Component mounting device

The integration of a battery-powered fan and optional heating element in component mounting devices addresses dew condensation by maintaining ventilation and temperature stability, ensuring device readiness and reducing energy use.

WO2026126389A1PCT designated stage Publication Date: 2026-06-18FUJI CORP

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
FUJI CORP
Filing Date
2024-12-11
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

Dew condensation occurs on electrical components due to rapid temperature changes and humidity, especially when component mounting devices are not in use, leading to potential damage and operational issues.

Method used

Incorporation of a fan powered by a battery during device shutdown to maintain ventilation, and in some cases, a heating element to stabilize internal temperature, preventing condensation.

🎯Benefits of technology

Effective prevention of condensation even when the device is not in operation, reducing the need for additional temperature control measures and minimizing power consumption.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to the present invention, a component mounting device that mounts components on substrates includes a power supply terminal, a mounting unit that performs a component mounting operation, a switch that is connected between the power supply terminal and the mounting unit and switches between an ON state in which power is supplied from the power supply terminal to the mounting unit and an OFF state in which power is not supplied from the power supply terminal to the mounting unit, a housing that accommodates the mounting unit, a battery, and a fan that is connected to the battery and ventilates the inside of the housing. When the switch is ON, the battery is charged by the power supplied from the power supply terminal. When the switch is OFF, the fan can operate by receiving a supply of power from the battery.
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Description

