Semiconductor package for laser-emitting device array chip, and lidar device comprising semiconductor package
The semiconductor package simplifies wiring and heat management in LiDAR devices by using insulated via lines, improving performance and miniaturization.
WO2026117054A1PCT designated stage Publication Date: 2026-06-04SOS LAB CO LTD
Patent Information
- Application Number
- PCT/KR2025/020007
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-28
- Filing Date
- 2025-11-27
- Publication Date
- 2026-06-04
AI Technical Summary
Technical Problem
Connecting multiple laser emitters in a laser emitter array to a driving driver package with wires results in complex wiring designs and potential performance degradation or failure of LiDAR devices.
Method used
A semiconductor package with a VCSEL array chip, a driving driver package, and thermal and electrical conductor structures that facilitate easy electrical connection and heat dissipation, using insulated via lines for wiring and thermal management.
Benefits of technology
Simplifies wiring design, miniaturizes LiDAR devices, and effectively dissipates heat, enhancing the performance and reliability of LiDAR systems.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure KR2025020007_04062026_PF_FP_ABST
Abstract
A laser output device for outputting a laser through respective vertical cavity surface emitting laser (VCSEL) devices, according to an embodiment of the present disclosure, comprises: a VCSEL array chip including the plurality of VCSEL devices; a driver package including at least one capacitor and a common drive switch; a VCSEL package interposed between the VCSEL array chip and the driver package; and at least one thermal and electrical conductor structure which provides a reference voltage to the VCSEL package and to which heat generated from the VCSEL package is transferred.
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Citation Information
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