Vacuum tube, radio frequency module, and communication device

Abstract

Embodiments of the present application relate to the technical field of vacuum tubes, and provide a vacuum tube, a radio frequency module, and a communication device. The vacuum tube comprises a metal housing and a cover plate. The cover plate covers the metal housing, the cover plate and the metal housing define a vacuum cavity, and a transduction structure is provided in the vacuum cavity. The cover plate comprises a dielectric layer structure and a metal layer structure, the metal layer structure is provided with a signal transmission structure, and the signal transmission structure is coupled to the transduction structure. The signal transmission structure is used for inputting a radio frequency signal outside the vacuum cavity into the transduction structure, or the signal transmission structure is used for outputting the radio frequency signal processed by the transduction structure from the vacuum cavity. In this way, it is easy to assemble the vacuum tube, which is beneficial to improving the accuracy and consistency of the vacuum tube.

Description

Vacuum tubes, radio frequency modules and communication equipment

[0001] This application claims priority to Chinese patent application filed on November 22, 2024, with application number 202411696739.0 and entitled "Vacuum tube, radio frequency module and communication device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of vacuum tube technology, and in particular to a vacuum tube, a radio frequency module, and a communication device. Background Technology

[0003] Vacuum tubes such as traveling wave tubes, klystrons, and backward wave tubes can be used to process radio frequency signals and are commonly used in the field of communications.

[0004] In related technologies, a vacuum tube includes a shell, a signal input structure, a signal output structure, and a transducer structure. The shell forms a vacuum chamber, and the transducer structure is located within the vacuum chamber. The signal input and signal output structures can be mounted on the shell by methods such as welding. The signal input structure receives radio frequency (RF) signals from outside the vacuum chamber and inputs them into the transducer structure. The transducer structure processes the RF signals input into the signal input structure, and the signal output structure outputs the processed RF signals from inside the vacuum chamber.

[0005] However, in related technologies, the assembly of vacuum tubes is relatively complex, resulting in poor precision and consistency of vacuum tubes. Summary of the Invention

[0006] This application provides a vacuum tube, a radio frequency module, and a communication device, which simplifies the assembly of the vacuum tube and helps improve its precision and consistency.

[0007] A first aspect of this application provides a vacuum tube, which includes a tube shell comprising a metal shell and a cover plate. The cover plate is attached to the metal shell, and the cover plate and the metal shell are used to enclose and form a vacuum cavity, within which a transducer structure is located. The cover plate includes a dielectric layer structure and a metal layer structure, with the metal layer structure forming a signal transmission structure coupled to the transducer structure. The signal transmission structure is used to input radio frequency signals from outside the vacuum cavity into the transducer structure, or to output radio frequency signals processed by the transducer structure from inside the vacuum cavity. In other words, the signal transmission structure can serve as either a signal input structure or a signal output structure for the vacuum tube.

[0008] The vacuum tube provided in this application integrates at least one of its signal input structure and signal output structure onto a cover plate, reducing the number of components and simplifying the tube's structure. Furthermore, the assembly of at least one of the signal input and output structures can be completed simultaneously with the tube shell assembly, further reducing the number of components requiring assembly. This reduces assembly steps and the necessary fixtures, minimizing assembly errors and improving the tube's precision and consistency. Additionally, the reduced number of components and assembly steps shortens the production cycle and lowers production costs. Moreover, integrating at least one of the signal input and output structures onto the cover plate reduces the number of areas requiring vacuum chamber sealing, mitigating the risk of leaks. In addition, at least one of the signal input structure and the signal output structure is integrated into the cover plate, and at least one of the signal input structure and the signal output structure does not need to be assembled with the tube shell, which is conducive to the miniaturization of vacuum tubes and the assembly of vacuum tubes that can process radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves.

[0009] In one possible implementation, the dielectric layer structure includes a first dielectric layer, and the metal layer structure includes a first metal layer, the first metal layer being located on the side of the first dielectric layer away from the vacuum cavity. The signal transmission structure includes a first signal transmission substructure formed on the first metal layer, and the first signal transmission substructure is coupled to the transducer structure.

[0010] Thus, the first signal transmission substructure is located outside the first dielectric layer. By setting the first signal transmission substructure coupled to the transducer structure on the outside of the first dielectric layer, it is convenient to achieve signal coupling between the components outside the vacuum cavity and the transducer structure inside the vacuum cavity while sealing the vacuum cavity.

[0011] In one possible implementation, the metal layer structure further includes a second metal layer located on the inner surface of the cover plate, and a first dielectric layer located between the second metal layer and the first metal layer.

[0012] This facilitates the welding of the metal shell and the cover plate. Furthermore, it allows for the formation of at least part of functional structures such as transducer structures and signal transmission structures on the inner surface of the cover plate.

[0013] In one possible implementation, the signal transmission structure further includes a second signal transmission substructure formed on a second metal layer. The first signal transmission substructure is coupled to the second signal transmission substructure, and the second signal transmission substructure is coupled to the transducer structure, such that the first signal transmission substructure is coupled to the transducer structure through the second signal transmission substructure.

[0014] Thus, by setting a second signal transmission substructure that is coupled to the first signal transmission substructure and the transducer structure respectively at a position close to the transducer structure, it is easy to realize the coupling between the first signal transmission substructure and the transducer structure, so that components outside the vacuum cavity can be coupled to the transducer structure through the signal transmission structure.

[0015] In one possible implementation, the metal layer structure further includes a third metal layer located on the side of the first metal layer away from the first dielectric layer, and the dielectric layer structure further includes a second dielectric layer located between the first metal layer and the third metal layer.

[0016] Thus, the third metal layer can serve as a ground layer to facilitate the coupling of radio frequency signals between components outside the vacuum cavity and the transducer structure inside the vacuum cavity via the signal transmission structure. Furthermore, the third metal layer can also be used to form other functional structures, allowing for the integration of more devices onto the cover plate.

[0017] In one possible implementation, the inner wall of the metal shell or the inner wall of the cover plate forms a transducer structure.

[0018] Thus, the transducer structure is integrated into the cover plate or metal shell, reducing the number of components in the vacuum tube and thus simplifying its structure. Furthermore, the transducer structure can be assembled simultaneously with the tube shell assembly, further reducing the number of components and assembly steps, thereby minimizing assembly errors and improving the tube's precision and consistency. The reduced number of components and assembly steps also shortens the production cycle and lowers production costs. Moreover, the transducer structure does not require separate assembly with the tube shell, facilitating miniaturization and enabling the assembly of vacuum tubes capable of processing millimeter-wave, submillimeter-wave, and terahertz electromagnetic signals.

[0019] In one possible implementation, the transducer structure is a microstrip line structure formed on the inner wall of the cover plate, and the transducer structure is insulated from the metal shell.

[0020] Thus, by transmitting radio frequency signals within the microstrip line structure, radio frequency signal processing is facilitated. Furthermore, forming the microstrip line structure on the inner wall of the cover plate is relatively easy and cost-effective, making it convenient to integrate the transducer structure onto the cover plate.

[0021] In one possible implementation, the first signal transmission substructure of the signal transmission structure is a first slot structure.

[0022] This facilitates signal coupling between components outside the vacuum cavity and the transducer structure inside the vacuum cavity. Furthermore, forming the first slot structure in the first metal layer is relatively easy. In the case where the transducer structure is a microstrip line structure formed on the inner wall of the cover plate, the portion of the first metal layer excluding the first slot structure can serve as the ground plane for the microstrip line structure.

[0023] In one possible implementation, the transducer structure is a waveguide structure formed on the inner wall of the metal shell, and the metal shell is electrically connected to the second metal layer of the metal layer structure.

[0024] Thus, by enabling radio frequency (RF) signals to propagate within the waveguide structure, RF signal processing is facilitated. Furthermore, forming the waveguide structure on the inner wall of the metal casing is relatively simple and cost-effective, making it easier to integrate the transducer structure onto the cover plate. Additionally, the second metal layer, electrically connected to the metal casing, can serve as the metal boundary of the waveguide structure, further facilitating RF signal transmission within the waveguide structure.

