Conveying system and method for cleaning of both edge-polished and double-side-polished wafers

Abstract

Provided in the present invention are a conveying system and method for cleaning of both edge-polished and double-side-polished wafers. A wafer unloading subsystem comprises a double-side-polished wafer unloading device and an edge-polished wafer loading and pushing device; a tank cleaning subsystem comprises a second manipulator and a wafer cleaning tank; a double-side-polished wafer transfer subsystem is configured to transfer a first container box containing a double-side-polished wafer to the double-side-polished wafer unloading device, the double-side-polished wafer unloading device is configured to push out the double-side-polished wafer in the first container box, and the second manipulator is configured to grip the double-side-polished wafer pushed out by the double-side-polished wafer unloading device and transfer same to a cleaning tank area; an edge-polished wafer transfer subsystem is configured to take out an edge-polished wafer from a second container box and position same at a first designated position, the edge-polished wafer loading and pushing device is configured to load the edge-polished wafer from the first designated position and return to a first standby position, and the second manipulator is configured to grip the edge-polished wafer from the edge-polished wafer loading and pushing device at the first standby position and transfer same to the cleaning tank area. The shared apparatus for a wet-in process of double-side-polished wafer cleaning and for a dry-in process of edge-polished wafer cleaning can reduce production costs.

Description

A conductive system and method for simultaneous edge-polishing and dual-polishing wafer cleaning Technical Field

[0001] This invention relates to the field of wafer cleaning process technology, and in particular to a conduction system and method for simultaneous edge polishing and double polishing wafer cleaning. Background Technology

[0002] With the development of semiconductor technology, semiconductor silicon wafers are gradually moving towards larger 300mm wafers and thinner wafers. Grinding and polishing of large silicon wafers plays an extremely important role. During the repeated grinding and polishing process of large silicon wafers, it is necessary to clean the large silicon wafers after grinding and polishing. At present, mainstream companies usually use two cleaning methods for the grinding and cleaning process of large silicon wafers: double polishing cleaning and edge polishing cleaning. The main purpose is to use special chemical solutions to clean various particles and contaminants on the surface of the dirty wafers after polishing. The cleaning process of large silicon wafers directly affects the quality of the subsequent grinding and polishing of silicon wafers and plays a decisive role in the production quality of large silicon wafer raw materials.

[0003] Currently, there are two cleaning methods: double-sided polishing and edge polishing. Double-sided polishing refers to cleaning large silicon wafers that have undergone double-sided grinding and polishing with a special chemical solution. Since the large silicon wafers are polished on both sides, they need to be placed in a special CST and immersed in water for transportation, which is a wet-in, dry-out process. Edge polishing refers to cleaning large silicon wafers that have undergone edge grinding and polishing with a special chemical solution. Since the large silicon wafers are polished on both sides, they are placed in a FOUP for transportation, which is a dry-in, dry-out process.

[0004] Currently, dual-polishing and edge-polishing processes are classified as wet-entry and dry-entry processes, respectively. The carriers for the wafers are water tanks with CST and FOUPs, respectively. Due to the difference between the two loading methods, the current market mainstream is to implement the two cleaning methods through two separate machines. Therefore, companies must purchase two machines, resulting in extremely high production costs. However, the only difference between these two cleaning processes is the loading method; all other subsequent processes are the same. Summary of the Invention

[0005] Based on the above description, the present invention provides a conduction system and method for simultaneous edge polishing and dual polishing wafer cleaning, which solves the technical problem of high cost in the prior art where dual polishing cleaning process and edge polishing cleaning process are used separately.

[0006] A conduction system for simultaneous edge-polishing and dual-polishing wafer cleaning includes an edge-polishing wafer transfer subsystem, a dual-polishing wafer transfer subsystem, a wafer ejection subsystem, and a tank cleaning subsystem;

[0007] The wafer ejection subsystem includes a dual-throw ejection device and an edge-throw loading and pushing device;

[0008] The tank cleaning subsystem includes a second robotic arm and a wafer cleaning tank;

[0009] In the double-polish wafer cleaning process, the double-polish wafer transfer subsystem is used to transfer the first container box containing the double-polish wafers to the double-polish ejection device. The double-polish ejection device is used to eject the double-polish wafers from the first container box. The second robot arm is used to pick up the double-polish wafers ejected by the double-polish ejection device and transfer them to the cleaning tank area.

[0010] In the edge-polishing wafer cleaning process, the edge-polishing wafer transfer subsystem is used to take out the edge-polishing wafer from the second container box and position it to the first designated position. The edge-polishing loading and pushing device is used to load the edge-polishing wafer from the first designated position and return it to the first standby position. The second robot arm is used to pick up the edge-polishing wafer from the loading and pushing device in the first standby position and transfer it to the cleaning tank area.

