Cooking vessel

Abstract

A cooking vessel (1) comprising a main cooking-vessel body (2), an add-on part (3) and an electronic device (4), wherein the main cooking-vessel body (2) comprises a base (5) and a wall (6) and wherein a receiving volume (7) is delimited by the base (5) and the wall (6), and the add-on part (3) is arranged on the outer side (8) of the wall (6) of the main cooking-vessel body (2), wherein the electronic device (4) is received in the add-on part (3), characterized in that the add-on part (3) comprises at least one outer cover (9), which, at least in a section facing the base, comprises at least one covering element (10) made of metal, wherein at least one potential-equalization element (11) is arranged between the covering element (10) and the outer side (8) of the wall (6).

Description

[0001] Description

[0002] "Cookware"

[0003] The present invention relates to a cookware or cooking vessel comprising at least one cookware base, at least one attachment, and at least one electronic device. The cookware base comprises at least one bottom and at least one wall, wherein the bottom and the wall define at least one receiving volume. The attachment is arranged on the outside of the wall of the cookware base, wherein the electronic device is received at least partially in the attachment.

[0004] Modern cookware, especially for induction cooking, includes sensors and / or a control unit depending on the design, and usually also involves communication between the cookware and the hob.

[0005] The necessary technology, such as a control unit, a communication unit and an energy storage device, is usually concealed in a type of housing on a wall of the cookware, with, for example, a so-called control panel being provided on the side of the cookware.

[0006] Even so-called smart cookware, or sensor cookware, is expected to meet the high visual demands of users. Therefore, a decorative cover is usually provided to conceal the electronic components in an aesthetically pleasing way.

[0007] Such a decorative panel should be made of metal, at least in the lower area or in the area facing the bottom of the cookware, since this area can heat up relatively quickly due to its proximity to the inductively heated base, which makes the use of, for example, plastic not always suitable.

[0008] A disadvantage of using metal for a bottom cover, or indeed for cookware in general, is that electromagnetic interference can couple into the metallic component, potentially leading to excessive heating or, in the worst case, even the formation of arcing between the cover and the cookware itself. Therefore, the object of the present invention is to provide so-called smart cookware in which the aforementioned disadvantages are avoided as far as possible.

[0009] This problem is solved by a cookware unit with the features of claim 1. Preferred embodiments of the invention are the subject of the dependent claims. Further advantages and features of the invention will become apparent from the exemplary embodiments.

[0010] The cookware according to the invention comprises at least one cookware base, at least one attachment, and at least one electronic device. The cookware base comprises at least one base and at least one wall, wherein the base and the wall define at least one receiving volume. The attachment is received on the outside of the wall of the cookware base, wherein the electronic device is received at least partially in the attachment. Furthermore, the attachment comprises at least one outer cover, which includes at least one metal cover element in at least one section facing the base of the cookware base, wherein at least one equipotential bonding element is arranged between the cover element and the outside of the wall.

[0011] The add-on component, in conjunction with the electronic device, provides in particular a so-called control panel, which is preferably arranged on the outside of, for example, a pot, thereby creating so-called smart cookware or sensor cookware. Such smart cookware includes in particular at least one sensor, for example on / in the base and / or also on / in the wall of the cookware body, in particular at least one temperature sensor. Furthermore, such cookware includes in particular at least one mainboard, at least one communication device, and / or at least one user interface. For example, a user interface is arranged in an upper area of ​​the control panel and preferably provides at least one operating device and / or at least one display device.In this way, smart cookware can communicate with a cooktop used for cooking, so that information about the cooking process can be displayed directly on the smart cookware to the user, and depending on the design, the user can also control the cooking process or make adjustments to the settings.

[0012] The cookware is, in particular, induction-compatible cookware, so that it can be used on an induction cooktop. The outer cover of the attachment is, in particular, a decorative panel, which is preferably intended to provide a visually appealing covering for the attachment. The outer cover or decorative panel, in particular, visually covers the entire attachment and extends, for example, from the base of the cookware body to an upper area of ​​the cookware body, or to the top of the attachment. Depending on the design, it is intended that a user interface or the display and control elements are not obscured by the decorative panel.

[0013] Depending on the design, the outer cover can also be made of multiple parts. In addition to the lower section, which is made of metal, an upper section made of plastic, for example, can also be included. The use of metal for the lower cover element is advantageous, or rather, chosen specifically, because excessive heat transfer can easily occur in this area of ​​the cover, which would be detrimental to other material choices.

