Control device, mounting device, and information processing method

Abstract

This control device is used for a mounting device including a mounting unit that picks up a component having a body and one or more protrusions formed on the body and places the component on an object to be processed. The control device comprises a control unit that acquires, from a detection unit that detects a distance to the component over a predetermined region, a detection region detected by the detection unit and acquires a position of the protrusion by using, among the acquired detection regions, a position acquisition region limited on the basis of the distance between the detection unit and the component.

Description

Control Device, Mounting Device, and Information Processing Method 【0001】 This specification discloses a control device, a mounting device, and an information processing method. 【0002】 Conventionally, as a mounting device for mounting components on an object such as a substrate, for example, when each of the pin terminals is detected as an image and the bending of each terminal is determined as to whether it is good or not, even when a housing exists as an obstacle around, only the tip portion of the pin is in a state of being obliquely illuminated by slit-shaped illumination light from light sources having different optical axes at least, and each terminal is proposed to be detected simultaneously as a low-distortion and wide-field image (see, for example, Patent Document 1). In this device, it is stated that even though there are surrounding obstacles, each tip portion of the pin can be detected as an image, and the amount of bending at each pin terminal can be detected with high accuracy. 【0003】 Japanese Patent Application Laid-Open No. 11-40307 【0004】 However, in the above-mentioned Patent Document 1, it is stated that even if there are obstacles around, the tip of the pin terminal as a protruding portion can be detected by oblique irradiation. However, depending on the obstacles, there are cases where light cannot be irradiated to the tip of the pin terminal, and further improvement has been demanded. 【0005】 The present disclosure has been made in view of such problems, and the main object is to provide a control device, a mounting device, and an information processing method capable of more accurately obtaining the position of the protruding portion of a component. 【0006】 The control device, mounting device, and information processing method disclosed in this specification have taken the following means to achieve the above main object. 【0007】 That is, the control device of the present disclosure is a control device used in a mounting device including a mounting unit that picks up a component having a main body and one or more protruding portions formed on the main body and arranges it on a processing object, and acquires a detection region detected by a detection unit that detects the distance to the component over a predetermined region from the detection unit, and uses a position acquisition region limited based on the distance between the detection unit and the component in the acquired detection region to acquire the position of the protruding portion, and includes a control unit. 【0008】 In this control device, when detecting the height position of a protrusion over a predetermined area using the distance between the component and the detection unit, even if the detection area cannot be uniformly detected, the control device uses a position acquisition area that is limited by the distance to the component to acquire the position of the protrusion. Therefore, since this control device can eliminate unnecessary information in position acquisition, it can determine the position of the protrusion on the component more accurately. 【0009】 A schematic diagram showing an example of the mounting system 10. A diagram illustrating an example of the mounting imaging unit 28 imaging a component P. A diagram illustrating an example of the detection unit 37 detecting a protruding portion 43 of a component 41. A flowchart showing an example of the mounting processing routine. A flowchart showing an example of the protruding portion position acquisition processing routine. A diagram illustrating an example of the component shape, tip shape, and detection result of a component 41. A diagram illustrating an example of detecting a protruding portion 43 having a planar area. A diagram illustrating an example of detecting a protruding portion 43 that does not have a planar area. A diagram illustrating an example of height-limiting information 24 stored in the storage unit 22. 【0010】 This embodiment will be described below with reference to the drawings. Figure 1 is a schematic diagram showing an example of the mounting system 10. Figure 2 is an explanatory diagram of an example in which the mounting imaging unit 28 images a component P. Figure 3 is an explanatory diagram of an example in which the detection unit 37 detects a protruding portion 43 of a component 41. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figures 1 to 3. 