Lamella transfer device and lamella transfer method

Abstract

The present invention makes it possible to stably acquire a lamella LM from a sample SAM and suppresses adhesion of the lamella LM to tweezers 16 when the lamella LM is to be mounted on a holder 21. A lamella LM that has been formed at a sample SAM is grasped by tweezers 16 that thereby enter a first grasping state. The lamella LM is picked from the sample SAM by moving the tweezers 16 as in the first grasping state. The lamella LM is fixed at a grasp adjustment member AM1. The tweezers 16 are opened to release the lamella LM from the tweezers 16. The tweezers 16 are moved, the lamella LM is re-grasped by the tweezers 16, and the tweezers 16 thereby enter a second grasping state. The lamella LM is released from the grasp adjustment member AM1 by moving the tweezers 16 as in the second grasping state. The lamella LM is mounted on a holder 21.

Description

Lamella Transfer Device and Method for Transferring Lamella

[0001] The present invention relates to a lamella transfer device and a method for transferring a lamella.

[0002] In recent years, with the miniaturization and high integration of semiconductor devices, their internal structures have become more complex. Therefore, when analyzing defects in semiconductor devices, in order to perform analysis with higher spatial resolution, for example, a transmission electron microscope (TEM: Transmission Electron Microscope) is used.

[0003] In order to produce a plate-like thin sample piece (lamella) to be observed, for example, a FIB-SEM composite device having both the functions of a focused ion beam (FIB: Focused Ion Beam) device and a scanning electron microscope (SEM: Scanning Electron Microscope) is used. Also, the operation of transferring the lamella produced by the FIB-SEM composite device to a holder for observation with a TEM device is performed by a lamella transfer device.

[0004] For example, Patent Document 1 discloses a lamella transfer device including a light source lens barrel and an observation lens barrel. In this lamella transfer device, the process of obtaining a lamella from a sample and mounting the lamella on a holder is automatically repeated using tweezers.

[0005] International Publication No. 2022 / 163042

[0006] When mounting a lamella on a holder, the lamella may be adsorbed by the tweezers, making it impossible to continue the lamella transfer operation. Considering the automation of the transfer operation, it is necessary to be able to quickly perform a recovery operation and return to the normal state when the transfer fails. Also, although the posture of the lamella during adsorption varies depending on the situation, it is necessary to stably perform a recovery operation for lamellas in various postures.

[0007] For example, when gripping a fine lamella, the adsorption force depends on the contact area, and it is considered that the van der Waals force becomes dominant. The van der Waals force increases as the distance between objects decreases. Therefore, the size of the contact area is proportional to the size of the van der Waals force.

[0008] One possible method to suppress lamellae adsorption to tweezers is to reduce the contact area between the tweezers and the lamellae. However, reducing the contact area can lead to a decrease in operational stability when acquiring lamellae from a sample. For example, lamellae are connected to a joint that is part of the sample, but if the contact area between the tweezers and the lamellae is insufficient, sufficient force may not be transmitted to the joint, making it difficult to separate the lamellae from the joint, and potentially preventing their acquisition.

[0009] The main object of this application is to provide a technology that enables the stable acquisition of lamellae from a sample in order to continue the lamellae relocation work, and that suppresses the adhesion of lamellae to tweezers when loading them into a holder. Other issues and novel features will become apparent from the description herein and the accompanying drawings.

[0010] A brief overview of some of the representative embodiments disclosed in this application is as follows:

[0011] A lamella relocation device in one embodiment includes tweezers for gripping lamellae, a holder for mounting the lamellae, and a gripping adjustment member. The lamellae prepared on the sample is gripped by the tweezers to put the tweezers into a first gripping state. In the first gripping state, the lamellae is retrieved from the sample by moving the tweezers. The retrieved lamellae is fixed to the gripping adjustment member. With the lamellae fixed to the gripping adjustment member, the tweezers are released to detach them from the lamellae. After the tweezers are released, they are moved to grip the lamellae again with the tweezers, putting the tweezers into a second gripping state. In the second gripping state, the tweezers are moved to detach the lamellae from the gripping adjustment member, and the detached lamellae is mounted on the holder.