[0025] In one possible implementation, the second signal transmission substructure of the signal transmission structure is a second slot structure.

[0026] Thus, it is relatively easy to form a second gap structure in the second metal layer, which facilitates the formation of a second signal transmission substructure that is coupled to the first signal transmission substructure and the transducer structure respectively in the second metal layer.

[0027] In one possible implementation, the cover plate further includes a plurality of via structures located between the second metal layer and the third metal layer of the metal layer structure. One end of the via structure is electrically connected to the second metal layer, and the other end is electrically connected to the third metal layer, such that the second and third metal layers are electrically connected through the via structures. The plurality of via structures enclose a resonant cavity, at least a portion of the second signal transmission substructure of the signal transmission structure is located within the resonant cavity, and the orthographic projection of the second slot structure on the third metal layer lies within the orthographic projection of the resonant cavity on the third metal layer.

[0028] Thus, the via structure facilitates the formation of a resonant cavity within the cover plate, which in turn facilitates the coupling of radio frequency signals between the second signal transmission substructure and the second slot structure.

[0029] In one possible implementation, the inner wall of the metal shell is further formed with a third slit structure, the transducer structure is coupled to the third slit structure, and the third slit structure is coupled to the second signal transmission substructure of the signal transmission structure, so that the second signal transmission substructure is coupled to the transducer structure through the third slit structure.

[0030] Thus, when the transducer structure is a waveguide structure formed on a metal shell, it is convenient to couple the second signal transmission substructure with the transducer structure.

[0031] In one possible implementation, the metal layer structure is formed with multiple signal transmission structures.

[0032] In this way, some signal transmission structures can serve as signal input structures and some signal transmission structures can serve as signal output structures. That is to say, both signal input and signal output structures can be integrated on the cover plate. The input and output of radio frequency signals in the vacuum cavity can be realized through the signal transmission structures integrated on the cover plate. This can further reduce the size and weight of the vacuum tube, further shorten the production cycle, further reduce the production cost, and further improve the precision and consistency of the vacuum tube.

[0033] In one possible implementation, the cover plate includes a first plate and a second plate, which are respectively fitted onto opposite sides of the metal shell. The first plate, the second plate, and the metal shell are used to enclose and form a vacuum cavity. The dielectric layer structure includes a first dielectric layer structure located on the first plate and a second dielectric layer structure located on the second plate. The metal layer structure includes a first metal layer structure located on the first plate and a second metal layer structure located on the second plate. At least one of the first metal layer structure and the second metal layer structure forms a signal transmission structure.

[0034] This provides a larger space for forming functional structures such as signal transmission structures, which is beneficial for integrating more devices on the cover plate.

[0035] In one possible implementation, the material of the dielectric layer structure is one or more of ceramics, diamond, and glass.

[0036] Thus, while facilitating the passage of radio frequency signals, the dielectric layer structure has good high-temperature resistance, making it easy for vacuum tubes to be assembled and used in high-temperature environments.

[0037] In one possible implementation, the vacuum tube further includes an electron gun, a collector, and a focusing system. The electron gun is located at one end of the cover plate and the metal shell, and the collector is located at the other end. The electron gun, cover plate, metal shell, and collector enclose a vacuum cavity, and the focusing system is located outside the vacuum cavity. The electron gun is used to emit electrons into the vacuum cavity, the focusing system is used to focus the electrons into an electron beam, and the collector is used to recover the remaining energy of the electron beam. This configuration facilitates the interaction between the formed electron beam and the radio frequency signal transmitted within the transducer structure, thereby enabling the processing of the radio frequency signal transmitted within the transducer structure.

[0038] Because vacuum tubes, which include electron guns, collectors, and focusing systems, often have complex structures, large sizes and weights, and are difficult to assemble, integrating the signal transmission structure onto a cover plate reduces the size and weight of the vacuum tube, thereby expanding its application scenarios. Furthermore, it reduces the production cycle and cost of vacuum tubes, improving their precision and consistency. Additionally, it facilitates the processing of radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves.

[0039] In one possible implementation, the transducer structure is a slow-wave structure or a resonant cavity structure.

[0040] Since slow-wave structures and resonant cavity structures are often complex and occupy a large amount of space, integrating at least one of the signal input and signal output structures of a vacuum tube with a slow-wave structure or resonant cavity structure onto the tube shell can reduce the space occupied by the vacuum tube with the slow-wave structure or resonant cavity structure, which is conducive to expanding the application scenarios of vacuum tubes with slow-wave structures or resonant cavity structures.

[0041] In one possible implementation, the vacuum tube is a traveling wave tube, a klystron, or a backward wave tube.

[0042] Traveling wave tubes (TWTs), klystrons, and backward wave tubes (SWTs) often have complex structures, large sizes and weights, and are difficult to assemble. Integrating at least one of the signal input and output structures onto the tube housing reduces their size and weight, thus expanding their application scenarios. Furthermore, it shortens production cycles and costs, and improves their precision and consistency. Additionally, it enhances their ability to process radio frequency (RF) signals in millimeter-wave, submillimeter-wave, and terahertz frequency bands.

[0043] A second aspect of this application provides a radio frequency module, which includes the vacuum tube in any of the above embodiments.

[0044] A third aspect of this application provides a communication device, which includes the radio frequency module in any of the above embodiments. Attached Figure Description

[0045] Figure 1 is a schematic diagram of a communication device provided in an embodiment of this application;

[0046] Figure 2 is a schematic diagram of a vacuum tube provided in an embodiment of this application;

[0047] Figure 3 is a schematic diagram of a cover plate provided in an embodiment of this application;

[0048] Figure 4 is an exploded view of a vacuum tube and waveguide provided in an embodiment of this application;

[0049] Figure 5 is a schematic diagram of the connection between the vacuum tube and waveguide provided in Figure 4;

[0050] Figure 6 shows the S-parameter simulation diagram when the vacuum tube provided in Figure 4 is a traveling wave tube;

[0051] Figure 7 is a schematic diagram of another vacuum tube provided in an embodiment of this application;

[0052] Figure 8 is a schematic diagram of another vacuum tube provided in an embodiment of this application;

[0053] Figure 9 is an exploded view of the vacuum tube provided in Figure 8;

[0054] Figure 10 is a schematic diagram of another type of cover plate provided in an embodiment of this application;

[0055] Figure 11 is a simulation diagram of the S-parameters when the vacuum tube provided in Figure 8 is a traveling wave tube;

[0056] Figure 12 is a schematic diagram of another vacuum tube provided in an embodiment of this application;

[0057] Figure 13 is a schematic diagram of another vacuum tube provided in an embodiment of this application;

[0058] Figure 14 shows an exploded view of the vacuum tube provided in Figure 13;

[0059] Figure 15 shows the S-parameter simulation diagram when the vacuum tube provided in Figure 13 is a traveling wave tube.

