Display module, preparation method, and display system

Abstract

The present application discloses a display module, a preparation method, and a display system. The display module comprises a support layer, an encapsulation layer, a display panel, and a connection structure. The support layer and the encapsulation layer are arranged on two opposite sides of the display panel, and the support layer and the encapsulation layer protrude relative to the display panel; the support layer, the encapsulation layer, and the display panel enclose to form an accommodating space; and the connection structure is located in the accommodating space and arranged around the periphery of the display panel.

Description

Display module, manufacturing method and display system

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411838689.5, filed on December 13, 2024, entitled “Display Module, Manufacturing Method and Display System”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the field of display technology, and in particular relates to a display module, a manufacturing method and a display system. Background Technology

[0004] In related technologies, multiple display modules are spliced ​​together to obtain a larger display area. A display module includes a support layer, a display panel, and an encapsulation layer stacked sequentially. Inconsistent thickness in the fabricated display modules, or deformation of some edges during splicing causing uneven thickness, will result in unevenness in the height of the display surface formed by splicing multiple display modules, affecting the display effect of the multiple display modules. Summary of the Invention

[0005] The purpose of this application is to provide a display module, a manufacturing method, and a display system, which aims to solve the problem of poor consistency in display modules.

[0006] The first aspect of this application provides a display module, the display module comprising:

[0007] Display panel;

[0008] The support layer and encapsulation layer are disposed on opposite sides of the display panel. The support layer and encapsulation layer protrude relative to the display panel, and the support layer, encapsulation layer and display panel together form an accommodating space.

[0009] The connecting structure is located in the accommodating space and is arranged around the periphery of the display panel.

[0010] In some embodiments, the connection structure connects the support layer and the encapsulation layer.

[0011] In some embodiments, the connection structure fills the accommodating space.

[0012] In some embodiments, the outer side of the connection structure away from the display panel, the outer side of the support layer, and the outer side of the encapsulation layer are in the same reference plane.

[0013] In some embodiments, the encapsulation layer includes a light-transmitting area and a connection area. The light-transmitting area is located on one side of the display area of ​​the display panel, and the connection area is located on one side of the connection structure and connected to the connection structure. The color of the connection area is the same as the color of the connection structure.

[0014] In some embodiments, the connection structure is an insulating material.

[0015] In some embodiments, the encapsulation layer is made of the same material as the connection structure.

[0016] In some embodiments, the encapsulation layer and connection structure are not integrally molded structures.

[0017] In some embodiments, the support layer has a first surface and a second surface disposed opposite to each other, the first surface being located on the side of the second surface away from the display panel, and the first surface being planar.

[0018] In some embodiments, the support layer comprises a magnetic material.

[0019] In some embodiments, the thickness of the support layer along the direction from the support layer to the encapsulation layer is 0.01 mm to 1 mm.

[0020] In some embodiments, the display module further includes:

[0021] The heat dissipation layer, the support layer, the heat dissipation layer and the display panel are stacked in sequence.

[0022] In some embodiments, the connection structure is disposed around the periphery of the heat dissipation layer.

[0023] In some embodiments, the heat dissipation layer adheres to the support layer and the display panel.

[0024] In some embodiments, the support layer has a first channel, and the display panel includes a main body and signal lines connecting the main body, the signal lines passing through the first channel.

[0025] A second aspect of this application provides a method for manufacturing a display module, the method comprising:

[0026] Take the display panel that is mounted on the supporting material;

[0027] An encapsulating material is placed on the side of the display panel that is away from the supporting material;

[0028] A connecting material is provided between the support material and the encapsulation material, surrounding the periphery of the display panel, to obtain an intermediate component. The connecting material connects the support material and the encapsulation material. The support material and the encapsulation material protrude relative to the display panel, and the support material, the encapsulation material, and the display panel enclose and form an accommodating space.

[0029] The edges of the intermediate components are cut to obtain the display module. The supporting material is cut to form the supporting layer, the encapsulation material is cut to form the encapsulation layer, and the connecting material is cut to form the connecting structure. The orthographic projection of the display panel on the supporting layer is located within the orthographic projection of the encapsulation layer on the supporting material, and the orthographic projection of the connecting structure on the supporting layer is located within the orthographic projection of the encapsulation layer on the supporting layer.

[0030] In some embodiments, the edges of the intermediate component are cut to obtain a display module, including:

[0031] The stacked support material, connecting material, and encapsulation material are cut together to obtain the display module. The outer side of the connecting structure facing away from the display panel, the outer side of the support layer, and the outer side of the encapsulation layer are all in the same reference plane.

