Heat sink and electrical device

Abstract

A heat sink and an electrical device, relating to the technical field of heat dissipation. The heat sink comprises an evaporator, a condenser, and a busbar member; the evaporator is communicated with the condenser by means of the busbar member; the interiors of the evaporator, the condenser and the busbar member are used for circulating a phase change medium; the flow direction of the phase change medium in the evaporator is a first direction; the flow direction of the phase change medium in the condenser is a second direction; the first direction and the second direction both intersect the length direction of the busbar member; the busbar member comprises a first section and a second section connected in the length direction; the evaporator is connected to the first section; and the condenser is connected to the second section.

Description

Radiators and electrical equipment

[0001] Cross-references to related applications

[0002] This application is based on and claims priority to Chinese Patent Application No. 2024227835403, filed on November 14, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation technology, and more specifically, to a radiator and electrical equipment. Background Technology

[0004] As electrical equipment continues to develop towards higher power density, higher efficiency, smaller size, and lower weight, the number of internal electronic components is increasing and their arrangement is becoming more compact. However, the heat dissipation capacity of the existing internal electronic cavity heat dissipation system is limited, making it difficult to meet the heat dissipation requirements of high-power electronic equipment. Summary of the Invention

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] Therefore, this application proposes a radiator and electrical equipment that improves the heat exchange performance per unit space within a certain volume and significantly optimizes the heat dissipation effect.

[0007] In a first aspect, this application provides a heat sink, comprising:

[0008] Evaporator;

[0009] Condenser;

[0010] A manifold is provided, through which the evaporator and the condenser are interconnected. The evaporator, the condenser, and the manifold are used for the flow of a phase change medium. The phase change medium flows in a first direction in the evaporator and in a second direction in the condenser. Both the first and second directions intersect the length direction of the manifold. The manifold includes a first segment and a second segment connected along the length direction. The evaporator is connected to the first segment, and the condenser is connected to the second segment.

[0011] According to the radiator of this application, the structural design of the evaporator connected to the side of the first section and the condenser connected to the side of the second section significantly improves the heat exchange performance per unit space within a certain volume, significantly optimizes the heat dissipation effect, reduces the risk of leakage, and at the same time reduces the internal space occupied by the radiator, thereby improving space utilization.

[0012] According to one embodiment of this application, the flow channel of the evaporator extends in a straight line.

[0013] According to one embodiment of this application, the flow channel of the condenser extends in a straight line.

[0014] According to one embodiment of this application, the evaporator is connected to the side of the first segment, and the condenser is connected to the side of the second segment.

[0015] According to one embodiment of this application, both the first segment and the second segment extend along a third direction, and the ends of the first segment and the second segment are connected to each other, wherein the third direction intersects with the first direction.

[0016] According to one embodiment of this application, the first segment extends along a fourth direction, the second segment extends along a fifth direction intersecting the fourth direction, the end of the first segment and the end of the second segment are bent and connected, and the fourth direction intersects the first direction.

[0017] According to one embodiment of this application, the condenser is connected to the surface of the second segment on the side opposite to the first segment.

[0018] According to one embodiment of this application, the manifold has multiple plates, the evaporator includes multiple first heat exchange plates, the condenser includes multiple second heat exchange plates, one end of the first heat exchange plate is connected to one side of the plate of the manifold, and one end of the second heat exchange plate is connected to one side of the plate of the manifold.

[0019] According to one embodiment of this application, the first segment extends along a sixth direction, the second segment extends along a seventh direction intersecting the sixth direction, the end of the first segment is connected to the side or end of the second segment, and both the sixth direction and the seventh direction intersect the first direction.

[0020] According to one embodiment of this application, the heat sink further includes:

[0021] A flow guiding structure is disposed within the manifold and forms a flow guiding channel for promoting the flow of the phase change medium toward the end of the manifold.

[0022] According to one embodiment of this application, the manifold is a circular tube type;

[0023] According to one embodiment of this application, the manifold is a flat tube type.

[0024] According to one embodiment of this application, the evaporator includes:

[0025] The first heat exchange plate is used for the flow of phase change medium.

[0026] The first heat dissipation fin is mounted on the first heat exchange plate;

[0027] According to one embodiment of this application, the condenser includes:

[0028] The second heat exchange plate is used for the flow of phase change medium.

[0029] The second heat dissipation fin is mounted on the second heat exchange plate.

[0030] According to one embodiment of this application, the end of the first heat exchange plate is connected to the side of the first segment, and the first heat dissipation fins are installed on the side of the first heat exchange plate; the end of the second heat exchange plate is connected to the side of the second segment, and the second heat dissipation fins are installed on the side of the second heat exchange plate.

[0031] According to one embodiment of this application, the evaporator further includes:

[0032] The first manifold is connected to the end of the first heat exchange plate away from the first section;

[0033] According to one embodiment of this application, the condenser further includes:

[0034] The second manifold is connected to the end of the second heat exchange plate away from the second section.

[0035] According to one embodiment of this application, the first heat exchange plate includes a plurality of spaced-apart plates, the sides of the plurality of first heat exchange plates are connected to the sides of the first segment, and the first heat dissipation fins are installed between two adjacent first heat exchange plates; the second heat exchange plate includes a plurality of spaced-apart plates, the sides of the plurality of second heat exchange plates are connected to the sides of the second segment, and the second heat dissipation fins are installed between two adjacent second heat exchange plates.

[0036] Secondly, this application provides an electrical device comprising:

[0037] The chassis defines a first receiving cavity;

[0038] An electrical component, wherein the electrical component is mounted in the first receiving cavity;

[0039] As described above, the evaporator of the radiator is located in the first receiving cavity, and the condenser of the radiator is located outside the chassis.

[0040] According to the electrical equipment of this application, the heat exchange performance per unit space within a certain volume is significantly improved by setting up the radiator, the heat dissipation effect is significantly optimized, the leakage risk is reduced, which is conducive to the long-term safe and stable operation of the electrical equipment and reduces the maintenance cost of the electrical equipment. At the same time, the internal space occupied by the radiator is reduced, which helps to optimize the spatial layout of electrical components inside the electrical equipment, thereby improving the space utilization rate. Moreover, no other parts need to be introduced, and no major modifications are required to the existing structure, which is conducive to promotion and use. In addition, the design of the evaporator and condenser sharing a common busbar simplifies the assembly process and achieves cost control of the radiator.

[0041] According to one embodiment of this application, the electrical device further includes:

[0042] A protective cover is installed on the chassis and defines a second receiving cavity, in which the condenser is located.

[0043] According to one embodiment of this application, the busbar of the heat sink extends through the chassis along its length.

[0044] According to one embodiment of this application, the protective cover has a first air vent and a second air vent that are separated from each other, and the first air vent and the second air vent are respectively located on two adjacent walls of the protective cover.

[0045] According to one embodiment of this application, the electrical device further includes:

[0046] The first fan is installed in the casing and is used to drive the airflow in the first receiving cavity;

[0047] The second fan, which is installed on the protective cover, is used to drive the airflow within the second accommodating cavity.

[0048] According to one embodiment of this application, the electrical device further includes:

[0049] A magnetic device, wherein the magnetic device is mounted in the second receiving cavity;

[0050] A heat dissipation component is installed in the second receiving cavity and is separated from the heat sink and the magnetic device.

