Server chassis and server

Abstract

The present application relates to the technical field of computers, and specifically to a server chassis and a server. The server chassis comprises a housing, a limiting assembly, and a power supply connection assembly, wherein the housing comprises an accommodating chamber, the accommodating chamber comprising a first opening and a second opening configured for constituent modules of a server to pass therethrough; the limiting assembly comprises a centrally positioned backplane, which is disposed in the accommodating chamber; the power supply connection assembly comprises several connectors disposed on the centrally positioned backplane; the connectors disposed on the centrally positioned backplane face the first opening or the second opening, and are configured to detachably connect to connecting members disposed on the surface of the constituent modules; and when the connectors are assembled with the connecting members, the connectors are electrically connected to the connecting members.

Description

Server chassis and servers

[0001] Cross-reference to related applications

[0002] This application claims the benefit and priority of Chinese Patent Application No. 202411804511.9, filed on December 10, 2024, entitled "Server Chassis and Server", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of computer technology, and in particular to a server chassis and a server. Background Technology

[0004] As the internet increasingly demands AI (Artificial Intelligence) computing, big data applications, and inference training, the demand for AI servers is also growing rapidly. Typically, the core components of an AI server are the GPU and its corresponding CPU. The GPU is used for computing and inference. The GPU and CPU are usually directly connected via a bus such as PCIe (Peripheral Component Interconnect Express), enabling the CPU to manage the GPU and transfer data.

[0005] Taking a PCIe standard GPU as an example, to maximize the computing efficiency of a single server, AI servers typically assemble as many GPUs as possible. Therefore, compared to conventional general-purpose servers, AI servers are larger and often taller, such as AI servers in 4U or 8U server chassis. Here, "U" is a unit representing the external dimensions of a server, an abbreviation for "unit," where 1U is 4.445 cm.

[0006] In AI servers with related technologies, the interconnection between modules such as GPU modules and CPU modules, GPU modules and power modules, CPU modules and power modules, and CPU modules and heat dissipation modules is often achieved through PCIe SW (Switch) chips, or by directly connecting the ports between the modules through cables.

[0007] Taking the GPU and CPU of an 8U server as an example, the GPU module and CPU module can each occupy 4U of chassis height. The server chassis is designed to provide power supply, heat dissipation, and high-speed signal interconnection for each component, which is uniformly provided to the GPU module and CPU module. Therefore, the various components within the server are usually designed as a whole, and their power supply, heat dissipation, and signal interconnection are designed as a whole, resulting in a tightly coupled design between the two 4U units of the GPU module and the CPU module.

[0008] Specifically, the GPU module and CPU module each occupy a 4U space in the upper and lower sections of the server chassis. The power supply, cooling, and high-speed interconnect between the GPU and CPU all need to span these 4U spaces. The peripheral cards, motherboard, PSU (PC Power Supply Unit), power supply board, and fan board are also typically directly coupled, meaning that affecting one component can have a ripple effect. In other words, the numerous interconnecting cables and conduits between the various modules create a complex network, making it difficult to maintain individual modules independently.

[0009] In detail, when maintenance is required on the internal components of a server, the relatively high height of an 8U chassis often prevents direct access to the lower levels. Therefore, the upper structure and circuit boards must be completely disassembled, and the interconnecting cables and conduits must be removed before maintenance can be performed on the lower components. Furthermore, the entire server chassis is approximately 35cm high. Even after removing the upper structure, mechanical limitations may still require maintenance personnel to extend their entire arm into the server chassis to reach the components at the bottom, making the repair process extremely difficult.

[0010] Therefore, in the actual operation and maintenance of servers, it may be necessary to remove the server chassis from the rack and return it to the operation and maintenance center so that the entire server system can be disassembled using special tools before operation and maintenance can be carried out, which causes serious waste in terms of time and operation and maintenance costs. Summary of the Invention

[0011] To address the technical challenges of assembling and maintaining servers with complex internal structures, a server chassis and server are provided that can decouple the various internal modules of the server, enabling blind insertion and rapid disassembly of the modules, thereby improving the assembly and maintenance efficiency of server modules.

[0012] On one hand, a server chassis is provided, comprising: a housing, a limiting component, and a power supply connection component; the housing includes a receiving cavity, the receiving cavity including a first opening and a second opening for the passage of server components; the limiting component includes a central backplate disposed in the receiving cavity; the power supply connection component includes a plurality of connectors disposed on the central backplate, the connectors on the central backplate facing the first opening or facing the second opening, for detachable connection with connectors disposed on the surface of the components; when the connectors and connectors are assembled, they are electrically connected; wherein, detachable connection means that when a non-connecting part of the components is subjected to a force along a reference direction, the components move relative to the central backplate, allowing the connectors of the components and their corresponding connectors to be coaxially assembled or separated, without needing to distinguish the front and back directions, up and down and left and right positions of the connectors and connectors; the reference direction is parallel to the relative direction of the first opening and the second opening.

[0013] In some embodiments, the server chassis further includes a relay connector; wherein the constituent modules include a first module and a second module, and the relay connector is used to detachably connect to the first module and the second module respectively. When both the first module and the second module are connected to the relay connector, the first module is electrically connected to the second module through the relay connector.

[0014] In some embodiments, the limiting assembly further includes a limiting member disposed on the side of the central back plate facing the first opening; a transfer connector is disposed on the side of the limiting member facing the first opening; the transfer connector includes a first connecting portion and a second connecting portion, the relative directions of the first connecting portion and the second connecting portion being perpendicular to the reference direction; the first connecting portion is used for detachable connection with a connector on the side surface of the first module facing it; the second connecting portion is used for detachable connection with a connector on the side surface of the second module facing it; wherein, the first module and the second module are movably disposed on the side of the transfer connector facing the first opening, and their movable directions are parallel to the reference direction; the relative directions of the first module and the second module are perpendicular to the reference direction.

[0015] In some embodiments, the server chassis further includes an internal heat dissipation component and a heat dissipation connection component, both disposed in the accommodating cavity; the internal heat dissipation component is connected to the heat dissipation connection component, and the heat dissipation connection component is used to connect to the component module to be cooled, so that the internal heat dissipation component is detachably connected to the component module to be cooled through the heat dissipation connection component.

[0016] In some embodiments, the server chassis further includes liquid pipelines and heat dissipation connection components; the heat dissipation connection components include a first pipeline connector and a second pipeline connector disposed at both ends of the liquid pipelines; wherein, the first pipeline connector is disposed in the housing and is used to connect to an external liquid source; the second pipeline connector is disposed in the accommodating cavity and is used to detachably connect to the liquid channel constituting the module.

[0017] In some embodiments, at least one connector of the power supply connection assembly includes a blind-mating connector; and / or, at least one conduit connector of the heat dissipation connection assembly includes a quick-release blind-mating connector; and / or, the server chassis further includes a relay connector for connecting to a first module and a second module of the server respectively to relay electrical signals between them; the relay connector includes a blind-mating connector.

[0018] In some embodiments, the server chassis further includes a moving channel disposed in the accommodating cavity, with one side opening facing a first opening or a second opening and the other side opening facing a central backplate, for moving the component modules along the moving channel.

[0019] On the other hand, a server is provided, comprising: a modular server chassis; the modular components include a heat dissipation module, a graphics processor module, a central processing unit module, and a power supply module; the modular components are disposed in the server chassis; the server chassis includes a shell, a limiting component, and a power supply connection component; the shell includes a receiving cavity, the receiving cavity including a first opening and a second opening for the modular components of the server to pass through; the limiting component includes a central backplate, the central backplate being disposed in the receiving cavity; the power supply connection component includes a plurality of connectors disposed on the central backplate, the connectors disposed on the central backplate facing the first opening or facing the second opening, for detachable connection with connectors disposed on the surface of the modular components; when the connectors and connectors are assembled, they are electrically connected; wherein, detachable connection means that when a non-connecting part of the modular component is subjected to a force along a reference direction, the modular component moves relative to the central backplate, causing the connectors of the modular component and their corresponding connectors to be coaxially assembled or separated, without needing to distinguish the front and back directions, up and down and left and right positions of the connectors and connectors; the reference direction is parallel to the relative directions of the first opening and the second opening.

[0020] In some embodiments, at least one component module includes: a module housing, a module functional body, and a plurality of connectors; the connectors are disposed on the surface of the module housing; the module functional body is disposed inside the module housing; the connectors are electrically connected to the module functional body and are also used for detachable connection with a connector disposed on a central backplate.

[0021] In some embodiments, the limiting component includes a limiting member disposed on the side of the central back plate facing the first opening; a transfer connector is provided on the side of the limiting member facing the first opening; the graphics processor module and the central processing unit module are detachably connected to the transfer connector via connectors, and the interaction signals between the graphics processor module and the central processing unit module are transmitted via the transfer connector.

[0022] In some embodiments, the graphics processor module includes a first housing, and the graphics processor is disposed inside the first housing; a first connector is provided on the surface of the first housing facing the relay connector for detachable connection with the relay connector, and is connected to the graphics processor inside the first housing via a first connecting line; when the graphics processor module is moved, the graphics processor, the first connecting line and the first connector move with the first housing.

[0023] In some embodiments, the central processing unit module includes a second housing, and the central processing unit is disposed inside the second housing; a second connector is provided on the surface of the second housing facing the relay connector for detachable connection with the relay connector, and is connected to the central processing unit inside the second housing via a second connecting line; when the central processing unit module is moved, the central processing unit, the second connecting line and the second connector move with the second housing.

[0024] In some embodiments, the graphics processor module is disposed on the side of the central backplate facing the first opening; the power supply connection assembly includes a power supply connector disposed on the side of the central backplate facing the first opening; a third connector is provided on the surface of the graphics processor module facing the central backplate, which is detachably connected to the power supply connector disposed on the central backplate.

[0025] In some embodiments, the graphics processor module includes a graphics processor and a power input component; a third connector is disposed on the side of the power input component facing the center backplate; the graphics processor is disposed on the side of the power input component away from the center backplate, and the graphics processor is electrically connected to the power input component for receiving power input through the center backplate and the power input component.