Component mounting device 【0001】 The technology disclosed in this specification relates to a component mounting device. 【0002】 A component mounting device for mounting components on a substrate to produce a circuit board is known. In the component mounting device, when the device is operating to perform the substrate production operation, the temperature inside the machine rises. Therefore, while the fan is driven for air cooling to exhaust heat inside the machine during device operation, the fan is stopped when the power is cut off and the substrate production operation is not performed. As a related conventional technology, for example, what is disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2007-329195) has been conventionally known. 【0003】 By the way, when a rapid temperature change of the outside air occurs in a state of high humidity or when a rapid temperature change occurs inside the machine, dew condensation may occur on the electrical components inside the machine due to the temperature difference between the outside air and the inside of the machine. 【0004】 Therefore, this specification provides a technology for suppressing dew condensation. 【0005】 The first component mounting device disclosed in this specification mounts components on a substrate. This component mounting device includes a power supply terminal, a mounting unit that performs a component mounting operation, a switch that is connected between the power supply terminal and the mounting unit and switches between an on state in which power is supplied from the power supply terminal to the mounting unit and an off state in which power is not supplied from the power supply terminal to the mounting unit, a housing that houses the mounting unit, a battery, and a fan that is connected to the battery and ventilates the inside of the housing. When the switch is on, the battery is charged by the power supplied from the power supply terminal. When the switch is off, the fan can operate by receiving power supply from the battery. 【0006】 In this configuration, when the switch is off (that is, when the device stops and does not perform the substrate production operation), the fan can operate by receiving power supply from the battery. Therefore, when the device stops, the inside of the housing can be ventilated by the fan, and dew condensation can be suppressed. 【0007】A second component mounting apparatus disclosed herein mounts components onto a substrate. This component mounting apparatus includes a power supply terminal, a mounting unit that performs component mounting operations, a switch connected between the power supply terminal and the mounting unit that switches between an ON state in which power is supplied from the power supply terminal to the mounting unit and an OFF state in which power is not supplied from the power supply terminal to the mounting unit, a housing that houses the mounting unit, a fan that ventilates the inside of the housing, and a heating element provided inside the housing. When the switch is OFF, the fan is operational by receiving power from the power supply terminal. When the switch is OFF and the fan is operating, the heating element generates heat by receiving power from the power supply terminal. 【0008】 In this configuration, the fan can operate by receiving power from the power supply terminal when the switch is off (i.e., when the device is stopped and not performing circuit board production operations). Therefore, the inside of the enclosure can be ventilated by the fan when the device is stopped. Furthermore, when the device is stopped and the fan is operating, the heat-generating element receives power from the power supply terminal and generates heat, which suppresses the temperature drop inside the enclosure. Therefore, condensation can be suppressed when the device is stopped. 【0009】 A third component mounting apparatus disclosed herein mounts components onto a substrate. This component mounting apparatus includes a mounting unit that performs component mounting operations, a housing that houses the mounting unit, a fan that ventilates the inside of the housing, and a condensation sensor that detects condensation inside the housing. When the condensation sensor detects condensation, the fan is activated. 【0010】 With this configuration, when condensation is detected, the inside of the enclosure is ventilated by a fan, thereby suppressing condensation. 【0011】The fourth component mounting apparatus disclosed herein mounts components onto a substrate. This component mounting apparatus includes a mounting unit that performs component mounting operations, a housing that houses the mounting unit, a fan that ventilates the inside of the housing, a filter provided on the fan, and a dust sensor that detects dust adhering to the filter. The apparatus provides notification when the dust sensor detects an amount of dust exceeding a certain value. 【0012】 This component mounting device alerts the user when a dust sensor detects a dust level exceeding a certain threshold, prompting the user to replace the filter. This prevents insufficient ventilation due to filter clogging, thus suppressing condensation. 【0013】 This is a perspective view of the component mounting device of Example 1. This is a schematic diagram showing the upper part of the component mounting device of Example 1. This is a schematic diagram showing the lower part of the component mounting device of Example 1. This is a block diagram of the power supply system of Example 1. This is a block diagram of the power supply system of Example 2. This is a block diagram of the power supply system of Example 3. This is a block diagram of the control circuit of fan 82 of Example 4. This is a schematic diagram showing the internal structure of the electrical component case of Example 5. 【0014】 The first component mounting device described above may further include a heating element provided within the housing and connected to the battery. When the switch is off and the fan is operating or stopped, the heating element may generate heat by receiving power from the battery. 【0015】 This configuration allows for suppression of temperature drops inside the enclosure, and more effectively prevents condensation. 