[0012] A method for relocating lamellae in one embodiment includes: (a) preparing a sample on which lamellae have been fabricated; (b) after step (a), placing the tweezers in a first gripping state by grasping the lamellae with tweezers; (c) after step (b), acquiring the lamellae from the sample by moving the tweezers in the first gripping state; (d) after step (c), fixing the lamellae to the gripping adjustment member; and (e) after step (d), fixing the lamellae to the gripping adjustment member. The process includes: (f) releasing the tweezers in a fixed state to detach the tweezers from the lamella; (g) after step (e), moving the tweezers to grip the lamella again with the tweezers to put the tweezers into a second gripping state; (h) after step (g), moving the tweezers in the second gripping state to detach the lamella from the gripping adjustment member; and (g) after step (g), mounting the lamella onto the holder.

[0013] According to one embodiment, lamellae can be stably obtained from the sample, and when the lamellae are loaded into the holder, the lamellae's adhesion to the tweezers can be suppressed. Therefore, the lamellae transfer operation can be continued.

[0014] This is a schematic diagram showing the lamellar observation system in Embodiment 1. This is a schematic diagram showing the lamellar relocation device in Embodiment 1. This is a plan view showing the holder in Embodiment 1. This is a perspective view showing the gripping adjustment member, lamellars, and tweezers in Embodiment 1. This is a flowchart showing the method for relocating the lamellars in Embodiment 1. This is a perspective view showing the sample and lamellars in Embodiment 1. This is a perspective view showing the process of acquiring lamellars from a sample in Embodiment 1. This is a perspective view showing the process of fixing the lamellars to the gripping adjustment member in Embodiment 1. This is a perspective view showing the process of detaching the tweezers from the lamellars in Embodiment 1. This is a perspective view showing the process of re-gripping the lamellars with the tweezers in Embodiment 1. This is a perspective view showing the process of detaching the tweezers and lamellars from the gripping adjustment member in Embodiment 1. This is a side view showing the process of mounting the lamellars onto the holder in Embodiment 1. This is a side view showing the process of retracting the tweezers from the holder in Embodiment 1. This is a perspective view showing the gripping adjustment member, lamellars, and tweezers in Embodiment 2. This is a perspective view showing the process of fixing the lamellars to the gripping adjustment member in Embodiment 2. This is a perspective view showing the step of detaching the tweezers from the lamella in Embodiment 2. This is a perspective view showing the step of re-gripping the lamella with the tweezers in Embodiment 2. This is a perspective view showing the step of detaching the tweezers and lamella from the gripping adjustment member in Embodiment 2. This is a side view showing the step of mounting the lamella onto the holder in the study example. This is a side view showing the step of retracting the tweezers from the holder in the study example.

[0015] The embodiments will be described in detail below with reference to the drawings. In all the drawings used to describe the embodiments, the same reference numerals are used for members having the same function, and repeated descriptions of them will be omitted. In addition, in the following embodiments, descriptions of the same or similar parts will not be repeated unless it is particularly necessary.

[0016] Furthermore, the X, Y, and Z directions described in this application intersect and are orthogonal to each other. In this application, the Z direction may also be described as the vertical direction, and the X or Y direction as the horizontal direction.

[0017] (Embodiment 1) <Lamellar Observation System> The lamellar observation system 100 in Embodiment 1 will be described below with reference to Figure 1. As shown in Figure 1, the lamellar observation system 100 comprises a FIB-SEM combined device 1, a lamellar relocation device 2, and a TEM device 3.

[0018] In the FIB-SEM combined device 1, a portion of the sample SAM is processed to produce a lamellar LM. The sample SAM containing the lamellar LM is transported from the FIB-SEM combined device 1 to the lamellar transfer device 2. In the lamellar transfer device 2, the lamellar LM is obtained from the sample SAM and mounted on the holder 21. The holder 21 containing the lamellar LM is transported from the lamellar transfer device 2 to the TEM device 3. In the TEM device 3, the lamellar LM is observed.

