Electronic device comprising molding member

Abstract

An electronic device according to one embodiment of the present disclosure may comprise: a housing; a display disposed in the housing; and a molding member disposed on at least a portion of the display, wherein: the display includes a conductive layer including at least one first hole penetrating at least a portion thereof, a display panel disposed on the conductive layer, and a first adhesive layer which is disposed between the conductive layer and the display panel and which includes at least one second hole penetrating at least a portion thereof; the molding member includes a first region disposed on one surface of the conductive layer, and a second region disposed inside the conductive layer and the first adhesive layer through the first hole and the second hole; and the second region includes a body formed to have a circumference corresponding to the circumference of the first hole, and at least one protrusion extending from the body.

Description

Electronic device including a molding member

[0001] The various embodiments disclosed in this document relate to an electronic device including a molding member.

[0002] An electronic device may require a sealed waterproof and / or dustproof structure to prevent damage to electronic components placed within the internal space caused by moisture and / or foreign substances entering from the outside. For example, a molding member may be placed on the back of the display to prevent moisture and / or foreign substances from entering the display of the electronic device.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] To prevent the ingress of moisture and / or foreign substances into the display of an electronic device, a molding member and a waterproof member may be placed on the back of the display.

[0005] The electronic device may include a bending portion connected to a display panel and positioned to fold toward the back side, which is the opposite side of the front of the display. At least a portion of the bending portion may be covered by a molding member positioned on the back side of the display. The molding member may reduce the step difference between the bending portion and the area on the back side of the display where the bending portion is not positioned. A waterproof member may be positioned along the perimeter of the electronic device and at least a portion may be bonded to the molding member.

[0006] The molding member may be extended obliquely from the bending portion toward the area where the molding member is not placed so that the step difference between the area where the molding member is placed and the area where the molding member is not placed on the back surface of the display is reduced. As the thickness of the molding member decreases as it faces the back surface of the display, the adhesion of the molding member to the back surface of the display may become relatively weak. Therefore, the molding member may be easily peeled off from the back surface of the display.

[0007] A display of an electronic device including a pen input device (e.g., a stylus) may include a digitizer panel that accepts input from the pen input device and a shielding layer that shields noise from the digitizer panel. In the case of a display including a shielding layer, the thickness of the conductive layer that shields noise from the display may be formed thin to reduce the thickness of the electronic device. As the thickness of the conductive layer placed on the back of the display decreases, the adhesion of the molding member to the conductive layer may become relatively weak. Consequently, the molding member may easily peel off from the conductive layer.

[0008] If the molding member is easily peeled off from the conductive layer, repairing the display may not be easy. A connecting member may be placed on one side of the molding member to connect the housing of the electronic device and the display. When the display is separated from the housing for repair, the connecting member may pull the molding member, causing the molding member to tear or lift. A display in a state where the molding member has torn or lifted may not be able to prevent the ingress of moisture and / or foreign substances, making it impossible to reuse.

[0009] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0010] An electronic device according to one embodiment of the present disclosure comprises a housing, a display disposed in the housing, and a molding member disposed on at least a portion of the display, wherein the display comprises a conductive layer having at least one first hole through which at least a portion is penetrated, a display panel disposed on the conductive layer, and a first adhesive layer disposed between the conductive layer and the display panel and having at least one second hole through which at least a portion is penetrated, and the molding member comprises a first region disposed on one surface of the conductive layer, and a second region disposed inside the conductive layer and the first adhesive layer through the first hole and the second hole, and the second region may include a body formed with a circumference corresponding to the circumference of the first hole, and at least one projection extending from the body.

[0011] An electronic device according to one embodiment of the present disclosure comprises a housing, a display disposed in the housing, and a molding member disposed on at least a portion of the display, wherein the display comprises a conductive layer having at least one first hole through which at least a portion is penetrated, a first-1 adhesive layer disposed on the conductive layer and having at least one second hole through which at least a portion is penetrated, a shielding layer disposed on the first-1 adhesive layer and having at least one third hole through which at least a portion is penetrated, a first-2 adhesive layer disposed on the shielding layer and having at least one fourth hole through which at least a portion is penetrated, a digitizer panel disposed on the first-2 adhesive layer, and a display panel disposed on the digitizer panel, wherein the molding member comprises a first region disposed on one surface of the conductive layer, and a second region disposed on at least a portion of the conductive layer, the first-1 adhesive layer, the shielding layer, and the first-2 adhesive layer through the first hole, the second hole, the third hole, and the fourth hole, and the second region is formed with a perimeter corresponding to the perimeter of the first hole. It may include a body and at least one projection extending from the body.

[0012] According to one embodiment disclosed in this document, a hole is formed in at least a part of a display stacked structure in which a thinning molding member is disposed, so that the molding member can be disposed not only on the back of the display but also inside the display. By disposing of the molding member inside the display to increase the bonding area between the molding member and the display, the bonding force between the display and the molding member can be increased.

[0013] A molding member disposed inside the display may include at least one protrusion. The bonding force between the display and the molding member may be increased through the protrusion.

[0014] When separating the display from the housing for maintenance, the molding member may be prevented from tearing or lifting. By placing the molding member on the back and inside of the display, moisture and / or foreign substances may be prevented from entering the display.

[0015] In addition, when separating the display from the housing for maintenance, the molding member does not separate from the display, allowing a worker to easily separate the display from the housing, and reducing the time and cost required for display repair.

[0016] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0017] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0018] FIG. 1a is a block diagram of an exemplary electronic device capable of performing the operations described in the present disclosure.

[0019] FIG. 1b is a block diagram of an electronic device in a network environment according to various embodiments.

[0020] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 2b is a perspective view of the rear side of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0022] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0023] FIG. 4 is an exploded perspective view of a display module according to various embodiments disclosed in this document.

[0024] FIG. 5 is an assembly diagram of a display, a molding member, a connecting member, a waterproof member, and a housing according to one embodiment of the present disclosure.

[0025] FIG. 6 is a drawing of a state in which a molding member is positioned on the back surface of a display and a fourth side of the display according to one embodiment of the present disclosure.

[0026] FIG. 7 is a cross-sectional view of a molding member and a display cut along line AA of FIG. 6 according to one embodiment of the present disclosure.

[0027] FIG. 8a is an enlarged view of a display having the molding member of FIG. 7 arranged thereon, according to one embodiment of the present disclosure.

[0028] FIG. 8b is an enlarged view of a display in which a molding member is disposed on a conductive layer, a first adhesive layer, and an elastic layer according to one embodiment of the present disclosure.

[0029] FIG. 8c is an enlarged view of a display in which a molding member is disposed on a conductive layer and a first adhesive layer according to one embodiment of the present disclosure.

[0030] FIG. 9 is a cross-sectional view of a display including a molding member and a digitizer panel cut along line AA of FIG. 6 according to one embodiment of the present disclosure.

[0031] FIG. 10a is an enlarged view of a display having a molding member comprising the first projection and the second projection of FIG. 9 arranged thereon, according to one embodiment of the present disclosure.

[0032] FIG. 10b is an enlarged view of a display having a molding member including a protrusion arranged thereon, according to one embodiment of the present disclosure.

[0033] FIG. 11 is a drawing in which a molding member and a connecting member are arranged on the back surface of a display and on the fourth side of the display, according to one embodiment of the present disclosure.

[0034] FIG. 12 is a cross-sectional view of a connecting member, a molding member, and a display cut along the BB line of FIG. 11 according to one embodiment of the present disclosure.

[0035] FIG. 13 is a drawing according to one embodiment of the present disclosure showing a state in which a connecting member is positioned in a first-2 region of a molding member and a conductive layer so as not to pass through a first-1 region of the molding member.

[0036] FIG. 14 is a drawing of a state in which a molding member is positioned on the back surface of a display, on the first side, second side, third side, and fourth side of the display, according to one embodiment of the present disclosure.

[0037] In the following description, various embodiments of this document are described with reference to the accompanying drawings. The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0038] In relation to the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise.

[0039] In this document, each of the phrases such as “A or B,” “at least one of A and B,” “or at least one of B,” “A, B or C,” “at least one of A, B and C,” and “B, or at least one of C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0040] FIG. 1a is a block diagram of an exemplary electronic device capable of performing the operations described in the present disclosure.

[0041] Referring to FIG. 1a, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable)-type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1a are illustrative only and are not intended to limit the implementations described or claimed in this disclosure. The electronic device (100) may be referred to as a mobile device, a user device, a multifunction device, a portable device, or a server.

[0042] The electronic device (100) may include components comprising at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuit, antenna, rechargeable battery, or input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into a single component.

[0043] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing operations. The processor (110) may include at least one electrical circuit and may process instructions (or programs, data, etc.) stored in memory (120) individually or collectively in a distributed manner. The processor (110) may include a processor assembly comprising one or more processing circuits. The processor (110) may include any processing circuit that is operative to control the performance and operations of one or more components of the electronic device (100) (e.g., memory (120), display (140), image sensor (150), communication circuit (160), and / or sensor (170)). For example, the processor (110) (e.g., application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or chipset). For example, the processor (110) may be implemented with a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to perform the various functions of the present disclosure individually and / or collectively. As an example without limitation, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) different from the first chip of the electronic device (100).

