Display apparatus
By setting measurement terminals and connections on a flexible circuit board to form a series circuit, the binding impedance measurement points are moved from the printed circuit board to the flexible circuit board, solving the problem of excessively large printed circuit board size, realizing ultra-narrow design and increased component placement space, and improving the accuracy and stability of impedance testing.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
- Filing Date
- 2024-11-20
- Publication Date
- 2026-05-15
AI Technical Summary
In existing display devices, the bonding impedance test points for flexible circuit boards and printed circuit boards are located on the printed circuit board, resulting in an excessively large printed circuit board size. This compresses the space for internal components of the display device and violates the requirement for ultra-narrow printed circuit boards.
Measurement terminals and connections are set on a flexible circuit board to form a series circuit, which moves the bonding impedance measurement points from the printed circuit board to the flexible circuit board, reduces the size of the printed circuit board, and improves the accuracy of impedance testing through the support structure.
It achieves an ultra-narrow design for printed circuit boards, freeing up internal space, increasing the space for component placement, improving product battery life, and enhancing the accuracy and stability of impedance testing.
Smart Images

Figure CN2024133088_15052026_PF_FP_ABST
Abstract
Description
Display device Technical Field
[0001] This application relates to the field of displays, and more particularly to a display device. Background Technology
[0002] In existing display devices, one end of the flexible circuit board is usually bonded to the bonding area of the display panel, and the other end of the flexible circuit board is usually bonded to the printed circuit board.
[0003] To evaluate the stability of the bonding process of a product, it is usually necessary to test the bonding impedance between the source driver chip and the display panel (Chip On Panel, COP), the bonding impedance between the flexible circuit board and the display panel (FPC On Panel, FOP), and the bonding impedance between the circuit board and the flexible circuit board (FPC on Board, FOB). Currently, the test points for the above three bonding impedances are all located in the printed circuit board, which increases the size of the printed circuit board and compresses the space for placing components inside the display device, which contradicts the current demand for ultra-narrow printed circuit boards. Summary of the Invention
[0004] This application provides a display device to improve the technical problem of large printed circuit board size in existing display devices.
[0005] To address the above issues, the technical solution provided in this application is as follows:
[0006] This application discloses a display device comprising:
[0007] The display panel includes a display section and a display mounting section disposed on one side of the display section. The display mounting section includes a first display terminal and a second display terminal arranged in series.
[0008] A flexible circuit board includes a first bonding portion and a second bonding portion. The first bonding portion is bonded to the display bonding portion. The first bonding portion includes a first flexible terminal and a second flexible terminal. The first flexible terminal is bonded to the first display terminal, and the second flexible terminal is bonded to the second display terminal.
[0009] A printed circuit board is disposed on the side of the flexible circuit board away from the display panel, and the printed circuit board includes a printed bonding portion that is bonded to the second bonding portion;
[0010] The flexible circuit board further includes a first measuring terminal and a second measuring terminal disposed on the side of the flexible circuit board away from the first bonding portion. The first measuring terminal is connected to the first flexible terminal, and the second measuring terminal is connected to the second flexible terminal.
[0011] A display device comprising:
[0012] The display panel includes a display section and a display mounting section disposed on one side of the display section. The display mounting section includes a first display terminal and a second display terminal arranged in series.
[0013] A flexible circuit board includes a first bonding portion and a second bonding portion. The first bonding portion is bonded to the display bonding portion. The first bonding portion includes a first flexible terminal and a second flexible terminal. The first flexible terminal is bonded to the first display terminal, and the second flexible terminal is bonded to the second display terminal.