[0019] In Embodiment 1, the sample SAM is exemplified by a wafer on which various semiconductor devices are formed. For example, the sample SAM consists of a semiconductor substrate on which p-type or n-type impurity regions are formed, semiconductor elements such as transistors formed on the semiconductor substrate, and wiring layers formed on the semiconductor elements. Since the lamellar LM is a plate-like thin piece obtained from a part of the sample SAM, the lamellar LM includes all or part of the semiconductor substrate, semiconductor elements, and wiring layers. Furthermore, the sample SAM may be a structure used in technologies other than semiconductor technology.

[0020] <Lamellar relocation device> As shown in Figure 2, the lamellar relocation device 2 comprises an optical system 4, a microscope tube drive mechanism 14, a sample transport device 15, tweezers 16, a tweezers drive mechanism 17, a control device 18, an input device 19, a display device 20, a holder 21 for lamellae, a gripping adjustment member AM1, and a gripping adjustment member AM2.

[0021] Optical system 4 is, for example, a white light interference microscope. Optical system 4 includes a light-emitting light source 5, a filter 6, a first beam splitter 7, a second beam splitter 8, a first objective lens 9, a second objective lens 10, a fixed mirror 11, a third objective lens 12, and a photodetector 13. Optical system 4 separates the light emitted from the light source 5 to irradiate the object to be observed and the reference surface with light, and forms an interference image as interference light L3, which is a combination of reflected light L1R reflected from the object to be observed and reference light L2 reflected from the reference surface.

[0022] In other words, the light L0 emitted from the light source 5 passes through the filter 6 and is reflected by the first beam splitter 7. The reflected light L0 is separated by the second beam splitter 8 into light L1 directed toward the sample SAM, which is the object of observation, and reference light L2 directed toward the fixed mirror 11, which is the reference plane. Light L1 passes through the first objective lens 9, strikes the sample SAM, and is reflected as reflected light L1R. Reference light L2 passes through the second objective lens 10, strikes the fixed mirror 11, and is reflected. The reflected light L1R and the reference light L2 reflected by the fixed mirror 11 are combined by the second beam splitter 8 as interference light L3. The interference light L3 is detected by the photodetector 13. The photodetector 13 forms an interference image of the interference light L3 and outputs the image signal of the interference image to the control device 18.

[0023] The intensity of the interference light L3 changes depending on the phase difference between the reflected light L1R and the reference light L2 when they are combined in the second beam splitter 8. When the phase difference is in phase, the intensity of the interference light L3 is at its maximum. Conversely, as the phase difference approaches opposite phase, the intensity of the interference light L3 decreases.

[0024] Under the condition that the distance between the second beam splitter 8 and the fixed mirror 11 is constant, the optical system 4 is moved in the Z direction by the mirror tube drive mechanism 14, and by changing the distance of the optical path of light L1, the phase difference between the reflected light L1R and the reference light L2 changes, and the intensity of the interference light L3 changes. From the change in the intensity of the interference light L3, information about the position of the object in the Z direction and the shape of the object can be obtained.

[0025] The control device 18 is, for example, a processor, and is an arithmetic processing unit that includes multiple semiconductor circuits such as a CPU. The control device 18 is electrically connected to the light source 5, photodetector 13, microscope tube drive mechanism 14, sample transport device 15, tweezers drive mechanism 17, input device 19, and display device 20, and controls them. In other words, each control and operation performed by the lamellar relocation device 2 is performed by the control device 18. The control device 18 also has a memory that stores various information performed by the lamellar relocation device 2.

[0026] The microscope tube drive mechanism 14 moves the optical system 4 vertically (Z direction) to change the distance between the optical system 4 and the sample transport device 15. The control device 18 controls the drive of the microscope tube drive mechanism 14.

[0027] The sample transport device 15 can be equipped with a sample SAM, a holder 21, a gripping adjustment member AM1, and a gripping adjustment member AM2. The sample SAM, which includes the lamellar LM fabricated in the FIB-SEM combined device 1, is transported onto the sample transport device 15. The sample transport device 15 can also be moved laterally (X direction, Y direction) under the control of the control device 18. By moving the sample transport device 15, the observation target of the optical system 4 can be changed.

