnet (1080, 1610). Camera module of an electronic device (700, 1000).

4. In any one of paragraphs 1 to 2, The suction yoke (1090) is positioned at a certain distance from the permanent magnet (1080, 1610), and When viewed from the optical axis, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are arranged so that at least a portion overlaps, thereby shielding the leakage magnetic flux of the permanent magnet (1080, 1610). Camera module of an electronic device (700, 1000).

5. In any one of paragraphs 1 to 2, The first protrusion (1623) of the back yoke (1070, 1620) overlaps with the suction yoke (1090) over its entire surface area to shield the leakage magnetic flux of the permanent magnet (1080, 1610). Camera module of an electronic device (700, 1000).

6. In any one of paragraphs 1 through 5, The first protrusion (1623) of the back yoke (1070, 1620) is arranged to cover 25 to 100% of the total area of ​​the lower portion of the permanent magnet (1080, 1610). Camera module of an electronic device (700, 1000).

7. In any one of paragraphs 1 through 6, The suction yoke (1090) is formed in an 'I' shape, an 'H' shape, or a combined 'I' shape and an 'H' shape when viewed from above. Camera module of an electronic device (700, 1000).

8. In any one of paragraphs 1 through 7, The above camera module (700, 1000) is a direct type, a lens lead folded type, or a direct type folded type, Camera module of an electronic device (700, 1000).

9. In electronic devices, A display positioned so that the screen is displayed from the front direction of the electronic device; A digitizer positioned on the back of the above display; and electronic components disposed on the back surface of the above display; and It includes a camera module (700, 1000) configured to capture an image from the rear direction of the electronic device, and The above camera module (700, 1000) is, A lens module (705, 1010) comprising at least one lens configured to move for optical image stabilization (OIS) and autofocus (AF) functions; and A lens driving unit for x-axis, y-axis, and z-axis movement of the above lens module (705, 1010); comprising The lens driving unit comprises a permanent magnet (1080, 1610) disposed on a first carrier (1030), a back yoke (1070, 1620) that binds the first carrier (1030) and the permanent magnet (1080, 1610), and a suction yoke (1090) that absorbs leakage magnetic flux of the permanent magnet (1080, 1610). The first surface of the permanent magnet (1080, 1610) faces the first surface of the back yoke (1070, 1620), and The above back yoke (1070, 1620) includes a first protrusion (1623) protruding from a first surface of the above back yoke (1070, 1620), and The first protrusion (1623) of the back yoke (1070, 1620) is positioned to overlap with at least a portion of the permanent magnet (1080, 1610), An electronic device including a camera module (700, 1000).

10. In Paragraph 9, The first protrusion (1623) of the back yoke (1070, 1620) is positioned to cover at least a portion of the lower part of the permanent magnet (1080, 1610). An electronic device including a camera module (700, 1000).

11. In any one of paragraphs 9 to 10, The suction yoke (1090) is positioned at a certain distance from the permanent magnet (1080, 1610), and When viewed from the optical axis, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are arranged so as not to overlap, thereby shielding the leakage magnetic flux of the permanent magnet (1080, 1610). An electronic device including a camera module (700, 1000).

12. In any one of paragraphs 9 through 11, The suction yoke (1090) is positioned at a certain distance from the permanent magnet (1080, 1610), and When viewed from the optical axis, the first protrusion (1623) of the back yoke (1070, 1620) and the suction yoke (1090) are arranged so that at least a portion overlaps, thereby shielding the leakage magnetic flux of the permanent magnet (1080, 1610). An electronic device including a camera module (700, 1000).

13. In any one of paragraphs 9 through 11, The first protrusion (1623) of the back yoke (1070, 1620) overlaps with the suction yoke (1090) over its entire surface area to shield the leakage magnetic flux of the permanent magnet (1080, 1610). An electronic device including a camera module (700, 1000).

14. In any one of paragraphs 9 through 13, The first protrusion (1623) of the back yoke (1070, 1620) is arranged to cover at least 25% of the total area of ​​the lower portion of the permanent magnet (1080, 1610). An electronic device including a camera module (700, 1000).

15. In any one of paragraphs 9 through 14, The above camera module (700, 1000) is a direct type, a lens lead folded type, or a direct type folded type, An electronic device including a camera module (700, 1000).

Images