Autonomous traveling maintenance device
The autonomous driving maintenance device addresses alignment challenges by using a positioning adjustment system with detection units to ensure precise connection with substrate processing modules, enhancing maintenance accuracy.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-11-17
- Publication Date
- 2026-06-04
AI Technical Summary
Existing autonomous driving maintenance devices face challenges in accurately aligning and connecting maintenance modules with substrate processing modules due to undulations in the road surface, leading to potential misalignment and connection issues.
An autonomous driving maintenance device equipped with a positioning adjustment unit, first and second detection units, and a control unit that adjusts the height and posture of the maintenance module based on detection results to ensure precise alignment and connection with substrate processing modules.
The device achieves accurate docking and maintenance by compensating for road surface undulations, ensuring proper alignment and maintaining maintenance accuracy.
Smart Images

Figure JP2025040084_04062026_PF_FP_ABST
Abstract
Description
Autonomous Driving Maintenance Device
[0001] The present disclosure relates to an autonomous driving maintenance device.
[0002] Patent Document 1 discloses a component replacement system for replacing consumable parts. Patent Document 1 discloses that the component replacement system includes a component storage device for storing consumable parts before use. Further, Patent Document 1 discloses that the component replacement system includes a component replacement device that is connected to a processing device and a component storage device and exchanges used consumable parts attached in the processing device with unused consumable parts stored in the component storage device. Patent Document 1 discloses that the component replacement device moves to the position of the processing device to which the consumable part to be replaced is attached and connects to the processing device.
[0003] Japanese Patent Application Laid-Open No. 2021-176173
[0004] The present disclosure provides a technique for stably operating an autonomous driving maintenance device for maintenance.
[0005] According to one aspect of the present disclosure, there is provided an autonomous driving maintenance device for maintaining a substrate processing module, including a maintenance module that can be connected to the substrate processing module, a frame, an autonomous mobile robot (AMR) attached to the frame, a positioning adjustment unit attached to the frame and configured to adjust the height and posture of the maintenance module, a first detection unit configured to detect a connection portion between the maintenance module in the substrate processing module, and a control unit configured to control the positioning adjustment unit based on an output of the first detection unit. The autonomous mobile robot includes a second detection unit configured to detect an obstacle during travel of the autonomous mobile robot, and an arm configured to move the second detection unit outside the frame during travel of the autonomous mobile robot and move the second detection unit inside the frame when the autonomous mobile robot stops.
[0006] This disclosure provides a technology for stably operating an autonomous maintenance device for maintenance purposes.
[0007] Figure 1 is a diagram illustrating an overview of a manufacturing system in which the transport device according to this embodiment is used. Figure 2 is a diagram illustrating an overview of a substrate processing device in a manufacturing system in which the transport device according to this embodiment is used. Figure 3 is a side view illustrating an overview of the transport device according to this embodiment. Figure 4 is a perspective view illustrating an overview of the transport device according to this embodiment. Figure 5 is a perspective view illustrating an overview of the transport device according to this embodiment. Figure 6 is a diagram illustrating an overview of the detection unit of the traveling unit when the transport device according to this embodiment is in use. Figure 7 is a diagram illustrating an overview of the detection unit of the traveling unit when the transport device according to this embodiment is not in use. Figure 8 is a flowchart illustrating the processing of the transport device according to this embodiment. Figure 9 is a diagram illustrating the operation of the transport device according to this embodiment. Figure 10 is a diagram illustrating the operation of the transport device according to this embodiment. Figure 11 is a diagram illustrating the operation of the transport device according to this embodiment. Figure 12 is a diagram illustrating the operation of the transport device according to this embodiment. Figure 13 is a diagram illustrating the alignment of the transport device according to this embodiment. Figure 14 is a diagram illustrating the alignment of the transport device according to this embodiment. Figure 15 is a diagram illustrating the alignment of the transport device according to this embodiment. Figure 16 is a diagram illustrating the alignment of the transport device according to this embodiment.
[0008] Hereinafter, embodiments for carrying out this disclosure will be described with reference to the drawings. In this specification and the drawings, substantially identical components are denoted by the same reference numerals to avoid redundant explanations. For ease of understanding, the scale of the parts in the drawings may differ from that of the actual parts. In directions such as parallel, right angles, orthogonal, horizontal, vertical, up and down, and left and right, deviations are permitted to the extent that they do not impair the effect of the embodiment. The shape of the corners is not limited to right angles and may be rounded. Parallel, right angles, orthogonal, horizontal, and vertical may include substantially parallel, substantially right angles, substantially orthogonal, substantially horizontal, and substantially vertical.
[0009] <Manufacturing System Using the Conveying Device According to This Embodiment> First, a manufacturing system using the conveying device according to this embodiment will be described. Figure 1 is a diagram illustrating the outline of manufacturing system 1, which is an example of a manufacturing system using the conveying device according to this embodiment. The conveying device according to this embodiment may sometimes be referred to as an autonomous driving maintenance device.
[0010] The manufacturing system 1 comprises a substrate processing subsystem 100, a transport device 200, a storage device 300, and a control device 400. The control device 400 controls the substrate processing subsystem 100, the transport device 200, and the storage device 300, respectively. The control device 400 communicates with the substrate processing subsystem 100, the transport device 200, and the storage device 300 wirelessly or via wired connection.
[0011] The substrate processing subsystem 100 includes a vacuum transport chamber 110 and substrate processing devices 121, 122, 123, 124, 125, and 126. The substrate processing subsystem 100 also includes load lock chambers 131 and 132 and an atmospheric pressure transport chamber 140. When it is not necessary to distinguish between substrate processing devices 121, 122, 123, 124, 125, and 126, they may be collectively referred to as the substrate processing device 120. Similarly, when it is not necessary to distinguish between load lock chambers 131 and 132, they may be collectively referred to as the load lock chamber 130.
[0012] The substrate processing subsystem 100 comprises a plurality of substrate processing devices 120, specifically six substrate processing devices 120. The substrate processing subsystem 100 is not limited to six; it may consist of one or two or more devices. The substrate processing subsystem 100 also comprises a plurality of load lock chambers 130, specifically two load lock chambers 130. The load lock chambers 130 in the substrate processing subsystem 100 are not limited to two; they may consist of one or three or more devices.
[0013] The vacuum transport chamber 110 is connected to each of the substrate processing devices 121, 122, 123, 124, 125, 126, load lock chamber 131, and load lock chamber 132.