[0028] The holder 21 is used to mount the lamellar LM acquired from the sample SAM. After the lamellar LM is mounted in the holder 21, the holder 21 containing the lamellar LM is transported to the TEM apparatus 3.

[0029] As shown in Figure 3, the holder 21 has a grid frame 22 and a film 23. The grid frame 22 is a disc-shaped substrate with multiple holes formed in it. The film 23 is formed on the surface of the grid frame 22 so as to cover the multiple holes. The film 23 is, for example, a carbon film or a polymer resin film and has the property of transmitting electrons.

[0030] The lamellars LM are placed on the membrane 23 such that, in a plan view perpendicular to the direction in which the lamellars LM are pressed against the membrane 23 (Z direction), each lamellar LM is located within a single pore. In other words, multiple lamellars LM are placed on the membrane 23 such that, in a plan view perpendicular to the Z direction, each of the multiple lamellars LM is located within a separate pore.

[0031] The input device 19 is, for example, a keyboard or a mouse. By using the input device 19 to work on the display device 20, the user can send instructions to the control device 18 for each operation performed by, for example, the light source 5, the microscope tube drive mechanism 14, the sample transport device 15, and the tweezers drive mechanism 17.

[0032] The display device 20 displays various screens as a graphical user interface (GUI). For example, the GUI may include a screen that displays the emission conditions of light L0, a screen that displays the coordinates of the optical system 4 and the sample transport device 15, or a screen that displays the interference image. The GUI may also include screens for performing operations such as zooming in, zooming out, moving, and rotating the interference image.

[0033] The tweezers 16 consist of a pair of arms and are used to grasp the lamellar LM between the pair of arms. The tweezers 16 are made of, for example, silicon and a silicon oxide film covering the silicon. The distance between the pair of arms of the open tweezers 16 is, for example, 7 μm.

[0034] The tweezers drive mechanism 17 is electrically connected to the tweezers 16 and can move and control the orientation of the tweezers 16. For example, the tweezers 16, tilted at an arbitrary angle, can be translated in the X, Y, and Z directions while maintaining that position, and can rotate around the arm as an axis. The control device 18 controls the drive of the tweezers drive mechanism 17. Note that the means for transporting the lamellar LM is not limited to the tweezers 16; for example, a glass probe or a suction probe may also be used.

[0035] As shown in Figure 4, gripping adjustment members AM1 and AM2 are used when the lamellar LM is gripped with the tweezers 16, then the tweezers 16 are released, and then the lamellar LM is gripped again with the tweezers 16. In Embodiment 1, gripping adjustment member AM1 is used. Grip adjustment member AM2 will be described in Embodiment 2 below.

[0036] The gripping adjustment member AM1 has a base material 30 and grooves 31 formed in the base material 30. The base material 30 is made of, for example, silicon. For example, grooves 31 can be formed in the base material 30 by selectively etching a part of the silicon substrate using a plasma processing apparatus. Note that multiple grooves 31 may be formed in the base material 30.

[0037] The lamellar LM can be fixed in place by housing a portion of it inside the groove 31. For example, the lamellar LM is fixed to the gripping adjustment member AM1 from the time the tweezers 16 are released until the lamellar LM is gripped again by the tweezers 16.

[0038] <Method for relocating the lamellae> Steps S1 to S8 included in the method for relocating the lamellae LM in Embodiment 1 will be explained below with reference to Figure 5. Figures 6 to 13 will be used as needed when explaining each step S1 to S8. Steps S2 to S8 are performed automatically by the lamellae relocation device 2.

[0039] In step S1, a sample SAM with a lamellar LM is prepared. First, as shown in Figure 6, a lamellar LM is fabricated in the FIB-SEM combined device 1 by processing a part of the sample SAM. The sample SAM has a connecting part SAMa as part of the sample SAM. At this point, the lamellar LM is connected to the connecting part SAMa, and the lamellar LM and the sample SAM are integrated. Next, the sample SAM with the fabricated lamellar LM is transported from the FIB-SEM combined device 1 to the lamellar transfer device 2, and the sample SAM is placed on the sample transport device 15.