[0044] For example, the processor (110) may include a central processing unit (111), a graphics processing unit (112), a neural processing unit (113), an image signal processor (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside of the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included in other components (e.g., at least part of memory (120), an interface (e.g. available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0045] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in memory (120). The CPU (111) (or central processing circuit) may be configured to control the components of the processor (110) based on the execution of instructions stored in memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or AI (artificial intelligence) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). An ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through an image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). A display controller (115) (or display control circuit, or DPU (display processing unit)) may be configured to process an image acquired from a CPU (111), GPU (112), ISP (114), or memory (120) (e.g., volatile memory (121)) into a format suitable for a display (140). A memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). A storage controller (117) (or storage control circuit) may be configured to control reading data from the non-volatile memory (122) and writing data to the non-volatile memory (122).The CP (118) (communication processing circuit) may be configured to process data obtained from a component of the processor (110) into a format suitable for transmitting to another electronic device via the communication circuit (160), or to process data obtained from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data regarding the state of the electronic device (100) and / or the state around the electronic device (100), obtained through the sensor (170), into a format suitable for the component of the processor (110).

[0046] Memory (120) may include one or more storage media (or one or more storage devices). For example, memory (120) may include a memory assembly comprising one or more storage media. For example, the one or more storage media may include a hard drive, a permanent memory such as flash memory, read-only memory (ROM) (e.g., non-volatile memory (122)), a semi-permanent memory such as random access memory (RAM) (e.g., volatile memory (121)), any other suitable type of storage (or storage assembly), or any combination thereof. Memory (120) may include a cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As an example not limited to, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a SIM (subscriber identity module) card and / or an SD (secure digital) card) that can be repeatedly inserted into and removed from the electronic device (100).

[0047] For example, memory (120) may store one or more software applications, such as operating system (or system) software applications, firmware software applications, driver software applications, plugin (e.g., add-in, add-on, and / or applet) software applications, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, memory (120) may store instructions that can be called by an application programming interface (API). For example, memory (120) may store instructions within a library.

[0048] FIG. 1b is a block diagram of an electronic device in a network environment according to various embodiments.

[0049] Referring to FIG. 1b, in a network environment (101), an electronic device (100) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (100) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (100) may include a processor (110), memory (120), input assembly (181), sound output assembly (182), display (140), audio assembly (183), sensor (170), interface (177), connection terminal (178), haptic assembly (179), camera assembly (180), power management circuit (188), battery (189), communication circuit (160), subscriber identification circuit (196), or antenna assembly (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (100), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor (170), camera assembly (180), or antenna assembly (197)) may be integrated into a single component (e.g., display (140)).

[0050] The processor (110) can control at least one other component (e.g., a hardware or software component) of the electronic device (100) connected to the processor (110) by executing software (e.g., a program (130)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (110) can store commands or data received from other components (e.g., a sensor (170) or a communication circuit (160)) in a volatile memory (121), process the commands or data stored in the volatile memory (121), and store the resulting data in a non-volatile memory (122). According to one embodiment, the processor (110) may include a main processor (110_1) (e.g., a central processing unit or processor) or an auxiliary processor (110_2) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU) (113), an image signal processor, a sensor hub processor, or a communication processor (118)). For example, if the electronic device (100) includes a main processor (110_1) and an auxiliary processor (110_2), the auxiliary processor (110_2) may be configured to use less power than the main processor (110_1) or to be specialized for a specified function. The auxiliary processor (110_2) may be implemented separately from the main processor (110_1) or as part thereof.

[0051] The auxiliary processor (110_2) can control at least some of the functions or states associated with at least one component of the electronic device (100) (e.g., display (140), sensor (170), or communication circuit (160)) on behalf of the main processor (110_1) while the main processor (110_1) is in an inactive (e.g., sleep) state, or together with the main processor (110_1) while the main processor (110_1) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (110_2) (e.g., image signal processor or communication processor (118)) may be implemented as part of another functionally related component (e.g., camera assembly (180) or communication circuit (160)). According to one embodiment, the auxiliary processor (110_2) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (100) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0052] The memory (120) can store various data used by at least one component of the electronic device (100) (e.g., processor (110) or sensor (170)). The data may include, for example, software (e.g., program (130)) and input data or output data for related commands. The memory (120) may include volatile memory (121) or non-volatile memory (122).

[0053] The program (130) may be stored as software in memory (120) and may include, for example, an operating system (132), middleware (134), or an application (136).

[0054] The input assembly (181) can receive commands or data to be used for a component of the electronic device (100) (e.g., processor (110)) from outside the electronic device (100) (e.g., user). The input assembly (181) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0055] The acoustic output assembly (182) can output an acoustic signal to the outside of the electronic device (100). The acoustic output assembly (182) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0056] The display (140) can visually provide information to an external (e.g., user) of the electronic device (100). The display (140) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display (140) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0057] The audio assembly (183) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio assembly (183) can acquire sound through the input assembly (181) or output sound through the sound output assembly (182) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (100).

[0058] The sensor (170) can detect the operating state of the electronic device (100) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor (170) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] The interface (177) may support one or more specified protocols that can be used for the electronic device (100) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0060] The connection terminal (178) may include a connector through which the electronic device (100) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0061] The haptic assembly (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic sense. According to one embodiment, the haptic assembly (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0062] The camera assembly (180) can capture still images and video. According to one embodiment, the camera assembly (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0063] The power management circuit (188) can manage power supplied to the electronic device (100). According to one embodiment, the power management circuit (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0064] The battery (189) can supply power to at least one component of the electronic device (100). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0065] The communication circuit (160) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (100) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication circuit (160) may include one or more communication processors (118) that operate independently of the processor (110) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication circuit (160) may include a wireless communication circuit (152) (e.g., cellular communication circuit, short-range wireless communication circuit, or GNSS (global navigation satellite system) communication circuit) or a wired communication circuit (154) (e.g., LAN (local area network) communication circuit, or power line communication circuit). The corresponding communication circuit among these communication circuits can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication circuits may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication circuit (152) can identify or authenticate the electronic device (100) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification circuit (196).

[0066] The wireless communication circuit (152) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. The NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication circuit (152) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication circuit (152) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication circuit (152) can support various requirements specified in the electronic device (100), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication circuit (152) can support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0067] An antenna assembly (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna assembly (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna assembly (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication circuit (160). A signal or power may be transmitted or received between the communication circuit (160) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna assembly (197).

[0068] According to various embodiments, the antenna assembly (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0069] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0070] According to one embodiment, commands or data may be transmitted or received between the electronic device (100) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (100). According to one embodiment, all or part of the operations performed on the electronic device (100) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (100) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (100) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (100). The electronic device (100) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (100) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (100) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0071] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0072] The electronic device (200) described below may include at least one of the components of the electronic device (100) described above in FIG. 1a and FIG. 1b.

[0073] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0074] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0075] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0076] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0077] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0078] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM (heart rate monitor) sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0079] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0080] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0081] An indicator may be placed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, a light-emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0082] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0083] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0084] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present disclosure is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device that is capable of bending deformation of a display (e.g., display (330) of FIG. 3), so that at least a portion may be folded, wound or rolled, at least a portion of the area may be expanded, and / or can be housed inside a housing (e.g., housing (210) of FIG. 2a and 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0085] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0086] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIG. 2a and FIG. 2b, or may include other embodiments of the electronic device.

[0087] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2a or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2a), a display (330) (e.g., the display (201) of FIG. 2a), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2b). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0088] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (311) may have a display (330) attached to one side and a substrate (340) attached to the other side. The substrate (340) may be equipped with a processor (e.g., processor (110) of FIG. 1b), a memory (e.g., memory (120) of FIG. 1b), and / or an interface (e.g., interface (177) of FIG. 1b). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0089] Memory may include, for example, volatile memory or non-volatile memory.

[0090] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD (secure digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0091] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the substrate (340). The battery (350) may be integrally disposed inside the electronic device (300). In one embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0092] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external electronic device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination thereof of the side bezel structure (310) and / or the first support member (311).

[0093] FIG. 4 is an exploded perspective view of a display according to one embodiment disclosed in this document.

[0094] In the following description, a display (400) (e.g., the display (140) of FIG. 1a, the display (201) of FIG. 2a, and the display (330) of FIG. 3) may refer to a device for visually displaying information. A display (410) may be understood as a set of components for visually displaying information. The components of the display (400) shown in FIG. 4 are merely examples of components included in the display (400), and the display (400) may be configured by omitting some of the components shown in FIG. 4, or by adding other components other than those shown in FIG. 4.

