Collection facilitation method, collection facilitation device, component mounting machine, and feeder

Abstract

This feeder has a support member in which a planar portion including a support surface for supporting a component is formed. In the planar portion, a supply region to which the component is supplied such that collection is possible and a non-supply region to which the component is not supplied are formed separately so as not to overlap. This collection facilitation method for facilitating a collection operation in which a holding member collects the component supplied by the feeder includes: a measurement step for measuring the respective height positions of three or more different measurement points in the non-supply region on the planar portion of the feeder; a calculation step for calculating, on the basis of the result of the measurements in the measurement step, the inclination of the planar portion of the feeder with respect to the horizontal and the height position of the planar portion of the feeder in the supply region; and an adjustment step for adjusting, on the basis of the result of the calculations in the calculation step, the collection height for each collection operation in which the holding member collects the component supplied to the supply region.

Description

Component Taking Support Method, Component Taking Support Device, Component Mounting Machine, and Feeder 【0001】 This specification relates to a component taking support method, a component taking support device, a component mounting machine, and a feeder. 【0002】 Conventionally, a system for supporting a taking operation in which a holding member takes a component supplied by a feeder has been known (see, for example, Patent Document 1). In the system described in Patent Document 1, as a first aspect, four measurement points are set on the bottom surfaces of the four corner cavities among a plurality of cavities in which components are accommodated, the height positions of each of these four measurement points are measured, a plane including these four measurement points is calculated, and the height position and inclination of a support surface that supports the component are calculated (paragraph

[0051] ). 【0003】 Further, as a second aspect, four different measurement points are set on the upper surface (measurement surface) of a mask plate that is at the same height as the opening surface of the cavity, the height positions of each of these four measurement points are measured, a plane including points obtained by shifting each of these four measurement points downward by an amount corresponding to the thickness of the mask plate is calculated, and the height position and inclination of a support surface that supports the component are calculated (paragraphs

[0055] to

[0056] ). 【0004】 Further, as a third aspect, a pair of measurement points are set on a fixed seat surface that is bolt-fastened on the tip side of the upper surface of a guide member, and a pair of measurement points are set on a bridge surface that is the upper surface of a bridge portion connecting a pair of side walls on the upstream side in the conveyance direction. The height positions of each of the pair of measurement points on the fixed seat surface and the height positions of each of the pair of measurement points on the bridge surface are measured. Then, a plane is calculated from points obtained by shifting each of the pair of measurement points on the fixed seat surface downward by an amount corresponding to the separation amount between the fixed seat surface and the support surface and points obtained by shifting each of the pair of measurement points on the bridge surface downward by an amount corresponding to the separation amount between the bridge surface and the support surface, and the height position and inclination of a support surface that supports the component are calculated (paragraphs

