Information processing device

Abstract

Provided is an information processing device to be applied to a substrate work machine comprising an imaging device capable of imaging a substrate from above, a light source device capable of irradiating an imaging target with lighting in any light source color from among three primary colors at the time of imaging by the imaging device, and a discharge device that discharges a liquid material onto the substrate. The information processing device computes a deviation from a reference of the discharge position and / or a discharge diameter of the liquid material discharged onto the substrate on the basis of imaging data obtained by emitting at least one light source color from among the three primary colors and imaging the substrate after the liquid material is discharged, and the imaging resolution, which is the length per pixel in each of the vertical and horizontal directions in the imaging data.

Description

Information Processing Device

[0001] The present invention relates to an information processing device that calculates at least one of a deviation from a reference of a discharge position of a liquid material discharged onto a substrate and a discharge diameter.

[0002] The following patent documents describe a technique for imaging a discharge nozzle that discharges a liquid material and the liquid material discharged onto a substrate by the discharge nozzle using an imaging device.

[0003] International Publication No. 2015 / 068305, Japanese Patent Application Laid-Open No. 2019-047067, Japanese Patent Application Laid-Open No. 11-057572, Japanese Patent Application Laid-Open No. 2023-130027

[0004] An object of the present invention is to appropriately calculate at least one of a deviation from a reference of a discharge position of a liquid material discharged onto a substrate and a discharge diameter.

[0005] In order to solve the above problems, this specification discloses an information processing device applied to a substrate working machine including an imaging device capable of imaging a substrate from above, a light source device capable of irradiating an imaging target with lighting in an arbitrary light source color among the three primary colors at the timing when the imaging device images, and a discharge device that discharges a liquid material onto the substrate. The information processing device calculates at least one of a deviation from a reference of a discharge position of the liquid material discharged onto the substrate and a discharge diameter based on imaging data obtained by irradiating at least one of the three primary colors and imaging the substrate after the liquid material is discharged, and an imaging resolution that is the length per pixel in each of the vertical and horizontal directions in the imaging data.

[0006] In the present disclosure, the substrate after the liquid material is discharged is imaged by an imaging device capable of imaging with arbitrary lighting among the three primary colors, and based on the imaging data, at least one of a deviation from a reference of the discharge position of the liquid material discharged onto the substrate and a discharge diameter is calculated. As a result, it becomes possible to appropriately calculate at least one of a deviation from a reference of the discharge position of the liquid material discharged onto the substrate and a discharge diameter.

[0007] This is a perspective view showing an electronic component mounting system. This is a plan view showing a work unit. This is a block diagram showing the control device included in the electronic component mounting system. This is a schematic diagram showing a pre-discharge substrate and a post-discharge substrate. This is a diagram showing an image of a circuit board including the calculation edge. This is a diagram showing an image of a circuit board including the calculation edge and the input edge. This is a diagram showing an image of a circuit board including the calculation edge and the circular edge. This is a diagram showing an image of a circuit board including the calculation edge and the circular edge. This is a diagram showing an image of a circuit board including the calculation edge and the circular edge.

[0008] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures, as embodiments for carrying out the present invention.

[0009] Figure 1 shows an electronic component mounting system 10. The electronic component mounting system 10 consists of one system base 12 and one work unit 16 mounted on the system base 12. As shown in Figure 2, the work unit 16 is equipped with two board-to-board work machines 18. The two board-to-board work machines 18 are arranged adjacent to each other, and the direction in which the two board-to-board work machines 18 are aligned is called the X-axis direction, and the horizontal direction perpendicular to that direction is called the Y-axis direction. Figure 2 is a plan view showing the interior of the work unit 16 from a top-down perspective.

[0010] The two circuit board handling machines 18 have substantially the same structure, and each circuit board handling machine 18 mainly consists of a work machine body 20, a transport device 22, a moving device 24, a feeder holding base 26, a mark camera (see Figure 3) 28, and a parts camera 30. The work machine body 20 is composed of a frame 32 and a beam 34 (see Figure 1) mounted on the frame 32.