[0095] The display (400) may include a flat type display panel (440) of the OCTA (on cell touch AMOLED (active matrix organic light-emitting diode)) method. In addition, the display (400) may include an unbreakable type OLED display (e.g., a curved display) panel (440). Furthermore, the light-emitting element constituting the display panel (440) may be implemented as an inorganic light-emitting element made using inorganic materials, which is different from an OLED (organic light-emitting diode) made using organic materials. According to one embodiment, the light-emitting element may be a micro LED (light-emitting diode) (u-LED). A micro LED may refer to an ultra-small inorganic light-emitting element of 100 micrometers (μm) or less in size that emits light on its own without a backlight or color filter.

[0096] Referring to FIG. 4, the display (400) may include a window layer (470), a second adhesive layer (460) sequentially disposed on the back surface of the window layer (470), a polarizing layer (450) (POL (polarizer)) (e.g., a polarizing film), a display panel (440), an elastic layer (e.g., a polymer layer) (430), and a first layer (410) (e.g., a conductive layer (411) and a first-first adhesive layer (412)). In some embodiments, the display panel (440) may include a second layer (420) disposed between the elastic layer (430) and the conductive layer (411), or on the back surface of the elastic layer (430) (e.g., a digitizer panel (424), a support plate (423), a first-second adhesive layer (422), and a shielding layer (421)).

[0097] According to one embodiment, the window layer (470) may include a glass layer. According to one embodiment, the window layer (470) may include ultra-thin glass (UTG). In some embodiments, the window layer (470) may include a polymer. In this case, the window layer (470) may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window layer (470) may be arranged in a plurality of layers to include a glass layer and a polymer.

[0098] According to one embodiment, the display panel (440) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). According to one embodiment, the display panel (440) may include a touch panel (not shown). Components included in the display panel (440) may be disposed on a substrate of the display panel (440). The substrate of the display panel may be formed of a rigid material such as glass. In some embodiments, the substrate of the display panel may be formed of a flexible material. For example, it may be formed of a flexible material such as polyimide (PI), polyethylene terephthalate (PET), or ultra-thin-glass (UTG). The display panel (440) may include organic light emitting diodes (OLEDs) comprising organic materials, but is not limited thereto.

[0099] According to one embodiment, the polarization layer (450) can selectively pass light that vibrates in a certain direction and is output from a light source of the display panel (440). According to one embodiment, the polarization layer (450) may be disposed between the window layer (470) and the display panel (440), or the polarization layer (450) and the display panel (440) may be formed integrally. According to one embodiment, the electronic device may not include the polarization layer (450) and may include a color filter for outputting light of a predetermined wavelength band and a BM (black matrix) layer for preventing light leakage on the upper part of the display panel (440).

[0100] According to one embodiment, the window layer (470) and the display panel (440) may be attached to each other through a second adhesive layer (460). In one embodiment, the window layer (470) and the polarizing layer (450) may be attached to each other through a second adhesive layer (460). For example, the second adhesive layer (460) may include an optical clear adhesive (OCA).

[0101] According to one embodiment, the elastic layer (430) (e.g., a polymer layer) is placed below the display panel (440) to provide a dark background for ensuring visibility of the display panel (440) and may be formed of a cushioning material (e.g., a cushion) for cushioning. For example, the elastic layer (430) may include an opaque metal layer (e.g., a black layer containing a rough pattern) to remove air bubbles that may occur between the display panel (440) and its lower attachments and to block light generated from the display panel (440) or light incident from the outside, and / or a cushioning layer (e.g., a sponge layer) placed for shock absorption. In one embodiment, the display panel (440) and the conductive layer (411) may be attached to each other through the elastic layer (430). In one embodiment, the display panel (440) and the digitizer panel (424) may be attached to each other through the elastic layer (430). For example, the elastic layer (430) may include at least one of a thermoreactive adhesive, a general adhesive, or a double-sided tape. In some embodiments, for waterproofing of the display (400), the elastic layer (430) may be removed or placed under the conductive layer (411).

[0102] According to one embodiment, the second layer (420) may include a digitizer panel (424), a support plate (423), a first-second adhesive layer (422), and a shielding layer (421).

[0103] According to one embodiment, a digitizer panel (424) may be disposed between a conductive layer (411) and an elastic layer (430). In some cases, the digitizer panel (424) may be disposed below the conductive layer (411). The digitizer panel (424) may be a detection member that receives input from a pen input device (e.g., a stylus). In one embodiment, the digitizer panel (424) may include a plurality of conductive patterns (not shown). For example, the digitizer panel (424) may include a plurality of conductive loops. Current flowing through the plurality of conductive loops may form a magnetic field. When an external electronic device (e.g., a stylus) including a coil comes into close to the magnetic field formed by the digitizer panel (424), a resonant frequency may be generated. The resonant frequency may be determined according to the inductance and capacitance of the external electronic device. A digitizer circuit controlling the operation of a digitizer panel (424) can recognize a specific frequency and a location where the specific frequency is recognized by utilizing a plurality of conductive loops included in the digitizer panel (424). For example, when a pen input device approaches the digitizer panel (424), the digitizer circuit can identify the occurrence and location of the resonant frequency of the pen input device. Through this, the pen input of the pen input device can be recognized.

[0104] According to one embodiment, a support plate (423) for supporting a display (400) may be disposed on the back of a digitizer panel (424). The support plate (423) may perform the function of supporting a polarizing layer (450), a display panel (440), an elastic layer (430), and / or a digitizer panel (424). For example, the support plate (423) may be formed of a non-metallic thin-plate material, such as fiber reinforced plastics (FRP) (e.g., carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP)), having rigid (or inflexible) properties for supporting the display (400).

[0105] According to one embodiment, a shielding layer (421) for shielding noise of a digitizer panel (424) may be disposed between the support plate (423) and the conductive layer (411). The shielding layer (421) may include Magnetic Metal Powder (MMP). The shielding layer (421) can shield ambient noise (e.g., magnetic field interference) entering the digitizer panel (424).

[0106] According to one embodiment, the digitizer panel (424) and the shielding layer (421) may be attached to each other through the first and second adhesive layers (422). The support plate (423) and the shielding layer (421) may be attached to each other through the first and second adhesive layers (422). For example, the first and second adhesive layers (422) may include a pressure-sensitive adhesive (PSA).

[0107] According to one embodiment, the first layer (410) may include a conductive layer (411) and a first-1 adhesive layer (412).

[0108] According to one embodiment, the conductive layer (411) may comprise at least one of SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or a metal CLAD (e.g., a layer in which SUS and Al are alternately arranged). In some embodiments, the conductive layer (411) may comprise other alloy materials. In some embodiments, the conductive layer (411) may be used to help reinforce the rigidity of an electronic device (e.g., the electronic device (100) of FIG. 1a, the electronic device (200) of FIG. 2a, and / or the electronic device (300) of FIG. 3), to shield ambient noise, and to dissipate heat emitted from surrounding heat dissipation components. Although FIG. 4 is illustrated as having the conductive layer (411) formed with the same area as the display panel (440), in some embodiments, the conductive layer (411) may be placed on a portion of the display panel (440). In some cases, the conductive layer (411) may be omitted.

[0109] In one embodiment, for a display (400) including a shielding layer (421), the thickness of the conductive layer (411) that shields noise of the display (400) can be formed thinly to reduce the thickness of the electronic device (e.g., the electronic device (300) of FIG. 3).

[0110] According to one embodiment, the elastic layer (430) and the conductive layer (411) may be attached to each other through a first-1 adhesive layer (412). The shielding layer (421) and the conductive layer (411) may be attached to each other through a first-1 adhesive layer (412). For example, the first-1 adhesive layer (412) may include a pressure-sensitive adhesive (PSA).

[0111] According to one embodiment, the display (400) may include at least one functional member (not shown) disposed between the elastic layer (430) and the conductive layer (411), or below the conductive layer (411). According to one embodiment, the functional member may include a graphite sheet for heat dissipation, a touch sensor supporting the touch function of the display (400), a force touch FPCB, a fingerprint sensor FPCB, a communication antenna radiator, or a conductive / non-conductive tape.

[0112] According to one embodiment, the display (400) may include a bending portion (442) that is positioned by folding (e.g., bending) from the display panel (440) to at least a portion of the back surface of the display (400). According to one embodiment, the bending portion (442) may be electrically connected to the display panel (440). The bending portion (442) may include a control circuit (e.g., a DDI (display driver IC)) (442a). The display panel (440) connected to the bending portion (442) may include a TDDI (touch display driver IC) (not shown). In some embodiments, the bending portion (442) connected to the display panel (440) may include both the control circuit (442a) and the TDDI.

[0113] In one embodiment, the bending portion (442) may be formed integrally with the substrate of the display panel (440). The bending portion (442) may be a part of the substrate on which the light-emitting element of the display panel (440) is placed. The bending portion (442) may include a portion that extends from the substrate of the display panel (440) and at least a portion of which is deformed and extends to the back surface of the display panel (440). In one embodiment, the display (400) may include a COP (chip on panel) structure in which a control circuit (442a) is placed on the bending portion (442) formed integrally with the substrate of the display panel (440).

