Resin composition and use thereof

Abstract

Disclosed in the present application are a resin composition and the use thereof. The resin composition comprises, on the basis of the weight of solids, 50-100 parts by weight of a first component; 5-60 parts by weight of a second component, 5-50 parts by weight of a third component and 0-50 parts by weight of an epoxy resin, wherein the first component is a maleimide resin or a maleimide prepolymer, the second component is a crosslinking agent, the third component is an elastomer, and at least two of the first component, the second component and the third component comprise at least one of defined groups.

Description

Resin Compositions and Their Applications

[0001] This application is based on and claims priority to Chinese Patent Application No. CN202411505221.4, filed on October 25, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application belongs to the field of electronic materials technology, and relates to a resin composition and its application in prepreg, copper-clad laminate, insulating board, insulating film, circuit board and electronic device. Background Technology

[0003] In recent years, with the rapid development of mobile Internet technology, high-density interconnect (HDI) electronic products have placed higher demands on the substrate of their printed circuit boards. In addition to requiring high heat resistance, high modulus and excellent flame retardancy, they also require lower water absorption, lower dielectric constant, lower dielectric loss and lower coefficient of thermal expansion.

[0004] Maleimide resin, as one of the commonly used high-performance resin materials in the copper clad laminate industry, is widely used due to its excellent heat resistance, high modulus, low CTE, electrical insulation, good mechanical properties, and dimensional stability. However, maleimide resin also has disadvantages such as high brittleness, high dielectric constant and dielectric loss, and poor processing performance, which limit its large-scale application.

[0005] The inclusion of any related technologies in this specification does not imply confirmation or recommendation that such related technologies constitute part of the general knowledge of any jurisdiction, or that it is reasonably expected that such related technologies will be understood, regarded as related and / or combined with other related technologies by a person skilled in the art. Summary of the Invention

[0006] The purpose of this application is to provide a resin composition and prepreg, copper-clad laminate, insulating board, insulating film, circuit board and electronic device made from the resin composition.

[0007] To achieve one of the above-mentioned objectives, one embodiment of this application provides a resin composition comprising, by weight of solids:

[0008] The first component is 50-100 parts by weight;

[0009] The second component is 5-60 parts by weight;

[0010] The third component is 5-50 parts by weight;

[0011] 0-50 parts by weight of epoxy resin;

[0012] Wherein, the first component is a maleimide resin or a maleimide prepolymer, the second component is a crosslinking agent, and the third component is an elastomer, wherein at least two of the first component, the second component, and the third component contain at least one of the following groups:

[0013] , , , , , , , X1 is a C1-C5 alkyl group.

[0014] Thus, by using components containing styrene structural units, the compatibility between components in the resin composition can be improved, the dielectric properties of the resin composition can be reduced, the toughness can be increased, the warpage of the sheet can be reduced, and excellent heat resistance and appropriate modulus can be maintained, resulting in excellent comprehensive performance.

[0015] As a further improvement of one embodiment of this application, the first component, the second component, and the third component each contain at least one of the following groups:

[0016] , , , , , , , X1 is a C1-C5 alkyl group.

[0017] When the maleimide resin or maleimide prepolymer, crosslinking agent, and elastomer all contain styrene units, the resin composition can obtain a very homogeneous mixed liquid, which can improve the processability of production and also obtain a low CTE value.

[0018] As a further improvement of one embodiment of this application, the elastomer is a styrene-based elastomer.

[0019] As a further improvement of one embodiment of this application, the elastomer is a hydrogenated or partially hydrogenated styrene-based elastomer.

[0020] As a further improvement of one embodiment of this application, the elastomer is at least one of styrene-butadiene copolymer, styrene-butadiene-styrene copolymer, styrene-pentadiene copolymer, and styrene-pentadiene-styrene copolymer.

[0021] As a further improvement of one embodiment of this application, the elastomer contains epoxy groups, acid anhydride groups or hydroxyl groups.

[0022] As a further improvement to one embodiment of this application, the maleimide resin is at least one of the following structures:

[0023] , structural formula (1), R is selected from hydrogen or C1-C5 alkyl, R' is selected from hydrogen or C1-C5 alkyl, n is an integer from 1 to 20;

[0024] , structural formula (2), R is selected from hydrogen or C1-C5 alkyl, R' is selected from hydrogen or C1-C5 alkyl, n is an integer from 1 to 20;

[0025] , structural formula (3);

[0026] , structural formula (4);

[0027] , structural formula (5);

[0028] Structural formula (6), R1 is methylene, ethylene or R2 is hydrogen, methyl, or ethyl;

[0029] , structural formula (7);

[0030] , structure (8), n is an integer from 1 to 10;

[0031] , structure (9), n is an integer from 1 to 10;

[0032] , structural formula (10), R is hydrogen, methyl or ethyl, n is an integer from 1 to 10.