[0051] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. Other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. Attached Figure Description

[0052] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0053] Figure 1 is a schematic diagram of one of the heat sinks provided in an embodiment of this application;

[0054] Figure 2 is a second schematic diagram of the structure of the heat sink provided in the embodiment of this application;

[0055] Figure 3 is a third schematic diagram of the structure of the heat sink provided in the embodiment of this application;

[0056] Figure 4 is a fourth structural schematic diagram of the heat sink provided in the embodiment of this application;

[0057] Figure 5 is a fifth schematic diagram of the structure of the heat sink provided in the embodiment of this application;

[0058] Figure 6 is a schematic diagram of the structure of the heat sink provided in the embodiment of this application;

[0059] Figure 7 is the seventh structural schematic diagram of the heat sink provided in the embodiment of this application;

[0060] Figure 8 is the eighth structural schematic diagram of the heat sink provided in the embodiment of this application;

[0061] Figure 9 is a schematic diagram of the structure of the heat sink provided in the embodiment of this application.

[0062] Figure 10 is one of the structural schematic diagrams of the chassis and protective cover provided in the embodiments of this application;

[0063] Figure 11 is one of the partial structural schematic diagrams of the electrical equipment provided in the embodiments of this application;

[0064] Figure 12 is a schematic diagram of the structure of an electrical device provided in an embodiment of this application;

[0065] Figure 13 is a second partial structural schematic diagram of the electrical equipment provided in the embodiment of this application;

[0066] Figure 14 is a second structural schematic diagram of the chassis and protective cover provided in an embodiment of this application;

[0067] Figure 15 is a third partial structural schematic diagram of the electrical equipment provided in the embodiments of this application;

[0068] Figure 16 is a second structural schematic diagram of the electrical equipment provided in an embodiment of this application;

[0069] Figure 17 is a fourth partial structural schematic diagram of the electrical equipment provided in the embodiments of this application;

[0070] Figure 18 is a third structural schematic diagram of the chassis and protective cover provided in the embodiments of this application;

[0071] Figure 19 is a partial structural schematic diagram of the electrical equipment provided in the embodiments of this application;

[0072] Figure 20 is a third structural schematic diagram of the electrical equipment provided in the embodiments of this application;

[0073] Figure 21 is a partial structural schematic diagram of the electrical equipment provided in the embodiment of this application;

[0074] Figure 22 is a partial structural schematic diagram of the electrical equipment provided in the embodiments of this application.

[0075] Reference numerals: Electrical equipment 10; Chassis 11, First receiving cavity 111; Electrical component 12, PCB board 121, Electronic device 122; Protective cover 13, Second receiving cavity 131, First air vent 132, Second air vent 133; First fan 14, Second fan 15, Magnetic device 16, Heat dissipation component 17; Radiator 18; Evaporator 181, First heat exchange plate 1811, First heat dissipation fin 1812, First manifold 1813; Condenser 182, Second heat exchange plate 1821, Second heat dissipation fin 1822, Second manifold 1823; Manifold 183, First section 1831, End of first section 18311, Side of first section 18312, Second section 1832, End of second section 18321, Side of second section 18322; Guide structure 184, Guide channel 1841. Detailed Implementation

[0076] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0077] This application discloses a heat sink 18.

[0078] The heat sink 18 according to an embodiment of the present application is described below with reference to Figures 1-22.

[0079] In some embodiments, as shown in Figures 1-6, the radiator 18 includes an evaporator 181, a condenser 182, and a manifold 183.

[0080] Evaporator 181 and condenser 182 are interconnected via manifold 183. The evaporator 181, condenser 182 and manifold 183 are used for the flow of phase change medium. The flow direction of the phase change medium in evaporator 181 is a first direction, and the flow direction of the phase change medium in condenser 182 is a second direction. Both the first and second directions intersect the length direction of manifold 183. Manifold 183 includes a first section 1831 and a second section 1832 connected along the length direction. Evaporator 181 is connected to the first section 1831, and condenser 182 is connected to the second section 1832.

[0081] Specifically, as shown in Figures 1-6, 10, 14, and 18, the first direction can be vertical or oblique at an acute angle to the vertical; the second direction can be vertical or oblique at an acute angle to the vertical. The length direction of the busbar 183 can include a single direction, which can be horizontal or oblique at an acute angle to the horizontal. The length direction of the busbar 183 can also include multiple directions, where "multiple" means two or more. For example, the length direction of the busbar 183 can include horizontal, vertical, vertical, oblique at an acute angle to the horizontal, oblique at an acute angle to the vertical, or oblique at an acute angle to the vertical.

[0082] For example, in some embodiments, as shown in FIG1, the flow channel direction of the evaporator 181 and the flow channel direction of the condenser 182 are both oblique directions at an acute angle to the vertical, and the length direction of the manifold 183 is oblique direction at an acute angle to the horizontal.

[0083] For example, in some other embodiments, as shown in FIG3, the flow direction of the evaporator 181 and the flow direction of the condenser 182 are both oblique directions at an acute angle to the vertical, and the length direction of the manifold 183 includes oblique directions at an acute angle to the vertical and oblique directions at an acute angle to the horizontal.

[0084] For example, in some other embodiments, as shown in Figures 5, 7 and 8, the flow direction of the evaporator 181 and the flow direction of the condenser 182 are both oblique directions at an acute angle to the vertical, and the length direction of the manifold 183 includes oblique directions at an acute angle to the longitudinal direction and oblique directions at an acute angle to the transverse direction.

[0085] For example, in some other embodiments, as shown in FIG2, the flow channel direction of the evaporator 181 and the flow channel direction of the condenser 182 are both vertical, and the length direction of the manifold 183 is horizontal.

[0086] The vertical direction can be the direction of gravity, while the horizontal and longitudinal directions can be the horizontal directions, that is, the horizontal and longitudinal directions are two directions that intersect perpendicularly on the horizontal plane.

[0087] In actual operation, as shown in Figures 1-6, the evaporator 181 of the radiator 18 absorbs the heat generated by the electrical components 12 within the electrical equipment 10 during operation through its internal phase change medium. After absorbing heat, the phase change medium vaporizes and rises along the flow channel within the evaporator 181 to the manifold 183. It then flows to the condenser 182 of the radiator 18. Under the cooling effect of the external environment, the gaseous phase change medium releases heat and becomes a liquid phase change medium. Subsequently, under the influence of gravity, the liquid phase change medium returns along the flow channel within the condenser 182 to the manifold 183, and finally falls back into the evaporator 181, completing one heat dissipation cycle. This process is repeated to dissipate the heat from the electrical components 12 within the electrical equipment 10 to the external environment, thereby reducing the temperature of the chamber containing the electrical components 12.

[0088] In related technologies, traditional electrical equipment uses air-to-air heat exchangers as heat dissipation devices to cool internal electrical components. However, the air-to-air heat exchanger as a whole needs to be housed in the chamber where the electrical components are located, and the internal air duct of the air-to-air heat exchanger needs to be connected to the external environment. As the power level of electrical equipment increases, the volume of the air-to-air heat exchanger also needs to increase. In order to match the large volume of the air-to-air heat exchanger, the chassis of the electrical equipment increases the space occupied by the electrical equipment significantly, which is not conducive to the overall spatial layout of the electrical equipment.

