Method for applying a protective coating, and protective coating system
The solvent-free polymer coating method addresses edge coverage issues by evaporating solvent before application, ensuring durable protection for printed circuit board components and connections.
WO2026125224A1 Publication Date: 2026-06-18ROBERT BOSCH GMBH
4 Cites 0 Cited by
Patent Information
- Application Number
- PCT/EP2025/085826
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-11
- Filing Date
- 2025-12-08
- Publication Date
- 2026-06-18
AI Technical Summary
Technical Problem
Conventional protective coatings on printed circuit boards inadequately cover the edges of components and connections, such as solder joints, leading to premature failure due to corrosion and mechanical stress.
Method used
A protective coating method and system that uses a solvent-free polymer by reducing solvent content through evaporation before application, ensuring the coating adheres effectively to edges by controlling temperature, pressure, and nozzle design to maintain low viscosity.
Benefits of technology
Ensures comprehensive edge coverage of components and connections, providing durable protection against corrosion and mechanical stress.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to a method for applying a protective coating (5) onto a printed circuit board (1) populated with electrical / electronic components (3), wherein a liquid protective agent is sprayed onto the printed circuit board (1) by means of a nozzle (11) and is cured in order to obtain the protective coating (5). According to the invention, the protective agent (5) comprises a polymer and a solvent as a carrier substance for the polymer, and the solvent is reduced on the path from the nozzle (11) to the printed circuit board (1) in order to obtain an at least substantially solvent-free protective coating (5).
Need to check novelty before this filing date? Find Prior Art