[0032] In some embodiments, the edges of the intermediate component are cut to obtain a display module, including:

[0033] Using the outer side of the support material as a reference, the stacked connecting material and encapsulation material are cut together to obtain the display module. The outer side of the connecting structure away from the display panel, the outer side of the support layer, and the outer side of the encapsulation layer are all in the same reference plane.

[0034] A third aspect of this application provides a display device, comprising: a plurality of display modules as provided in the first aspect, or display modules prepared by the method for preparing display modules as provided in the second aspect;

[0035] The bracket, at least two display modules, are connected to the support layer of the bracket.

[0036] In some embodiments, the bracket includes a mounting base and a plurality of connecting ribs disposed on the mounting base. The plurality of connecting ribs are arranged at intervals along a first direction, and the support layer is connected to adjacent connecting ribs on both sides along the first direction.

[0037] In some embodiments, the support layer is magnetically connected to the connecting rib.

[0038] In some embodiments, the connecting rib is further provided with a receiving space for placing magnetic components.

[0039] In some embodiments, a second channel is formed between adjacent connecting ribs, and the first channel on the support layer is connected to the second channel, and the signal lines of the display panel pass through the first channel and the second channel in sequence.

[0040] According to the display module, manufacturing method, and display system of this application, by setting the connecting structure in the accommodating space, the thickness unevenness caused by deformation of all or part of the support layer and encapsulation layer can be avoided or reduced, thereby improving the consistency of the display module thickness and improving the flatness of the display surface formed by splicing multiple display modules. By setting the connecting structure around the periphery of the display panel, the opposite sides of the display panel can be protected by the encapsulation layer and the support layer respectively, and the side of the display panel can be protected by the connecting structure, thereby improving the service life of the display panel. Attached Figure Description

[0041] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 is a cross-sectional structural diagram of the display module provided in an embodiment of this application;

[0043] Figure 2 is a cross-sectional structural diagram of the display module provided in an embodiment of this application;

[0044] Figure 3 is a schematic diagram of the planar structure of the display module provided in an embodiment of this application;

[0045] Figure 4 is a schematic diagram of the cross-sectional structure along line AA shown in Figure 3;

[0046] Figure 5 is a flowchart illustrating the manufacturing method of the display module provided in the embodiment of this application;

[0047] Figure 6 is a schematic diagram of the planar structure of the display device provided in an embodiment of this application;

[0048] Figure 7 is a cross-sectional structural diagram of the display device provided in an embodiment of this application.

[0049] The reference numerals are as follows: 10. Display module; 1. Support layer; 11. First surface; 12. Second surface; 13. First channel; 14. Outer side of the support layer; 2. Encapsulation layer; 21. Light-transmitting area; 22. Connection area; 23. Outer side of the encapsulation layer; 3. Display panel; 4. Connection structure; 41. Outer side of the connection structure; 5. Heat dissipation layer; 20. Bracket; 201. Connecting rib; 202. Second channel; 203. Mounting base; 100. Support material; 200. Encapsulation material; 400. Connection material; X, First direction; Y, Second direction. Detailed Implementation

[0050] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of this application by way of example, but should not be used to limit the scope of this application, that is, this application is not limited to the described embodiments.

[0051] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationships, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable tolerance range. "Parallel" is not parallel in the strict sense, but within the allowable tolerance range.

[0052] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0053] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0054] In related technologies, multiple display modules are spliced ​​together to obtain a larger display area. Inconsistent thickness of the fabricated display modules, or deformation of some edges during the splicing process causing uneven thickness, will result in unevenness in the height of the display surface formed by splicing multiple display modules, affecting the display effect of the multiple display modules.

[0055] The display module comprises a support layer, a display panel, and an encapsulation layer stacked sequentially. In the manufactured display module, the support layer and the encapsulation layer are located on opposite sides of the display panel. Deformation of either the support layer or the encapsulation layer will cause a change in the spacing between them, resulting in a change in the thickness of the display module and reducing its uniformity.

[0056] To address the aforementioned issues, this application provides a display module, a manufacturing method, and a display system. The following description, in conjunction with the accompanying drawings, details various embodiments of the display module, manufacturing method, and display system.