[0014] A printed circuit board, wherein the printed circuit board is disposed on the backlight side of the display panel, and a portion of the flexible circuit board is bent to the backlight side of the display panel, the printed circuit board including a printed bonding portion bonded to the second bonding portion;
[0015] A support structure is disposed between the display panel and the flexible circuit board;
[0016] The flexible circuit board further includes a first measuring terminal and a second measuring terminal disposed on the side of the flexible circuit board away from the first bonding portion. The first measuring terminal is connected to the first flexible terminal, and the second measuring terminal is connected to the second flexible terminal. Attached Figure Description
[0017] Figure 1 is a structural diagram of the display device provided in an embodiment of this application;
[0018] Figure 2 is a first cross-sectional view of the display device provided in an embodiment of this application;
[0019] Figure 3 is a second cross-sectional view of the display device provided in an embodiment of this application;
[0020] Figure 4 is a schematic diagram of the first position of the measuring terminal in the display device provided in the embodiment of this application;
[0021] Figure 5 is a schematic diagram of the display panel, flexible circuit board, and terminals in the printed circuit board of the display device provided in the embodiment of this application;
[0022] Figure 6 is a schematic diagram of a second position of the measuring terminal in the display device provided in the embodiment of this application. Embodiments of the present invention
[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. Furthermore, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application.
[0024] In the description of this application, it should be understood that the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, and "at least one" can mean one, two, or more, unless otherwise explicitly specified.
[0026] Please refer to Figures 1 to 6. This application proposes a display device 100, which includes a display panel 10, a flexible circuit board 20 and a printed circuit board 30 connected to each other. For display devices 100 of different sizes, this application can provide different numbers of flexible circuit boards 20.
[0027] In this embodiment, the display panel 10 includes a display section AA and a display bonding section 110 disposed on one side of the display section AA. The display bonding section 110 includes a first display terminal 112a and a second display terminal 112b connected in series. The flexible circuit board 20 includes a first bonding section 210 and a second bonding section 220. The first bonding section 210 is bonded to the display bonding section 110. The first bonding section 210 includes a first flexible terminal 212a and a second flexible terminal 212b. The first flexible terminal 212a is bonded to the first display terminal 112a, and the second flexible terminal 212b is bonded to the second display terminal 112b. The printed circuit board 30 is disposed on the side of the flexible circuit board 20 away from the display panel 10. The printed circuit board 30 includes a printed bonding section 310 bonded to the second bonding section 220.
[0028] In this embodiment, the flexible circuit board 20 further includes a first measuring terminal 411 and a second measuring terminal 412 disposed on the side of the flexible circuit board 20 away from the first bonding portion 210. The first measuring terminal 411 is connected to the first flexible terminal 212a, and the second measuring terminal 412 is connected to the second flexible terminal 212b.
[0029] In this embodiment, the printed circuit board 30 is disposed on the backlight side of the display panel 10, and a portion of the flexible circuit board 20 is bent to the backlight side of the display panel 10. That is, one end of the flexible circuit board 20 can be bonded to the display bonding part 110, and the other end of the flexible circuit board 20 is bent to the back of the display panel 10 and bonded to the printed bonding part 310. The arrangement of the flexible circuit board 20 and the printed circuit board 30 can reduce the bezel width of the display device 100 to achieve a narrow bezel design for the product.
[0030] This application provides a first measuring terminal 411 and a second measuring terminal 412 on the surface of the flexible circuit board 20 away from the bonding side. This allows the first measuring terminal 411, the second measuring terminal 412, the first flexible terminal 212a, the second flexible terminal 212b, the first display terminal 112a, and the second display terminal 112b to form a series circuit. This moves the measurement point of the bonding impedance between the display panel 10 and the flexible circuit board 20 from the printed circuit board 30 to the flexible circuit board 20, freeing up space on the printed circuit board 30, reducing its size, and achieving an ultra-narrow design. This allows more space inside the display device 100 to arrange other components, such as increasing the volume of the battery in the display device 100 to improve the product's battery life.
[0031] It should be noted that, for the convenience of describing the technical solution of this application, the display panel 10, the printed circuit board 30 and the flexible circuit board 20 can all be located on the same support platform 200 to facilitate the testing of the bonding impedance, such as the structure shown in Figure 3.
[0032] It should be noted that the display panel 10 can be an LCD panel, an OLED panel, or a MiniLED or MicroLED direct display panel, etc.