[0011] The transport device 22 is equipped with two conveyor devices 40 and 42. The conveyor devices 40 and 42 are arranged on the frame 32 parallel to each other and extending in the X-axis direction. The conveyor devices 40 and 42 transport the circuit boards 47 they support in the X-axis direction using electromagnetic motors 46 (see Figure 3). The circuit boards 47 are also fixedly held in place at predetermined positions by a board holding device 48 (see Figure 3).

[0012] The mobile device 24 is an XY robot type mobile device and is equipped with an electromagnetic motor 52 (see Figure 3) that slides the slider 50 in the X-axis direction and an electromagnetic motor 54 (see Figure 3) that slides it in the Y-axis direction. The slider 50 can be selectively fitted with either a discharge head 60 or a mounting head 62. Either the discharge head 60 or the mounting head 62 attached to the slider is moved to any position on the frame 32 by the operation of the electromagnetic motors 52 and 54.

[0013] The discharge head 60 dispenses adhesive onto the circuit board 47. A syringe 64 is attached to the lower end surface of the discharge head 60. The syringe 64 is filled with adhesive and is connected to an air supply device 66 (see Figure 3) via an air passage. The syringe 64 dispenses adhesive when air is supplied from the air supply device 66. The discharge head 60 also has a syringe lifting device 68 (see Figure 3) that raises and lowers the syringe 64. The syringe lifting device 68 allows the discharge head 60 to change the adhesive dispensing position in the vertical direction. The syringe 64 is detachable from the discharge head 60, and can be replaced with a new syringe 64 when the amount of adhesive inside decreases. The discharge head 60 is attached to the slider 50a of the left circuit board work machine 18a of the two circuit board work machines 18.

[0014] The mounting head 62 is used to mount electronic components onto the circuit board 47. A suction nozzle 70 is provided on the lower end surface of the mounting head 62. The suction nozzle 70 is connected to a positive / negative pressure supply device 72 (see Figure 3) via negative pressure air and positive pressure air passages. The suction nozzle 70 attracts and holds electronic components using negative pressure and releases the held electronic components using positive pressure. The mounting head 62 also has a nozzle lifting device 76 (see Figure 4) that raises and lowers the suction nozzle 70. The nozzle lifting device 76 allows the mounting head 62 to change the vertical position of the electronic component being held. The suction nozzle 70 is detachable from the mounting head 62 and can be replaced according to the size of the electronic component. The mounting head 62 is attached to the slider 50b of the right-hand board-to-board work machine 18b of the two board-to-board work machines 18.

[0015] The feeder holder 26 is located at one end of the frame 32 in the Y-axis direction, and multiple tape feeders 80 can be attached to the feeder holder 26. The tape feeders 80 house tape components, which are electronic components taped together, in a wound state. The tape feeders 80 then feed out the tape components using a dispensing device 82 (see Figure 3). As a result, the tape feeders 80 attached to the feeder holder 26 supply electronic components at the supply location by feeding out the tape components. The tape feeders 80 are detachable from the feeder holder 26, allowing for replacement of electronic components, etc.

[0016] The mark camera 28 is mounted on the slider 50 facing downwards and moves in the X and Y directions together with the discharge head 60 or mounting head 62. As a result, the mark camera 28 captures images of any position on the frame 32. The parts camera 30 is positioned on the frame 32 between the transport device 22 and the feeder holding base 26, facing upwards. As a result, the parts camera 30 captures images of the discharge head 60 or mounting head 62 from a downward viewpoint.

[0017] Furthermore, the substrate handling machine 18 is equipped with a control device 100 as shown in Figure 3. The control device 100 includes a controller 102, a plurality of drive circuits 104, an image processing device 106, and a memory 108. The controller 102 is a computer-based device equipped with a CPU, ROM, RAM, etc. The controller 102 is connected to the plurality of drive circuits 104, which in turn are connected to electromagnetic motors 46, 52, 54, a substrate holding device 48, an air supply device 66, a syringe lifting device 68, a positive / negative pressure supply device 72, a nozzle lifting device 76, and a delivery device 82. As a result, the operation of the transport device 22, the moving device 24, etc., is controlled by the controller 102. The controller 102 is also connected to the image processing device 106. The image processing device 106 is a device for processing image data captured by the mark camera 28 and the parts camera 30. The image processing device 106 obtains information on the imaging resolution, which is the length per pixel of the mark camera 28 and the part camera 30, that has been measured in advance, from the controller 102, and processes the imaging data based on the acquired imaging resolution information. In this way, the controller 102 obtains various information from the imaging data. The controller 102 is also connected to the memory 108. In this way, the controller 102 stores various information in the memory 108 and retrieves various information from the memory 108.