[0057] to

[0059] ). 【0005】Then, based on the height and inclination of the support surface calculated as described above, the height of the support surface for each cavity is measured, the sampling height of the holding member for sampling the target part is set, and the sampling operation of the part by the holding member is performed. This prevents the holding member from contacting the top surface of the part due to differences in the height of the support surface supporting the part in each cavity during the sampling operation of the part by the holding member, or reduces the impact of such contact on other parts. 【0006】 International Publication No. 2024-053048 【0007】 However, in methods that calculate the height position and inclination of the support surface supporting the component as described in the second and third embodiments above, the bottom surface of the cavity in which the component is actually supported is not used as the measurement point. Instead, the measurement point becomes the top surface of the mask plate or the bolt fixing surface, which have a height difference relative to the bottom surface of the cavity. Therefore, when the thickness of the mask plate does not match the specified thickness, or when the height difference between the bottom surface of the cavity and the bolt fixing surface is not as specified, it becomes impossible to accurately calculate the height position and inclination of the support surface. 【0008】 Furthermore, in the method in which the height position and inclination of the support surface that supports the component are calculated as in the first embodiment described above, the bottom surface of the cavity in which the component is actually supported becomes the measurement point. Therefore, the situation of reduced accuracy in calculating the support surface due to the height position deviation described above does not occur. However, it may be difficult to measure the height position at the measurement point when a component is housed inside the cavity or when the cavity is narrow. 【0009】 This specification aims to provide a sampling support method, a sampling support device, a component mounting machine, and a feeder that can accurately calculate the height position and inclination of the support surface supporting each component, while also stabilizing the sampling of each component by a holding member. 【0010】This specification discloses a sampling support method for assisting a sampling operation in which a holding member samples a component supplied by a feeder, wherein the feeder has a support member formed with a planar portion including a support surface for supporting the component, and the planar portion is formed in such a way that a supply area where the component is supplied in a sampling manner and a non-supply area where the component is not supplied are separated without overlapping, and the sampling support method comprises: a measurement step of measuring the height position of three or more different measurement points in the non-supply area on the planar portion; a calculation step of calculating the inclination of the planar portion with respect to the horizontal and the height position within the supply area based on the measurement results in the measurement step; and an adjustment step of adjusting the sampling height of the holding member for each sampling operation of sampling the component supplied to the supply area based on the calculation results in the calculation step. 【0011】 This specification discloses a sampling support device that assists a sampling operation in which a holding member picks up a component supplied by a feeder, wherein the feeder has a support member formed with a flat portion including a support surface for supporting the component, and the support member is formed such that a supply area where the component is supplied in a pickable manner and a non-supply area where the component is not supplied are separated without overlapping with each other, and the sampling support device comprises a measuring unit that measures the height positions of three or more different measuring points in the non-supply area on the flat portion, a calculation unit that calculates the inclination of the flat portion with respect to the horizontal and the height position within the supply area based on the measurement results by the measuring unit, and an adjustment unit that adjusts the sampling height of the holding member for each sampling operation that picks up the component supplied to the supply area based on the calculation results by the calculation unit. 【0012】This specification discloses a component mounting machine comprising: a support member provided on a feeder, having a flat portion including a support surface for supporting components, wherein the flat portion is divided into a supply area where components are supplied in a pickable manner and a non-supply area where components are not supplied, without overlapping with each other; a measuring unit for measuring the height positions of three or more different measuring points in the non-supply area on the flat portion; a calculation unit for calculating the inclination of the flat portion with respect to the horizontal and the height position within the supply area based on the measurement results from the measuring unit; and an adjustment unit for adjusting the picking height for each picking operation of the holding member for picking up the components supplied to the supply area based on the calculation results from the calculation unit. 【0013】 This specification discloses a feeder comprising: a support member having a planar portion including a support surface for supporting a component, wherein the planar portion is formed such that a supply area for supplying the component in a collectible manner and a non-supply area for which the component is not supplied are separated without overlap; and three or more distinct measuring points provided in the non-supply area on the planar portion, each of which is subject to measurement of its height position. 【0014】 According to these disclosed configurations, the height position and inclination of the support surface supporting each component can be calculated accurately, while the sampling of each component by the holding member can be stabilized with high precision. 【0015】 Furthermore, this specification also discloses the technical idea of ​​changing "the parts mounting machine described in claim 5" to "the parts mounting machine described in any one of claims 3 to 5" in claim 6 of the original application, the technical idea of ​​changing "the parts mounting machine described in claim 3" to "the parts mounting machine described in any one of claims 3 to 6" in claim 7 of the original application, and the technical idea of ​​changing "the parts mounting machine described in claim 3" to "the parts mounting machine described in any one of claims 3 to 7" in claim 8 of the original application. 【0016】This is a plan view of the parts mounting machine. This is a side view of the parts transfer device equipped with the parts mounting machine. This is a configuration diagram of the bulk feeder. This is a top view of the main part of the bulk feeder. This is a side view of the bulk feeder. This is a cross-sectional view of the bulk feeder when cut along the straight line VI-VI shown in Figure 4. This diagram shows the sampling height of the suction nozzle during the sampling operation, as well as the amount of descent of the suction nozzle when the flat surface of the base plate is inclined relative to the horizontal. This diagram shows the relationship between the supply area, non-supply area, and measurement point of the height measurement target on the flat surface of the bulk feeder. This is a configuration diagram of the parts mounting machine. This is a flowchart of an example of a control routine executed during the sampling support process in the sampling support unit equipped with the control device. This is a flowchart of an example of a control routine executed during the mounting process in the parts mounting machine. 【0017】 The sampling support method, sampling support device, component mounting machine, and feeder according to the embodiment will be described below with reference to Figures 1 to 11. 【0018】 1. Configuration of the Component Mounting Machine 1-1. Basic Configuration The component mounting machine 1 is a device that mounts components onto a substrate. The component mounting machine 1 constitutes a substrate production line that produces substrate products using multiple types of substrate-to-substrate work machines, including, for example, other component mounting machines 1, a printing press, an inspection device, a reflow oven, etc. As shown in Figure 1, the component mounting machine 1 is equipped with a substrate transport device 10, a component supply device 20, and a component transfer device 30. 【0019】 The substrate transport device 10 is a device that transports substrates B in the transport direction X. The substrate transport device 10 can sequentially transport multiple substrates B in the transport direction X and position the substrates B at predetermined positions for component mounting. 【0020】 The component supply device 20 is a device that supplies components P to be mounted on a circuit board B. The component supply device 20 has a feeder 21 and a slot 22 in which the feeder 21 is installed. Multiple slots 22 are provided in the component supply device 20. The component supply device 20 can supply components with multiple feeders 21 set in the slots 22. 【0021】Feeder 21 is, for example, a tape feeder that feeds and moves a carrier tape containing multiple parts P at predetermined intervals along the length of the tape to supply parts P to a predetermined supply position in a way that allows them to be picked up, or a bulk feeder that supplies parts P in a way that allows them to be picked up, even when they are contained in bulk (i.e., in a loose state with an inconsistent orientation). The bulk feeder 50 will be described in detail later. 