[0033] The technical solution of this application will now be described in conjunction with specific embodiments.
[0034] Please refer to Figures 4 and 5. The display bonding part 110 may include a plurality of display bonding terminals 111 and a first alignment mark 113 disposed on both sides of the plurality of display bonding terminals 111. The plurality of display bonding terminals 111 include a first display terminal 112a and a second display terminal 112b for impedance testing. The first display terminal 112a and the second display terminal 112b are arranged adjacent to each other or at least one display bonding terminal 111 is arranged between them.
[0035] Please refer to Figures 4 and 5. Since the first display terminal 112a and the second display terminal 112b are used to measure the bonding impedance between the display panel 10 and the flexible circuit board 20, in order to form a series circuit, this application can provide a first connecting portion 114 between the first display terminal 112a and the second display terminal 112b. One end of the first connecting portion 114 is electrically connected to the first display terminal 112a, and the other end of the first connecting portion 114 is electrically connected to the second display terminal 112b.
[0036] In this embodiment, the first connecting part 114 can be a U-shaped structure, and the two ends of the U-shaped structure are respectively connected to the first display terminal 112a and the second display terminal 112b.
[0037] In this embodiment, the first display terminal 112a, the second display terminal 112b, and the first connecting portion 114 can be formed in the same photomask process as the other display bonding terminals 111 in the display bonding portion 110.
[0038] Please refer to Figure 5. The first binding part 210 includes a plurality of first binding terminals 211 and second alignment marks 213 disposed on both sides of the plurality of first binding terminals 211. The first alignment marks 213 and the second alignment marks 213 are aligned and bound together. A first binding terminal 211 is bound to a first display terminal 112a. The plurality of first binding terminals 211 include a first flexible terminal 212a and a second flexible terminal 212b for impedance testing. The first flexible terminal 212a corresponds to and is bound to the first display terminal 112a, and the second flexible terminal 212b corresponds to and is bound to the second display terminal 112b.
[0039] This application provides a first connection portion 114 in the display bonding portion 110 to connect the first display terminal 112a and the second display terminal 112b in series. This allows the first display terminal 112a and the second display terminal 112b to be directly connected in series, so that the first measurement terminal 411, the second measurement terminal 412, the first flexible terminal 212a, the second flexible terminal 212b, the first display terminal 112a, and the second display terminal 112b form a series circuit. For example, test point 3 and test point 4 in FIG. 4 form a circuit, and test point 8 and test point 9 form a circuit. This allows the measurement points of the bonding impedance between the display panel 10 and the flexible circuit board 20 to be moved from the printed circuit board 30 to the flexible circuit board 20, freeing up space on the printed circuit board 30.
[0040] Please refer to Figure 2. The flexible circuit board 20 includes a base layer, a first bonding portion 210 and a second bonding portion 220 disposed on a first side of the base layer, and a first measuring terminal 411 and a second measuring terminal 412 disposed on a second side of the base layer opposite to the first side.
[0041] In this embodiment, since the first flexible terminal 212a and the second flexible terminal 212b are located on the bonding side of the flexible circuit board 20, if the first measuring terminal 411 and the second measuring terminal 412 are both set on the same side as the terminals on the bonding side, the impedance testing fixture cannot obtain the first measuring terminal 411 and the second measuring terminal 412.
[0042] In this embodiment, the flexible circuit board 20 further includes a first test lead 421 and a second test lead 422. The first test lead 421 and the second test lead 422 penetrate the substrate, and the two ends of the first test lead 421 are respectively connected to the first flexible terminal 212a and the first measurement terminal 411, and the two ends of the second test lead 422 are respectively connected to the second flexible terminal 212b and the second measurement terminal 412.