[0014] The substrate processing subsystem 100 includes a robotic arm 115 in a vacuum transport chamber 110. The inside of the vacuum transport chamber 110 is maintained at a predetermined vacuum level. The robotic arm 115 removes the substrate W before processing from either the load lock chamber 131 or the load lock chamber 132, which has been reduced to a predetermined vacuum level. The robotic arm 115 then transports the removed substrate W into one of the multiple substrate processing devices 120. The robotic arm 115 also removes the processed substrate W from one of the multiple substrate processing devices 120. The robotic arm 115 then transports the removed substrate W to a different substrate processing device 120 than the one from which it was removed. The robotic arm 115 also transports the removed substrate W into either the load lock chamber 131 or the load lock chamber 132.
[0015] Each of the substrate processing devices 121, 122, 123, 124, 125, and 126 performs processes on the substrate W, such as etching or film deposition, under low-pressure conditions.
[0016] Each of the multiple substrate processing devices 120 may be a device that performs the same process in the manufacturing process, or it may be a device that performs different processes.
[0017] Each of the multiple substrate processing devices 120 is equipped with consumable parts that wear out depending on the processing performed on the substrate W. These consumable parts include, for example, edge rings and cover rings.
[0018] Each of the multiple substrate processing units 120 is equipped with a gate valve 120g that separates it from the vacuum transport chamber 110. Furthermore, each of the multiple substrate processing units 120 is equipped with a gate valve 120h for unloading used consumable parts and loading new consumable parts.
[0019] Each of the load lock chambers 131 and 132 is equipped with a gate valve 130g that separates it from the vacuum transport chamber 110. Each of the load lock chambers 131 and 132 is equipped with a gate valve 130h that separates it from the atmospheric pressure transport chamber 140.
[0020] Each of the load lock chambers 131 and 132 switches the internal pressure from a predetermined vacuum pressure to atmospheric pressure, or from atmospheric pressure to a predetermined vacuum pressure.
[0021] The substrate processing subsystem 100 includes a robotic arm 145 in an atmospheric pressure transport chamber 140. The atmospheric pressure transport chamber 140 is equipped with a plurality of load ports 141. Each of the plurality of load ports 141 is connected to a container (for example, a FOUP: Front Opening Unified Pod) capable of accommodating multiple substrates W before or after processing. The inside of the atmospheric pressure transport chamber 140 is at atmospheric pressure.
[0022] The robot arm 145 removes the substrate W before processing from the container connected to the load port 141 and transports it into the load lock chamber 131 or load lock chamber 132. The robot arm 145 also removes the processed substrate W from the load lock chamber 131 or load lock chamber 132 and transports it into the container connected to the load port 141.
[0023] The substrate processing subsystem 100 may include an alignment unit in the atmospheric pressure transport chamber 140 that adjusts the orientation of the substrate W removed from the container connected to the load port 141.
[0024] Below, an example of the configuration of a plasma processing apparatus is described as an example of a substrate processing apparatus 120. Figure 2 is a diagram illustrating an example of the configuration of a capacitively coupled plasma processing apparatus, which is an example of a substrate processing apparatus included in a manufacturing system using the transport device according to this embodiment. Note that the substrate processing apparatus may sometimes be referred to as a substrate processing module.
[0025] The plasma processing system includes a capacitively coupled plasma processing apparatus, a substrate processing apparatus 120, and a control unit 2. The capacitively coupled plasma processing apparatus, the substrate processing apparatus 120, includes a plasma processing chamber 10, a gas supply unit 20, a power supply system 30, and an exhaust system 40. The substrate processing apparatus 120 also includes a substrate support unit 11 and a gas introduction unit. The gas introduction unit is configured to introduce at least one processing gas into the plasma processing chamber 10. The gas introduction unit includes a shower head 13. The substrate support unit 11 is located inside the plasma processing chamber 10. The shower head 13 is located above the substrate support unit 11. In one embodiment, the shower head 13 constitutes at least a portion of the ceiling of the plasma processing chamber 10. The plasma processing chamber 10 has a plasma processing space 10s defined by the shower head 13, the side walls 10a of the plasma processing chamber 10, and the substrate support unit 11. The plasma processing chamber 10 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 10s, and at least one gas outlet for discharging gas from the plasma processing space. The plasma processing chamber 10 is grounded. The shower head 13 and the substrate support portion 11 are electrically insulated from the housing of the plasma processing chamber 10.
[0026] The substrate support portion 11 includes a main body portion 111 and a ring assembly 112. The main body portion 111 has a central region 111a for supporting the substrate W and an annular region 111b for supporting the ring assembly 112. A wafer is an example of a substrate W. The annular region 111b of the main body portion 111 surrounds the central region 111a of the main body portion 111 in a plan view. The substrate W is placed on the central region 111a of the main body portion 111, and the ring assembly 112 is placed on the annular region 111b of the main body portion 111 so as to surround the substrate W on the central region 111a of the main body portion 111. Therefore, the central region 111a is also called the substrate support surface for supporting the substrate W, and the annular region 111b is also called the ring support surface for supporting the ring assembly 112.
[0027] In one embodiment, the main body 111 includes a base 1110 and an electrostatic chuck 1111. The base 1110 includes a conductive member. The conductive member of the base 1110 can function as a lower electrode. The electrostatic chuck 1111 is placed on the base 1110. The electrostatic chuck 1111 includes a ceramic member 1111a and an electrostatic chuck electrode 1111b placed within the ceramic member 1111a. The electrostatic chuck electrode 1111b is also called a clamping electrode. In one embodiment, the electrostatic chuck electrode 1111b is electrically connected or coupled to a chuck power supply. The chuck power supply may be a DC power supply or an AC power supply. The ceramic member 1111a has a central region 111a. In one embodiment, the ceramic member 1111a also has an annular region 111b. Furthermore, other members surrounding the electrostatic chuck 1111, such as an annular electrostatic chuck or an annular insulating member, may have an annular region 111b. In this case, the ring assembly 112 may be placed on the annular electrostatic chuck or the annular insulating member, or it may be placed on both the electrostatic chuck 1111 and the annular insulating member. In addition, at least one bias electrode, which is electrically connected or coupled to the power supply 31 and / or power supply 32 described later, may be placed inside the ceramic member 1111a. In this case, at least one bias electrode functions as a lower electrode. Also, the conductive member of the base 1110 and the bias electrode inside the ceramic member 1111a may function as multiple lower electrodes. In one embodiment, the first voltage generation unit 32a, which functions as a voltage pulse generation unit described later, is electrically connected or coupled to the bias electrode inside the ceramic member 1111a, and the first RF generation unit 31a, described later, is electrically connected or coupled to the conductive member of the base 1110. Furthermore, the electrostatic chuck electrode 1111b may function as a lower electrode. Therefore, the substrate support portion 11 includes at least one lower electrode.
[0028] The ring assembly 112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one covering ring. The edge rings are formed of a conductive or insulating material, and the covering rings are formed of an insulating material.
