Power conversion device

Abstract

The present application relates to the technical field of energy. Provided is a power conversion device. The power conversion device provided in the present application comprises a housing, a main circuit board, and a plurality of power conversion modules. The housing comprises a partition, the partition dividing the cavity of the housing into a heat dissipation cavity and a power cavity arranged in a first direction, and the partition comprising a first hollowed-out region. The power conversion modules each comprise a power conversion assembly and a heat dissipation component arranged in the first direction; in the first direction, the projection of the power conversion assembly is located within the contour range of the first hollowed-out region. In the present application, the main circuit board is located in the power cavity, and the power conversion assembly and the main circuit board are detachably connected to each other. The heat dissipation component is located in the heat dissipation cavity, and is used for dissipating heat for the power conversion assembly. By using the design scheme for the power conversion device provided in the present application, since the plurality of power conversion modules are all detachably connected to the main circuit board, the ease of maintenance of the power conversion device is improved, thereby helping reduce maintenance costs of the power conversion device.

Description

A power conversion device

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411630723.X, filed on November 14, 2024, entitled "A Power Conversion Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of energy technology, and in particular to a power conversion device. Background Technology

[0004] In recent years, with the increase in the power level of photovoltaic inverters, the performance of power conversion modules also needs to be enhanced accordingly. On the one hand, power conversion modules need to operate stably under higher current and voltage conditions; on the other hand, the heat dissipation efficiency of power conversion modules also needs to be improved. In current high-power photovoltaic inverters, multiple power conversion modules are fixedly connected to the same heat dissipation component by welding, and multiple power conversion modules are also fixed to the circuit board by welding. Therefore, when one power conversion module fails, the entire unit will be scrapped, resulting in high maintenance costs. Summary of the Invention

[0005] This application provides a power conversion device to improve the ease of maintenance of the power conversion device, thereby reducing the maintenance cost of the power conversion device.

[0006] The power conversion device provided in this application includes a housing, a main circuit board, and multiple power conversion modules. The housing houses the multiple power conversion modules and the main circuit board. The housing includes a partition that divides the housing's cavity into a power cavity and a heat dissipation cavity arranged along a first direction. The partition includes a first hollow area. Power conversion modules are attached to the partition and cover the first hollow area. Each power conversion module includes a power conversion module and a heat dissipation component arranged along the first direction, and the projection of the power conversion module lies within the outline of the first hollow area along the first direction. In this application, the main circuit board is located in the power cavity, and the power conversion modules are detachably connected to the main circuit board for converting direct current (DC) from photovoltaic modules or energy storage batteries into alternating current (AC). Additionally, the heat dissipation component is located within the heat dissipation cavity for cooling the power conversion modules. By adopting the power conversion device configuration provided in this application, since multiple power conversion modules are respectively equipped with heat dissipation components for heat dissipation of the power conversion module, and each power conversion module can be detachably connected to the main circuit board through the power conversion module, when one of the power conversion modules fails, only the power conversion module including the failed power conversion module can be replaced. This is beneficial to improving the maintenance convenience of the power conversion device, thereby helping to reduce the maintenance cost of the power conversion device.

[0007] In one possible implementation of this application, the power conversion module further includes a first sub-circuit board. One side of the first sub-circuit board is attached to the surface of the power conversion module opposite to the heat dissipation component, and the other side of the first sub-circuit board includes a first current-carrying terminal. The first current-carrying terminal is fixed to and electrically connected to the main circuit board. This not only facilitates the detachable connection between the power conversion module and the main circuit board, but also enhances the current-carrying capacity of the power conversion module by setting the first current-carrying terminal on the first sub-circuit board, enabling the power conversion module to meet the current-carrying requirements of high-current application scenarios.

[0008] In one possible implementation of this application, the projection of the power conversion module is located within the outline of the first sub-circuit board connected thereto along the first direction. This helps to reduce the board area occupied by the power conversion module on the main circuit board, thereby supporting the installation of more power conversion modules and improving the power density of the power conversion device.

[0009] In this application, the first sub-circuit board further includes a first signal terminal, which is disposed on the other side of the first sub-circuit board, and the current value supported by the first signal terminal is less than the current value supported by the first current-carrying terminal. Therefore, the first sub-circuit board can also be used to transmit signals from the power conversion module, which helps reduce the cabling between the power conversion module and the main circuit board, thereby improving its assembly convenience.

[0010] In addition, the first sub-circuit board also includes a drive circuit, which provides drive levels to the power conversion module. The drive circuit is electrically connected to the main circuit board via a first signal terminal. This reduces the number of cables between the power conversion module and the main circuit board while meeting the drive requirements of the power conversion module.

[0011] In one possible implementation of this application, the heat dissipation component is detachably connected to the partition, and along the first direction, the projection of the first hollow area lies within the outline of the projection of the heat dissipation component. This allows for a detachable connection between the power conversion module and the partition, improving the ease of maintenance of the power conversion device. Additionally, the heat dissipation component can cover the first hollow area to provide a better sealing effect for the power cavity.

[0012] In addition, in this application, a first sealing ring is provided between the heat dissipation component and the partition, and the first sealing ring is arranged around the power conversion module. This helps to improve the sealing performance of the power cavity, so as to ensure the efficient operation of the main circuit board and other components in the power cavity.

[0013] In one possible implementation of this application, the heat dissipation component includes a housing and a liquid working fluid contained within the housing. Along a first direction, the projection of the power conversion module lies within the contour of the housing, and the power conversion module is in thermally conductive contact with the liquid working fluid. This approach utilizes vapor-liquid two-phase heat exchange to dissipate heat from the power conversion module, which is beneficial for improving the heat dissipation efficiency of the power conversion module.

[0014] In one possible implementation of this application, the power conversion module and the heat dissipation module are detachably connected. This allows for replacement of only the failed component when either the power conversion module or the heat dissipation component fails, thus reducing maintenance costs for the power conversion device.

[0015] In addition, a second sealing ring is provided between the power conversion module and the heat dissipation component, and the projection of the power conversion module covers the second sealing ring along the first direction. This improves the sealing performance between the power conversion module and the heat dissipation component, thereby reducing the risk of liquid working fluid leakage.

[0016] In one possible implementation of this application, the power conversion device further includes an inductor assembly, at least a portion of which is located within a heat dissipation cavity. The inductor is housed within a first housing, and the inductor assembly includes a second current-carrying terminal. The partition also includes a second cutout area. Along a first direction, the projection of the second cutout area lies within the outline of the projection of the first housing, and the projection of the second current-carrying terminal lies within the outline of the second cutout area. The second current-carrying terminal is detachably connected to the main circuit board. In this solution, since the inductor assembly is also detachably connected to the main circuit board, it improves the ease of maintenance of the power conversion device. Furthermore, in the event of inductor assembly failure, only the inductor assembly needs to be replaced, thus reducing maintenance costs.