[0011] Furthermore, the dual-polish wafer transfer subsystem is located in the first area, the edge-polish wafer transfer subsystem and the wafer ejection subsystem are located in the second area, and the tank cleaning subsystem is located in the third area.

[0012] Furthermore, the dual-displacement wafer transfer subsystem includes a first dual-displacement loading device, a second dual-displacement loading device, and a first robotic arm;

[0013] The first double-discharge loading device is used to load a liquid tank with a first container box from the outside and transfer it to the second double-discharge loading device, wherein the double-discharged wafers in the first container box are immersed in the liquid in the liquid tank.

[0014] The first robotic arm is used to remove the first container box containing the double-sprayed wafers from the liquid tank on the second double-spray loading device and transfer it to the double-spray ejection device.

[0015] Furthermore, the dual-displacement wafer transfer subsystem also includes a third dual-displacement loading device and a sliding device;

[0016] The second double-throw loading device is installed on the sliding device;

[0017] The first robotic arm is also used to retrieve an empty first container box from the double-throw ejector and transfer it to a liquid tank on the second double-throw loading device, which is in a second standby position.

[0018] The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position;

[0019] The second double-throw loading device transfers the liquid tank with the empty first container box to the third double-throw loading device after the second designated position, and the third double-throw loading device ships the liquid tank with the first container box.

[0020] Furthermore, the edge-polishing wafer transfer subsystem includes an edge-polishing door opening device, an edge-polishing transfer device, and an edge-polishing positioning device;

[0021] The edge-polishing door opening device is used to carry the second container box containing the edge-polished wafers and to open the second container box;

[0022] The edge-discharge transfer device is used to fork out the edge-discharged wafers from the open second container and transfer them to the edge-discharge positioning device;

[0023] The edge-polishing positioning device is used to position and adjust the edge-polished wafer to the first designated position;

[0024] The edge-discharge loading and pushing device moves from the first standby position to below the first designated position, loads the edge-discharged wafer from the first designated position, and then moves back to the first standby position.

[0025] Furthermore, the second region lies between the first and third regions;

[0026] When the second double-throw loading device is in the second standby position and the side-throw loading push device is in the first standby position, the first double-throw loading device, the second double-throw loading device, the double-throw pushing device, and the side-throw loading push device are arranged in a row in sequence.

[0027] The edge-discharge wafer transfer subsystem and the edge-discharge loading and pushing device are arranged in a row.

[0028] A transfer method for simultaneous edge-polishing and dual-polishing wafer cleaning, using the aforementioned transfer system for simultaneous edge-polishing and dual-polishing wafer cleaning, includes a transfer step for the dual-polishing wafer cleaning process and a transfer step for the edge-polishing wafer cleaning process.

[0029] The transfer steps of the double-polished wafer cleaning process include:

[0030] Step A1: The dual-polish wafer transfer subsystem transfers the first container holding the dual-polish wafers to the dual-polish ejection device.

[0031] Step A2: The dual-polish ejection device ejects the dual-polished wafer from the first container box;

[0032] Step A3: The second robotic arm picks up the double-polished wafer pushed out by the double-polished ejection device and transfers it to the cleaning tank area;

[0033] The transfer steps of the edge polishing wafer cleaning process include:

[0034] Step B1: The edge-polished wafer transfer subsystem removes the edge-polished wafer from the second container and positions it at the first designated location;

[0035] Step B2: The edge-discharge loading and pushing device loads the edge-discharged wafer from the first designated position and returns to the first standby position;

[0036] Step B3: The second robotic arm picks up the edge-polished wafer from the loading and pushing device in the first standby position and transfers it to the cleaning tank area.

[0037] Furthermore, the dual-displacement wafer transfer subsystem includes a first dual-displacement loading device, a second dual-displacement loading device, and a first robotic arm. Step A1 includes:

[0038] Step A11: The first double-discharge loading device loads the liquid tank with the first container box from the outside and transfers it to the second double-discharge loading device, and the double-discharged wafer in the first container box is immersed in the liquid in the liquid tank.

[0039] Step A12: The first machine removes the first container box containing the double-polished wafer from the liquid tank on the second double-polished loading device and transfers it to the double-polished ejection device.

[0040] Furthermore, the dual-displacement wafer transfer subsystem also includes a third dual-displacement loading device and a sliding device, with the second dual-displacement loading device mounted on the sliding device;

[0041] In the transfer steps of the double-polished wafer cleaning process, after step A3, the following steps are also included:

[0042] Step A4: The first robotic arm retrieves the empty first container box from the double-throwing ejector and transfers it to the second double-throwing loading device, which is in the second standby position.