[0014] The cookware according to the invention offers many advantages. A significant advantage is that by providing a potential equalization element between the metal cover element and the wall of the cookware body, good conductivity is achieved between the two components, thus minimizing differences in electrical potentials and enabling potential equalization.

[0015] By providing such a potential equalization element, it can be prevented that interference fields generated during cooking spread too strongly into the metal cover element, which would cause it to overheat or, in the worst case, even create arcs or voltage arcs between the cover element and the wall.

[0016] Furthermore, the provision of a potential equalization element can reduce the temperature at the metallic cover element or prevent excessive heating, as currents are diverted or returned to the cookware or the cookware base.

[0017] Preferably, the equipotential bonding element is suitable and designed to achieve contact between the cover element and the wall and / or the base of the cookware body in order to avoid or minimize different voltage potentials.

[0018] Preferably, the equipotential bonding element is made of an electrically conductive material, in particular an electrically conductive metal. This ensures that currents or interference fields jumping to the cover element have no negative effects on the cover element.

[0019] Preferably, the equipotential bonding element comprises at least one contact section for the wall and / or the base of the cookware body and / or at least one contact section for the cover element. Such contact sections provide particularly well-defined contact surfaces for the components, ensuring proper contact.

[0020] In advantageous further developments, at least one contact section is resiliently designed. Such a design preferably allows for good compensation of tolerances. A resiliently designed contact section can be achieved, for example, in the one-piece manufacturing of the equipotential bonding element by a stamping process, whereby the equipotential bonding element is subsequently bent into a corresponding shape that incorporates the contact sections. Particularly when using metal or sheet metal, a certain preload can be achieved in the contact sections, so that the components bend into the correct shape during assembly or adapt to the shape of the components for good contact.

[0021] Preferably, at least one contact point between the cover element and the equipotential bonding element is provided, at least in one lateral connection area between the cover element and the wall. This contact point is located at the connection points between the cover element and the outside of the wall, particularly in the left and right lateral areas. For this purpose, the equipotential bonding element can, for example, be provided essentially circumferentially or section by section, or it can only provide contact between the cover element and the equipotential bonding element, or between the equipotential bonding element and the wall, at specific sections.

[0022] In practical designs, the equipotential bonding element is manufactured as a single piece. This allows for the simple production of an equipotential bonding element, for example, through a stamping process followed by appropriate forming, which is also easy to install.

[0023] Particularly preferred is the contact between the equipotential bonding element and the wall and / or between the equipotential bonding element and the cover element, at least sectionally at specific points and / or at least sectionally around the entire circumference. In this way, suitable contact can be achieved depending on the specific design. In advantageous embodiments, the equipotential bonding element comprises at least one equipotential bonding plate. Such an equipotential bonding plate can, in particular, be designed as a cover plate or comprise larger contact surfaces for the wall and / or the cover element. Such an equipotential bonding plate is, in particular, formally adapted to the cover element and / or the wall, so that particularly good and preferably area-wide contact is achieved, thus enabling suitable equipotential bonding.

[0024] In preferred embodiments, the equipotential bonding element comprises at least one equipotential bonding stud. A (rather) point-like contact can also be achieved via an equipotential bonding stud, which is connected, for example, to the wall or the outer surface of the cookware body. In particular, several equipotential bonding studs are provided to achieve a particularly suitable and uniform contact and thus a suitable equipotential bonding.

[0025] Further advantages and features of the present invention will become apparent from the exemplary embodiments, which are explained below with reference to the accompanying figures.

[0026] The figures show:

[0027] Figure 1 is a purely schematic representation of an embodiment of a cookware according to the invention in an exploded view;

[0028] Figure 2 is a purely schematic representation of an embodiment of a cookware according to the invention in a cutaway side view;

[0029] Figure 3 is a purely schematic representation of an embodiment of a cookware according to the invention in a cutaway view with a detailed magnification of the equipotential bonding element;

[0030] Figure 4 is a purely schematic representation of an embodiment of a potential equalization element for a cookware according to the invention in a perspective view;

[0031] Figure 5 is a purely schematic representation of an embodiment of a cookware according to the invention with the equipotential bonding element according to Figure 4 in a perspective view; Figure 6 is a purely schematic representation of a further embodiment of an equipotential bonding element for a cookware according to the invention in a perspective view;

[0032] Figure 7 is a purely schematic representation of an embodiment of a cookware according to the invention with the potential equalization element according to Figure 6 in a perspective view.