[0043] Specifically, the first measuring terminal 411, the first flexible terminal 212a, the first display terminal 112a, and the first test lead 421 of this application constitute the first test segment of the FOP, and the second measuring terminal 412, the second flexible terminal 212b, the second display terminal 112b, and the second test lead 422 constitute the second test segment of the FOP. The first connecting part 114 connects the first test segment and the second test segment of the FOP in series so that the first test segment and the second test segment of the FOP form a series circuit to measure the bonding impedance between the display panel 10 and the flexible circuit board 20.
[0044] In this embodiment, since the measuring terminals are only used to connect to the impedance testing fixture, the area of the measuring terminals does not need to be large. This application can make the area of the first measuring terminal 411 smaller than the area of the first flexible terminal 212a, and the area of the second measuring terminal 412 smaller than the area of the second flexible terminal 212b.
[0045] Please refer to Figure 3. The second bonding part 220 includes a plurality of second bonding terminals 221 and third alignment marks 223 disposed on both sides of the plurality of second bonding terminals 221. The printed circuit board 30 includes a plurality of printed bonding terminals 311 and fourth alignment marks 313 disposed on both sides of the plurality of printed bonding terminals 311. The third alignment marks 223 and the fourth alignment marks 313 are aligned and bonded. A second bonding terminal 221 is bonded to a printed bonding terminal 311.
[0046] In this embodiment, the plurality of second bonding terminals 221 may include a third flexible terminal 222a and a fourth flexible terminal 222b, and the plurality of printed bonding terminals 311 may include a first printed terminal 312a and a second printed terminal 312b. The third flexible terminal 222a and the first printed terminal 312a are bonded together, and the fourth flexible terminal 222b and the second printed terminal 312b are bonded together.
[0047] In this embodiment, for the bonding impedance test between the flexible circuit board 20 and the printed circuit board 30, the present application can provide a second connection portion 224 on the flexible circuit board 20. The two ends of the second connection portion 224 are respectively connected to the third flexible terminal 222a and the fourth flexible terminal 222b, so that the first printed terminal 312a, the second printed terminal 312b, the third flexible terminal 222a and the fourth flexible terminal 222b form a series circuit.
[0048] Meanwhile, the printed bonding part 310 also includes a third measuring terminal 413 and a fourth measuring terminal 414. The third measuring terminal 413 is electrically connected to the first printed terminal 312a, and the fourth measuring terminal 414 is electrically connected to the second printed terminal 312b. The third measuring terminal 413 and the fourth measuring terminal 414 are both located on the same side of the printed circuit board 30 as the printed bonding part 310.
[0049] In this embodiment, since the bonding side of the printed circuit board 30 corresponds to the impedance test fixture, the measurement terminals on the printed circuit board 30 can be disposed on the same side as the printed bonding terminals 311; test leads for bonding impedance testing can also be disposed on the printed circuit board 30.
[0050] In this embodiment, the areas of the first measuring terminal 411, the second measuring terminal 412, the third measuring terminal 413, and the fourth measuring terminal 414 are all equal.
[0051] In this embodiment, due to the limited space for terminal arrangement, the terminal areas in different structures are different; at the same time, due to the existence of alignment and binding errors, this application can make the area of the first binding terminal 211 larger than the area of the display binding terminal 111, and the area of the printed binding terminal 311 larger than the area of the second binding terminal 221.
[0052] Specifically, the first printed terminal 312a, the third flexible terminal 222a, and the third measuring terminal 413 constitute the first test segment of the FOB, and the second printed terminal 312b, the fourth flexible terminal 222b, and the fourth measuring terminal 414 constitute the second test segment of the FOB. The second connecting part 224 connects the first test segment and the second test segment of the FOB in series so that the first test segment and the second test segment of the FOB form a series circuit to measure the bonding impedance between the printed circuit board 30 and the flexible circuit board 20. For example, test point 1 and test point 2 in Figure 4 form a circuit, and test point 6 and test point 7 form a circuit.