[0018] In the work unit 16, as described above, adhesive is dispensed onto the circuit board 47 by the circuit board work machine 18a, and electronic components are mounted onto the circuit board 47 by the circuit board work machine 18b. Specifically, the circuit board 47 is loaded into the circuit board work machine 18a, and the transport device 22a of the circuit board work machine 18a transports the circuit board to the work position and holds it fixedly in that position. Once the circuit board 47 is held in the work position, the mark camera 28a moves above the circuit board 47 and takes an image of the circuit board 47. As a result, information regarding the holding position of the circuit board 47 is calculated by the controller 102. Next, the dispensing head 60 moves above the circuit board by the operation of the moving device 24a. The dispensing head 60 then dispenses adhesive onto the upper surface of the circuit board after making corrections based on the holding position of the circuit board 47. At this time, the dispensing head 60 dispenses adhesive to the position on the circuit board where the electronic components are to be mounted. Then, once the discharge of adhesive by the discharge head 60 is complete, the circuit board is removed from the board handling machine 18a and loaded into the board handling machine 18b. Once the circuit board is loaded into the board handling machine 18b, the transport device 22b of the board handling machine 18b transports the circuit board to the working position and holds it there in a fixed position. When the circuit board 47 is held in the working position, the mark camera 28b moves above the circuit board 47 and takes an image of the circuit board 47. As a result, information regarding the holding position of the circuit board 47 is calculated by the controller 102. In the board handling machine 18b, the tape feeder 80 feeds out tape-formed components and supplies electronic components to the supply position. Then, the mounting head 62 moves above the supply position of the electronic components by the operation of the moving device 24b and holds the electronic components by suction nozzle 70. Then, the mounting head 62 moves above the parts camera 30b, and the parts camera 30b images the electronic component held by the suction nozzle 70. As a result, the controller 102 calculates information regarding the holding posture and position of the component. Next, the mounting head 62 moves above the planned mounting position of the electronic component on the circuit board, that is, above the position where the adhesive is being dispensed, due to the operation of the moving device 24b.Then, the mounting head 62 makes corrections based on the holding position of the circuit board 47, the holding orientation of the components, etc., and mounts the held electronic components onto the circuit board. As a result, the electronic components are mounted in a state where they are bonded to the predetermined position on the circuit board with adhesive.

[0019] Thus, in the circuit board work machine 18a, the discharge head 60 discharges adhesive to a predetermined position on the circuit board, and in the circuit board work machine 18b, the mounting head 62 mounts electronic components on the adhesive. Therefore, it is desirable for the discharge head 60 to discharge the adhesive to the appropriate position. For this reason, it is necessary to ensure the discharge accuracy of the discharge head 60, and in order to calculate Cpk (abbreviation for Process Capability Index), the deviation of the discharge position of the adhesive discharged by the discharge head 60 from the reference and the discharge diameter are calculated by the control device 100.

[0020] Specifically, first, the circuit board 47 is transported to the work position by the circuit board handling machine 18a and held fixedly in the work position. Then, before adhesive is dispensed onto the circuit board 47, the mark camera 28a images the circuit board 47. When the circuit board 47 before adhesive is dispensed (hereinafter referred to as the "pre-dispensing board") is imaged, the dispensing head 60 dispenses adhesive at a predetermined position on the circuit board 47, i.e., the planned dispensing position. Then, the mark camera 28a images the circuit board after the adhesive has been dispensed (hereinafter referred to as the "post-dispensing board"). The mark camera 28 includes an imaging device 28A and a light source device (see Figure 3) 28B that can illuminate the object to be imaged with lighting of any of the three primary colors at the timing when the imaging device (see Figure 3) 28A takes an image. In other words, the Mark Camera 28 has a light source device 28B that can emit any color from red, blue, and green, and it is possible to capture an image of the subject with the imaging device 28A while illuminating it with light of any color.