[0060] Explanation of reference numerals in the attached diagram: 1. Radio frequency module; 2. Antenna; 10. Baseband; 20. Mid-RF module; 30. Vacuum tube; 100. Metal casing; 110. Third slot structure; 110a. Input slot structure; 110b. Output slot structure; 200. Cover plate; 210. Dielectric layer structure; 210a. First dielectric layer structure; 210b. Second dielectric layer structure; 211. First dielectric layer; 212. Second dielectric layer; 220. Metal layer structure; 220a. First metal layer structure; 220b. Second metal layer structure; 221. First metal layer; 222. Second metal layer; 223. Third metal layer; 230. Via structure; 230a. First via structure; 240b. Second via structure; 240. Resonant cavity; 240a. Input resonant cavity; 240b. Output resonant cavity; 250. First plate; 260. Second plate; 300. Transducer structure; 310. Transducer section; 320. Coupling section; 400, Signal transmission structure; 400a, Signal input structure; 400b, Signal output structure; 410, First signal transmission substructure; 410a, First signal input substructure; 410b, First signal output substructure; 420, Second signal transmission substructure; 420a, Second signal input substructure; 420b, Second signal output substructure; 500, Electron gun; 600, Collector electrode; 700, Focusing system; 800, Waveguide; 800a, Input waveguide; 800b, Output waveguide. Detailed Implementation

[0061] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0062] This application provides a communication device that can be applied to communication systems, such as Global System for Mobile Communication (GSM), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), General Packet Radio Service (GPRS), Long Term Evolution (LTE), LTE Frequency Division Duplex (FDD), LTE Time Division Duplex (TDD), Universal Mobile Telecommunication System (UMTS), Worldwide Interoperability for Microwave Access (WiMAX), 5th Generation (5G), New Radio (NR), Future Communication Systems, Inter-Satellite Communication Systems, and Satellite Communication Systems.

[0063] The communication equipment includes, but is not limited to, network equipment, satellite payloads, and radar. Network equipment includes, but is not limited to, transmission reception points (TRPs), transmission points (TPs), mobile switching centers, access network equipment, base transceiver stations (BTSs), evolved NodeBs (eNodeBs or eNBs), radio frequency base stations, microwave base stations, millimeter-wave base stations, and terahertz base stations. Satellite payloads refer to instruments, equipment, or systems carried on satellites to perform specific tasks; these satellites include, but are not limited to, communication satellites and meteorological satellites. This communication equipment can be applied to wireless communication scenarios such as microwave backhaul, wireless access, satellite communication, and public transportation, and can meet wireless communication applications such as point-to-point (P2P) or point-to-multipoint (P2MP).

[0064] Figure 1 is a schematic diagram of a communication device provided in an embodiment of this application.

[0065] In this embodiment, the communication device includes a radio frequency (RF) module 1 and an antenna 2. The RF module 1 includes a baseband 10, an intermediate frequency (IF) module 20, and a vacuum tube 30. The baseband 10 can be used to encode and pre-distort the input signal, and then transmit the processed signal to the IF module 20. The IF module 20 can be used to perform digital-to-analog conversion, up-conversion, amplification, and filtering on the phase signal of the baseband 10, and input an RF signal that satisfies the operating requirements of the vacuum tube 30. The vacuum tube 30 can be used to amplify the RF signal from the IF module 20 and then transmit the processed RF signal to the antenna 2. The antenna 2 is used to radiate the processed signal from the vacuum tube 30 into free space.

[0066] For example, the vacuum tube 30 may include, but is not limited to, a traveling wave tube, a backward wave tube, a klystron, etc.

[0067] Figure 2 is a schematic diagram of a vacuum tube provided in an embodiment of this application.

[0068] As shown in Figure 2, the vacuum tube 30 may include a tube shell, an electron gun 500, a collector electrode 600, and a focusing system 700. The electron gun 500 and the collector electrode 600 are respectively disposed at both ends of the tube shell. The electron gun 500, the tube shell, and the collector electrode 600 enclose a vacuum cavity. The focusing system 700 is disposed outside the vacuum cavity, and a transducer structure 300 is disposed inside the vacuum cavity. The antenna 2 and the intermediate radio frequency module 20 are both located outside the vacuum cavity. The tube shell is provided with a signal input structure 400a and a signal output structure 400b. The two ends of the signal input structure 400a are respectively connected to the intermediate radio frequency module 20 and the transducer structure 300. The two ends of the signal output structure 400b are respectively connected to the transducer structure 300 and the antenna 2. The intermediate radio frequency module 20 inputs the radio frequency signal into the transducer structure 300 through the signal input structure 400a. The transducer structure 300 is used to process the radio frequency signal input by the signal input structure 400a. The signal output structure 400b is used to transmit the radio frequency signal processed by the transducer structure 300 to the antenna 2.

[0069] An electron gun 500 emits electrons into a vacuum chamber, where they move towards a collector 600. A focusing system 700 focuses the electrons into an electron beam. A transducer structure 300 interacts the electron beam with a radio frequency (RF) signal transmitted within the transducer structure 300 to process the RF signal. The collector 600 recovers any remaining energy after the interaction between the electron beam and the RF signal. This facilitates the interaction of an electron beam with the RF signal transmitted within the transducer structure 300, enabling the processing of the RF signal.

[0070] For example, the focusing system 700 can be fixed to the tube housing, or it can be fixed to the electron gun 500 and the collector electrode 600. The focusing system 700 is arranged circumferentially around the tube housing, and it can be arranged on opposite sides of the tube housing, or it can surround the tube housing circumferentially.

[0071] To house the transducer structure 300 within the vacuum chamber, the tube shell often needs to be assembled from multiple components. For example, the tube shell can be formed by welding together at least two plates.

[0072] In related technologies, the signal input structure and signal output structure are independent components from the casing. After the casing is assembled, the signal input structure and signal output structure need to be assembled onto the casing, and the connection between the signal input structure and the casing needs to be sealed. For example, the signal input structure and signal output structure can be welded onto the casing, and the connection between the signal input structure and the casing can be sealed using solder.

[0073] In related technologies, vacuum tubes have numerous components and a complex structure. Furthermore, the large number of components required for assembly leads to numerous assembly steps and fixtures, resulting in significant assembly errors and consequently, poor precision and consistency. The numerous components and assembly steps also contribute to longer production cycles and higher production costs. Moreover, the numerous locations requiring sealing within the vacuum chamber make it prone to leaks. In addition, vacuum tubes for processing millimeter-wave, submillimeter-wave, and terahertz frequency electromagnetic signals are often small in size. When the size of the vacuum tube is small, assembling the signal input and output structures, which are independent of the tube shell, is difficult. Assembly errors between the signal input and output structures and the tube shell significantly affect the performance of the vacuum tube. In other words, a design where the signal input and output structures are independent components from the tube shell is not conducive to the miniaturization of vacuum tubes and hinders their processing of millimeter-wave, submillimeter-wave, and terahertz frequency electromagnetic signals.

[0074] As shown in Figure 2, based on this, in this embodiment of the application, the casing includes a metal shell 100 and a cover plate 200. The cover plate 200 is fitted onto the metal shell 100, and the cover plate 200 and the metal shell 100 are used to enclose and form a vacuum cavity. Specifically, the side wall of the metal shell 100 has an opening, and the cover plate 200 is fitted onto the side wall of the metal shell 100, sealing the opening on the side wall of the metal shell 100.

[0075] For example, the electron gun 500 is located at one end of the cover plate 200 and the metal shell 100, and the collecting electrode 600 is located at the other end of the cover plate 200 and the metal shell 100. The electron gun 500, the cover plate 200, the metal shell 100 and the collecting electrode 600 are arranged to form a vacuum cavity.

[0076] Figure 3 is a schematic diagram of a cover plate provided in an embodiment of this application.

[0077] As shown in Figure 3 and referring to Figure 2, the cover plate 200 includes a dielectric layer structure 210 and a metal layer structure 220. The metal layer structure 220 forms a signal transmission structure 400. That is, the cover plate 200 integrates the signal transmission structure 400 through the metal layer structure 220. The signal transmission structure 400 is coupled to the transducer structure 300.

[0078] The signal transmission structure 400 is used to input radio frequency signals from outside the vacuum cavity into the transducer structure 300, or the signal transmission structure 400 is used to output radio frequency signals processed by the transducer structure 300 from inside the vacuum cavity.