[0043] Step A5: The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position;

[0044] Step A6: After the second double-throw loading device reaches the second designated position, it transfers the empty first container box to the third double-throw loading device, which then ships the empty first container box.

[0045] Furthermore, the edge-polishing wafer transfer subsystem includes an edge-polishing door opening device, an edge-polishing transfer device, and an edge-polishing positioning device;

[0046] In the transfer steps of the edge-polishing wafer cleaning process, step B1 includes:

[0047] Step B11: The edge-polishing door device carries the second container box containing the edge-polished wafer and opens the second container box;

[0048] Step B12: The edge-discharge transfer device forks out the edge-discharge wafer from the opened second container box and transfers it to the edge-discharge positioning device;

[0049] Step B13: The edge-polishing positioning device positions and adjusts the edge-polishing wafer to the first designated position;

[0050] Step B14: The edge-discharge loading and pushing device moves from the first standby position to below the first designated position, loads the edge-discharged wafer from the first designated position, and then moves back to the first standby position.

[0051] The beneficial technical effects of this invention are as follows: This invention integrates the loading methods of two cleaning processes, namely double-shot cleaning and side-shot cleaning. Through a brand-new layout design, it realizes the sharing of wet loading for double-shot cleaning and dry loading for side-shot cleaning. After accommodating the two loading methods, the original two cleaning equipment will be merged into one cleaning equipment, which will greatly reduce the production cost of enterprises. Attached Figure Description

[0052] Figure 1 is a schematic diagram of a commonly used CST and water tank for carrying double-polished wafers in the prior art;

[0053] Figure 2 is a schematic diagram of a commonly used FOUP for supporting edge-polished wafers in the prior art;

[0054] Figure 3 is a schematic diagram of a preferred arrangement of a conductive system for simultaneous edge polishing and double polishing wafer cleaning according to the present invention.

[0055] Figure 4-11 is a schematic diagram of the process of loading dual-polished wafers using a conduction system and method for simultaneous edge polishing and dual-polishing wafer cleaning according to the present invention.

[0056] Figures 12-18 are schematic diagrams of the process of loading edge-polished wafers using a conduction system and method for simultaneous edge-polishing and dual-polishing wafer cleaning according to the present invention.

[0057] Figures 19-23 are flowcharts of the conductive method for simultaneous edge polishing and double polishing wafer cleaning according to the present invention.

[0058] Wherein: 1-First container box; 2-Liquid tank; 3-First double-throw loading device; 4-Second double-throw loading device; 5-First robotic arm; 6-Sliding device; 7-Third double-throw loading device; 8-Double-throw ejection device; 9-Side-throw loading and pushing device; 10-Second robotic arm; 11-Wafer cleaning tank; 12-Second container box; 13-Side-throw opening device; 14-Side-throw conveying device; 15-Side-throw positioning device; A-First area; B-Second area; C-Third area. Detailed Implementation

[0059] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0060] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0061] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0062] Referring to Figure 3, the present invention provides a conduction system for simultaneous edge-polishing and dual-polishing wafer cleaning, including an edge-polishing wafer transfer subsystem, a dual-polishing wafer transfer subsystem, a wafer ejection subsystem, and a tank cleaning subsystem;

[0063] The wafer ejection subsystem includes a dual-throw ejection device (8) and an edge-throw loading and pushing device (9);

[0064] The tank cleaning subsystem includes a second robotic arm (10) and a wafer cleaning tank (11);

[0065] In the double-polished wafer cleaning process, the double-polished wafer transfer subsystem is used to transfer the first container box (1) containing the double-polished wafer to the double-polished ejection device (8), the double-polished ejection device (8) is used to eject the double-polished wafer in the first container box (1), and the second robot (10) is used to pick up the double-polished wafer ejected by the double-polished ejection device and transfer it to the cleaning tank (11).

[0066] In the edge-polishing wafer cleaning process, the edge-polishing wafer transfer subsystem is used to take out the edge-polishing wafer from the second container box (12) and position it to the first designated position. The edge-polishing loading and pushing device (9) is used to load the edge-polishing wafer from the first designated position and return it to the first standby position. The second robot (10) is used to pick up the edge-polishing wafer from the loading and pushing device (9) in the first standby position and transfer it to the cleaning tank (11) area.

[0067] This invention integrates the loading methods of two cleaning processes, double-jet cleaning and side-jet cleaning. Through a brand-new layout design, it enables wet loading for double-jet cleaning and dry loading for side-jet cleaning. By accommodating the two loading methods, the original two cleaning machines are merged into one, greatly reducing the production costs of enterprises.