[0029] The substrate support section 11 may also include a temperature control module configured to adjust at least one of the electrostatic chuck 1111, the ring assembly 112, and the substrate to a target temperature. The temperature control module may include a heater, a heat transfer medium, a flow path 1110a, or a combination thereof. A heat transfer fluid such as brine or gas flows through the flow path 1110a. In one embodiment, the flow path 1110a is formed within the base 1110, and one or more heaters are arranged within the ceramic member 1111a of the electrostatic chuck 1111. The substrate support section 11 may also include a heat transfer gas supply section configured to supply heat transfer gas to the gap between the back surface of the substrate W and the central region 111a.
[0030] The showerhead 13 is configured to introduce at least one processing gas from the gas supply unit 20 into the plasma processing space 10s. The showerhead 13 has at least one gas supply port 13a, at least one gas diffusion chamber 13b, and a plurality of gas inlet ports 13c. The processing gas supplied to the gas supply port 13a passes through the gas diffusion chamber 13b and is introduced into the plasma processing space 10s through the plurality of gas inlet ports 13c. The showerhead 13 also includes at least one upper electrode. In addition to the showerhead 13, the gas introduction unit may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the side wall 10a.
[0031] The gas supply unit 20 may include at least one gas source 21 and at least one flow controller 22. In one embodiment, the gas supply unit 20 is configured to supply at least one processing gas to the shower head 13 from a corresponding gas source 21 via a corresponding flow controller 22. Each flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may include one or more flow modulation devices that modulate or pulse the flow rate of at least one processing gas.
[0032] The power supply system 30 includes a power supply 31 that is electrically connected to or coupled to the plasma processing chamber 10. In one embodiment, the power supply 31 is electrically connected to or coupled to the plasma processing chamber 10 via at least one impedance matcher. The impedance matcher may be a mechanically controlled matcher or an electronically controlled matcher. The power supply 31 is configured to supply at least one RF (Radio Frequency) signal (RF power) to at least one lower electrode and / or at least one upper electrode. This generates plasma from at least one processing gas supplied to the plasma processing space 10s. Therefore, the power supply 31 can function as at least part of a plasma generation unit configured to generate plasma from one or more processing gases in the plasma processing chamber 10. In addition, by supplying a bias RF signal to at least one lower electrode, a bias potential is generated on the substrate W, and ionic components in the formed plasma can be drawn into the substrate W.
[0033] The power supply 31 includes a first RF generation unit 31a and a second RF generation unit 31b. The first RF generation unit 31a is electrically connected or coupled to at least one lower electrode and / or at least one upper electrode and is configured to generate a source RF signal (source RF power) to generate plasma in the plasma processing space 10s. In one embodiment, the first RF generation unit 31a is electrically connected or coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matcher. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generation unit 31a may be configured to generate a plurality of source RF signals having different frequencies. One or more generated source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.
[0034] The second RF generation unit 31b is electrically connected to or coupled to at least one lower electrode and is configured to generate a bias RF signal (bias RF power). In one embodiment, the second RF generation unit 31b is electrically connected to or coupled to at least one lower electrode via at least one impedance matcher. When the first RF generation unit 31a is electrically connected to or coupled to a lower electrode, the second RF generation unit 31b may be electrically connected to or coupled to the same lower electrode, or it may be electrically connected to or coupled to a different lower electrode. The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generation unit 31b may be configured to generate a plurality of bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.
[0035] The power supply system 30 may also include a power supply 32 that is electrically connected to or coupled to the plasma processing chamber 10. The power supply 32 includes a first voltage generation unit 32a and a second voltage generation unit 32b. In one embodiment, the first voltage generation unit 32a is electrically connected to or coupled to at least one lower electrode and is configured to generate a first voltage signal. The generated first voltage signal is applied to at least one lower electrode. In one embodiment, the second voltage generation unit 32b is electrically connected to or coupled to at least one upper electrode and is configured to generate a second voltage signal. The generated second voltage signal is applied to at least one upper electrode.
[0036] In various embodiments, the first and / or second voltage signals may be pulsed. In this case, the first voltage generation unit 32a and / or the second voltage generation unit 32b function as voltage pulse generation units configured to generate a sequence of voltage pulses. Thus, the sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. In one embodiment, the sequence of voltage pulses has a plurality of cycles, each cycle including a burst of voltage pulses in a first period and a constant reference voltage in a second period. That is, in the sequence of voltage pulses, the burst of voltage pulses is repeated. The absolute value of the voltage level of the voltage pulse is greater than the absolute value of the voltage level of the reference voltage. The voltage pulse may have an arbitrary waveform having a rectangle, trapezoid, triangle, or a combination thereof, and the arbitrary waveform may change over time. The voltage pulse may have positive polarity or negative polarity. The sequence of voltage pulses may also include one or more positive voltage pulses and one or more negative voltage pulses within one cycle. The first voltage generation unit 32a and the second voltage generation unit 32b may be provided in addition to the power supply 31, and the first voltage generation unit 32a may be provided in place of the second RF generation unit 31b.
[0037] The exhaust system 40 may be connected to, for example, a gas outlet 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure regulating valve regulates the pressure in the plasma processing space 10s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.
[0038] The substrate processing apparatus 120 includes gate valves 120h and 120g.
[0039] The control unit 2 processes computer-executable instructions that cause the substrate processing apparatus 120 to perform the various processes described herein. The control unit 2 may be configured to control the elements of the substrate processing apparatus 120 to perform the various processes described herein. In one embodiment, part or all of the control unit 2 may be included in the substrate processing apparatus 120. The control unit 2 is implemented, for example, by a computer 2a. The control unit 2 may include a processing unit 2a1, a storage unit 2a2, and a communication interface 2a3. The functions realized by the processing unit 2a1 described herein may be implemented in a circuit or processing circuit, including a general-purpose processor, an application-specific processor, integrated circuits, ASICs (Application Specific Integrated Circuits), a CPU (Central Processing Unit), a conventional circuit, and / or a combination thereof, programmed to realize the described functions. The processor is considered to be a circuit or processing circuit, including transistors and other circuits. The processor may be a programmed processor that executes a program stored in the storage unit 2a2. This program may be pre-stored in the storage unit 2a2 or retrieved via a medium when needed. The acquired program is stored in the storage unit 2a2 and read from the storage unit 2a2 and executed by the processing unit 2a1. The storage medium may be various storage media readable by the computer 2a, or it may be a communication line connected to the communication interface 2a3. The storage unit 2a2 may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface 2a3 may communicate with the substrate processing device 120 via a communication line such as a LAN (Local Area Network).In this disclosure, circuits, units, and means are hardware programmed to perform or configured to perform the functions described. Such hardware may be any hardware described in this disclosure, or any hardware known to be programmed to perform or execute the functions described. If such hardware is a processor that is considered to be a type of circuit, such circuit, means, or unit is a combination of hardware and software used to constitute such hardware and / or processor.