【0022】 The component transfer device 30 is a device that transfers components P supplied to a predetermined supply position by the component supply device 20 to a predetermined mounting position on a substrate B positioned at a predetermined position by the substrate transport device 10. As shown in Figures 1 and 2, the component transfer device 30 includes a mounting head 31, a movable table 32, and a head drive device 33. The mounting head 31 is a member to which a holding member 40 for holding components is attached. The movable table 32 is a base to which the mounting head 31 is detachably fixed. The head drive device 33 is a device that moves the movable table 32 to which the mounting head 31 is fixed in the horizontal direction (i.e., the transport direction X and the orthogonal direction Y perpendicular to the transport direction X). 【0023】 The mounting head 31 has a rotary head 34, as shown in Figure 2. The rotary head 34 supports a plurality of holders 36 so that they can be individually raised and lowered in the vertical direction Z and rotated around a Q axis extending in the vertical direction Z. A holding member 40 capable of holding a part P is attached to each holder 36. The holding member 40 is either a suction nozzle that sucks and collects the part P using supplied negative pressure air and then holds it by suction, or a chuck that grips and collects the part P and then holds it. Hereinafter, the holding member 40 will be assumed to be a suction nozzle and will be referred to as the suction nozzle 40. 【0024】The mounting head 31 has an R-axis rotation device 35 that rotates the rotary head 34 around the R-axis, which extends in the vertical Z direction. The R-axis rotation device 35 determines the lifting angle position for one holder 36 to be raised and lowered by the lifting device 38 described later, by setting the angle of the rotary head 34 to a predetermined angle around the R-axis. The mounting head 31 has a Q-axis rotation device 37 that rotates the holder 36 around the Q-axis. In this embodiment, the Q-axis rotation device 37 has a mechanism that rotates multiple holders 36 in conjunction, and rotates multiple holders 36 synchronously. 【0025】 The mounting head 31 has a lifting device 38 for raising and lowering the holder 36. The lifting device 38 raises or lowers the suction nozzle 40 attached to the holder 36 by lowering or raising the holder 36 that has been positioned at a lifting angle by the rotation of the rotary head 34 from among the multiple holders 36. The mounting head 31 may also have two or more lifting devices 38, and a configuration may be adopted in which the holder 36 positioned by each can be raised and lowered independently. 【0026】 The number of holders 36 in the mounting head 31 may vary depending on the type of mounting head 31. Furthermore, the mounting head 31 may support multiple holders 36 in an annular shape at equal intervals, as shown in Figure 1, or it may support multiple holders 36 arranged linearly or in a matrix. 【0027】 1-2. Configuration of the Bulk Feeder Unlike tape feeders that use carrier tapes, the bulk feeder 50 supplies parts P stored in parts cases in bulk. The bulk feeder 50 is an effective feeder because it eliminates the need to load carrier tapes and collect used tapes. 【0028】One type of bulk feeder 50 supplies parts P in an irregular orientation to a planar supply area S. However, if the parts P are so close together in the supply area S that they are in contact with each other, or if they are stacked on top of each other in the vertical direction, or if the parts P are in a horizontal position with their sides facing up and down, the parts mounting machine 1 cannot pick up these parts P. Therefore, in order to increase the proportion of parts P that can be picked up, there is a type of bulk feeder 50 that supplies parts P in an aligned state in the supply area S. In this embodiment, a bulk feeder 50 of the type that aligns parts P will be described below with reference to Figures 3 to 6. 【0029】 The bulk feeder 50 has a flat, box-shaped feeder body 51. A parts case for storing multiple parts P in bulk is attached to the feeder body 51. A connector 51a and two pins 51b are provided at the front end of the feeder body 51. When the bulk feeder 50 has its feeder body 51 set in the slot 22 of the parts supply device 20, it is powered via the connector 51a and becomes able to communicate with the control device 70 described later. The feeder body 51 is positioned and set in the slot 22 by inserting the two pins 51b into guide holes provided in the slot 22. 【0030】 The bulk feeder 50 has a track unit 52 for picking up parts P. The track unit 52 is detachably and vibrably mounted on the feeder body 51. The track unit 52 vibrates due to a force from the excitation device 56, which will be described later. The track unit 52 has a transport area T on which multiple parts P are transported, and a supply area S that communicates with the transport area T and exposes multiple parts P upward so that they can be picked up. 【0031】The track unit 52 is formed to extend in the front-to-back direction (left-to-right direction in Figures 3 to 6) of the feeder body 51. The track unit 52 has a pair of side walls 52a and a front wall 52b that surround the periphery of the transport area T in order to prevent leakage of parts P being transported in the transport area T. The pair of side walls 52a are formed on both edges in the width direction (up-down direction in Figure 4) of the track unit 52 and protrude upward relative to the surface on which the parts P are transported. The front wall 52b is formed on the front side (right side in Figures 4 and 6) of the feeder body 51 and protrudes upward relative to the surface on which the parts P are transported. 【0032】 In this embodiment, an alignment member 53 is interchangeably attached to the track unit 52. The alignment member 53 has a base plate 53a and a mask plate 53b. The base plate 53a and the mask plate 53b are each flat plate-shaped members formed to a predetermined thickness. The base plate 53a and the mask plate 53b are arranged in that order on top of the track body 52c of the track unit 52. The mask plate 53b has a plurality of through holes arranged in a predetermined pattern (matrix in Figure 4). Each of the plurality of through holes in the mask plate 53b is formed in a rectangular shape capable of accommodating the parts P supplied by the bulk feeder 50. 【0033】 The base plate 53a and the mask plate 53b are sandwiched between the track body 52c and the guide member 52d and fixed to the track body 52c and the guide member 52d by a plurality of bolts 52e. The guide member 52d is a fixing member that secures the replaceable base plate 53a and the mask plate 53b, and also forms the pair of side walls 52a and front wall 52b described above to guide the parts P supplied to the supply area S. As shown in Figure 3, a cover 52f that covers the upper part of the transport area T is positioned above the guide member 52d. The cover 52f prevents the parts P from flying out of the transport area T. 【0034】The bulk feeder 50 has a plurality of cavities 54, as shown in Figures 4 and 6. Each cavity 54 is capable of accommodating one part P. The cavities 54 are formed by the upper surface of the base plate 53a of the alignment member 53 and the through holes in the mask plate 53b. The plurality of cavities 54 are arranged in a matrix or staggered pattern in the supply area S so as to be aligned in the width direction and front-to-back direction of the track unit 52. The alignment member 53 has a total of 54 cavities 54, for example, as shown in Figure 4, with rows of 9 cavities each arranged in the width direction of the track unit 52, and 6 rows arranged in the front-to-back direction of the feeder body 51. Each of the plurality of cavities 54 opens upward and accommodates the part P in a position where the thickness direction of the part P is in the vertical direction. 【0035】 The size of the cavity 54 opening is set to a dimension slightly larger than the outer shape of the part P when viewed from above. The depth of the cavity 54 is set according to the type of part P (i.e., shape, mass, etc.). One of the various types of alignment members 53 is attached to the track unit 52, selected based on the type of part P, the required number of cavities 54, and their functions. 【0036】 The "supply area S" of the track unit 52 described above is the area in which parts P are supplied in bulk, and is the area in which the suction nozzle 40 supported by the mounting head 31 of the parts transfer device 30 can pick up parts P. The "transport area T" of the track unit 52 is the path through which parts P that have flowed from the parts case side to the track unit 52 are transported to the supply area S. 【0037】 The bulk feeder 50 has a shutter 55 that can close the opening of the supply area S. The shutter 55 is located on the upper part of the track unit 52. The shutter 55 is movable in the front-rear direction relative to the track unit 52 of the feeder body 51. The shutter 55 is opened and closed in the front-rear direction by a drive device (not shown), changing between an open state, a closed state, and an intermediate state. In the bulk feeder 50, when the shutter 55 is in the closed state, it is prevented that parts P in the cavity 54 will fly out and foreign matter will enter the supply area S. 【0038】The closed state of the shutter 55 is the state in which the shutter 55 is in contact with the track unit 52 and the opening of the supply area S is completely closed. The open state of the shutter 55 is the state in which the opening of the supply area S is not closed and the main area of ​​the supply area S (the area in which multiple cavities 54 are provided in this embodiment) is exposed. In the closed state of the shutter 55, the sampling of parts P in the cavities 54 is restricted, but in the open state of the shutter 55, parts P in the cavities 54 can be sampled by the suction nozzle 40. The intermediate state of the shutter 55 is the state between the closed state and the open state. In the intermediate state of the shutter 55, the shutter 55 moves away from the track unit 52, which vibrates due to the excitation of the excitation device 56 described later, while restricting the ejection of parts P from the opening of the supply area S. 【0039】 As shown in Figure 3, the bulk feeder 50 has a vibration exciter 56 that constitutes a conveying device for conveying multiple parts P from the conveying area T to the supply area S. The vibration exciter 56 is provided on the feeder body 51. The vibration exciter 56 applies vibration to the track unit 52 so that the multiple parts P are conveyed along the conveying area T. When vibration is applied from the vibration exciter 56 to the track unit 52, the track unit 52 moves in an elliptical motion when viewed from the side. 