[0026] In some embodiments, the power input component includes an abutment portion and a main body portion; the server chassis includes a limiting member; a third connector is disposed on the abutment portion; the side of the main body portion away from the abutment portion is connected to the graphics processor; the main body portion is surrounded to form a clearance groove, and the limiting member is disposed in the clearance groove; the graphics processor module also includes a first connector, which is detachably connected to a first connection portion of a transfer connector disposed on the limiting member, and the third connector is also electrically connected to the graphics processor.

[0027] In some embodiments, the graphics processor module further includes a cooling component; the cooling component is disposed on the graphics processor and is used to dissipate heat from the graphics processor; when the graphics processor module is moved, the graphics processor, the power input component, and the cooling component work together.

[0028] In some embodiments, the server chassis includes liquid lines and a first pipe connector and a second pipe connector located at both ends of the liquid lines; the cooling assembly includes a liquid cooling connector, multiple cooling plates, a liquid channel, and a distribution component; the cooling plates abut against the graphics processor; the liquid cooling connector is located on the surface of the graphics processor facing the second pipe connector; both ends of the liquid channel are connected to the liquid cooling connector and the cooling plates respectively, and the liquid cooling connector is detachably connected to the second pipe connector to allow coolant to flow through the liquid lines, the liquid channel, and the cooling plates; the liquid channel is connected to the cooling plates through the distribution component; the coolant flows into the distribution component through the liquid channel and is distributed to each cooling plate to dissipate heat from the graphics processor.

[0029] In some embodiments, the central processing unit module is disposed on the side of the central back panel facing the first opening; the surface of the central processing unit module facing the central back panel is provided with a second connector, which is connected to the central processing unit and is also detachably connected to the relay connector.

[0030] In some embodiments, the relay connector includes a first connecting portion and a second connecting portion; wherein, a first direction is parallel to the relative direction of the central processing unit module and the graphics processing unit module, and the first direction is also perpendicular to a reference direction; wherein, the first direction is the relative direction of the first connecting portion and the second connecting portion; the connector of the first connecting portion is detachably connected to a first connector of the graphics processing unit module, and the connector of the first connecting portion is electrically connected to the graphics processing unit through the first connector; the connector of the second connecting portion is detachably connected to a second connector, and the connector of the second connecting portion is electrically connected to the central processing unit through the second connector.

[0031] In some embodiments, the central processing unit outputs a graphics management signal, which is used to manage the working state of the graphics processor module. The graphics management signal is transmitted to the relay connector via the first connector and then to the second connector via the relay connector, so as to the graphics processor module.

[0032] In some embodiments, a heat dissipation module is disposed on the side of the central processing unit module facing the second opening; a fourth connector is provided on the surface of the heat dissipation module facing the central processing unit module, and a fifth connector is provided on the surface of the central processing unit module facing the heat dissipation module; the fourth connector and the fifth connector are detachably connected, so that the central processing unit module and the heat dissipation module can interact through the fourth connector and the fifth connector.

[0033] In some embodiments, the heat dissipation module is electrically connected to the power supply module to receive the power supply energy output by the power supply module; when the fourth connector and the fifth connector are connected, part of the power supply energy is input to the central processing unit module through the fourth connector and the fifth connector to supply power to the central processing unit module.

[0034] In some embodiments, the central processing unit of the central processing unit module outputs a thermal management signal, which is used to manage the working state of the thermal management module; the thermal management signal is transmitted to the thermal management module via the fifth connector and the fourth connector.

[0035] In some embodiments, the heat dissipation module includes a cooling fan, a fan power supply assembly, and a sixth connector; the cooling fan is disposed on the side of the fan power supply assembly facing the second opening, and the cooling fan is detachably connected to the fan power supply assembly; the fan power supply assembly is provided with a fourth connector; the sixth connector is disposed on the surface of the heat dissipation module facing the central backplate; the sixth connector is electrically connected to the fourth connector, and the sixth connector is also electrically connected to the power supply module.

[0036] In some embodiments, the power supply connection assembly further includes a heat dissipation connector disposed on the side of the central backplate facing the second opening; the heat dissipation connector is detachably connected to the sixth connector; the central backplate is also electrically connected to the power module, and the power output from the power module is transmitted to the heat dissipation module through the central backplate, the heat dissipation connector and the sixth connector.

[0037] In some embodiments, the power module is disposed on the side of the central back panel facing the second opening; the power module is provided with a seventh connector; the power supply connection assembly further includes a power connector disposed on the side of the central back panel facing the second opening; the seventh connector is detachably connected to the power connector.

[0038] In some embodiments, the power supply module outputs power to the central backplane, and a portion of the power is transmitted to the graphics processor module via the central backplane; a portion of the power is transmitted to the heat dissipation module via the central backplane, and the heat dissipation module transmits a portion of the received power to the central processing unit module.

[0039] In some embodiments, the central processing unit module is electrically connected to the heat dissipation module, and the heat dissipation module is electrically connected to the center backplane; the central processing unit of the central processing unit module outputs a power management signal, which is transmitted to the center backplane via the heat dissipation module, and then to the power module via the power connector and the seventh connector, so as to manage the working status of the power module through the power management signal. Attached Figure Description

[0040] To more clearly illustrate the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 is a structural schematic diagram of an embodiment of the server chassis of this application;

[0042] Figure 2 is a structural schematic diagram of an embodiment of the server chassis of this application, omitting the shell and the moving channel;

[0043] Figure 3 is a schematic diagram of the structure of a server according to an embodiment of this application;

[0044] Figure 4 is a structural schematic diagram of an embodiment of the server shown in Figure 3 with the shell omitted;

[0045] Figure 5 is a schematic diagram of the structure of an embodiment of the graphics processor module, central processing unit module, limiting member and transfer connector of this application;

[0046] Figure 6 is a structural schematic diagram of an embodiment of the limiting member, transfer connector, first connector and second connector of this application;

[0047] Figure 7 is a schematic diagram of the liquid cooling related structure and a central backplate of an embodiment of this application;

[0048] Figure 8a is a schematic diagram of an embodiment of the assembly of the limiting component, the transfer processor and the graphics processor module of this application;

[0049] Figure 8b is a structural schematic diagram of an embodiment of the discrete graphics processor module shown in Figure 8a;

[0050] Figure 9 is a schematic diagram of an embodiment of the fan power supply assembly and central processing unit of this application;

[0051] Figure 10 is a structural schematic diagram of an embodiment of the heat dissipation module of this application;

[0052] Figure 11 is a structural schematic diagram of an embodiment of the heat dissipation module and the central backplate of this application;

[0053] Figure 12a is a schematic flowchart of an embodiment of transmitting electrical power according to this application;

[0054] Figure 12b is a flowchart illustrating an embodiment of transmitting thermal management signals according to this application;

[0055] Figure 12c is a flowchart illustrating an embodiment of the power management signal transmission in this application. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0057] This application provides a server chassis and a server. The server chassis includes a housing, a limiting component, and a power supply connection component. The housing includes a receiving cavity with a first opening and a second opening for the passage of server components. The limiting component includes a central backplate disposed within the receiving cavity. The power supply connection component includes a plurality of connectors disposed on the central backplate, the connectors facing the first opening or the second opening, for detachable connection with connectors disposed on the surface of the components. When the connectors and connectors are assembled, they are electrically connected. The detachable connection means that when a non-connecting part of the component is subjected to a force along a reference direction, the component moves relative to the central backplate, allowing the connectors and their corresponding connectors to be coaxially assembled or separated without needing to distinguish the front / back or left / right positions of the connectors. The reference direction is parallel to the relative directions of the first and second openings. The detailed structure and working principle of this application are illustrated below.

[0058] Please refer to Figures 1 to 4. Figure 1 is a structural schematic diagram of an embodiment of the server chassis of this application. Figure 2 is a structural schematic diagram of an embodiment of the server chassis of this application without the shell and the moving channel. Figure 3 is a structural schematic diagram of an embodiment of the server of this application. Figure 4 is a structural schematic diagram of an embodiment of the server shown in Figure 3 without the shell.

[0059] In one embodiment, the server chassis 10 includes a housing 11, a limiting component 12, and a power supply connection component 13.

[0060] The housing 11 serves as the basic carrier of the server chassis 10 and the server, and can bear and protect the various components of the server chassis 10 and the server. The housing 11 may include a cavity 111 for storing the internal structure of the server chassis 10 and the component modules of the server.

[0061] The accommodating cavity 111 may include a first opening 112 and a second opening 113.

[0062] The first opening 112 and the second opening 113 are used for the passage of server components. In simpler terms, server components can be inserted into or removed from the receiving cavity 111 through the first opening 112 and the second opening 113. For example, when the casing 11 of the server chassis 10 has a relatively regular shape, such as a cuboid, cylinder, or cube, the first opening 112 and the second opening 113 can be respectively located on opposite sides of the receiving cavity 111.

[0063] The limiting component 12 may include a central backplate 121. The central backplate 121 may be such as an MBP (backplane board), etc., and is not limited here.

[0064] The connector located on the central backplate 121 faces either the first opening 112 or the second opening 113. For example, the central backplate 121 is located in the receiving cavity 111 and on the relative path between the first opening 112 and the second opening 113. When the component module is fed into the receiving cavity 111 through the first opening 112 or the second opening 113, the central backplate 121 can be located on the movement path of the component module, so as to assemble the component module extending from the first opening 112 or the second opening 113 onto the central backplate 121, so as to remove the component module through the first opening 112 or the second opening 113.

[0065] The power supply connection assembly 13 includes several connectors located on the central backplane 121.

[0066] The connector located on the central backplate 121 is used for detachable connection with the connectors located on the surface of the module. Detachable connection means that when a non-connector portion of the module is subjected to a force along the reference direction X, the module moves relative to the central backplate 121, allowing the connectors and their corresponding connectors to be coaxially assembled or separated. This eliminates the need to distinguish the orientation or position of the connectors; in this embodiment, detachable connection means that blind mating of the connectors and connectors is possible. The reference direction X is parallel to the relative direction of the first opening 112 and the second opening 113.