[0089] It is understandable that the evaporator 181 and condenser 182 need to have a vertical positional difference in their arrangement to facilitate the fall of the liquid phase change medium by gravity. On the one hand, since the evaporator 181 is connected to the first section 1831 and the condenser 182 is connected to the second section 1832, the evaporator 181 and the first section 1831 can be housed in the chamber where the electrical component 12 is located, while the condenser 182 and the second section 1832 can be arranged outside the chamber where the electrical component 12 is located. This helps to reduce the internal space occupied by the radiator 18 and optimize the spatial layout of the electrical component 12 inside the electrical equipment 10, thereby improving the space utilization rate of the electrical equipment 10. On the other hand, in terms of spatial layout, there are few changes to the existing structural form of the electrical equipment 10. Specifically, the gas in the original position can be directly moved to the next position. The heat exchanger replaces the radiator 18 of this application without introducing other components or making significant modifications to the structure of the electrical equipment 10. It has high adaptability, which is conducive to promotion and use. On the other hand, since the radiator 18 of this application uses a phase change heat exchanger, its heat exchange performance is greatly improved compared to a gas-to-gas heat exchanger, thereby significantly optimizing the heat dissipation and cooling effect. The radiator 18 has no reserved interfaces with the outside, which greatly reduces the risk of leakage. Even if leakage occurs, the phase change working fluid will evaporate rapidly and will not cause significant damage to the electrical components 12. This increases the practicality of the radiator 18 and reduces the maintenance cost of the electrical equipment 10. Furthermore, since the evaporator 181 and the condenser 182 share the same manifold 183, compared with the common gas pipe and liquid pipe scheme, it not only simplifies the assembly process but also achieves cost control.

[0090] The radiator 18 provided in this application embodiment, through the structural design of the evaporator 181 connected to the first segment 1831 and the condenser 182 connected to the second segment 1832, significantly improves the heat exchange performance per unit space within a certain volume, significantly optimizes the heat dissipation effect, reduces the risk of leakage, is conducive to the long-term safe and stable operation of the electrical equipment 10, reduces the maintenance cost of the electrical equipment 10, and at the same time reduces the internal space occupied by the radiator 18, which helps to optimize the spatial layout of the electrical components 12 inside the electrical equipment 10, thereby improving the space utilization rate. Moreover, it does not require the introduction of other parts or major modifications to the existing structure, which is conducive to promotion and use. In addition, the design of the evaporator 181 and the condenser 182 sharing the same busbar 183 simplifies the assembly process and achieves cost control of the radiator 18.

[0091] In some embodiments, as shown in Figures 1-8, the flow channels of the evaporator 181 extend in a straight line.

[0092] In related technologies, some electrical equipment also uses phase change heat exchangers as radiators to cool internal electrical components. However, traditional phase change heat exchangers have significant limitations in placement due to the need for gravity. Specifically, to maximize heat dissipation capacity, phase change heat exchangers are usually placed in the top area of ​​electronic equipment, resulting in excessive height space occupied by the electronic equipment. In order to place them in the side area of ​​electronic equipment, some phase change heat exchangers have been designed by bending or folding the shape of the evaporator to isolate the condenser from the chamber where the electrical components are located. Although this solution can increase the diversity of phase change heat exchangers in terms of placement, in practical applications, the medium flow resistance of the evaporator is greatly increased, which slows down the circulation rate of the phase change medium and reduces the heat dissipation efficiency.

[0093] It is understandable that, based on the above, the evaporator 181 is connected to the first segment 1831 and the condenser 182 is connected to the second segment 1832. In other words, the evaporator 181 and the condenser 182 are staggered along the length of the manifold 183. In this way, when the radiator 18 needs to be installed on the side of the electrical equipment 10, the evaporator 181 does not need to be deformed or twisted in any shape or structure. It can retain the common structure of the evaporator 181, that is, the flow channel of the evaporator 181 extends in a straight line. In this case, the phase change medium can flow in a straight line in the flow channel of the evaporator 181, effectively reducing the medium flow resistance of the evaporator 181, accelerating the circulation rate of the phase change medium, helping to reduce the heat accumulation inside the electrical equipment 10, thereby significantly improving the heat dissipation efficiency.

[0094] In some embodiments, as shown in Figures 1-8, the flow path of the condenser 182 extends in a straight line.

[0095] In related technologies, some electrical equipment also uses phase change heat exchangers as radiators to cool internal electrical components. However, traditional phase change heat exchangers have significant limitations in placement due to the need for gravity. Specifically, to maximize heat dissipation capacity, phase change heat exchangers are usually placed in the top area of ​​electronic equipment, resulting in excessive height space occupied by the electronic equipment. In order to place them in the side area of ​​electronic equipment, some phase change heat exchangers have been designed by bending or folding the shape of the condenser to isolate the condenser from the chamber where the electrical components are located. Although this solution can increase the diversity of phase change heat exchangers in terms of placement, in practical applications, the medium flow resistance of the condenser is greatly increased, which slows down the circulation rate of the phase change medium and reduces the heat dissipation efficiency.

[0096] It is understandable that, based on the above, the evaporator 181 is connected to the first segment 1831 and the condenser 182 is connected to the second segment 1832. In other words, the evaporator 181 and the condenser 182 are staggered along the length of the manifold 183. In this way, when the radiator 18 needs to be installed on the side of the electrical equipment 10, the condenser 182 does not need to be deformed or twisted in any shape or structure. It can retain the common structure of the condenser 182, that is, the flow channel of the condenser 182 extends in a straight line. In this case, the phase change medium can flow in a straight line in the flow channel of the condenser 182, effectively reducing the medium flow resistance of the condenser 182, accelerating the circulation rate of the phase change medium, helping to reduce the heat accumulation inside the electrical equipment 10, thereby significantly improving the heat dissipation efficiency.

[0097] In some embodiments, as shown in Figures 1-8, the evaporator 181 is connected to the side 18312 of the first segment 1831, and the condenser 182 is connected to the side 18322 of the second segment 1832.

[0098] By connecting the evaporator 181 and condenser 182 to the side of the manifold 183, the communication area between the evaporator 181 and condenser 182 and the manifold 183 is increased, while the assembly difficulty between the evaporator 181 and condenser 182 and the manifold 183 is reduced.

[0099] In some embodiments, as shown in Figures 1 and 2, the first segment 1831 and the second segment 1832 both extend along a third direction, and the end 18311 of the first segment 1831 and the end 18321 of the second segment 1832 are connected together, and the third direction intersects with the first direction.

[0100] In this embodiment, as shown in Figures 1 and 2, the first segment 1831 and the second segment 1832 can be integrally formed. Both the first segment 1831 and the second segment 1832 are straight segments. The first end of the first segment 1831 along the third direction is directly connected to the second end of the second segment 1832 along the third direction to form a continuous pipe. The entire manifold 183 is in the shape of a straight line. In this case, the length direction of the manifold 183 is the third direction.

[0101] In addition to being straight lines, the first segment 1831 and the second segment 1832 can also be designed into other shapes, such as arc segments, wavy segments, or serrated segments, etc. There are no restrictions here.

[0102] For example, as shown in Figure 1, the first direction and the second direction intersect. The first direction is an oblique direction at an acute angle to the vertical, the second direction is an oblique direction at an acute angle to the vertical, and the third direction is an oblique direction at an acute angle to the horizontal.