[0079] In other words, the signal transmission structure 400 can serve as a signal input structure 400a. When the signal transmission structure 400 serves as a signal input structure 400a, it is used to input radio frequency signals from outside the vacuum cavity into the transducer structure 300. Specifically, when the signal transmission structure 400 serves as a signal input structure 400a, it can be connected to the intermediate radio frequency module 20, which inputs the radio frequency signals into the transducer structure 300 through the signal transmission structure 400. Alternatively, the signal transmission structure 400 can serve as a signal output structure 400b. When the signal transmission structure 400 serves as a signal output structure 400b, it is used to output the radio frequency signals processed by the transducer structure 300 from inside the vacuum cavity. Specifically, when the signal transmission structure 400 serves as a signal output structure 400b, it can be connected to the antenna 2, and it transmits the radio frequency signals processed by the transducer structure 300 to the antenna 2.

[0080] This configuration allows at least one of the signal input structure 400a and the signal output structure 400b to be integrated onto the cover plate 200, reducing the number of components in the vacuum tube 30 and thus simplifying its structure. Furthermore, the assembly of at least one of the signal input structure 400a and the signal output structure 400b can be completed simultaneously with the tube housing assembly, further reducing the number of components required for assembly. This reduces assembly steps and the necessary fixtures, minimizing assembly errors and improving the precision and consistency of the vacuum tube 30. Additionally, the reduced number of components and assembly steps shortens the production cycle and lowers production costs. Moreover, integrating at least one of the signal input structure 400a and the signal output structure 400b onto the cover plate 200 reduces the number of areas requiring vacuum chamber sealing, mitigating the risk of leaks. In addition, at least one of the signal input structure 400a and the signal output structure 400b is integrated in the cover plate 200. At least one of the signal input structure 400a and the signal output structure 400b does not need to be assembled with the tube shell, which is beneficial to the miniaturization of the vacuum tube 30, and to the assembly of the vacuum tube 30 for processing radio frequency signals such as millimeter wave, submillimeter wave, and terahertz electromagnetic waves.

[0081] For example, the dielectric layer structure 210 is used to cooperate with the metal shell 100, the electron gun 500, and the collector electrode 600 to form a vacuum cavity. The dielectric layer structure 210 is also used to support the metal layer structure 220 so that the metal layer structure 220 can form functional structures such as the signal transmission structure 400.

[0082] For example, the dielectric layer structure 210 includes at least one dielectric layer, the metal layer structure 220 includes at least one metal layer, and the signal transmission structure 400 may be formed by a metal structure on one or more metal layers.

[0083] For example, in addition to forming the signal transmission structure 400, the metal layer structure 220 can also form other functional structures such as filters, power dividers, functional equalizers, and antennas 2, so that other functional structures such as filters, power dividers, functional equalizers, and antennas 2 can be integrated on the cover plate 200, which helps to reduce the size and weight of radio frequency modules and communication equipment.

[0084] When a vacuum tube 30 includes an electron gun 500, a collector 600, and a focusing system 700, its structure is often complex, resulting in large size and weight, and making assembly difficult. By integrating the signal transmission structure 400 onto the cover plate 200, the volume and weight of the vacuum tube 30 are reduced, thereby expanding its application scenarios. Furthermore, this also reduces the production cycle and cost of the vacuum tube 30, and improves its precision and consistency. In addition, it also facilitates the processing of radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves by the vacuum tube 30, including the electron gun 500, the collector electrode 600, and the focusing system 700.

[0085] In some possible implementations, the metal layer structure 220 is formed with a plurality of signal transmission structures 400.

[0086] In this way, part of the signal transmission structure 400 can be used as a signal input structure 400a and part of the signal transmission structure 400 can be used as a signal output structure 400b. That is to say, both the signal input structure 400a and the signal output structure 400b can be integrated on the cover plate 200. The input and output of radio frequency signals in the vacuum cavity can be realized through the signal transmission structure 400 integrated on the cover plate 200. This can further reduce the size and weight of the vacuum tube 30, further shorten the production cycle, further reduce the production cost, and further improve the precision and consistency of the vacuum tube 30.

[0087] For example, the metal layer structure 220 has two signal transmission structures 400. One signal transmission structure 400 is located at the end of the transducer structure 300 near the electron gun 500 and is a signal input structure 400a. The other signal transmission structure 400 is located at the end of the transducer structure 300 near the collector 600 and is a signal output structure 400b.

[0088] In some possible implementations, the transducer structure 300 can be a slow-wave structure or a resonant cavity structure.

[0089] The slow-wave structure can be used to reduce the propagation speed of radio frequency signals between the signal input structure 400a and the signal output structure 400b, so as to facilitate the interaction between the radio frequency signals transmitted in the slow-wave structure and the electron beam, and to facilitate the amplification of radio frequency signals.

[0090] The resonant cavity structure allows the radio frequency signal to oscillate within the resonant cavity 240, which in turn facilitates the interaction between the radio frequency signal transmitted within the resonant cavity structure and the electron beam, thus enabling the processing of the radio frequency signal.

[0091] Since slow-wave structures and resonant cavity structures are often complex and occupy a large amount of space, integrating at least one of the signal input structure 400a and signal output structure 400b of the vacuum tube 30 with a slow-wave structure or resonant cavity structure onto the tube shell of the vacuum tube 30 can reduce the space occupied by the vacuum tube 30 with a slow-wave structure or resonant cavity structure, and facilitate the expansion of the application scenarios of the vacuum tube 30 with a slow-wave structure or resonant cavity structure.

[0092] Figure 4 is an exploded view of a vacuum tube provided in an embodiment of this application, and Figure 5 is a schematic diagram of the connection between a vacuum tube and a waveguide provided in an embodiment of this application.

[0093] As shown in Figures 4 and 5, and referring to Figure 3, in some possible embodiments, the dielectric layer structure 210 includes a first dielectric layer 211, and the metal layer structure 220 includes a first metal layer 221, with the first metal layer 221 located on the side of the first dielectric layer 211 away from the vacuum cavity. The signal transmission structure 400 includes a first signal transmission substructure 410, which is formed on the first metal layer 221 and coupled to the transducer structure 300.

[0094] Thus, the first signal transmission substructure 410 is located outside the first dielectric layer 211. By setting the first signal transmission substructure 410 coupled to the transducer structure 300 on the outside of the first dielectric layer 211, it is convenient to achieve signal coupling between components outside the vacuum cavity and the transducer structure 300 inside the vacuum cavity while sealing the vacuum cavity. For example, when the signal transmission structure 400 is a signal input structure 400a, the first signal transmission substructure 410 is a first signal input substructure 410a. Components outside the vacuum cavity, such as the radio frequency module 20, can conveniently input radio frequency signals into the first signal input substructure 410a, so that radio frequency signals outside the vacuum cavity can be input into the transducer structure 300 inside the vacuum cavity through the first signal input substructure 410a. For example, when the signal transmission structure 400 is a signal output structure 400b, the first signal transmission substructure 410 is a first signal output substructure 410b. The first signal output substructure 410b can conveniently transmit radio frequency signals to components such as antenna 2 located outside the vacuum cavity, so that the radio frequency signals on the transducer structure 300 inside the vacuum cavity can be transmitted to components such as antenna 2 outside the vacuum cavity through the first signal output substructure 410b.

[0095] For example, the first dielectric layer 211 can be used to carry the first metal layer 221.

[0096] In some possible implementations, the metal layer structure 220 further includes a second metal layer 222 located on the inner surface of the cover plate 200, and a first dielectric layer 211 located between the second metal layer 222 and the first metal layer 221.

[0097] This facilitates the welding of the metal shell 100 to the cover plate 200. Furthermore, it also facilitates the formation of functional structures such as the transducer structure 300 and at least a portion of the signal transmission structure 400 on the inner surface of the cover plate 200.

[0098] For example, the first dielectric layer 211 can also be used to carry the second metal layer 222.

[0099] For example, the second metal layer 222 is formed with a connection structure (not shown), and the metal shell 100 is welded and fixed to the cover plate 200 through the connection structure.

[0100] In some possible implementations, the inner wall of the cover plate 200 forms a transducer structure 300.