[0040] The transport device 200 docks from the aisle side to perform maintenance on process modules in semiconductor manufacturing equipment. The transport device 200 includes a robotic arm for replacing consumable parts and a moving mechanism. The transport device 200 moves in response to instructions from the control device 400. For example, the transport device 200 moves from the storage device 300 to the substrate processing device 120 which has consumable parts that need to be replaced. Then, the transport device 200 connects to the substrate processing device 120 which it has moved to.
[0041] The storage device 300 stores multiple unused consumable parts, jigs, etc. The transport device 200 transports the consumable parts, jigs, etc. from the storage device 300.
[0042] The transport device according to this embodiment will now be described. The transport device according to this embodiment includes a maintenance module connected to a process module that performs substrate processing, a lifting unit that raises and lowers the maintenance module, and a first detection unit that detects the connection portion to which the maintenance module is connected in the process module. The transport device according to this embodiment also includes a frame that holds the maintenance module, the lifting unit, and the first detection unit, and is formed by a frame, a traveling unit that moves the frame and is provided inside the frame, and a control unit that controls the lifting unit based on the detection result of the first detection unit. The traveling unit of the transport device according to this embodiment includes an arm and a second detection unit attached to the tip of the arm. In the transport device according to this embodiment, the second detection unit is located outside the frame when in use, and is housed inside the frame when not in use.
[0043] The transport device according to this embodiment will be described as an autonomous driving maintenance device according to this embodiment from another perspective. The autonomous driving maintenance device according to this embodiment is an autonomous driving maintenance device for maintaining a substrate processing module. The autonomous driving maintenance device according to this embodiment includes a maintenance module that can be connected to the substrate processing module, a frame, an autonomous driving transport robot attached to the frame, a positioning adjustment unit, a first detection unit, and a control unit. The positioning adjustment unit included in the autonomous driving maintenance device according to this embodiment is attached to the frame and is configured to adjust the height and posture of the maintenance module. The first detection unit included in the autonomous driving maintenance device according to this embodiment is configured to detect the connection portion with the maintenance module in the substrate processing module. The control unit included in the autonomous driving maintenance device according to this embodiment is configured to control the positioning adjustment unit based on the output of the first detection unit. Further, the autonomous driving transport robot included in the autonomous driving maintenance device according to this embodiment includes a second detection unit configured to detect an obstacle during the travel of the autonomous driving transport robot, and an arm. The arm in the autonomous driving transport robot included in the autonomous driving maintenance device according to this embodiment is configured to move the second detection unit to the outside of the frame during the travel of the autonomous driving transport robot and to move the second detection unit to the inside of the frame when the autonomous driving transport robot stops.
[0044] For example, due to undulations on the road surface where the transport device moves, the height and angle of the maintenance module in the transport device may deviate significantly from the process module. If the maintenance module in the transport device is connected in a state where the height and angle deviate significantly from the process module, the alignment pin may be inserted obliquely into the hole and get stuck, resulting in a situation where connection is impossible. Also, if the height and angle of the maintenance module in the transport device deviate significantly from the process module, the maintenance accuracy due to errors may deteriorate.
[0045] According to the transport device (autonomous maintenance device) according to this embodiment, when connecting to the process module, the position can be adjusted by the sensor for position detection, and accurate docking can be achieved. Further, according to the transport device (autonomous maintenance device) according to this embodiment, the maintenance module can be adjusted in height or angle with respect to the process module regardless of the road surface undulation.
[0046] Details of the transport device (autonomous maintenance device) according to this embodiment will be described using the transport device 200. FIG. 3 is a side view for explaining the outline of the transport device 200 which is an example of the transport device according to this embodiment. Each of FIGS. 4 and 5 is a perspective view for explaining the outline of the transport device 200 which is an example of the transport device according to this embodiment. FIG. 5 is a perspective view seen from a direction different from that of FIG. 4.
[0047] The transport device 200 includes a maintenance module 210, a plurality of lifting parts 220, a detection part 230, a gantry part 240, a traveling part 250, and a control part 260.
[0048] The maintenance module 210 is connected to the substrate processing apparatus 120 (process module) that performs substrate processing. The maintenance module 210 includes a chamber that can be depressurized to a predetermined pressure. The maintenance module 210 includes a robot arm for transporting the maintenance module inside the chamber. The maintenance module 210 holds new consumable parts for replacement and used consumable parts after replacement inside the chamber. The maintenance module 210 includes a gate valve 210g for opening and closing the chamber. When the maintenance module 210 is connected to the substrate processing apparatus 120, the gate valve 210g opens. Then, the maintenance module 210, for example, carries out the used consumable parts in the substrate processing apparatus 120 and carries new consumable parts into the substrate processing apparatus 120. The maintenance module 210 is an example of a maintenance module.
[0049] Multiple lifting units 220 raise and lower the maintenance module 210. The conveying device 200 includes, for example, lifting units 221, 222, 223, and 224 as lifting units 220. The lifting units 220 are, for example, air cylinders or electric cylinders. By having multiple lifting units 220 in the conveying device 200, the height of the maintenance module 210 can be adjusted, as well as the orientation of the maintenance module 210. Note that the number of lifting units 220 is not limited to four, but can be selected as appropriate. Multiple lifting units 220 are an example of a positioning adjustment unit, and each of the multiple lifting units 220 is an example of a lifting unit. In other words, the conveying device 200 includes multiple lifting units.
[0050] The maintenance module 210 is connected to the lifting section 220 by a floating mechanism 220m. In other words, the transport device 200 has multiple floating mechanisms. For example, the maintenance module 210 is connected to the lifting section 221 by a floating mechanism 221m. The maintenance module 210 is also connected to the lifting section 222 by a floating mechanism 222m. Furthermore, the maintenance module 210 is connected to the lifting section 223 by a floating mechanism 223m. And furthermore, the maintenance module 210 is connected to the lifting section 224 by a floating mechanism 224m.
[0051] The floating mechanism 220m is, for example, a ball joint. According to the transport device (autonomous driving maintenance device) of this embodiment, the presence of the floating mechanism increases the degree of freedom, allowing not only lifting and lowering but also angle adjustment of the connection part.
[0052] The detection unit 230 detects the positional relationship between the maintenance module 210 and the substrate processing device 120 to which the maintenance module 210 is connected. The detection unit 230 includes at least one selected from the group consisting of a camera (image sensor), a distance sensor, a force sensor, and a gyro sensor.