[0068] Specifically, the first container box (1) is the existing CST. CST (cassette) is a fully open wafer carrier box. The CST is placed in a liquid tank (2) so that the double-polished wafer is always immersed in a liquid such as water, thus realizing the wet entry of the double-polished wafer.

[0069] Specifically, the second container box (12) is a FOUP, which is a front-opening wafer transfer box, also known as a Front Opening Unified Pod, which is existing technology and will not be described in detail here.

[0070] Specifically, after receiving the first container box (1), the double-displacement ejector (8) will push the double-displacement wafers in the first container box (1) upwards, so that the second robotic arm (10) can pick up the double-displacement wafers. The double-displacement ejector (8) is, for example, the commonly used CST OUT, which is a wafer ejection device.

[0071] Specifically, the edge-discharge loading and pushing device (9) is, for example, the Load Pusher commonly used in the prior art. The edge-discharge loading and pushing device (9) positions the edge-discharged wafer from the edge-discharged wafer transfer subsystem to the first designated position to load the edge-discharged wafer, and then returns the edge-discharged wafer to the standby position, i.e., the first standby position, to wait for the second robotic arm to pick up the wafer.

[0072] When the second robotic arm (10) is to pick up the double-sprayed wafer, it moves from its standby position to the double-spray ejection device (8) to pick up the wafer. Then the second robotic arm (10) transfers the wafer to the cleaning tank area and then returns to the standby position.

[0073] When the second robotic arm (10) is about to pick up the edge-polished wafer, it moves from its standby position to the vicinity of the edge-polishing loading and pushing device (9) in the first standby position to pick up the wafer. Then the second robotic arm (10) transfers the edge-polished wafer to the cleaning tank (11) area and then returns to its standby position.

[0074] Furthermore, the dual-polish wafer transfer subsystem is located in the first region (A), the edge-polish wafer transfer subsystem and the wafer ejection subsystem are located in the second region (B), and the tank cleaning subsystem is located in the third region (C).

[0075] Specifically, the second region (B) is located between the first region (A) and the third region (C).

[0076] Furthermore, the dual-displacement wafer transfer subsystem includes a first dual-displacement loading device (3), a second dual-displacement loading device (4), and a first robotic arm (5);

[0077] The first double-discharge loading device (3) is used to load the liquid tank (2) with the first container box (1) from the outside and transfer it to the second double-discharge loading device (4), wherein the double-discharged wafer in the first container box (1) is immersed in the liquid in the liquid tank (2);

[0078] The first robotic arm (5) is used to remove the first container box (1) with double-sprayed wafers from the liquid tank (2) on the second double-spray loading device (4) and transfer it to the double-spray ejection device (8).

[0079] Specifically, the first double-throw loading device (3) and the second double-throw loading device (4) are load ports commonly used in the prior art, used for loading and unloading wafer storage mechanisms, i.e. picking up and placing wafers. The first double-throw loading device (3) can load goods from an external AGV trolley, i.e., load the liquid tank (2) with the first container box (1), and then transfer it to the second double-throw loading device (4) via a roller conveyor.

[0080] The first robotic arm (5), i.e., the robot, takes the first container (1) containing the double-polished wafer from the liquid tank (2) on the second double-polished loading device (4), and then transfers it to the double-polished ejection device (8). The wafer is lifted by the double-polished ejection device (8) so that the second robotic arm can grip it. After transferring the wafer to the double-polished ejection device (8), the first robotic arm (5) returns to its standby position. The standby position of the first robotic arm (5) is in the first area, near the second double-polished loading device (4).

[0081] Furthermore, the dual-displacement wafer transfer subsystem also includes a third dual-displacement loading device (7) and a sliding device (6);

[0082] The second double-throw loading device (4) is installed on the sliding device (6);

[0083] The first robotic arm (5) is also used to retrieve the empty first container box (1) from the double-throw ejector (8) and transfer it to the second double-throw loading device (4) which is in the second standby position;

[0084] The sliding device (6) moves the second double-throw loading device (4) linearly from the second standby position to the second designated position;

[0085] The second double-throw loading device (4) passes the empty first container box (1) to the third double-throw loading device (7) after the second designated position, and the third double-throw loading device (7) ships the empty first container box (1).