[0017] In addition, the power conversion device also includes a capacitor assembly, at least a portion of which is located in the heat dissipation cavity. The capacitor assembly includes a third current-carrying terminal. The partition also includes a third cutout area. Along the first direction, the projection of the third cutout area lies within the outline of the projection of the capacitor assembly, and the projection of the third current-carrying terminal lies within the outline of the third cutout area. The third current-carrying terminal is detachably connected to the main circuit board. This allows for a detachable connection between the capacitor assembly and the main circuit board, improving the ease of maintenance of the power conversion device.

[0018] In one possible implementation of this application, the surface of the partition facing the power cavity includes a first positioning post, and the main circuit board includes a first positioning hole, with the first positioning post inserted into the first positioning hole. This improves the positioning accuracy of the main circuit board within the enclosure and enhances the ease of installation of the main circuit board.

[0019] Furthermore, in this application, the surface of the partition facing the heat dissipation cavity includes a second positioning post, and the heat dissipation assembly includes a second positioning hole. This allows the power conversion module to be positioned within the enclosure by inserting the second positioning post into the second positioning hole. Since the main circuit board also uses the partition as a positioning reference, it helps improve the assembly accuracy of the power conversion module and the main circuit board, thereby reducing the assembly difficulty of the power conversion device.

[0020] In one possible implementation of this application, the enclosure further includes peripheral side plates that form a cavity within the enclosure. Additionally, the edge of the partition plate is connected to the peripheral side plate, and the partition plate and the peripheral side plate are integrally formed. This simplifies the enclosure structure and allows for the unique positioning reference of each component in the power conversion device; that is, each component in the power conversion device uses the partition plate as its positioning reference, thereby improving the positioning accuracy of each component and reducing the manufacturing difficulty of the power conversion device. Attached Figure Description

[0021] Figure 1 is a schematic diagram of a conventional photovoltaic inverter provided in an embodiment of this application;

[0022] Figure 2 is a simplified structural diagram of a power conversion device provided in an embodiment of this application;

[0023] Figure 3 is an exploded view of a partial structure of the power conversion device provided in an embodiment of this application;

[0024] Figure 4 is an exploded view of another partial structure of the power conversion device provided in the embodiment of this application;

[0025] Figure 5 is an exploded view of a structure of a power conversion module provided in an embodiment of this application;

[0026] Figure 6 is a schematic diagram of the power conversion module provided in an embodiment of this application;

[0027] Figure 7 is an exploded view of another structure of the power conversion module provided in the embodiment of this application;

[0028] Figure 8 is a schematic diagram of the structure of the main circuit board facing the partition side provided in the embodiment of this application;

[0029] Figure 9 is a schematic diagram of an inductor assembly provided in an embodiment of this application;

[0030] Figure 10 is a schematic diagram of a capacitor assembly provided in an embodiment of this application;

[0031] Figure 11 is a schematic diagram of the structure of the partition of the box provided in the embodiment of this application facing the heat dissipation cavity;

[0032] Figure 12 is an exploded view of a power conversion device provided in an embodiment of this application;

[0033] Figure 13 is a schematic diagram of the structure shown in Figure 12 from another angle;

[0034] Figure 14 is a cross-sectional view of the power conversion device provided in an embodiment of this application;

[0035] Figures 15a to 15g are schematic diagrams of an assembly process for a power conversion device provided in an embodiment of this application;

[0036] Figures 16a to 16f are schematic diagrams of a maintenance process for a power conversion device provided in an embodiment of this application.

[0037] Reference numerals: 1-Passive component; 101-Inductor assembly; 1011-First housing; 10111-Third positioning hole; 1012-Inductor; 10121-Second current-carrying terminal; 102-Capacitor assembly; 1021-Second housing; 10211-Fourth positioning hole; 1022-Capacitor; 1023-Second sub-circuit board; 10231-Third current-carrying terminal; 10232-Third signal terminal; 2-Power conversion module; 201-First sub-circuit board; 2011-First current-carrying terminal; 2012-First signal terminal; 202-Power conversion module; 2021-Substrate; 2022-Heat dissipation plate; 2023-Chip; 203-Heat dissipation assembly; 2031-Housing; 2032 - Mounting slot; 2033 - Second positioning hole; 204 - Sealing ring; 3 - Main circuit board; 301 - First positioning hole; 302 - Second signal terminal; 4 - Housing; 401 - Partition; 4011 - First positioning post; 4012 - First hollow area; 4013 - Second positioning post; 4014 - Third positioning post; 4015 - Fourth positioning post; 4016 - Second hollow area; 4017 - Second hollow area; 402 - Heat dissipation cavity; 403 - Power cavity; 404 - Peripheral side plate; 405 - First cover plate; 406 - Second cover plate; 5 - Screw; 6 - Busbar; 7 - Fan; 8 - Air-cooled heat dissipation assembly. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.

[0039] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this application.

[0040] To facilitate understanding of the power conversion device provided in the embodiments of this application, its application scenarios will be introduced first below.

[0041] With the continuous development and widespread adoption of green energy, the importance of electricity in people's daily lives is becoming increasingly prominent. During the transmission and use of electricity, parameters such as voltage and current need to be converted or regulated. Taking photovoltaic (PV) power generation as an example, a PV system utilizes the photovoltaic effect of semiconductor materials to convert solar energy into electrical energy. A PV system typically includes PV modules and a power conversion device. The PV modules convert solar energy into direct current (DC), while the power conversion device converts the DC current from the PV modules into power, or it can convert the DC voltage from the PV modules into power, enabling the PV system to output alternating current (AC) that matches the power demand of external electrical equipment. Alternatively, in an energy storage scenario, the energy storage cabinet may include an energy storage battery and a power conversion device. The power conversion device converts the DC power from the energy storage battery into AC power for output to the load. In this application, the power conversion device includes a PV inverter and an energy storage converter. For ease of understanding, in the following embodiments of this application, a PV inverter is used as an example of the power conversion device.

[0042] As the power of photovoltaic inverters increases, the number of circuit boards, passive components, power conversion modules, and cables inside the inverter chassis also increases. Since the power conversion module generates a significant amount of heat during operation, a heat dissipation component is typically installed to ensure its reliable operation. Figure 1 is a schematic diagram of a conventional photovoltaic inverter structure provided in an embodiment of this application. In the embodiment shown in Figure 1, the heat dissipation component 203 is an air-cooled heat dissipation component. In specific applications, the heat dissipation base plate of the power conversion module 202 is in thermal contact with the heat dissipation component 203, allowing the heat generated by the power conversion module 202 to be transferred to the heat dissipation component 203. Additionally, the air blown out by the fan can carry away the heat from the surface of the heat dissipation component 203, thereby achieving heat dissipation for the power conversion module 202 by the heat dissipation component 203.