[0053] Please refer to Figure 6. The third measurement terminal 413 and the fourth measurement terminal 414 can be disposed on the flexible circuit board 20, and the second connection part 224 can be disposed on the printed circuit board 30 to move the measurement point of the bonding impedance between the printed circuit board 30 and the flexible circuit board 20 from the printed circuit board 30 to the flexible circuit board 20, thereby further freeing up space on the printed circuit board 30. For example, test point 1 and test point 2 in Figure 6 form a loop, and test point 6 and test point 7 form a loop.
[0054] Please refer to Figure 4. The display panel 10 also includes a drive bonding part 120 that is bonded to the drive chip IC. The drive bonding part 120 includes a plurality of drive bonding terminals 121. The plurality of drive bonding terminals 121 include a first drive terminal 122a and a second drive terminal 122b. The first drive terminal 122a and the second drive terminal 122b are respectively bonded to two terminals in series in the drive chip IC. That is, the drive bonding terminal 121 can be reused as a terminal for impedance testing.
[0055] In this embodiment, since there is not enough space in the driver chip IC and the display panel 10 to set the measurement terminals, the test points of the bonding impedance of the driver chip IC and the display panel 10 can be set on the flexible circuit board 20.
[0056] Please refer to Figure 5. The display bonding part 110 also includes a third display terminal 112c disposed adjacent to the second display terminal 112b. The second display terminal 112b is electrically connected to the first drive terminal 122a, and the third display terminal 112c is electrically connected to the second drive terminal 122b.
[0057] Meanwhile, the flexible circuit board 20 may also include a fifth flexible terminal 212c, a fifth measurement terminal 415, and a third test lead 423. The fifth flexible terminal 212c is bonded to the third display terminal 112c. The fifth measurement terminal 415 is arranged on the same layer as the first measurement terminal 411 and the second measurement terminal 412. The two ends of the third test lead 423 are respectively connected to the fifth measurement terminal 415 and the fifth flexible terminal 212c.
[0058] Therefore, the second display terminal 112b, the first driving terminal 122a, the second flexible terminal 212b, and the second measuring terminal 412 electrically connected in this application form the first test segment of COP and FOP, and the third display terminal 112c, the second driving terminal 122b, the fifth flexible terminal 212c, and the fifth measuring terminal 415 electrically connected form the second test segment of COP and FOP. The two terminals connected in series in the driver chip IC form a series circuit between the first test segment of COP and FOP and the second test segment of COP and FOP, so as to measure the bonding impedance between the display panel 10 and the flexible circuit board 20, and the driving... The bonding impedance between the chip IC and the display panel 10 is measured. Since the bonding impedance between the display panel 10 and the flexible circuit board 20 can be obtained from the first measurement terminal 411 and the second measurement terminal 412, the bonding impedance between the driver chip IC and the display panel 10 in this application can be obtained from the difference between the impedance measured between the fifth measurement terminal 415 and the second measurement terminal 412 and the impedance measured between the first measurement terminal 411 and the second measurement terminal 412. For example, test point 4 and test point 5 in Figures 4 and 6 form a loop, and test point 9 and test point 10 form a loop.
[0059] This application can form a test circuit for the bonding impedance of COP and FOP by setting three measurement terminals on the flexible circuit board 20 and using the three flexible terminals in the flexible circuit board 20 and the three display bonding terminals 111 in the display panel 10. At the same time, the measurement terminals in FOB can also be set on the flexible circuit board 20, so that all the measurement terminals on the original printed circuit board 30 can be transferred to the flexible circuit board 20, freeing up space on the printed circuit board 30 and reducing the size of the printed circuit board 30.
[0060] It should be noted that the impedance measurement terminals in this application can be used only for impedance testing and do not require signal transmission.
[0061] Please refer to Figures 2 and 3. The display device 100 also includes a support structure 40 disposed on the backlight side of the display panel 10. The support structure 40 is disposed between the display panel 10 and the flexible circuit board 20. During impedance testing, since the impedance testing fixture needs to contact the measurement terminals on the flexible circuit board 20, the setting of the support structure 40 increases the contact stability between the impedance testing fixture and the flexible circuit board 20, thereby improving the accuracy of the impedance test.