[0114] In one embodiment, the bending portion (442) may be formed separately from the substrate of the display panel (440) and electrically connected to the display panel (440). In this case, the bending portion (442) may be a printed circuit board formed of a flexible material (e.g., a flexible printed circuit board (FPCB)). A portion of the bending portion (442) connected to the display panel (440) may be deformed and extended to the back surface of the display panel (440). In one embodiment, the display (400) may include a COF (chip on film) structure in which a control circuit (442a) is disposed on the bending portion (442) electrically connected to the display panel (440).

[0115] According to one embodiment, various components related to driving the display (400) may be placed in the bending portion (442). For example, passive components such as a flash memory for the display, an ESD (electrostatic discharge) protection diode, a pressure sensor, and / or a decap may be placed in the bending portion (442). For example, active components such as a DDI (display driver integrated circuit) may be placed in the bending portion (442).

[0116] FIG. 5 is an assembly diagram of a display, a molding member, a connecting member, a waterproof member, and a housing according to one embodiment of the present disclosure. FIG. 6 is a diagram according to one embodiment of the present disclosure showing a state in which a molding member is positioned on a fourth side (400d) of a display on the back side of the display.

[0117] According to one embodiment of the present disclosure, as illustrated in FIGS. 5 and 6, an electronic device (600) (e.g., electronic device (100) of FIG. 1a, electronic device (200) of FIG. 2a and / or electronic device (300) of FIG. 3) may include a waterproof structure disposed between a housing (610) (e.g., housing (210) of FIG. 2a) and a display (400). In one embodiment, the waterproof structure may include a waterproof member (620) and a molding member (500).

[0118] According to one embodiment, with reference to FIGS. 4 through 6, a waterproof member (620) (e.g., waterproof tape) may be disposed along the perimeter of the display (400) between the display (400) and the housing (610) and may be adhered to the back surface of the display (400) and the housing (610). The waterproof member (620) may form at least one waterproof space between the back surface of the display (400) and the housing (610). In one embodiment, the waterproof space may accommodate at least a portion of a bending portion (442) that is connected to the display panel (440) and folds toward the back surface of the display (400). In one embodiment, the bending portion (442) may be disposed on a conductive layer (411) disposed on the back surface of the display (400). In one embodiment, the back surface (411a) of the conductive layer (411) may be the back surface of the display (400). Accordingly, the control circuit (442a) placed in the bending part (442) and the plurality of electrical elements (not shown) placed on the back surface of the display (400) are placed in a waterproof space formed through the waterproof member (620), thereby being protected from moisture and / or foreign substances entering from the outside of the electronic device (600).

[0119] In one embodiment, the waterproof member (620) may be a waterproof tape comprising a waterproof material. For example, the waterproof member (620) may include at least one material selected from polyethylene, polypropylene, vinyl, polyester, acrylic, rubber, and silicone. In one embodiment, the waterproof member (620) may prevent or reduce the ingress of moisture and / or foreign substances from the outside of the electronic device (600) into the inside of the electronic device (600).

[0120] According to one embodiment, as illustrated in FIGS. 5 and 6, the electronic device (600) may include a molding member (500) disposed on the back surface of the display (400).

[0121] In one embodiment, the display (400) may include a first side (400a), a second side (400b), a third side (400c), and a fourth side (400d). The second side (400b) may extend from the first side (400a) in a direction perpendicular to the first side (400a) (e.g., the -x-axis direction of FIG. 6). The third side (400c) extends from the second side (400b) in a direction perpendicular to the second side (400b) (e.g., the -y-axis direction of FIG. 6) and may extend in a direction parallel to the first side (400a) (e.g., the y-axis direction of FIG. 6). The fourth side (400d) extends from the third side (400c) in a direction perpendicular to the third side (400c) (e.g., the +x-axis direction in FIG. 6) and may extend in a direction parallel to the second side (400b) (e.g., the x-axis direction in FIG. 6).

[0122] In one embodiment, the molding member (500) is positioned adjacent to the fourth side (400d) of the back surface of the display (400) and can cover at least a portion of the bending portion (442) and the conductive layer (411) positioned on the back surface of the display (400).

[0123] According to one embodiment, the molding member (500) may be placed in the bending portion (442), the conductive layer (411), and the first hole (4101) through insert injection molding. In one embodiment, the molding member (500) may be formed by curing the molding liquid injected through a molding injector. For example, the molding liquid may be cured through at least one of natural curing, thermal curing, or UV curing. In one embodiment, the molding liquid is applied to the back surface of the display (400), and may be applied to at least a portion of the bending portion (442) and the conductive layer (411) on the back surface of the display (400).

[0124] According to one embodiment, with reference to FIG. 6 and FIG. 11 and FIG. 12 to be described later, the molding member (500) can reduce the step difference between components (e.g., a bending part (442), a plurality of electrical elements) disposed on the back surface of the display (400). For example, the bending part (442) may protrude from one side (411a) (e.g., back surface) of the conductive layer (411) on the back surface of the display (400). In this case, a step difference due to a height difference (e.g., a difference in length in the z-axis direction of FIG. 6) may occur between the bending part (442) and one side (411a) of the conductive layer (411). The molding member (500) can be positioned to cover one side (411a) of the bending portion (442) and the conductive layer (411), thereby reducing the step difference between the bending portion (442) and the molding member (500). The molding member (500) can be positioned between the display (400) and the housing (610). Through the molding member (500), a plane can be formed to support the display (400) positioned in the housing (610).

[0125] In one embodiment, referring to FIG. 6 and FIG. 7 to be described later, the molding member (500) may include a first-1 region (511) (e.g., an inclined portion) and a first-2 region (512) (e.g., a cover portion). In one embodiment, the first-2 region (512) may be parallel to the back surface of the conductive layer (411) or at least partially curved relative to the back surface of the conductive layer (411). In one embodiment, the first-1 region (511) may be formed at one end (e.g., the portion facing the +x direction in FIG. 6) and the other end (e.g., the portion facing the -x direction in FIG. 6) of the first-2 region (512). In one embodiment, the first-2 region (512) of the molding member (500) may overlap with a bending portion (442) disposed on the back surface of the display (400). For example, the first-second region (512) can cover at least a portion of the bending portion (442).

[0126] In one embodiment, when the first-1 region (511) is formed at one end and / or the other end of the first-2 region (512) disposed in the bending portion (442) at a height substantially constant with the first-2 region (512), a gap (not shown) may be formed between the first-1 region (511) and the conductive layer (411) due to a waterproof member (620) disposed on at least a portion of one side (500a) of the molding member (500) and one side (411a) of the conductive layer (411). In one embodiment, the gap may be formed through the side of the first-1 region (511) (e.g., the side facing the +x and -x axes in FIG. 7), one side (411a) of the conductive layer (411), and the waterproof member (620).

[0127] In one embodiment, referring to FIGS. 5 and 6 and FIG. 7 to be described later, the first-1 region (511) is formed to be inclined toward the conductive layer (411) at one end and / or the other end of the first-2 region (512) disposed in the bending portion (442). In one embodiment, by placing a waterproof member (620) on at least a portion of the inclined first-1 region (511) and one side (411a) of the conductive layer (411), a gap (not shown) between the first-1 region (511) and the conductive layer (411) can be prevented due to the waterproof member (620). In one embodiment, at least one side of the first-2 region (512) and the first-1 region (511) of the molding member (500) can be formed to be smoothly connected. The waterproof member (620) may extend from the first-2 region (512) of the molding member (500) to the first-1 region (511) along the conductive layer (411). In particular, the waterproof member (620) may be adhered to the first-2 region (512) and / or the first-1 region (511) of the molding member (500).

[0128] According to one embodiment, as illustrated in FIGS. 5 and 6, the electronic device (600) may include a closed-loop waterproof member (620) disposed along the perimeter of the display (400) through a first-1 region (511) of the molding member (500). For example, the waterproof member (620) may be a single-shaped waterproof tape that is not segmented into multiple parts. Thus, the waterproof member (620) may be disposed along the perimeter of the display (400) on one side (e.g., back side) of the conductive layer (411) and one side of the molding member (500) on the back side of the display (400) to seal the space between the display (400) and the housing (610). Thus, the waterproof member (620) may block or reduce moisture and / or foreign substances that may enter between the display (400) and the housing (610).

[0129] In one embodiment, the waterproof member (620) may be formed with a uniform thickness. In one embodiment, depending on the area where the waterproof member (620) is placed, some areas may be formed to be relatively thinner than other areas.