[0067] In this embodiment, at least one component module can be detachably connected to the center backplate 121. For example, at least one of the graphics processor module 20, central processing unit module 30, heat dissipation module 40, and power supply module 50 can be detachably connected to the center backplate 121. Alternatively, some component modules, such as the central processing unit module 30, may not be detachably connected to the center backplate 121, while the remaining component modules are detachably connected to the center backplate 121. In this case, when assembling the component modules detachably connected to the center backplate 121, maintenance personnel can achieve assembly of the component modules to the center backplate 121 without directly controlling the movement direction of the connectors of the component modules or manually assembling them with the connectors provided on the center backplate 121 by roughly assessing the movement direction and the limiting structure of the component modules. Furthermore, when disassembling the component module that is detachably connected to the central backplate 121, the component module can be separated from the central backplate 121 by applying force to the non-connecting parts of the component module.

[0068] Furthermore, in this embodiment, the central backplane 121 can be connected to a power source. The power source can be the internal power module 50 of the server or an external power source; this is not limited here. If so, power can be supplied to the component modules connected to the central backplane 121 through the central backplane 121 and the power supply connection assembly 13. That is, when the connector on the central backplane 121 is assembled with the connector on the component module, the assembled connector and connector are electrically connected, thereby achieving an electrical connection between the central backplane 121 and the component module, thus enabling power to be supplied to the component modules through the central backplane 121.

[0069] In this embodiment, a central backplane 121 is provided inside the accommodating cavity 111 of the server chassis 10, and the central backplane 121 is provided with a power supply connection assembly 13. This decouples the server's component modules. Thus, at least one component module can be detachably connected to the central backplane 121 via a connector located on the component module and a connector located on the central backplane 121. In other words, this application enables blind insertion and rapid disassembly of at least one component module, thereby improving the assembly and maintenance efficiency of the server's component modules.

[0070] Optionally, at least one connector of the power supply connection assembly 13 includes a blind-mating connector. Accordingly, the connectors of the constituent modules connected to the power supply connection assembly 13 may also include blind-mating connectors to reduce the tedious work of carefully identifying and aligning the interfaces when assembling the constituent modules, thereby enabling quick assembly or disassembly of the constituent modules.

[0071] Please refer to Figures 1 through 4. In one embodiment, the server chassis 10 also includes a relay connector 14.

[0072] A server typically comprises multiple modules. One of these modules can be designated as the first module, and another as the second module. In other words, a server consists of both the first and second modules. As illustrated in Figure 4, the first module could be a graphics processing unit (GPU) module 20, and the second module could be a central processing unit (CPU) module 30; this is not a limitation.

[0073] The relay connector 14 can be detachably connected to both the first module and the second module, allowing them to connect to each other. The relay connector 14 relays signals between the first and second modules, enabling a high-speed signal connection. Furthermore, it decouples the first and second modules, reducing the impact on the other when one is installed, removed, or maintained individually.

[0074] Specifically, when both the first module and the second module are connected to the relay connector 14, the first module is electrically connected to the second module through the relay connector 14, and the signal between the first module and the second module can be transmitted through the relay connector 14.

[0075] Furthermore, the limiting component 12 may also include a limiting member 122. The limiting member 122 may be disposed on the side of the central back plate 121 facing the first opening 112. The transit connector 14 is disposed on the side of the limiting member 122 facing the first opening 112. The limiting member 122 can limit the position of the transit connector 14 in the receiving cavity 111. The first module and / or the second module can extend into the receiving cavity 111 through the first opening 112. On its travel path, the connector on its surface can correspond to the transit connector 14. When the connector abuts against the transit connector 14 and is further subjected to force, the connector can be assembled to the transit connector 14, thereby realizing the assembly of the first module and / or the second module with the transit connector 14.

[0076] Furthermore, the transfer connector 14 may include a first connecting portion 141 and a second connecting portion 142. The relative directions of the first connecting portion 141 and the second connecting portion 142 are perpendicular to the reference direction X.

[0077] The first connecting part 141 is detachably connected to a connector on the side surface of the first module facing thereto. The second connecting part 142 is detachably connected to a connector on the side surface of the second module facing thereto.

[0078] When the server chassis 10 is correctly positioned, the relative orientation of the first module and the second module can be parallel to the direction of gravity, and the reference direction X is perpendicular to the direction of gravity. The first module and the second module are movably disposed on the side of the relay connector 14 facing the first opening 112, and their movability is parallel to the reference direction X. The relative orientation of the first module and the second module is perpendicular to the reference direction X.

[0079] Optionally, the transfer connector 14 may include a blind-mating connector.

[0080] Therefore, at least one of the first connecting portion 141 and the second connecting portion 142 may be provided with a blind-mating connector. For example, both the first connecting portion 141 and the second connecting portion 142 may be provided with blind-mating connectors to achieve blind mating with the first module and the second module, respectively.

[0081] The first and second modules will be illustrated with examples of the specific components of the server later, and will not be repeated here.

[0082] Please refer to Figures 1 through 4. In one embodiment, the server chassis 10 further includes an internal heat dissipation assembly and a heat dissipation connection assembly 16, both disposed in the receiving cavity 111.

[0083] The heat dissipation components inside the box are connected to the heat dissipation connection components 16.

[0084] The heat dissipation connection component 16 is used to connect to the component module to be cooled. Thus, in this embodiment, the heat dissipation component inside the enclosure can be detachably connected to the component module to be cooled via the heat dissipation connection component 16.

[0085] Specifically, the internal heat dissipation components may include liquid piping.

[0086] The heat dissipation connection assembly 16 may include a first pipe connector 161 and a second pipe connector 162 located at both ends of the liquid pipe.

[0087] The first pipe connector 161 is located in the housing 11 and is used to connect to an external liquid source. The second pipe connector 162 is located in the accommodating cavity 111 and is used to detachably connect to the liquid channel 242 of the component module. Thus, the component module can be cooled by liquid cooling, and during the assembly of the component module, the liquid cooling-related connectors can be detachably connected to the second pipe connector 162, improving the loading and unloading efficiency of the liquid cooling components within the server chassis 10.

[0088] Optionally, at least one pipe connector in the heat dissipation connection assembly 16 includes a quick-release blind-fit connector to enable blind-fitting of the liquid cooling section, thereby further improving the loading and unloading efficiency of the liquid cooling section.

[0089] Please refer to Figures 1 through 4. In one embodiment, the server chassis 10 also includes a movement channel 17.

[0090] The moving channel 17 can be disposed in the receiving cavity 111. One side of the moving channel 17 faces the first opening 112 or the second opening 113, and the other side faces the central backplate 121, for moving the component module along the moving channel 17. That is, the component module that can be detachably connected to the central backplate 121 can move through the moving channel 17. At the same time, the moving channel 17 can limit the position of the component module. During the process of the component module extending into the receiving cavity 111, the connectors on the surface of the component module can correspond to the connectors disposed in the central backplate 121, and / or, the connectors of the first module and the second module can correspond to the transfer connector 14, and / or, the liquid cooling related connectors of the component module can correspond to the second pipeline connector 162. This can reduce the tedious work of manually aligning connectors and connectors, which is beneficial to reducing the difficulty of production assembly. The component module can be blindly inserted into the server chassis 10, omitting the process of interconnecting and assembling between component modules, and significantly improving production and processing efficiency.

[0091] The following provides an example illustrating the specific structure of the server in this application. The internal power supply transmission paths and management signal transmission paths of the server will be described in detail later.

[0092] Please refer to Figures 2 through 4. In one embodiment, the server includes component modules and a server chassis 10.

[0093] As illustrated in the examples above, the modules may include a heat dissipation module 40, a graphics processor module 20, a central processing unit module 30, and a power supply module 50.

[0094] The server chassis 10 can be as described in any of the embodiments above, and will not be repeated here. The following will describe in detail the cooperation between each component module and the structure of the server chassis 10, as well as the cooperation between the component modules, in conjunction with the specific component modules of the server.

[0095] Please refer to Figures 2 to 5. Figure 5 is a schematic diagram of the structure of an embodiment of the graphics processor module, central processing unit module, limiting member, and transfer connector of this application.

[0096] In one embodiment, the limiting component 12, as described above, includes a limiting member 122. In this embodiment, the graphics processor module 20 can be used as a first module, and the central processing unit module 30 can be used as a second module.

[0097] The graphics processing unit (GPU) module 20 can be detachably connected to the intermediate connector 14 via a connector on its surface. The central processing unit (CPU) module 30 can be detachably connected to the intermediate connector 14 via a connector on its surface. Thus, when both the GPU module 20 and the CPU module 30 are mounted on the intermediate connector 14, the interaction signals between them can be transmitted via the intermediate connector 14.

[0098] In one embodiment, at least one component module includes a module housing, a module functional body, and a plurality of connectors. As the name suggests, the module functional body is a component capable of realizing the relevant functions of the component module. For example, the module functional body of the graphics processor module 20 is the graphics processor 21, the module functional body of the central processing unit module 30 is the central processing unit 31, and so on. The module functional bodies of other component modules will not be described in detail here.

[0099] The connector is located on the surface of the module housing; the module functional body is located inside the module housing; the connector is electrically connected to the module functional body and is also used for detachable connection with the connector located on the central backplate.

[0100] The following describes the data transmission related structure of the graphics processor module 20 of this application.

[0101] Please refer to Figures 2 through 5. In one embodiment, the graphics processor module 20 may include a first housing, a graphics processor 21, and a first connection line 22.

[0102] The surface of the first housing facing the transfer connector 14 is provided with a first connector 201. The first connector 201 is a connector for detachable connection with the transfer connector 14.

[0103] The graphics processor 21 and the first connecting line 22 may be located inside the first housing. The first connector 201 is connected to the graphics processor 21 through the first connecting line 22 inside the first housing.