[0043] Currently, to ensure the heat dissipation effect of the heat dissipation component 203 on the power conversion module 202, the power conversion module 202 and the heat dissipation component 203 are connected by welding. Furthermore, when a photovoltaic inverter includes multiple power conversion modules 202, all of these modules are welded to the same heat dissipation component 203. Additionally, in traditional photovoltaic inverters, passive components 1 (such as inductors or capacitors) and power conversion modules 202 are both welded to the main circuit board 3. Therefore, if one power conversion module 202 or passive component 1 fails, the entire unit will be rendered unusable, resulting in high maintenance costs.

[0044] In view of this, the power conversion device provided in this application improves the ease of maintenance of the power conversion device by arranging the power conversion module and heat dissipation component in a one-to-one correspondence and making the power conversion component detachably connected to the main circuit board, thereby reducing the maintenance cost of the power conversion device. To facilitate understanding of the power conversion device provided in this application, it will be described in detail below with reference to the accompanying drawings.

[0045] Figure 2 is a simplified structural diagram of a power conversion device provided in an embodiment of this application. As shown in Figure 2, in this embodiment, the power conversion device includes a housing 4, a power conversion module 2, and a main circuit board 3. The housing 4 includes a partition 401, which divides the cavity of the housing 4 into a power cavity 403 and a heat dissipation cavity 402 arranged along a first direction. The main circuit board 3 is located in the power cavity 403, and a portion of the power conversion module 2 is located in the heat dissipation cavity 402. A portion of the power conversion module 2 extends through the partition 401 into the power cavity 403 for electrical connection with the main circuit board 3, thereby realizing the electrical connection between the power conversion module 2 and the main circuit board 3.

[0046] When specifically configuring the power conversion device provided in this application, first refer to Figure 3, which is an exploded view of a partial structure of the power conversion device provided in the embodiment of this application. In this embodiment, the housing 4 further includes a peripheral side plate 404, which is used to form a cavity in the housing 4. The edge of the partition plate 401 is fixedly connected to the peripheral side plate 404 to divide the cavity into a heat dissipation cavity 402 and a power cavity 403 as shown in Figure 2. It is worth mentioning that in this application, the peripheral side plate 404 and the partition plate 401 can be an integrally formed structure, which can be, for example, a die-cast integral structural component to simplify the structure of the housing 4.

[0047] Figure 4 is an exploded view of another partial structure of the power conversion device provided in an embodiment of this application. Referring to Figures 3 and 4 together, the partition 401 includes a first hollow area 4012, and the power conversion module 2 is attached to and covers the first hollow area 4012. Furthermore, in this embodiment, the power conversion device may include multiple power conversion modules 2, which can be arranged side-by-side. It is understood that in this application, the number of first hollow areas 4012 on the partition 401 is the same as the number of power conversion modules 2, so that the first hollow areas 4012 correspond one-to-one with the power conversion modules 2.

[0048] Figure 5 is an exploded view of a power conversion module structure provided in an embodiment of this application. As shown in Figure 5, the power conversion module 2 includes a power conversion module 202 and a heat dissipation component 203 arranged along a first direction. The power conversion module 202 is used to convert DC power from a photovoltaic module or energy storage battery into AC power, and the heat dissipation component 203 is used to dissipate heat from the power conversion module 202. Referring further to Figures 4 and 5, along the first direction, the projection of the power conversion module 202 is located within the outline of the first hollow area 4012. The power conversion module 202 is detachably connected to the main circuit board 3, thereby realizing the detachable connection between the power conversion module 2 and the main circuit board 3. In this way, when a power conversion module 2 fails, it is only necessary to remove the failed power conversion module 2 from the main circuit board 3 for replacement, which will not affect other power conversion modules 2, the main circuit board 3, or other devices disposed on the main circuit board 3, thereby improving the maintainability of the power conversion device.

[0049] It is understood that in this application, the heat dissipation component 203 is located inside the heat dissipation cavity 402 and is in thermal contact with the power conversion module 202.

[0050] Referring to Figure 6, which is a schematic diagram of a power conversion module provided in an embodiment of this application, the power conversion module 202 includes a substrate 2021, a heat dissipation base plate 2022, and a chip 2023. The substrate 2021 is fixedly connected to the heat dissipation base plate 2022, and the chip 2023 is located on the side of the substrate 2021 facing away from the heat dissipation base plate 2022. To achieve effective heat dissipation of the power conversion module 202, the heat dissipation base plate 2022 can be a plate-like structure with good heat dissipation performance, such as a copper plate. Therefore, in this application, the heat dissipation base plate 2022 of the power conversion module 202 can be in thermally conductive contact with the heat dissipation component 203.

[0051] In this embodiment, the heat dissipation assembly 203 includes a housing 2031 and a liquid working medium contained within the housing 2031. At least a portion of the heat dissipation base plate 2022 is embedded in the housing 2031, and the heat dissipation base plate 2022 is in thermally conductive contact with the liquid working medium. Thus, the heat generated by the power conversion module 202 can be conducted to the liquid working medium through the heat dissipation base plate 2022. The liquid working medium evaporates into a gas upon heating, and the gas can condense back into a liquid upon cooling and flow back to the location of the heat dissipation base plate 2022. This utilizes two-phase heat exchange between the vapor and liquid phases to dissipate heat from the power conversion module 202, which is beneficial for improving the heat dissipation efficiency of the power conversion module 2.

[0052] In this application, as shown in Figures 5 and 6, along the first direction, the projection of the power conversion module 202 is located within the outline of the housing 2031 of the heat dissipation component 203, which can ensure a large heat exchange area between the power conversion module 202 and the heat dissipation component 203, thereby improving the heat exchange efficiency between the power conversion module 202 and the heat dissipation component 203.

[0053] Furthermore, referring to Figures 4 and 5, along the first direction, the projection of the first hollow area 4012 lies within the outline of the projection of the heat dissipation component 203, thus allowing the heat dissipation component 203 to cover the first hollow area 4012. The heat dissipation component 203 can also be detachably connected to the partition 401, which can be, but is not limited to, connected by fasteners such as screws, to achieve a detachable connection between the entire power conversion module 2 and the housing 4, which improves the ease of maintenance of the power conversion device.