[0040] In step S2, as shown in Figure 7, the tweezers 16 are closed and the lamellar LM is grasped by the tweezers 16, thereby putting the tweezers 16 into a first gripping state. Then, in the first gripping state, the tweezers 16 are moved to acquire the lamellar LM from the sample SAM. The force applied when the tweezers 16 are moved separates the lamellar LM from the connecting part SAMa.

[0041] First, the control device 18 controls the sample transport device 15 and the tweezers drive mechanism 17 while referring to the interference image output from the photodetector 13. That is, the control device 18 moves the sample SAM and the tweezers 16 so that the lamellar LM fabricated on the sample SAM and the tip of the tweezers 16 are simultaneously detected in the interference image.

[0042] Next, the control device 18 moves the optical system 4 in the Z direction using the lens barrel drive mechanism 14, and measures the positions of the sample SAM and tweezers 16 in the Z direction based on the interference image output from the photodetector 13. Based on the measured position information of the sample SAM and tweezers 16, the control device 18 moves the tweezers 16 to a position where the lamellar LM can be grasped. Next, the tweezers 16 are closed to grasp the lamellar LM (first grasping state).

[0043] Next, in the first gripping state, the control device 18 moves the tweezers 16 by the tweezers drive mechanism 17 so that the lamellar LM is separated from the connecting portion SAMa. This allows the lamellar LM to be acquired from the sample SAM. Note that the contact area between the tweezers 16 and the lamellar LM in the first gripping state is relatively large, and is larger than the contact area between the tweezers 16 and the lamellar LM in the second gripping state, which will be described later. Therefore, sufficient force is transmitted to the connecting portion SAMa, making it easier to separate the lamellar LM from the connecting portion SAMa.

[0044] Next, the control device 18 retracts the tweezers 16 in the Z direction by the tweezers drive mechanism 17 to a height at which the tweezers 16 do not contact the sample SAM. Next, the control device 18 moves the holder 21 by the sample transfer device 15 and moves the tweezers 16 by the tweezers drive mechanism 17 while referring to the interference image output from the photodetector 13 so that the lamella LM exists above the planned lamella mounting position of the holder 21.

[0045] In step S3, the control device 18 moves the gripping adjustment member AM1 by the sample transfer device 15 and moves the tweezers 16 by the tweezers drive mechanism 17 while referring to the interference image output from the photodetector 13 so that the lamella LM exists above the gripping adjustment member AM1. That is, the control device 18 moves the gripping adjustment member AM1 and the tweezers 16 so that the gripping adjustment member AM1 and the tip of the tweezers 16 are simultaneously detected in the interference image.

[0046] In step S4, first, the control device 18 measures the position of the gripping adjustment member AM1, the position of the tweezers 16, and the position of the lamella LM based on the interference image output from the photodetector 13 while moving the optical system 4 in the Z direction by the lens barrel drive mechanism 14. Next, the control device 18 moves the tweezers 16 by the tweezers drive mechanism 17 and lowers the tweezers 16 in the Z direction so that the lamella LM fits into the groove 31 of the gripping adjustment member AM1 based on the measured position information.

[0047] In step S5, as shown in FIG. 8, the control device 18 lowers the tweezers 16 in the Z direction by the tweezers drive mechanism 17 until a part of the lamella LM is accommodated inside the groove 31, and fixes the lamella LM to the gripping adjustment member AM1.

[0048] In step S6, as shown in FIG. 9, with the lamella LM fixed to the gripping adjustment member AM1, the control device 18 releases the clamp 16 to detach the clamp 16 from the lamella LM. While moving the optical system 4 in the Z direction by the lens barrel drive mechanism 14, the control device 18 measures the Z-direction positions of the lamella LM and the clamp 16 based on the interference image output from the photodetector 13. Thereafter, the control device 18 moves the clamp 16 by the clamp drive mechanism 17, for example, raises the clamp 16 in the Z direction.

[0049] In step S7, first, as shown in FIG. 10, the clamp 16 is closed and the lamella LM is gripped again by the clamp 16 to bring the clamp 16 into the second gripping state. The contact area between the clamp 16 and the lamella LM in the second gripping state is relatively small and smaller than the contact area between the clamp 16 and the lamella LM in the first gripping state of step S2.