[0104] Thus, when loading or unloading the graphics processor module 20, the graphics processor module 20 can be moved by the force applied to the first housing, and the graphics processor 21, the first connecting cable 22, and the first connector 201 can move along with the first housing. In other words, when the first housing is moved by force, the first connector 201 moves in conjunction with the first housing, thereby reducing the force on the first connecting cable 22 inside the first housing during the process of loading or unloading the graphics processor module 20, which helps to protect the first connecting cable 22.

[0105] Optionally, the graphics processor module 20 may include a plurality of graphics processors 21. As illustrated in Figures 3 to 6, Figure 6 is a schematic diagram of an embodiment of the limiting member, the transfer connector, the first connector, and the second connector of this application.

[0106] The graphics processing unit module 20 includes N implementations of GPUs (Graphics Processing Units, GPUs 21), namely GPU_0, GPU_1, ..., GPU_N; correspondingly, the number of intermediate connectors 14 can be N, namely C0, C1, ..., C N The number of first connectors 201 on the surface of the first housing can be N, namely D0, D1, ..., D2. N .

[0107] In layman's terms, the graphics processor 21 leads out a signal cable, namely the first connecting line 22, through the first connector 201. One end of the first connecting line 22 is connected to the first connector 201, and the other end of the first connecting line 22 is connected to the graphics processor 21, thereby realizing the electrical connection between the graphics processor 21 and the first connector 201.

[0108] As shown in Figure 6, such as D0, D1, ..., D N The first connector 201 can be fixed to the first housing. When the graphics processor module 20 performs blind insertion and pulling actions, the first housing can be pulled or pushed, D0, D1, ..., D...N Structures such as the first connector 201, the graphics processor 21, and the first connecting line 22 can be formed together with the graphics processor module 20 through joint motion, thereby realizing D0, D1, ..., D N When the first connector 201 connects to C0, C1, ..., C N The assembly or disassembly of the intermediate connector 14 is carried out. During this process, the insertion and extraction force required for the first connector 201 can be guaranteed by the first housing to which it is fixed. Thus, when assembling or disassembling the graphics processor module 20, the body of the first connecting line 22 is not subject to the corresponding insertion and extraction force, which helps to protect the first connecting line 22 and reduce the wear of the first connecting line 22.

[0109] The graphics processor 21 and the central processing unit 31 are interconnected by high-speed and low-speed signals to enable high-speed communication and corresponding management functions. Therefore, some related structures of the graphics processor module 20 and the central processing unit module 30 via the relay connector 14 are described here.

[0110] Please refer to Figures 3 through 6. In one embodiment, the central processing unit module 30 is located on the side of the central backplate 121 facing the first opening 112. As the name suggests, the central processing unit module 30 may include a plurality of central processing units 31.

[0111] The central processing unit module 30 has a second connector 301 on its surface facing the central backplate 121. The second connector 301 is connected to the central processing unit 31 and is also detachably connected to the relay connector 14. Thus, when both the graphics processing unit module 20 and the central processing unit module 30 are connected to the relay connector 14, the central processing unit module 30 can be electrically connected to the graphics processing unit module 20 through the relay connector 14.

[0112] Further, as described above, the relay connector 14 may include a first connecting portion 141 and a second connecting portion 142, which are internally interconnected within the relay connector 14 via pins or similar means. The first direction is the relative direction between the first connecting portion 141 and the second connecting portion 142. In this embodiment, the first direction is parallel to the relative direction between the central processing unit module 30 and the graphics processing unit module 20, and is also perpendicular to the reference direction X. In other words, when the server is correctly placed, the relative directions of the graphics processing unit module 20 and the central processing unit module 30, and the relative directions of the first connecting portion 141 and the second connecting portion 142, can be parallel to the direction of gravity and perpendicular to their movable directions. The movable directions of the graphics processing unit module 20 and the central processing unit module 30 are parallel to the reference direction X.

[0113] The connector of the first connecting part 141 is detachably connected to the first connector 201 of the graphics processor module 20, and the connector of the first connecting part 141 is electrically connected to the graphics processor 21 through the first connector 201. The connector of the second connecting part 142 is detachably connected to the second connector 301, and the connector of the second connecting part 142 is electrically connected to the central processing unit 31 through the second connector 301. This allows for blind mating between the graphics processor module 20 and the central processing unit module 30 and the intermediate connecting part.

[0114] Thus, when disassembling either the graphics processor module 20 or the central processing unit module 30, it can be done simply by separating it from the transfer connector 14, with minimal impact on the cable connections of the other. When reinstalling the disassembled module, it is not necessary to distinguish and manually connect the specific connection relationships and cable relationships between the graphics processor module 20 and the central processing unit module 30, thereby achieving decoupling between the graphics processor module 20 and the central processing unit module 30 and significantly reducing the burden of installation and removal.

[0115] Optionally, as illustrated in Figure 6, the second connector 301 may include F0, F1, ..., F N respectively with C0, C1, ..., C N When the intermediate connector 14 is connected, F0, F1, ..., F N When the second connector 301 can connect with D0, D1, ..., D N The electrical connection between the first connectors 201, etc., thereby realizing the electrical connection between the graphics processor 21 and the central processing unit 31. Such as F0, F1, ..., F... N The second connector 301 can be relatively fixed to the central processing unit module 30, meaning it can engage or disengage with the relay connector 14 as the central processing unit module 30 is pulled out. The second connector 301 can be a blind-mating high-speed connector, etc., to achieve high-speed signal transmission between the graphics processor 21 and the central processing unit 31.

[0116] In other words, the blind-mating connectors such as D0, D1, ..., D1 between the graphics processing unit module 20 and the central processing unit module 30 are respectively... N And F0, F1, ..., F N By using a limiting component 122 and a transfer connector 14 that are relatively fixed to the server chassis 10, the high-speed cable between the graphics processor 21 and the central processing unit 31 is decoupled, enabling blind-plug interconnection of signals between the graphics processor 21 and the central processing unit 31. Thus, during related maintenance, it is not necessary to manually plug and unplug cables after opening the cover before maintaining the graphics processor module 20 and / or the central processing unit module 30, which helps to decouple the cables between the upper and lower 4U units of the server.

[0117] To address this, in this embodiment, when the central processing unit 31 manages the graphics processor 21, the central processing unit 31 can output a graphics management signal. The graphics management signal is used to manage the working state of the graphics processor module 20. The graphics management signal is transmitted to the relay connector 14 via the first connector 201, and then to the second connector 301 via the relay connector 14, so as to the graphics processor module 20.

[0118] The following describes the power supply and transmission structure of the graphics processor module 20 of this application.

[0119] Please refer to Figures 2 through 5. In one embodiment, the power supply connection assembly 13 may include a power supply connector 131.

[0120] A power connector 131 is located on the side of the central backplate 121 facing the first opening 112, and the power connector 131 is electrically connected to the central backplate 121. A graphics processor module 20 is located on the side of the central backplate 121 facing the first opening 112.

[0121] The graphics processor module 20 has a third connector on its surface facing the center backplate 121. The third connector is detachably connected to the power connector 131 located on the center backplate 121. Thus, power can be transmitted to the graphics processor module 20 via the center backplate 121, the power connector 131, and the third connector to power the graphics processor module 20.

[0122] Furthermore, the graphics processor module 20 may include a graphics processor 21 and a power input component 23. The power input component 23 may be a busbar or the like, and is not limited here.

[0123] The third connector is located on the side of the power input assembly 23 facing the central backplate 121.

[0124] The graphics processor 21 is located on the side of the power input component 23 away from the center backplate 121. The graphics processor 21 is electrically connected to the power input component 23 and is used to receive power input through the center backplate 121 and the power input component 23.

[0125] In other words, the power supply is transmitted through the central backplane 121 to the power connector 131, which is connected to the third connector. The power supply is then transmitted from the power connector 131 to the third connector, and subsequently to the power input component 23, which is equipped with the third connector. The power input component 23 is connected to the graphics processor 21, allowing the power supply to be transmitted to the graphics processor 21 via the power input component 23. Thus, in this embodiment, the power supply and graphics management signals of the graphics processor module 20 can be transmitted through different transmission paths, which helps to ensure the performance of the graphics processor module 20.

[0126] Furthermore, the power input component 23 may include an abutment portion 231 and a main body portion 232.

[0127] The third connector is provided at the abutment portion 231. The side of the main body portion 232 away from the abutment portion 231 is connected to the graphics processor 21. This increases the contact area between the power input component 23 and the central backplate 121, which is beneficial for the reliable connection between the graphics processor module 20 and the central backplate 121, and also helps to reduce the thickness of the main body portion 232.

[0128] The main body 232 is provided to form a clearance groove 233, and the limiting member 122 is provided in the clearance groove 233.

[0129] The graphics processor module 20 also includes a first connector 201, which is detachably connected to the first connection portion 141 of the transfer connector 14 provided on the limiting member 122, and a third connector is also electrically connected to the graphics processor 21.

[0130] In layman's terms, the power input component 23 may have a central space, and the limiting member 122 may be disposed in this central space. The limiting member 122 may be fixed relative to the server chassis 10. When the graphics processor module 20 is moved, the limiting member 122 may not move with the components such as the graphics processor module 20 and the central processing unit module 30. For example, when the graphics processor module 20 and / or the central processing unit module 30 are pulled out, the limiting member 122 may remain in its original position, and even if the graphics processor module 20 moves the power input component 23, the power input component 23 may not interfere with the fixing structure of the server chassis 10, such as the limiting member 122 and the central backplate 121. Thus, the limiting member 122 and the intermediate connector 14 disposed on the limiting member 122 may be relatively fixed to the server chassis 10 without interfering with the movement of the components.

[0131] Optionally, the main body 232 may include a first side 2321, a second side 2322 and a third side 2323, with the two ends of the second side 2322 connected to the first side 2321 and the third side 2323 respectively, forming a clearance groove 233.

[0132] The graphics processor 21 is located on the second side 2322. The first side 2321 and the third side 2323 are connected to the abutment portion 231 on the side away from the second side 2322, so as to optimize the internal structural layout of the graphics processor module 20 and improve the structural compactness of the graphics processor module 20.