[0033] As a further improvement of one embodiment of this application, the maleimide resin is at least one of structural formula (1) and structural formula (2).

[0034] As a further improvement of one embodiment of this application, the maleimide prepolymer is selected from at least one of the following: prepolymers of diallyl compounds and maleimide compounds, prepolymers of diamine compounds and maleimide compounds, prepolymers of polyfunctional amines and maleimide compounds, and prepolymers of acidic phenolic compounds and maleimide compounds.

[0035] As a further improvement of one embodiment of this application, the crosslinking agent is at least one selected from triallyl isocyanate monomer, triallyl isocyanate monomer prepolymer, butadiene, styrene, styrene-anhydride copolymer, pentadiene, methacrylate, dicyclopentadienyl methacrylate, norbornene, and cyclopentadiene.

[0036] As a further improvement of one embodiment of this application, the crosslinking agent is a styrene-anhydride copolymer, wherein the molar ratio of styrene to anhydride is 1:1, 2:1, 3:1, 4:1, 6:1 or 8:1.

[0037] As a further improvement to one embodiment of this application, the crosslinking agent has the following structural formula:

[0038] , where m / n = 1~8.

[0039] When a styrene-anhydride copolymer is used as the crosslinking agent, the epoxy groups react with the anhydride groups and retain the styrene groups. The crosslinking agent maintains excellent resin compatibility with maleimide resins or maleimide prepolymers containing styrene structural units and styrene elastomers. This not only inhibits the decline in heat resistance but also improves the processability, resulting in cured products with high heat resistance, low dielectric constant, low CTE, and appropriate modulus values.

[0040] As a further improvement of one embodiment of this application, the epoxy resin is at least one of the following: dicyclopentadiene epoxy resin, phosphorus-containing epoxy resin, isocyanate-modified epoxy resin, bisphenol A type epoxy resin, phenolic epoxy resin, o-cresolic epoxy resin, epoxidized polybutadiene resin, naphthalene-containing epoxy resin, biphenyl type epoxy resin, bisphenol F type epoxy resin, trifunctional epoxy resin, hydrogenated bisphenol A type epoxy resin, and hydrogenated bisphenol F type epoxy resin.

[0041] As a further improvement of one embodiment of this application, the solid weight of the epoxy resin is 5 to 40 parts by weight.

[0042] As a further improvement to one embodiment of this application, the epoxy resin is at least one of the following structural formulas:

[0043] , structural formula (11);

[0044] , structural formula (12);

[0045] , structural formula (13);

[0046] , structural formula (14);

[0047] , structural formula (15);

[0048] , structural formula (16);

[0049] , structural formula (17);

[0050] , structural formula (18);

[0051] , structural formula (19);

[0052] , structural formula (20);

[0053] In the above structural formula, n is an integer from 1 to 10.

[0054] When the epoxy resin adopts a naphthalene-type structure, a good balance can be achieved between the dielectric properties, CTE, heat resistance and modulus of the resin composition, and the resin composition has excellent dielectric properties, CTE, heat resistance and modulus.

[0055] As a further improvement of one embodiment of this application, the resin composition further includes 1 to 50 parts by weight of epoxy resin curing agent, based on solid weight.

[0056] As a further improvement of one embodiment of this application, the epoxy resin curing agent is selected from at least one of amine curing agents, reactive ester curing agents, and phenolic curing agents.

[0057] As a further improvement of one embodiment of this application, the amine curing agent is selected from at least one of diaminodiphenylmethane, bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, diaminobenzophenone, diaminodiphenyl ether, diaminodiphenyl sulfone, diaminobiphenyl, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminobinaphthalene, diaminodiphenylfluorene, diaminoanthraquinone, and dicyandiamide.

[0058] As a further improvement of one embodiment of this application, the active ester curing agent is a dicyclopentadienyl active ester or a naphthyl active ester.

[0059] As a further improvement of one embodiment of this application, the phenolic curing agent is phenolic resin or benzoxazine resin.

[0060] As a further improvement of one embodiment of this application, the resin composition further includes 5 to 40 parts by weight of cyanate ester resin, based on solid weight.