[0130] In a comparative embodiment not illustrated in the drawings, if the first-1 region (511) is not formed in the molding member (500), a gap may be formed between the waterproof member (620) and the back surface of the display (400) due to the step difference between the bending portion (442) and the back surface of the display (400) (e.g., the back surface of the conductive layer (411). According to one embodiment of the present disclosure, as the molding member (500) includes the first-1 region (511), the molding member (500) may extend through the first-1 region (511) to one side (e.g., the back surface) of the conductive layer (411) located on the back surface of the display (400). Accordingly, the waterproof member (620) may be in close contact with the back surface of the conductive layer (411) at the first-2 region (512) of the molding member (500) - the first-1 region (511). Accordingly, as no gap is formed between the waterproof member (620) and the back surface of the display (400) (e.g., the back surface of the conductive layer (411)), the back surface of the display (400) and the housing (610) can be sealed through the waterproof member (620).

[0131] According to one embodiment, the bending portion (442) may include an extension portion (4421) comprising a control circuit of the display (400) (e.g., control circuit (442a) of FIG. 4) and a flexible circuit board (4422) electrically connected to the extension portion (4421) and located in the +y direction of FIG. 6 with respect to the extension portion (4421). In one embodiment, the molding member (500) may be positioned on the back surface of the display (400) such that the first-second region (512) covers a portion of the extension portion (4421). For example, the molding member (500) may extend in the x-axis direction of FIG. 6 to cover at least a portion of the extension portion (4421).

[0132] FIG. 7 is a cross-sectional view of a molding member and a display cut along line AA of FIG. 6 according to one embodiment of the present disclosure. FIG. 8a is an enlarged view of a display in which the molding member of FIG. 7 is disposed, according to one embodiment of the present disclosure. FIG. 8b is an enlarged view of a display in which the molding member is disposed on a conductive layer, a first adhesive layer, and an elastic layer, according to one embodiment of the present disclosure. FIG. 8c is an enlarged view of a display in which the molding member is disposed on a conductive layer and a first adhesive layer, according to one embodiment of the present disclosure.

[0133] Referring to FIGS. 7, FIGS. 8a, FIGS. 8b, and FIGS. 8c, the display (400) may include a window layer (470), a second adhesive layer (460) sequentially disposed on the back surface of the window layer (470), a polarizing layer (450), a display panel (440), an elastic layer (430), and a first layer (410) (e.g., a conductive layer (411) and a first adhesive layer (412)).

[0134] In one embodiment, with reference to FIGS. 6, 7, and 8a, the molding member (500) may include a first region (510) disposed on the back surface of the display (400) and a second region (520) disposed on the inside of the display (400). In one embodiment, the first region (510) may include a first-1 region (511) and a first-2 region (512). The thickness of the first-1 region (511) may be formed to become thinner as it faces one side (411a) of the conductive layer (411) in the first-2 region (512). In one embodiment, by placing a waterproof member (620) on at least a portion of the inclined first-1 region (511) and one side (411a) of the conductive layer (411), a gap (not shown) between the first-1 region (511) and the conductive layer (411) can be prevented due to the waterproof member (620). The first-1 region (511) may be placed on the upper surface (520a) of the second region (520) (e.g., the surface facing the -z axis in FIG. 6). In one embodiment, the second region (520) may be formed on the lower surface of the first-1 region (511) (e.g., the surface facing the +z axis in FIG. 6) at one end (e.g., the portion facing the +x direction in FIG. 6) and the other end (e.g., the portion facing the -x direction in FIG. 6c) of the first-2 region (512). The second region (520) may include a body (521) and at least one projection (522a, 522b).

[0135] In one embodiment, referring to FIGS. 7 and FIGS. 8A, the body (521) of the molding member (500) may be placed inside the first layer (410) and the elastic layer (430) through at least one first recess (4101) through which at least a portion of the first layer (410) of the display (400) is penetrated and at least one groove (4301) through which at least a portion of the elastic layer (430) is recessed.

[0136] In one embodiment, referring to FIGS. 7 and FIGS. 8A, the first recess (4101) may include a first hole (4111) through which at least a portion of the conductive layer (411) is penetrated and a second hole (4121) through which at least a portion of the first adhesive layer (412) (e.g., the first adhesive layer (412) of FIG. 4) is penetrated. In one embodiment, the body (521) of the molding member (500) may be disposed inside the conductive layer (411), the first adhesive layer (412), and the elastic layer (430) through at least one first hole (4111) through which at least a portion of the conductive layer (411) of the display (400) is penetrated, at least one second hole (4121) through which at least a portion of the first adhesive layer (412) is penetrated, and at least one groove (4301) through which at least a portion of the elastic layer (430) is recessed. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the groove (4301). In one embodiment, the first hole (4111) and the second hole (4121) may be formed with the same circumference. In one embodiment, the groove (4301) may be formed with a larger circumference than the first hole (4111) and the second hole (4121). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111) and the second hole (4121).

[0137] In one embodiment, referring to FIGS. 7 and FIGS. 8A, the projection may include a first projection (522a) and a second projection (522b). In one embodiment, the first projection (522a) may be formed extending from the body (521) in a first direction (e.g., the +x axis direction of FIGS. 7) to the groove (4301). In one embodiment, the second projection (522b) may be formed extending from the body (521) in a second direction (e.g., the -x axis direction of FIGS. 7) to the groove (4301). In one embodiment, the first projection (522a) and the second projection (522b) may be formed protruding in the +y axis direction and / or the -y axis direction of FIGS. 7. In one embodiment, either the first projection (522a) or the second projection (522b) may be omitted. In one embodiment, the first projection (522a) and the second projection (522b) may be formed as a single projection formed continuously in a 360-degree manner on the xy plane of FIG. 7. In this case, the first projection (522a) and the second projection (522b) may be formed in the shape of a disc.

[0138] In one embodiment, referring to FIG. 8b, the body (521) of the molding member (500) may be disposed inside the conductive layer (411), the first adhesive layer (412), and the elastic layer (430) through at least one first hole (4111) through which at least a portion of the conductive layer (411) of the display (400) is penetrated, at least one second hole (4121) through which at least a portion of the first adhesive layer (412) is penetrated, and at least one groove (4301) through which at least a portion of the elastic layer (430) is recessed. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the second hole (4121). The first hole (4111) and the groove (4301) are formed with the same circumference, and the second hole (4121) may be formed with a larger circumference than the first hole (4111) and the groove (4301). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111) and the groove (4301).

[0139] In one embodiment, referring to FIG. 8b, the projection may include a first projection (522a) and a second projection (522b). The first projection (522a) may be formed by extending from the body (521) to the second hole (4121) in a first direction (e.g., the +x axis direction in FIG. 8b). The second projection (522b) may be formed by extending from the body (521) to the second hole (4121) in a second direction (e.g., the -x axis direction in FIG. 8b). In one embodiment, the first projection (522a) and the second projection (522b) may be formed by protruding in the +y axis direction and / or the -y axis direction in FIG. 8b. In one embodiment, either the first projection (522a) or the second projection (522b) may be omitted. In one embodiment, the first projection (522a) and the second projection (522b) may be formed as a single projection formed continuously in a 360-degree manner on the xy plane of FIG. 8b. In this case, the first projection (522a) and the second projection (522b) may be formed in the shape of a disc.

[0140] In one embodiment, referring to FIG. 8c, the body (521) of the molding member (500) may be disposed inside the conductive layer (411) and the first adhesive layer (412) through at least one first hole (4111) through which at least a portion of the conductive layer (411) of the display (400) is penetrated and at least one second hole (4121) through which at least a portion of the first adhesive layer (412) is penetrated. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the second hole (4121). In one embodiment, the second hole (4121) may be formed with a larger circumference than the first hole (4111). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111).

[0141] In one embodiment, referring to FIG. 8c, the projection may include a first projection (522a) and a second projection (522b). The first projection (522a) may be formed by extending from the body (521) to the second hole (4121) in a first direction (e.g., the +x axis direction of FIG. 8c). The second projection (522b) may be formed by extending from the body (521) to the second hole (4121) in a second direction (e.g., the -x axis direction of FIG. 8c). In one embodiment, the first projection (522a) and the second projection (522b) may be formed by protruding in the +y axis direction and / or the -y axis direction of FIG. 8c. In one embodiment, either the first projection (522a) or the second projection (522b) may be omitted. In one embodiment, the first projection (522a) and the second projection (522b) may be formed as a single projection formed continuously in a 360-degree manner on the xy plane of FIG. 8c. In this case, the first projection (522a) and the second projection (522b) may be formed in the shape of a disc. In one embodiment, a second region (520) of a molding member (500) is placed on at least a portion of the conductive layer (411), the first adhesive layer (412), and / or the elastic layer (430) of the display (400), and a first-1 region (511) of the molding member (500) is placed on the upper surface (520a) of the second region (520) and on one surface (411a) of the conductive layer (411) so that the molding member (500) can be placed adjacent to the fourth side (400d) of the back surface of the display (400) (e.g., the surface facing the -z axis in FIG. 6).