【0040】 As the track unit 52 moves in an elliptical motion as described above, an external force is applied to the parts P in the transport area T, either forward and upward or backward and upward, depending on the rotational direction of the elliptical motion of the track unit 52. When such an external force acts on the parts P in the transport area T, each part P is transported to the front or rear of the track unit 52 and supplied to the cavity 54 in the supply area S, where it is contained for collection. In the bulk feeder 50, the transport speed of the parts P to be transported, the degree of dispersion of the parts P, and the transport direction can be changed by controlling the frequency and amplitude of the vibrations applied to the track unit 52 and the rotational direction of the elliptical motion caused by those vibrations. 【0041】1-3. As shown in FIG. 1, the component mounting machine 1 includes a component camera 61 and a substrate camera 62. The component camera 61 and the substrate camera 62 are digital imaging devices having imaging elements such as CMOS. The component camera 61 and the substrate camera 62 perform imaging based on a control signal and send the image data obtained by the imaging to the control device 70. The component camera 61 images the component P held by the suction nozzle 40 from below. The substrate camera 62 is attached to the moving stage 32 so as to be movable horizontally integrally with the mounting head 31. The substrate camera 62 images the substrate B from above. 【0042】 In addition to imaging the surface of the substrate B, the substrate camera 62 can image various devices and the like within the movable range of the moving stage 32. For example, the substrate camera 62 can image the supply area S where the component P is supplied in the bulk feeder 50 and the reference mark 57 provided on the upper part of the bulk feeder 50 within the camera field of view (see FIG. 4). 【0043】 The reference mark 57 is a mark such as a circle indicating the reference position with respect to the supply area S. The reference mark 57 is attached to the front side of the feeder body 51 on the upper surface of the mask plate 53b of the alignment member 53. A pair of reference marks 57 are provided at a predetermined distance apart in the left-right direction of the feeder body 51. According to the pair of reference marks 57, the horizontal position of the bulk feeder 50 can be recognized. The reference mark 57 is hidden by the shutter 55 when viewed from above in the closed state of the shutter 55, while it is exposed upward and visible in the open state of the shutter 55 and can be imaged by the substrate camera 6,. 【0044】 As shown in FIGS. 1 and 9, the component mounting machine 1 includes a control device 70. The control device 70 is mainly composed of a CPU, various memories, a control circuit, and the like. As shown in FIG. 9, the control device 70 has a storage unit 71. The storage unit 71 is composed of an optical drive device such as a hard disk device or a flash memory. Various data such as a control program, reference data, and adjustment data used for controlling the mounting process of the component P onto the substrate B are stored in the storage unit 71. 【0045】The control program indicates the mounting position, mounting angle, and type of component P to be mounted on the substrate B during the mounting process, in the order of mounting. Here, the mounting process includes a process that repeats a pick-and-place (PP) cycle, which includes a picking cycle and a mounting cycle, multiple times. The picking cycle is a process that repeats multiple times the picking operation in which the suction nozzle 40 picks up the component P supplied to a predetermined supply position by the component supply device 20. 【0046】 Furthermore, the mounting cycle is a process in which the mounting operation, in which the component P picked up by the suction nozzle 40 is mounted on the substrate B at a predetermined mounting position and at a predetermined mounting angle, is repeated multiple times. The PP cycle consists of multiple picking and mounting operations that are grouped together, taking into consideration the number of suction nozzles 40 supported by the mounting head 31 and the distance the mounting head 31 moves. The execution order of the PP cycle is pre-set in the control program. 【0047】 As shown in Figure 3, the bulk feeder 50 has a feeder control device 58 that performs various controls on the bulk feeder 50. The feeder control device 58 is mainly composed of a CPU, various memories, and control circuits. When the feeder body 51 is set in the slot 22, the feeder control device 58 is powered via the connector 51a and becomes able to communicate with the control device 70 of the component mounting machine 1. The control device 70 controls the supply of components by the component supply device 20. When the bulk feeder 50 is equipped on the component supply device 20, the control device 70 issues commands to the feeder control device 58 so that the supply operation by the bulk feeder 50 is performed at an appropriate timing during the execution of the mounting process. 【0048】The feeder control device 58 stores various data such as programs and conveyance parameters used for controlling the supply process of the component P to the supply area S. This conveyance parameter is a parameter for controlling the operation of the vibration device 56 so that the vibration applied to the orbit unit 52 becomes appropriate in order to convey the component P to the supply area S in the component supply process. This conveyance parameter is preset in association with, for example, the type of the alignment member 53 and the type of the component P. The feeder control device 58 controls the operation of the vibration device 56 to execute the conveyance of the component P to the supply area S. 【0049】 During the execution of the PP cycle by the component mounting machine 1, the above-described feeder control device 58 receives a command from the control device 70 to supply the component P to the supply area S during the period from the end of the current sampling operation to the start of the next sampling operation, and executes the supply of the component P to the supply area S. This supply operation of the component P is a conveyance operation for conveying the component P so as to be accommodated in a plurality of cavities 54. Specifically, this conveyance operation includes a feeding operation in which the component P located at the front end of the conveyance area T advances to the front end of the supply area S, and then includes a returning operation in which the component P retreats to the front end of the conveyance area T again. 【0050】 In addition, when there is sufficient time margin until the start of the next sampling operation, etc., in the conveyance operation, the feeding operation and the returning operation may be repeatedly executed so that a plurality of components P reciprocate in the front-rear direction in the supply area S a plurality of times. That is, as the supply operation of the component P in the bulk feeder 50, one supply operation selected from a plurality of conveyance patterns may be selectively executed in consideration of circumstances such as ensuring the allowable time and the number of components that can be sampled. 【0051】As shown in Figure 9, the control device 70 has a supply state recognition unit 72. When the target feeder 21 is a bulk feeder 50, the supply state recognition unit 72 recognizes the supply state of multiple components P in the supply area S of the bulk feeder 50 based on image data acquired by imaging by the substrate camera 62. This supply state recognition process includes a process to recognize whether or not there are components P that can be collected (specifically, components P to be housed in the cavity 54) in the supply area S, and further, if there are components P that can be collected, a process to recognize the position and angle of those components P. 【0052】 As shown in Figure 9, the control device 70 has a sampling support unit 73 as a sampling support device. The sampling support unit 73 assists the sampling operation in which a holding member 40 (specifically, a suction nozzle 40) picks up parts P (specifically, parts P housed in the cavity 54 of the supply area S by the bulk feeder 50) supplied to a predetermined supply position by the feeder 21. Specifically, for each sampling operation in which the suction nozzle 40 picks up parts P housed in each cavity 54 of the bulk feeder 50, the sampling support unit 73 sets an adjustment amount to adjust the target sampling height (i.e., the lower end height) of the suction nozzle 40 to match the housing height position of the part P. The processing by the sampling support unit 73 will be described in detail later. 【0053】 As shown in Figure 9, the control device 70 has a mounting control unit 74. The mounting control unit 74 executes the mounting process based on the control program. When collecting parts P from the supply area S of the bulk feeder 50, the mounting control unit 74 first performs a process to recognize the supply status of parts P using the supply status recognition unit 72. Then, based on the recognition result of the supply status, it controls the collection operation of the mounting head 31, including the suction nozzle 40. Specifically, as a collection operation, the mounting control unit 74 lowers the suction nozzle 40 according to the collection height adjusted as a result of the processing by the collection support unit 73, and causes the suction nozzle 40 to collect the parts P. 【0054】Furthermore, the mounting control unit 74 recognizes the holding state of each of the multiple suction nozzles 40. Specifically, the mounting control unit 74 processes the image data acquired by the part camera 61 to recognize the position and angle of each part P with respect to a reference point on the mounting head 31. In addition to the part camera 61, the mounting control unit 74 may also recognize the holding state of the part P by processing image data acquired by, for example, a head camera unit integrally provided on the mounting head 31 that images the part P from the side, below, or above. 