[0053] The detection unit 230 is, for example, a camera (image sensor). The camera (image sensor) captures an image of the substrate processing apparatus 120 to be connected, thereby detecting the positional relationship. The transport device 200 may acquire an image using the camera (image sensor), for example, detect a mark attached to the object, and control a plurality of lifting units 220 so that the detected mark is in a predetermined positional relationship.
[0054] The detection unit 230 may be, for example, a distance sensor. The positional relationship is detected by measuring the distance to the substrate processing apparatus 120 to be connected using the distance sensor. The distance sensor may be, for example, a laser distance meter. The transport device 200 may, for example, use multiple distance sensors to measure the distance between the connection surfaces of the substrate processing apparatus 120 (process module) to be connected, and control the device so that the measured distances have a predetermined relationship.
[0055] The detection unit 230 may be, for example, a gyro sensor. The positional relationship is detected by detecting the attitude of the maintenance module 210 using the gyro sensor.
[0056] The detection unit 230 may be, for example, a force sensor. The force sensor detects the force applied when the substrate processing device 120 (process module) and the maintenance module 210 are connected, thereby detecting their positional relationship. For example, a pin may be provided on one of the substrate processing device 120 (process module) and the maintenance module 210, and inserted into a positioning hole provided on the other. If the position or angle between the pin and the positioning hole is misaligned, force will be applied to the pin when connecting the substrate processing device 120 (process module) and the maintenance module 210. Therefore, the positional relationship between the substrate processing device 120 (process module) and the maintenance module 210 can be adjusted by adjusting the height of the maintenance module 210 so that the force applied to the pin during connection is kept below a certain level.
[0057] The detection unit 230 is an example of a first detection unit.
[0058] The support base 240 is formed by a frame. The support base 240 holds the lifting unit 220. By holding the lifting unit 220, the support base 240 also holds the maintenance module 210 to which the lifting unit 220 is connected and the detection unit 230 attached to the maintenance module 210.
[0059] The support structure 240 is an example of a frame.
[0060] The traveling unit 250 moves the base unit 240. The traveling unit 250 is a so-called autonomous mobile robot (AMR). The traveling unit 250 is installed inside the frame of the base unit 240. More specifically, in a top view, the traveling unit 250 is installed inside the frame of the base unit 240. The traveling unit 250 is fixed to the base unit 240. Therefore, when the traveling unit 250 moves, the base unit 240 also moves. As the base unit 240 moves, the entire transport device 200 moves.
[0061] The detection unit attached to the travel unit 250 will now be described. Figure 6 is a diagram illustrating the outline of the detection unit 251 of the travel unit 250 when the transport device 200, an example of the transport device according to this embodiment, is in use. Figure 7 is a diagram illustrating the outline of the detection unit of the travel unit when the transport device 200, an example of the transport device according to this embodiment, is not in use.
[0062] The driving unit 250 is equipped with a detection unit 251. The detection unit 251 is, for example, a distance sensor, a bumper sensor, or an emergency stop button. The detection unit 251 is provided at the tip of each arm portion 251a and arm portion 251b. As shown in Figure 6, when in use, the detection unit 251 is positioned outside the frame of the base portion 240 as the arms 251a and arm portion 251b extend. Also, as shown in Figure 7, when not in use, the detection unit 251 is positioned inside the frame of the base portion 240 as the arms 251a and arm portion 251b retract.
[0063] The arm portion 251a and the arm portion 251b are examples of arms, and the detection unit 251 is an example of a second detection unit configured to detect obstacles during travel.
[0064] The control unit 260 acquires the detection result from the detection unit 230. The control unit 260 also controls each of the multiple lifting units 220. Based on the result detected by the detection unit 230, the control unit 260 controls the lifting units 220 so that the maintenance module 210 is correctly connected to the substrate processing device 120. Specifically, the control unit 260 controls the lifting units 220 so that the maintenance module 210 is connected in the correct position and orientation.
[0065] The control unit 260 controls the travel unit 250 to move to the vicinity of the substrate processing device 120 (process module) to be connected, for example. The control unit 260 then activates the detection unit 230 to start searching for the substrate processing device 120 (process module) to be connected. Based on the measurement results from the detection unit 230, the control unit 260 controls the travel unit 250 so that the maintenance module 210 is oriented appropriately relative to the substrate processing device 120 (process module) to be connected. The control unit 260 also controls the lifting unit 220 so that the maintenance module 210 is at an appropriate height relative to the substrate processing device 120 (process module) to be connected, based on the measurement results from the detection unit 230. Finally, while monitoring the measurement results from the detection unit 230, the control unit 260 controls the travel unit 250 to connect the maintenance module 210 to the substrate processing device 120 (process module) to be connected.
[0066] Alternatively, for example, the transport device 200 may be configured to include a maintenance module 210 on a horizontally moving stage (horizontally moving table). When the maintenance module 210 is located on a horizontally moving stage (horizontally moving table), the control unit 260 controls the travel unit 250 to move, for example, to near the substrate processing device 120 (process module) to be connected. The control unit 260 then activates the detection unit 230 to begin searching for the substrate processing device 120 (process module) to be connected. Based on the measurement results from the detection unit 230, the control unit 260 controls the travel unit 250 so that the maintenance module 210 is oriented appropriately relative to the substrate processing device 120 (process module) to be connected. The control unit 260 also controls the lifting unit 220 so that the maintenance module 210 is at an appropriate height relative to the substrate processing device 120 (process module) to be connected, based on the measurement results from the detection unit 230. The control unit 260 then monitors the measurement results from the detection unit 230 and controls the stage (horizontal moving table) to connect the maintenance module 210 to the substrate processing device 120 (process module) to be connected.
[0067] Details of the control of the control unit 260 will now be described. Figure 8 is a flowchart illustrating the processing of a transport device 200, which is an example of a transport device according to this embodiment. Figures 9 to 12 are diagrams illustrating the operation of a transport device 200, which is an example of a transport device according to this embodiment.
[0068] (Step S10) First, the control unit 260 moves the transport device 200 (the process of moving the transport device). The control unit 260 controls the travel unit 250 to move the transport device 200 close to the substrate processing device 120 to be connected. Figure 9 shows the state in which the transport device 200 has been moved close to the substrate processing device 120 to be connected. As shown in Figure 9, for example, the ground GN may not be flat but undulating. As shown in Figure 9, for example, suppose that the gate valve 210g in the transport device 200 and the gate valve 120h in the substrate processing device 120 are separated by a distance d in the height direction. If the distance d is large, the transport device 200 and the substrate processing device 120 may not be able to be properly connected.