[0021] Therefore, before the pre-ejection substrate and the post-ejection substrate are imaged, imaging conditions for red lighting, blue lighting, and green lighting are set as imaging conditions. In addition, since shutter speed can also be set as an imaging condition, an arbitrary shutter speed can be set along with the imaging conditions for any color of lighting. For example, imaging conditions for each of the three primary colors at shutter speed S1, imaging conditions for each of the three primary colors at shutter speed S2, and imaging conditions for each of the three primary colors at shutter speed S3, that is, nine (=3 x 3) types of imaging conditions are set. Then, according to each of these nine types of imaging conditions, the pre-ejection substrate and the post-ejection substrate are imaged by the mark camera 28a.

[0022] In this process, for example, the controller 102 compares the imaging data of the pre-extrusion substrate and the imaging data of the post-extrusion substrate, both captured according to imaging condition 1, to identify the brightness of the circuit board 47 and the brightness of the adhesive. Specifically, as shown in Figure 4, in image 110 based on the imaging data of the pre-extrusion substrate captured according to imaging condition 1, only the circuit board 47 is captured, while in image 120 based on the imaging data of the post-extrusion substrate captured according to imaging condition 1, both the circuit board 47 and the adhesive 122 extruded onto the circuit board 47 are captured. Therefore, the controller 102 calculates the brightness of each pixel based on the imaging data of the pre-extrusion substrate and identifies the calculated brightness as the brightness of the circuit board 47. The controller 102 also calculates the brightness of each pixel based on the imaging data of the post-extrusion substrate and extracts the brightness of each pixel based on the imaging data of the post-extrusion substrate that differs from the brightness of each pixel based on the imaging data of the pre-extrusion substrate. In this case, since the brightness of each extracted pixel is different from the brightness of the circuit board 47, the controller 102 identifies the extracted brightness as the brightness of the adhesive 122. By identifying the brightness of the circuit board 47 and the brightness of the adhesive 122 in this way, the controller 102 calculates the boundary line between the brightness of the circuit board 47 and the brightness of the adhesive 122 in the imaging data of the ejected substrate. In other words, the controller 102 calculates the outer edge of the adhesive 122 in the imaging data of the ejected substrate based on the difference between the brightness of the circuit board 47 and the brightness of the adhesive 122. In this way, the controller 102 calculates the outer edge of the adhesive 122 based on the imaging data of the pre-ejection substrate and the imaging data of the ejected substrate, which are imaged according to imaging condition 1. Furthermore, the controller 102 calculates the outer edge of the adhesive 122 in the above procedure based on the imaging data of the pre-ejection substrate and the imaging data of the ejected substrate, which are imaged according to each of the other imaging conditions different from imaging condition 1.

[0023] The controller 102 then calculates the outer edge of the adhesive 122 based on the imaging data under each of the nine imaging conditions, and displays an image of the circuit board 47 including the calculated outer edge of the adhesive 122 on a display device (not shown). In other words, the outer edge of the adhesive 122 dispensed onto the circuit board 47 is calculated based on the imaging data captured under each of the nine imaging conditions, and nine images of the circuit board 47 including the calculated outer edge of the adhesive 122 are displayed on the display device. The operator then selects any one of the displayed images. In this case, the operator selects, for example, the image that includes the most clearly marked outer edge of the adhesive 122. The controller 102 then sets the imaging conditions of the selected image as the optimal imaging conditions. This makes it possible to set the imaging conditions to the lighting color that best recognizes the outer edge of the adhesive among the three primary color lighting. It also makes it possible to set the imaging conditions to the shutter speed that best recognizes the outer edge of the adhesive among multiple shutter speeds.