【0055】 The mounting control unit 74 controls the mounting operation of the mounting head 31, including the suction nozzles 40, based on information output from various sensors, image processing results, and a control program during the mounting process. This operation adjusts the position and angle of the multiple suction nozzles 40 supported by the mounting head 31. This mounting operation ensures that the component P held by the suction nozzles 40 is mounted at a predetermined mounting position and angle on the substrate B as instructed by the control program. 【0056】 2. The sampling support unit 73 of the sampling support control device 70 assists the sampling operation in which the suction nozzle 40 picks up parts P contained in the cavity 54 of the supply area S in the bulk feeder 50. The sampling support operation by the sampling support unit 73 involves obtaining an appropriate adjustment amount for the sampling operation based on individual differences in the bulk feeder 50, such as the thickness of the base plate 53a, before the installation process is performed, and adjusting the sampling height of the suction nozzle 40. 【0057】 The individual differences mentioned above include, for example, the tolerance difference between the base plate 53a and the mask plate 53b in the track unit 52, and the positional error of the bulk feeder 50 set in the slot 22. When such individual differences occur, the upper surface of the base plate 53a that supports the parts P in the supply area S may shift vertically and also tilt with respect to the horizontal plane. When the upper surface of the base plate 53a shifts from the specified height position in the design and also tilts with respect to the horizontal plane, each of the parts P that can be collected in the supply area S will be located at a height that is individually shifted from the specified height position. 【0058】If, in the event of the above-mentioned individual differences, control is performed to uniformly suppress the amount of descent of the suction nozzle 40 to match parts P located higher than a specified height, regardless of the individual differences, then when parts P located lower than a specified height are picked up by the suction nozzle 40, a pickup failure may occur where those parts P are not picked up by the suction nozzle 40. 【0059】 Conversely, if, in order to prevent the above-mentioned sampling defects during the sampling operation, the amount of descent is uniformly increased to match the position of parts P below the specified height, then parts P above the specified height may come into excessive contact with the suction nozzle 40, causing increased vibrations due to the contact. This can change the posture of the surrounding parts P, potentially causing them to tilt within the cavity 54 or even fly out of the cavity 54, which could lead to subsequent sampling defects. 【0060】 Therefore, in this embodiment, the sampling support unit 73 grasps the individual differences in the configuration of the bulk feeder 50, calculates the height position and inclination of the upper surface of the base plate 53a that supports each component P, and adjusts the sampling height of the suction nozzle 40 during the sampling operation based on the calculation results. The sampling support unit 73 comprises a measuring unit 73a, a calculation unit 73b, and an adjustment unit 73c. 【0061】 In this embodiment, the base plate 53a is a support member that supports the component P supplied to the supply area S. The base plate 53a is a plate-shaped member with a flat planar portion 53c formed as its upper surface. The planar portion 53c extends in a planar shape, including the support surface that supports the component P. The planar portion 53c is formed, for example, in a rectangular shape. The planar portion 53c is formed to be larger than the size (area) of the supply area S. The planar portion 53c is formed to include the supply area S and a non-supply area U that is different from the supply area S. 【0062】The supply area S includes a location in the planar section 53c where parts P are supplied in a collectible manner, and is a region that includes a plurality of cavities 54, each accommodating a part P, when viewed from above. The supply area S has an outer edge that collectively includes all the cavities 54 in the bulk feeder 50, and is formed in a rectangular, circular, or elliptical shape, for example. The support surface of the planar section 53c includes a first exposed area V1 (see Figure 4) that is exposed upward when the shutter 55 is open in the supply area S. The first exposed area V1 is provided for each cavity 54. On the support surface of the planar section 53c, the supply area S is surrounded by vertical walls formed in the feeder body 51, specifically by the side walls 52a and front wall 52b of the track unit 52 provided in the feeder body 51. 【0063】 The non-supplying area U includes a portion of the flat section 53c where parts P are not supplied in a collectible manner, and is an area that does not include the cavity 54 when viewed from above. The non-supplying area U may include the transport area T described above. The non-supplying area U is formed separately from the supply area S without overlapping. In the flat section 53c, the non-supplying area U is formed on the front side of the feeder relative to the supply area S, and also on the rear side of the feeder relative to the supply area S. The support surface of the flat section 53c includes a second exposed area V2 (see Figure 4) in the non-supplying area U where the support surface of the flat section 53c is exposed upward when the shutter 55 is open. In the support surface of the flat section 53c, the non-supplying area U (specifically, the second exposed area V2) is formed outside the vertical wall (specifically, the side wall 52a and front wall 52b of the track unit 52) ​​formed on the feeder body 51. 【0064】The measurement section 73a of the sampling support section 73 is the part that measures the height position of the support surface of the flat section 53c of the base plate 53a in the non-supply area U where the part P is not supplied in a way that allows it to be sampled. The support surface whose height position is to be measured is the bottom surface of the cavity 54 that houses the part P, and is the upper surface of the flat section 53c to which the lower surface of the part P in its normal position makes contact. This section is included in the non-supply area U (specifically, the second exposed area V2) of the flat section 53c, excluding the supply area S in which the part P is supplied in a way that allows it to be sampled. In the flat section 53c, the second exposed area V2 of the non-supply area U is formed outside the side walls 52a and front wall 52b of the track unit 52 in the feeder body 51. 【0065】 The measuring unit 73a measures the height position of each of the multiple measuring points W in the second exposed area V2 of the non-supply area U on the flat surface 53c. The measuring points W to be measured are three or more measuring points that are positioned at different locations from each other so that the upper surface of the flat surface 53c (i.e., the support surface that supports the component P) can be reproduced based on the height position of the measuring points W. In this embodiment, the number of measuring points W is four (W1 to W4), as shown in Figure 4. 【0066】 Furthermore, regarding the four measurement points W mentioned above, it is desirable that at least one measurement point W is included in each of the two non-supply regions U that separate the supply region S in the front-to-back direction of the feeder. For example, two measurement points W may be provided in the non-supply region U in front of the supply region S, and two measurement points W may be provided in the non-supply region U behind the supply region S. In this case, it is also desirable that the two measurement points W provided in each of the two non-supply regions U that separate the supply region S in the front-to-back direction of the feeder are separated from each other in the left-to-right direction of the feeder. 【0067】The height position of each measurement point W is measured by the measurement unit 73a using a height detection sensor 75 (see Figure 9). The height detection sensor 75 is positioned, for example, above the flat portion 53c of the base plate 53a. The height detection sensor 75 is attached, for example, to the mounting head 31 or to a mobile base 32 integrated with the mounting head 31. The height detection sensor 75 may be a non-contact type such as a laser or ultrasonic type that measures the distance from the sensor to the measurement point W, or a contact type that measures the distance until the probe touches the measurement point W by lowering the probe. The height detection sensor 75 may be used to detect the height of the upper surface of the substrate B positioned by the substrate transport device 10. 【0068】 Alternatively, the height position of each measurement point W may be measured by the measuring unit 73a using a jig nozzle attached to the holder 36 of the mounting head 31 in place of the holding member 40. This jig nozzle is first lowered from a reference height position and pressed into a calibration block pre-installed on the component mounting machine 1. In this case, the height position of the calibration block is measured. Next, the jig nozzle is repeatedly raised and lowered and pressed sequentially into the four measurement points W1 to W4 of the second exposed area V2 in the non-supply area U on the flat portion 53c of the base plate 53a. In this case, the height position of each of the four measurement points W of the second exposed area V2 is measured. These height measurements may be performed using changes in airflow rate, air pressure, torque, motor deviation, etc., when the jig nozzle is moved up and down in the mounting head 31. 