[0142] In one embodiment, a second region (520) of the molding member (500) is positioned in at least a part of the interior of the display (400) to increase the bonding area between the molding member (500) and the display (400), thereby increasing the bonding force between the display (400) and the molding member (500). The bonding force between the display (400) and the molding member (500) can be increased through protrusions (522a, 522b) protruding from the body (521) of the second region (520) in a first direction (e.g., the +x-axis direction of FIG. 6) and / or a second direction (e.g., the -x-axis direction of FIG. 6).

[0143] FIG. 9 is a cross-sectional view of a display including a molding member and a digitizer panel cut along line AA of FIG. 6 according to one embodiment of the present disclosure. FIG. 10a is an enlarged view of a display having a molding member including a first projection and a second projection of FIG. 9 arranged thereon according to one embodiment of the present disclosure. FIG. 10b is an enlarged view of a display having a molding member including a projection arranged thereon according to one embodiment of the present disclosure.

[0144] Referring to FIG. 9, FIG. 10a, and FIG. 10b, the display (400) may include a window layer (470), a second adhesive layer (460) sequentially disposed on the back surface of the window layer (470), a polarizing layer (450), a display panel (440), an elastic layer (430), a second layer (420) (e.g., a digitizer panel (424), a support plate (423), a first-second adhesive layer (422), and a shielding layer (421)), and a first layer (410) (e.g., a conductive layer (411) and a first-first adhesive layer (412)).

[0145] In one embodiment, with reference to FIGS. 6, FIGS. 9, FIGS. 10a, and FIGS. 10b, the body (521) of the molding member (500) may be placed inside the first layer (410) and the second layer (420) through at least one first recess (4101) through which at least a portion of the first layer (410) of the display (400) is penetrated and at least one second recess (4201) through which at least a portion of the second layer (420) is recessed.

[0146] In one embodiment, referring to FIG. 9, FIG. 10a, and FIG. 10b, the first recess (4101) may include a first hole (4111) through which at least a portion of the conductive layer (411) is penetrated and a second hole (4121) through which at least a portion of the first-1 adhesive layer (412) (e.g., the first-1 adhesive layer (412) of FIG. 4 and the first adhesive layer (412) of FIG. 7) is penetrated. In one embodiment, the second recess (4201) may include a third hole (4211) through which at least a portion of the shielding layer (421) is penetrated and a fourth hole (4221) through which at least a portion of the first-2 adhesive layer (422) is penetrated.

[0147] In one embodiment, with reference to FIG. 9, FIG. 10a, and FIG. 10b, the body (521) of the molding member (500) may be disposed inside the conductive layer (411), the first-first adhesive layer (412), the shielding layer (421), and / or the first-second adhesive layer (422) through at least one first hole (4111) through which at least a portion of the conductive layer (411) of the display (400) is penetrated, at least one second hole (4121) through which at least a portion of the first adhesive layer (412) is penetrated, a third hole (4211) through which at least a portion of the shielding layer (421) is penetrated, and / or a fourth hole (4221) through which at least a portion of the first-second adhesive layer (422) is penetrated. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to a second hole (4121), a third hole (4211), or a fourth hole (4221).

[0148] In one embodiment, the body (521) of the molding member (500) may be disposed inside the conductive layer (411) and the first-first adhesive layer (412) through at least one first hole (411) through which at least a portion of the conductive layer (411) of the display (400) is penetrated and at least one second hole (4121) through which at least a portion of the first-first adhesive layer (412) is penetrated. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the second hole (4121).

[0149] In one embodiment, the body (521) of the molding member (500) may be disposed inside the conductive layer (411), the first adhesive layer (412), and the shielding layer (421) through at least one first hole (411) through which at least a portion of the conductive layer (411) of the display (400) is penetrated, at least one second hole (4121) through which at least a portion of the first adhesive layer (412) is penetrated, and at least one third hole (4211) through which at least a portion of the shielding layer (421) is penetrated. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the second hole (4121) or the third hole (4211).

[0150] In one embodiment, referring to FIG. 9 and FIG. 10a, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the third hole (4211). In one embodiment, the first hole (4111), the second hole (4121), and the fourth hole (4221) may be formed with the same circumference. In one embodiment, the third hole (4211) may be formed with a larger circumference than the first hole (4111), the second hole (4121), and the fourth hole (4221). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111), the second hole (4121), and the fourth hole (4221). In one embodiment, the projection may include a first projection (522a) and a second projection (522b). The first projection (522a) may be formed by extending from the body (521) to the third hole (4211) in a first direction (e.g., the +x axis direction of FIG. 9). The second projection (522b) may be formed by extending from the body (521) to the third hole (4211) in a second direction (e.g., the -x axis direction of FIG. 9). In one embodiment, the first projection (522a) and the second projection (522b) may be formed by protruding in the +y axis direction and / or the -y axis direction of FIG. 9. In one embodiment, either the first projection (522a) or the second projection (522b) may be omitted. In one embodiment, the first projection (522a) and the second projection (522b) may be formed as a single projection formed continuously in a 360-degree manner on the xy plane of FIG. 9. In this case, the first projection (522a) and the second projection (522b) may be formed in the shape of a disc. In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the second hole (4121). In one embodiment, the first hole (4111), the third hole (4211), and the fourth hole (4221) may be formed with the same circumference.In one embodiment, the second hole (4121) may be formed with a larger circumference than the first hole (4111), the third hole (4211), and the fourth hole (4221). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111), the third hole (4211), and the fourth hole (4221). In one embodiment, the projection may include a first projection (522a) and a second projection (522b). The first projection (522a) may be formed extending from the body (521) to the second hole (4121) in a first direction (e.g., the +x axis direction in FIG. 9). The second projection (522b) may be formed extending from the body (521) to the second hole (4121) in a second direction (e.g., the -x axis direction in FIG. 9). In one embodiment, the first projection (522a) and the second projection (522b) may be formed to protrude in the +y-axis direction and / or the -y-axis direction of FIG. 9. In one embodiment, either the first projection (522a) or the second projection (522b) may be omitted. In one embodiment, the first projection (522a) and the second projection (522b) may be formed as a single projection formed continuously for 360 degrees on the xy-plane of FIG. 9. In this case, the first projection (522a) and the second projection (522b) may be formed in the shape of a disc.

[0151] In one embodiment, at least one projection (522a, 522b) of the molding member (500) may be formed extending from the body (521) to the fourth hole (4221). In one embodiment, the first hole (4111), the second hole (4121), and the third hole (4211) may be formed with the same circumference. In one embodiment, the fourth hole (4221) may be formed with a larger circumference than the first hole (4111), the second hole (4121), and the third hole (4211). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111), the second hole (4121), and the third hole (4211). In one embodiment, the projection may include the first projection (522a) and the second projection (522b). The first projection (522a) may be formed by extending from the body (521) to the fourth hole (4221) in a first direction (e.g., the +x-axis direction of FIG. 9). The second projection (522b) may be formed by extending from the body (521) to the fourth hole (4221) in a second direction (e.g., the -x-axis direction of FIG. 9). In one embodiment, the first projection (522a) and the second projection (522b) may be formed by protruding in the +y-axis direction and / or the -y-axis direction of FIG. 9. In one embodiment, either the first projection (522a) and the second projection (522b) may be omitted. In one embodiment, the first projection (522a) and the second projection (522b) may be formed as a single projection formed continuously for 360 degrees on the xy plane of FIG. 9. In this case, the first projection (522a) and the second projection (522b) can be formed in the shape of a disc.

[0152] In one embodiment, referring to FIG. 10b, a projection (522) of the molding member (500) may be formed extending from the body (521) to the third hole (4211). In one embodiment, the first hole (4111), the second hole (4121), and the fourth hole (4221) may be formed with the same circumference. In one embodiment, the third hole (4211) may be formed with a larger circumference than the first hole (4111), the second hole (4121), and the fourth hole (4221). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111), the second hole (4121), and the fourth hole (4221). In one embodiment, a projection (522) of the molding member (500) may be formed extending from the body (521) in a first direction (e.g., the +x-axis direction of FIG. 10b) to a third hole (4211). In one embodiment, the projection (522) may be formed protruding from the body (521) in a second direction (e.g., the -x-axis direction of FIG. 10b). In one embodiment, the projection (522) may be formed protruding in the +y-axis direction and / or the -y-axis direction of FIG. 10b. In one embodiment, the projection (522) may be formed as a single projection formed continuously for 180 degrees on the xy-plane of FIG. 10b. In this case, the projection (522) may be formed in the shape of a semi-circle.