[0024] Once the optimal imaging conditions are set, the mark camera 28 images the circuit board 47 both before and after ejection according to the optimal imaging conditions. Next, the controller 102 identifies the brightness of the circuit board 47 and the brightness of the adhesive 122 based on the imaging data of the circuit board 47 before ejection and the imaging data of the circuit board after ejection, and calculates the outer edge of the adhesive 122 using the procedure described above. Then, as shown in Figure 5, the controller 102 displays an image 132 of the circuit board including the calculated outer edge of the adhesive (hereinafter referred to as the "calculated outer edge") 130 on the display device. The operator checks the calculated outer edge 130 included in the displayed image 132 and determines whether the calculated outer edge 130 is appropriate. In other words, the operator compares the image 132 with the adhesive 122 ejected onto the circuit board 47 to determine whether the calculated outer edge 130 included in the image 132 is correctly marked. In this case, if the calculation outline 130 included in image 132 is correctly depicted, the operator inputs information indicating OK, for example, and the controller 102 stores the previously identified brightness of the circuit board 47 and the brightness of the adhesive 122 in the memory 108. On the other hand, if the calculation outline 130 included in image 132 is not correctly depicted, the operator inputs information indicating NG, for example. In this case, as shown in Figure 6, the operator inputs the outline 136 of the adhesive equivalent to the adhesive dispensed onto the circuit board 47 (hereinafter referred to as the "input outline") into image 132. The controller 102 then identifies the brightness inside the input outline 136 as the brightness of the adhesive 122 and the brightness outside the input outline 136 as the brightness of the circuit board 47, and stores the identified brightness of the circuit board 47 and the brightness of the adhesive 122 in the memory 108.

[0025] Next, the mark camera 28 images the pre-extrusion and post-extrusion substrates of a second circuit board 47 of the same type as the circuit board 47 described in 1 above. Subsequently, the controller 102 identifies the brightness of the circuit board 47 and the brightness of the adhesive 122 based on the image data of the pre-extrusion and post-extrusion substrates of the second circuit board 47, and calculates the calculation outline 130. The controller 102 then displays the image 132 of the circuit board, including the calculation outline 130, on the display device, and the operator inputs information indicating OK or NG. At this time, the brightness of the circuit board 47 and the brightness of the adhesive 122 corresponding to the input information are stored in the memory 108. In other words, when information indicating OK is input, the brightness of the circuit board 47 and the brightness of the adhesive 122 identified based on the image data are stored in the memory 108. Furthermore, if information indicating NG is input, the input outer edge 136 is input, the brightness inside the input outer edge 136 is stored in the memory 108 as the brightness of the adhesive 122, and the brightness outside the input outer edge 136 is stored in the memory 108 as the brightness of the circuit board 47.

[0026] This process is repeated until the Nth circuit board 47 is imaged both before and after ejection, and the brightness of the circuit board 47 and the brightness of the adhesive 122 are determined based on the Nth image data. Then, an image 132 of the circuit board, including the calculated outer edge 130 calculated based on the Nth image data, is displayed on the display device, and the operator inputs information indicating OK or NG. At this time, the brightness of the circuit board 47 and the brightness of the adhesive 122 corresponding to the input information are stored in the memory 108, so that the brightness of the circuit board 47 and the brightness of the adhesive 122 for N boards are stored in the memory 108.

[0027] In this way, once the brightness of N circuit boards 47 and the brightness of the adhesive 122 are stored in the memory 108, the mark camera 28 images only the post-extrusion circuit board for the N+1th circuit board, without imaging the pre-extrusion board. The controller 102 then uses the brightness of the circuit boards 47 and the brightness of the adhesive 122 stored in the memory 108 to calculate the calculated outer edge 130 in the image data of the post-extrusion board. The controller 102 then calculates the internal area of ​​the calculated outer edge 130. Then, with the internal area as S, the controller 102 calculates the radius r, assuming the shape of the extruded adhesive is a perfect circle, according to the following formula: S = πr ２ The controller 102 then calculates (2 × r) as the discharge diameter of the adhesive dispensed onto the circuit board 47.