[0086] Specifically, the third double-throw loading device (7) is a load port commonly used in the prior art, used for loading and unloading wafer storage mechanisms, i.e. picking up and placing wafers. After the wafer in the double-throw ejection device (8) is picked up by the second robot (10), the empty first container box (1) is left. The first robot (5) moves from its standby position back to the double-throw ejection device (8), takes out the empty first container box (1), and transfers the empty first container box (1) to the liquid tank (2) on the second double-throw loading device (4).

[0087] The sliding device (6) is the existing SLIDE mechanism. The slide mechanism moves linearly, moving the second double-throw loading device (4) linearly to the second designated position. Then, it transfers the empty first container box (1) to the third double-throw loading device (7) via a roller conveyor. The third double-throw loading device (7) transfers the empty first container box (1) to the AGV trolley via a roller conveyor for the next process. Furthermore, the edge-throw wafer transfer subsystem includes an edge-throw door opening device (13), an edge-throw transfer device (14), and an edge-throw positioning device (15).

[0088] The edge-polishing opening device (13) is used to carry the second container box (12) containing the edge-polished wafers and to open the second container box (12);

[0089] The edge-discharge transfer device (14) is used to fork out the edge-discharged wafer from the open second container box (12) and transfer it to the edge-discharge positioning device (15);

[0090] The edge-polishing positioning device (15) is used to position and adjust the edge-polished wafer to the first designated position;

[0091] The edge-discharge loading and pushing device (9) moves from the first standby position to below the first designated position, loads the edge-discharged wafer from the first designated position, and then moves back to the first standby position.

[0092] The edge-polishing door opening device (13) can be, for example, a commonly used FIMS device. A second container box (12), such as a FOUP, containing edge-polished wafers is placed on the carrying platform. Then the door of the FOUP is opened to facilitate the clamping of the wafers. For example, a vacuum suction type is used to open the front door of the FOUP.

[0093] The edge-discharge transfer device (14) is, for example, the WTU device in the prior art. The fork unit of the WTU device rotates to the edge-discharge opening device (13), the fork unit penetrates into the FOUP to pick up the edge-discharged wafer, and then rotates again so that the fork unit faces the edge-discharge positioning device (15).

[0094] The edge positioning device (15) is, for example, the POS mechanism in the prior art, which can adjust the orientation of the wafer to keep it horizontal or vertical during the transmission process, and can accurately position the wafer to a designated position, such as the first designated position.

[0095] The edge-discharge loading and pushing device (9), such as the Load Pusher commonly used in the prior art, moves from the first standby position to below the edge-discharge positioning device (15), rises to connect to the edge-discharged wafer on the edge-discharge positioning device (15), and then returns to the first standby position. Then, the second robotic arm moves from the standby position to the edge-discharge loading and pushing device (9), picks up the wafer, and places it in the wafer cleaning tank area. This achieves dry feeding of the edge-discharged wafer. In this invention, the wet feeding of the dual-discharged wafer and the dry feeding of the edge-discharged wafer share the cleaning tank and the second robotic arm, reducing the use of one cleaning device and robotic arm, greatly reducing production costs. Moreover, integrating wet feeding and dry feeding reduces the floor space and facilitates unified management.

[0096] Furthermore, the second region (B) lies between the first region (A) and the third region (C);

[0097] When the second double-throw loading device (4) is in the second standby position and the side-throw loading push device (9) is in the first standby position, the first double-throw loading device (3), the second double-throw loading device (4), the double-throw pushing device (8), and the side-throw loading push device (9) are arranged in a row in sequence.

[0098] The edge-discharge wafer transfer subsystem and the edge-discharge loading and pushing device are arranged in a row.

[0099] Arranging them in a row or line improves the compactness of each transfer mechanism, reduces the floor space, and allows double-displacement wafer boxes to transfer wafers along the row direction while single-displacement wafer boxes transfer wafers along the column direction, shortening the transfer path and improving transfer efficiency.

[0100] Specifically, when the second double-throw loading device (4) is in the second standby position and the side-throw loading push device (9) is in the first standby position, the first double-throw loading device (3), the second double-throw loading device (4), the double-throw pushing device (8), the side-throw loading push device (9) and the cleaning tank (11) are arranged in a row in sequence.

[0101] The edge-discharge wafer transfer subsystem and the edge-discharge loading and pushing device are arranged in a row, namely the edge-discharge opening device (13), the edge-discharge transfer device (14), the edge-discharge positioning device (15) and the edge-discharge loading and pushing device (9) are arranged in a row.

[0102] Furthermore, when the third double-throw loading device (7) and the first double-throw loading device (3) are arranged in a row.

[0103] Referring to Figures 19 and 20, the present invention also provides a conduction method for simultaneous edge polishing and dual polishing wafer cleaning, using the aforementioned conduction system for simultaneous edge polishing and dual polishing wafer cleaning, including a transfer step for the dual polishing wafer cleaning process and a transfer step for the edge polishing wafer cleaning process.