【0016】 (Example 1) The component mounting apparatus 10 of Example 1 will be described below with reference to Figures 1 to 3. The component mounting apparatus 10 is a device for mounting components 2 onto a substrate 4. The component mounting apparatus 10 is also called a surface mount apparatus or chip mounter. Typically, the component mounting apparatus 10 is installed together with a solder printing machine, a substrate inspection machine, etc., to form a series of mounting lines. The component mounting apparatus 10 comprises a base 10b and a component mounting module 10a installed on the base 10b. 【0017】 Figure 1 shows a state in which one component mounting module 10a is installed on the base 10b. Multiple component mounting modules 10a can be installed on the base 10b. The multiple component mounting modules 10a can be mounted side by side in the X direction on the base 10b and are configured to be detachable from the base 10b. 【0018】 The component mounting module 10a comprises a substrate transport unit 30, a component mounting unit 40, a component supply unit 50, an operation panel 70, a control system electrical component unit 60 that controls these devices 30, 40, 50, and 70, and a main body cover 11. Hereinafter, the substrate transport unit 30, the component mounting unit 40, the component supply unit 50, and the control system electrical component unit 60 are collectively referred to as the mounting unit 20. The main body cover 11 is a housing that accommodates the mounting unit 20 that performs the substrate production operation. The main body cover 11 covers a portion of the substrate transport unit 30, the component mounting unit 40, and the component supply unit 50. Inside the main body cover 11 is an electrical component case 12 that contains the control system electrical component unit 60. The electrical component case 12 is located below the substrate transport unit 30 and the component mounting unit 40. The inside of the main body cover 11 is divided into a first region R1 and a second region R2. The first region R1 is the area outside the electrical component case 12 within the internal space of the main body cover 11. The first region R1 houses the board transport unit 30, the component mounting unit 40, and a portion of the component supply unit 50. The second region R2 is the area inside the electrical component case 12 and is located below the first region R1. The control system electrical component unit 60 is housed in the second region R2. 【0019】The substrate transport unit 30 is a device that loads the substrate 4 into the component mounting unit 40, positions it in the component mounting unit 40, and unloads it from the component mounting unit 40. The substrate transport unit 30 includes, for example, a pair of belt conveyors 32, a support device (not shown) attached to the belt conveyors 32 and supporting the substrate 4 from below, and a drive device 34 that drives the belt conveyors 32. The substrate 4 is positioned at the mounting position within the component mounting device 10, and once the components 2 are mounted at the mounting position, it is transported from the mounting position to outside the component mounting device 10. As described above, the mounting line including the component mounting device 10 extends in the X direction. The pair of belt conveyors 32 extend along the X direction and transport the substrate 4 in the X direction. 【0020】 The component supply unit 50 is a device that supplies components 2 to be mounted on the circuit board 4. The component supply unit 50 includes a feeder holding section 54 and a plurality of component feeders 52. The plurality of component feeders 52 are detachably attached to the feeder holding section 54. Each component feeder 52 contains a plurality of components 2. The component feeders 52 are detachably attached to the feeder holding section 54 and supply components 2 to the component mounting unit 40. The specific configuration of the component feeders 52 is not particularly limited. Each component feeder 52 may be, for example, a tape-type feeder that contains a plurality of components 2 on a rolled tape, a tray-type feeder that contains a plurality of components 2 on a tray, or a bulk-type feeder that randomly contains a plurality of components 2 in a container. 【0021】The component mounting unit 40, which is a work unit that performs circuit board production operations, is a device (suction unit) that picks up components 2 supplied from the component supply unit 50 and mounts them onto the circuit board 4. The component mounting unit 40 includes a moving device 42, a moving base 44, and a mounting head 46. The moving device 42 is a device that moves the moving base 44 relative to the circuit board 4 and is driven by a control system electrical component unit 60. The moving device 42 is equipped with an XY robot mechanism that drives the moving base 44 in the X and Y directions. The moving device 42 consists of a guide rail that guides the moving base 44, a moving mechanism that moves the moving base 44 along the guide rail, and a motor that drives the moving mechanism. The mounting head 46 is attached to the moving base 44 and moves together with the moving device 42 above the belt conveyor 32 and the component feeder 52. 【0022】The mounting head 46 has a suction nozzle 48 for picking up components 2. The suction nozzle 48 is detachably attached to the mounting head 46. The suction nozzle 48 is configured to be movable in the Z direction (up and down direction in the drawing) by an actuator (not shown) housed in the mounting head 46. As described above, the suction nozzle 48 can move in the Z direction, and in addition, as the moving base 44 moves in the X and Y directions (hereinafter referred to as the XY direction), the suction nozzle 48 can also move in the XY direction. Therefore, by moving the suction nozzle 48 in various directions, components 2 can be picked up by the suction nozzle 48, and the components 2 picked up by the suction nozzle 48 can be mounted on the substrate 4. Therefore, in order to mount components 2 on the substrate 4 using the mounting head 46, first, the suction nozzle 48 is positioned in the XY direction relative to the components 2 supplied from the component feeder 52, and then the suction nozzle 48 is moved downward until the suction surface (bottom surface) of the suction nozzle 48 makes contact. When the suction surface of the suction nozzle 48 comes into contact with the component 2, the suction nozzle 48 picks up the component 2 and moves the suction nozzle 48 upward. Next, the moving device 42 positions the component 2, which has been picked up by the suction nozzle 48, relative to the substrate 4. At this time, the position and orientation of the component 2 in the X and Y directions are adjusted so that the component 2 is positioned at a preset position on the substrate 4. Then, the suction nozzle 48 is moved downward until the component 2 comes into contact with the substrate 4, thereby mounting the component 2 to the substrate 4. 