[0061] As a further improvement of one embodiment of this application, the cyanate resin is selected from at least one of bisphenol A type cyanate resin, bisphenol F type cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, cyanate resin containing double bonds, cyanate resin containing phosphorus, phenolic type cyanate resin, biphenyl type cyanate resin, naphthalene ring type cyanate resin, and dicyclopentadiene type cyanate resin.

[0062] As a further improvement of one embodiment of this application, the cyanate ester resin is a monomer, a prepolymer, a polymer, or a mixture of the three.

[0063] As a further improvement of one embodiment of this application, the resin composition further includes 10 to 200 parts by weight of inorganic filler, based on solid weight.

[0064] As a further improvement of one embodiment of this application, the inorganic filler is surface-treated with a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, an epoxysilane coupling agent, or a silane coupling agent containing a double bond.

[0065] As a further improvement of one embodiment of this application, the resin composition further includes 5 to 60 parts by weight of flame retardant, based on solid weight.

[0066] As a further improvement of one embodiment of this application, the resin composition further includes 0.01 to 5 parts by weight of catalyst, based on solid weight.

[0067] This application also provides the use of the above-described resin composition in prepregs, copper-clad laminates, insulating boards, insulating films, circuit boards, and electronic devices.

[0068] Due to the application of the above technical solution, this application has the following advantages compared with the prior art:

[0069] By using components containing styrene structural units, the compatibility between components in the resin composition can be improved, the dielectric properties of the resin composition can be reduced, the toughness can be increased, the warpage of the sheet can be reduced, and excellent heat resistance and appropriate modulus can be maintained, resulting in excellent comprehensive performance.

[0070] As used herein, the term "comprise" and its variations, such as "comprises," "comprised," "comprising," "including," and "containing," do not exclude other features, components, elements, or steps unless the context explicitly requires otherwise. Detailed Implementation

[0071] The technical solution of this application will be further described below with reference to specific implementation methods. The following embodiments are only descriptive and not limiting, and cannot be used to limit the protection scope of this application.

[0072] One embodiment of this application provides a resin composition and its application in prepregs, copper-clad laminates, insulating boards, insulating films, circuit boards, and electronic devices.

[0073] The resin composition, by solid weight, comprises:

[0074] The first component is 50-100 parts by weight;

[0075] The second component is 5-60 parts by weight;

[0076] The third component is 5-50 parts by weight;

[0077] 0-50 parts by weight of epoxy resin;

[0078] Wherein, the first component is a maleimide resin or a maleimide prepolymer, the second component is a crosslinking agent, and the third component is an elastomer, wherein at least two of the first component, the second component, and the third component contain at least one of the following groups:

[0079] , , , , , , , X1 is a C1-C5 alkyl group.

[0080] That is, two of the first component, the second component, and the third component contain at least one of the aforementioned groups, and the at least one of the aforementioned groups contained in one of the components may be the same as or different from the at least one of the aforementioned groups contained in the other component; or, all three components contain at least one of the aforementioned groups, and the at least one of the aforementioned groups contained in any one of the components may be the same as or different from the at least one of the aforementioned groups contained in the other two components.

[0081] Preferably, the first component, the second component, and the third component each contain at least one of the following groups:

[0082] , , , , , , , X1 is a C1-C5 alkyl group.

[0083] In other words, the first component, the second component, and the third component each contain at least one of the aforementioned groups, and at least one of the aforementioned groups contained in any one of the three components may be the same as at least one of the aforementioned groups contained in the other two components, or the three components may be different from each other.

[0084] When the maleimide resin or maleimide prepolymer, crosslinking agent, and elastomer all contain styrene units, the resin composition can obtain a very homogeneous mixed liquid, which can improve the processability of production and also obtain a low CTE value.

[0085] Preferably, the elastomer is a styrene-based elastomer.

[0086] Preferably, the elastomer is a hydrogenated or partially hydrogenated styrene-based elastomer.

[0087] Preferably, the elastomer is at least one of styrene-butadiene copolymer, styrene-butadiene-styrene copolymer, styrene-pentadiene copolymer, and styrene-pentadiene-styrene copolymer.

[0088] Preferably, the elastomer contains epoxy groups, acid anhydride groups, or hydroxyl groups.

[0089] The elastomer can be selected from SEPTON™ 2000 series (2002, 2004, 2005, 2006, 2063, 2104), SEPTON™ 4000 series (4033, 4044, 4055, 4077), HYBRAR™ 7000 series (7125, 7311), SEPTON™ 8000 series (8004, 8006, 8007L, 8851), SEPTON™ V series (9461, 9475), SEPTON™ Q1250 manufactured by KURARE, Japan; the elastomer can also be selected from H1041, H1043, H1051, H1052, H1053, H1221, M1913 manufactured by Asahi Kasei.