【0011】The mounting system 10 is configured as a production line in which mounting devices 13, which mount components P onto a substrate S as the object to be processed, are arranged in the transport direction of the substrate S. Here, the object to be processed for mounting is described as a substrate S, but it is not particularly limited as long as it mounts components P, and may also be a three-dimensional shaped base material. As shown in Figure 1, this mounting system 10 is configured to include a printing device 11, a printing inspection device 12, a mounting device 13, a mounting inspection device 14, and a control device 18. The printing device 11 is a device that prints a viscous fluid such as solder paste onto the substrate S. The printing device 11 may also be a device that prints adhesives or conductive pastes as the viscous fluid. The printing inspection device 12 is a device that inspects the state of the printed viscous fluid. The mounting device 13 is a device that mounts components P onto the substrate S. The mounting inspection device 14 is a device that inspects the state of the components P mounted by the mounting device 13. The mounting device 13 may also be a mounting-inspection device that has the functions of the mounting inspection device 14. The management device 18 is a computer that manages information on each device of the mounting system 10. 【0012】 The mounting device 13 is a device that takes components P from a component supply unit 26 that supplies components P and components 41, and mounts them onto a substrate S, which is a processing target object before or after printing. As shown in Figure 1, the mounting device 13 comprises a control device 20, a substrate processing unit 25, a component supply unit 26, a mounting imaging unit 28, a mounting unit 30, and a detection unit 37. 【0013】 Component 41 is an electronic component and has a main body 42 and a protruding portion 43. The protruding portion 43 is, for example, a terminal pin, and multiple protruding portions are arranged on the main body 42. Component 41 is fixed by inserting the protruding portion 43 into an insertion hole in a substrate S. The protruding portion 43 has a tapered portion 44 that narrows towards the tip, and a tip portion 45 that is the tip surface. For convenience of explanation, the protruding portion 43 will also be referred to as a "terminal" or "pin" below. 【0014】The control device 20 is configured as a microprocessor centered on the control unit 21 and controls the entire device. This control device 20 includes a storage unit 22 for storing various data. The control device 20 has the function of controlling the entire mounting device 13. The control device 20 outputs control signals to each unit of the mounting device 13 and inputs signals from each unit. The storage unit 22 stores mounting condition information, etc. The mounting condition information includes information such as the mounting order in which components P are mounted on the substrate S, the sampling position of components P, the placement position, and the type of sampling member 33 from which components P can be sampled. As will be described in more detail later, the control device 20 uses the detection area Ad (see Figure 8) detected by the detection unit 37 to perform processing to determine the tip position of the protruding portion 43 of the component 41. 【0015】 The substrate processing unit 25 is a unit that loads, transports, fixes, and unloads substrates S at their mounting positions. The component supply unit 26 has multiple feeders 27 equipped with reels and a tray unit, and is detachably attached to the front side of the mounting device 13. Tape, which serves as a holding member, is wound around each reel, and multiple components P are held along the longitudinal direction of the tape. This holding member is unwound from the reel toward the rear, and with the components P exposed, it is fed by the feeder 27 to the picking position where it will be picked up by the picking member 33. 【0016】 As shown in Figures 1 and 2, the mounting imaging unit 28 is a unit that images the mounting unit 30. The mounting imaging unit 28 is a parts camera that captures images of one or more parts P collected by the mounting head 32. The mounting imaging unit 28 includes an illumination unit that irradiates light onto the mounting unit 30 and an image sensor that converts the input light into an electrical signal. The mounting imaging unit 28 captures an image of the mounting head 32 as it passes over the mounting imaging unit 28, and outputs the captured image data to the control device 20. The control device 20 processes this captured image to inspect whether the shape and location of the parts P are normal, and to detect the amount of deviation such as the position and rotation of the parts P at the time of collection. 【0017】The mounting unit 30 is a unit that collects components P from the component supply unit 26 using a collection member 33 and places them on a substrate S fixed to the substrate processing unit 25. The mounting unit 30 comprises a head moving unit 31, a mounting head 32, a collection member 33, an object imaging unit 34, and a lifting unit 35. The head moving unit 31 comprises a slider that moves in the XY direction guided by a guide rail and a motor that drives the slider. The mounting head 32 is detachably mounted on the slider and moves in the XY direction by the head moving unit 31. One or more collection members 33 are detachably mounted on the lower surface of the mounting head 32. The collection member 33 may be a suction nozzle that collects components using negative pressure, or a mechanical chuck that grips the component P. The object imaging unit 34 is a unit that images the substrate S side as the object. The object imaging unit 34 is a mark camera positioned on the underside of the mounting head 32 that images the substrate S, marks formed on the substrate S, the simulated part 40, etc., from above. The object imaging unit 34 moves in the XY direction as the mounting head 32 moves. The lifting unit 35 is a unit that moves up and down the cylinder to which the sampling member 33 is attached. As shown in Figure 2, the lifting unit 35 is a mechanism that moves linearly in the Z-axis direction, and may be a ball screw mechanism or a linear motor, etc. 