[0057] Please refer to Figures 1, 2 and 3. In a first aspect, this application provides a display module, including: a support layer 1, an encapsulation layer 2, a display panel 3 and a connecting structure 4. The support layer 1 and the encapsulation layer 2 are disposed on opposite sides of the display panel 3, and the support layer 1 and the encapsulation layer 2 protrude relative to the display panel 3. The support layer 1, the encapsulation layer 2 and the display panel 3 enclose a receiving space, and the connecting structure 4 is located within the receiving space and is disposed around the periphery of the display panel 3.

[0058] The display panel 3 provided in this application can be a display panel based on an Organic Light Emitting Diode (OLED). Alternatively, it can be a display panel based on a Micro Light Emitting Diode (Micro-LED), a Mini Light Emitting Diode (Mini-LED), or a Quantum Light Emitting Diode (QLED). The display panel 3 is provided with light-emitting units, and multiple light-emitting units can emit different colors of light. By providing light-emitting units for emitting different colors of light, the display panel 3 can be used to display colorful images. The multiple light-emitting units may include a blue light-emitting unit for emitting blue light, a red light-emitting unit for emitting red light, and a green light-emitting unit for emitting green light.

[0059] The support layer 1 may include rigid materials such as stainless steel (e.g., SUS), which are not easily deformed under stress. The support layer 1 can support the display panel 3, maintain the shape of the display panel 3, and provide structural reinforcement for the display panel 3. The support layer 1 can be made of metallic or non-metallic materials. Metallic materials include, but are not limited to, stainless steel, iron, and aluminum, while non-metallic materials include, but are not limited to, acrylic and carbon fiber.

[0060] The encapsulation layer 2 may include light-transmitting materials such as epoxy resin and acrylic organic adhesive. The encapsulation layer 2 can protect the display panel 3, reduce damage to the display panel 3 from external forces, reduce the entry of external moisture into the display panel 3, and improve the light emission effect of the display panel 3.

[0061] The support layer 1, display panel 3, and encapsulation layer 2 can be arranged sequentially along the first direction X. The light-emitting surface of the display panel 3 faces the encapsulation layer 2, and the backlight surface of the display panel 3 faces the support layer 1. The light emitted by the display panel 3 passes through the encapsulation layer 2 and is emitted outward. The outer surface of the display panel 3 is the surface connecting the light-emitting surface and the backlight surface. The support layer 1 and the encapsulation layer 2 are protruding relative to the display panel 3. The support layer 1 can be protruding from either side of the display panel 3 away from the center of the display panel 3. That is, the projected area of ​​the support layer 1 along the first direction X is larger than the projected area of ​​the display panel 3 along the first direction X, and the projected area of ​​the display panel 3 along the first direction X is located within the projected area of ​​the support layer 1 along the first direction X. Optionally, the support layer 1 is always protruding relative to the display panel 3 along its circumference. Alternatively, the encapsulation layer 2 can be configured to protrude from the center of the display panel 3 on either side of the display panel 3, meaning the projected area of ​​the encapsulation layer 2 along the first direction X is larger than the projected area of ​​the display panel 3 along the first direction X, and the projected area of ​​the display panel 3 along the first direction X is located within the projected area of ​​the encapsulation layer 2 along the first direction X. Optionally, the encapsulation layer 2 can be configured to protrude from the display panel 3 along its circumference.

[0062] The support layer 1 and the encapsulation layer 2 protrude relative to the display panel 3, forming an accommodating space between the support layer 1, the display panel 3, and the encapsulation layer 2, which facilitates the installation of the connection structure 4 within the accommodating space. The display panel 3 can be positioned between the support layer 1 and the encapsulation layer 2 first, and then the connection structure 4 can be installed around the periphery of the display panel 3 within the formed accommodating space.

[0063] The connecting structure 4 is located within the accommodating space, enabling it to connect at least one of the following: the support layer 1 and the display panel 3; the encapsulation layer 2 and the display panel 3; and the support layer 1 and the encapsulation layer 2. The connecting structure 4 can reinforce the portions of the support layer 1 and the encapsulation layer 2 that protrude relative to the display panel 3, thereby preventing or reducing deformation of all or part of either the support layer 1 or the encapsulation layer 2.

[0064] In this embodiment, by setting the connecting structure 4 in the accommodating space, the thickness unevenness caused by deformation of all or part of the support layer 1 and the encapsulation layer 2 is avoided or reduced, thereby improving the consistency of the thickness of the display module 10 and improving the flatness of the display surface formed by splicing multiple display modules 10. By setting the connecting structure 4 around the periphery of the display panel 3, the opposite sides of the display panel 3 can be protected by the encapsulation layer 2 and the support layer 1 respectively, and the side of the display panel 3 can be protected by the connecting structure 4, thereby improving the service life of the display panel 3.