[0133] The following describes the heat dissipation-related structure of the graphics processor module 20 of this application.

[0134] Please refer to Figures 3, 4 and 7. Figure 7 is a schematic diagram of the liquid cooling related structure and a central backplate of an embodiment of this application.

[0135] In one embodiment, the graphics processor module 20 further includes a cooling assembly 24.

[0136] The cooling component 24 is located on the graphics processor 21 and is used to dissipate heat from the graphics processor 21. When the graphics processor module 20 is moved, the graphics processor 21, the power input component 23, and the cooling component 24 work together.

[0137] In this embodiment, considering the high power consumption of the graphics processor 21, an independent heat dissipation structure is adopted for the graphics processor 21, such as liquid cooling methods such as cold plate type or immersion type.

[0138] Please refer to Figures 3, 4, and 7. In one embodiment, the cooling assembly 24 includes a liquid cooling connector 241, a cooling plate, and a liquid channel 242. The cooling assembly 24 can cooperate with the liquid piping and heat dissipation connection assembly 16 described above to dissipate heat from the graphics processor module 20 via liquid cooling. The heat dissipation connection assembly 16 includes a first pipe connector 161 and a second pipe connector 162.

[0139] In other words, in this embodiment, a cold plate-type liquid cooling method can be used to dissipate heat from the graphics processor 21. A cold plate structure, such as a cooling plate, can be attached to the graphics processor 21 to absorb the heat transferred by the graphics processor 21, and the heat can be continuously dissipated through coolant circulation. In other words, the cooling plate can be in contact with the graphics processor 21.

[0140] The liquid cooling connector 241 may be disposed on the surface of the graphics processor 21 facing the second pipeline connector 162.

[0141] The liquid channel 242 is connected to the liquid cooling connector 241 and the cooling plate at both ends, respectively. The liquid cooling connector 241 is detachably connected to the second pipe connector 162, so that the coolant can flow through the liquid pipe, the liquid channel 242 and the cooling plate. That is, the coolant used for liquid cooling flows to the cooling assembly 24 via the liquid cooling pipe 15 and the heat dissipation connector 16, flows into the liquid channel 242 via the liquid cooling connector 241 and then flows to the cooling plate, where it absorbs the heat of the graphics processor 21 and carries the absorbed heat out of the cooling plate.

[0142] Furthermore, the first pipe connector 161 includes a first sub-channel 1611 and a second sub-channel 1612, and the second pipe connector 162 includes a third sub-channel 1621 and a fourth sub-channel 1622. The liquid pipeline includes a first inlet pipe 151 and a first outlet pipe 152, and the liquid channel 242 includes a second inlet pipe 2421 and a second outlet pipe 2422.

[0143] The first sub-channel 1611, the first liquid inlet pipe 151, the third sub-channel 1621, and the second liquid inlet pipe 2421 are connected in sequence to allow the coolant to flow to the cooling component 24; the second sub-channel 1612, the first liquid outlet pipe 152, the fourth sub-channel 1622, and the second liquid outlet pipe 2422 are connected in sequence to discharge the coolant after heat absorption.

[0144] Specifically, the coolant flows into the first inlet pipe 151 through the first sub-channel 1611, then sequentially flows through the third sub-channel 1621, the liquid-cooling connector 241, and the second inlet pipe 2421, before flowing into the cooling plate to absorb the heat dissipated by the graphics processor 21. The cooled coolant, after absorbing heat, flows to the second outlet pipe 2422, sequentially flowing through the liquid-cooling connector 241, the fourth sub-channel 1622, and the first outlet pipe 152, before being discharged through the second sub-channel 1612. The liquid-cooling connector 241 may include two channels, one for the coolant flowing to the cooling plate and the other for the cooled coolant after absorbing heat; these details will not be elaborated further here.

[0145] Optionally, there can be multiple cooling plates, so the cooling assembly 24 may also include a liquid distribution component 243 (not shown in the figure). The liquid distribution component 243 may be such as a manifold, etc., and is not limited here.

[0146] The liquid channel 242 is connected to the cooling plate via the liquid distribution component 243; the coolant flows into the liquid distribution component 243 through the liquid channel 242 and is distributed to each cooling plate to dissipate heat from the graphics processor 21. The liquid cooling connectors of each graphics processor 21 can be plugged into the liquid distribution component 243 for unified liquid distribution.

[0147] Furthermore, the liquid distribution component 243 and the cooling plate can be connected via a conventional quick-connect coupling, meaning one end of the liquid channel 242 can be inserted into the liquid distribution component 243 via a conventional quick-connect coupling. The other end of the liquid channel 242 is connected to a liquid cooling connector 241, which can be a quick-release blind connector. The quick-release blind connector can be relatively fixed to the graphics processor module 20 so that it moves together with the graphics processor module 20, and the installation force required for blind-connection can be provided by a fixed structure such as the first housing.

[0148] Please refer to Figures 3, 4, and 7. In one embodiment, a liquid-cooled positioning component 163 may be provided inside the server chassis 10. The liquid-cooled positioning component 163 can remain relatively fixed to the server chassis 10, meaning it does not move with the movement of the component modules. The side of the liquid-cooled positioning component 163 facing the graphics processor module 20 has a second pipeline connector 162 to achieve blind mating with the related liquid-cooled pipelines 15 of the graphics processor module 20. Furthermore, as the graphics processor module 20 is pushed into or pulled out of the receiving cavity 111, the liquid-cooled connector 241, which is relatively fixed to the graphics processor module 20, can be mated with or pulled out of the second pipeline connector 162, achieving blind mating of the liquid-cooled pipelines 15 of the graphics processor module 20.

[0149] Furthermore, the server chassis 10 may also include a chassis positioning member 164 disposed on the housing 11 of the server chassis 10, and a first pipeline connector 161 disposed on the chassis positioning member 164. In this case, the liquid cooling pipeline 15 can be fixedly connected between the liquid cooling positioning member 163 and the chassis positioning member 164 to lead the liquid channel 242 of the graphics processor module 20 out of the server chassis 10 through the liquid cooling pipeline 15. Additionally, the side of the chassis positioning member 164 facing away from the receiving cavity 111 may be provided with a quick-release blind-plug connector, leading out of the server chassis 10 for blind-plug docking with the water distributor on the external rack, realizing rack-level liquid cooling blind-plug docking.

[0150] Referring to the examples shown in Figures 8a and 8b, Figure 8a is a structural schematic diagram of an embodiment of the assembly of the limiting component, the transfer processor, and the graphics processor module of this application, and Figure 8b is a structural schematic diagram of an embodiment of the separation of the graphics processor module shown in Figure 8a. The process of loading and unloading the graphics processor module 20 will be illustrated below.

[0151] Specifically, as illustrated in the examples above, the non-connecting parts of the graphics processor module 20 can be subjected to force to drive the graphics processor module 20 to move, thereby achieving a detachable connection of the graphics processor module 20, i.e., blind insertion.

[0152] The graphics processor module 20 can be inserted into the receiving cavity 111 through the first opening 112 to install the graphics processor module 20. During this process, the non-connecting parts of the graphics processor module 20 are subjected to a pushing force, and the first connector 201 connected to the intermediate connector 14, the second connector 301 connected to the central backplate 121, the first housing, the graphics processor 21, the first connecting cable 22, the power input component 23, the cooling component 24, etc., are inserted into the receiving cavity 111 due to the pushing force on the graphics processor module 20.

[0153] In detail, under the action of thrust, the end of the power input component 23 perpendicular to the server chassis 10, namely the abutment portion 231, can be inserted into the central backplane 121 via a third connector such as a blind-mating post connector to draw power from the central backplane 121 to supply power to the graphics processor 21, for example, it can obtain 12V power from the power supply module 50. At the same time, the liquid cooling connector 241 of the cooling component 24 moves with the graphics processor module 20 and docks with the second pipeline connector 162 to realize the connection of the liquid cooling path. The first connector 201 of the graphics processor module 20, along with the movement of the graphics processor module 20, is inserted into the transfer connector 14 of the limiting member 122 located in the server chassis 10. In this way, the power supply, liquid cooling, and signal of the graphics processor module 20 can be fully blind-mated.

[0154] The graphics processor module 20 can be pulled out of the housing cavity 111 through the first opening 112 to disassemble the graphics processor module 20. During this process, the non-connecting parts of the graphics processor module 20 are subjected to a pushing force, and the first connector 201 connected to the intermediate connector 14, the second connector 301 connected to the central backplate 121, the first housing, the graphics processor 21, the first connecting cable 22, the power input component 23, the cooling component 24, etc., are pulled out of the housing cavity 111 by the pulling force on the graphics processor module 20.

[0155] In detail, since the power input component 23 can remain relatively fixed to other parts of the graphics processor module 20, under tension, the third connector, such as the blind-mold post connector, can disengage from the central backplate 121. Simultaneously, the liquid cooling connector 241 of the cooling component 24 is also subjected to the fixing force of the graphics processor module 20, disengaging from the second pipe connector 162 located on the server chassis 10. Furthermore, during this process, the liquid channels 242 of the graphics processor module 20 can remain in a state where they are not directly subjected to tension, thus avoiding the concentration of tension on the liquid channels 242, such as the liquid cooling hoses, significantly reducing the risk of the liquid channels being broken. The first connector 201 of the graphics processor module 20 can also remain relatively fixed to the graphics processor module 20, so as the graphics processor module 20 moves, the first connector 201 can disengage from the transfer connector 14 installed on the limiting member 122. Furthermore, since the power input component 23 forms a relief groove 233 through its structure, it can provide travel space for the limit member 122 and the transfer connector 14, so that no interference will occur when the graphics processor module 20 is pulled out.