[0090] Preferably, the maleimide resin has at least one of the following structures:

[0091] , structural formula (1), R is selected from hydrogen or C1-C5 alkyl, R' is selected from hydrogen or C1-C5 alkyl, n is an integer from 1 to 20;

[0092] , structural formula (2), R is selected from hydrogen or C1-C5 alkyl, R' is selected from hydrogen or C1-C5 alkyl, n is an integer from 1 to 20;

[0093] , structural formula (3);

[0094] , structural formula (4);

[0095] , structural formula (5);

[0096] Structural formula (6), R1 is methylene, ethylene or R2 is hydrogen, methyl, or ethyl;

[0097] , structural formula (7);

[0098] , structure (8), n is an integer from 1 to 10;

[0099] , structure (9), n is an integer from 1 to 10;

[0100] , structural formula (10), R is hydrogen, methyl or ethyl, n is an integer from 1 to 10.

[0101] More preferably, the maleimide resin is at least one of structural formula (1) and structural formula (2).

[0102] Preferably, the maleimide prepolymer is selected from at least one of the following: prepolymers of diallyl compounds and maleimide compounds, prepolymers of diamine compounds and maleimide compounds, prepolymers of polyfunctional amines and maleimide compounds, and prepolymers of acidic phenolic compounds and maleimide compounds.

[0103] The maleimide compounds may be selected from BMI-1000, BMI-1000H, BMI-1100, BMI-1100H, BMI-2000, BMI-2300, BMI-3000, BMI-3000H, BMI-4000H, BMI-5000, BMI-5100, BMI-7000, and BMI-7000H manufactured by Yamato Chemical Co., Ltd., or BMI, BMI-70, and BMI-80 manufactured by KI Chemical Co., Ltd., or MIR-3000 and MIR-5000 manufactured by Nippon Kayaku Co., Ltd., or X9-450 and X9-470 manufactured by DIC Co., Ltd., or D936, D937, D939, and D950 manufactured by Sichuan Dongcai Co., Ltd.

[0104] The preferred maleimide compounds are BMI-2300 manufactured by Yamato Chemical Co., Ltd., BMI-70 and BMI-80 manufactured by KI Chemical Co., Ltd., and MIR-3000 manufactured by Nippon Kayaku Co., Ltd.

[0105] Preferably, the crosslinking agent is at least one selected from triallyl isocyanate monomer, triallyl isocyanate monomer prepolymer, butadiene, styrene, styrene-anhydride copolymer, pentadiene, methacrylate, dicyclopentadienyl methacrylate, norbornene, and cyclopentadiene.

[0106] Preferably, the crosslinking agent is a styrene-anhydride copolymer, wherein the molar ratio of styrene to anhydride is 1:1, 2:1, 3:1, 4:1, 6:1 or 8:1.

[0107] Preferably, the crosslinking agent has the following structural formula:

[0108] , where m / n = 1~8.

[0109] When a styrene-anhydride copolymer is used as the crosslinking agent, the epoxy groups react with the anhydride groups and retain the styrene groups. The crosslinking agent maintains excellent resin compatibility with maleimide resins or maleimide prepolymers containing styrene structural units and styrene elastomers. This not only inhibits the decline in heat resistance but also improves the processability, resulting in cured products with high heat resistance, low dielectric constant, low CTE, and appropriate modulus values.

[0110] Preferably, the epoxy resin is at least one of the following: dicyclopentadiene epoxy resin, phosphorus-containing epoxy resin, isocyanate-modified epoxy resin, bisphenol A type epoxy resin, phenolic epoxy resin, o-cresolic epoxy resin, epoxidized polybutadiene resin, naphthalene-containing epoxy resin, biphenyl type epoxy resin, bisphenol F type epoxy resin, trifunctional epoxy resin, hydrogenated bisphenol A type epoxy resin, and hydrogenated bisphenol F type epoxy resin.

[0111] Preferably, the epoxy resin has a solid weight of 5 to 40 parts by weight.

[0112] Preferably, the epoxy resin is at least one of the following structural formulas:

[0113] , structural formula (11);

[0114] , structural formula (12);

[0115] , structural formula (13);

[0116] , structural formula (14);

[0117] , structural formula (15);

[0118] , structural formula (16);

[0119] , structural formula (17);

[0120] , structural formula (18);

[0121] , structural formula (19);

[0122] , structural formula (20);

[0123] In the above structural formula, n is an integer from 1 to 10.