[0065] In some embodiments, the connecting structure 4 connects the support layer 1 and the encapsulation layer 2, so that the connecting structure 4 can apply a tensile force to the support layer 1 in a direction close to the encapsulation layer 2, and can apply a tensile force to the encapsulation layer 2 in a direction close to the support layer 1. That is, the connecting structure 4 applies a tensile force along the first direction X to the support layer 1 and the encapsulation layer 2, thereby avoiding or reducing deformation of all or part of the area of ​​either the support layer 1 or the encapsulation layer 2, avoiding or reducing the increase of the spacing between the support layer 1 and the encapsulation layer 2, ensuring uniform thickness throughout the display module 10, and improving the consistency of the thickness of the display module 10. The connecting structure 4 can protect the edges of the display panel 3, preventing damage from impacts and improving its drop resistance.

[0066] In some embodiments, the connection structure 4 fills the accommodating space.

[0067] The connecting structure 4, which overflows from the accommodating space, can be prepared using processes such as slit dispensing and slit spraying. The overflow portion of the connecting structure 4 is then trimmed to ensure that it fills the accommodating space. This filling of the accommodating space allows for the placement of more connecting structures 4 within the space, which improves the contact area between the connecting structure 4 and the support layer 1, as well as the contact area between the connecting structure 4 and the encapsulation layer 2.

[0068] In some embodiments, the outer side 41 of the connection structure 4 away from the display panel 3, the outer side 14 of the support layer 1, and the outer side 23 of the encapsulation layer 2 are in the same reference plane.

[0069] The outer side 41 of the connecting structure 4, the outer side 14 of the support layer 1, and the outer side 23 of the encapsulation layer 2 are in the same reference plane so that the display module 10 has a flat side, so that when multiple display modules 10 are spliced ​​together, the sides of adjacent display modules 10 are in flat contact, reducing the gap between adjacent display modules 10.

[0070] The prepared display module can be cut to obtain the outer side 41 of the connecting structure 4 facing away from the display panel 3, the outer side 14 of the support layer 1, and the outer side 23 of the encapsulation layer 2 all lying in the same reference plane. This prevents any of the three components—the connecting structure 4, the support layer 1, and the encapsulation layer 2—from protruding outwards, which helps reduce the splicing gaps formed when multiple display modules 10 are spliced ​​together and improves the display effect of the display surface formed by splicing multiple display modules 10. When cutting to obtain a display module with a flat outer side, the connecting structure 4, the support layer 1, and the encapsulation layer 2 can be cut in one piece, so that the resulting connecting structure 4 tightly connects the support layer 1 and the encapsulation layer 2.

[0071] Optionally, the reference plane is a plane parallel to the first direction X.

[0072] Optionally, both the support layer 1 and the encapsulation layer 2 are rectangular plates, the projection of the display module 10 along the first direction X is rectangular, and the connecting structure 4 is a hollow rectangular ring surrounding the display panel 3.

[0073] In some embodiments, the encapsulation layer 2 includes a light-transmitting area 21 and a connecting area 22. The light-transmitting area 21 is located on one side of the display area of ​​the display panel 3, and the connecting area 22 is located on one side of the connecting structure 4 and connected to the connecting structure 4. The color of the connecting area 22 is the same as the color of the connecting structure 4.

[0074] The display panel 3 has a display area and a non-display area surrounding at least a portion of the display area, with light-emitting units disposed in the display area. A light-transmitting area 21 is made of a light-transmitting material and is located on one side of the display area of ​​the display panel 3, allowing light emitted by the light-emitting units to pass through it. Some circuitry of the display panel 3 may be located in the non-display area, and the connection area 22 may be located on one side of the non-display area. Optionally, the orthographic projection of the display area onto the encapsulation layer 2 is located in the light-transmitting area 21.

[0075] Optionally, the connection area 22 is made of a light-shielding material that is different from the light-transmitting area 21, in order to block the non-display area and the connection structure 4, reduce the light emitted by the light-emitting unit from passing through the connection area 22, and cause light leakage in the display module 10.

[0076] Different light-transmitting materials are used in the encapsulation layer 2, resulting in different colors, such as pale yellow. The light-transmitting area 21 and the connecting area 22 can be made of the same material. Optionally, the light-transmitting area 21, the connecting area 22, and the connecting structure 4 can be the same color to improve the consistency of light reflected from the encapsulation layer 2 and light reflected from the connecting structure 4, which is beneficial to improving the consistency of the appearance of the display module 10.