[0050] When the lamella LM is obtained from the sample SAM in step S2, the posture of the lamella LM may not be ideal, for example, the lamella LM may be rotated. Even in such a case, the posture of the lamella LM can be adjusted by fixing the lamella LM to the gripping adjustment member AM1, once releasing the clamp 16, and gripping the lamella LM again with the clamp 16.

[0051] Next, as shown in FIG. 11, the control device 18 moves the clamp 16 in the second gripping state by the clamp drive mechanism 17 to detach the lamella LM from the gripping adjustment member AM1. Thereafter, while referring to the interference image output from the photodetector 13 so that the lamella LM exists above the lamella mounting planned position of the holder 21, the control device 18 moves the holder 21 by the sample transfer device 15 and moves the clamp 16 by the clamp drive mechanism 17.

[0052] In step S8, as shown in FIGS. 12 and 13, the lamella LM is mounted on the holder 21. In FIGS. 12 and 13, only one arm of the clamp 16 is shown for easy viewing of the lamella LM.

[0053] First, as shown in Figure 12, the control device 18, in the second gripping state, lowers the tweezers 16 in the Z direction using the tweezers drive mechanism 17 until the lamellar LM contacts the holder 21. As the film 23 of the holder 21 deforms upon contact with the object, the distance of the optical path of light L1 changes, the intensity of the interference light L3 changes, and the interference image output from the photodetector 13 changes. Contact is determined by detecting this change in the intensity of the interference image. After the lamellar LM is in contact with the film 23, the tweezers 16 are further lowered in the Z direction for a predetermined time, pressing the lamellar LM against the film 23 to cause the lamellar LM to adhere to the film 23.

[0054] Next, the control device 18 releases the tweezers 16 using the tweezers drive mechanism 17. At this point, the lamellar LM is placed on the film 23. In step S7, the orientation of the lamellar LM can be adjusted, resulting in good contact between the lamellar LM and the film 23, making it easier to place the lamellar LM on the film 23. Subsequently, the control device 18 raises the tweezers 16 in the Z direction using the tweezers drive mechanism 17, retracting the tweezers 16 from the holder 21.

[0055] This completes the transfer of the lamellar LM from the sample SAM to the holder 21. If there are other lamellar LMs in the sample SAM that need to be transferred to the holder 21, steps S2 to S8 are performed for those other lamellar LMs as well.

[0056] <Comparison of Study Example and Embodiment 1> Figures 19 and 20 show a study example conducted by the present inventors, illustrating the process of mounting the lamellar LM onto the holder 21.

[0057] In this example, unlike Embodiment 1, after acquiring the lamellar LM from the sample SAM in step S2, the lamellar LM is mounted onto the holder 21 in step S8 without re-grasping it.

[0058] Therefore, as can be seen by comparing Figure 12 and Figure 19, the contact area between the tweezers 16 and the lamellar LM in the example remains relatively large. In other words, the suction force between the lamellar LM and the tweezers 16 is high. In this state, when the lamellar LM is mounted on the holder 21, as shown in Figure 20, the lamellar LM remains attached to the tweezers 16, and it may become impossible to continue the lamellar LM relocation work.

[0059] In contrast to such examples, in Embodiment 1, the lamellar LM is separated from the connecting portion SAMa of the sample SAM in a first gripping state where the contact area between the tweezers 16 and the lamellar LM is relatively large. Therefore, the lamellar LM can be stably obtained from the sample SAM.

[0060] Furthermore, the gripping adjustment member AM1 is used to temporarily detach the tweezers 16 from the lamellar LM, and then the tweezers 16 grips the lamellar LM again (second gripping state). In the second gripping state, where the contact area between the tweezers 16 and the lamellar LM is relatively small, the lamellar LM is mounted onto the holder 21, which suppresses the lamellar LM from adhering to the tweezers 16. Therefore, the lamellar LM relocation work can be continued.

[0061] (Embodiment 2) The method for relocating the lamellar relocation device 2 and lamellar LM in Embodiment 2 will be described below with reference to Figures 14 to 18. In the following description, the differences from Embodiment 1 will be mainly explained, and points that overlap with Embodiment 1 will not be explained.