[0124] When the epoxy resin adopts a naphthalene-type structure, a good balance can be achieved between the dielectric properties, CTE, heat resistance and modulus of the resin composition, and the resin composition has excellent dielectric properties, CTE, heat resistance and modulus.

[0125] The naphthalene-containing epoxy resin can be HP-6000 manufactured by DIC or NC-7000 manufactured by Nippon Kayaku.

[0126] Furthermore, the resin composition further comprises 1 to 50 parts by weight of an epoxy resin curing agent, based on solid weight.

[0127] Preferably, the epoxy resin curing agent is selected from at least one of amine curing agents, reactive ester curing agents, and phenolic curing agents.

[0128] Preferably, the amine curing agent is selected from at least one of diaminodiphenylmethane, bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, diaminobenzophenone, diaminodiphenyl ether, diaminodiphenyl sulfone, diaminobiphenyl, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminodiphenyl sulfone, diaminobinaphthalene, diaminodiphenylfluorene, diaminoanthraquinone, and dicyandiamide.

[0129] Preferably, the active ester curing agent is a dicyclopentadienyl active ester or a naphthyl active ester.

[0130] Preferably, the phenolic curing agent is a phenolic resin or a benzoxazine resin.

[0131] Furthermore, the resin composition further comprises 5 to 40 parts by weight of cyanate ester resin, based on solid weight.

[0132] As an optional option, the cyanate resin is selected from at least one of bisphenol A type cyanate resin, bisphenol F type cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, double bond-containing cyanate resin, phosphorus-containing cyanate resin, phenolic type cyanate resin, biphenyl type cyanate resin, naphthalene ring type cyanate resin, and dicyclopentadiene type cyanate resin.

[0133] Preferably, the cyanate resin is a monomer, a prepolymer, a polymer, or a mixture of the three.

[0134] Furthermore, the resin composition further comprises 10 to 200 parts by weight of inorganic filler, based on solid weight.

[0135] As an optional option, the inorganic filler is selected from at least one of fused silica, crystalline silica, spherical silica, hollow silica, aluminum hydroxide, alumina, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate, mica, and glass fiber powder.

[0136] Preferably, the inorganic filler is spherical silica.

[0137] More preferably, the inorganic filler is surface-treated with a silane coupling agent, wherein the silane coupling agent is at least one of an aminosilane coupling agent, an epoxysilane coupling agent, or a silane coupling agent containing a double bond.

[0138] Furthermore, the resin composition further comprises 5 to 60 parts by weight of flame retardant, based on solid weight.

[0139] As an optional option, the flame retardant is at least one of the following: brominated flame retardants, phosphorus-based flame retardants, nitrogen-based flame retardants, organosilicon flame retardants, and organometallic salt flame retardants.

[0140] As an alternative, the brominated flame retardant is selected from decabromodiphenyl ether, decabromodiphenyl ethane, styrene bromide, or tetrabromophthalamide.

[0141] As an optional embodiment, the phosphorus-based flame retardant is selected from inorganic phosphorus, condensed phosphate compounds, phosphoric acid compounds, hypophosphoric acid compounds, phosphorus oxide compounds, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tris(2,6-dimethylphenyl)phosphine, etc. (m is an integer from 1 to 5) Phosphazene or modified phosphazene.

[0142] As an alternative, the flame retardant is a condensed phosphate ester, hypophosphite, or a bisDOPO compound.

[0143] Furthermore, the resin composition further comprises 0.01 to 5 parts by weight of catalyst, based on solid weight.

[0144] As an alternative, the catalyst is at least one of imidazole catalysts, organophosphorus catalysts, pyridine catalysts, and organometallic salt catalysts.

[0145] As an alternative, the catalyst is at least one selected from 4-dimethylaminopyridine, 2-methylimidazole, 2-ethyl-4-methylimidazole, triphenylphosphine, 2-phenylimidazole and zinc octanoate.

[0146] This application also provides the application of the above-mentioned resin composition in prepregs, copper-clad laminates, insulating boards, insulating films, circuit boards, and electronic devices, as detailed below:

[0147] This application also provides a semi-cured sheet comprising a reinforcing material and the aforementioned resin composition; the resin composition is coated on the reinforcing material.