[0077] In some embodiments, the connection structure 4 is an insulating material with an insulation resistance greater than 107 Ωmm² / m, so that the connection structure 4 can improve the electrostatic discharge (ESD) protection capability of the display panel 3 and extend the product life.

[0078] In some embodiments, the connecting structure 4 is a water-oxygen barrier material, and the water vapor transmission rate (WVTR) of the connecting structure 4 is less than 1 g / m³. 2 •day, so that the connection structure 4 can encapsulate the display panel 3, improve the water and oxygen barrier ability of the display panel 3, and extend the product life.

[0079] In some embodiments, the material of the encapsulation layer 2 is the same as the material of the connection structure 4.

[0080] The fact that the materials of the encapsulation layer 2 and the connecting structure 4 are the same makes it less likely for light to be refracted at the interface between the encapsulation layer 2 and the connecting structure 4 when the encapsulation layer 2 and the connecting structure 4 are formed in stages, thereby improving the compatibility of the encapsulation layer 2 and the connecting structure 4 and improving the connection strength between the encapsulation layer 2 and the connecting structure 4.

[0081] In some embodiments, the encapsulation layer 2 and the connecting structure 4 are not integrally formed, allowing them to be made of different materials to possess different physicochemical properties. The non-integral nature of the encapsulation layer 2 and the connecting structure 4 allows them to be fabricated in stages, for example, by first fabricating the encapsulation layer 2 and then fabricating the connecting structure 4 that connects the encapsulation layer 2 and the support layer 1. When the display panel 3 has a large size, an encapsulation layer 2 matching the display panel 3 can be pre-fabricated and then installed on the display panel 3, thereby reducing the difficulty of fabricating the encapsulation layer 2.

[0082] In some embodiments, the support layer 1 has a first surface 11 and a second surface 12 disposed opposite to each other, the first surface 11 being located on the side of the second surface 12 away from the display panel 3, and the first surface 11 being planar.

[0083] The outer surface 14 of the support layer 1 connects to the first surface 11 and the second surface 12. The first surface 11 of the support layer 1 can be used to support the display panel 3. Both the first surface 11 and the second surface 12 can be flat. When the second surface 12 is flat, it is beneficial to support a flat display panel 3. When the first surface 11 is flat, it eliminates the need for structural components to be fastened to the bracket 20, allowing multiple display modules 10 to be spliced ​​together via the bracket 20. Compared to structural components with grooves, protrusions, etc., the first surface 11 of the support layer 1 used to connect the bracket 20 is flat, thereby reducing the thickness difference of the support layer 1 in different display modules 10 and improving the consistency of the thickness of the display modules 10.

[0084] In some embodiments, the support layer 1 includes a magnetic material. The support layer 1 can be magnetically attached to the bracket 20 to achieve a connection with the bracket 20.

[0085] Optionally, when the display modules 10 are spliced, the magnetic properties of the adjacent ends of the support layer 1 of the adjacent display modules 10 are opposite, so that the adjacent display modules 10 can be magnetically attracted and fixed by the support layer 1.

[0086] In some embodiments, the support layer 1 includes an adhesive material. The support layer 1 can be adhered to the bracket 20 to achieve a connection with the bracket 20. Optionally, the adhesive material is a double-sided adhesive film.

[0087] Please refer to Figure 2. In some embodiments, the thickness H1 of the support layer 1 along the direction from the support layer 1 to the encapsulation layer 2 is 0.01 mm to 1 mm.

[0088] The support layer 1 can be a plate-like structure with a thickness of 0.01mm to 1mm, and the thickness tolerance of the support layer 1 in different display modules 10 is ≤10%. Compared with structural components with grooves, protrusions, etc., the thickness of the support layer 1 is much smaller than the thickness of the structural components, thereby reducing the total thickness of the display module 10 and facilitating the thinning of the display module 10. The smaller the thickness of the support layer 1, the smaller the difference in thickness between different support layers 1, which helps to improve the consistency of the thickness of the display module 10. Optionally, the thickness H1 is 0.01mm, 0.05mm, 0.1mm, 0.3mm, 0.5mm, 0.7mm, 0.9mm, or 1mm.

[0089] In some embodiments, the display module 10 further includes a heat dissipation layer 5, and the support layer 1, the heat dissipation layer 5 and the display panel 3 are stacked in sequence.