[0062] As shown in Figure 14, in Embodiment 2, a gripping adjustment member AM2 is used instead of the gripping adjustment member AM1 of Embodiment 1 to fix the lamellar LM. The gripping adjustment member AM2 is a thin plate-like shape and is made of, for example, silicon. For example, the gripping adjustment member AM2 can be obtained by etching a part of a silicon substrate using a plasma processing apparatus. Note that the sample transport device 15 may be provided with multiple gripping adjustment members AM2.

[0063] By bringing the lamellar LM into contact with the gripping adjustment member AM2, the lamellar LM can be fixed to the gripping adjustment member AM2. When the tweezers 16 are released, the lamellar LM, which is fixed to the gripping adjustment member AM2, separates from the tweezers 16.

[0064] The suction force between the lamellar LM and the gripping adjustment member AM2 is greater than the suction force between the lamellar LM and the tweezers 16. If the van der Waals force acting when the lamellar LM is attached to the gripping adjustment member AM2 is greater than the van der Waals force acting when the lamellar LM is attached to the tweezers 16, the lamellar LM will easily detach from the tweezers 16. Therefore, the contact area between the lamellar LM and the gripping adjustment member AM2 is greater than the contact area between the lamellar LM and the tweezers 16. In addition, the surface roughness of the gripping adjustment member AM2 is smaller than the surface roughness of the tweezers 16.

[0065] <Method for relocating the lamellae in Embodiment 2> The method for relocating the lamellae LM in Embodiment 2 is substantially the same as the method for relocating the lamellae LM in Embodiment 1 up to step S4.

[0066] In step S5, as shown in Figure 15, the control device 18 moves the tweezers 16 by the tweezers drive mechanism 17 so that the lamellar LM contacts the gripping adjustment member AM2, thereby fixing the lamellar LM to the gripping adjustment member AM2.

[0067] In step S6, as shown in Figure 16, the control device 18 releases the tweezers 16 while the lamellar LM is fixed to the gripping adjustment member AM2, thereby detaching the tweezers 16 from the lamellar LM. Since the suction force between the lamellar LM and the gripping adjustment member AM2 is greater than the suction force between the lamellar LM and the tweezers 16, the tweezers 16 separate from the lamellar LM and the lamellar LM is attracted to the gripping adjustment member AM2. Subsequently, the control device 18 moves the tweezers 16 using the tweezers drive mechanism 17, for example, raising the tweezers 16 in the Z direction.

[0068] In step S7, first, as shown in Figure 17, the tweezers 16 are closed and the lamellar LM is gripped again by the tweezers 16, thereby putting the tweezers 16 into a second gripping state. Next, as shown in Figure 18, the control device 18 moves the tweezers 16 in the second gripping state using the tweezers drive mechanism 17, thereby releasing the lamellar LM from the gripping adjustment member AM2. The gripping force of the tweezers 16 on the lamellar LM is greater than the suction force between the lamellar LM and the gripping adjustment member AM2, so the lamellar LM separates from the gripping adjustment member AM2.

[0069] Subsequently, step S8 is performed in the same manner as in Embodiment 1, and the lamellar LM is mounted on the holder 21.

[0070] In Embodiment 2, as in Embodiment 1, the lamellar LM can be separated from the connection part SAMa of the sample SAM in the first gripping state, so that the lamellar LM can be reliably obtained from the sample SAM. Furthermore, since the lamellar LM is mounted on the holder 21 in the second gripping state, it is possible to suppress the lamellar LM from adhering to the tweezers 16. Therefore, the lamellar LM transfer operation can be continued.

[0071] The lamellar relocation device 2 includes at least one of the gripping adjustment member AM1 and the gripping adjustment member AM2, and may also include both.

[0072] Although the present invention has been described in detail based on embodiments for carrying it out, the present invention is not limited to the above embodiments and can be modified in various ways without departing from its essence.