【0069】The calculation unit 73b is the part that calculates the inclination of the flat portion 53c of the base plate 53a with respect to the horizontal and its height position within the supply area S, based on the measurement results from the measurement unit 73a. Specifically, the calculation unit 73b first calculates the height and inclination of the flat portion 53c with respect to the horizontal represented by the plane by creating a plane that includes the four measurement points W1 to W4, based on the height positions of the four measurement points W1 to W4 measured by the measurement unit 73a. Then, based on the calculated height and inclination of the flat portion 53c with respect to the horizontal, the calculation unit 73b identifies the height position of the flat portion 53c within the supply area S, and further calculates the height position of the support surface (within the first exposed area V1) of the flat portion 53c, which is the bottom surface of each cavity 54 within the supply area S, based on the arrangement pattern of the cavities 54 on the flat portion 53c. 【0070】 The adjustment unit 73c is a part that adjusts the sampling height of the holding member 40 (suction nozzle 40) for each sampling operation, which is used to collect the parts P supplied to the supply area S, based on the calculation results from the calculation unit 73b. Specifically, for each cavity 54 in the supply area S, the adjustment unit 73c calculates the amount by which to adjust the sampling height of the suction nozzle 40 in the sampling operation, in which the suction nozzle 40 is lowered to collect the parts P contained in the cavity 54, based on the height position of the support surface of the flat part 53c for each cavity 54. 【0071】The sampling height of the suction nozzle 40 in the sampling operation described above is changed according to the type and total height of the supplied part P and the type of sampling operation. For example, if the sampling operation by the suction nozzle 40 is an operation in which the tip of the suction nozzle 40 is pressed against the part to perform sampling, the sampling height of the suction nozzle 40 is set to a height in which the lower end of the suction nozzle 40 is located below the upper surface of the part P supported by the support surface of the flat part 53c. Also, as shown in Figure 7, if the sampling operation by the suction nozzle 40 is an operation in which the part P is adsorbed into the air by negative pressure without pressing the tip of the suction nozzle 40 against the part P, the sampling height of the suction nozzle 40 is set to a height in which the lower end of the suction nozzle 40 is located within a predetermined range above the upper surface of the part P supported by the support surface of the flat part 53c. In this case, a clearance Lc is set between the lower end of the suction nozzle 40 and the upper surface of the part P. 【0072】 Furthermore, the above-mentioned aerial suction is a sampling method designed to prevent the impact of the suction nozzle 40 contacting the upper surface of the part P from affecting other parts P housed in the cavities 54, such as causing changes in their orientation. The predetermined range mentioned above is the distance at which the suction nozzle 40 can reliably collect the part P by aerial suction. 【0073】 The adjustment unit 73c calculates an adjustment amount for each cavity 54 within the supply area S, based on the height and inclination of the flat section 53c relative to the horizontal, to adjust the sampling height of the suction nozzle 40 during the sampling operation. The process of calculating the adjustment amount by this adjustment unit 73c is performed with appropriate timing and precision depending on the type of bulk feeder 50 and the operating mode of the mounting process (for example, accuracy priority mode or production efficiency priority mode). 【0074】Furthermore, in a configuration where the bulk feeder 50 has multiple cavities 54 and accommodates the parts P in the cavities 54, the adjustment amount described above can be calculated for each cavity 54. On the other hand, in a configuration where the bulk feeder 50 does not have cavities 54 for accommodating the parts P and the parts P supported in the supply area S are arranged irregularly, after the position of each part P in the supply area S is recognized, an adjustment amount may be calculated to adjust the sampling height of the suction nozzle 40 in the sampling operation based on the height and inclination of the flat portion 53c relative to the horizontal, according to that position. 【0075】 3. The sampling support unit 73 of the sampling support unit's processing control device 70 performs sampling support processing for the suction nozzle 40 to perform a sampling operation in which it collects parts P contained in the cavity 54 of the supply area S of the bulk feeder 50, with the bulk feeder 50 set in the slot 22 of the parts supply device 20 (see Figure 10). Before executing the sampling support processing, the control device 70 sets four measurement points W1 to W4 on the base plate 53a, which has an upper surface that supports the parts P in the bulk feeder 50, based on the type of bulk feeder 50 and the type of height detection sensor 75. As shown in Figures 4 and 8, the measurement points W1 to W4 are set in the second exposed area V2 of the support surface of the flat portion 53c, which is the upper surface of the base plate 53a, which can be exposed upward in the non-supply area U. 【0076】 The sampling support unit 73 measures the height of each of the four measurement points W1 using the height detection sensor 75 in the measurement unit 73a (step S100; measurement step). Then, the sampling support unit 73 calculates the height and inclination of the planar portion 53c of the base plate 53a relative to the horizontal based on the height of each of the four measurement points W1 to W4 measured by the measurement unit 73a in the calculation unit 73b (step S110; calculation step). It also identifies the height of the planar portion 53c within the supply area S based on the height and inclination of the planar portion 53c, and further calculates the height of the support surface of the planar portion 53c for each cavity 54 according to the arrangement pattern of the cavities 54 (step S120; calculation step). This calculated data of the height of the support surface of the planar portion 53c for each cavity 54 is stored in the storage unit 71. 【0077】The sampling support unit 73 calculates an adjustment amount for adjusting the sampling height of the suction nozzle 40 during the sampling operation for each cavity 54 based on the height position of the support surface of the flat portion 53c of each cavity 54 in the adjustment unit 73c (step S130; adjustment step). That is, the adjustment unit 73c calculates an adjustment amount for each cavity 54 based on the height position of the support surface of the flat portion 53c of each cavity 54 calculated by the calculation unit 73b. Then, the sampling support unit 73 stores the data of the adjustment amount for each cavity 54 calculated by the adjustment unit 73c in the storage unit 71, associating it with the address of the cavity 54 (step S140). 【0078】 If the height position of the support surface of the flat portion 53c of each cavity 54 is adjusted by the above adjustment amount, then even if the flat portion 53c of the base plate 53a is tilted relative to the horizontal or shifted vertically, the distance between the tip of the lowered end of the suction nozzle 40 and the support surface of the flat portion 53c during the sampling operation will remain constant regardless of the position of the cavity 54 in the supply area S. For this reason, the amount of pressure the suction nozzle 40 applies to the part P and the clearance Lc during aerial suction will remain constant during sampling in any of the cavities 54. 【0079】 4. Attachment process by the parts attachment machine The parts attachment machine 1 performs the attachment process when the bulk feeder 50 is set in the slot 22 of the parts supply device 20 and the sampling support unit 73 has performed the sampling support process and the adjustment amount data has been stored in the storage unit 71 (see Figure 11). 【0080】In the component mounting process by the component mounting machine 1, first, the substrate transport device 10 loads the substrate B and positions the substrate B in a predetermined position for component mounting (step S200). In parallel with this mounting process, the bulk feeder 50 performs a component P supply operation to the supply area S at a predetermined timing. After this component supply operation is performed, a recognition process is performed by the supply state recognition unit 72. The supply state recognition unit 72 acquires image data by imaging the supply area S with the substrate camera 62. Within this supply area S, there may be many bulk components P, for example, components P housed in the cavity 54 in a normal orientation, components P outside the cavity 54, components P in contact with or piled up on each other, and components P in a horizontal orientation. 【0081】 The supply status recognition unit 72 determines the state of each cavity 54. Based on this, the multiple cavities 54 are classified into three categories: storage cavities that can accommodate components P for extraction, NG cavities where components P are present but extraction is impossible, and empty cavities where no components P are present. The supply status recognition unit 72 then calculates the number of each state for each cavity 54. 【0082】 After positioning the substrate B as described above, the control device 70 then executes the PP cycle as a mounting process (step S210). 【0083】 In the PP cycle, the mounting control unit 74 executes a collection cycle in which it repeatedly collects parts P using the suction nozzle 40 of the part transfer device 30 (step S211). In this collection cycle, the mounting control unit 74 sequentially positions the mounting head 31 and, consequently the suction nozzle 40, according to the position of the parts P that can be collected. After positioning the suction nozzle 40, the mounting control unit 74 lowers it to collect the parts P and performs a collection operation in which it sucks up the parts P with negative pressure air after reaching the collection height position HP. This collection operation is repeated for multiple suction nozzles 40 of the mounting head 31. In this collection operation, the collection height of the suction nozzle 40 is adjusted for each part P to be collected based on the adjustment amount for each cavity 54. 