[0028] Furthermore, the controller 102 estimates the shape of the calculated outer edge 130 by comparing the calculated outer edge of a perfect circle with radius r with the calculated outer edge 130. Specifically, as shown in Figure 7, the outer edge of a perfect circle with radius r (hereinafter referred to as "perfect circle outer edge") 138 and the calculated outer edge 130 are superimposed, and it is determined whether the agreement rate between the pixels inside the perfect circle outer edge 138 and the pixels inside the calculated outer edge 130 is a predetermined ratio, for example, 95% or more. If the agreement rate between the pixels inside the perfect circle outer edge 138 and the pixels inside the calculated outer edge 130 is a predetermined ratio or more, the controller 102 estimates that the calculated outer edge 130 is a perfect circle or approximately a perfect circle. At this time, the controller 102 calculates the center of the calculated outer edge 130 as the deviation from the reference position of the adhesive discharged onto the circuit board 47. The deviation from the reference point is, for example, a deviation from the imaging center or a deviation from a reference position within the image. For example, if a fiducial mark is marked on the circuit board 47, the amount of deviation relative to the fiducial mark when the mark camera 28 captures an image including the fiducial mark is calculated. In addition, the amount of deviation from a pre-assumed distance and position from a selected corner, using one of the four corners of the captured image as the reference point, is calculated. The controller 102 then stores in memory 108 the deviation of the calculated discharge position (hereinafter referred to as "calculated discharge position") from the reference point, the aforementioned planned discharge position, and the previously calculated adhesive discharge diameter, associating them.

[0029] Furthermore, for example, if the circular outer edge 138 and the calculation outer edge 130 have the shapes shown in Figure 8, the agreement rate between the pixels inside the circular outer edge 138 and the pixels inside the calculation outer edge 130 will be less than a predetermined ratio. In such cases, the circular outer edge 138 alternately enters and exits the inside and outside of the calculation outer edge 130. Since the inside of the calculation outer edge 130 is the brightness of the adhesive and the outside of the calculation outer edge 130 is the brightness of the circuit board, the brightness along the circular outer edge 138 alternates between the brightness of the adhesive and the brightness of the circuit board. At this time, the shape of the calculation outer edge 130 is estimated based on the frequency with which the brightness along the circular outer edge 138 alternates between the brightness of the adhesive and the brightness of the circuit board.

[0030] Specifically, for example, in the calculation outer edge 130 shown in Figure 8, the circular outer edge 138 protrudes in two places outside the calculation outer edge 130 and intrudes in two places inside the calculation outer edge 130. Therefore, in the calculation outer edge 130 shown in Figure 8, the brightness around the circular outer edge 138 changes four times due to the brightness of the circuit board and the brightness of the adhesive. When the brightness around the circular outer edge 138 changes four times due to the brightness of the circuit board and the brightness of the adhesive, the controller 102 estimates that the shape of the calculation outer edge 130 is generally elliptical. Then, the controller 102 identifies the major axis 150 and minor axis 152 of the calculation outer edge 130 which has been estimated to be elliptical, and calculates the intersection of the major axis 150 and the minor axis 152 as the deviation from the reference of the calculation ejection position. The controller 102 then stores in memory 108 the deviation from the reference for the calculated discharge position, the planned discharge position mentioned above, and the previously calculated discharge diameter of the adhesive, relating them together.

[0031] Furthermore, for example, in the calculation outer edge 130 with the shape shown in Figure 9, the agreement rate between the pixels inside the circular outer edge 138 and the pixels inside the calculation outer edge 130 is less than a predetermined ratio. Therefore, in the calculation outer edge 130, the shape of the calculation outer edge 130 is estimated based on the frequency at which the brightness along the circular outer edge 138 alternates between the brightness of the adhesive and the brightness of the circuit board. Specifically, in the calculation outer edge 130 shown in Figure 9, the circular outer edge 138 protrudes to the outside of the calculation outer edge 130 in six places and intrudes into the inside of the calculation outer edge 130 in six places. Therefore, in the calculation outer edge 130, the brightness around the circular outer edge 138 changes 12 times between the brightness of the circuit board and the brightness of the adhesive. In this way, when the brightness around the circular outer edge 138 changes 12 times between the brightness of the circuit board and the brightness of the adhesive, the controller 102 estimates that the shape of the calculation outer edge 130 is generally star-shaped. With a star-shaped calculation edge 130 like this, it is difficult to pinpoint the center point of the calculation edge 130, and therefore it is not possible to calculate the deviation of the calculation discharge position from the reference. For this reason, the controller 102 issues an error notification indicating that it is not possible to calculate the deviation of the discharge position and discharge diameter of the adhesive discharged onto the circuit board.