[0054] In this embodiment, a first sealing ring (not shown in the figure) is further provided between the heat dissipation component 203 and the partition 401, and the first sealing ring surrounds the power conversion module 202. This helps to improve the sealing performance of the power cavity 403, so as to ensure the efficient operation of the main circuit board 3 and other devices in the power cavity 403.

[0055] In the embodiment shown in Figure 5, the power conversion module 202 and the heat dissipation component 203 can be connected by welding (e.g., laser welding), which can ensure the reliability of the connection between the power conversion module 202 and the heat dissipation component 203 while improving the sealing of the connection between the power conversion module 202 and the heat dissipation component 203.

[0056] Referring to Figure 7, which is an exploded view of another structure of the power conversion module provided in this embodiment, the power conversion module 202 and the heat dissipation assembly 203 are detachably connected. Specifically, a second sealing ring 204 is provided between the power conversion module 202 and the heat dissipation assembly 203. Furthermore, the heat dissipation assembly 203 also includes a mounting groove 2032 for mounting the second sealing ring 204 and the power conversion module 202. This allows the power conversion module 202 to compress the second sealing ring 204, thereby sealing the gap between the power conversion module 202 and the heat dissipation assembly 203.

[0057] It is worth mentioning that, in this application, the projection of the power conversion module 202 along the first direction covers the second sealing ring 204. This is beneficial to improving the sealing reliability between the power conversion module 202 and the heat dissipation component 203.

[0058] In the embodiment shown in Figure 7, the heat dissipation base plate 2022 of the power conversion module 202 and the housing 2031 of the heat dissipation component 203 can be connected by fasteners such as screws. This facilitates replacement of the power conversion module 202 or the heat dissipation component 203 in case of failure, thereby improving the maintainability of the power conversion device.

[0059] In traditional solutions, increasing the current-carrying capacity between the power conversion module 202 and the main circuit board 3 is typically achieved by adding power pins. However, this method has limited effectiveness and the power pins occupy a large area. Therefore, to improve the current-carrying capacity of the power conversion module 2, as shown in Figures 5 and 7, the power conversion module 202 further includes a first sub-circuit board 201, as shown in Figure 4. The first sub-circuit board 201 is located in the power cavity 403. One side of the first sub-circuit board 201 is attached to the surface of the power conversion module 202 that is away from the heat dissipation component 203, thereby achieving an electrical connection between the power conversion module 202 and the first sub-circuit board 201. This application does not limit the specific implementation of the electrical connection between the power conversion module 202 and the first sub-circuit board 201; it can be exemplarily achieved through soldering to improve the reliability of the electrical connection between the power conversion module 2 and the first sub-circuit board 201.

[0060] Referring to Figures 4 and 5, the other side of the first sub-circuit board 201, that is, the side of the first sub-circuit board 201 facing away from the power conversion module 202, includes a first current-carrying terminal 2011, which is fixed and electrically connected to the main circuit board 3. Specifically, as shown in Figures 5 and 7, the first current-carrying terminal 2011 may protrude from the surface of the first sub-circuit board 201. Additionally, referring to Figure 2, the first current-carrying terminal 2011 and the main circuit board 3 can be electrically connected via screws 5. This not only achieves electrical connection between the first sub-circuit board 201 and the main circuit board 3 but also increases the current-carrying area between them, thereby meeting the requirements for high current flow.

[0061] It is worth mentioning that, in scenarios where high current-passing area is required, a busbar can be added between the first sub-circuit board 201 and the main circuit board 3. One end of the busbar is electrically connected to the first sub-circuit board 201 via screws, and the other end of the busbar is electrically connected to the main circuit board 3 via screws. This allows the current-passing area of ​​the busbar to be designed according to the actual usage requirements of the scenario, so as to meet the current-passing requirements between the first sub-circuit board 201 and the main circuit board 3. In some possible embodiments of this application, the busbar can also be replaced with a flexible circuit board, which can also meet the current-passing requirements between the first sub-circuit board 201 and the main circuit board 3 while achieving a detachable connection.

[0062] Since there is both high-current and low-current transmission between the main circuit board 3 and the first sub-circuit board 201, as shown in Figures 5 and 7, in this embodiment, the first sub-circuit board 201 may include a first signal terminal 2012. The first signal terminal 2012 is also disposed on the side of the first sub-circuit board 201 facing away from the power conversion module 202, i.e., the side where the first current-carrying terminal 2011 is located. Additionally, referring to Figure 8, which is a schematic diagram of the structure of the main circuit board facing the partition side provided in this embodiment, the main circuit board 3 includes a second signal terminal 302.

[0063] In this application, the specific configuration of the first signal terminal 2012 and the second signal terminal 302 is not limited. For example, as shown in Figures 5 and 7, the first signal terminal 2012 and the second signal terminal 302 can be board-to-board (BTB) connectors. In other embodiments of this application, the first signal terminal 2012 can also be an OT terminal (or a circular cold-pressed terminal), and the second signal terminal 302 is disposed on the bright copper area of ​​the main circuit board 3. In other possible embodiments of this application, the first signal terminal 2012 and the second signal terminal 302 can also adopt other configuration methods, which will not be listed here.

[0064] It is worth mentioning that, in this application, the current value supported by the first signal terminal 2012 is less than the current value supported by the first current-carrying terminal 2011. For example, in one possible embodiment, the first signal terminal 2012 can be used to support the transmission of small currents of 10A and below, while the first current-carrying terminal 2011 can be used to support the transmission of large currents of 100A and above.

[0065] It is understood that, in this application, as shown in Figure 5 or Figure 7, along the first direction, the projection of the power conversion module 202 lies within the outline of the first sub-circuit board 201 connected to it. This helps to reduce the area occupied by the power conversion module 2 on the main circuit board 3, thereby enabling the power conversion device to support the installation of more power conversion modules 2, thus improving the power density of the power conversion device.

[0066] As described above, the power conversion device design provided in this application effectively reduces the cable connections between the main circuit board 3 and the power conversion module 2, thus improving the ease of assembly. Furthermore, compared to existing technologies, in the power conversion device provided in this application, the power conversion module 202 is electrically connected to the main circuit board 3 via the first sub-circuit board 201, which improves the current-carrying capacity of the power conversion module 2, thereby meeting the requirements of high-current-carrying scenarios. Additionally, it also reduces the footprint of the power conversion module 2, thereby reducing the overall size of the power conversion device.

[0067] In one possible embodiment of this application, the first sub-circuit board 201 further includes a driving circuit, which can be electrically connected to the main circuit board 3 through the first signal terminal 2012 described above. This helps to reduce the cable connection between the main circuit board 3 and the power conversion module 2, thereby improving the assembly efficiency of the power conversion device.