【0023】 The control panel 70 is both an input device that receives instructions from the worker and a display device that shows various kinds of information to the worker. 【0024】 As shown in Figures 1 and 3, an electrical component case 12 is mounted on the lower rear end of the main body cover 11. The electrical component case 12 is formed integrally with the main body cover 11. However, the electrical component case 12 may be provided as a separate component from the main body cover 11. The electrical component case 12 houses the control system electrical component unit 60. An opening is provided at the front end of the main body cover 11, where a component supply unit 50 is located. However, in Figure 3, the component supply unit 50 is omitted and the main body cover 11 is shown. 【0025】The control system electrical component unit 60 is communicatively connected to the board transport unit 30, the component mounting unit 40, the component supply unit 50, and the operation panel 70. In this embodiment, the control system electrical component unit 60 is composed of many heat-generating electrical components and includes a unit control device 62, a power distribution device 64, and a servo amplifier 66. The unit control device 62 is composed of a computer equipped with a CPU, ROM, and RAM. The unit control device 62 drives and controls each of the devices 30, 40, 50, and 70, for example, by executing a pre-installed program. The servo amplifier 66 controls the rotation speed of the motors of the board transport unit 30 and the component mounting unit 40, for example, based on control signals from the unit control device 62. Therefore, a relatively large current flows through the servo amplifier 66, which is one of the electronic components provided in the control system electrical component unit 60. As a result, the temperature of the servo amplifier 66 tends to rise. The power distribution device 64 distributes the power supplied to the component mounting device 10, for example, to each of the devices 30, 40, 50, 62, 64, and 70. 【0026】 The component mounting device 10 has a fan 82. The fan 82 is a DC fan driven by direct current. The fan 82 is installed at the rear end of the electrical component case 12. The fan 82 discharges air from the electrical component case 12 to the outside. When the fan 82 is operating, an airflow A1 is generated inside the electrical component case 12, as shown in Figure 3. The airflow A1 flows into the electrical component case 12 from the air inlet and is discharged outside the electrical component case 12 from the fan 82. The electrical component case 12 is ventilated by the generation of this airflow A1. 【0027】Next, the configuration of the power supply system in the component mounting device 10 of this embodiment will be described. Figure 4 shows the power supply system of the component mounting device 10. Note that the ground wiring is not shown in Figure 4. As shown in Figure 4, the component mounting device 10 has a power supply terminal 80, a circuit breaker 81, a main switch 83, a DC power supply circuit 84, and a battery 85. The power supply terminal 80 is connected to an external power source. The external power source refers to a commercial power source that supplies 100V or 200V AC. The power supply terminal 80 is connected to the input terminal of the DC power supply circuit 84 via the circuit breaker 81 and the main switch 83. As shown in Figures 1 and 3, the main switch 83 is provided on the side of the base 10b. The main switch 83 is operated by the user. When the circuit breaker 81 and the main switch 83 are ON, AC power is supplied from the power supply terminal 80 to the DC power supply circuit 84. When either the circuit breaker 81 or the main switch 83 is OFF, AC power is not supplied from the power supply terminal 80 to the DC power supply circuit 84. The DC power supply circuit 84 converts the AC power supplied from the power supply terminal 80 into DC power. The output terminal of the DC power supply circuit 84 is connected to the mounting unit 20 (i.e., the board transport unit 30, the component mounting unit 40, the component supply unit 50, and the control system electrical component unit 60) and the battery 85. The mounting unit 20 operates by receiving DC power from the DC power supply circuit 84. The battery 85 is charged by the DC power supplied from the DC power supply circuit 84. The battery 85 is connected to the fan 82. The fan 82 operates by receiving DC power from the battery 85. A control circuit for controlling the fan 82 may be provided between the battery 85 and the fan 82. 【0028】Next, the operation of the power supply system and the fan 82 will be explained. When the component mounting device 10 is in use, the circuit breaker 81 and the main switch 83 are turned on. In this state, AC power is supplied from the power supply terminal 80 to the DC power supply circuit 84. As a result, the DC power supply circuit 84 outputs DC power. The DC power output by the DC power supply circuit 84 is supplied to the mounting unit 20, so the mounting unit 20 performs the board production operation. In addition, the DC power output by the DC power supply circuit 84 is supplied to the battery 85, so the battery 85 is charged. That is, the battery 85 is charged by the power supplied from the power supply terminal 80 via the DC power supply circuit 84. Also, the DC power output by the battery 85 is supplied to the fan 82, so the fan 82 operates and the electrical component case 12 is ventilated. In this way, when the main switch 83 is turned on, the battery 85 is charged and the electrical component case 12 is ventilated by the fan 82. This suppresses condensation inside the electrical component case 12. During charging, ventilation of the electrical component case 12 by the fan 82 may be stopped. 