Plating device and plating method

The plating apparatus and method address the challenge of non-uniform bump height by employing a controlled plating current with adjusted pause periods to manage accelerator molecule adsorption, ensuring consistent bump formation despite variations in photoresist layer openings.

WO2026126339A1 Publication Date: 2026-06-18EBARA CORP
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
EBARA CORP
Filing Date
2024-12-10
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing plating technologies struggle to form multiple bumps on a substrate at a uniform height due to variations in the height of the bumps caused by differences in the size and density of openings in the photoresist layer.

⚗Method used

A plating apparatus and method that utilizes a controlled plating current with a repeating cycle of positive, reverse, and pause periods, adjusting the length of the pause period to maintain a predetermined fluctuation range of the plating voltage, ensuring uniform bump height by managing the adsorption and desorption of accelerator molecules.

🎯Benefits of technology

The solution effectively maintains uniform bump height by controlling the plating current pause period, compensating for variations in the photoresist layer openings, resulting in consistent bump formation throughout the plating process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention forms a plurality of bumps at a uniform height on a substrate.　A plating device for forming a plating film on a substrate includes: a substrate holder for holding the substrate; a plating tank for storing a plating solution together with the substrate holder; an anode disposed in the plating tank so as to face the substrate held by the substrate holder; a power supply for supplying a plating current between the substrate and the anode; and a control unit. The control unit causes the power supply to output a plating current that repeats a forward current period in which a forward current for causing a metal to be deposited on the substrate from the plating solution is supplied, a reverse current period in which a reverse current pulse flowing in the opposite direction to the forward current is supplied, and a current pause period in which the supply of current is paused partway during a transition from the reverse current pulse to the forward current. The control unit controls the length of the current pause period such that the width of fluctuation of the plating voltage after the reverse current pulse is supplied falls within a predetermined range.
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