[0148] The method for preparing the prepreg is as follows: the aforementioned resin composition is dissolved in a solvent to form an adhesive solution, and then the adhesive solution is coated onto the reinforcing material by impregnation. The impregnated reinforcing material is then taken out and baked at a temperature of 100~180℃ for 1~15 minutes. After drying, the prepreg is obtained.

[0149] As an alternative, the solvent is selected from at least one of acetone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0150] As an alternative, the reinforcing material is selected from at least one of natural fibers, organic synthetic fibers, organic fabrics, and inorganic fabrics.

[0151] Preferably, the reinforcing material is glass fiber cloth. The glass fiber cloth is preferably open-fiber cloth or flat cloth. More preferably, the glass fiber cloth is E-glass fiber cloth, S-glass fiber cloth, T-glass fiber cloth, or Q-glass fiber cloth.

[0152] Furthermore, when the reinforcing material is glass fiber cloth, the glass fiber cloth is pre-treated with a coupling agent to improve the interfacial bonding between the resin composition and the glass fiber cloth. Preferably, the coupling agent used here is an epoxy silane coupling agent or an amino silane coupling agent to provide good water resistance and heat resistance.

[0153] This application also provides a copper-clad laminate, comprising a prepreg and a metal foil disposed on at least one surface of the prepreg; or comprising a composite sheet formed by stacking multiple prepregs and a metal foil disposed on at least one surface of the composite sheet.

[0154] The copper-clad laminate is prepared by: covering one or both surfaces of a prepreg with metal foil, or stacking at least two prepregs to form a composite sheet, covering one or both surfaces of the composite sheet with metal foil, and hot-pressing to obtain the copper-clad laminate. The hot-pressing conditions are: pressure of 0.2~2MPa, temperature of 150~250℃, and pressing time of 2~4h.

[0155] Preferably, the metal foil is selected from copper foil or aluminum foil. The thickness of the metal foil is 5μm, 8μm, 12μm, 18μm, 35μm or 70μm.

[0156] This application also provides an insulating board comprising at least one of the aforementioned prepreg sheets.

[0157] This application also provides an insulating film, including a carrier film and the aforementioned resin composition coated thereon.

[0158] The insulating film is prepared by the following method: the aforementioned resin composition is dissolved in a solvent to form an adhesive solution, which is then coated onto a carrier film. After the carrier film coated with the adhesive solution is heated and dried, the insulating film is obtained.

[0159] As an alternative, the solvent is selected from at least one of acetone, butanone, methyl isobutyl ketone, N,N-dimethylformamide, N,N-dimethylacetamide, ethylene glycol methyl ether, propylene glycol methyl ether, benzene, toluene, xylene, and cyclohexane.

[0160] As an alternative, the carrier film is selected from at least one of PET film, PP film, PE film, and PVC film.

[0161] This application also provides a circuit board, including at least one of the aforementioned prepreg, copper-clad laminate, insulating board, and insulating film.

[0162] This application also provides an electronic device, including the aforementioned circuit board.

[0163] This application provides a resin composition and its application in prepregs, copper-clad laminates, insulating boards, insulating films, circuit boards, and electronic devices.

[0164] The technical solution of this application will be further described below with reference to some specific preparation examples, embodiments, and comparative examples. Of course, these embodiments are only a part of the many variations contained in the implementation of this application, and not all of them.

[0165] Preparation Example 1

[0166] Step (1): Take 242.4g of 2-ethylaniline, 242g of xylene and 80g of activated clay, add them to the reaction flask and stir evenly. Then heat to 125℃ and react for 30min. Then take 272g of DVB810 (in which the molar ratio of divinylbenzene to ethylstyrene is 81:19) and add it dropwise over 2h. Continue to react for 1h. Then heat to 185℃ and react for 4h to obtain the intermediate amine compound.

[0167] Step (2): Take 117.7g of maleic acid and 700g of toluene, stir evenly at room temperature, add 214g of intermediate amine compound and 175g of DMF solvent and mix, then react for 2h, add 37.1g of p-toluenesulfonic acid hydrate, heat to 120℃, and then carry out dehydration, neutralization and vacuum distillation to obtain concentrated maleimide compound, i.e. maleimide resin A.

[0168] Preparation Example 2

[0169] Maleimide prepolymer B was prepared by reacting 100g of maleimide resin (BMI-2300 manufactured by Daiwa Kasei Corporation) with 60g of diallyl bisphenol A at 110°C for 90min.

[0170] Examples and Comparative Examples

[0171] The chemical composition and content of the resin compositions of Examples 1-5 and Comparative Examples 1-4 are shown in Table 1.