[0033] Figure 1 shows a purely schematic exploded view of the cookware 1 according to the invention, which is here designed as a pot 100. The cookware 1 comprises a base 2, which includes a bottom 5 and a wall 6, which together define a receiving volume 7. In the embodiment shown here, handles 16 are provided on the outside of the wall 6 to facilitate moving the pot 100 or the cookware 1.

[0034] Furthermore, an attachment 3 is provided on the outer surface 8 of the wall 6, through which, in the embodiment shown here, a so-called control panel 17 is provided. An electronic device 4 is provided in the control panel 17 or in the attachment 3, whereby the cookware 1 becomes a smart cookware or a sensor cookware.

[0035] The sensors are not shown in the illustrated embodiment. However, various components of the electronic device 4 are visible. In particular, a user interface 18 is provided, through which a user can view information about the current cooking process and, depending on the configuration, also control the cooking process. Furthermore, the illustration shows that two energy storage devices 19 are provided, which supply energy to a mainboard 20 (not shown in detail).

[0036] Furthermore, a communication device (not shown) is provided, by means of which the cookware 1 can communicate with a connected cooktop. The cookware 1 is designed as an induction cookware, which can be used in conjunction with an induction cooktop.

[0037] The outer termination of the attachment 3 is formed by an outer cover 9, which here is designed as a decorative panel 25 and includes a lower cover element 10 made of metal 21. The upper part of the outer cover 9 is thus provided by a further cover element 10a, which here is made of plastic 22. The use of plastic offers the advantage that a lighter design of the control panel 17 or attachment 3 can be achieved, so that the overall weight of the cookware 1 is not unnecessarily increased. However, the lower cover element 10, which faces the base 5 of the cookware body 2, is made of metal 21, because excessive heat transfer to the lower area of ​​the cover 9 could occur during cooking. This is not critical when using metal 21 for the lower cover element 10.

[0038] However, the use of metal 21 can lead to the introduction of interference fields generated during cooking, which would cause the heating of the material or the cover element 10 to be excessive not due to the material itself, but for safety reasons for the user. This must be avoided.

[0039] For this purpose, a potential equalization element 11, not shown in Figure 1, is provided, which is explained in more detail in the following figures.

[0040] Figure 2 shows a purely schematic embodiment of a cookware 1 according to the invention in a cutaway side view. The basic structure of the cookware 1 essentially corresponds to the embodiment shown previously. For the sake of clarity, only the cookware base 2, the attachment 3, and the equipotential bonding element 11 are shown here.

[0041] The illustration shows that the attachment 3, which accommodates an electronic device 4 not shown here, is arranged on the outside 8 of the cookware base body 2.

[0042] This illustration further shows that a lower cover element 10 made of metal 21 is provided, with a potential equalization element 11 being provided between the outer surface 8 of the wall 6 and the metallic cover element 10, so that the different electrical potentials between the cover element 10 and the cookware body 2 or wall 6 and / or base 5 are minimized in order to achieve potential equalization. This prevents excessive heating and the formation of arcs between the cover element 10 and the wall 5. For this purpose, the potential equalization element 11 is made of a conductive material 12.

[0043] Figure 3 shows a further embodiment of a cooking vessel 1 according to the invention in a cutaway view from below, wherein the structure of this cooking vessel 1 again corresponds to the basic structure of the embodiments described above according to Figures 1 and 2.

[0044] In the illustrated embodiment, a sectional view from below shows that a potential equalization plate 14, acting as a potential equalization element 11, effects a predetermined contact between the cover element 10 and the wall 6 of the cookware base body 2.

[0045] To illustrate the shape of the potential equalization element 11 more precisely, the potential equalization element 11 is shown separately again next to the cooking utensil 1.

[0046] To achieve particularly good and reliable contact between the equipotential bonding element 11 and the cover 10 or wall 6, the equipotential bonding element 11 comprises two separate contact sections 23 for the wall 6 and an elongated contact section 24 for the lower cover element 10. It is further shown that the contact sections 23 and 24 are formally adapted to the wall 6 and the cover element 10, respectively. This ensures sufficient and reliable contact for equipotential bonding.

[0047] The contact sections 23, 24 can also be designed to be spring-loaded, so that tolerances can be compensated for and stable contact between individual components can be ensured.