[0068] In this application, the driving circuit is used to provide a driving level for the power conversion module 202 and to absorb electrical stress. In practical applications, the driving circuit may include a driving chip and RC devices, etc., wherein the driving chip can provide a driving level for the insulated-gate bipolar transistor (IGBT) and metal-oxide semiconductor (MOS) in the power conversion module 202 through RC devices, and can be used to absorb electrical stress to realize the power conversion function of the power conversion module 2.

[0069] In the power conversion device, there are also some passive components electrically connected to the main circuit board 3, such as capacitors and inductors. The arrangement of these components is similar to that of the power conversion module 2 described above. For example, as shown in FIG3, the power conversion device also includes an inductor assembly 101. FIG9 is a schematic diagram of an inductor assembly provided in an embodiment of this application. As shown in FIG9, the inductor assembly 101 includes a first housing 1011 and an inductor 1012, with the inductor 1012 housed in the first housing 1011. This application does not limit the number of inductors 1012 in the inductor assembly 101; for example, there may be one or more, and the specific number can be set according to the function to be implemented by the power conversion device.

[0070] As shown in Figure 9, the inductor 1012 includes a second current-carrying terminal 10121. The second current-carrying terminal 10121 can be set with reference to the first current-carrying terminal 2011, and will not be described in detail here.

[0071] In order to achieve the electrical connection between the inductor 1012 and the main circuit board 3, referring to Figure 3, the partition 401 also includes a second cutout area 4016, and as shown in Figure 4, along the first direction, the projection of the second current-carrying terminal 10121 falls within the outline range of the second cutout area 4016, so that the second current-carrying terminal 10121 can be detachably electrically connected to the main circuit board 3 through the second cutout area 4016.

[0072] Furthermore, the first outer shell 1011 is located in the heat dissipation cavity 402, and along the first direction, the projection of the second hollow area 4016 is within the outline of the projection of the first outer shell 1011. This allows the first outer shell 1011 to cover the second hollow area 4016, ensuring the sealing of the power cavity 403. In addition, a sealing ring fitted onto the inductor 1012 can be provided between the first outer shell 1011 and the partition 401, so that the first outer shell 1011 can press the sealing ring against the partition 401, thereby improving the sealing effect of the power cavity 403.

[0073] It is understood that, in this embodiment, the first housing 1011 can also be detachably connected to the partition 401. This allows for the installation of the inductor assembly 101 within the housing 4 while also improving the ease of maintenance of the inductor assembly 101, thereby enhancing the overall ease of maintenance of the power conversion device and reducing maintenance costs.

[0074] In other words, at least a portion of the inductor assembly 101 is located within the heat dissipation cavity, and along the first direction, the projection of the second cutout region 4016 lies within the outline of the inductor assembly 101, so that the inductor assembly 101 can block the second cutout region 4016. Additionally, along the first direction, the projection of the second current-carrying terminal 10121 of the inductor assembly 101 lies within the second cutout region 4016, so that the inductor assembly 101 can be detachably connected to the main circuit board 3 via the second current-carrying terminal 10121.

[0075] Referring again to Figure 3, the power conversion device further includes a capacitor assembly 102. Figure 10 is a schematic diagram of a capacitor assembly provided in an embodiment of this application. As shown in Figure 10, the capacitor assembly 102 includes a second housing 1021 and a capacitor 1022, wherein the capacitor 1022 is housed in the second housing 1021, and the second housing 1021 is located in the heat dissipation cavity 402. This application does not limit the number of capacitors 1022 in the capacitor assembly 102; it can be one or more, and the specific number can be set according to the function to be implemented by the power conversion device.

[0076] To achieve electrical connection between capacitor 1022 and main circuit board 3, referring to Figure 3, partition 401 also includes a third cutout area 4017. Furthermore, referring to Figures 3 and 4 together, it can be understood that along the first direction, the projection of capacitor 1022 lies within the outline of the third cutout area 4017, so that capacitor 1022 can be detachably connected to main circuit board 3 through the third cutout area 4017.

[0077] In this application, the specific connection method between the capacitor assembly 102 and the main circuit board 3 can refer to the connection method between the power conversion module 2 and the main circuit board 3 described above. Specifically, as shown in FIG10, the capacitor assembly 102 also includes a second sub-circuit board 1023, wherein one side of the second sub-circuit board 1023 is electrically connected to the capacitor 1022, and the other side of the second sub-circuit board 1023 includes a third current-carrying terminal 10231 and a third signal terminal 10232, wherein the third current-carrying terminal 10231 can be set with reference to the first current-carrying terminal 2011, and the third signal terminal 10232 can be set with reference to the first signal terminal 2012, which will not be described in detail here.

[0078] As shown in Figure 4, the second sub-circuit board 1023 is located in the power cavity 403. Therefore, the second sub-circuit board 1023 can be detachably connected to the main circuit board 3 to achieve a detachable connection between the capacitor assembly 102 and the main circuit board 3. In this application, the arrangement of the second sub-circuit board 1023 facilitates a detachable connection between the capacitor assembly 102 and the main circuit board 3, and reduces the board area occupied by the capacitor assembly 102. Furthermore, it helps to improve the current-carrying capacity of the capacitor assembly 102, thereby meeting the usage requirements of high-current scenarios.

[0079] In other words, at least a portion of the capacitor assembly 102 is located within the heat dissipation cavity, and along the first direction, the projection of the third cutout region 4017 lies within the outline of the capacitor assembly 102, so that the capacitor assembly 102 can block the third cutout region 4017. Furthermore, along the first direction, the projection of the third current-carrying terminal 10231 of the capacitor assembly 102 lies within the third cutout region 4017, so that the capacitor assembly 102 can be detachably connected to the main circuit board 3 via the third current-carrying terminal 10231.

[0080] As can be seen from the above introduction, by adopting the design of the power conversion device provided in this application, since the power conversion module 2, inductor component 101 and capacitor component 102 and other components can be detachably connected to the main circuit board 3, it is beneficial to improve the maintainability of the power conversion device, thereby reducing maintenance costs.

[0081] Understandably, in order to connect the power conversion module 2, inductor assembly 101, and capacitor assembly 102 to the main circuit board 3, their installation positions need to be determined. In traditional solutions, the assembly process of the power conversion device requires multiple positioning operations, including positioning the main circuit board 3 against the enclosure, positioning the passive components against the main circuit board 3, and positioning the power conversion module 2 against the main circuit board 3. Since the positioning references for each step are not unique—for example, the positioning reference for the main circuit board 3 is the enclosure, while the positioning references for the passive components and the power conversion module 2 are the main circuit board 3—this leads to a large cumulative tolerance during the assembly process.