[0073] 100 Lamellar Observation System 1 FIB-SEM Combined Device 2 Lamellar Transfer Device 3 TEM Device 4 Optical System 5 Light Source 6 Filter 7 First Beam Splitter 8 Second Beam Splitter 9 First Objective Lens 10 Second Objective Lens 11 Fixed Mirror 12 Third Objective Lens 13 Photodetector 14 Lens Tube Drive Mechanism 15 Sample Transport Device 16 Tweezers 17 Tweezers Drive Mechanism 18 Control Device 19 Input Device 20 Display Device 21 Holder 22 Grid Frame 23 Film 30 Substrate 31 Groove AM1, AM2 Gripping Adjustment Member L0 Light L1 Light L1R Reflected Light L2 Reference Light L3 Interfering Light LM Lamellar SAM Sample SAMa Connection Part

Claims

1. A lamellar transfer device comprising:

1. Tweezers for gripping a lamellar; 2. A holder for mounting the lamellar; 3. A gripping adjustment member, wherein the device performs the following actions: gripping the lamellar prepared on a sample with the tweezers to put the tweezers into a first gripping state; 4. Moving the tweezers in the first gripping state to acquire the lamellar from the sample; 5. Fixing the acquired lamellar to the gripping adjustment member; 6. Releasing the tweezers while the lamellar is fixed to the gripping adjustment member to detach the tweezers from the lamellar; 7. Moving the tweezers after releasing the tweezers to grip the lamellar again with the tweezers to put the tweezers into a second gripping state; 8. Moving the tweezers in the second gripping state to detach the lamellar from the gripping adjustment member; and 9. Mounting the detached lamellar to the holder.

2. A lamellar relocation device according to claim 1, wherein the contact area between the tweezers and the lamellar in the second gripping state is smaller than the contact area between the tweezers and the lamellar in the first gripping state.

3. A lamellar relocation device according to claim 1, wherein the gripping adjustment member has a base material and a groove formed in the base material, and when the lamellar is fixed to the gripping adjustment member, a part of the lamellar is housed inside the groove.

4. A lamellar relocation device according to claim 1, wherein the lamellar is fixed to the gripping adjustment member by bringing the lamellar into contact with the gripping adjustment member, and the suction force between the lamellar and the gripping adjustment member is greater than the suction force between the lamellar and the tweezers.

5. A lamellar relocation device according to claim 4, wherein the contact area between the gripping adjustment member and the lamellar is greater than the contact area between the tweezers and the lamellar in the first gripping state.

6. A lamellar relocation device according to claim 4, wherein the surface roughness of the gripping adjustment member is smaller than the surface roughness of the tweezers.

7. (a) A step of preparing a sample on which lamellae have been fabricated; (b) After step (a), a step of gripping the lamellae with tweezers to put the tweezers into a first gripping state; (c) After step (b), a step of moving the tweezers in the first gripping state to acquire the lamellae from the sample; (d) After step (c), a step of fixing the lamellae to a gripping adjustment member; (e) After step (d), with the lamellae fixed to the gripping adjustment member, a step of releasing the tweezers to detach the tweezers from the lamellae; (f) After step (e), a step of moving the tweezers to grip the lamellae again with the tweezers to put the tweezers into a second gripping state; (g) After step (f), a step of moving the tweezers in the second gripping state to detach the lamellae from the gripping adjustment member. A method for relocating a lamellar, comprising: (h) a step of mounting the lamellar onto a holder after step (g).

8. A method for relocating a lamella according to claim 7, wherein the contact area between the tweezers and the lamella in the second gripping state is smaller than the contact area between the tweezers and the lamella in the first gripping state.

9. A method for relocating a lamellar according to claim 7, wherein the gripping adjustment member has a base material and a groove formed in the base material, and in step (d), a part of the lamellar is housed inside the groove.

10. A method for relocating a lamella according to claim 7, wherein in step (d), the lamella is fixed to the gripping adjustment member by bringing the lamella into contact with the gripping adjustment member, and the suction force between the lamella and the gripping adjustment member is greater than the suction force between the lamella and the tweezers.

11. A method for relocating a lamella according to claim 10, wherein the contact area between the gripping adjustment member and the lamella is greater than the contact area between the tweezers and the lamella in the first gripping state.

12. A method for relocating a lamella according to claim 10, wherein the surface roughness of the gripping adjustment member is smaller than the surface roughness of the tweezers.

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