[0062] In this embodiment, the material of the support structure 40 can be foam.
[0063] In this embodiment, since the flexible circuit board 20 needs to be bent to the back of the display panel 10, in order to improve the bonding stability between the flexible circuit board 20 and the printed circuit board 30, the thickness of the support structure 40 can be less than or equal to the thickness of the printed circuit board 30, that is, to ensure that the bonding surfaces of the flexible circuit board 20 and the printed circuit board 30 are located on the same plane as much as possible.
[0064] It should be noted that the foam 40 in Figures 2 and 3 is only a schematic diagram, and the dimensions of the foam in this application shall be based on the description in the instruction manual.
[0065] It should be noted that the display device in this application can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.
[0066] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0067] The technical solutions provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions in the embodiments of this application.
Claims
1. A display device comprising: The display panel includes a display section and a display mounting section disposed on one side of the display section. The display mounting section includes a first display terminal and a second display terminal arranged in series. A flexible circuit board includes a first bonding portion and a second bonding portion. The first bonding portion is bonded to the display bonding portion. The first bonding portion includes a first flexible terminal and a second flexible terminal. The first flexible terminal is bonded to the first display terminal, and the second flexible terminal is bonded to the second display terminal. A printed circuit board is disposed on the side of the flexible circuit board away from the display panel, and the printed circuit board includes a printed bonding portion that is bonded to the second bonding portion; The flexible circuit board further includes a first measuring terminal and a second measuring terminal disposed on the side of the flexible circuit board away from the first bonding portion. The first measuring terminal is connected to the first flexible terminal, and the second measuring terminal is connected to the second flexible terminal.
2. The display device according to claim 1, wherein, The display bonding part further includes a first connecting part disposed between the first display terminal and the second display terminal, one end of the first connecting part being electrically connected to the first display terminal, and the other end of the first connecting part being electrically connected to the second display terminal.
3. The display device according to claim 2, wherein, The first connecting part has a U-shaped structure.
4. The display device according to claim 2, wherein, The first display terminal, the second display terminal, and the first connecting portion are formed in the same photomask process as other display bonding terminals in the display bonding portion used for signal transmission.
5. The display device according to claim 2, wherein, The flexible circuit board includes a base layer, a first test lead, and a second test lead. The first bonding portion and the second bonding portion are disposed on a first side of the base layer, and the first measuring terminal and the second measuring terminal are disposed on a second side of the base layer opposite to the first side. The first test lead and the second test lead penetrate the substrate, and the two ends of the first test lead are respectively connected to the first flexible terminal and the first measuring terminal, and the two ends of the second test lead are respectively connected to the second flexible terminal and the second measuring terminal.
6. The display device according to claim 5, wherein, The area of the first measuring terminal is smaller than the area of the first flexible terminal, and the area of the second measuring terminal is smaller than the area of the second flexible terminal.
7. The display device according to claim 5, wherein, The second bonding portion includes a third flexible terminal, a fourth flexible terminal, and a second connecting portion, with the two ends of the second connecting portion respectively connected to the third flexible terminal and the fourth flexible terminal; The printed bonding part includes a first printed terminal and a second printed terminal, the third flexible terminal is bonded to the first printed terminal, and the fourth flexible terminal is bonded to the second printed terminal.
8. The display device according to claim 7, wherein, The printed bonding portion further includes a third measuring terminal and a fourth measuring terminal. The third measuring terminal is electrically connected to the first printed terminal, and the fourth measuring terminal is electrically connected to the second printed terminal. Both the third measuring terminal and the fourth measuring terminal are located on the same side of the printed circuit board as the printed bonding portion.
9. The display device according to claim 8, wherein, The areas of the first measuring terminal, the second measuring terminal, the third measuring terminal, and the fourth measuring terminal are all equal.