[0090] The heat dissipation layer 5 can be made of materials with good thermal conductivity, such as graphite and thermally conductive adhesive. The heat dissipation layer 5 can absorb the heat energy emitted by the display panel 3 and then conduct it to the support layer 1, the connecting structure 4, etc. to spread outward.

[0091] In some embodiments, the connecting structure 4 is arranged around the periphery of the heat dissipation layer 5, so that the connecting structure 4 can encapsulate the heat dissipation layer 5 together, which helps to reduce the entry of external moisture into the display panel 3 through the heat dissipation layer 5.

[0092] In some embodiments, the heat dissipation layer 5 adheres to the support layer 1 and the display panel 3.

[0093] When the heat dissipation layer 5 is made of an adhesive thermally conductive material, the thermally conductive material can directly bond the support layer 1 and the display panel 3. When the thermally conductive layer in the heat dissipation layer 5 is made of a non-adhesive thermally conductive material, the heat dissipation layer 5 also includes a first adhesive layer and a second adhesive layer. The first adhesive layer and the second adhesive layer are respectively disposed on opposite sides of the thermally conductive layer. The thermally conductive layer bonds the support layer 1 through the first adhesive layer and bonds the display panel 3 through the second adhesive layer.

[0094] Please refer to Figures 3 and 4. In some embodiments, the support layer 1 has a first channel 13, and the display panel 3 includes a main body and signal lines connecting the main body, with the signal lines passing through the first channel 13.

[0095] The first channel 13 can be a through hole or through slot located on the support layer 1. The main body of the display panel 3 can include a driving substrate, display units, etc. The signal lines connecting the main body can be flexible signal lines extending from the driving substrate, passing through the first channel 13 to connect with an external control system. Alternatively, the signal lines connecting the main body can be flexible signal lines extending from the driving chip of the display panel 3, passing through the first channel 13 to connect with an external control system.

[0096] By setting up a first channel 13 for signal lines to pass through, the support layer 1 is prevented from blocking the signal lines from connecting to the external control system.

[0097] When a heat dissipation layer 5 is provided, the heat dissipation layer 5 has a clearance opening corresponding to the first channel 13, so that the signal line can pass through the clearance opening and the first channel 13.

[0098] A second aspect of this application provides a method for manufacturing a display module 10, the method comprising:

[0099] S110, take the display panel 3 that is set on the support material 100;

[0100] S120, an encapsulation material 200 is provided on the side of the display panel 3 away from the support material 100. The support material 100 and the encapsulation material 200 protrude relative to the display panel 3, and the support material 100, the encapsulation material 200 and the display panel 3 enclose and form an accommodating space.

[0101] S130, a connecting material 400 is provided around the periphery of the display panel 3 in the accommodating space to obtain an intermediate part, wherein the connecting material 400 connects the support material 100 and the encapsulation material 200.

[0102] S140, the edge of the intermediate component is cut to obtain the display module 10, the support material 100 is cut to form the support layer 1, the encapsulation material 200 is cut to form the encapsulation layer 2, and the connecting material 400 is cut to form the connecting structure 4.

[0103] Please refer to Figure 5. As shown in Figure 5(a), a support material 100 with the same size as the required support layer 1 or a larger size can be pre-prepared, and the heat dissipation layer 5 and the display panel 3 are placed on the support material 100. As shown in Figure 5(b), an encapsulation material 200 is then placed on the side of the display panel 3 away from the support material 100 by means of attachment, molding, coating, etc. The encapsulation material 200 can be a pre-prepared plate, and in S120, the plate-shaped encapsulation material 200 can be fixed to one side of the display panel 3.

[0104] Both the support material 100 and the encapsulation material 200 are larger than the display panel 3, so that the support material 100 and the encapsulation material 200 cover both sides of the display panel 3, and there is an accommodating space between the support material 100 and the encapsulation material 200. As shown in Figure 5(c), the connecting material 400 can be placed in the accommodating space by dispensing or spraying, and the connecting material 400 cures to connect the encapsulation material 200 and the support material 100. When setting the connecting material 400, the outlet of the connecting material 400 can be controlled to rotate around the display panel 3, or the display panel 3 can rotate itself, so that the connecting material 400 can surround the periphery of the display panel 3.

[0105] S140 can use laser cutting, mechanical cutting, or other methods to cut at least one of the support material 100, encapsulation material 200, and connecting material 400 to give the display module 10 a flat side surface. As shown in Figure 5(c), where the dashed arrow indicates the laser used for cutting, and as shown in Figure 5(d), the side surfaces of the support layer 1, the connecting structure 4, and the encapsulation layer 2 obtained by cutting are located on the same reference plane.