【0029】 For example, when the component mounting device 10 is not in use, such as when the facility where the component mounting device 10 is installed (e.g., a factory) is shut down, the main switch 83 is turned off. As a result, the DC power supply circuit 84 does not output DC power, and the power supply to the mounting unit 20 and the battery 85 stops. Since the battery 85 is charged when the component mounting device 10 is in use, the charge level of the battery 85 is high when the main switch 83 is turned off. After the main switch 83 is turned off, the power stored in the battery 85 is supplied to the fan 82. Therefore, the fan 82 continues to operate even when the main switch 83 is off (i.e., when the mounting unit 20 is stopped). In other words, ventilation of the electrical component case 12 by the fan 82 continues even when the mounting unit 20 is stopped. This suppresses the occurrence of condensation inside the electrical component case 12. 【0030】As explained above, in the component mounting apparatus 10, the fan 82 ventilates the electrical component case 12 not only while the mounting unit 20 is operating but also when it is stopped. Therefore, condensation inside the electrical component case 12 can be suppressed not only while the mounting unit 20 is operating but also when it is stopped. In component mounting apparatuses where the electrical component case cannot be ventilated when the mounting unit is stopped, it is necessary to adjust the temperature inside the facility with air conditioning equipment when the mounting unit is stopped to suppress condensation inside the electrical component case. In contrast, in Embodiment 1, the electrical component case 12 can be ventilated when the mounting unit 20 is stopped, so temperature adjustment by air conditioning equipment is unnecessary and power consumption can be reduced. 【0031】 (Example 2) As shown in Figure 5, the component mounting apparatus 10x of Example 2 has a heating element 86. The heating element 86 is connected to a battery 85. The heating element 86 is a device (e.g., an electric heater) that generates heat using DC power supplied from the battery 85. The other configurations of the component mounting apparatus 10x of Example 2 are the same as those of Example 1. 【0032】 In the component mounting apparatus 10x of Example 2, as in Example 1, the fan 82 ventilates the electrical component case 12 not only when the mounting unit 20 is operating but also when it is stopped. However, the ventilation of the electrical component case 12 by the fan 82 may be stopped when the mounting unit 20 is operating. In Example 2, the heating element 86 operates together with the fan 82. By heating the inside of the electrical component case 12 with the heating element 86, condensation inside the electrical component case 12 is more effectively suppressed. In particular, when the facility is shut down, the temperature inside the facility tends to drop, but even in such cases, the heating element 86 heats the inside of the electrical component case 12, effectively suppressing condensation. 【0033】 (Example 3) The component mounting apparatus 10y of Example 3 has a different power supply system than the component mounting apparatus 10 of Example 1. Except for the power supply system, the configuration of the component mounting apparatus 10y of Example 3 is the same as that of Example 1. 【0034】Figure 6 shows the power supply system of the component mounting device 10y of Embodiment 3. As shown in Figure 6, the component mounting device 10y of Embodiment 3 has a power supply terminal 80, a circuit breaker 81, a main switch 83, a DC power supply circuit 84, a DC power supply circuit 87, and a heating element 86. The power supply terminal 80 is connected to an external power supply. The power supply terminal 80 is connected to the input terminal of the DC power supply circuit 84 via the circuit breaker 81 and the main switch 83. When the circuit breaker 81 and the main switch 83 are on, AC power is supplied from the power supply terminal 80 to the DC power supply circuit 84. Also, the power supply terminal 80 is connected to the input terminal of the DC power supply circuit 87 via the circuit breaker 81. That is, the main switch 83 is not interposed between the power supply terminal 80 and the DC power supply circuit 87. Therefore, regardless of the state of the main switch 83, if the circuit breaker 81 is on, AC power is supplied from the power supply terminal 80 to the DC power supply circuit 87. The DC power supply circuit 84 converts the AC power supplied from the power supply terminal 80 into DC power. The output terminal of the DC power supply circuit 84 is connected to the mounting unit 20. The mounting unit 20 operates by receiving DC power from the DC power supply circuit 84. The DC power supply circuit 87 converts the AC power supplied from the power supply terminal 80 into DC power. The output terminal of the DC power supply circuit 87 is connected to the fan 82 and the heating element 86. The fan 82 operates by receiving DC power from the DC power supply circuit 87. The heating element 86 operates by receiving DC power from the DC power supply circuit 87. 【0035】Next, the operation of the power supply system, fan 82, and heat-generating element 86 will be described. When the component mounting device 10y is in use, the main switch 83 is turned on. In this state, AC power is supplied from the power supply terminal 80 to the DC power supply circuits 84 and 87. As a result, the DC power supply circuits 84 and 87 output DC power. The DC power output by the DC power supply circuit 84 is supplied to the mounting unit 20, so the mounting unit 20 performs the board production operation. In addition, the DC power output by the DC power supply circuit 87 is supplied to the fan 82 and / or the heat-generating element 86. As a result, the fan 82 operates to ventilate the electrical component case 12, and the heat-generating element 86 heats the inside of the electrical component case 12. This suppresses condensation inside the electrical component case 12. 