[0172] Table 1

[0173]

[0174] In this study, maleimide resin A was prepared in Preparation Example 1, maleimide prepolymer B was prepared in Preparation Example 2, maleimide resin C was BMI-2300 manufactured by Daiwa Chemical Co., Ltd., crosslinking agent A was TAIC, crosslinking agent B was EF40 manufactured by Sartomer (USA), elastomer A was V9475 manufactured by KURARE, elastomer B was M1913 manufactured by Asahi Kasei, elastomer C was methacrylate manufactured by KURARE, cyanate ester resin was bisphenol A type cyanate ester resin manufactured by Tianqi, epoxy resin was HP6000 manufactured by DIC, catalyst was 2-ethyl-4-methylimidazolium manufactured by Shikoku Chemical Co., Ltd., and inorganic filler was spherical silica manufactured by Lianrui. 50 =3μm.

[0175] The above embodiments and comparative examples also prepared semi-cured sheets, comprising E-glass fiber cloth as a reinforcing material and a resin composition coated onto the glass fiber cloth by an impregnation method. The glass fiber cloth was a pre-treated open-fiber cloth using an epoxy silane coupling agent.

[0176] Specifically, the components of the resin compositions of Examples 1-5 and Comparative Examples 1-4 were dissolved in methyl ethyl ketone, stirred and mixed, and then diluted to a 65wt% solid content solution. The E-glass fiber cloth, which is used as a reinforcing material, was pretreated with an epoxy silane coupling agent, then impregnated in the above syrup. After impregnation, it was taken out and placed in a forced-air drying oven at 160°C for 3-6 minutes to obtain a semi-cured sheet.

[0177] The above embodiments and comparative examples also produced copper-clad laminates, which were prepared by the following method:

[0178] Take the above-mentioned prepreg, cut it to 300×300mm, and stack it into a composite sheet with a certain stacking structure. Then, place a low profile electrolytic copper foil with a thickness of 12μm on each side of the composite sheet, place it in a vacuum hot press, and hot press it for 1.5h under the conditions of pressure of 1.5MPa and temperature of 220℃ to obtain copper-clad laminate.

[0179] The above embodiments and comparative examples also prepared an insulating board, including at least one of the aforementioned prepreg sheets.

[0180] The above embodiments and comparative examples also prepared insulating films, including a carrier film and the aforementioned resin composition coated thereon.

[0181] The above embodiments and comparative examples also prepared circuit boards, including one of the above-mentioned prepregs, which were prepared using conventional preparation methods of the prior art, and will not be described in detail here.

[0182] The copper-clad laminates obtained in Examples 1-5 and Comparative Examples 1-4 were subjected to performance testing, and the test results are shown in Table 2. The performance testing methods included:

[0183] (1) Glass transition temperature (Tg): The test was performed using the DMA (thermomechanical analysis) method according to the method specified in IPC-TM-650 2.4.25, with a heating rate of 10℃ / min and a frequency of 10Hz.

[0184] (2) CTE (X / Y axis): TMA was used, the heating rate was 5℃ / min, and the test temperature range was 50~120℃;

[0185] (3) Dk and Df: The dielectric constant Dk and dielectric loss Df at 10 GHz were determined using the plate method according to IPC-TM-650 2.5.5.9.

[0186] (4) Modulus: The DMA (thermomechanical analysis) method was used to test the modulus according to the method specified in IPC-TM-650 2.4.24.4;

[0187] (5) Substrate quality: When there are no resin agglomerates larger than 10μm inside the substrate, it is indicated as О; when there are a small amount of resin agglomerates larger than 10μm inside the substrate, it is indicated as Δ; when there are a large amount of resin agglomerates larger than 10μm inside the substrate, it is indicated as Ⅹ.

[0188] Table 2

[0189]

[0190] Referring to Table 2, compared with the comparative examples, the resin compositions of the embodiments of this application have excellent compatibility and processability, and the copper-clad laminates further prepared not only have excellent heat resistance, low dielectric constant and dielectric loss value, but also have appropriate modulus value.

[0191] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0192] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application, and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

Claims

1. A resin composition, characterized in that, By solid weight, including: The first component is 50-100 parts by weight; The second component is 5-60 parts by weight; The third component is 5-50 parts by weight; 0-50 parts by weight of epoxy resin; Wherein, the first component is a maleimide resin or a maleimide prepolymer, the second component is a crosslinking agent, and the third component is an elastomer, wherein at least two of the first component, the second component, and the third component contain at least one of the following groups: 、 、 、 、 、 、 、 X1 is a C1-C5 alkyl group.