[0156] In other words, the server chassis 10 may be equipped with a quick-release blind-plug connector, namely the first pipe connector 161, on the side near the second opening 113. The first pipe connector 161 can be relatively fixed to the housing 11 by means of a chassis positioning member 164, and when the server chassis 10 is installed in the server rack, the first pipe connector 161 can correspond to the corresponding liquid cooling connector in the server structure. In this way, the server chassis 10 can be directly pushed into the server rack or pulled out of the server rack to achieve blind plugging of the whole machine liquid cooling, thereby reducing the cumbersome operation of manual connection and installation of liquid cooling water pipes during operation and maintenance, and thus improving the convenience of operation and maintenance. Several server chassis 10 can be installed in the server rack.

[0157] It should be noted that the descriptions such as "can remain relatively fixed" and "relatively fixed to" in this application refer to the ability to remain relatively fixed during the movement of the component module. When the component module has been removed from the accommodating cavity 111, the relevant components can be disassembled, etc., which are not limited here.

[0158] The following is a detailed description of the structure of the central processing unit module 30 of this application.

[0159] Please refer to Figures 3 and 4 in conjunction with these figures. In one embodiment, the central processing unit module 30 includes a second housing, a central processing unit 31, and a second connection line 32.

[0160] The second housing has a second connector 301 on the surface facing the transfer connector 14 for detachable connection with the transfer connector 14.

[0161] The central processing unit 31 is located inside the second housing. The second connector 301 is connected to the central processing unit 31 via the second connecting line 32 of the second housing. When the central processing unit module 30 is moved, the central processing unit 31, the second connecting line 32, and the second connector 301 move along with the second housing. That is, the central processing unit 31, the second connecting line 32, the second connector 301, and the second housing can be pulled out as a whole from the first opening 112 to facilitate maintenance and replacement of components such as the central processing unit 31 and memory modules in the lower layer. Optionally, the central processing unit 31 can be a CPU, etc. The central processing unit 31 described in this application can also be a motherboard that carries the CPU, etc., and is not strictly limited here.

[0162] In layman's terms, one end of the second connecting line 32 can be plugged into the central processing unit 31, and the other end of the second connecting line 32 can be connected to a blind-mating high-speed signal connector, i.e., the second connector 301. The second connector 301 is illustrated in Figure 6 as F0, F1, ..., F... N It can be relatively fixed to the surface of the second housing. When the central processing unit module 30 performs blind insertion and removal actions, the second connector 301 can move synchronously with the central processing unit module 30, forming a connection with components such as C0, C1, ..., C... N When the intermediate connector 14 is assembled or disassembled, the interconnection or disconnection with the graphics processor module 20 can be achieved through the conversion of the intermediate connector 14.

[0163] Of course, the central processing unit module 30 may also include other structures, such as a tray, storage component 60, network card, and other structural components. Among them, storage component 60 may include storage device 61 and storage backplane, etc. Storage device 61 may be such as NVMe (Non-Volatile Memory Host Controller Interface Specification) hard drive, etc.

[0164] Thus, the storage component 60, network card, and corresponding structures interconnected with the central processing unit 31, together with the second housing, central processing unit 31, second connecting cable 32, second connector 301, and fifth connector 302, constitute the central processing unit module 30. The second connecting cable 32 is an internal cable of the central processing unit module 30. During the blind insertion process of the central processing unit module 30, the central processing unit module 30 is inserted or removed as a whole, and internal cables such as the second connecting cable 32 will not affect the insertion or removal of the overall central processing unit module 30.

[0165] The following section provides a detailed description of the heat dissipation-related structures of the central processing unit module 30 in this application.

[0166] Please refer to Figures 3, 4, and 9. Figure 9 is a schematic diagram of the structure of an embodiment of the fan power supply assembly and central processing unit of this application. It should be noted that Figure 9 only shows, by way of example, the docking structure between the central processing unit 31 and part of the structure of the heat dissipation module 40 (i.e., the fan power supply assembly 42) for transmitting power and signals. Other structures are omitted, which does not mean that the central processing unit module 30 and the heat dissipation module 40 only include the structures shown in the figure.

[0167] In one embodiment, a heat dissipation module 40 is disposed on the side of the central processing unit module 30 facing the second opening 113, so as to dissipate heat from the central processing unit module 30 using the heat dissipation module 40.

[0168] As can be seen, in this application, the heat dissipation module 40 and the cooling component 24 can be used to dissipate heat from the central processing unit module 30 and the graphics processing unit module 20, respectively.

[0169] Optionally, in this embodiment, the heat dissipation module 40 can dissipate heat from the central processing unit module 30 through physical structures such as a cooling fan 41. This design in this embodiment takes into account that the heat dissipation power consumption of the central processing unit module 30 is less than that of the graphics processing unit module 20. Therefore, the heat dissipation methods used for the two are designed separately to rationally allocate heat dissipation capacity while ensuring heat dissipation effect. Furthermore, this design in this embodiment also allows the server chassis 10 to have only one set of liquid cooling interfaces. If the central processing unit module 30 also uses liquid cooling, the central processing unit module 30 and the graphics processing unit module 20 would be connected in parallel. There might be a coupling problem between these two modules in the liquid cooling pipes 15, making decoupling impossible and preventing all modules from being blind-pluggable. Therefore, in this embodiment, the central processing unit module 30 uses air cooling, which can be dissipated from the second opening 113 using the cooling fan 41, thus reducing the heat dissipation complexity of the central processing unit module 30.

[0170] The following section provides a detailed description of the power supply and transmission structure of the central processing unit module 30 in this application.

[0171] Please refer to Figures 3, 4, 9 and 10. Figure 10 is a schematic diagram of the structure of an embodiment of the heat dissipation module of this application.

[0172] In one embodiment, a fourth connector 401 may be provided on the surface of the heat dissipation module 40 facing the central processing unit module 30. A fifth connector 302 may be provided on the surface of the central processing unit module 30 facing the heat dissipation module 40.

[0173] The fourth connector 401 and the fifth connector 302 are detachably connected. This allows the central processing unit module 30 and the heat dissipation module 40 to interact through the fourth connector 401 and the fifth connector 302. Specific details regarding signal transmission and power transmission will be elaborated later and will not be repeated here.

[0174] Furthermore, the heat dissipation module 40 can be electrically connected to the power supply module 50 so that the heat dissipation module 40 can be used to receive the power supply output by the power supply module 50.

[0175] In layman's terms, a fifth connector 302 can be provided on the surface of the central processing unit module 30 facing the second opening 113, and a fourth connector 401 can be provided on the surface of the heat dissipation module 40 facing the central processing unit module 30. The fourth connector 401 and the fifth connector are positioned correspondingly. Therefore, the central processing unit module 30 and the heat dissipation module 40 can be plugged into each other along the reference direction X, that is, the fourth connector 401 and the fifth connector 302 can be plugged in and out along their respective directions of movement. Thus, when the fourth connector 401 and the fifth connector 302 are connected, a portion of the power supply energy is input to the central processing unit module 30 through the fourth connector 401 and the fifth connector 302 to supply power to the central processing unit module 30. That is, the power supply module 50 can provide power such as 12V to the central processing unit 31 through the heat dissipation module 40 to drive the central processing unit 31 to work.

[0176] The fourth connector 401 can be relatively fixed to the heat dissipation module 40 via its structural frame, allowing it to be inserted or removed as the heat dissipation module 40 moves. Optionally, the fourth connector 401 includes a first quick connector. The fifth connector 302 includes a second quick connector; both can be blind-mating connectors.

[0177] Both the fourth connector 401 and the fifth connector 302 include a guide 43 and a guide groove (not shown in the figure). The number of guides 43 and guide grooves can be one or more. When there are multiple guides 43, they can be located on both sides or more sides of the blind-fit connector.

[0178] When the first quick connector is connected to the second quick connector, the guide 43 extends into the guide groove, which facilitates a reliable connection between the fourth connector 401 and the fifth connector 302. While relatively fixing the fourth connector 401 or the fifth connector 302, it also serves as a guide for blind insertion, thereby reducing the risk of misalignment between the heat dissipation module 40 and the central processing unit module 30 during the insertion process. As illustrated in Figure 10, the guide 43 may be located on the fourth connector 401.

[0179] In addition, other connectors and connecting parts in this application may also have guiding structures, which will not be described in detail here.

[0180] In detail, when the central processing unit module 30 is assembled independently, the central processing unit module 30 can be pushed into the receiving cavity 111 along the reference direction X. During the movement of the central processing unit module 30, the second connector 301 corresponds to the second connection portion 142 of the relay connector 14, and the fifth connector 302 corresponds to the fourth connector 401 of the heat dissipation module 40. When the second connector 301 abuts against the second connecting part 142 and the fifth connector 302 abuts against the fourth connector 401, the central processing unit module 30 is further pushed, thereby realizing the installation of the second connector 301 and the second connecting part 142, and the installation of the fifth connector 302 and the fourth connector 401. This enables the central processing unit module 30 to be assembled with the relay connector 14 and the heat dissipation module 40, allowing the central processing unit module 30 to interact with the graphics processing unit module 20 through the relay connector 14, and also with the heat dissipation module 40, and with the power supply module 50 through the heat dissipation module 40 and the central backplate 121. Similarly, when disassembling the central processing unit module 30, the central processing unit module 30 can be subjected to a force in the direction of the first opening 112 to remove the central processing unit module 30. During this process, the second connector 301 can separate from the second connecting part 142, and the fifth connector 302 can separate from the fourth connector 401.

[0181] In this application, a heat dissipation module 40 and a power supply module 50 may be provided on the side of the accommodating cavity 111 relatively close to the second opening 113. Taking an 8U server as an example, when the server is correctly placed, the power supply module 50 and the heat dissipation module 40 can each occupy 4U of space in the upper and lower sections. As the name suggests, the power supply module 50 can provide power to the entire server.

[0182] The following is a detailed description of the structure of the heat dissipation module of this application.

[0183] Please refer to Figures 3, 4, 10 and 11. Figure 11 is a schematic diagram of the structure of an embodiment of the heat dissipation module and the central backplate of this application.

[0184] In one embodiment, the heat dissipation module 40 includes a heat dissipation fan 41, a fan power supply assembly 42, and a sixth connector 402.