【0036】 For example, when the component mounting device 10y is not in use, such as when the facility is shut down, the main switch 83 is turned off. This stops the power supply to the DC power supply circuit 84, and therefore stops the power supply to the mounting unit 20. On the other hand, even when the main switch 83 is turned off, the power supply to the DC power supply circuit 87 is not stopped. Therefore, even after the main switch 83 is turned off, power continues to be supplied from the DC power supply circuit 87 to the fan 82 and the heat-generating element 86, or one of them. Consequently, even when the main switch 83 is off (i.e., when the mounting unit 20 is stopped), the fan 82 and the heat-generating element 86, or one of them, continue to operate. In other words, even when the mounting unit 20 is stopped, ventilation of the electrical component case 12 by the fan 82 and heating of the inside of the electrical component case 12 by the heat-generating element 86, or one of them, continue. This suppresses the occurrence of condensation inside the electrical component case 12. 【0037】 As described above, in the component mounting apparatus 10y of Embodiment 3, the fan 82 and the heat-generating element 86, or either one, operate not only while the mounting unit 20 is in operation but also when it is stopped, thereby suppressing condensation inside the electrical component case 12. 【0038】(Example 4) The component mounting device 10z of Example 4 has a condensation sensor 88, as shown in Figure 7, and activates the fan 82 when the condensation sensor 88 detects condensation. The condensation sensor 88 detects condensation inside the electrical component case 12. The condensation sensor 88 may also be a sensor that detects moisture inside the electrical component case 12. Alternatively, the condensation sensor 88 may be a sensor that determines that condensation has occurred when the temperature inside the electrical component case 12 is higher than a standard value or higher. Alternatively, the condensation sensor 88 may be a sensor that determines that condensation has occurred when the humidity inside the electrical component case 12 is above a standard value. 【0039】 As shown in Figure 7, in Embodiment 4, the fan 82 is connected to the DC power supply 90 via a switch 91. The DC power supply 90 can be any device that supplies DC power. The DC power supply 90 may be the battery 85 in Embodiment 1, the DC power supply circuit 87 in Embodiment 3, or any other device. The switch 91 switches in response to the detection signal from the condensation sensor 88. For example, in response to the detection signal from the condensation sensor 88, current flows through a coil (not shown), and the switch 91 switches in response to the magnetic force generated by the coil. When condensation is detected by the condensation sensor 88, the switch 91 turns on, and DC power is supplied from the DC power supply 90 to the fan 82. Therefore, when condensation is detected, the electrical component case 12 is ventilated by the fan 82. This eliminates the condensation. When condensation is not detected by the condensation sensor 88, the switch 91 turns off, and the power supply from the DC power supply 90 to the fan 82 is cut off. Since the fan 82 is not operated when condensation is not occurring, power consumption can be reduced. 【0040】Furthermore, the control of Embodiment 4, which operates the fan when condensation is detected, can be performed in any mounting device that has a ventilation fan. For example, in Embodiments 1 to 3, the control of Embodiment 4 may be performed on the fan 82 when the main switch 83 is off (i.e., when the mounting unit 20 is stopped). Also, in Embodiments 1 to 3, the control of Embodiment 4 may be performed on the fan 82 when the main switch 83 is on (i.e., when the mounting unit 20 is operating). In addition, the control of Embodiment 4 may be performed on the ventilation fan in mounting devices other than Embodiments 1 to 3 (for example, mounting devices in which the fan operates only when the main switch is on). 【0041】 In Examples 1 to 4, the fan 82 was a fan that expelled air to the outside of the case, but the fan 82 may also be a fan that introduced air into the case. 【0042】 (Example 5) As shown in Figure 8, the mounting device of Example 5 has a fan 23 that introduces air from the outside to the inside of the electrical component case 12. When the fan 23 is operating, an airflow A2 is generated inside the electrical component case 12. The airflow A2 flows from the fan 23 into the electrical component case 12 and is discharged outside the electrical component case 12 from the air outlet. The electrical component case 12 is ventilated by the generation of this airflow A2. Note that the mounting device of Example 5 does not necessarily have a fan that discharges air outside the electrical component case 12. 【0043】 The fan 23 is equipped with a filter 24. The filter 24 may be located either upstream or downstream of the fan 23. The filter 24 removes dust from the airflow A2. 【0044】 The mounting device of Example 5 has a dust sensor 25 that detects dust adhering to the filter 24. The dust sensor 25 may be a sensor that captures an image of the filter 24 and analyzes the captured image to detect the amount of dust. Alternatively, the dust sensor 25 may be a sensor that detects the flow rate of the airflow A2 and detects the amount of dust adhering to the filter 24 based on the detected flow rate (i.e., the air resistance of the filter 24). 【0045】 Further, the mounting device of Example 5 has a control device 26 and a display device 27. When the amount of dust detected by the dust sensor 25 is equal to or greater than a reference value, the control device 26 causes the display device 27 to display a screen notifying that the filter 24 is clogged. Therefore, the user can clean or replace the filter 24 at an appropriate timing. As a result, proper ventilation can be performed by the fan 23, and dew condensation can be suppressed. 【0046】 In addition, the configuration of Example 5 can be adopted by any mounting device having a ventilation fan and a filter. For example, it can be adopted in the mounting devices of Examples 1 to 4 and other mounting devices. 【0047】 As described above, the embodiments have been described in detail, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Also, the technology illustrated in this specification or the drawings achieves a plurality of purposes simultaneously, and has technical utility by achieving one of those purposes itself.