[0104] The transfer steps of the double-polished wafer cleaning process include:

[0105] Step A1: The dual-polish wafer transfer subsystem transfers the first container holding the dual-polish wafers to the dual-polish ejection device.

[0106] Step A2: The dual-polish ejection device ejects the dual-polished wafer from the first container box;

[0107] Step A3: The second robotic arm picks up the double-polished wafer pushed out by the double-polished ejection device and transfers it to the cleaning tank area;

[0108] The transfer steps of the edge polishing wafer cleaning process include:

[0109] Step B1: The edge-polished wafer transfer subsystem removes the edge-polished wafer from the second container and positions it at the first designated location;

[0110] Step B2: The edge-discharge loading and pushing device loads the edge-discharged wafer from the first designated position and returns to the first standby position;

[0111] Step B3: The second robotic arm picks up the edge-polished wafer from the loading and pushing device in the first standby position and transfers it to the cleaning tank area.

[0112] This invention integrates the loading methods of two cleaning processes, double-jet cleaning and side-jet cleaning. Through a brand-new layout design, it enables wet loading for double-jet cleaning and dry loading for side-jet cleaning. By accommodating the two loading methods, the original two cleaning machines are merged into one, greatly reducing the production costs of enterprises.

[0113] Referring to Figure 21, further, the dual-displacement wafer transfer subsystem includes a first dual-displacement loading device, a second dual-displacement loading device, and a first robotic arm. Step A1 includes:

[0114] Step A11: The first double-discharge loading device loads the liquid tank with the first container box from the outside and transfers it to the second double-discharge loading device, and the double-discharged wafer in the first container box is immersed in the liquid in the liquid tank.

[0115] Step A12: The first machine removes the first container box containing the double-polished wafer from the liquid tank on the second double-polished loading device and transfers it to the double-polished ejection device.

[0116] Referring to Figure 22, the dual-displacement wafer transfer subsystem further includes a third dual-displacement loading device and a sliding device, with the second dual-displacement loading device mounted on the sliding device;

[0117] In the transfer steps of the double-polished wafer cleaning process, after step A3, the following steps are also included:

[0118] Step A4: The first robotic arm retrieves the empty first container box from the double-throwing ejector and transfers it to the second double-throwing loading device, which is in the second standby position.

[0119] Step A5: The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position;

[0120] Step A6: After the second double-throw loading device reaches the second designated position, it transfers the empty first container box to the third double-throw loading device, which then ships the empty first container box.

[0121] Referring to Figure 23, the edge-polishing wafer transfer subsystem further includes an edge-polishing gate opening device, an edge-polishing transfer device, and an edge-polishing positioning device;

[0122] In the transfer steps of the edge-polishing wafer cleaning process, step B1 includes:

[0123] Step B11: The edge-polishing door device carries the second container box containing the edge-polished wafer and opens the second container box;

[0124] Step B12: The edge-discharge transfer device forks out the edge-discharge wafer from the opened second container box and transfers it to the edge-discharge positioning device;

[0125] Step 13: The edge-polishing positioning device positions and adjusts the edge-polishing wafer to the first designated position;

[0126] Step B14: The edge-discharge loading and pushing device moves from the first standby position to below the first designated position, loads the edge-discharged wafer from the first designated position, and then moves back to the first standby position.

[0127] Referring to Figure 4-11, the specific wet-entry process of the cleaning process for double-polished wafers is as follows:

[0128] Referring to Figure 4, the liquid tank containing the first container box with double-sprayed wafers is transferred by the AGV trolley to the position of the first double-spray loading device for loading and standby.

[0129] Referring to Figure 5, the liquid tank containing the first container box with double-sprayed wafers is transferred to the second double-spray loading device.

[0130] Referring to Figure 6, the first robotic arm retrieves the first container box containing the double-polished wafers from the liquid tank in the second double-polished loading device.

[0131] Referring to Figure 7, the first robotic arm picks up the first container box containing the double-polished wafer and transfers it to the double-polished ejection device, while the second robotic arm is in a standby position.

[0132] Referring to Figure 8, the first robotic arm returns to the second double-discharge loading device, and the second robotic arm moves to the double-discharge ejection device to pick up the double-discharged wafer ejected by the double-discharge ejection device and moves the double-discharged wafer to the cleaning trough area.

[0133] Referring to Figure 9, the first robotic arm moves to the double-throwing ejector to pick up the empty first container box and moves the empty first container box into the liquid tank of the second double-throwing loading device.