【0018】 The detection unit 37 is a sensor unit that detects the distance to the component 41 over a predetermined area. This detection unit 37 is, for example, a unit that detects the tip position of a protrusion 43 of a component 41 having a main body 42 and one or more protrusions 43 formed on the main body 42. The detection unit 37 is equipped with an irradiation input unit 38. The irradiation input unit 38 is a sensor that detects the distance to an object over a predetermined area Ap by irradiating an object located at an opposing position with a detection wave and inputting the reflected wave. The irradiation input unit 38 may also irradiate the object with light and input the reflected light. Alternatively, the irradiation input unit 38 may irradiate the object with a waveform-shaped detection wave and detect the distance to the surface of the object over a predetermined area based on the waveform deformation obtained from the reflected wave. As shown in Figures 7 and 8, which will be described later, the detection unit 37 detects the distance between the protruding portion 43 of the component 41 and a predetermined region Ap, and detects the detection region Ad by acquiring the reflected wave. 【0019】 Next, the operation of the mounting system 10 of this embodiment, as configured in this way, will be explained, starting with the process of placing components P on the substrate S by the mounting device 13. Figure 4 is a flowchart showing an example of a mounting process routine executed by the control device 20 of the mounting device 13. This routine is stored in the storage unit 22 of the mounting device 13 and is executed by the control unit 21 of the control device 20 after the mounting system 10 is started. When this routine is started, the control unit 21 first reads and acquires the mounting condition information of the substrate S to be produced from the storage unit 22 (S100). The control unit 21 may also acquire the mounting condition information from the management device 18. 【0020】 Next, the control unit 21 has the substrate processing unit 25 transport the substrate S to the mounting position and perform the fixing process (S110). Next, the control unit 21 acquires the components P to be picked up by the mounting unit 30 based on mounting condition information and sets them as picked components (S120). At this time, the control unit 21 may replace the picking member 33 as necessary depending on the type of component to be picked up. Next, the control unit 21 has the mounting head 32 pick up the components from the component supply unit 26 (S130), moves the mounting head 32 onto the mounting imaging unit 28, and has the mounting imaging unit 28 take an image (S140). Next, the control unit 21 acquires the position and rotation angle of the components based on the captured image (S150). Next, the control unit 21 determines whether or not there is a component 41 with a protrusion 43 among the components being picked up (S160). If there is a component 41 with a protrusion 43 among the components being picked up, the control unit 21 executes the protrusion position acquisition process (S170). 【0021】Figure 5 is a flowchart showing an example of a protruding portion position acquisition processing routine executed by the control device. This routine is stored in the storage unit 22 of the mounting device 13 and is executed by the control unit 21 in S170 of the mounting processing routine. When this routine is started, the control unit 21 first moves the part 41 having the protruding portion 43 to a position facing the detection unit 37 (S300), and obtains the detection result of a predetermined region Ap by the detection unit 37 (S310). The predetermined region Ap is not particularly limited as long as it is the region including the protruding portion 43, and may be the region including the entire part 41, or the region including each protruding portion 43. Figure 6 is an explanatory diagram of an example of the part shape, tip shape and detection result of the part 41. For example, in Figure 6, the upper part 41 has a tip portion 45 with a small planar area. In this part 41, due to the influence of reflection from the tapered portion 44, the detection result of the detection unit 37 is a detection region Ad with a relatively unstable shape. On the other hand, the lower component 41 has a tip portion 45 with a large planar area, and the detection result of the detection unit 37 is a detection area Ad with a relatively stable shape. 【0022】Next, the control unit 21 sets the protruding portion 43 to be judged (S320) and obtains the maximum and minimum heights of the detection area Ad located within a predetermined area Ap. Here, "height" may refer to the height of the protruding portion 43 determined from the distance between the irradiation input unit 38 and the protruding portion 43. For convenience, it is assumed that a shorter distance results in a higher height of the protruding portion 43, and a longer distance results in a lower height of the protruding portion 43. Furthermore, a higher "height" indicates a larger inclination surface of the tapered portion 44 of the protruding portion 43, resulting in a sharper shape, while a lower height indicates a smaller inclination surface of the tapered portion 44 of the protruding portion 43, resulting in a more planar tip. Next, the control unit 21 determines whether the height H, which is the difference between the maximum height and the minimum height, is less than a predetermined threshold reference height Hs (S340). The predetermined reference height Hs may be empirically determined, for example, to a value that allows determination of whether the tip portion 45 of the protruding portion 43 has a planar area of ​​a predetermined area. Furthermore, the predetermined area may be empirically determined to be, for example, an area value that allows for more accurate calculation of the center position of the tip portion 45. The control unit 21 determines whether or not the tip of the protruding portion 43 has a predetermined planar area based on the distance detected by the detection unit 37. 