Claims

1. A component mounting apparatus for mounting components onto a circuit board, comprising: a power supply terminal; a mounting unit that performs component mounting operations; a switch connected between the power supply terminal and the mounting unit, which switches between an ON state in which power is supplied from the power supply terminal to the mounting unit and an OFF state in which power is not supplied from the power supply terminal to the mounting unit; a housing for housing the mounting unit; a battery; and a fan connected to the battery for ventilating the inside of the housing, wherein when the switch is ON, the battery is charged by power supplied from the power supply terminal, and when the switch is OFF, the fan is able to operate by receiving power from the battery.

2. The component mounting apparatus according to claim 1, further comprising a heating element provided within the housing and connected to the battery, wherein the heating element generates heat when power is supplied from the battery while the switch is off and the fan is operating.

3. A component mounting apparatus for mounting components onto a circuit board, comprising: a power supply terminal; a mounting unit that performs component mounting operations; a switch connected between the power supply terminal and the mounting unit, which switches between an ON state in which power is supplied from the power supply terminal to the mounting unit and an OFF state in which power is not supplied from the power supply terminal to the mounting unit; a housing that houses the mounting unit; a fan for ventilating the inside of the housing; and a heating element provided inside the housing, wherein when the switch is OFF, the fan is able to operate by receiving power from the power supply terminal, and when the switch is OFF and the fan is operating or stopped, the heating element generates heat by receiving power from the power supply terminal.

4. A component mounting apparatus for mounting components onto a circuit board, comprising: a mounting unit that performs component mounting operations; a housing that houses the mounting unit; a fan that ventilates the inside of the housing; and a condensation sensor that detects condensation inside the housing, wherein the component mounting apparatus operates the fan when the condensation sensor detects condensation.

5. A component mounting apparatus for mounting components onto a circuit board, comprising: a mounting unit that performs component mounting operations; a housing that houses the mounting unit; a fan that ventilates the inside of the housing; a filter provided on the fan; and a dust sensor that detects dust adhering to the filter, wherein the component mounting apparatus provides notification when the dust sensor detects an amount of dust exceeding a standard value.