[0106] In this embodiment, by setting the connecting structure 4 in the accommodating space, the thickness unevenness caused by deformation of all or part of the support layer 1 and the encapsulation layer 2 is avoided or reduced, thereby improving the consistency of the thickness of the display module 10 and improving the flatness of the display surface formed by splicing multiple display modules 10. By setting the connecting structure 4 around the periphery of the display panel 3, the opposite sides of the display panel 3 can be protected by the encapsulation layer 2 and the support layer 1 respectively, and the side of the display panel 3 can be protected by the connecting structure 4, thereby improving the service life of the display panel 3.

[0107] In some embodiments, S140 includes:

[0108] S141, the stacked support material 100, connecting material 400 and encapsulation material 200 are cut together to obtain display module 10. The outer side of the connecting structure 4 away from the display panel 3, the outer side of the support layer 1 and the outer side of the encapsulation layer 2 are in the same reference plane.

[0109] During the manufacturing process, the support material 100, connecting material 400, and encapsulation material 200 can be irregularly positioned away from the outer surface of the display panel 3. This means that the size and shape requirements for the support material 100 and encapsulation material 200 are low. It is only necessary to ensure that the size of the support material 100 and encapsulation material 200 is larger than the size of the display panel 3. The support material 100, connecting material 400, and encapsulation material 200 are cut together according to the required size so that the outer surfaces of each layer are in the same reference plane. The support material 100, connecting material 400, and encapsulation material 200 are then corrected to the required size.

[0110] In some embodiments, S140 includes:

[0111] S142, using the outer side of the support material 100 as a reference, the stacked connecting material 400 and the encapsulation material 200 are cut together to obtain the display module 10. The connecting structure 4 is located away from the outer side of the display panel 3, the outer side of the support layer 1 and the outer side of the encapsulation layer 2 in the same reference plane.

[0112] During the fabrication process, a support material 100 is prepared in advance according to the required dimensions of the support layer 1. The support material 100, connecting material 400, and encapsulation material 200 can be staggered relative to the outer surface of the display panel 3. This means that the requirements for the size and shape of the encapsulation material 200 are low, as are the alignment requirements for the support material 100 and the encapsulation material 200. Only the dimensions of the encapsulation material 200 need to be larger than the dimensions of the display panel 3. Using the support material 100 as a reference, the connecting material 400 and the encapsulation material 200 are cut together to ensure that the outer surfaces of the connecting material 400 and the encapsulation material 200 are aligned with the outer surface of the support material 100, both within the same reference plane. The connecting material 400 and the encapsulation material 200 are then corrected to the required dimensions.

[0113] The third aspect of this application provides a display device, as shown in Figures 6 and 7. The display device includes: a display module 10 as provided in the first aspect, or a display module 10 prepared by the preparation method provided in the second aspect; and a bracket 20, wherein a support layer 1 of at least two display modules 10 is connected to the bracket 20.

[0114] The bracket 20 can be connected to at least two display modules 10 at the same time, and the at least two display modules 10 can be spliced ​​together, so that the same image can be displayed through at least two display modules 10, so as to obtain a larger display area than a single display module 10.

[0115] The bracket 20 can provide support for at least two display modules 10, and can also be used to install at least two display modules 10 on a target location such as a wall.

[0116] In some embodiments, the bracket 20 includes a mounting base 203 and a plurality of connecting ribs 201 disposed on the mounting base 203. The plurality of connecting ribs 201 are arranged at intervals along the second direction Y, and the support layer 1 is connected to the adjacent connecting ribs 201 on both sides along the second direction Y.

[0117] The support layer 1 is connected to the adjacent connecting ribs 201 on both sides along the second direction Y, so that the empty area between the adjacent connecting ribs 201 can correspond to the support layer 1, which is conducive to heat dissipation of the support layer 1.

[0118] In some embodiments, the support layer 1 is magnetically connected to the connecting rib 201.

[0119] At least one of the support layer 1 and the connecting rib 201 is made of magnetic material so that the support layer 1 and the connecting rib 201 can be magnetically attracted, thereby eliminating the need for riveting and snap-fit ​​structures and helping to reduce the thickness of the display module 10.

[0120] The bracket 20 also includes a magnetic element 204, and the connecting rib 201 also has a receiving space for the magnetic element 204, which is disposed within the receiving space.