【0084】As a result, the amount of descent of the suction nozzle 40 during the sampling operation is adjusted by an adjustment amount that matches the state of the cavity 54 in which the part P to be sampled is housed. For example, as shown in Figure 7, if the flat portion 53c of the base plate 53a is inclined with respect to the horizontal, the amount of descent becomes smaller for the cavity 54 on the upper side of the inclination and larger for the cavity on the lower side of the inclination. 【0085】 As described above, once the part P is collected from each of the multiple suction nozzles 40, the mounting control unit 74 then uses the image captured by the part camera 61 to recognize the holding state (posture, i.e., position and angle) of the part P at each suction nozzle 40 (step S212). This recognition of the holding state, including any collection errors during the collection operation, is stored in the storage unit 71 as the operation result. 【0086】 As described above, once the component holding state at the suction nozzle 40 is recognized, the mounting control unit 74 then executes a mounting cycle in the component transfer device 30 (step S213). Specifically, the mounting control unit 74 controls the operation of the mounting head 31 so that the components P held by each of the multiple suction nozzles 40 of the mounting head 31 are mounted to the designated mounting positions on the substrate B. At this time, based on the recognition result of the component holding state at the suction nozzle 40, the mounting head 31 is controlled to position and angle the suction nozzle 40 relative to the designated mounting position on the substrate B so that the components P are mounted by releasing the suction nozzle 40. 【0087】 The mounting control unit 74 determines whether all PP cycles have been completed for the substrate B (step S220). If the mounting control unit 74 determines that all PP cycles have not been completed, it executes the next PP cycle (steps S211 to S213). On the other hand, if the mounting control unit 74 determines that all PP cycles have been completed, the substrate transport device 10 then performs the substrate B unloading process (step S230). In this substrate B unloading process, the positioned substrate B is unclamped and unloaded from the component mounting machine 1. 【0088】Thus, in the component mounting machine 1, the substrate B is transported to a predetermined position for component mounting, and the component P is supplied to a predetermined supply position. Then, the suction nozzle 40 is lowered, and the component P is sucked and held at the tip of the suction nozzle 40 by negative pressure air. The component P held at the tip of the suction nozzle 40 can then be mounted to the designated mounting position on the substrate B. 【0089】 5. Effects of the Sampling Support Unit and Parts Mounting Machine In the parts mounting machine 1, when the suction nozzle 40 picks up parts P supplied to a predetermined supply position by the feeder 21 during the PP cycle of the mounting process (parts P supplied to the supply area S of the bulk feeder 50 and housed in the cavity 54), the sampling support unit 73 performs a process to support the sampling operation by the suction nozzle 40. 【0090】 Specifically, before the suction nozzle 40 picks up the part P, the height positions of three or more different measurement points W (specifically, four measurement points W1 to W4) provided in the non-supply area U on the flat portion 53c of the base plate 53a, which has an upper surface for supporting the part P in the bulk feeder 50, are first measured. 【0091】 Based on the measurement results of the height positions of these measurement points W, the inclination of the flat portion 53c of the base plate 53a relative to the horizontal and the height position of the flat portion 53c within the supply area S are calculated. Furthermore, based on the inclination of the flat portion 53c and the height position within the supply area S, the sampling height for each sampling operation of the suction nozzle 40 that picks up the parts P supplied to the supply area S is adjusted. After this adjustment, the sampling operation by the suction nozzle 40 is performed on the parts P housed in the cavity 54 that are the target of sampling. 【0092】 With this configuration, even if the support surface of the flat portion 53c of the base plate 53a on which the component P is supported is tilted relative to the horizontal or the support surface of the flat portion 53c is misaligned vertically, due to individual differences in the thickness of the base plate 53a of the bulk feeder 50, the distance between the tip of the lowered end of the suction nozzle 40 during the sampling operation and the support surface of the flat portion 53c can be kept constant for all cavities 54 within the supply area S of the bulk feeder 50. 【0093】 Therefore, regardless of which cavity 54 the part P is picked up by the suction nozzle 40, the amount of pressure the suction nozzle 40 applies to the part P and the clearance Lc during aerial suction can be kept constant. This prevents variations in the picking operation by the suction nozzle 40 depending on the position of the cavity 54, i.e., the part P, in the supply area S, thereby stabilizing the picking of each part P by the suction nozzle 40 with high accuracy and preventing part picking errors and part picking failures. 【0094】 In particular, the measurement point W, which is the target of height position measurement, is the support surface, which is the upper surface of the flat portion 53c of the base plate 53a that supports the component P. However, it is set in the non-supply region U (second exposed region V2) where the component P is not supplied, rather than the bottom surface (first exposed region V1) of the cavity 54 in the supply region S where the component P is supplied. 【0095】 With this configuration, the height position measurement point W is not set on a surface that is offset from the support surface of the flat portion 53c of the base plate 53a on which the component P is supported (for example, the upper surface of the mask plate 53b). Therefore, the individual differences between the surface that is offset from the support surface of the flat portion 53c and the support surface do not affect the calculation of the height position and inclination of the support surface, and the height position and inclination of the support surface that supports each component P in the flat portion 53c can be calculated with high accuracy. In addition, the height position measurement point W is not set on the bottom surface of the cavity 54 in which each component P is housed and supported in the supply area S. Therefore, even when the component P is housed in the cavity 54 or when the cavity 54 is narrow, the height position can be measured stably at the measurement point, and the height position and inclination of the support surface that supports each component P in the flat portion 53c can be calculated with high accuracy. 【0096】 Therefore, with the configuration of the sampling support unit 73 and the component mounting machine 1 having the sampling support unit 73, the height position and inclination of the support surface of the flat portion 53c of the base plate 53a that supports each component P can be calculated with high accuracy, and the sampling of each component P by the suction nozzle 40 can be stabilized with high accuracy. 【0097】Furthermore, in the flat portion 53c of the base plate 53a of the bulk feeder 50, the supply area S is surrounded by vertical walls (specifically, the side walls 52a and front wall 52b of the track unit 52), and the non-supply area U is formed outside of these vertical walls. In this configuration, the measurement point W, which is the target of height position measurement, is set in the non-supply area U, which is separated from the supply area S by vertical walls. As a result, the supply area S and the non-supply area U are clearly distinguished by the boundary of the vertical walls, which prevents errors in measuring the height position of the flat portion 53c of the base plate 53a that supports the parts P. This prevents mismeasurement of the height position in the non-supply area U, and consequently, miscalculation of the inclination of the flat portion 53c relative to the horizontal and the height position within the supply area S, allowing the suction nozzle 40 to accurately collect each part P. 【0098】 6. Modified Forms In the above embodiment, the sampling support unit 73 performs processing to support the sampling operation after the bulk feeder 50 has been set on the component mounting machine 1. However, the disclosure is not limited thereto, and the sampling support unit 73 may perform processing to support the sampling operation under predetermined conditions. For example, the sampling support unit 73 may perform processing to support the sampling operation when the mounting process of mounting components P onto the substrate B has been performed a predetermined number of times, or when the execution time of the mounting process performed multiple times has reached a predetermined time. With such a configuration, it is possible to respond to fluctuations in the height and inclination of the flat portion 53c due to vibrations and thermal displacement associated with the execution of the mounting process. 【0099】 Furthermore, this disclosure is not limited to the embodiments and modifications described above, and various modifications can be made without departing from the spirit of this disclosure. 【0100】1: Component mounting machine, 10: Substrate transport device, 20: Component supply device, 21: Feeder, 22: Slot, 30: Component transfer device, 31: Mounting head, 40: Holding member (suction nozzle), 50: Bulk feeder, 52: Track unit, 52a: Side wall, 52b: Front wall, 53: Alignment member, 53a: Base plate (support member), 53b: Mask plate, 53c: Flat section, 54: Cavity, 70: Control device, 71: Memory unit, 72: Supply status recognition unit, 73: Sampling support unit (sampling support device), 73a: Measurement unit, 73b: Calculation unit, 73c: Adjustment unit, 74: Mounting control unit, 75: Height detection sensor, B: Substrate, P: Component, S: Supply area, U: Non-supply area, V1: First exposed area, V2: Second exposed area, W: Measurement point.