【0023】 When this height H is less than the reference height Hs, the control unit 21 assumes that there is a predetermined planar area at the tip 45 of the protrusion 43 and extracts a point cloud of the entire detection area Ad occupying the predetermined area Ap (S350). Figure 7 is an explanatory diagram showing an example in which the detection unit 37 detects a protrusion 43 having a predetermined planar area, where Figure 7A is an explanatory diagram of the detection area Ad as a detection result in the predetermined area Ap, and Figure 7B is a conceptual diagram of the height histogram. In Figure 7, the area is drawn so that the color becomes darker as the distance between the detection unit 37 and the protrusion 43 increases. As shown in Figure 7, when the difference value, height H, is smaller than the reference height Hs and there is a predetermined planar area, the detection area Ad obtained from the reflected wave after irradiation is obtained with less deformation, so the control unit 21 can more accurately determine the position of the protrusion 43 using the detection point cloud of the entire detection area Ad indicated by "+" in Figure 7A. 【0024】On the other hand, in S340, if the height H, which is the difference between the maximum height and the minimum height, is not less than a predetermined reference height Hs, that is, if the height H is greater than or equal to the reference height Hs, the control unit 21 acquires a height histogram of the protrusion 43 using the total number of points in the detection area Ad based on the distance between the detection unit 37 and the part 41 (S360), and extracts a point cloud of the top predetermined percentage of the height histogram from the detection area Ad as the position acquisition area Aa (S370). Here, "top predetermined percentage" refers to a predetermined percentage of the height from the tip side of the protrusion 43 (for example, 20%, 30%, etc.). Here, the "predetermined percentage" may be determined empirically by experimentally finding the position of the protrusion 43 at various percentages and setting it within a range where the position of the protrusion 43 can be detected with greater accuracy. The control unit 21 obtains the detection area Ad detected by the detection unit 37, which detects the distance between the detection unit 37 and the protruding portion 43 over a predetermined area Ap, and performs a process to obtain the position of the protruding portion 43 using a position acquisition area Aa limited from the acquired detection area Ad based on the distance between the detection unit 37 and the component 41. 【0025】 Figure 8 is an explanatory diagram showing an example of detecting a protrusion 43 that does not have a planar area. Figure 8A is an explanatory diagram of the detection area Ad as a detection result in a predetermined area Ap, and Figure 8B is a conceptual diagram of the height histogram. In Figure 7, the area is drawn so that the color becomes darker as the distance between the detection unit 37 and the protrusion 43 increases. As shown in Figure 8, when the difference value, height H, is larger than the reference height Hs and the planar area is small, the shape of the detection area Ad obtained from the reflected wave after irradiation tends to become unstable due to the influence of the tapered portion 44. In this case, if the control unit 21 uses the entire detection area Ad to determine its average position, it may determine a position that is shifted from the actual center position, indicated by the dotted line "+" in Figure 8A. Here, for areas where the distance between the detection unit 37 and the protrusion 43 is greater, the tip position of the protrusion 43 is determined without using that information to determine the tip position. As a result, the control unit 21 can determine the position of the protrusion 43 more accurately using the detection point cloud of the position acquisition area Aa, which is a more limited area. 【0026】After S370 or after S350, the control unit 21 calculates the tip position of the protrusion 43 using the extracted point cloud (S380). When the control unit 21 extracts the entire point cloud of the detection area Ad, it obtains its average position as the tip position (center position) of the protrusion 43 (see Figure 7). Also, when the control unit 21 extracts the top predetermined percentage of the point cloud of the height histogram, it obtains its average position as the tip position (center position) of the protrusion 43 (see Figure 8). In other words, when the tip 45 of the protrusion 43 has a predetermined planar area, the control unit 21 obtains the tip position of the protrusion 43 using the detection area Ad detected by the detection unit 37, while when the tip 45 of the protrusion 43 does not have a predetermined planar area, it obtains the tip position of the protrusion 43 using a position acquisition area Aa that limits the detection area Ad. Next, the control unit 21 determines whether or not it has acquired the tip positions of all the protrusions 43 (S390). If it has not acquired the tip positions of all the protrusions 43, it executes the processing from S320 onward. That is, the control unit 21 sets the next protrusion 43 to be determined and repeatedly executes the process of acquiring its tip position according to the height H of the detection area Ad within a predetermined area Ap. On the other hand, when the tip positions of all the protrusions 43 have been acquired, the control unit 21 stores the acquisition results in the storage unit 22 (S400) and terminates this routine. In this way, the control unit 21 stores the tip positions of one or more protrusions 43 of the component 41 in the storage unit 22. 