[0032] In this way, after the brightness of N circuit boards 47 and the brightness of the adhesive 122 have been stored in the memory 108, the (N+1)th circuit board is not imaged before ejection, but only the ejected board is imaged. Then, using the brightness of the circuit boards 47 and the brightness of the adhesive 122 stored in the memory 108, the deviation from the reference ejection position and the ejection diameter of the adhesive are calculated based on the image data of the ejected board. Similarly, for the (N+2)th and subsequent circuit boards, the brightness of the circuit boards 47 and the brightness of the adhesive 122 stored in the memory 108 are used to calculate the deviation from the reference ejection position and the ejection diameter of the adhesive based on the image data of the ejected board. In other words, pre-training of the brightness of the circuit boards 47 and the brightness of the adhesive 122 is performed for the 1st to Nth circuit boards. Then, for the N+1 and subsequent circuit boards, the brightness of the N circuit boards 47 and the brightness of the adhesive 122 stored in the memory 108 are used to calculate the deviation from the reference for the calculated ejection position and the ejection diameter of the adhesive based on the imaging data of the ejected board. This makes it possible to appropriately calculate the deviation from the reference for the calculated ejection position and the ejection diameter of the adhesive based on the imaging data of the ejected board.

[0033] In the above embodiment, the substrate processing machine 18 is an example of a substrate processing machine. The imaging device 28A is an example of an imaging device. The light source device 28B is an example of a light source device. The circuit board 47 is an example of a substrate. The control device 100 is an example of an information processing device. The memory 108 is an example of a memory. The adhesive 122 is an example of a liquid material.

[0034] In the embodiment described above, the following effects are achieved.

[0035] The mark camera 28a is an imaging device capable of imaging with any of the three primary colors, and it images the circuit board 47 after the adhesive 122 has been dispensed, i.e., the dispensed board. The controller 102 then calculates the deviation of the dispensed position of the adhesive 122 dispensed onto the circuit board 47 from the reference, i.e., the deviation from the reference of the calculated dispensed position, and the dispensed diameter, based on the imaging data of the dispensed board. In other words, the deviation from the reference of the calculated dispensed position and the dispensed diameter are calculated based on the imaging data of the dispensed board captured with any of the three primary colors, and the resolution, which is the length per pixel of the mark camera 28a, obtained from the controller 102. This makes it possible to set the lighting according to the color of the circuit board 47, the color of the adhesive 122, etc., as imaging conditions, and to appropriately calculate the deviation from the reference of the calculated dispensed position and the dispensed diameter.

[0036] Furthermore, the controller 102 identifies the brightness of the circuit board 47 and the brightness of the adhesive 122 based on the imaging data of the substrate before ejection and the imaging data of the substrate after ejection, and identifies the boundary line between the brightness of the circuit board 47 and the brightness of the adhesive 122 in the imaging data of the substrate after ejection, that is, the calculated outer edge 130 of the adhesive. In other words, the controller 102 identifies the calculated outer edge 130 of the adhesive in the imaging data of the substrate after ejection based on the difference between the brightness of the circuit board 47 and the brightness of the adhesive 122, and calculates the ejection diameter deviation from the reference with respect to the calculated ejection position based on that calculated outer edge 130. This makes it possible to clearly recognize the calculated outer edge 130 of the adhesive, and to appropriately calculate the deviation from the reference of the calculated ejection position and the ejection diameter.

[0037] Furthermore, the controller 102 calculates the discharge diameter of the adhesive dispensed onto the circuit board 47 based on the internal area of ​​the specified adhesive's calculation edge 130. This makes it possible to appropriately calculate the discharge diameter of the adhesive dispensed onto the circuit board 47 based on the imaging data.

[0038] Furthermore, the controller 102 estimates the shape of the calculated outer edge 130 based on the circular outer edge 138 of the discharge diameter calculated based on the internal area of ​​the calculated outer edge 130 of the adhesive. In this case, if the shape of the calculated outer edge 130 is estimated to be a perfect circle, a nearly perfect circle, or an ellipse, it becomes possible to appropriately calculate the position of the adhesive 122 discharged onto the circuit board 47, that is, the deviation from the reference of the calculated discharge position.