[0101] In this way, compared to a design where the transducer structure 300 and the tube shell are independent components, the transducer structure 300 is integrated onto the cover plate 200, reducing the number of components in the vacuum tube 30 and thus lowering the complexity of its structure. Furthermore, the transducer structure 300 can be assembled simultaneously with the tube shell assembly, further reducing the number of components that need to be assembled. This reduces assembly steps and the required fixtures, minimizing assembly errors and improving the precision and consistency of the vacuum tube 30. Additionally, the reduced number of components and assembly steps shortens the production cycle and lowers the production cost of the vacuum tube 30. Furthermore, the transducer structure 300 does not require separate assembly with the tube housing, which facilitates the miniaturization of the vacuum tube 30, enables the assembly of the vacuum tube 30 for processing radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves, and facilitates the processing of radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves by the vacuum tube.

[0102] As shown in Figures 4 and 5, in some possible embodiments, the transducer structure 300 is a microstrip line structure formed on the inner wall of the cover plate 200, that is, the transducer structure 300 is a microstrip line structure formed on the second metal layer 222, and the transducer structure 300 is insulated from the metal shell 100.

[0103] In this way, by transmitting radio frequency signals within the microstrip line structure, it is easier to process the radio frequency signals. In addition, the difficulty and cost of forming the microstrip line structure on the inner wall of the cover plate 200 are relatively low, making it easier to integrate the transducer structure 300 onto the cover plate 200.

[0104] For example, the transducer structure 300 is spaced apart from the connecting structure, so that the transducer structure 300 is insulated from the connecting structure, thereby insulating the transducer structure 300 from the metal shell 100.

[0105] For example, the microstrip line structure includes a transducer segment 310 and a coupling segment 320 disposed at the end of the transducer segment 310, the coupling segment 320 being connected to the transducer segment 310, and a first signal transmission substructure 410 being coupled to the coupling segment 320.

[0106] For example, a signal transmission structure 400 is provided at one end of the microstrip line structure near the electron gun 500. The signal transmission structure 400 at one end of the microstrip line structure near the electron gun 500 is a signal input structure 400a. A coupling section 320 is connected to one end of the transducer section 310 near the electron gun 500. The first signal input substructure 410a of the signal input structure 400a is coupled to the coupling section 320 connected to the one end of the transducer section 310 near the electron gun 500.

[0107] For example, a signal transmission structure 400 is provided at one end of the microstrip line structure near the collector 600. The signal transmission structure 400 at one end of the microstrip line structure near the collector 600 is a signal output structure 400b. A coupling section 320 is connected to one end of the transducer section 310 near the collector 600. The first signal output substructure 410b of the signal output structure 400b is coupled to the coupling section 320 connected to the one end of the transducer section 310 near the collector 600.

[0108] In some possible implementations, the first signal transmission substructure 410 of the signal transmission structure 400 is a first slot structure. That is, when the signal transmission structure 400 serves as a signal input structure 400a, the first signal input substructure 410a can be a first slot structure. When the signal transmission structure 400 serves as a signal output structure 400b, the first signal output substructure 410b can be a first slot structure. The first slot structure forms a slot antenna.

[0109] This facilitates signal coupling between components outside the vacuum cavity and the transducer structure 300 inside the vacuum cavity. Furthermore, forming the first slot structure in the first metal layer 221 is relatively easy. Since the transducer structure 300 is a microstrip line structure formed on the inner wall of the cover plate 200, the portion of the first metal layer 221 other than the first slot structure can serve as the ground plane for the microstrip line structure.

[0110] For example, the first slot structure can be coupled to the microstrip line structure. Specifically, the first slot structure can be coupled to the coupling segment 320 of the microstrip line structure.

[0111] For example, the signal transmission structure 400 can be coupled to a waveguide 800 outside the vacuum cavity to connect to the mid-frequency module 20 or the antenna 2 via the waveguide 800.

[0112] For example, the signal input structure 400a formed by the metal layer structure 220 can be connected to the intermediate radio frequency module 20 via the input waveguide 800a, and the intermediate radio frequency module 20 can transmit radio frequency signals to the signal input structure 400a via the input waveguide 800a. For example, one end of the input waveguide 800a can be connected to the intermediate radio frequency module 20, and the other end of the input waveguide 800a can be coupled to the first slot structure of the signal input structure 400a.

[0113] For example, the signal output structure 400b formed by the metal layer structure 220 can be connected to the antenna 2 via the output waveguide 800b, and the signal output structure 400b can transmit radio frequency signals to the antenna 2 via the output waveguide 800b. For example, one end of the output waveguide 800b can be connected to the antenna 2, and the other end of the output waveguide 800b can be coupled to the first slot structure of the signal output structure 400b.

[0114] Figure 6 shows the S-parameter simulation diagram when the vacuum tube 30 provided in Figure 4 is a traveling wave tube. In the figure, the solid line represents the forward transmission coefficient when the vacuum tube 30 provided in Figure 4 is a traveling wave tube, and the dashed line represents the reflection coefficient when the vacuum tube 30 provided in Figure 4 is a traveling wave tube. As shown in Figure 6, in the 80-90Hz range, the vacuum tube 30 provided in Figure 4, when used as a traveling wave tube, can have good electromagnetic wave coupling characteristics. Components outside the vacuum cavity can be coupled to the transducer structure 300 inside the vacuum cavity through the signal transmission structure 400 integrated on the cover plate 200.

[0115] In other possible embodiments, the transducer structure 300 formed on the inner wall of the cover plate 200 can also be a planar transducer structure 300 such as a slotted structure or a power supply waveguide structure. When the transducer structure 300 formed on the inner wall of the cover plate 200 is a slotted structure or a power supply waveguide structure, the transducer structure 300 is electrically connected to the metal shell 100. Specifically, the transducer structure 300 is electrically connected to the connecting structure so as to be electrically connected to the metal shell 100 through the connecting structure.

[0116] Figure 7 is a schematic diagram of another vacuum tube provided in an embodiment of this application.

[0117] As shown in Figure 7, in some possible embodiments, the inner wall of the metal shell 100 forms a transducer structure 300.

[0118] In this way, compared to a design where the transducer structure 300 and the tube shell are independent components, the transducer structure 300 is integrated onto the metal shell 100, reducing the number of components in the vacuum tube 30 and thus reducing the complexity of the vacuum tube 30 structure. Furthermore, the transducer structure 300 can be assembled simultaneously with the tube shell assembly, further reducing the number of components that need to be assembled in the vacuum tube 30. This reduces assembly steps and the required fixtures, minimizing assembly errors and improving the precision and consistency of the vacuum tube 30. Additionally, the reduced number of components and assembly steps shortens the production cycle and lowers the production cost of the vacuum tube 30. Furthermore, the transducer structure 300 does not require separate assembly with the tube housing, which facilitates the miniaturization of the vacuum tube 30, enables the assembly of the vacuum tube 30 for processing radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves, and facilitates the processing of radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves by the vacuum tube.

[0119] Figure 8 is a schematic diagram of another vacuum tube provided in an embodiment of this application.

[0120] As shown in Figure 8 and referring to Figure 7, in some possible embodiments, the transducer structure 300 is a waveguide structure formed on the inner wall of the metal shell 100, and the metal shell 100 is electrically connected to the second metal layer 222 of the metal layer structure 220.

[0121] In this way, by transmitting radio frequency (RF) signals within the waveguide structure, RF signal processing is facilitated. Furthermore, forming the waveguide structure on the inner wall of the metal casing 100 is relatively simple and cost-effective, making it easier to integrate the transducer structure 300 onto the cover plate 200. Additionally, the second metal layer 222, electrically connected to the metal casing 100, can serve as the metal boundary of the waveguide structure, facilitating RF signal transmission within the waveguide structure.

[0122] For example, the waveguide structure may include, but is not limited to, an interlaced double-grid structure, a folded waveguide structure, a coupled cavity structure, etc. For instance, when the transducer structure 300 is a slow-wave structure, the waveguide structure may include, but is not limited to, an interlaced double-grid slow-wave structure, a folded waveguide slow-wave structure, a coupled cavity slow-wave structure, etc.