2. The resin composition according to claim 1, characterized in that, The first component, the second component, and the third component each contain at least one of the following groups: 、 、 、 、 、 、 、 X1 is a C1-C5 alkyl group.

3. The resin composition according to claim 1, characterized in that, The elastomer is a styrene-based elastomer.

4. The resin composition according to claim 1, characterized in that, The elastomer is at least one of styrene-butadiene copolymer, styrene-butadiene-styrene copolymer, styrene-pentadiene copolymer, and styrene-pentadiene-styrene copolymer.

5. The resin composition according to claim 1, characterized in that, The elastomer contains epoxy groups, acid anhydride groups, or hydroxyl groups.

6. The resin composition according to claim 1, characterized in that, The maleimide resin has at least one of the following structures: , structural formula (1), R is selected from hydrogen or C1-C5 alkyl, R' is selected from hydrogen or C1-C5 alkyl, n is an integer from 1 to 20; , structural formula (2), R is selected from hydrogen or C1-C5 alkyl, R' is selected from hydrogen or C1-C5 alkyl, n is an integer from 1 to 20; , structural formula (3); , structural formula (4); , structural formula (5); Structural formula (6), R1 is methylene, ethylene or R2 is hydrogen, methyl, or ethyl; , structural formula (7); , structure (8), n is an integer from 1 to 10; , structure (9), n is an integer from 1 to 10; , structural formula (10), R is hydrogen, methyl or ethyl, n is an integer from 1 to 10.

7. The resin composition according to claim 1, characterized in that, The maleimide prepolymer is selected from at least one of the following: prepolymers of diallyl compounds and maleimide compounds, prepolymers of diamine compounds and maleimide compounds, prepolymers of polyfunctional amines and maleimide compounds, and prepolymers of acidic phenolic compounds and maleimide compounds.

8. The resin composition according to claim 1, characterized in that, The crosslinking agent is at least one of triallyl isocyanate monomer, triallyl isocyanate monomer prepolymer, butadiene, styrene, styrene-anhydride copolymer, pentadiene, methacrylate, dicyclopentadienyl methacrylate, norbornene, and cyclopentadiene.

9. The resin composition according to claim 8, characterized in that, The crosslinking agent is a styrene-anhydride copolymer, wherein the molar ratio of styrene to anhydride is 1:1, 2:1, 3:1, 4:1, 6:1 or 8:

1.

10. The resin composition according to claim 1, characterized in that, The epoxy resin is at least one of the following: dicyclopentadiene epoxy resin, phosphorus-containing epoxy resin, isocyanate-modified epoxy resin, bisphenol A type epoxy resin, phenolic epoxy resin, o-cresol epoxy resin, epoxidized polybutadiene resin, naphthalene-containing epoxy resin, biphenyl type epoxy resin, bisphenol F type epoxy resin, trifunctional epoxy resin, hydrogenated bisphenol A type epoxy resin, and hydrogenated bisphenol F type epoxy resin.

11. The resin composition according to claim 1, characterized in that, The epoxy resin is at least one of the following structural formulas: , structural formula (11); , structural formula (12); , structural formula (13); , structural formula (14); , structural formula (15); , structural formula (16); , structural formula (17); , structural formula (18); , structural formula (19); , structural formula (20); In the above structural formula, n is an integer from 1 to 10.

12. The resin composition according to claim 1, characterized in that, The resin composition further comprises, by solid weight, 1 to 50 parts by weight of an epoxy resin curing agent, wherein the epoxy resin curing agent is selected from at least one of amine curing agents, reactive ester curing agents, and phenolic curing agents.

13. The resin composition according to claim 1, characterized in that, It also includes 5 to 40 parts by weight of cyanate ester resin on a solid basis.

14. The resin composition according to claim 13, characterized in that, The cyanate resin is selected from at least one of the following: bisphenol A type cyanate resin, bisphenol F type cyanate resin, bisphenol S type cyanate resin, bisphenol E type cyanate resin, bisphenol M type cyanate resin, cyanate resin containing double bonds, cyanate resin containing phosphorus, phenolic type cyanate resin, biphenyl type cyanate resin, naphthalene ring type cyanate resin, and dicyclopentadiene type cyanate resin.

15. The use of a resin composition according to any one of claims 1 to 14 in prepreg, copper clad laminate, insulating board, insulating film, circuit board and electronic device.

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