[0121] In some embodiments, a second channel 202 is formed between adjacent connecting ribs 201, and the first channel 13 on the support layer 1 is connected to the second channel 202. The signal lines of the display panel 3 pass through the first channel 13 and the second channel 202 in sequence.

[0122] The first channel 13 and the second channel 202 are connected, so that the signal line can extend to the edge of the display device through the first channel 13 and the second channel 202 in sequence, so as to facilitate connection with external circuits or external control modules.

[0123] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, wherein, The display module includes: Display panel; A support layer and an encapsulation layer are disposed on opposite sides of the display panel. The support layer and the encapsulation layer protrude relative to the display panel. The support layer, the encapsulation layer, and the display panel together form an accommodating space. A connecting structure is located in the accommodating space and is arranged around the periphery of the display panel.

2. The display module according to claim 1, wherein, The connection structure connects the support layer and the encapsulation layer.

3. The display module according to claim 1, wherein, The connecting structure fills the accommodating space.

4. The display module according to claim 1, wherein, The connection structure is located on the same reference plane as the outer side of the display panel, the outer side of the support layer, and the outer side of the encapsulation layer.

5. The display module according to claim 1, wherein, The connection structure is made of insulating material. And / or, the material of the encapsulation layer is the same as the material of the connection structure.

6. The display module according to claim 1, wherein, The encapsulation layer and the connection structure are not integrally molded structures.

7. The display module according to claim 1, wherein, The support layer has a first surface and a second surface disposed opposite to each other, the first surface being located on the side of the second surface away from the display panel, and the first surface being planar.

8. The display module according to claim 1, wherein, The support layer comprises a magnetic material.

9. The display module according to claim 1, wherein, The thickness of the support layer along the direction from the support layer to the encapsulation layer is 0.01 mm to 1 mm.

10. The display module according to claim 1, wherein, The display module also includes: The heat dissipation layer, the support layer, and the display panel are stacked in sequence.

11. The display module according to claim 10, wherein, The connection structure is arranged around the periphery of the heat dissipation layer.

12. The display module according to claim 10, wherein, The heat dissipation layer bonds the support layer and the display panel.

13. The display module according to claim 1, wherein, The support layer has a first channel, and the display panel includes a main body and a signal line connected to the main body, the signal line passing through the first channel.

14. A method for manufacturing a display module, wherein, The method includes: Take the display panel that is mounted on the supporting material; An encapsulation material is provided on the side of the display panel away from the support material. The support material and the encapsulation material protrude relative to the display panel, and the support material, the encapsulation material, and the display panel enclose and form an accommodating space. A connecting material is provided around the periphery of the display panel within the accommodating space to obtain an intermediate component; The edges of the intermediate component are cut to obtain a display module. The support material is cut to form a support layer, the encapsulation material is cut to form an encapsulation layer, and the connecting material is cut to form a connecting structure.

15. The preparation method according to claim 14, wherein, The step of cutting the edge of the intermediate component to obtain the display module includes: The stacked support material, connecting material, and encapsulation material are cut together to obtain the display module. The outer side of the connecting structure facing away from the display panel, the outer side of the support layer, and the outer side of the encapsulation layer are all in the same reference plane.

16. The preparation method according to claim 14, wherein, The step of cutting the edge of the intermediate component to obtain the display module includes: Using the outer side of the supporting material as a reference, the stacked connecting material and the encapsulation material are cut together to obtain the display module. The outer side of the connecting structure facing away from the display panel, the outer side of the supporting layer, and the outer side of the encapsulation layer are all in the same reference plane.

17. A display device, wherein, include: Multiple display modules as described in any one of claims 1 to 13, or display modules prepared by the method of preparing display modules as described in any one of claims 14 to 16; A bracket, wherein at least two support layers of the display modules are connected to the bracket.

18. The display device according to claim 17, wherein, The bracket includes a mounting base and a plurality of connecting ribs disposed on the mounting base. The plurality of connecting ribs are arranged at intervals along a first direction, and the support layer is connected to the adjacent connecting ribs on both sides along the first direction.

19. The display device according to claim 18, wherein, The support layer is magnetically connected to the connecting rib; and / or, the connecting rib is further provided with a receiving space for placing magnetic components.

20. The display device according to claim 18, wherein, A second channel is formed between adjacent connecting ribs, and the first channel on the support layer is connected to the second channel. The signal lines of the display panel pass through the first channel and the second channel in sequence.

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