[0134] Referring to Figure 10, the sliding device moves linearly to move the second double-throw loading device to the designated position.

[0135] Referring to Figure 11, the liquid tank of the empty first container box is moved from the second double-throw loading device to the third double-throw loading device, and is discharged from the third double-throw loading device.

[0136] Referring to Figure 12-18, the specific wet entry process of the edge-polished wafer cleaning process is as follows:

[0137] Referring to Figure 12, the side-throw conveyor is in the standby position.

[0138] Referring to Figure 13, the fork unit on the edge-discharge transfer device rotates to the edge-discharge opening device station and extends into the opened second container box to fork the edge-discharged wafer.

[0139] Referring to Figure 14, the edge-discharge transfer device rotates again so that the fork unit faces the edge-discharge positioning device, and the edge-discharged wafer is inserted into the wafer clamping teeth of the edge-discharge positioning device, where the edge-discharged wafer is clamped by the wafer clamping teeth of the edge-discharge positioning device.

[0140] Referring to Figure 15, the edge-discharge transfer device returns to the standby position, and the edge-discharge positioning device moves the edge-discharge wafer and adjusts the edge-discharge wafer attitude so that the edge-discharge wafer is in the first designated position.

[0141] Referring to Figure 16, the edge-throw loading and pushing device moves from the first standby position to below the edge-throw positioning device and rises to load the edge-throw wafer into its own device.

[0142] Referring to Figure 17, the edge-spraying loading and pushing device carries the edge-sprayed wafer back to the first standby position.

[0143] Referring to Figure 18, the second robotic arm moves from its standby position to the edge-spraying loading and pushing device to pick up the edge-spraying wafer, and then transfers it to the cleaning tank area.

[0144] In this invention, the wet entry of double-polished wafers and the dry entry of edge-polished wafers share a common cleaning tank and a second robotic arm, reducing the need for a cleaning device and a robotic arm, thus significantly lowering production costs. Furthermore, integrating wet and dry entry reduces the floor space required and facilitates unified management.

[0145] The above are merely preferred embodiments of the present invention and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should recognize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present invention should be included within the protection scope of the present invention.

Claims

1. A conductive system for simultaneous edge and double-side wafer cleaning, characterized in that, This includes an edge-polished wafer transfer subsystem, a dual-polished wafer transfer subsystem, a wafer ejection subsystem, and a tank cleaning subsystem; The wafer ejection subsystem includes a dual-throw ejection device and a side-throw loading and pushing device; The tank cleaning subsystem includes a second robotic arm and a cleaning tank; In the double-polish wafer cleaning process, the double-polish wafer transfer subsystem is used to transfer the first container box containing the double-polish wafers to the double-polish ejection device, the double-polish ejection device is used to eject the double-polish wafers from the first container box, and the second robotic arm is used to pick up the double-polish wafers ejected by the double-polish ejection device and transfer them to the cleaning tank area. In the edge-polishing wafer cleaning process, the edge-polishing wafer transfer subsystem is used to remove the edge-polishing wafer from the second container box and position it to a first designated position. The edge-polishing loading and pushing device is used to load the edge-polishing wafer from the first designated position and return it to a first standby position. The second robotic arm is used to grip the edge-polishing wafer from the edge-polishing loading and pushing device in the first standby position and transfer it to the cleaning tank area.

2. A conductive system for simultaneously cleaning edge-polished and double-polished wafers as recited in claim 1, wherein, The dual-displacement wafer transfer subsystem includes a first dual-displacement loading device, a second dual-displacement loading device, and a first robotic arm; The first dual-discharge loading device is used to load a liquid tank with the first container box from the outside and transfer it to the second dual-discharge loading device, wherein the dual-discharged wafer in the first container box is immersed in the liquid in the liquid tank; The first robotic arm is used to remove the first container box containing the double-polished wafer from the liquid tank on the second double-polished loading device and transfer it to the double-polished ejection device.

3. A conductive system for simultaneously cleaning edge and double polished wafer as claimed in claim 2, wherein, The dual-polish wafer transfer subsystem also includes a third dual-polish loading device and a sliding device; The second double-throw loading device is mounted on the sliding device; The first robotic arm is also used to retrieve the empty first container box from the double-throw ejector and transfer it to the liquid tank on the second double-throw loading device, which is in the second standby position; The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position; After the second double-throw loading device reaches the second designated position, it transfers the liquid tank containing the first container box to the third double-throw loading device, which then ships the liquid tank containing the first container box.