[0069] (Step S20) Next, the detection unit 230 is activated and the target search is started (the step of activating the detection unit and starting the target search). The control unit 260 activates the detection unit 230. Then, the control unit 260 starts searching for the position of the gate valve 120h provided in the substrate processing apparatus 120 to be connected (target search).
[0070] (Step S30) Next, the traveling unit 250 is rotated and moved horizontally to change the direction of the tires (step of rotating and moving the traveling unit horizontally to change the direction of the tires). The control unit 260 rotates and moves the traveling unit 250 horizontally to change the direction of the tires so that the transport device 200 can move toward the substrate processing device 120 to be connected. Figure 10 shows the traveling unit 250 rotated to change the direction of the tires.
[0071] (Step S40) Next, while sensing with the detection unit 230, the maintenance module 210 is raised by the lifting unit 220 so that the heights of the gate valve 210g and the gate valve 120h are aligned (a process of raising the maintenance module 210 to a desired height by the lifting unit while sensing). Figure 11 shows the maintenance module 210 being raised and lowered along arrow A by the lifting unit 220. The control unit 260 uses the detection result from the detection unit 230 to control the lifting unit 220 so that the heights of the gate valve 210g and the gate valve 120h are aligned.
[0072] (Step S50) Next, while sensing with the detection unit 230, the travel unit 250 moves the transport device 200 traversely and docks it with the substrate processing device 120 to be connected (a process in which the transport device is moved traversely by the travel unit and docked while sensing). Figure 12 shows how the travel unit 250 moves the maintenance module 210 traversely along arrow B and docks the transport device 200 with the substrate processing device 120 to be connected. The control unit 260 uses the detection result from the detection unit 230 to control the travel unit 250 so that the orientation of the gate valve 210g and the gate valve 120h is aligned.
[0073] The above process connects the transport device 200 to the substrate processing device 120 to be connected.
[0074] Next, we will explain detection by the detection unit. First, we will explain the alignment when a camera (image sensor) is used as the detection unit. Figures 13 and 14 are diagrams illustrating the alignment of the transport device according to this embodiment.
[0075] In Figures 13 and 14, TGT indicates the target to be connected, for example, the gate valve 120h of the substrate processing apparatus 120. MK1 and MK2 indicate alignment marks attached to the target TGT. CAM1 indicates the area to be imaged by the first camera. CAM2 indicates the area to be imaged by the second camera.
[0076] Figure 13 shows an example of the state before alignment, and Figure 14 shows an example of the state after alignment.
[0077] As shown in Figure 13, before alignment, the alignment mark MK1 is offset from the center of region CAM1. Also, before alignment, the alignment mark MK2 is offset from the center of region CAM2.
[0078] For example, the control unit 260 uses image recognition technology to control the lifting unit 220 and the travel unit 250 so that the alignment mark MK1 is at the center of the region CAM1. The control unit 260 also uses image recognition technology to control the lifting unit 220 and the travel unit 250 so that the alignment mark MK1 is aligned with the vertical and horizontal directions within the region CAM1. As shown in Figure 14, the control unit 260 adjusts the position and orientation of the alignment mark MK1 to the desired position and orientation, thereby enabling alignment with the target TGT.
[0079] Furthermore, for example, the control unit 260 uses image recognition technology to control the lifting unit 220 and the traveling unit 250 so that the alignment mark MK1 becomes the center of region CAM1 and the alignment mark MK2 becomes the center of region CAM2. As shown in Figure 14, the control unit 260 can align with the target TGT by adjusting the positions of the alignment mark MK1 and the alignment mark MK2 to desired positions.
[0080] In the above example, regions CAM1 and CAM2 were centered, but the alignment position may be changed as appropriate. The same applies to the orientation. Furthermore, the alignment marks may be changed as appropriate, not limited to the examples in Figures 13 and 14.
[0081] Next, we will explain the alignment process when a distance sensor is used as the detection unit. Figures 15 and 16 are diagrams illustrating the alignment of the transport device according to this embodiment.
[0082] In Figures 15 and 16, TGT represents the target to be connected, for example, the gate valve 120h provided by the substrate processing apparatus 120. LM1 is an example of a detection unit 230, which is a first laser distance meter, and LM2 is an example of a detection unit 230, which is a second laser distance meter. L1 represents the path of the laser irradiated by the first laser distance meter LM1, and L2 represents the path of the laser irradiated by the second laser distance meter LM2. y1 represents the distance from the docking surface 200s on the transport device 200 to the docking surfaces TGTs on the target TGT, as measured by the first laser distance meter LM1. y2 represents the distance from the docking surface 200s on the transport device 200 to the docking surfaces TGTs on the target TGT, as measured by the second laser distance meter LM2.
[0083] Figure 15 shows an example of the state before alignment, and Figure 16 shows an example of the state after alignment.
[0084] As shown in Figure 15, distances y1 and y2 are different before alignment. Therefore, before alignment, the docking surface 200s and the docking surface TGTs are not parallel, and the docking surface TGTs is tilted relative to the docking surface 200s.
[0085] For example, the control unit 260 controls the lifting unit 220 so that distance y1 and distance y2 are equal. As shown in Figure 16, the control unit 260 can make the docking surface 200s and the docking surface TGTs parallel by adjusting so that distance y1 and distance y2 are equal.
[0086] The transport device (autonomous driving maintenance device) according to this embodiment can adjust the height and angle between the process module and the maintenance module. According to the transport device (autonomous driving maintenance device) according to this embodiment, even if the position of the transport device is misaligned with that of the process module due to undulations in the road surface on which the transport device is moving, the misalignment can be adjusted. Furthermore, according to the transport device (autonomous driving maintenance device) according to this embodiment, the floating mechanism increases the degree of mechanical freedom during connection, and angle adjustment can be made during connection. Moreover, according to the transport device (autonomous driving maintenance device) according to this embodiment, the first detection unit can detect the position of the process module during connection, align the position, and enable a highly accurate connection.
[0087] Furthermore, according to the transport device (autonomous driving maintenance device) of this embodiment, the driving unit comprises an arm and a second detection unit attached to the tip of the arm. When in use, the second detection unit is positioned outside the frame, and when not in use, the second detection unit is housed inside the frame, thereby enabling safe driving.
[0088] For example, the frame of the mounting base may create a blind spot in the second detection unit of the mobile unit (sensors (e.g., camera (image sensor), distance sensor, LiDAR)). If a blind spot occurs in the second detection unit of the mobile unit, collisions with people or obstacles, entrapment, confinement, and tipping may occur. In addition, if a blind spot occurs in the second detection unit of the mobile unit, self-position estimation may become impossible.
[0089] Furthermore, the frame of the mounting base prevents the use of bumper sensors, which may lead to collisions with people or obstacles, entrapment, locking, or tipping over. In addition, the frame of the mounting base makes it difficult to press emergency stop buttons and other buttons, which may also lead to collisions with people or obstacles, entrapment, locking, or tipping over.