Claims

1. A sampling support method for assisting a sampling operation in which a holding member picks up a component supplied by a feeder, wherein the feeder has a support member formed with a flat portion including a support surface for supporting the component, and the support member is formed such that a supply area where the component is supplied in a pickable manner and a non-supply area where the component is not supplied are separated without overlapping with each other, and the sampling support method comprises: a measurement step of measuring the height position of three or more different measurement points in the non-supply area on the flat portion; a calculation step of calculating the inclination of the flat portion with respect to the horizontal and the height position within the supply area based on the measurement results in the measurement step; and an adjustment step of adjusting the sampling height of the holding member for each sampling operation of picking up the component supplied to the supply area based on the calculation results in the calculation step.

2. A sampling support device that assists a sampling operation in which a holding member picks up parts supplied by a feeder, wherein the feeder has a support member formed with a flat portion including a support surface for supporting the parts, and the supply area in which the parts are supplied in a manner that allows for sampling and the non-supply area in which the parts are not supplied are formed separately without overlapping with each other, the sampling support device comprising: a measuring unit that measures the height positions of three or more different measuring points in the non-supply area on the flat portion, a calculation unit that calculates the inclination of the flat portion with respect to the horizontal and the height position within the supply area based on the measurement results from the measuring unit, and an adjustment unit that adjusts the sampling height of the holding member for each sampling operation that picks up the parts supplied to the supply area based on the calculation results from the calculation unit.

3. A component mounting machine comprising: a support member provided on a feeder, having a flat portion formed including a support surface for supporting components, wherein a supply area where components are supplied in a pickable manner and a non-supply area where components are not supplied are formed separately without overlapping; a measuring unit for measuring the height positions of three or more different measuring points in the non-supply area on the flat portion; a calculation unit for calculating the inclination of the flat portion with respect to the horizontal and the height position within the supply area based on the measurement results from the measuring unit; and an adjustment unit for adjusting the picking height for each picking operation of a holding member for picking up components supplied to the supply area based on the calculation results from the calculation unit.

4. The component mounting machine according to claim 3, wherein the support surface of the support member is the bottom surface of a cavity that houses the component.

5. The component mounting machine according to claim 4, wherein the feeder is a bulk feeder in which a plurality of cavities are provided in the supply area.

6. The component mounting machine according to claim 5, wherein in the planar portion, the supply area is surrounded by a vertical wall, and in the planar portion, the non-supply area is formed outside the vertical wall.

7. The parts mounting machine according to claim 3, further comprising a control unit that lowers the holding member according to the sampling height adjusted by the adjustment unit with respect to the part to be sampled in the sampling operation, and causes the holding member to sample the part.

8. The component mounting machine according to claim 3, wherein the sampling height is the height at which the lower end of the holding member is located within a predetermined range from the upper surface of the component supported on the support surface.

9. A feeder comprising: a support member having a flat portion formed including a support surface for supporting a component, wherein a supply area for supplying the component in a collectible manner and a non-supply area for which the component is not supplied are formed separately without overlapping; and three or more different measuring points provided in the non-supply area on the flat portion, each of which is subject to measurement of its height position.

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