4. A conductive system for simultaneously cleaning edge and double polished wafer as claimed in claim 1 wherein, The edge-polishing wafer transfer subsystem includes an edge-polishing door opening device, an edge-polishing transfer device, and an edge-polishing positioning device; The edge-polishing door opening device is used to carry the second container box containing the edge-polished wafers and to open the second container box; The edge-discharge transfer device is used to fork out the edge-discharged wafer from the open second container box and transfer it to the edge-discharge positioning device; The edge-polishing positioning device is used to position and adjust the edge-polished wafer to the first designated position; The edge-discharge loading and pushing device moves from the first standby position to below the first designated position, loads the edge-discharged wafer from the first designated position, and then moves back to the first standby position.

5. A conductive system for simultaneously cleaning edge and double polished wafer as claimed in claim 2 wherein, The dual-polishing wafer transfer subsystem is located in the first region, the edge-polishing wafer transfer subsystem and the wafer ejection subsystem are located in the second region, and the tank cleaning subsystem is located in the third region. The second region is located between the first region and the third region; When the second double-throw loading device is in the second standby position and the side-throw loading and pushing device is in the first standby position, the first double-throw loading device, the second double-throw loading device, the double-throw pushing device, and the side-throw loading and pushing device are arranged in a row in sequence. The edge-discharge wafer transfer subsystem and the edge-discharge loading and pushing device form a row.

6. A conductive method for simultaneously cleaning edge-polished and double-polished wafers, characterized by, Using a transfer system for simultaneous edge polishing and dual polishing wafer cleaning as described in any one of claims 1-5, including a transfer step for the dual polishing wafer cleaning process and a transfer step for the edge polishing wafer cleaning process; The transfer steps of the double-polished wafer cleaning process include: Step A1: The dual-polish wafer transfer subsystem transfers the first container holding the dual-polish wafer to the dual-polish ejection device; Step A2: The dual-polish ejection device ejects the dual-polished wafer from the first container box; Step A3: The second robotic arm picks up the double-polished wafer pushed out by the double-polishing ejection device and transfers it to the cleaning tank area; The transfer steps of the edge-polishing wafer cleaning process include: Step B1: The edge-polished wafer transfer subsystem removes the edge-polished wafer from the second container and positions it at the first designated location; Step B2: The edge-discharge loading and pushing device loads the edge-discharged wafer from the first designated position and returns to the first standby position; Step B3, the second robotic arm picks up the edge-polished wafer from the polishing and pushing device in the first standby position and transfers it to the cleaning tank area.

7. The conductive method for simultaneous edge polishing and double polishing wafer cleaning as described in claim 6, characterized in that, The dual-displacement wafer transfer subsystem includes a first dual-displacement loading device, a second dual-displacement loading device, and a first robotic arm. Step A1 includes: Step A11: The first dual-displacement loading device loads the liquid tank with the first container box from the outside and transfers it to the second dual-displacement loading device, and the dual-displacement wafer in the first container box is immersed in the liquid in the liquid tank; Step A12, the first machine removes the first container box containing the double-polished wafer from the liquid tank on the second double-polishing loading device and transfers it to the double-polishing ejection device.

8. The conductive method for simultaneous edge polishing and double polishing wafer cleaning as described in claim 7, characterized in that, The dual-polish wafer transfer subsystem further includes a third dual-polish loading device and a sliding device, wherein the second dual-polish loading device is mounted on the sliding device; In the transfer steps of the double-polished wafer cleaning process, after step A3, the process further includes: Step A4: The first robotic arm retrieves the empty first container from the double-throwing ejector and transfers it to the liquid tank on the second double-throwing loading device, which is in the second standby position. Step A5: The sliding device moves the second double-throw loading device linearly from the second standby position to the second designated position; Step A6: After the second double-throw loading device reaches the second designated position, it transfers the liquid tank with the empty first container box to the third double-throw loading device, which then ships the liquid tank with the first container box.

9. The conductive method for simultaneous edge polishing and double polishing wafer cleaning as described in claim 6, characterized in that, The edge-polishing wafer transfer subsystem includes an edge-polishing door opening device, an edge-polishing transfer device, and an edge-polishing positioning device; In the transfer steps of the edge-polishing wafer cleaning process, step B1 includes: Step B11, the edge polishing door opening device carries the second container box containing the edge polishing wafer and opens the second container box; Step B12, the edge-discharge transfer device forks out the edge-discharged wafer from the opened second container box and transfers it to the edge-discharge positioning device; Step B13, the edge-polishing positioning device positions and adjusts the edge-polished wafer to the first designated position; Step B14: The edge-spraying loading and pushing device moves from the first standby position to below the first designated position, loads the edge-spraying wafer from the first designated position, and then moves back to the first standby position.

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