[0082] To address the aforementioned issues, in this application, referring to Figure 4, the surface of the partition 401 facing the power cavity 403 includes a first positioning post 4011. It is understood that the first positioning post 4011 and the partition 401 can be integrally formed; for example, the first positioning post 4011 can be a columnar structure stamped onto the partition 401. Furthermore, when the partition 401 and the peripheral side plate 404 are integrally formed, the first positioning post 4011 can be directly die-cast during the processing of the partition 401 and the peripheral side plate 404, which simplifies the processing steps of the power conversion device.

[0083] Additionally, referring to Figure 4, the main circuit board 3 includes a first positioning hole 301. It can be understood that the aforementioned first positioning post 4011 can be inserted into the first positioning hole 301, thereby enabling the positioning of the main circuit board 3 within the housing 4.

[0084] It is worth mentioning that in this application, there are at least two first positioning posts 4011 and at least two first positioning holes 301. For example, in the embodiment shown in Figure 4, there are two first positioning posts 4011 and two first positioning holes 301, and the two first positioning posts 4011 are inserted into the two first positioning holes 301 in a one-to-one correspondence. This can improve the positioning accuracy of the main circuit board 3 in the housing 4.

[0085] In addition, in this embodiment, at least one positioning hole 301 can be an elongated hole, which can absorb the fitting error between the multiple first positioning posts 4011 and the multiple first positioning holes 301.

[0086] As described above, the power conversion module 202 can be connected to the main circuit board 3 through the first cutout area 4012 of the partition 401. It can be understood that this first cutout area 4012 can be used to define the position of the power conversion module 2 on the housing 4, thereby achieving initial positioning of the power conversion module 2.

[0087] Referring to Figures 5 and 7, in this application, the heat dissipation assembly 203 further includes a second positioning hole 2033. Additionally, referring to Figure 11, which is a schematic diagram of the structure of the partition plate of the housing facing the heat dissipation cavity according to an embodiment of this application, in this embodiment, the surface of the partition plate 401 facing the heat dissipation cavity 402 also includes a second positioning post 4013. Referring to Figures 5 and 11, it can be understood that the second positioning post 4013 is inserted into the second positioning hole 2033, thus enabling the positioning of the power conversion module 2 on the housing 4. It is understood that the specific arrangement of the second positioning post 4013 is similar to that of the first positioning post 4011 described above, and will not be elaborated upon here.

[0088] As described above, the power conversion module 2 is attached to and covers the first hollow area 4012 with the partition plate 401, and the projection of the power conversion module 202 is located within the outline of the first hollow area 4012 along the first direction. Based on this, it can be understood that when assembling the power conversion module 2, it can first be installed in the first hollow area 4012 to achieve initial positioning of the power conversion module 2, and then the second positioning post 4013 can be inserted into the second positioning hole 2033 to improve the positioning accuracy of the power conversion module 2 in the housing 4.

[0089] It is understandable that since both the power conversion module 2 and the main circuit board 3 use the housing 4 as their positioning reference, or in other words, the partition 401 as their positioning reference, their positioning references are the same. This facilitates the setting of the positions of the first positioning post 4011 and the second positioning post 4013 according to the connection relationship and relative position relationship between the power conversion module 2 and the main circuit board 3, thereby improving the positioning accuracy of the power conversion module 2 and the main circuit board 3 in the housing 4. This helps to reduce the assembly error between the power conversion module 2 and the main circuit board 3, thus reducing the assembly difficulty of the power conversion device and improving the manufacturability of the power conversion device.

[0090] In this embodiment, due to the high positioning accuracy between the power conversion module 2 and the main circuit board 3, it provides the possibility of detachable connection between the main circuit board 3 and the first sub-circuit board 201. Specifically, the first current-carrying terminal 2011 and the first signal terminal 2012 can be positioned by the first positioning post 4011 and the second positioning post 4013. During the assembly of the main circuit board 3 and the power conversion module 2 with the housing 4, while aligning the first positioning post 4011 with the first positioning hole 301 of the main circuit board 3 and the second positioning post 4013 with the second positioning hole 2033 of the heat dissipation component 203, the current-carrying position (e.g., bright copper area) of the first current-carrying terminal 2011 and the main circuit board 3 and the alignment of the first signal terminal 2012 with the second signal terminal 302 (e.g., alignment of the OT terminal with the bright copper area) are also completed. Thus, after the main circuit board 3 and the power conversion module 2 are installed in place, the main circuit board 3 and the first sub-circuit board 201 can be detachably connected, which helps to reduce the assembly difficulty.

[0091] Additionally, as shown in Figure 11, the surface of the partition 401 facing the heat dissipation cavity 402 also includes a third positioning post 4014, and the first housing 1011 of the inductor assembly 101 includes a third positioning hole 10111 as shown in Figure 9. The third positioning post 4014 is inserted into the third positioning hole 10111 to achieve the positioning of the inductor assembly 101 within the housing 4. Therefore, the positioning reference for the inductor assembly 101 within the housing 4 is also the partition 401. When the inductor assembly 101 is installed in the housing 4, while aligning the third positioning post 4014 with the third positioning hole 10111, the second current-carrying terminal 10121 of the inductor 1012 of the inductor assembly 101 is also aligned with the current-carrying position of the main circuit board 3. Thus, after the main circuit board 3 and the inductor assembly 101 are installed in place, the main circuit board 3 and the inductor assembly 101 can be detachably connected, which helps reduce assembly difficulty. Referring to FIG11, the surface of the partition 401 facing the heat dissipation cavity 402 also includes a fourth positioning post 4015. The second housing 1021 includes a fourth positioning hole 10211 as shown in FIG10. The fourth positioning post 4015 is inserted into the fourth positioning hole 10211 to realize the positioning of the capacitor assembly 102 in the housing 4.

[0092] Since the positioning reference for the capacitor assembly 102 within the housing 4 is also the partition 401, the positioning accuracy between the capacitor assembly 102 and the main circuit board 3 is relatively high. This provides the possibility for a detachable connection between the main circuit board 3 and the second sub-circuit board 1023. Specifically, the third current-carrying terminal 10231 and the third signal terminal 10232 of the second sub-circuit board 1023 can be positioned using the fourth positioning post 4015 and the fourth positioning hole 10211. Therefore, when the capacitor assembly 102 is installed in the housing 4, the alignment of the fourth positioning post 4015 and the fourth positioning hole 10211 is achieved simultaneously with the alignment of the current-carrying position of the third current-carrying terminal 10231 of the capacitor assembly 102 with that of the main circuit board 3, and the alignment of the third signal terminal 10232 with that of the signal terminal of the main circuit board 3. Thus, after the main circuit board 3 and the capacitor assembly 102 are installed in place, a detachable connection between the main circuit board 3 and the capacitor assembly 102 can be made, which helps to reduce assembly difficulty.