[0039] Furthermore, the mark camera 28a captures images of the pre-extrusion and post-extrusion substrates for each of the 1st to Nth circuit boards 47. The controller 102 then, as a pre-training step, identifies the brightness of the circuit board 47 and the brightness of the adhesive in the image data based on the image data of the pre-extrusion and post-extrusion substrates of each circuit board 47, and stores the identified brightness of the circuit board 47 and the brightness of the adhesive in the memory 108. This makes it possible to collect brightness data of the circuit board 47 and the adhesive from a large amount of image data as a pre-training step, allowing for appropriate calculation of the deviation from the reference ejection position and the ejection diameter.

[0040] Furthermore, the mark camera 28a does not image the circuit board 47 before ejection, but instead images the ejected board for the N+1th and subsequent boards. The controller 102 then uses the brightness of the circuit board 47 and the brightness of the adhesive stored in the memory 108, based on the image data of the ejected board, to calculate the deviation from the reference ejection position and the ejection diameter. This allows for the appropriate calculation of the deviation from the reference ejection position and the ejection diameter using the brightness of the circuit board 47 and the brightness of the adhesive from the large amount of image data collected as pre-training.

[0041] It should be noted that the present invention is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiments, both the deviation of the calculated ejection position from the reference and the ejection diameter are calculated based on the imaging data, but it is sufficient if at least one of the deviation of the calculated ejection position from the reference and the ejection diameter is calculated.

[0042] Furthermore, in the above embodiment, the circuit board is imaged using lighting of the three primary colors, that is, lighting of one of the three primary colors: red, blue, and green. On the other hand, the circuit board may also be imaged using lighting that simultaneously illuminates two or more of the three primary colors. For example, the circuit board may be imaged using purple lighting, which is achieved by simultaneously illuminating it with red and blue light.

[0043] Furthermore, although adhesive 122 is used as the liquid material in the above embodiment, various liquid materials can be used. For example, liquid materials used in mounted circuit boards such as adhesive 122, solder, flux, and underfill can be used.

[0044] 18: Circuit board processing machine (circuit board processing machine) 28A: Imaging device 28B: Light source device 47: Circuit board (circuit board) 100: Control device (information processing device) 108: Memory 122: Adhesive (liquid material)

Claims

1. An information processing device applied to a substrate work machine comprising: an imaging device capable of imaging a substrate from above; a light source device capable of illuminating the object to be imaged with lighting of any of the three primary colors at the timing of imaging by the imaging device; and a dispensing device for dispensing liquid onto the substrate, wherein the information processing device calculates at least one of the deviation of the dispensing position of the liquid dispensed onto the substrate from a reference and the dispensing diameter, based on imaging data of the substrate after the liquid has been dispensed, irradiated with at least one of the three primary colors, and imaging resolution which is the length of one pixel in the vertical and horizontal directions in the imaging data.

2. The information processing apparatus according to claim 1, wherein, from the imaging data, it calculates at least one of the deviation of the discharge position of the liquid material discharged onto the substrate from a reference and the discharge diameter, based on the difference between the brightness of the substrate and the brightness of the liquid material.

3. The information processing apparatus according to claim 2, wherein, when calculating the discharge diameter of the liquid material discharged onto the substrate, the outer edge of the liquid material is identified based on the difference between the brightness of the substrate and the brightness of the liquid material in the imaging data, and the discharge diameter of the liquid material discharged onto the substrate is calculated based on the internal area of ​​the identified outer edge of the liquid material.

4. The information processing apparatus according to claim 3, which estimates the shape of the liquid material dispensed onto the substrate based on the discharge diameter of the circle calculated based on the internal area and the outer edge of the liquid material identified based on the difference between the brightness of the substrate and the brightness of the liquid material in the imaging data.

5. An information processing apparatus according to any one of claims 1 to 4, wherein the apparatus identifies the brightness of the substrate and the brightness of the liquid in the imaging data based on imaging data of the substrate before the liquid is dispensed and imaging data of the substrate after the liquid is dispensed, and stores the identified brightness of the substrate and the brightness of the liquid in the imaging data in a memory.

6. The information processing apparatus according to claim 5, wherein, when the brightness of the substrate and the brightness of the liquid material in each of the plurality of imaging data are stored in the memory, the apparatus calculates at least one of the discharge position and discharge diameter of the liquid material discharged onto the substrate using the brightness of the substrate and the brightness of the liquid material stored in the memory, based on the imaging data of the substrate after the liquid material has been discharged.

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