[0153] In one embodiment, a projection (522) of the molding member (500) may be formed extending from the body (521) to the second hole (4121). In one embodiment, the first hole (4111), the third hole (4211), and the fourth hole (4221) may be formed with the same circumference. In one embodiment, the second hole (4121) may be formed with a larger circumference than the first hole (4111), the third hole (4211), and the fourth hole (4221). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111), the third hole (4211), and the fourth hole (4221). In one embodiment, the projection may be formed extending from the body (521) to the second hole (4121) in a first direction (e.g., the +x axis direction in FIG. 9). In one embodiment, the projection (522) may be formed by protruding from the body (521) in a second direction (e.g., the -x-axis direction of FIG. 9). In one embodiment, the projection (522) may be formed by protruding in the +y-axis direction and / or the -y-axis direction of FIG. 9. In one embodiment, the projection (522) may be formed as a single projection formed continuously for 180 degrees on the xy-plane of FIG. 9. In this case, the projection (522) may be formed in the shape of a semi-disc.

[0154] In one embodiment, a projection (522) of the molding member (500) may be formed extending from the body (521) to the fourth hole (4221). In one embodiment, the first hole (4111), the second hole (4121), and the third hole (4211) may be formed with the same circumference. In one embodiment, the fourth hole (4221) may be formed with a larger circumference than the first hole (4111), the second hole (4121), and the third hole (4211). In one embodiment, the body (521) of the molding member (500) may be formed with a circumference corresponding to the first hole (4111), the second hole (4121), and the third hole (4211). In one embodiment, the projection may be formed extending from the body (521) to the fourth hole (4221) in a first direction (e.g., the +x axis direction in FIG. 9). In one embodiment, the projection (522) may be formed by protruding from the body (521) in a second direction (e.g., the -x-axis direction of FIG. 9). In one embodiment, the projection (522) may be formed by protruding in the +y-axis direction and / or the -y-axis direction of FIG. 9. In one embodiment, the projection (522) may be formed as a single projection formed continuously for 180 degrees on the xy-plane of FIG. 9. In this case, the projection (522) may be formed in the shape of a semi-disc.

[0155] FIG. 11 is a drawing according to one embodiment of the present disclosure in which a molding member and a connecting member are arranged on the back side of a display at a fourth side of the display. FIG. 12 is a cross-sectional view of a connecting member, a molding member, and a display cut along the BB line of FIG. 11 according to one embodiment of the present disclosure. FIG. 13 is a drawing according to one embodiment of the present disclosure in which a connecting member is arranged in a first-2 region of a molding member and a conductive layer so as not to pass through a first-1 region of the molding member.

[0156] Referring to FIGS. 11, 12, and 13, the display (400) may include a window layer (470), a second adhesive layer (460) sequentially disposed on the back surface of the window layer (470), a polarizing layer (450), a display panel (440), an elastic layer (430), a second layer (420), and a first layer (410).

[0157] In one embodiment, with reference to FIGS. 6, FIGS. 11, and FIGS. 12, a connecting member (630) may be disposed on one side (500a) of a molding member (500) and one side (411a) of a conductive layer (411) to connect the housing (610) of an electronic device (600) and a display (400).

[0158] In one embodiment, the display (400) and the housing (610) may be attached to each other through a connecting member (630). For example, the connecting member (630) may be an adhesive. For example, the connecting member (630) may include at least one of an adhesive, a general adhesive, double-sided tape, or a bond.

[0159] In one embodiment, a second region (520) of the molding member (500) is positioned in at least a part of the interior of the display (400) to increase the bonding area between the molding member (500) and the display (400), thereby increasing the bonding force between the display (400) and the molding member (500). In one embodiment, when the display (400) is separated from the housing (610) for repair of the display (400), the connecting member (630) pulls the molding member (500), and tearing or lifting of the molding member (500) may occur. In one embodiment, the bonding force between the display (400) and the molding member (500) is increased through the second region (520), so that when the display (400) is separated from the housing (610) for repair, the phenomenon of the molding member (500) being torn or lifted from one side (411a) of the conductive layer (411) can be prevented even if the connecting member (630) pulls the molding member (500). In one embodiment, the bonding force between the display (400) and the molding member (500) is increased through the second region (520), so that when the display (400) is separated from the housing (610) to repair the display (400), the molding member (500) is not separated from the display (400) even if the connecting member (630) pulls the molding member (500), allowing the worker to easily separate the display (400) from the housing (610), and the time and cost required for repairing the display (400) can be reduced.

[0160] In one embodiment, with reference to FIGS. 6, FIGS. 11, and FIGS. 12, the bonding force between the display (400) and the molding member (500) can be increased through a third projection (522c) protruding from the body (521) of the second region (520) in a third direction (e.g., the +y-axis direction of FIG. 12). The first projection (522a), the second projection (522b), and the third projection (522c) can be formed in a shape protruding in a first direction (e.g., the +x-axis direction of FIG. 6), a second direction (e.g., the -x-axis direction of FIG. 6), and a third direction (e.g., the +y-axis direction of FIG. 6), respectively, when viewed from above the display (400) (e.g., the z-axis direction of FIG. 6). In one embodiment, the first projection (522a), the second projection (522b), and the third projection (522c) may be configured as a second region (520) of the molding member (500) extending to a second recess (4201) formed with a larger circumference than the first recess (4101) when viewed from above (e.g., in the z-axis direction of FIG. 6). In one embodiment, the first projection (522a), the second projection (522b), and the third projection (522c) may be configured as a second region (520) of the molding member (500) extending to a second hole (4121) formed with a larger circumference than the first hole (4111) when viewed from above (e.g., in the z-axis direction of FIG. 6). In one embodiment, the first projection (522a), the second projection (522b), and the third projection (522c) may be composed of a second region (520) of the molding member (500) extending from either the first layer (410) and the second layer (420). In one embodiment, the first projection (522a), the second projection (522b), and the third projection (522c) may be composed of a second region (520) of the molding member (500) extending from either the first adhesive layer (412) and the elastic layer (430).In one embodiment, the first projection (522a), the second projection (522b), and the third projection (522c) may be composed of a second region (520) of the molding member (500) extending from either the shielding layer (421) and the first-second adhesive layer (422). In one embodiment, any one of the first projection (522a), the second projection (522b), and the third projection (522c) may be omitted.

[0161] In one embodiment, referring to FIG. 13, the connecting member (630) may be disposed on one side (500a) of the first-second region (512) of the molding member (500) and one side (411a) of the conductive layer (411) so as not to pass through the first-first region (511) of the molding member (500). In one embodiment, as the thickness of the first-first region (511) is formed to become thinner as it goes toward one side (411a) of the conductive layer (411) in the first-second region (512), the adhesion of the first-first region (511) of the molding member (500) to one side (411a) of the conductive layer (411) may be relatively weak. In one embodiment, the connecting member (630) is positioned so as not to pass through the first-1 region (511) of the molding member (500), so that when the display (400) is separated from the housing (610) for repair, the phenomenon of the molding member (500) being torn or lifted from one side (411a) of the conductive layer (411) can be prevented even if the connecting member (630) pulls the molding member (500). In one embodiment, the connecting member (630) is positioned so as not to pass through the first-1 region (511) of the molding member (500), so that when the display (400) is separated from the housing (610) to repair the display (400), the molding member (500) is not separated from the display (400) even if the connecting member (630) pulls the molding member (500), allowing the worker to easily separate the display (400) from the housing (610), and the time and cost required for repairing the display (400) can be reduced.

[0162] FIG. 14 is a drawing of a state in which a molding member is positioned on the back surface of a display, on the first side, second side, third side, and fourth side of the display, according to one embodiment of the present disclosure.

[0163] Referring to FIGS. 4, FIGS. 5, and FIGS. 14, the display (400) may include a window layer (470), a second adhesive layer (460) sequentially disposed on the back surface of the window layer (470), a polarizing layer (450), a display panel (440), an elastic layer (430), a second layer (420) (e.g., a digitizer panel (424), a support plate (423), a first-second adhesive layer (422), and a shielding layer (421)), and a first layer (410) (e.g., a conductive layer (411) and a first-first adhesive layer (412)).

[0164] In one embodiment, referring to FIG. 14, the molding member (500) is positioned adjacent to the first side (400a), second side (400b), third side (400c), and fourth side (400d) of the back surface of the display (400) and can cover at least a portion of the bending portion (442) and the conductive layer (411) positioned on the back surface of the display (400).

[0165] In one embodiment, referring to FIGS. 4, 5, and 14, a second region (520) of the molding member (500) is disposed in at least a part inside the display (400) to increase the bonding strength between the display (400) and the molding member (500) by widening the bonding area between the molding member (500) and the display (400). In the case of a display (400) including a shielding layer (421), the conductive layer (411) that shields noise of the display (400) can be formed with a thin thickness to reduce the thickness of the electronic device (600). In one embodiment, to form the thickness of the conductive layer (411) thin, the conductive layer (411) can be formed from a rolled foil material. The rolled foil material can be configured to have a smooth surface and low surface roughness. As one side (411a) of the conductive layer (411) disposed on the back surface of the display (400) is formed of a smooth rolled foil material, the adhesive force to the conductive layer (411) of the molding member (500) may be relatively weak. In one embodiment, the bonding force between the display (400) and the molding member (500) is increased through the second region (520), so that when the display (400) is separated from the housing (610) for repair, the phenomenon of the molding member (500) being torn or lifted from one side (411a) of the conductive layer (411) can be prevented even if the connecting member (630) pulls the molding member (500). In one embodiment, the bonding force between the display (400) and the molding member (500) is increased through the second region (520), so that when the display (400) is separated from the housing (610) to repair the display (400), the molding member (500) is not separated from the display (400) even if the connecting member (630) pulls the molding member (500), allowing the worker to easily separate the display (400) from the housing (610), and the time and cost required for repairing the display (400) can be reduced.