[0093] It is understandable that, in practical applications, the aforementioned inductor assembly 101 and capacitor assembly 102 can be assembled with the housing 4 as a whole to improve the assembly and maintenance efficiency of the power conversion device.

[0094] The above description only covers the main components of the power conversion device provided in this application. In practical applications, the power conversion device also includes other structural components. For example, referring to Figure 12, which is an exploded view of the power conversion device provided in an embodiment of this application, it can be used to show the structure in the heat dissipation cavity. As shown in Figure 12, the housing 4 also includes a first cover plate 405 and a second cover plate 406 disposed opposite to each other. A peripheral side plate 404 is located between the first cover plate 405 and the second cover plate 406. The first cover plate 405 covers the opening of the heat dissipation cavity 402 and is detachably connected to the peripheral side plate 404. For example, the first cover plate 405 and the peripheral side plate 404 are detachably connected by screws.

[0095] Figure 13 is a schematic diagram of the structure shown in Figure 12 from another angle, illustrating the positional relationship between the second cover plate 406 and the power cavity 403. As shown in Figure 13, the second cover plate 406 covers the opening of the power cavity 403 and is detachably connected to the peripheral side plate 404, for example, the second cover plate 406 and the peripheral side plate 404 are detachably connected by screws.

[0096] Referring again to Figure 12, in this application, the power conversion device also includes a fan 7. In addition, the heat dissipation assembly 203, the first housing 1011 and the second housing 1021 may each include heat dissipation fins, so that the airflow in the housing 4 can be driven by the fan 7 to achieve heat dissipation of the power conversion module 2, the inductor assembly 101 and the capacitor assembly 102.

[0097] It is worth mentioning that, as shown in Figure 14, which is a cross-sectional view of the power conversion device provided in an embodiment of this application, in this embodiment, the fan 7 can be located between the capacitor assembly 102 and the heat dissipation assembly 203, and the air outlet of the fan 7 faces the heat dissipation fins of the heat dissipation assembly 203. This can help improve the heat dissipation efficiency of the heat dissipation assembly 203, thereby improving the heat dissipation efficiency of the power conversion module 2.

[0098] In addition to the above structure, the power conversion device may also include an air-cooled heat dissipation component 8 as shown in Figure 2. The air-cooled heat dissipation component 8 can be used to provide a circulation channel for airflow in the housing 4. This application does not limit the specific placement of the air-cooled heat dissipation component 8 in the housing 4. It can be set according to the layout space and heat dissipation requirements in the housing 4.

[0099] After understanding the basic structure of the power conversion device provided in this application, the assembly process of the power conversion device will be described exemplarily with reference to Figures 15a to 15g.

[0100] The first step is to place the housing 4 on the assembly workbench. Figure 15a only shows the peripheral side plate 404 and partition plate 401 of the housing 4, and at this time the heat dissipation cavity 402 is far away from the assembly workbench relative to the power cavity 403 (not shown in Figure 15a). That is to say, in this embodiment, the components located in the heat dissipation cavity 402 are installed first.

[0101] The second step is to position and install the components within the heat dissipation cavity 402. In this step, referring to Figures 7 and 11, the second positioning post 4013 is inserted into the second positioning hole 2033 of the heat dissipation component 203 of the power conversion module 2 to achieve positioning of the power conversion module 2 within the housing 4. Furthermore, to improve structural reliability, the power conversion module 2 and the partition plate 401 can be fixed with screws; specifically, the heat dissipation component 203 and the partition plate 401 can be fixed with screws.

[0102] The inductor assembly 101 is then placed in the heat dissipation cavity 402. Referring to Figures 9 and 11, the third positioning post 4014 is inserted into the third positioning hole 10111 to achieve positioning of the inductor assembly 101 within the housing 4. Similarly, the first outer shell 1011 of the inductor assembly 101 can be fixed to the partition plate 401 with screws to achieve a fixed connection between the inductor assembly 101 and the housing 4.

[0103] Additionally, referring to Figures 10 and 11, the capacitor assembly 102 is placed in the heat dissipation cavity 402, and the fourth positioning post 4015 is inserted into the fourth positioning hole 10211 to achieve positioning of the capacitor assembly 102 within the housing 4. The second outer shell 1021 of the capacitor assembly 102 can also be fixed to the partition plate 401 with screws to achieve a fixed connection between the capacitor assembly 102 and the housing 4.

[0104] In addition, components such as the fan 7 and the air-cooled heat dissipation assembly 8 can be placed in the heat dissipation cavity 402 and fixed to the housing 4 with screws to obtain the structure shown in Figure 15b.

[0105] It is understood that the installation order of the above components in the heat dissipation cavity 402 is not limited to this, and can be selected according to the actual processing production line.

[0106] The third step is to install the first cover plate 405, as shown in Figure 15c. The first cover plate 405 covers the opening of the heat dissipation cavity 402 and is fixedly connected to the peripheral side plate 404 to encapsulate the heat dissipation cavity 402. It is worth mentioning that in this application, the first cover plate 405 and the peripheral side plate 404 can be detachably connected by screws or the like.

[0107] The fourth step is to rotate the structure assembled in the third step by 180° so that it is in the state shown in Figure 15d. At this time, the first cover plate 405 is in contact with the assembly table, and the power cavity 403 is away from the assembly table relative to the heat dissipation cavity 402. Then the components in the power cavity 403 can be assembled.

[0108] The fifth step is to position and install the main circuit board 3. Referring to Figure 4, the main circuit board 3 is placed in the power cavity 403, and the first positioning post 4011 is inserted into the first positioning hole 301, thereby positioning the main circuit board 3 in the housing 4 to obtain the structure shown in Figure 15e.

[0109] The sixth step, as shown in Figure 15f, is to connect the main circuit board 3 to the first sub-circuit board 201, capacitor assembly 102, and inductor assembly 101 of the power conversion module 2. Since the power conversion module 2, capacitor assembly 102, and inductor assembly 101 are all fixedly connected to the partition 401, and they can all be fixedly connected to the main circuit board 3 using screws, there is no need to fix the main circuit board 3 to the housing 4 separately.

[0110] Step 7: Install the second cover plate 406, as shown in Figure 15g. The second cover plate 406 covers the opening of the power cavity 403 and is fixedly connected to the peripheral side plate 404. The second cover plate 406 and the peripheral side plate 404 can be detachably connected by screws or the like.