[0103] For example, as shown in Figure 2, the first direction and the second direction are parallel, both the first direction and the second direction are vertical, and the third direction is horizontal.

[0104] The radiator 18 provided in this application embodiment has a structural design in which the first segment 1831 and the second segment 1832 both extend along the third direction and are connected at their ends. This design allows the busbar 183 to extend along the third direction as a whole, which is beneficial for arrangement in a limited space and improves space utilization. At the same time, the overall structure is simple, which reduces the flow resistance of the phase change medium in the busbar 183 and facilitates rapid heat exchange.

[0105] In some embodiments, as shown in Figures 3 and 4, the first segment 1831 extends along a fourth direction, the second segment 1832 extends along a fifth direction intersecting the fourth direction, the end 18311 of the first segment 1831 and the end 18321 of the second segment 1832 are bent and connected, and the fourth direction intersects the first direction.

[0106] In this embodiment, as shown in Figures 3 and 4, the first segment 1831 and the second segment 1832 can be integrally formed. Both the first segment 1831 and the second segment 1832 are straight segments. One end of the first segment 1831 along the fourth direction is connected to the end of the second segment 1832 along the fifth direction at a 90° bend, forming a continuous pipe. The entire manifold 183 is L-shaped. In this case, the length direction of the manifold 183 includes the fourth direction and the fifth direction.

[0107] The bending angle between the first segment 1831 and the second segment 1832 can be any angle other than 90°, such as 60°, 85° or 120°, etc., without any restrictions.

[0108] For example, as shown in Figure 3, the first direction, the second direction and the fifth direction are all parallel to each other, the first direction, the second direction and the fifth direction are all oblique directions at an acute angle to the vertical, and the fourth direction is oblique direction at an acute angle to the horizontal.

[0109] For example, as shown in Figure 4, the first direction, the second direction, and the fifth direction are all parallel to each other, the first direction, the second direction, and the fifth direction are all vertical, and the fourth direction is horizontal.

[0110] The radiator 18 provided in this application embodiment, through the structural design of the first segment 1831 and the second segment 1832 extending in different directions and connected by bending at the ends, can more flexibly adapt to the internal spatial layout of the electrical equipment 10, especially in cases of limited or irregular space. At the same time, the bent portion can disperse and absorb the force generated by thermal expansion or mechanical vibration to provide additional structural strength.

[0111] In some embodiments, as shown in Figures 3 and 4, the condenser 182 is also connected to the surface of the second segment 1832 on the side opposite to the first segment 1831.

[0112] In actual implementation, as shown in Figures 3 and 4, when installing the radiator 18, at least a portion of the condenser 182 is positioned higher than the evaporator 181 along the direction of gravity to maintain smooth flow of the phase change medium. Specifically, after the radiator 18 is placed, the condenser 182 can be completely positioned above the evaporator 181 along the direction of gravity to minimize the flow resistance of the phase change medium. The condenser 182 can be installed on the side 18322 of the second section 1832, located on the side of the second section 1832 along the fourth direction and away from the first section 1831 and the evaporator 181. In this case, the interference of the first section 1831 and the evaporator 181 on the condenser 182 is minimal, and the airflow of the condenser 182 is not significantly obstructed by the first section 1831 and the evaporator 181, thereby improving the heat exchange efficiency of the condenser 182.

[0113] The radiator 18 provided in this application embodiment, through the layout design of the condenser 182 connected to the surface of the second segment 1832 away from the first segment 1831, reduces the interference of the first segment 1831 and the evaporator 181 on the condenser 182, thereby improving the heat exchange efficiency of the condenser 182.

[0114] In some embodiments, as shown in Figures 3 and 4, the manifold 183 further has multiple plates, the evaporator 181 includes multiple first heat exchange plates 1811, and the condenser 182 includes multiple second heat exchange plates 1821. One end of the first heat exchange plate 1811 is connected to a plate on one side of the manifold 183, and one end of the second heat exchange plate 1821 is connected to a plate on one side of the manifold 183.

[0115] The first heat exchange plate 1811 is arranged in a direction parallel to the first direction, and the second heat exchange plate 1821 is arranged in a direction parallel to the second direction.

[0116] As can be understood, as shown in Figures 3 and 4, and with the manifold 183 having a flat cross-section, meaning its height is much smaller than its width and length, the manifold 183 appears as a flat tube. The plate surface is the large surface of the flat tube-shaped manifold 183. The first heat exchange plate 1811 and the second heat exchange plate 1821 can be connected to the same side of the manifold 183 or to the opposite side. By connecting the plate surface to the first heat exchange plate 1811 and the second heat exchange plate 1821, the contact area between the manifold 183 and the evaporator 181 and the condenser 182 is increased, thereby further improving heat exchange efficiency and optimizing the heat exchange effect.

[0117] In some embodiments, as shown in Figures 5-8, the first segment 1831 extends along the sixth direction, and the second segment 1832 extends along the seventh direction intersecting the sixth direction. The end portion 18311 of the first segment 1831 is connected to the side portion 18322 or the end portion 18321 of the second segment 1832. Both the sixth and seventh directions intersect with the first direction.

[0118] In this embodiment, as shown in Figures 5 and 6, the first segment 1831 and the second segment 1832 can be integrally formed. Both the first segment 1831 and the second segment 1832 are straight segments. One end of the first segment 1831 along the sixth direction is connected at a 90° angle to the middle area of ​​the side portion 18322 of the second segment 1832, forming a continuous pipe. The entire manifold 183 is T-shaped. The middle area of ​​the side portion 18322 of the second segment 1832 can be the area near the center line of the side portion 18322 along the length direction. In this case, the length direction of the manifold 183 includes the sixth direction and the seventh direction.

[0119] In other embodiments, as shown in Figures 7 and 8, the first segment 1831 and the second segment 1832 can be integrally formed. Both the first segment 1831 and the second segment 1832 are straight segments. One end of the first segment 1831 along the sixth direction is connected to one end of the second segment 1832 along the seventh direction at a 90° angle to form a continuous pipe. The entire manifold 183 is L-shaped. In this case, the length direction of the manifold 183 includes the sixth direction and the seventh direction.

[0120] The bending angle between the first segment 1831 and the second segment 1832 can be any angle other than 90°, such as 75°, 88.6°, 100° or 150°, etc. There are no restrictions here.

[0121] For example, as shown in Figures 5, 7 and 8, the first direction and the second direction are parallel, both the first direction and the second direction are oblique directions at an acute angle to the vertical, the sixth direction is oblique direction at an acute angle to the horizontal, and the seventh direction is oblique direction at an acute angle to the longitudinal direction.

[0122] For example, as shown in Figure 6, the first direction and the second direction are parallel, both the first direction and the second direction are vertical, the sixth direction is horizontal, and the seventh direction is vertical.

[0123] The radiator 18 provided in this application embodiment, through the structural design of the first segment 1831 and the second segment 1832 extending in different directions and the end 18311 of the first segment 1831 being connected to the side 18322 or end 18321 of the second segment 1832, can make more effective use of space, reduce the volume occupied by the radiator 18, and at the same time provide more structural flexibility, allowing the busbar 183 to be laid out in different directions to adapt to the specific spatial layout and structural requirements inside the electrical equipment 10.