[0090] According to the transport device (autonomous driving maintenance device) of this embodiment, the influence of the frame on the second detection unit can be suppressed during use by positioning the second detection unit outside the frame during use. Furthermore, for example, the transport device (autonomous driving maintenance device) of this embodiment may position the second detection unit outside the frame during use by extending the arm. In addition, for example, the transport device (autonomous driving maintenance device) of this embodiment may have multiple second detection units and prioritize the use of the second detection unit that is least affected by the frame. Furthermore, for example, the transport device (autonomous driving maintenance device) of this embodiment may have the second detection unit positioned in the building or device. The transport device (autonomous driving maintenance device) of this embodiment may acquire measurement data from the second detection unit positioned in the building or device, for example, by wireless communication. Furthermore, for example, the transport device (autonomous driving maintenance device) of this embodiment may be equipped with a downward-facing second detection unit for hole confirmation as a countermeasure against grating openings characteristic of clean rooms.
[0091] The embodiments disclosed above include, for example, the following aspects:
[0092] [Note 1] An autonomous mobile maintenance device for maintaining a circuit board processing module, comprising: a maintenance module connectable to the circuit board processing module; a frame; an autonomous mobile robot (AMR) attached to the frame; a positioning adjustment unit attached to the frame and configured to adjust the height and orientation of the maintenance module; a first detection unit configured to detect the connection portion between the circuit board processing module and the maintenance module; and a control unit configured to control the positioning adjustment unit based on the output of the first detection unit, wherein the autonomous mobile robot includes a second detection unit configured to detect obstacles when the autonomous mobile robot is traveling, and an arm configured to move the second detection unit to the outside of the frame when the autonomous mobile robot is traveling and to move the second detection unit to the inside of the frame when the autonomous mobile robot is stopped.
[0093] [Note 2] The autonomous driving maintenance device according to Note 1, wherein the positioning adjustment unit includes a plurality of lifting units configured to raise and lower the maintenance module.
[0094] [Note 3] The autonomous driving maintenance device as described in Note 2, wherein each of the plurality of lifting units includes an air cylinder or an electric cylinder.
[0095] [Appendix 4] The autonomous driving maintenance device according to either Appendix 2 or Appendix 3, further comprising a plurality of floating mechanisms connected between the maintenance module and the plurality of lifting units.
[0096] [Note 5] The autonomous driving maintenance device described in Note 4, wherein each of the plurality of floating mechanisms includes a ball joint.
[0097] [Note 6] The autonomous driving maintenance device according to any one of Notes 1 to 5, wherein the positioning adjustment unit includes a horizontal moving table configured to move the maintenance module horizontally, and a lifting unit configured to raise and lower the horizontal moving table.
[0098] [Note 7] The autonomous driving maintenance device according to any one of Notes 1 to 6, wherein the first detection unit is selected from the group consisting of an image sensor, a distance sensor, a force sensor, a gyro sensor, and combinations thereof.
[0099] [Note 8] An autonomous driving maintenance device for maintaining a circuit board processing module, comprising: a maintenance module connectable to the circuit board processing module; a frame; an autonomous mobile robot (AMR) attached to the frame; a positioning adjustment unit attached to the frame and configured to adjust the height and orientation of the maintenance module; a first detection unit configured to detect the connection portion between the circuit board processing module and the maintenance module; and a control unit configured to control the positioning adjustment unit based on the output of the first detection unit.
[0100] [Note 9] The autonomous driving maintenance device according to Note 8, wherein the positioning adjustment unit includes a plurality of lifting units configured to raise and lower the maintenance module.
[0101] [Note 10] The autonomous driving maintenance device according to Note 9, wherein each of the plurality of lifting units includes an air cylinder or an electric cylinder.
[0102] [Note 11] The autonomous driving maintenance device according to either Note 9 or Note 10, further comprising a plurality of floating mechanisms connected between the maintenance module and the plurality of lifting units.
[0103] [Note 12] The autonomous driving maintenance device according to Note 11, wherein each of the plurality of floating mechanisms includes a ball joint.
[0104] [Note 13] The autonomous driving maintenance device according to any one of Notes 8 to 12, wherein the positioning adjustment unit includes a horizontal moving table configured to move the maintenance module horizontally, and a lifting unit configured to raise and lower the horizontal moving table.
[0105] [Note 14] The first detection unit is an autonomous driving maintenance device according to any one of Notes 8 to 13, including an image sensor.
[0106] [Note 15] The first detection unit is an autonomous driving maintenance device according to any one of Notes 8 to 13, including a distance sensor.
[0107] [Note 16] The first detection unit is an autonomous driving maintenance device according to any one of Notes 8 to 13, including a force sensor.
[0108] [Note 17] The first detection unit is an autonomous driving maintenance device according to any one of Notes 8 to 13, including a gyro sensor.
[0109] [Note 18] An autonomous mobile maintenance device for maintaining a circuit board processing module, comprising: a maintenance module connectable to the circuit board processing module; a frame supporting the maintenance module; and an autonomous mobile robot (AMR) attached to the frame, wherein the autonomous mobile robot includes a detection unit configured to detect obstacles when the autonomous mobile robot is in motion, and an arm configured to move the detection unit to the outside of the frame when the autonomous mobile robot is in motion and to move the detection unit to the inside of the frame when the autonomous mobile robot is stopped.
[0110] [Note 19] The detection unit is selected from the group consisting of a distance sensor, a bumper sensor, a button, and combinations thereof, as described in Note 18.
[0111] Furthermore, the embodiments disclosed above also include, for example, the following embodiments.
[0112] [Note 1] A transport device comprising: a maintenance module connected to a process module that performs substrate processing; a lifting unit for raising and lowering the maintenance module; a first detection unit for detecting the connection portion to which the maintenance module is connected in the process module; a frame for holding the maintenance module, the lifting unit, and the first detection unit, and formed by a frame; a traveling unit for moving the frame and provided inside the frame; and a control unit for controlling the lifting unit based on the detection result of the first detection unit, wherein the traveling unit comprises an arm and a second detection unit attached to the tip of the arm, and when in use, the second detection unit is positioned outside the frame, and when not in use, the second detection unit is housed inside the frame.
[0113] [Note 2] A transport device comprising: a maintenance module connected to a process module that performs substrate processing; a lifting unit for raising and lowering the maintenance module; a first detection unit for detecting the connection portion in the process module to which the maintenance module is connected; a frame for holding the maintenance module, the lifting unit, and the first detection unit, and a control unit for controlling the lifting unit based on the detection result of the first detection unit.