[0166] An electronic device (100, 200, 300, 600) according to one embodiment of the present disclosure may include a housing (610).

[0167] In one embodiment, the electronic device may include a display (400) disposed in the housing.

[0168] In one embodiment, the electronic device may include a molding member (500) disposed on at least a portion of the display.

[0169] In one embodiment, the display may include a conductive layer (411) having at least one first hole (4111) through which at least a portion is penetrated.

[0170] In one embodiment, the display may include a display panel (440) disposed on the conductive layer.

[0171] In one embodiment, the display may include a first adhesive layer (412) disposed between the conductive layer and the display panel and including at least one second hole (4121) through which at least a portion is penetrated.

[0172] In one embodiment, the molding member may include a first region (510) disposed on one surface (411a) of the conductive layer.

[0173] In one embodiment, the molding member may include a first hole and a second region (520) disposed inside the conductive layer and the first adhesive layer through the second hole.

[0174] In one embodiment, the second region may include a body (521) formed with a circumference corresponding to the circumference of the first hole.

[0175] In one embodiment, the second region may include at least one projection (522) extending from the body.

[0176] In one embodiment, the at least one projection may extend from the body to the second hole.

[0177] In one embodiment, the at least one projection may include a first projection (522a) extending in a first direction from the body, and a second projection (522b) extending in a second direction opposite to the first direction from the body.

[0178] In one embodiment, the display may include an elastic layer (430) disposed between the first adhesive layer and the display panel, and including at least one groove (4301) in which at least a portion is recessed.

[0179] In one embodiment, the second region may be disposed inside the conductive layer, the first adhesive layer, and the elastic layer through the first hole, the second hole, and the groove.

[0180] In one embodiment, the at least one projection may extend from the body to the second hole and / or the groove.

[0181] In one embodiment, the at least one projection may include a first projection (522a) extending in a first direction from the body, and a second projection (522b) extending in a second direction opposite to the first direction from the body.

[0182] In one embodiment, the first region may include a first-2 region (512) and a first-1 region (511) extending from the first-2 region and disposed on the upper surface (520a) of the second region.

[0183] In one embodiment, the thickness of the first-1 region may be formed to become thinner as it approaches one side of the conductive layer in the first-2 region.

[0184] In one embodiment, the molding member can prevent moisture from entering the display.

[0185] In one embodiment, the electronic device may further include a connecting member (630) connecting the housing and the display.

[0186] In one embodiment, the connecting member may be disposed in at least a portion of the conductive layer and the first region.

[0187] In one embodiment, the first region may include a first-2 region (512) and a first-1 region (511) extending from the first-2 region and disposed on the upper surface (520a) of the second region.

[0188] In one embodiment, the connecting member may be positioned so as not to pass through the first-1 region of the molding member.

[0189] In one embodiment, the display may include a first side (400a), a second side (400b) extending from the first side in a direction perpendicular to the first side, a third side (400c) extending from the second side in a direction perpendicular to the second side and parallel to the first side, and a fourth side (400d) extending from the third side in a direction perpendicular to the third side and parallel to the third side.

[0190] In one embodiment, the molding member may be disposed on the first side, the second side, the third side, and / or the fourth side.

[0191] In one embodiment, the display may include a conductive layer (411) having at least one first hole (4111) through which at least a portion is penetrated.

[0192] In one embodiment, the display may include a first-1 adhesive layer (412) disposed on the conductive layer and including at least one second hole (4121) through which at least a portion is penetrated.

[0193] In one embodiment, the display may include a shielding layer (421) disposed on the first-1 adhesive layer and including at least one third hole (4211) through which at least a portion is penetrated.

[0194] In one embodiment, the display may include a first-second adhesive layer (422) disposed on the shielding layer and including at least one fourth hole (4221) through which at least a portion is penetrated.

[0195] In one embodiment, the display may include a digitizer panel (424) disposed on the first and second adhesive layers.

[0196] In one embodiment, the display may include a display panel (440) disposed on the digitizer panel.

[0197] In one embodiment, the molding member may include a first region (510) disposed on one surface of the conductive layer.

[0198] In one embodiment, the molding member may include a second region (520) disposed in at least a portion of the conductive layer, the first-1 adhesive layer, the shielding layer, and the first-2 adhesive layer through the first hole, the second hole, the third hole, and the fourth hole.

[0199] In one embodiment, the second region may include a body (521) formed with a circumference corresponding to the circumference of the first hole.

[0200] In one embodiment, the second region may include at least one projection (522) extending from the body.

[0201] In one embodiment, the at least one projection may extend from the body to the second hole, the third hole, and / or the fourth hole.

[0202] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device (e.g., a laptop), a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0203] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device (100, 200, 300, 600), Housing (610); A display (400) disposed in the above housing; and It includes a molding member (500) disposed on at least a portion of the above display, and The above display is, A conductive layer (411) including at least one first hole (4111) that is partially penetrated, A display panel (440) disposed on the conductive layer, and It includes a first adhesive layer (412) disposed between the conductive layer and the display panel and including at least one second hole (4121) through which at least a portion is penetrated, and The above molding member is, A first region (510) disposed on one surface (411a) of the conductive layer, and It includes a second region (520) disposed inside the conductive layer and the first adhesive layer through the first hole and the second hole, and The above second region is, A body (521) formed with a circumference corresponding to the circumference of the first hole, and An electronic device comprising at least one projection (522) extending from the body.

2. In Paragraph 1, The above at least one projection is, An electronic device extending from the body to the second hole.

3. In Paragraph 2, The above at least one projection is, A first projection (522a) extending in a first direction from the body, and An electronic device comprising a second projection (522b) extending from the body in a second direction opposite to the first direction.

4. In Paragraph 1, The above display is, It includes an elastic layer (430) disposed between the first adhesive layer and the display panel, and comprising at least one groove (4301) in which at least a portion is recessed, and The above second region is, An electronic device disposed inside the conductive layer, the first adhesive layer, and the elastic layer through the first hole, the second hole, and the groove.

5. In Paragraph 4, The above at least one projection is, An electronic device extending from the body to the second hole and / or the groove.

6. In Paragraph 5, The above at least one projection is, A first projection (522a) extending in a first direction from the body, and An electronic device comprising a second projection (522b) extending from the body in a second direction opposite to the first direction.

7. In Paragraph 1, The above-mentioned first region is, Areas 1-2 (512), and It includes a first-1 region (511) that extends from the first-2 region and is positioned on the upper surface (520a) of the second region, and The thickness of the above 1-1 region is, An electronic device that becomes thinner as it approaches one side of the conductive layer in the first and second regions.

8. In Paragraph 1, The above molding member is, An electronic device that prevents moisture from entering the above display.

9. In Paragraph 1, The above electronic device is, It further includes a connecting member (630) connecting the housing and the display, and The above connecting member is, An electronic device disposed on at least a portion of the conductive layer and the first region.

10. In Paragraph 9, The above-mentioned first region is, Areas 1-2 (512), and It includes a first-1 region (511) that extends from the first-2 region and is positioned on the upper surface (520a) of the second region, and The above connecting member is, An electronic device positioned so as not to pass through the first-1 region of the molding member.

11. In Paragraph 1, The above display is, First side (400a), A second side (400b) extending from the first side in a direction perpendicular to the first side, A third side (400c) extending from the second side in a direction perpendicular to the second side and parallel to the first side, and An electronic device comprising a fourth side (400d) that extends from the third side in a direction perpendicular to the third side and is parallel to the third side.

12. In Paragraph 11, The above molding member is, An electronic device disposed on the first side, the second side, the third side, and / or the fourth side.

13. In Paragraph 1, The above display is, A shielding layer (421) disposed on the first adhesive layer and including at least one third hole (4211) that is partially penetrated, A first-second adhesive layer (422) disposed in the shielding layer and comprising at least one fourth hole (4221) through which at least a portion is penetrated, A digitizer panel (424) disposed on the first and second adhesive layers, and An electronic device comprising a display panel (440) disposed on the above-mentioned digitizer panel.

14. In Paragraph 13, The first adhesive layer above is, disposed on the conductive layer, and the second region is, An electronic device disposed in at least a portion of the conductive layer, the first adhesive layer, the shielding layer, and the first-second adhesive layer through the first hole, the second hole, the third hole, and the fourth hole.

15. In Paragraph 13, The above at least one projection is, An electronic device extending from the body to the second hole, the third hole, and / or the fourth hole.

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