[0124] It should be noted that, in addition to the four embodiments mentioned above, the busbar 183 of this application can also be designed in various other structural forms, such as the first segment 1831 and the second segment 1832 being cross-connected, etc., without limitation. In actual design, a suitable structural form can be selected according to the space conditions and heat dissipation requirements of the electrical equipment 10.

[0125] In some embodiments, as shown in Figures 2, 4 and 9, the heat sink 18 further includes a flow guiding structure 184.

[0126] The flow guiding structure 184 is disposed within the manifold 183, and the flow guiding structure 184 has a flow guiding channel 1841 for promoting the flow of the phase change medium toward the end of the manifold 183.

[0127] The flow guiding structure 184 may include, but is not limited to, a flow guide plate, fins, a flow guide tube or other forms of flow diversion device, which are not limited here.

[0128] For example, in some embodiments, as shown in Figures 2, 4 and 9, the flow guiding structure 184 includes a flow guide plate.

[0129] In some embodiments, as shown in FIG2, the flow guiding structure 184 forms a flow guiding channel 1841 with an oblique opening. Specifically, one end of the flow guiding channel 1841 can face the far end of the evaporator 181 in a third direction, and the other end of the flow guiding channel 1841 can face the far end of the condenser 182 in a third direction. This design allows more of the phase change medium to be guided to the far ends of the evaporator 181 and condenser 182, reducing the dense accumulation of the phase change medium in local areas.

[0130] In other embodiments, as shown in Figures 4 and 9, the flow guiding structure 184 forms multiple flow guiding channels 1841, where "multiple" indicates two or more. The design principle for the flow area of ​​the multiple flow guiding channels 1841 can be "larger at the far end and smaller at the near end." Specifically, the flow area of ​​the flow guiding channel 1841 near the far end of the evaporator 181 can be larger than that of the flow guiding channel 1841 near the middle of the evaporator 181, and the flow area of ​​the flow guiding channel 1841 near the middle of the evaporator 181 can be larger than that of the flow guiding channel 1841 near the near end of the evaporator 181. This design helps to achieve a more uniform flow distribution of the phase change medium within the evaporator 181 and condenser 182, reducing local temperature fluctuations.

[0131] The radiator 18 provided in this application embodiment, through the design of the above-mentioned flow guiding structure 184, realizes the orderly flow of the phase change medium in the manifold 183, so that the phase change medium can enter the evaporator 181 and the condenser 182 evenly and efficiently, which helps to improve the overall heat dissipation efficiency of the radiator 18. At the same time, the flow guiding structure 184 can realize the diversion of the medium at the near and far ends by adjusting the distribution and flow area of ​​the flow guiding channel 1841, thereby reducing local temperature fluctuations and maintaining the stable operation of the electrical equipment 10.

[0132] In some embodiments, as shown in Figures 1, 2 and 5-8, the manifold 183 is a circular tube.

[0133] In this embodiment, as shown in Figures 1, 2 and 5-8, both the first segment 1831 and the second segment 1832 are cylindrical tubes. The ports of the first segment 1831 along the length direction are all circular, and the ports of the second segment 1832 along the length direction are all circular.

[0134] In other embodiments, the manifold 183 is an elliptical tube, that is, the first segment 1831 and the second segment 1832 are both elliptical cylindrical tubes, the ports of the first segment 1831 along the length direction are all elliptical, and the ports of the second segment 1832 along the length direction are all elliptical.

[0135] The radiator 18 provided in this application embodiment, by designing the manifold 183 as a circular tube structure as described above, provides a smooth inner wall for the manifold 183, which helps to reduce the frictional resistance when the phase change medium flows, and helps the phase change medium to flow more smoothly between the evaporator 181 and the condenser 182, thereby improving the flow efficiency of the phase change medium. At the same time, the manufacturing process of the circular tube manifold 183 is relatively mature, and it can be produced by various forming techniques (such as stretching, bending, etc.), which helps to reduce manufacturing costs and improve production efficiency. In addition, the circular tube structure exhibits good stability when subjected to internal pressure, which helps to improve the reliability and durability of the entire radiator 18.

[0136] In some embodiments, as shown in Figures 3 and 4, the manifold 183 is a flat tube type.

[0137] In this embodiment, as shown in Figures 3 and 4, both the first segment 1831 and the second segment 1832 are long flat tubes. The ports of the first segment 1831 along the length direction are rectangular, and the ports of the second segment 1832 along the length direction are also rectangular.

[0138] The radiator 18 provided in this application embodiment, by designing the busbar 183 as a flat tube structure as described above, can provide a larger surface area to volume ratio, increase the contact area between the phase change medium and the tube wall, thereby helping to improve heat exchange efficiency. At the same time, the flat tube busbar 183 can more easily adapt to the layout requirements inside the electrical equipment 10, especially in cases where space is limited or a specific orientation is required.

[0139] In some embodiments, as shown in Figures 1-6-8, the evaporator 181 includes a first heat exchange plate 1811 and a first heat dissipation fin 1812.

[0140] The first heat exchange plate 1811 is used for the flow of phase change medium; the first heat dissipation fins 1812 are installed on the first heat exchange plate 1811.

[0141] In this embodiment, the first heat exchange plate 1811 can adopt a microchannel design, that is, a large number of tiny flow channels are processed inside the first heat exchange plate 1811 for the flow of phase change medium, and the first heat dissipation fins 1812 are tightly attached to the surface of these microchannels.

[0142] The connection method between the first heat exchange plate 1811 and the first heat dissipation fin 1812 may include, but is not limited to, welding, riveting or pressing, etc., and is not limited here.

[0143] For example, in some embodiments, the connection between the first heat exchange plate 1811 and the first heat dissipation fin 1812 is welding.

[0144] The first heat dissipation fin 1812 can be designed as a straight line, a serrated line, a needle-shaped line, or a wavy line, etc., without any restrictions.

[0145] For example, in some embodiments, as shown in Figures 1-6-8, the first heat dissipation fin 1812 is designed in a serrated shape.

[0146] The radiator 18 provided in this application embodiment increases the surface area of ​​the evaporator 181 by setting the first heat exchange plate 1811 and the first heat dissipation fins 1812, which helps to increase the contact area between the evaporator 181 and the surrounding air, promotes the transfer of heat in the evaporator 181, and thus improves the heat exchange efficiency of the evaporator 181.

[0147] In some embodiments, as shown in Figures 1-6-8, the condenser 182 includes: a second heat exchange plate 1821 and a second heat dissipation fin 1822.

[0148] The second heat exchange plate 1821 is used for the flow of phase change medium; the second heat dissipation fins 1822 are installed on the second heat exchange plate 1821.

[0149] In this embodiment, the second heat exchange plate 1821 can adopt a microchannel design, that is, a large number of tiny flow channels are processed inside the second heat exchange plate 1821 for the flow of phase change medium, and the second heat dissipation fins 1822 are tightly attached to the surface of these microchannels.

[0150] The connection method between the second heat exchange plate 1821 and the second heat dissipation fin 1822 may include, but is not limited to, welding, riveting or pressing, etc., and is not limited here.

[0151] For example, in some embodiments, the connection between the second heat exchange plate 1821 and the second heat dissipation fin 1822 is a press-fit connection.

[0152] The second heat dissipation fin 1822 can be designed as a straight line, a serrated line, a needle-shaped line, or a wavy line, etc., and there are no restrictions here.