[0123] Figure 9 is an exploded view of the vacuum tube provided in Figure 8.

[0124] As shown in Figure 9, in some possible embodiments, the signal transmission structure 400 further includes a second signal transmission substructure 420, which is formed on the second metal layer 222. The first signal transmission substructure 410 is coupled to the second signal transmission substructure 420, and the second signal transmission substructure 420 is coupled to the transducer structure 300, such that the first signal transmission substructure 410 is coupled to the transducer structure 300 through the second signal transmission substructure 420.

[0125] In this way, by setting a second signal transmission substructure 420 that is coupled to the first signal transmission substructure 410 and the transducer structure 300 respectively at a position close to the transducer structure 300, it is easy to realize the coupling between the first signal transmission substructure 410 and the transducer structure 300, so that components outside the vacuum cavity can be coupled to the transducer structure 300 through the signal transmission structure 400.

[0126] For example, when the signal transmission structure 400 is a signal input structure 400a, the second signal transmission substructure 420 is a second signal input substructure 420a. The second signal input substructure 420a located in the second metal layer 222 is coupled with the first signal input substructure 410a and the transducer structure 300, so that the first signal input substructure 410a can more easily input the radio frequency signal to the second signal input substructure 420a, and the second signal input substructure 420a can more easily input the radio frequency signal to the transducer structure 300. For example, when the signal transmission structure 400 is a signal output structure 400b, the second signal transmission substructure 420 is a second signal output substructure 420b. The second signal output substructure 420b located in the second metal layer 222 is coupled with the first signal output substructure 410b and the transducer structure 300, so that the transducer structure 300 can more easily input the radio frequency signal to the second signal output substructure 420b, and the second signal output substructure 420b can more easily input the radio frequency signal to the first signal output substructure 410b.

[0127] In some possible implementations, the second signal transmission substructure 420 of the signal transmission structure 400 is a second slot structure. That is, when the signal transmission structure 400 serves as a signal input structure 400a, the second signal input substructure 420a can be a second slot structure. When the signal transmission structure 400 serves as a signal output structure 400b, the second signal output substructure 420b can be a second slot structure. The second slot structure forms a slot antenna.

[0128] Thus, it is easier to form a second gap structure in the second metal layer 222, which facilitates the formation of a second signal transmission substructure 420 that is coupled to the first signal transmission substructure 410 and the transducer structure 300 respectively in the second metal layer 222.

[0129] Figure 10 is a schematic diagram of another type of cover plate provided in an embodiment of this application.

[0130] As shown in Figure 10, and referring to Figures 8 and 9, in some possible embodiments, the metal layer structure 220 further includes a third metal layer 223, which is located on the side of the first metal layer 221 away from the first dielectric layer 211. The dielectric layer structure 210 further includes a second dielectric layer 212, which is located between the first metal layer 221 and the third metal layer 223.

[0131] Thus, the third metal layer 223 can serve as a ground layer to facilitate the coupling of radio frequency signals between components outside the vacuum cavity and the transducer structure 300 inside the vacuum cavity via the signal transmission structure 400. Furthermore, the third metal layer 223 can also be used to form other functional structures to integrate more devices on the cover plate 200.

[0132] In some examples, the first signal transmission substructure 410 of the signal transmission structure 400 can be a stripline structure, and at least a portion of the third metal layer 223 can serve as the ground of the stripline structure.

[0133] Thus, it is relatively easy to form a strip structure on the first metal layer 221.

[0134] For example, the stripline structure can be coupled to the second slit structure, and the transducer structure 300 can be coupled to components outside the vacuum cavity through the stripline structure and the second slit structure.

[0135] As shown in Figure 9, in some possible embodiments, the cover plate 200 further includes a plurality of via structures 230. The via structures 230 are located between the second metal layer 222 and the third metal layer 223 of the metal layer structure 220. One end of the via structure 230 is electrically connected to the second metal layer 222, and the other end of the via structure 230 is electrically connected to the third metal layer 223, so that the second metal layer 222 and the third metal layer 223 are electrically connected through the via structures 230. The plurality of via structures 230 surround to form a resonant cavity 240. At least a portion of the first signal transmission substructure 410 of the signal transmission structure 400 is located within the resonant cavity 240, and the orthographic projection of the second slot structure on the third metal layer 223 is located within the orthographic projection of the resonant cavity 240 on the third metal layer 223.

[0136] Thus, the via structure 230 facilitates the formation of a resonant cavity 240 within the cover plate 200, and the formed resonant cavity 240 facilitates the coupling of radio frequency signals between the second signal transmission substructure 420 and the second slot structure.

[0137] For example, at least a portion of the stripline structure of the signal transmission structure 400 is located within the resonant cavity 240.

[0138] For example, the plurality of via structures 230 includes a plurality of first via structures 230a, the plurality of first via structures 230a surrounding an input resonant cavity 240a, at least a portion of the first signal input substructure 410a of the signal input structure 400a is located within the input resonant cavity 240a, and the orthographic projection of the second slot structure of the signal input structure 400a on the third metal layer 223 is located within the orthographic projection of the input resonant cavity 240a on the third metal layer 223.

[0139] For example, the plurality of via structures 230 includes a plurality of second via structures 230b, the plurality of second via structures 230b surrounding to form an output resonant cavity 240b, at least a portion of the first signal output substructure 410b of the signal output structure 400b is located within the output resonant cavity 240b, and the orthographic projection of the second slot structure of the signal output structure 400b on the third metal layer 223 is located within the orthographic projection of the output resonant cavity 240b on the third metal layer 223.

[0140] In some possible implementations, a third slot structure 110 is also formed on the inner wall of the metal shell 100, forming a slot antenna. The transducer structure 300 is coupled to the third slot structure 110, and the third slot structure 110 is coupled to the second signal transmission substructure 420 of the signal transmission structure 400, such that the second signal transmission substructure 420 is coupled to the transducer structure 300 through the third slot structure 110.

[0141] Thus, when the transducer structure 300 is a waveguide structure formed on the metal shell 100, it is convenient to couple the second signal transmission substructure 420 with the transducer structure 300.

[0142] For example, the inner wall of the metal shell 100 is formed with two third slit structures 110. The two third slit structures 110 are located on both sides of the waveguide structure formed on the metal shell 100. One of the third slit structures 110 is an input slit structure 110a, and the other third slit structure 110 is an output slit structure 110b. The input slit structure 110a is coupled to the second slit structure and the waveguide structure of the signal input structure 400a, and the output slit structure 110b is coupled to the second slit structure and the waveguide structure of the signal output structure 400b.

[0143] In some possible implementations, one side of the sidewall of the metal shell 100 has an opening, and the cover plate 200 covers the side of the sidewall of the metal shell 100 with the opening. In this case, the cover plate 200 can be a plate, and the metal layer of the metal layer structure 220 and the dielectric layer of the dielectric layer structure 210 are alternately stacked.

[0144] Figure 11 shows the S-parameter simulation diagram of the vacuum tube 30 provided in Figure 8 when it is a traveling wave tube. The transducer structure is a sine / cosine slow wave structure formed by the inner wall of the metal shell, with one magnetic field surface of the sine / cosine slow wave structure located in the second metal layer 222. In the figure, the solid line represents the forward transmission coefficient of the vacuum tube 30 provided in Figure 8 when it is a traveling wave tube, and the dashed line represents the reflection coefficient of the vacuum tube 30 provided in Figure 8 when it is a traveling wave tube. As shown in Figure 11, in the 120-140Hz range, the vacuum tube 30 provided in Figure 8, when it is a traveling wave tube, can have good electromagnetic wave coupling characteristics. Components outside the vacuum cavity can be coupled to the transducer structure 300 inside the vacuum cavity through the signal transmission structure 400 integrated on the cover plate 200.