[0048] Figures 4 and 5 show an embodiment of a potential equalization element 11 for a cookware 1 according to the invention in a purely schematic way in a perspective view alone and in a representation attached to a cookware base body 2.

[0049] The potential equalization element 11 is designed as a single piece, whereby a corresponding sheet metal part is cut out by a punching process, which is then formed accordingly.

[0050] Here too, the contact sections 23, 24 for the cover element 10 and the wall 6 are known. In the embodiment shown here, as already provided in Figure 3, the cover element 10 is coupled to the wall via the equipotential bonding element 11, particularly in the connection area 13, on the left and right sides, in such a way that a suitable equipotential bonding is provided.

[0051] Figures 6 and 7 show another embodiment of a potential equalization element 11, in which a different shape is provided. Here too, the potential equalization element 11 is manufactured in one piece by a stamping process and bent accordingly. Contact sections 23, 24 are also provided here to ensure particularly good contact between the potential equalization element 11 and the cover 9 or cover element 10, especially in the connection area 13.

[0052] In the embodiments shown above, additional equipotential bonding bolts 15 are provided. These equipotential bonding bolts 15 further enhance equipotential bonding and provide even better protection against excessive heating.

[0053] Reference symbol list

[0054] 1 cookware

[0055] 2 Cookware bases

[0056] 3 Attachment part

[0057] 4 Electronic equipment

[0058] 5 Floor

[0059] 6 wall

[0060] 7 Recording volume

[0061] 8 Outside

[0062] 9 outer cover

[0063] 10 Cover element

[0064] 10a Cover element

[0065] 11 Potential equalization element

[0066] 12 conductive material

[0067] 13 Connection area

[0068] 14 Potential equalization plate

[0069] 15 potential equalization bolts

[0070] 16 handle

[0071] 17 Control panel

[0072] 18 User Interface

[0073] 19 Energy storage

[0074] 20 Mainboard

[0075] 21 Metal

[0076] 22 plastic

[0077] 23 Contact section

[0078] 24 Contact section

[0079] 25 decorative trim

[0080] 100 pots

Claims

Patent claims 1.Cookware (1) comprising at least one cookware base (2), at least one attachment (3) and at least one electronic device (4), wherein the cookware base (2) comprises at least one bottom (5) and at least one wall (6) and wherein at least one receiving volume (7) is defined by the bottom (5) and the wall (6), wherein the attachment (3) is arranged on the outside (8) of the wall (6) of the cookware base (2), wherein the electronic device (4) is received at least partially in the attachment (3), characterized in that the attachment (3) comprises at least one outer cover (9) which comprises at least one cover element (10) made of metal (16) in at least one section facing the bottom (5) of the cookware base (2), wherein at least one equipotential bonding element (11) is arranged between the cover element (10) and the outside (8) of the wall (6) of the cookware base (2).

2. Cookware (1) according to claim 1, wherein the equipotential bonding element (11) is suitable and designed to achieve contact between the cover element (10) and the wall (6) and / or the base (5) in order to avoid different voltage potentials.

3. Cookware (1) according to one of the preceding claims, wherein the equipotential bonding element (11) is made of an electrically conductive material (12), in particular of an electrically conductive metal.

4. Cookware (1) according to one of the preceding claims, wherein the equipotential bonding element (11) comprises at least one contacting section (23) for the wall (6) and / or the base (5) and / or at least one contacting section (24) for the cover element (10).

5. Cookware (1) according to the preceding claim, wherein at least one contacting section (23, 24) is resiliently designed.

6. Cookware (1) according to one of the preceding claims, wherein contact between cover element (10) and equipotential bonding element (11) takes place at least in a lateral connection area (13) of cover element (10) and wall (6).

7. Cookware (1) according to one of the preceding claims, wherein the equipotential bonding element (11) is manufactured in one piece.

8. Cookware (1) according to one of the preceding claims, wherein contact between potential equalization element (11) and wall (6) and / or between potential equalization element (11) and cover element (10) is at least sectionally pointwise and / or at least sectionally circumferential.

9. Cookware (1) according to one of the preceding claims, wherein the equipotential bonding element (11) comprises at least one equipotential bonding plate (14).

10. Cookware (1) according to one of the preceding claims, wherein the equipotential bonding element (11) comprises at least one equipotential bonding bolt (15).

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