[0153] For example, in some embodiments, as shown in Figures 1-6-8, the second heat dissipation fin 1822 is designed in a serrated shape.

[0154] In other embodiments, a heat pipe is embedded inside the second heat exchange plate 1821. One end of the heat pipe is in contact with the phase change medium, and the other end is connected to the second heat dissipation fins 1822. The heat pipe efficiently transfers heat by utilizing the phase change process of the internal working medium.

[0155] The radiator 18 provided in this application embodiment increases the surface area of ​​the condenser 182 by setting the second heat exchange plate 1821 and the second heat dissipation fins 1822, which helps to increase the contact area between the condenser 182 and the surrounding air, promotes the transfer of heat in the condenser 182, and thus improves the heat exchange efficiency of the condenser 182.

[0156] In some embodiments, as shown in Figures 1, 2 and 5-8, the end of the first heat exchange plate 1811 is connected to the side portion 18312 of the first segment 1831, and the first heat dissipation fins 1812 are mounted on the side portion of the first heat exchange plate 1811; the end of the second heat exchange plate 1821 is connected to the side portion 18322 of the second segment 1832, and the second heat dissipation fins 1822 are mounted on the side portion of the second heat exchange plate 1821.

[0157] Multiple first heat dissipation fins 1812 can be provided, and multiple first heat dissipation fins 1812 are distributed at intervals. Multiple means two or more.

[0158] For example, in some embodiments, twelve first heat dissipation fins 1812 may be provided.

[0159] For example, as shown in Figures 1, 2 and 5-8, a plurality of first heat dissipation fins 1812 are distributed in a horizontal direction or at an acute angle to the horizontal direction, and the first heat dissipation fins 1812 may extend in a vertical direction or at an acute angle to the vertical direction.

[0160] Multiple second heat dissipation fins 1822 can be provided, and multiple second heat dissipation fins 1822 are distributed at intervals. Multiple means two or more.

[0161] For example, in some embodiments, ten second heat dissipation fins 1822 may be provided.

[0162] For example, as shown in Figures 1, 2 and 5-8, a plurality of second heat dissipation fins 1822 are spaced apart along the horizontal direction, the vertical direction, the oblique direction at an acute angle to the horizontal direction or the oblique direction at an acute angle to the vertical direction, and the second heat dissipation fins 1822 may extend along the vertical direction or the oblique direction at an acute angle to the vertical direction.

[0163] As shown in Figures 1, 2, and 5-8, the first heat exchange plate 1811 is designed as a hollow structure and is interconnected with the first segment 1831. The first heat exchange plate 1811 can be connected to the first segment 1831 by welding, riveting, pressing, or threaded connection. The second heat exchange plate 1821 is designed as a hollow structure and is interconnected with the second segment 1832. The second heat exchange plate 1821 can be connected to the second segment 1832 by welding, riveting, pressing, or threaded connection.

[0164] The radiator 18 provided in this application embodiment, through the assembly form between the first heat exchange plate 1811, the first section 1831 and the first heat dissipation fin 1812 and the assembly form between the second heat exchange plate 1821, the second section 1832 and the second heat dissipation fin 1822, can maximize the heat exchange area. More heat can be transferred from the phase change medium to the environment in the same time, thereby improving the heat exchange efficiency. It can also make more efficient use of space. Especially in space-constrained situations, it can reduce the occupancy of the evaporator 181 in the length or width direction, leaving more space for other components. It also avoids obstacles or space restrictions that may be encountered when installing at the top or bottom, making the overall layout more compact and reasonable.

[0165] In some embodiments, as shown in Figures 1, 2 and 5-8, the evaporator 181 further includes a first manifold 1813.

[0166] The first manifold 1813 is connected to the end of the first heat exchange plate 1811 that is away from the first section 1831.

[0167] In this embodiment, as shown in Figures 1, 2 and 5-8, the first manifold 1813 can be designed as a circular tube. The first end of the first heat exchange plate 1811 along the first direction can be connected to the first section 1831, and the second end of the first heat exchange plate 1811 along the first direction can be connected to the side of the first manifold 1813. A large amount of liquid phase change medium can gradually leave the condenser 182 and flow to the manifold 183, and finally fall back and collect in the first manifold 1813.

[0168] The connection method between the first manifold 1813 and the first heat exchange plate 1811 may include, but is not limited to, welding, riveting or pressing, etc., and no restriction is imposed here.

[0169] For example, in some embodiments, the connection between the first manifold 1813 and the first heat exchange plate 1811 is welding.

[0170] The radiator 18 provided in this application embodiment, through the arrangement of the first manifold 1813, helps to evenly distribute the liquid phase change medium, so that the heat exchange efficiency of each part of the first heat exchange plate 1811 is as consistent as possible, and at the same time, it more effectively controls the flow of the phase change medium in the evaporator 181, reduces dead zones and eddies, thereby improving the heat exchange performance of the evaporator 181.

[0171] In some embodiments, as shown in Figures 1, 2 and 5-8, the condenser 182 further includes a second manifold 1823.

[0172] The second manifold 1823 is connected to the end of the second heat exchange plate 1821 that is away from the second section 1832.

[0173] In this embodiment, as shown in Figures 1, 2 and 5-8, the second manifold 1823 can be designed as a circular tube. The first end of the second heat exchange plate 1821 along the second direction can be connected to the side of the second manifold 1823. The second end of the first heat exchange plate 1811 along the second direction can be connected to the second section 1832. A large amount of gaseous phase change medium can gradually leave the evaporator 181 and flow to the manifold 183, and finally rise and collect in the second manifold 1823.

[0174] The connection method between the second manifold 1823 and the second heat exchange plate 1821 may include, but is not limited to, welding, riveting or pressing, etc., and no restrictions are imposed here.

[0175] For example, in some embodiments, the connection between the second manifold 1823 and the second heat exchange plate 1821 is welding.

[0176] The radiator 18 provided in this application embodiment, through the arrangement of the second manifold 1823, helps to evenly distribute the gaseous phase change medium, so that the heat exchange efficiency of each part of the second heat exchange plate 1821 is as consistent as possible, and at the same time, it more effectively controls the flow of the phase change medium in the condenser 182, reduces dead zones and eddies, thereby improving the heat exchange performance of the condenser 182.

[0177] In some embodiments, as shown in Figures 3 and 4, the first heat exchange plate 1811 includes a plurality of spaced-apart plates, the sides of the plurality of first heat exchange plates 1811 being connected to the sides 18312 of the first segment 1831, and the first heat dissipation fins 1812 being installed between two adjacent first heat exchange plates 1811; the second heat exchange plate 1821 includes a plurality of spaced-apart plates, the sides of the plurality of second heat exchange plates 1821 being connected to the sides 18322 of the second segment 1832, and the second heat dissipation fins 1822 being installed between two adjacent second heat exchange plates 1821.

[0178] "Multiple" here means two or more.

[0179] For example, in some embodiments, eight first heat exchange plates 1811 may be provided, and correspondingly, seven first heat dissipation fins 1812 may be provided.

[0180] For example, as shown in Figures 3 and 4, a plurality of first heat exchange plates 1811 are distributed in a transverse direction or at an acute angle to the transverse direction, and the first heat exchange plates 1811 may extend in a vertical direction or at an acute angle to the vertical direction.