[0185] A cooling fan 41 is located on the side of the fan power assembly 42 facing the second opening 113, and the cooling fan 41 is detachably connected to the fan power assembly 42. The fan power assembly 42 is provided with a fourth connector 401, that is, a fourth connector 401 for connecting to the central processing unit module 30 is provided on the fan power assembly 42, and the cooling module 40 is interconnected with the central processing unit module 30 through the fan power assembly 42.

[0186] Specifically, the sixth connector 402 is disposed on the surface of the heat dissipation module 40 facing the central backplate 121; the sixth connector 402 is electrically connected to the fourth connector 401, and the sixth connector 402 is also electrically connected to the power supply module 50.

[0187] In layman's terms, the cooling fan 41 can be located on the side of the heat dissipation module 40 near the second opening 113, and the cooling fan 41 can be plugged into the fan power supply assembly 42. Optionally, the cooling fan 41 and the fan power supply assembly 42 can support blind plugging, so that the cooling fan 41 can be plugged in and unplugged separately for independent maintenance.

[0188] Furthermore, the power supply connection assembly 13 also includes a heat dissipation connector 132. The heat dissipation connector 132 is located on the side of the central backplate 121 facing the second opening 113.

[0189] The heat dissipation connector 132 is detachably connected to the sixth connector 402.

[0190] The central backplate 121 is also electrically connected to the power module 50. The power output from the power module 50 is transmitted to the heat dissipation module 40 through the central backplate 121, the heat dissipation connector 132, and the sixth connector 402.

[0191] In other words, the cooling fan 41, the fan power supply assembly 42, and other structural components together form the heat dissipation module 40. When the heat dissipation module 40 is installed or removed, the cooling fan 41, the fan power supply assembly 42, the fourth connector 401, and the sixth connector 402 can move along with the frame-like mechanical structure of the heat dissipation module 40, so as to realize the overall installation and removal of the heat dissipation module 40.

[0192] In detail, as illustrated in Figure 11, the heat dissipation module 40 can support blind insertion between itself and the central processing unit module 30 along the reference direction X, thereby enabling blind insertion of the entire heat dissipation module 40. This helps to reduce the difficulty of manually connecting cables and interfaces during assembly and improves the installation and removal efficiency of the heat dissipation module 40.

[0193] On the surface of the heat dissipation module 40 facing the central backplate 121 and relatively close to the power supply module 50, a sixth connector 402 is provided. The sixth connector 402 can support the transmission of power supply and management signals. The specific transmission path will be illustrated later and will not be repeated here. The sixth connector 402 is connected to the fan power supply assembly 42 through structures such as cables, plug-in connectors, and pins. The sixth connector 402 is also connected to the heat dissipation connector 132 located on and electrically connected to the central backplate 121, so as to realize the power and signal path between the central processing unit 31, the fan power supply assembly 42, and the central backplate 121.

[0194] The sixth connector 402 can be relatively fixed to the mechanical structure of the heat dissipation module 40 to maintain relative fixation with the heat dissipation module 40. Optionally, the sixth connector 402 can also be provided with a guide structure to assist in blind mating guidance between the sixth connector 402 and the heat dissipation connector 132.

[0195] The following section provides a detailed description of the structure of the power module in this application.

[0196] Please refer to Figures 3 and 4. In one embodiment, the power module 50 is located on the side of the central backplate 121 facing the second opening 113. The power module 50 is provided with a seventh connector (omitted from the figures). Optionally, the power module 50 may include a plurality of PSUs, which is not limited herein.

[0197] The power supply connection assembly 13 also includes a power connector located on the side of the central backplate 121 facing the second opening 113. The seventh connector is detachably connected to the power connector, thereby enabling blind insertion of the power module 50, and when the power module 50 is inserted into the power connector of the central backplate 121, the power module 50 can provide power to other component modules through the central backplate 121.

[0198] The following provides examples illustrating the power transmission paths and some management signal transmission paths within the server of this application.

[0199] Please refer to Figures 3, 4, and 12a-12c. Figure 12a is a flowchart illustrating an embodiment of transmitting power supply energy according to this application, Figure 12b is a flowchart illustrating an embodiment of transmitting heat dissipation management signals according to this application, and Figure 12c is a flowchart illustrating an embodiment of transmitting power management signals according to this application.

[0200] In one embodiment, the central backplane 121 can be relatively fixed to the housing 11 of the server chassis 10, thus serving as the reference for the entire server system. The graphics processor module 20, the heat dissipation module 40, and the power supply module 50 can all be blind-plugged into it to transmit power and management signals. The central processing unit module 30 can indirectly draw power from the central backplane 121 through the fan power supply assembly 42 of the heat dissipation module 40, and can transmit management signals to the fan power supply assembly 42 and the central backplane 121.

[0201] Specifically, as illustrated in Figures 3, 4 and 12a, the power supply module 50 outputs power to the central backplane 121, and part of the power is transmitted to the graphics processor module 20 via the central backplane 121; part of the power is transmitted to the heat dissipation module 40 via the central backplane 121, and the heat dissipation module 40 transmits part of the received power to the central processing unit module 30.

[0202] For example, the power module 50 can input 12V power to the center backplane 121 via the seventh connector and the power connector. After being shunted by the center backplane 121, the power is transmitted to the graphics processor module 20 and the heat dissipation module 40 via the power connector 131 and the heat dissipation connector 132 located on the center backplane 121. That is, the power can be transmitted to the power input component 23 via the power connector 131 to power the graphics processor module 20. The power can also be transmitted to the fan power assembly 42 via the heat dissipation connector 132 to deliver the power to the cooling fan 41. The power can also be transmitted to the central processing unit module 30 via the fourth connector 401 of the fan power assembly 42 and the fifth connector 302 of the central processing unit module 30 to power the central processing unit 31 and other components.

[0203] The overall management path of the machine can be considered to start from the central processing unit 31. The central processing unit 31 can output management signals to manage other component modules. Among them, the management signals can include at least one of the graphics management signals, thermal management signals, and power management signals as described above. The transmission path of the graphics management signals has been described above and will not be repeated here.

[0204] As illustrated in Figures 3, 4, and 12b, the CPU 31 of the CPU module 30 outputs a thermal management signal, which is used to manage the operating state of the thermal module 40. The thermal management signal is transmitted to the thermal module 40 via the fifth connector 302 and the fourth connector 401. In simpler terms, the thermal management signal output by the CPU 31 can be transmitted to the fan power supply assembly 42 via the fifth connector 302 and the fourth connector 401, which are detachably connected to both the CPU 31 and the fan power supply assembly 42, to manage and control the cooling fan 41.

[0205] As illustrated in Figures 3, 4, and 12c, the central processing unit (CPU) module 30 is electrically connected to the heat dissipation module 40, and the heat dissipation module 40 is electrically connected to the center backplane 121. The CPU 31 of the CPU module 30 outputs a power management signal, which is transmitted to the center backplane 121 via the heat dissipation module 40, and then to the power module 50 via the power connector and the seventh connector, so as to manage the operating status of the power module 50 through the power management signal.

[0206] For example, the power management signal output by the central processing unit 31 can be transmitted to the fan power supply assembly 42 through the connected fifth connector 302 and fourth connector 401. As explained above, the fan power supply assembly 42 can be connected to the heat dissipation connector 132 located on the central backplate 121 through the sixth connector 402, so the power management signal can be transmitted to the central backplate 121 through the sixth connector 402 and the heat dissipation connector 132. The central backplate 121 is connected to the seventh connector of the power module 50 through the power connector located thereon, so the power management signal can be ultimately transmitted to the power module 50 through the power connector and the seventh connector, realizing the management and control of the power module 50 by the central processing unit 31.

[0207] In summary, this application addresses the challenges of complex internal structures in large AI servers such as 8U servers, tight coupling between component modules, and the need to transport the entire server to a specialized repair center for disassembly and maintenance due to difficulties in rack mounting. It provides a server chassis and server. The server architecture of the chassis and server in this application is redesigned, enabling independent maintenance of each component module. Furthermore, the component modules can be blind-plugged, facilitating maintenance without removing the server chassis, significantly improving the ease of server maintenance, and effectively reducing the cumbersome steps of transporting the entire server to a repair center for disassembly and maintenance. Simultaneously, during the production assembly process, each component module can be assembled separately and then blindly plugged into the server chassis to complete the installation, eliminating the tedious assembly process of interconnecting the components and significantly reducing the difficulty of server production assembly, effectively improving production efficiency.

[0208] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0209] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application.

Claims

1. A server chassis, characterized in that, The server chassis includes: The housing includes a receiving cavity, the receiving cavity including a first opening and a second opening for the passage of component modules of the server; The limiting component includes a central back plate, which is disposed in the receiving cavity; The power supply connection assembly includes a plurality of connectors disposed on the central backplate, wherein the connectors disposed on the central backplate face the first opening or the second opening, and are used for detachable connection with the connectors disposed on the surface of the component module; when the connectors and the connectors are assembled, the two are electrically connected. The detachable connection means that when the non-connecting parts of the module are subjected to a force along the reference direction, the module moves relative to the central back plate, allowing the connecting parts of the module and their corresponding connectors to be coaxially assembled or separated without needing to distinguish the front and back directions, up and down and left and right positions of the connecting parts and connectors; the reference direction is parallel to the relative directions of the first opening and the second opening.

2. The server chassis according to claim 1, characterized in that, The server chassis also includes a relay connector; The module comprises a first module and a second module. The transfer connector is used to detachably connect to the first module and the second module respectively. When both the first module and the second module are connected to the transfer connector, the first module is electrically connected to the second module through the transfer connector.

3. The server chassis according to claim 2, characterized in that, The limiting component further includes a limiting member, which is disposed on the side of the central back plate facing the first opening; The transfer connector is located on the side of the limiting member facing the first opening; the transfer connector includes a first connecting part and a second connecting part, and the relative directions of the first connecting part and the second connecting part are perpendicular to the reference direction; The first connecting part is used for detachable connection with a connector on one side surface of the first module facing thereto; the second connecting part is used for detachable connection with a connector on one side surface of the second module facing thereto. The first module and the second module are movably disposed on the side of the transfer connector facing the first opening, and their movable direction is parallel to the reference direction; the relative direction of the first module and the second module is perpendicular to the reference direction.