【0027】Now, returning to the explanation of the mounting process routine, after the protrusion position acquisition process in S170, or if the part P is a part without a protrusion 43 in S160, the control unit 21 determines whether or not there are any defective parts among the parts picked up by the mounting head 32 (S180). Defective parts include, for example, defective parts where the pickup position exceeds the acceptable range, and defective parts where the shape of the main body or protrusion exceeds the acceptable range. That is, the control unit 21 determines whether or not the part 41 having the protrusion 43 is usable based on the shape of the main body and pickup position of part P and part 41, as well as the tip position of the acquired protrusion 43. If there are defective parts, the control unit 21 excludes the corresponding defective parts from the mounting process (S190). The control unit 21 may store information such as the placement position and type of the defective part and discard the defective part. The control unit 21 registers a replacement part in the mounting condition information and performs remounting with another part of the same type. 【0028】 If there are no abnormal parts after S190 or in S180, the control unit 21 corrects the misalignment and places the parts on the substrate S as the target object (S200). The control unit 21 controls the head movement unit 31 and the lifting unit 35 to place the parts at the placement positions on the substrate S. In the case of part 41, when the position of the main body 42 is aligned with the placement position, the protruding part 43 is inserted into the insertion hole, and part 41 is placed on the substrate S. Next, the control unit 21 determines whether there is a part P to be picked up and placed next (S210), and if there is a part P to be picked up and placed next, it executes the processing from S120 onwards. On the other hand, if there is no part P to be picked up and placed next in S210, the control unit 21 determines whether the production of the substrate S is complete or not (S220). If the production of the substrate S is not complete, the control unit 21 executes the processing from S110 onwards. On the other hand, if the production of the substrate S is completed in S220, this routine is terminated. In this way, the control unit 21 uses a detection unit 37 that detects the tip position of the protruding portion 43 based on its distance from the opposing irradiation input unit 38, thereby determining the tip position more accurately. 【0029】Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The control device 20 of this embodiment is an example of the control device of the present disclosure, the mounting unit 30 is an example of the mounting unit, the mounting device 13 is an example of the mounting device, the detection unit 37 is an example of the detection unit, and the control unit 21 is an example of the control unit. Furthermore, the component 41 is an example of the component, the main body 42 is an example of the main body, the protruding part 43 is an example of the protruding part, the substrate S is an example of the object, the predetermined area Ap is an example of the predetermined area, the detection area Ad is an example of the detection area, the position acquisition area Aa is an example of the position acquisition area, and the storage unit 22 is an example of the storage unit. In addition, in this embodiment, an example of the information processing method of the present disclosure is also clarified by describing the operation of the mounting device 13. 【0030】 The control device 20 of this embodiment, as described above, is a control device used in a mounting apparatus 13 that includes a mounting unit 30 that picks up a component 41 having a main body 42 and one or more protrusions 43 formed on the main body 42 and places it on a substrate S as a processing target. This control device 20 includes a control unit 21 that acquires a detection area Ad detected by a detection unit 37 that detects the distance to the component 41 over a predetermined area Ap, and acquires the position of the protrusion 43 using a position acquisition area Aa limited from the acquired detection area Ad based on the distance between the detection unit 37 and the component 41. In this control device 20, when detecting the height position of the protrusion 43 over a predetermined area Ap using the distance between the component 41 and the detection unit 37, even if the detection area Ad cannot be detected uniformly, the control device 20 uses a position acquisition area Aa that limits the detection area Ad using the distance to the component 41 to acquire the position of the protrusion 43. Therefore, since this control device 20 can eliminate unnecessary information in position acquisition, the position of the protrusion 43 on the component 41 can be determined more accurately. 