[0145] Figure 12 is a schematic diagram of another vacuum tube provided in an embodiment of this application.

[0146] As shown in Figure 12, in some other possible embodiments, the sidewalls of the metal shell 100 have openings on opposite sides. The cover plate 200 includes a first plate 250 and a second plate 260, which respectively cover the openings on the sidewalls of the metal shell 100, sealing the openings on opposite sides of the sidewalls of the metal shell 100. The first plate 250, the second plate 260, and the metal shell 100 are used to enclose and form a vacuum cavity.

[0147] Figure 13 is a schematic diagram of another vacuum tube provided in the embodiment of this application, and Figure 14 is an exploded view of the vacuum tube provided in Figure 13.

[0148] As shown in Figures 13 and 14, the dielectric layer structure 210 includes a first dielectric layer structure 210a located on the first plate 250 and a second dielectric layer structure 210b located on the second plate 260. The metal layer structure 220 includes a first metal layer structure 220a located on the first plate 250 and a second metal layer structure 220b located on the second plate 260, and at least one of the first metal layer structure 220a and the second metal layer structure 220b forms a signal transmission structure 400.

[0149] This provides a larger space for forming functional structures such as the signal transmission structure 400, which is beneficial for integrating more devices on the cover plate 200.

[0150] For example, the first dielectric layer structure 210a includes at least one dielectric layer, and the first metal layer structure 220a includes at least one metal layer. The dielectric layer of the first dielectric layer structure 210a and the metal layer of the first metal layer structure 220a are stacked alternately.

[0151] For example, the second dielectric layer structure 210b includes at least one dielectric layer, and the second metal layer structure 220b includes at least one metal layer. The dielectric layer of the second dielectric layer structure 210b and the metal layer of the second metal layer structure 220b are alternately stacked.

[0152] In some examples where multiple signal transmission structures 400 are formed in the metal layer structure 220, all signal transmission structures 400 can be formed in the first metal layer structure 220a or the second metal layer 222, that is, all signal transmission structures 400 can be integrated into the first plate 250 or the second plate 260.

[0153] For example, the metal layer structure 220 has two signal transmission structures 400, both of which are formed on the first metal layer structure 220a. That is, both signal transmission structures 400 are integrated into the first plate 250. One of the signal transmission structures 400 is a signal input structure 400a and is located on the first plate 250 near the electron gun 500. The other signal transmission structure 400 is a signal output structure 400b and is located on the first plate 250 near the collector 600.

[0154] Of course, in other examples, the metal layer structure 220 can also form four, six or more signal transmission structures 400, so that all signal transmission structures 400 are formed on the first metal layer structure 220a or the second metal layer structure 220b.

[0155] In some other examples where the metal layer structure 220 has multiple signal transmission structures 400, some of the signal transmission structures 400 may be formed on the first metal layer 221 and some of the signal transmission structures 400 may be formed on the second metal layer 222. That is, some of the signal transmission structures 400 may be integrated on the first plate 250 and some of the signal transmission structures 400 may be integrated on the second plate 260.

[0156] For example, the metal layer structure has two signal transmission structures 400. One signal transmission structure 400 is formed in the first metal layer structure 220a, and the other signal transmission structure 400 is formed in the second metal layer structure 220b. That is, one signal transmission structure 400 is integrated into the first plate 250, and the other signal transmission structure 400 is integrated into the second plate 260. The signal transmission structure 400 formed in the first metal layer structure 220a is a signal input structure 400a and is located in the first plate 250 near the electron gun 500. The signal transmission structure 400 formed in the second metal layer structure 220b is a signal output structure 400b and is located in the second plate 260 near the collector electrode 600.

[0157] Of course, in other examples, the first metal layer structure 220a and the second metal layer structure 220b can both form multiple signal transmission structures 400. For example, one or more signal input structures 400a and one or more signal output structures 400b can be formed on the first metal layer 221, and one or more signal input structures 400a and one or more signal output structures 400b can be formed on the second metal layer 222.

[0158] When the first metal layer structure 220a has a signal transmission structure 400, the first metal layer structure 220a may include a first metal layer 221 and a second metal layer 222, and the first dielectric layer structure 210a includes a first dielectric layer 211.

[0159] When the signal transmission structure 400 is formed in the second metal layer structure 220b, the second metal layer structure 220b includes a first metal layer 221 and a second metal layer 222, and the second dielectric layer structure 210b includes a first dielectric layer 211.

[0160] When both the first metal layer structure 220a and the second metal layer structure 220b have a signal transmission structure 400, both the first metal layer structure 220a and the second metal layer structure 220b include a first metal layer 221 and a second metal layer 222, and both the first dielectric layer structure 210a and the second dielectric layer structure 210b include a first dielectric layer 211.

[0161] As shown in Figure 14, in some examples, the first metal layer structure 220a forms a signal input structure 400a. That is, the first plate 250 integrates the signal input structure 400a. The signal input structure 400a may include a first signal input substructure 410a and a second signal input substructure 420a. The first signal input substructure 410a is formed on the first metal layer 221 of the first metal layer structure 220a, for example, it can be a stripline structure. The second signal input substructure 420a is formed on the second metal layer 222 of the first metal layer structure 220a, for example, it can be a second slot structure.

[0162] In some examples, the second metal layer structure 220b forms a signal output structure 400b, that is, the second plate 260 integrates a signal output structure 400b. The signal output structure 400b may include a first signal output substructure 410b and a second signal output substructure 420b. The first signal output substructure 410b is formed on the first metal layer 221 of the second metal layer structure 220b, for example, it may be a stripline structure. The second signal output substructure 420b is formed on the second metal layer 222 of the second metal layer structure 220b, for example, it may be a second slot structure.

[0163] Figure 15 shows the S-parameter simulation diagram of the vacuum tube provided in Figure 13 when it is a traveling wave tube. The transducer structure is a sine / cosine slow wave structure formed on the inner wall of the metal shell. The two magnetic field surfaces of the sine / cosine slow wave structure are located in the second metal layer 222 of the first metal layer structure 220a and the second metal layer 222 of the second metal layer structure 220b. In the figure, the solid line represents the forward transmission coefficient of the vacuum tube 30 provided in Figure 13 when it is a traveling wave tube, and the dashed line represents the reflection coefficient of the vacuum tube 30 provided in Figure 13 when it is a traveling wave tube. As shown in Figure 15, in the 120-140Hz range, the vacuum tube 30 provided in Figure 13, when it is a traveling wave tube, can have good electromagnetic wave coupling characteristics. Components outside the vacuum cavity can be coupled to the transducer structure 300 inside the vacuum cavity through the signal transmission structure 400 integrated on the cover plate 200.

[0164] In some possible implementations, the material of the dielectric layer structure 210 is one or more of ceramics, diamond, and glass.

[0165] Since vacuum tubes 30 are mostly high-power devices, they operate at high temperatures. High-temperature treatment is often required during assembly of vacuum tubes 30. The dielectric layer structure 210 can be made of one or more of ceramics, diamond, and glass. While facilitating the passage of radio frequency signals, the dielectric layer structure 210 also exhibits good high-temperature resistance, making it convenient for the vacuum tubes 30 to be assembled and used in high-temperature environments.

[0166] For example, the ceramic may include, but is not limited to, boron nitride (BN) ceramics, beryllium oxide (BeO) ceramics, silicon carbide (SiC) ceramics, etc.

[0167] For example, the glass may include, but is not limited to, quartz glass, sapphire glass, etc.

[0168] For example, the material of the metal layer structure 220 can be one or more of molybdenum, tungsten, tungsten / molybdenum alloy copper, stainless steel, nickel-based alloys and copper, so as to facilitate the assembly and use of the vacuum tube 30 in a high-temperature environment.

[0169] In some possible implementations, the vacuum cavity has multiple transducer structures 300.