10. The display device according to claim 8, wherein, The display panel further includes a drive bonding part that is bonded to the drive chip. The drive bonding part includes a first drive terminal and a second drive terminal, and the first drive terminal and the second drive terminal are respectively bonded to two terminals connected in series in the drive chip. The display bonding part further includes a third display terminal disposed adjacent to the second display terminal, the second display terminal being electrically connected to the first driving terminal, and the third display terminal being electrically connected to the second driving terminal.
11. The display device according to claim 10, wherein, The flexible circuit board includes: The fifth flexible terminal is bonded and connected to the third display terminal; The fifth measuring terminal is disposed on the same layer as the first measuring terminal and the second measuring terminal; The third test lead has its two ends connected to the fifth measuring terminal and the fifth flexible terminal, respectively.
12. The display device according to any one of claims 1 to 11, wherein, The display bonding part includes a display bonding terminal for transmitting signals, the printed bonding part includes a printed bonding terminal for transmitting signals, the first bonding part includes a first bonding terminal for transmitting signals, and the second bonding part includes a second bonding terminal for transmitting signals. The area of the first bonding terminal is larger than the area of the display bonding terminal, and the area of the printed bonding terminal is larger than the area of the second bonding terminal.
13. A display device comprising: The display panel includes a display section and a display mounting section disposed on one side of the display section. The display mounting section includes a first display terminal and a second display terminal arranged in series. A flexible circuit board includes a first bonding portion and a second bonding portion. The first bonding portion is bonded to the display bonding portion. The first bonding portion includes a first flexible terminal and a second flexible terminal. The first flexible terminal is bonded to the first display terminal, and the second flexible terminal is bonded to the second display terminal. A printed circuit board, wherein the printed circuit board is disposed on the backlight side of the display panel, and a portion of the flexible circuit board is bent to the backlight side of the display panel, the printed circuit board including a printed bonding portion bonded to the second bonding portion; A support structure is disposed between the display panel and the flexible circuit board; The flexible circuit board further includes a first measuring terminal and a second measuring terminal disposed on the side of the flexible circuit board away from the first bonding portion. The first measuring terminal is connected to the first flexible terminal, and the second measuring terminal is connected to the second flexible terminal.
14. The display device according to claim 13, wherein, The display bonding part further includes a first connecting part disposed between the first display terminal and the second display terminal, one end of the first connecting part being electrically connected to the first display terminal, and the other end of the first connecting part being electrically connected to the second display terminal.
15. The display device according to claim 14, wherein, The flexible circuit board includes a base layer, a first test lead, and a second test lead. The first bonding portion and the second bonding portion are disposed on a first side of the base layer, and the first measuring terminal and the second measuring terminal are disposed on a second side of the base layer opposite to the first side. The first test lead and the second test lead penetrate the substrate, and the two ends of the first test lead are respectively connected to the first flexible terminal and the first measuring terminal, and the two ends of the second test lead are respectively connected to the second flexible terminal and the second measuring terminal.
16. The display device according to claim 15, wherein, The area of the first measuring terminal is smaller than the area of the first flexible terminal, and the area of the second measuring terminal is smaller than the area of the second flexible terminal.
17. The display device according to claim 15, wherein, The second bonding portion includes a third flexible terminal, a fourth flexible terminal, and a second connecting portion, with the two ends of the second connecting portion respectively connected to the third flexible terminal and the fourth flexible terminal; The printed bonding part includes a first printed terminal and a second printed terminal, the third flexible terminal is bonded to the first printed terminal, and the fourth flexible terminal is bonded to the second printed terminal.
18. The display device according to claim 17, wherein, The printed bonding portion further includes a third measuring terminal and a fourth measuring terminal. The third measuring terminal is electrically connected to the first printed terminal, and the fourth measuring terminal is electrically connected to the second printed terminal. Both the third measuring terminal and the fourth measuring terminal are located on the same side of the printed circuit board as the printed bonding portion.
19. The display device according to claim 13, wherein, The thickness of the support structure is less than or equal to the thickness of the printed circuit board.
20. The display device according to claim 13, wherein, The supporting structure is made of foam.