[0111] This completes the assembly of the power conversion device. As can be understood from the above description of its assembly steps, the power conversion device setup provided in this application embodiment uses the partition 401 as the positioning reference for each component, which can effectively reduce assembly errors, thereby reducing the assembly difficulty of the power conversion device, improving the manufacturability of the power conversion device, and helping to improve the product yield of the power conversion device.

[0112] In practical applications, the power conversion device is placed vertically as shown in Figure 16a. Next, taking the failure of the power conversion module as an example, the maintenance process of the power conversion device will be introduced.

[0113] The first step, as shown in Figure 16b, is to remove the second cover plate 406.

[0114] The second step, as shown in Figure 16c, is to disconnect the screw connection between the main circuit board 3 and the power conversion module 2.

[0115] The third step, as shown in Figure 16d, is to remove the first cover plate 405.

[0116] The fourth step, as shown in Figure 16e, is to remove the failed power conversion module 2.

[0117] Fifth step, as shown in Figure 16f, replace the power conversion module 2 with a replacement and reinstall the first cover plate 405 on the peripheral side plate 404.

[0118] The sixth step, as shown in Figure 16a, is to reconnect the replacement power conversion module 2 to the main circuit board 3 and reinstall the second cover plate 406 onto the peripheral side plate 404.

[0119] This completes the maintenance of the power conversion device. It is worth mentioning that when the power conversion module 2 is configured as shown in Figure 7, if either the power conversion module 202 or the heat dissipation component 203 fails, only the failed part needs to be replaced, thus reducing maintenance costs.

[0120] Since the power conversion device includes multiple power conversion modules 2, the design scheme provided in this application is adopted. If one of the power conversion modules 2 fails, only the failed power conversion module 2 needs to be replaced, which can avoid the scrapping of the entire machine.

[0121] In the embodiments shown in Figures 16a to 16f above, the on-site maintenance process is only described using the failure of the power conversion module 2 as an example. When other key components in the power conversion device, such as the inductor assembly 101, capacitor assembly 102, air-cooled heat dissipation assembly 8, or the main circuit board 3 in the power cavity 403, fail, their maintenance processes are similar and will not be described in detail here.

[0122] Therefore, the arrangement of the power conversion device provided in this application not only reduces the assembly difficulty of the power conversion device, but also helps to improve its maintainability in the later stage.

[0123] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between different embodiments are consistent and can be referenced in each other. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.

[0124] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. The order of the process numbers described above does not imply the order of execution; the execution order of each process should be determined by its function and internal logic.

Claims

1. A power conversion device, characterized by, It includes a housing, a main circuit board, and multiple power conversion modules, among which: The enclosure is used to house multiple power conversion modules and the main circuit board. The enclosure includes a partition that divides the enclosure into power cavities and heat dissipation cavities arranged along a first direction. The partition includes a first hollow area. The main circuit board is located inside the power cavity; The power conversion module is attached to the partition and covers the first hollow area. The power conversion module includes a power conversion module and a heat dissipation component arranged along the first direction. Along the first direction, the projection of the power conversion module is located within the outline of the first hollow area. The power conversion module is detachably connected to the main circuit board and is used to convert DC power from photovoltaic modules or energy storage batteries into AC power. The heat dissipation component is located in the heat dissipation cavity and is used to dissipate heat from the power conversion module.

2. The power conversion device of claim 1, wherein, The power conversion module further includes a first sub-circuit board, one side of which is attached to the surface of the power conversion module away from the heat dissipation component, and the other side of which includes a first current-carrying terminal, which is fixed and electrically connected to the main circuit board.

3. The power conversion device of claim 2, wherein, Along the first direction, the projection of the power conversion module lies within the outline of the first sub-circuit board connected thereto.

4. The power conversion device according to claim 2 or 3, characterized by The first sub-circuit board further includes a first signal terminal, which is disposed on the other side of the first sub-circuit board. The current value supported by the first signal terminal is less than the current value supported by the first current-carrying terminal.

5. The power conversion device of claim 4, wherein, The first sub-circuit board further includes a driving circuit, which is used to provide a driving level for the power conversion module. The driving circuit is electrically connected to the main circuit board through the first signal terminal.

6. The power conversion device according to any one of claims 1 to 5, characterized by The heat dissipation component is detachably connected to the partition plate, and along the first direction, the projection of the first hollow area is located within the outline of the projection of the heat dissipation component.

7. The power conversion device according to any one of claims 1 to 6, characterized by A first sealing ring is provided between the heat dissipation component and the partition plate, and the first sealing ring is arranged around the power conversion module.

8. The power conversion device according to any one of claims 1 to 7, characterized by The heat dissipation assembly includes a housing and a liquid working fluid contained within the housing; along the first direction, the projection of the power conversion module is located within the contour range of the housing, and the power conversion module is in thermally conductive contact with the liquid working fluid.

9. The power conversion device of claim 8, wherein, The power conversion module is detachably connected to the heat dissipation component.

10. The power conversion device according to any one of claims 1 to 9, characterized by The power conversion device further includes an inductor assembly, at least a portion of which is located in the heat dissipation cavity. The inductor assembly includes a second current-carrying terminal. The partition also includes a second cutout area. Along the first direction, the projection of the second cutout area is located within the outline of the projection of the inductor assembly, and the projection of the second current-carrying terminal is located within the outline of the second cutout area. The second current-carrying terminal is detachably connected to the main circuit board.

11. The power conversion device according to any one of claims 1 to 10, characterized by The power conversion device further includes a capacitor assembly, at least a portion of which is located in the heat dissipation cavity. The capacitor assembly includes a third current-carrying terminal. The partition also includes a third hollow area. Along the first direction, the projection of the third hollow area is located within the outline of the projection of the second housing. The projection of the third current-carrying terminal is located within the outline of the third hollow area, and the third current-carrying terminal is detachably connected to the main circuit board.

12. The power conversion device according to any one of claims 1 to 11, characterized by The surface of the partition facing the power cavity includes a first positioning post, and the main circuit board includes a first positioning hole, with the first positioning post inserted into the first positioning hole.

13. The power conversion device of claim 12, wherein, The first positioning post and the partition plate are integrally formed.

14. A power conversion device according to claim 12 or 13, characterised in that, The surface of the partition facing the heat dissipation cavity includes a second positioning post, and the heat dissipation assembly includes a second positioning hole, with the second positioning post inserted into the second positioning hole.

15. The power conversion device according to any one of claims 1 to 14, characterized by The box also includes a peripheral side plate, which is used to form a cavity of the box; the edge of the partition is connected to the peripheral side plate, and the partition and the peripheral side plate are integrally formed.

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