【0031】Generally, in a component 41 having a protrusion 43, the tip position of the protrusion 43 can be detected by using, for example, a sidelight camera with multiple laser illuminations on the outer edge of the mounting imaging unit 28. The multiple laser illuminations of the sidelight camera irradiate horizontally on the XY plane. These laser beams are reflected off the tip of the insertion pin, and the mounting imaging unit 28 captures the illuminated state of the pin. In image processing, the control unit 21 detects the position of each individual protrusion (pin) and then uses them to calculate the displacement amount XYθ of the entire component. Also, since pins may be bent for some reason, the control unit detects such pins to prevent mounting defects. As described above, since the sidelight camera irradiates lasers in the horizontal direction, in the case of a component 41 where there are obstacles around the protrusion 43 that block the laser, the protrusion will not light up and accurate image processing cannot be performed. Therefore, a method of measurement using a detection unit 37 as a three-dimensional measuring instrument from the bottom side of the component can be considered. With this method, the shape of the pin tip can be captured in three dimensions. On the other hand, as shown in Figure 6, the shape of the pin tip can be curved or flat. For flat surfaces, the pin position (pin tip, pin center) can be determined by taking the average value of each 3D measurement point. However, for curved pins, it can be difficult to obtain uniform 3D measurement points (Figure 8). In this mounting device 13, the tip position of the protruding part 43 can be determined more accurately by using a limited position acquisition area Aa from all the data in the detection area Ad. 【0032】Furthermore, the control unit 21 acquires a height histogram of the protrusion 43 based on the distance between the detection unit 37 and the part 41, and sets the upper predetermined percentage of the height histogram values ​​within the detection area Ad as the position acquisition area Aa. This control device 20 can more accurately determine the position of the protrusion by using the upper predetermined percentage of the height histogram in which the protrusion 43 was detected. Moreover, the control unit 21 acquires the average position of the upper predetermined percentage of the height histogram values ​​as the tip position of the protrusion 43. This control device 20 can more accurately determine the tip position of the protrusion 43 by using the average position obtained from the height histogram. Furthermore, when the tip 45 of the protrusion 43 has a predetermined planar area, the control unit 21 acquires the tip position of the protrusion 43 using the detection area Ad detected by the detection unit 37, while when the tip 45 of the protrusion 43 does not have a predetermined planar area, it acquires the position of the protrusion 43 using the position acquisition area Aa which limits the detection area Ad. In this control device 20, if the position of the protrusion 43 has a planar area where its position can be reliably determined, the detection area Ad is used as is to simplify the process. If the position of the protrusion 43 is difficult to reliably determine because it does not have a predetermined planar area, the detection area Ad is used in a limited manner to determine the position of the protrusion 43 more accurately. The control unit 21 then determines whether or not the tip 45 of the protrusion 43 has a predetermined planar area based on the distance detected by the detection unit 37. In this control device 20, it is possible to determine whether or not a planar area exists on the protrusion 43 using the detected distance. Furthermore, since this control device 20 uses the measured distance value, there is no need to acquire other data for planar area determination. 【0033】Furthermore, the mounting device 13 includes a mounting unit 30 that picks up a component 41 having a main body 42 and one or more protrusions 43 formed on the main body 42 and places it on a substrate S as the object to be processed, a detection unit 37 that detects the distance to the component 41 over a predetermined area Ap, and the control device 20 described above. Similar to the control device 20, it is possible to eliminate unnecessary information when acquiring the tip position of the protrusion 43, so that the tip position of the protrusion 43 can be determined more accurately. In addition, the control unit 21 determines whether the component 41 having the protrusion 43 is usable based on the acquired position of the protrusion 43. With this mounting device 13, more reliable component mounting can be performed by more accurately determining the position of the protrusion 43. 【0034】 It goes without saying that the control devices, mounting devices, and information processing methods disclosed herein are not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention. 【0035】 For example, in the embodiment described above, the control unit 21 uses a height histogram and sets the upper predetermined percentage of the height histogram as the limited position acquisition region Aa. However, it is not limited to this, and the position acquisition region Aa may be determined without using a height histogram if the distance between the detection unit 37 and the protrusion 43 is used. Also, in the embodiment described above, the average position of the upper predetermined percentage of the height histogram is acquired as the position of the protrusion. However, it is not limited to this, and a position other than the average position, such as the centroid position, may be used as the position of the protrusion. 