[0170] For example, when the cover plate 200 is a plate, the inner wall of the cover plate 200 can be formed with multiple transducer structures 300 arranged in parallel, and each transducer structure 300 can be coupled with the signal transmission structure 400 formed by the metal layer structure 220.

[0171] For example, when the cover plate 200 includes a first plate 250 and a second plate 260, one or more transducer structures 300 can be formed on the inner wall of the first plate 250 and the inner wall of the second plate 260. The transducer structure 300 formed on the inner wall of the first plate 250 can be coupled with the signal transmission structure 400 formed on the first metal layer structure 220a, and the transducer structure 300 formed on the inner wall of the second plate 260 can be coupled with the signal transmission structure 400 formed on the second metal layer structure 220b.

[0172] In some possible implementations, the vacuum tube 30 is a traveling wave tube, a klystron, or a backward wave tube.

[0173] Traveling wave tubes (TWTs), klystrons, and backward wave tubes (SWTs) often have complex structures, large sizes and weights, and are difficult to assemble. Integrating at least one of the signal input structure 400a and the signal output structure 400b onto the tube housing reduces the size and weight of the TWTs, klystrons, and backward wave tubes, thereby expanding their application scenarios. Furthermore, it reduces the production cycle and cost of TWTs, klystrons, and backward wave tubes, and improves their precision and consistency. Additionally, it facilitates the processing of radio frequency signals such as millimeter-wave, submillimeter-wave, and terahertz electromagnetic waves by TWTs, klystrons, and backward wave tubes.

[0174] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0175] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0176] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0177] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0178] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0179] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A vacuum electron tube (30) characterized by, Includes a metal casing (100) and a cover plate (200); The cover plate (200) covers the metal shell (100), and the cover plate (200) and the metal shell (100) are used to enclose and form a vacuum cavity, which has a transducer structure (300). The cover plate (200) includes a dielectric layer structure (210) and a metal layer structure (220), wherein the metal layer structure (220) forms a signal transmission structure (400), and the signal transmission structure (400) is coupled to the transducer structure (300); The signal transmission structure (400) is used to input radio frequency signals outside the vacuum cavity into the transducer structure (300), or the signal transmission structure (400) is used to output radio frequency signals processed by the transducer structure (300) from inside the vacuum cavity.

2. The vacuum electron tube (30) of claim 1, characterized in that The dielectric layer structure (210) includes a first dielectric layer (211), and the metal layer structure (220) includes a first metal layer (221), wherein the first metal layer (221) is located on the side of the first dielectric layer (211) away from the vacuum cavity; The signal transmission structure (400) includes a first signal transmission substructure (410), which is formed on the first metal layer (221) and is coupled to the transducer structure (300).

3. The vacuum electron tube (30) of claim 2, characterized by The metal layer structure (220) further includes a second metal layer (222), which is located on the inner surface of the cover plate (200), and the first dielectric layer (211) is located between the second metal layer (222) and the first metal layer (221). The signal transmission structure (400) further includes a second signal transmission substructure (420), which is formed on the second metal layer (222). The first signal transmission substructure (410) is coupled to the second signal transmission substructure (420), and the second signal transmission substructure (420) is coupled to the transducer structure (300), such that the first signal transmission substructure (410) is coupled to the transducer structure (300) through the second signal transmission substructure (420).

4. The vacuum electron tube (30) according to claim 2 or 3, characterized in that The metal layer structure (220) further includes a third metal layer (223), which is located on the side of the first metal layer (221) away from the first dielectric layer (211). The dielectric layer structure (210) further includes a second dielectric layer (212), which is located between the first metal layer (221) and the third metal layer (223).

5. The vacuum electron tube (30) according to any one of claims 1 to 4, characterized in that The inner wall of the metal shell (100) or the inner wall of the cover plate (200) forms the transducer structure (300).

6. The vacuum electron tube (30) of claim 5, characterized by The transducer structure (300) is a microstrip line structure formed on the inner wall of the cover plate (200), and the transducer structure (300) is insulated from the metal shell (100).

7. The vacuum electron tube (30) of claim 6, characterized by The first signal transmission substructure (410) of the signal transmission structure (400) is a first slot structure.

8. The vacuum electron tube (30) of claim 5, characterized by The transducer structure (300) is a waveguide structure formed on the inner wall of the metal shell (100), and the metal shell (100) is electrically connected to the second metal layer (222) of the metal layer structure (220).

9. The vacuum electron tube (30) of claim 8, characterized by The second signal transmission substructure (420) of the signal transmission structure (400) is a second slot structure.

10. The vacuum electron tube (30) of claim 9, characterized by The cover plate (200) further includes a plurality of via structures (230), the via structures (230) being located between the second metal layer (222) and the third metal layer (223) of the metal layer structure (220), one end of the via structure (230) being electrically connected to the second metal layer (222), and the other end of the via structure (230) being electrically connected to the third metal layer (223), so that the second metal layer (222) and the third metal layer (223) are electrically connected through the via structure (230); The plurality of via structures (230) surround to form a resonant cavity (240), at least a portion of the first signal transmission substructure (410) of the signal transmission structure (400) is located within the resonant cavity (240), and the orthographic projection of the second slot structure on the third metal layer (223) is located within the orthographic projection of the resonant cavity (240) on the third metal layer (223).

11. The vacuum electron tube (30) according to any one of claims 8-10, characterized in that The inner wall of the metal shell (100) is further formed with a third slit structure (110), the transducer structure (300) is coupled to the third slit structure (110), and the third slit structure (110) is coupled to the second signal transmission substructure (420) of the signal transmission structure (400), so that the second signal transmission substructure (420) is coupled to the transducer structure (300) through the third slit structure (110).

12. The vacuum electron tube (30) according to any one of claims 1 to 11, characterized in that The metal layer structure (220) is formed with a plurality of the signal transmission structures (400).

13. The vacuum electron tube (30) according to any one of claims 1 to 12, characterized in that The cover plate (200) includes a first plate (250) and a second plate (260), the first plate (250) and the second plate (260) respectively cover the opposite sides of the metal shell (100), and the first plate (250), the second plate (260) and the metal shell (100) are used to enclose and form the vacuum cavity; The dielectric layer structure (210) includes a first dielectric layer structure (210a) located on the first plate (250) and a second dielectric layer structure (210b) located on the second plate (260); The metal layer structure (220) includes a first metal layer structure (220a) located on the first plate (250) and a second metal layer structure (220b) located on the second plate (260), wherein at least one of the first metal layer structure (220a) and the second metal layer structure (220b) is formed with the signal transmission structure (400).

14. The vacuum electron tube (30) according to any one of claims 1 to 13, characterized in that The material of the dielectric layer structure (210) is one or more of ceramics, diamond and glass.

15. The vacuum electron tube (30) according to any one of claims 1 to 14, characterized in that It also includes an electron gun (500), a collecting electrode (600), and a focusing system (700); The electron gun (500) is located at one end of the cover plate (200) and the metal shell (100), and the collecting electrode (600) is located at the other end of the cover plate (200) and the metal shell (100). The electron gun (500), the cover plate (200), the metal shell (100) and the collecting electrode (600) surround and form the vacuum cavity. The focusing system (700) is located outside the vacuum cavity. The electron gun (500) is used to emit electrons into the vacuum cavity, the focusing system (700) is used to focus the electrons into an electron beam, and the collecting electrode (600) is used to recover the remaining energy of the electron beam.

16. The vacuum electron tube (30) according to any one of claims 1 to 15, characterized in that The transducer structure (300) is a slow-wave structure or a resonant cavity structure.

17. The vacuum electron tube (30) according to any one of claims 1-16, characterized in that The vacuum tube (30) is a traveling wave tube, a klystron, or a backwave tube.

18. A radio module (1) characterized by Includes the vacuum tube (30) as described in any one of claims 1-17.

19. A communication device, characterized by Includes the radio frequency module (1) as described in claim 18.

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