[0181] For example, in some embodiments, fifteen second heat exchange plates 1821 may be provided, and correspondingly, fourteen second heat dissipation fins 1822 may be provided.

[0182] For example, as shown in Figures 3 and 4, a plurality of second heat exchange plates 1821 are distributed at intervals along the longitudinal direction or at an acute angle to the longitudinal direction, and the second heat exchange plates 1821 may extend along the vertical direction or at an acute angle to the vertical direction.

[0183] In actual implementation, multiple first heat exchange plates 1811 can be spaced apart along the length of the first segment 1831. The sides of the multiple first heat exchange plates 1811 are closely connected to the sides 18312 of the first segment 1831, forming a stable support structure. The multiple first heat exchange plates 1811 can be arranged in parallel or in other layouts suitable for the flow of the phase change medium. Multiple second heat exchange plates 1821 can be spaced apart along the length of the second segment 1832. The sides of the multiple second heat exchange plates 1821 are closely connected to the sides 18322 of the second segment 1832, forming a stable support structure. The multiple second heat exchange plates 1821 can be arranged in parallel or in other layouts suitable for the flow of the phase change medium. A first heat dissipation fin 1812 is installed between each pair of adjacent first heat exchange plates 1811. The first heat dissipation fin 1812 can be perpendicular or inclined to the surface of the first heat exchange plate 1811 to increase the heat exchange area and promote airflow, thereby improving the heat exchange efficiency. A second heat dissipation fin 1822 is installed between each pair of adjacent second heat exchange plates 1821. The second heat dissipation fin 1822 can be perpendicular or inclined to the surface of the second heat exchange plate 1821 to increase the heat exchange area and promote airflow, thereby improving the heat exchange efficiency.

[0184] The radiator 18 provided in this application embodiment, by distributing the first heat exchange plate 1811 at intervals and installing the first heat dissipation fins 1812, and distributing the second heat exchange plate 1821 at intervals and installing the second heat dissipation fins 1822, can make the temperature distribution in the evaporator 181 and condenser 182 more uniform, which helps to reduce the occurrence of local overheating and overcooling, and improves the stability and reliability of the radiator 18.

[0185] This application also discloses an electrical device 10.

[0186] In some embodiments, as shown in Figures 10-22, the electrical device 10 includes: a chassis 11, electrical components 12, and a heat sink 18 as described above.

[0187] The chassis 11 defines a first receiving cavity 111; electrical components 12 are mounted in the first receiving cavity 111; the evaporator 181 of the radiator 18 is located in the first receiving cavity 111, and the condenser 182 of the radiator 18 is located outside the chassis 11.

[0188] It should be noted that the electrical equipment 10 may include, but is not limited to, inverters, converters, or combiner boxes, etc., and no restrictions are imposed here.

[0189] The electrical device 10 may further include: a protective cover 13, which is mounted on the chassis 11 and defines a second receiving cavity 131, wherein the condenser 182 is located in the second receiving cavity 131.

[0190] As shown in Figures 10, 14 and 18, the chassis 11 can be a hollow structure with one side open, which is then fixedly connected with other components (such as a cover plate) to form a sealed first receiving cavity 111. The protective cover 13 can be a hollow structure with one side open, and the non-open side of the chassis 11 can be connected to the open side of the protective cover 13 to form a second receiving cavity 131.

[0191] As shown in Figures 11-13, 15-17, and 19-22, the evaporator 181 and the first section 1831 are arranged in the first receiving cavity 111. The evaporator 181 is used to dissipate heat for the electrical components 12 in the first receiving cavity 111. The electrical components 12 include a PCB board 121 (Printed Circuit Board) and electronic devices 122 electrically connected to the PCB board 121. The condenser 182 and the second section 1832 are arranged in the second receiving cavity 131. The condenser 182 is used to exchange heat with the external environment.

[0192] The electrical equipment 10 provided in this application embodiment reduces the internal space occupied by the radiator 18 through the above-mentioned arrangement of the radiator 18, which helps to optimize the spatial layout of electrical components 12 in the first receiving cavity 111, thereby improving space utilization. The separate cavity arrangement of the evaporator 181 and the condenser 182 helps to achieve more effective heat exchange and thermal management, improves the heat dissipation efficiency of the condenser 182, reduces the thermal impact on the evaporator 181, and significantly improves the heat exchange performance, significantly optimizes the heat dissipation effect, reduces the risk of leakage, and is conducive to the long-term safe and stable operation of the electrical equipment 10, and reduces the maintenance cost of the electrical equipment 10. In addition, the design of the evaporator 181 and the condenser 182 sharing the same busbar 183 simplifies the assembly process and realizes cost control of the radiator 18.

[0193] In some embodiments, as shown in Figures 12, 16 and 20, the busbar 183 of the heat sink 18 extends through the chassis 11 along its length.

[0194] Understandably, since the busbar 183 of the heat sink 18 runs through the chassis 11 along its length, only a through hole matching the end face of the busbar 183 needs to be machined on the chassis 11. The chassis 11 does not need to have a large area of ​​opening. While not seriously affecting the structural strength of the chassis 11 itself, it also reduces the area required for sealing after machining the through hole, reduces the difficulty of sealing operation, and thus helps to optimize the protective performance of the chassis 11.

[0195] In other embodiments, the busbar 183 of the heat sink 18 extends through the chassis 11 in the width direction.

[0196] In some other embodiments, the busbar 183 of the heat sink 18 extends through the chassis 11 in the height direction.

[0197] In some embodiments, as shown in Figures 10, 14 and 18, the protective cover 13 has a first air vent 132 and a second air vent 133 that are separated from each other, and the first air vent 132 and the second air vent 133 are respectively located on two adjacent walls of the protective cover 13.

[0198] In this embodiment, as shown in Figures 10, 14 and 18, the first air vent 132 can be located on the wall of the protective cover 13 along the horizontal direction and opposite to the opening. The first air vent 132 can be provided with a wire mesh structure to achieve filtration and protection. The second air vent 133 can be located on the wall of the protective cover 13 along the vertical direction and the wall along the longitudinal direction. Specifically, the second air vent 133 can be located on the top wall of the protective cover 13 and a wall along the longitudinal direction. The second air vent 133 can be provided with a wire mesh structure to achieve filtration and protection.

[0199] Understandably, in related technologies, electrical equipment using air-to-air heat exchangers as radiators requires the air to pass through four 90° bends after being drawn in from the external environment before it can be returned to the external environment after heat exchange, resulting in significant resistance throughout the flow path. As shown in Figures 9, 13, and 17, since this application uses the aforementioned radiator 18, the flow path only needs to pass through one bend to return the heat-exchanged air to the environment, greatly reducing the resistance of the entire airflow path and effectively improving the heat exchange efficiency.

[0200] The electrical equipment 10 provided in this application embodiment, through the arrangement of the first air vent 132 and the second air vent 133 adjacently distributed on the protective cover 13, significantly reduces the flow resistance of the entire circulating air path compared to the scheme using an air-to-air heat exchanger, thereby effectively improving the heat exchange efficiency.

[0201] In some embodiments, as shown in Figures 11, 13, 15, 17, 19, 21 and 22, the electrical equipment 10 further includes a first fan 14 and a second fan 15.