4. The server chassis according to claim 1, characterized in that, The server chassis also includes an internal heat dissipation component and a heat dissipation connection component, both of which are located in the accommodating cavity; The internal heat dissipation component is connected to the heat dissipation connection component, which is used to connect to the component module to be cooled, so that the internal heat dissipation component is detachably connected to the component module to be cooled through the heat dissipation connection component.

5. The server chassis according to claim 4, characterized in that, The internal heat dissipation components include liquid piping; The heat dissipation connection assembly includes a first pipe connector and a second pipe connector located at both ends of the liquid pipe. The first pipe connector is located in the housing and is used to connect to an external liquid source; the second pipe connector is located in the accommodating cavity and is used to detachably connect to the liquid channel of the module.

6. The server chassis according to claim 5, characterized in that, At least one connector of the power supply connection assembly includes a blind-mating connector; and / or, At least one pipe connector in the heat dissipation connection assembly includes a quick-release blind-fit connector; and / or, The server chassis also includes a relay connector for connecting to the first module and the second module of the server respectively, so as to relay the electrical signals between the two; the relay connector includes a blind-mating connector.

7. The server chassis according to claim 1, characterized in that, The server chassis also includes a moving channel located in the accommodating cavity. One side of the moving channel faces the first opening or the second opening, and the other side faces the central backplate, for allowing the component modules to move along the moving channel.

8. A server, characterized in that, The server includes: The modules consist of a heat dissipation module, a graphics processing unit module, a central processing unit module, and a power supply module. Server chassis, the component modules are disposed in the server chassis; the server chassis includes a shell, limiting components and power supply connection components; The housing includes a receiving cavity, which includes a first opening and a second opening for the passage of the server's constituent modules; The limiting component includes a central back plate, which is disposed in the receiving cavity; The power supply connection assembly includes a plurality of connectors disposed on the central backplate, the connectors disposed on the central backplate facing the first opening or the second opening, for detachable connection with connectors disposed on the surface of the module; when the connectors and connectors are assembled, the two are electrically connected. The detachable connection means that when the non-connecting parts of the module are subjected to a force along the reference direction, the module moves relative to the central back plate, allowing the connecting parts of the module and their corresponding connectors to be coaxially assembled or separated without needing to distinguish the front and back directions, up and down and left and right positions of the connecting parts and connectors; the reference direction is parallel to the relative directions of the first opening and the second opening.

9. The server according to claim 8, characterized in that, At least one of the constituent modules includes: a module housing, a module functional body, and a plurality of connectors; The connector is disposed on the surface of the module housing; the module functional body is disposed inside the module housing; the connector is electrically connected to the module functional body and is also used for detachable connection with the connector disposed on the central back plate.

10. The server according to claim 9, characterized in that, The limiting assembly includes a limiting member disposed on the side of the central back plate facing the first opening; the limiting member is provided with a transfer connector on the side facing the first opening; The graphics processing unit (GPU) module and the central processing unit (CPU) module are detachably connected to the relay connector via connectors, and the interaction signals between the GPU module and the CPU module are transmitted via the relay connector.

11. The server according to claim 10, characterized in that, The graphics processor module includes a first housing, and the graphics processor is disposed inside the first housing; The first housing has a first connector on the surface facing the relay connector for detachable connection with the relay connector, and is connected to the graphics processor inside the first housing via a first connecting line; When the graphics processor module is moved, the graphics processor, the first connecting line, and the first connector move along with the first housing.

12. The server according to claim 10, characterized in that, The central processing unit module includes a second housing, and the central processing unit is disposed inside the second housing; The second housing has a second connector on the surface facing the relay connector for detachable connection with the relay connector, and is connected to the central processing unit inside the second housing via a second connecting line; When the central processing unit module is moved, the central processing unit, the second connecting line, and the second connector move along with the second housing.

13. The server according to claim 8, characterized in that, The graphics processor module is located on the side of the central backplate facing the first opening; the power supply connection assembly includes a power supply connector, located on the side of the central backplate facing the first opening; The graphics processor module has a third connector on its surface facing the central backplate, which is detachably connected to the power supply connector located on the central backplate.

14. The server according to claim 13, characterized in that, The graphics processor module includes a graphics processor and a power input component; The third connector is located on the side of the power input assembly facing the central backplate; The graphics processor is located on the side of the power input component away from the center backplate. The graphics processor is electrically connected to the power input component and is used to receive power input through the center backplate and the power input component.

15. The server according to claim 14, characterized in that, The power input component includes an abutment part and a main body part; the server chassis includes a limiting component; The third connector is disposed at the abutting portion; the side of the main body portion away from the abutting portion is connected to the graphics processor; The main body is provided to form a clearance groove, and the limiting member is provided in the clearance groove; The graphics processor module further includes a first connector that is detachably connected to the first connecting portion of the transfer connector located on the limiting member, and the third connector is also electrically connected to the graphics processor.

16. The server according to claim 14, characterized in that, The graphics processor module also includes a cooling component; The cooling component is located on the graphics processor and is used to dissipate heat from the graphics processor. When the graphics processor module is moved, the graphics processor, the power input component, and the cooling component work together.

17. The server according to claim 16, characterized in that, The server chassis includes liquid piping and a first pipe connector and a second pipe connector located at both ends of the liquid piping; the cooling assembly includes liquid cooling connectors, multiple cooling plates, liquid channels, and liquid distribution components. The cooling plate abuts against the graphics processor; The liquid cooling connector is disposed on the surface of the graphics processor facing the second pipeline connector. The liquid channel is connected to the liquid cooling connector and the cooling plate at both ends, respectively. The liquid cooling connector is detachably connected to the second pipeline connector so that the coolant can flow through the liquid pipeline, the liquid channel and the cooling plate. The liquid channel is connected to the cooling plate through the liquid distribution component; the coolant flows into the liquid distribution component through the liquid channel and is distributed to each of the cooling plates to dissipate heat from the graphics processor.

18. The server according to claim 8, characterized in that, The central processing unit module is located on the side of the central back panel facing the first opening; The central processing unit module has a second connector on its surface facing the central backplate. The second connector is connected to the central processing unit and is also detachably connected to the relay connector.

19. The server according to claim 18, characterized in that, The relay connector includes a first connecting portion and a second connecting portion; wherein, the first direction is parallel to the relative direction between the central processing unit module and the graphics processing unit module, and the first direction is also perpendicular to the reference direction; wherein, the first direction is the relative direction between the first connecting portion and the second connecting portion; The connector of the first connecting part is detachably connected to the first connector of the graphics processor module, and the connector of the first connecting part is electrically connected to the graphics processor through the first connector. The connector of the second connecting part is detachably connected to the second connecting member, and the connector of the second connecting part is electrically connected to the central processing unit through the second connecting member.

20. The server according to claim 19, characterized in that, The central processing unit outputs a graphics management signal, which is used to manage the working status of the graphics processing unit module. The graphics management signal is transmitted via the first connector to the relay connector, and then via the relay connector to the second connector, so as to the graphics processor module.

21. The server according to claim 18, characterized in that, The heat dissipation module is located on the side of the central processing unit module facing the second opening; The surface of the heat dissipation module facing the central processing unit module is provided with a fourth connector, and the surface of the central processing unit module facing the heat dissipation module is provided with a fifth connector; the fourth connector and the fifth connector are detachably connected, so that the central processing unit module and the heat dissipation module can interact through the fourth connector and the fifth connector.

22. The server according to claim 21, characterized in that, The heat dissipation module is electrically connected to the power supply module and is used to receive the power supply energy output by the power supply module. When the fourth connector is connected to the fifth connector, a portion of the power supply is input to the central processing unit module through the fourth connector and the fifth connector to supply power to the central processing unit module.

23. The server according to claim 22, characterized in that, The central processing unit of the central processing unit module outputs a heat dissipation management signal, which is used to manage the working status of the heat dissipation module. The heat dissipation management signal is transmitted to the heat dissipation module via the fifth connector and the fourth connector.

24. The server according to claim 8, characterized in that, The heat dissipation module includes a heat dissipation fan, a fan power supply assembly, and a sixth connector. The cooling fan is located on the side of the fan power assembly facing the second opening, and the cooling fan is detachably connected to the fan power assembly; the fan power assembly is provided with a fourth connector; The sixth connector is disposed on the surface of the heat dissipation module facing the central backplate; the sixth connector is electrically connected to the fourth connector and is also electrically connected to the power supply module.

25. The server according to claim 24, characterized in that, The power supply connection assembly also includes a heat dissipation connector disposed on the side of the central backplate facing the second opening; The heat dissipation connector is detachably connected to the sixth connector. The central backplate is also electrically connected to the power module, and the power output from the power module is transmitted to the heat dissipation module through the central backplate, the heat dissipation connector, and the sixth connector.

26. The server according to claim 8, characterized in that, The power module is located on the side of the central back panel facing the second opening; the power module is provided with a seventh connector; The power supply connection assembly also includes a power connector located on the side of the central backplate facing the second opening; the seventh connector is detachably connected to the power connector.

27. The server according to claim 26, characterized in that, The power module outputs power to the central backplane; Part of the power supply is transmitted to the graphics processor module via the central backplane; A portion of the power supply is transmitted to the heat dissipation module via the central backplane, and the heat dissipation module transmits a portion of the received power supply to the central processing unit module.

28. The server according to claim 26, characterized in that, The central processing unit module is electrically connected to the heat dissipation module, and the heat dissipation module is electrically connected to the central backplate; The central processing unit of the central processing unit module outputs a power management signal; The power management signal is transmitted to the center backplane via the heat dissipation module, and then to the power module via the power connector and the seventh connector, so as to manage the working status of the power module through the power management signal.

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