[0114] [Note 3] The lifting mechanism is an air cylinder or an electric cylinder, as described in Note 1 or Note 2.
[0115] [Note 4] The transport device according to any one of Notes 1 to 3, wherein the maintenance module is connected to the lifting section by a floating mechanism.
[0116] [Note 5] The conveying device described in Note 4, wherein the floating mechanism is a ball joint.
[0117] [Note 6] The transport device according to any one of Notes 1 to 5, wherein the first detection unit includes at least one selected from the group consisting of a camera, a distance sensor, a force sensor, and a gyro sensor.
[0118] [Note 7] The first detection unit is a transport device according to any one of Notes 1 to 5, including a camera.
[0119] [Note 8] The first detection unit is a transport device according to any one of Notes 1 to 5, including a distance sensor.
[0120] [Note 9] The first detection unit is a transport device according to any one of Notes 1 to 5, including a force sensor.
[0121] [Note 10] The transport device according to any one of Notes 1 to 5, wherein the first detection unit includes a gyro sensor for detecting the attitude of the maintenance module.
[0122] [Note 11] A transport device comprising: a maintenance module connected to a process module for substrate processing; a frame holding the maintenance module and formed by a frame; and a travel unit that moves the frame and is provided inside the frame, wherein the travel unit comprises an arm and a second detection unit attached to the tip of the arm, and when in use, the second detection unit is positioned outside the frame and when not in use, the second detection unit is housed inside the frame.
[0123] [Note 12] The transport device according to Note 11, wherein the second detection unit is one of a distance sensor, a bumper sensor, or a button.
[0124] The transport device (autonomous driving maintenance device) according to the present embodiment disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner.
[0125] This application claims priority to Basic Patent Application No. 2024-205741 filed with the Japan Patent Office on November 26, 2024, and Basic Patent Application No. 2025-094226 filed with the Japan Patent Office on June 5, 2025, the entire contents of which are incorporated herein by reference.
[0126] 1 Manufacturing system 2 Control unit 10 Plasma processing chamber 100 Substrate processing subsystem 110 Vacuum transfer chamber 115 Robot arm 120, 121, 122, 123, 124, 125, 126 Substrate processing unit 120g, 120h Gate valve 130, 131, 132 Load lock chamber 140 Atmospheric pressure transfer chamber 141 Load port 145 Robot arm 200 Transfer device 210 Maintenance module 210g Gate valve 220, 221, 222, 223, 224 Lifting unit 220m, 221m, 222m, 223m, 224m Floating mechanism 230 Detection unit 240 Stand unit 250 Travel unit 251 Detection unit 251a, 251b Arm unit 260 Control unit 300 Storage device 400 Control device W Circuit board
Claims
1. An autonomous mobile maintenance device for maintaining a circuit board processing module, comprising: a maintenance module connectable to the circuit board processing module; a frame; an autonomous mobile robot (AMR) attached to the frame; a positioning adjustment unit attached to the frame and configured to adjust the height and orientation of the maintenance module; a first detection unit configured to detect the connection portion between the circuit board processing module and the maintenance module; and a control unit configured to control the positioning adjustment unit based on the output of the first detection unit, wherein the autonomous mobile robot includes a second detection unit configured to detect obstacles when the autonomous mobile robot is traveling, and an arm configured to move the second detection unit to the outside of the frame when the autonomous mobile robot is traveling and to move the second detection unit to the inside of the frame when the autonomous mobile robot is stopped.
2. The autonomous driving maintenance device according to claim 1, wherein the positioning adjustment unit includes a plurality of lifting units configured to raise and lower the maintenance module.
3. The autonomous driving maintenance device according to claim 2, wherein each of the plurality of lifting units includes an air cylinder or an electric cylinder.
4. The autonomous driving maintenance device according to claim 2, further comprising a plurality of floating mechanisms connected between the maintenance module and the plurality of lifting units.
5. The autonomous driving maintenance device according to claim 4, wherein each of the plurality of floating mechanisms includes a ball joint.
6. The autonomous driving maintenance device according to claim 1, wherein the positioning adjustment unit includes a horizontal movement table configured to move the maintenance module horizontally, and a lifting unit configured to raise and lower the horizontal movement table.
7. The autonomous driving maintenance device according to any one of claims 1 to 6, wherein the first detection unit is selected from the group consisting of an image sensor, a distance sensor, a force sensor, a gyro sensor, and combinations thereof.
8. An autonomous driving maintenance device for maintaining a circuit board processing module, comprising: a maintenance module connectable to the circuit board processing module; a frame; an autonomous mobile robot (AMR) attached to the frame; a positioning adjustment unit attached to the frame and configured to adjust the height and orientation of the maintenance module; a first detection unit configured to detect the connection portion between the circuit board processing module and the maintenance module; and a control unit configured to control the positioning adjustment unit based on the output of the first detection unit.
9. The autonomous driving maintenance device according to claim 8, wherein the positioning adjustment unit includes a plurality of lifting units configured to raise and lower the maintenance module.
10. The autonomous driving maintenance device according to claim 9, wherein each of the plurality of lifting units includes an air cylinder or an electric cylinder.
11. The autonomous driving maintenance device according to claim 9, further comprising a plurality of floating mechanisms connected between the maintenance module and the plurality of lifting units.
12. The autonomous driving maintenance device according to claim 11, wherein each of the plurality of floating mechanisms includes a ball joint.
13. The autonomous driving maintenance device according to claim 8, wherein the positioning adjustment unit includes a horizontal movement table configured to move the maintenance module horizontally, and a lifting unit configured to raise and lower the horizontal movement table.
14. The autonomous driving maintenance device according to any one of claims 8 to 13, wherein the first detection unit includes an image sensor.
15. The autonomous driving maintenance device according to any one of claims 8 to 13, wherein the first detection unit includes a distance sensor.
16. The autonomous driving maintenance device according to any one of claims 8 to 13, wherein the first detection unit includes a force sensor.
17. The autonomous driving maintenance device according to any one of claims 8 to 13, wherein the first detection unit includes a gyro sensor.
18. An autonomous mobile maintenance device for maintaining a circuit board processing module, comprising: a maintenance module connectable to the circuit board processing module; a frame supporting the maintenance module; and an autonomous mobile robot (AMR) attached to the frame, wherein the autonomous mobile robot includes a detection unit configured to detect obstacles when the autonomous mobile robot is in motion, and an arm configured to move the detection unit to the outside of the frame when the autonomous mobile robot is in motion and to move the detection unit to the inside of the frame when the autonomous mobile robot is stopped.
19. The autonomous driving maintenance device according to claim 18, wherein the detection unit is selected from the group consisting of a distance sensor, a bumper sensor, a button, and a combination thereof.