[0202] The first fan 14 is installed on the casing 11 and is used to drive the airflow in the first receiving cavity 111; the second fan 15 is installed on the protective cover 13 and is used to drive the airflow in the second receiving cavity 131.

[0203] In this embodiment, as shown in Figures 11, 13, 15, 17, 19, 21, and 22, the first fan 14 can be installed in the first receiving cavity 111. The first fan 14 can be longitudinally arranged between the evaporator 181 and the electrical component 12, and can be connected to the casing 11 by means of threaded connection, riveting, or snap-fit. The second fan 15 can be installed in the second receiving cavity 131. The second fan 15 can be located at the first air outlet 132, and can be connected to the protective cover 13 by means of threaded connection, riveting, or snap-fit.

[0204] Among them, the first fan 14 can be set to one or more, and the second fan 15 can be set to one or more, where "more" means two or more.

[0205] For example, in some embodiments, as shown in Figures 11, 13, 15, 17, 19, 21 and 22, one first fan 14 is provided and four second fans 15 are provided.

[0206] The electrical equipment 10 provided in this application embodiment, through the arrangement of the first fan 14 and the second fan 15, realizes forced airflow in the first receiving cavity 111 and the second receiving cavity 131, which can effectively improve heat dissipation efficiency and more precisely and independently control the airflow distribution in the first receiving cavity 111 and the second receiving cavity 131. It can adjust the speed and airflow direction of the first fan 14 and the second fan 15 according to the heat source distribution and heat dissipation requirements of the first receiving cavity 111 and the second receiving cavity 131 to achieve the best heat dissipation effect.

[0207] In some embodiments, as shown in Figures 11, 15, 19 and 22, the electrical device 10 further includes a magnetic device 16 and a heat dissipation component 17.

[0208] The magnetic device 16 is installed in the second receiving cavity 131; the heat dissipation component 17 is installed in the second receiving cavity 131, and the heat dissipation component 17 is separated from the heat sink 18 and the magnetic device 16.

[0209] In this embodiment, as shown in Figures 11, 15, 19, and 22, the magnetic device 16 includes a plurality of spaced-apart magnetic devices 16. Among the plurality of magnetic devices 16, a portion of the magnetic devices 16 can be longitudinally spaced above the heat sink 18 component, and another portion of the magnetic devices 16 can be longitudinally spaced below the heat sink 18 component. The condenser 182 can be located on one side of the magnetic device 16 and the heat sink component 17 along the longitudinal direction. Specifically, the heat sink component 17 can define a vertical air duct, thereby guiding the airflow in the second receiving cavity 131 to the magnetic device 16 in an orderly manner, further dissipating heat and cooling the magnetic device 16.

[0210] In this context, "multiple" refers to two or more. For example, in some embodiments, as shown in Figures 12 and 16, the magnetic device 16 includes five spaced-apart magnetic devices 16. Among the five magnetic devices 16, three magnetic devices 16 can be longitudinally separated and arranged above the heat sink 18 component, and two magnetic devices 16 can be longitudinally separated and arranged below the heat sink 18 component.

[0211] The electrical equipment 10 provided in this application embodiment, through the arrangement of the magnetic device 16 and the heat dissipation component 17, the heat dissipation component 17 can promote the orderly flow of air in the second receiving cavity 131 to the magnetic device 16, thereby realizing the simultaneous heat dissipation and cooling of the magnetic device 16 and the condenser 182 by the second fan 15, so that the magnetic device 16 can work at a suitable temperature to maintain the normal operation of the magnetic device 16.

[0212] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0213] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0214] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0215] In the description of this application, "multiple" means two or more.

[0216] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0217] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0218] Other configurations of the embodiments of this application, such as ... and ..., and operations, are known to those skilled in the art and will not be described in detail here.

[0219] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0220] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat sink (18) characterized by, include: Evaporator (181); Condenser (182); A manifold (183) is provided, through which the evaporator (181) and the condenser (182) are interconnected. The evaporator (181), the condenser (182), and the manifold (183) are used for the flow of a phase change medium. The phase change medium flows in the evaporator (181) in a first direction and in the condenser (182) in a second direction. Both the first and second directions intersect the length direction of the manifold (183). The manifold (183) includes a first section (1831) and a second section (1832) connected along the length direction. The evaporator (181) is connected to the first section (1831), and the condenser (182) is connected to the second section (1832).

2. The radiator (18) according to claim 1, characterized in that, The flow channel of the evaporator (181) extends in a straight line; And / or, The flow path of the condenser (182) extends in a straight line.

3. The heat sink (18) according to claim 1 or 2, characterized in that The evaporator (181) is connected to the side (18312) of the first section (1831), and the condenser (182) is connected to the side (18322) of the second section (1832).

4. The heat sink (18) according to any one of claims 1-3, characterized in that, Both the first segment (1831) and the second segment (1832) extend along a third direction, and the end (18311) of the first segment (1831) and the end (18321) of the second segment (1832) are connected, and the third direction intersects with the first direction.

5. The heat sink (18) according to any one of claims 1-3, characterized in that, The first segment (1831) extends along the fourth direction, and the second segment (1832) extends along the fifth direction that intersects with the fourth direction. The end (18311) of the first segment (1831) and the end (18321) of the second segment (1832) are bent and connected. The fourth direction intersects with the first direction.

6. The heat sink (18) of claim 5, characterized in that The condenser (182) is also connected to the surface of the second segment (1832) on the side opposite to the first segment (1831).

7. The heat sink (18) according to claim 5 or 6, characterized in that The manifold (183) also has multiple plates, the evaporator (181) includes multiple first heat exchange plates (1811), and the condenser (182) includes multiple second heat exchange plates (1821). One end of the first heat exchange plate (1811) is connected to the plate on one side of the manifold (183), and one end of the second heat exchange plate (1821) is connected to the plate on one side of the manifold (183).

8. The heat sink (18) according to any one of claims 1-3, characterized in that, The first segment (1831) extends along the sixth direction, and the second segment (1832) extends along the seventh direction that intersects the sixth direction. The end (18311) of the first segment (1831) and the side (18322) or end (18321) of the second segment (1832) are connected. Both the sixth direction and the seventh direction intersect the first direction.

9. The heat sink (18) according to any one of claims 1-8, characterized in that, Also includes: A flow guiding structure (184) is disposed within the manifold (183) and has a flow guiding channel (1841) for promoting the flow of the phase change medium toward the end of the manifold (183).

10. An electrical device (10) characterized by include: A chassis (11) defines a first receiving cavity (111); An electrical component (12) is installed in the first receiving cavity (111); The radiator (18) as described in any one of claims 1-9, wherein the evaporator (181) of the radiator (18) is located in the first receiving cavity (111), and the condenser (182) of the radiator (18) is located outside the chassis (11).

11. The electrical device (10) according to claim 10, characterized in that The busbar (183) of the radiator (18) extends through the chassis (11) along its length.

12. The electrical device (10) according to claim 10 or 11, characterized in that Also includes: A protective cover (13) is installed on the chassis (11) and defines a second receiving cavity (131), wherein the condenser (182) is located in the second receiving cavity (131).

13. The electrical device (10) according to claim 12, characterized in that Also includes: The first fan (14) is installed in the casing (11) and is used to drive the airflow in the first receiving cavity (111); The second fan (15) is installed on the protective cover (13) and is used to drive the airflow in the second receiving cavity (131).

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