【0036】 In the embodiment described above, when the tip 45 of the protrusion 43 has a predetermined planar area, the detection area Ad detected by the detection unit 37 is used to determine the tip position. However, the invention is not limited to this, and this process may be omitted. That is, the control unit 21 may always use a position acquisition area Aa that limits the detection area Ad to determine the tip position of the protrusion 43. In this control unit 21, the determination process can be further simplified. 【0037】In the above-described embodiment, the control unit 21 determines whether or not there is a planar area at the tip 45 of the protrusion 43 based on the height H, which is the difference between the highest and lowest positions of the detection area Ad, based on the distance detected by the detection unit 37. However, it is not limited to this, and the area of ​​each layer of the detection area Ad may be determined, and the presence or absence of a predetermined planar area may be determined based on this area. In this control device 20, since the area is determined directly, a more accurate determination can be made. 【0038】 In the embodiment described above, the control unit 21 determined whether a predetermined planar area was present at the tip of the protrusion based on the distance between the detection unit 37 and the component 41, but it is not limited to this. For example, the control unit 21 may determine whether a predetermined planar area is present at the tip of the protrusion 43 based on the shape information of the component stored in the storage unit 22. This control device 20 can determine whether a planar area exists on the protrusion 43 based on pre-registered information. The shape information of the component may include, for example, the number of protrusions 43, the shape of the protrusion 43 itself, and the shape of the tip of the protrusion 43. This shape information may be input by the worker, provided by the supplier of the component 41, or pre-registered from the image captured by the mounting imaging unit 28 or the detection result of the detection unit 37. 【0039】In the above-described embodiment, the detection area Ad is limited by one predetermined upper percentage of the height histogram, but it is not limited to this, and the detection area Ad may be limited by percentages corresponding to multiple heights. For example, the control unit 21 acquires a height histogram of the protrusion 43 based on the distance between the detection unit 37 and the part 41, and when the height histogram is within a first range, the value of the first percentage of the height histogram within the detection area Ad is set as the position acquisition area Aa, while when the height histogram is within a second range which is larger than the first range, the value of the second percentage which is narrower than the first percentage is set as the position acquisition area Aa. Figure 9 is an explanatory diagram showing an example of height-limiting information 24 stored in the storage unit 22. The height-limiting information 24 is associated with multiple ranges of the height histogram and their corresponding limiting percentages. Specifically, the control unit 21 uses, for example, the value of the top 30% of the detection area Ad as the first percentage when the height histogram is 0.3 mm in the first range, and when the height histogram is 0.5 mm in the second range. The top 20% value may be used as the second proportion. In this control device 20, the tip position of the protrusion 43 can be determined more accurately by using multiple proportions according to the height distribution of the protrusion 43. 【0040】 In the embodiments described above, the disclosure was explained as an implementation system 10 and an implementation device 13, but it is not limited to these, and may also be a control device 20, a control method for the implementation device 13, an implementation method, and a program to implement these methods. 【0041】 Herein, the information processing method of the present disclosure may be configured as follows. For example, the information processing method of the present disclosure is an information processing method executed by a control device of an assembly device equipped with an assembly unit that takes a part having a main body and one or more protrusions formed on the main body and places it on an object to be processed, and includes: (a) a step of acquiring a detection area detected by a detection unit that detects the distance to the part over a predetermined area from the detection unit; and (b) a step of acquiring the position of the protrusion using a position acquisition area limited from the detection area acquired in step (a) based on the distance between the detection unit and the part. 【0042】In this information processing method, similar to the control device described above, unnecessary information can be excluded in position acquisition, so that the position of the protrusion can be determined more accurately. In this information processing method, any of the various aspects of the control device or the mounting device described above may be adopted, or steps for realizing the functions of the control device or the mounting device described above may be added. 【0043】 In this specification, the technical idea of changing "the control device according to claim 1 or 2" to "the control device according to any one of claims 1 to 3" in claim 4 at the time of filing, and the technical idea of changing "the control device according to claim 1 or 2" to "the control device according to any one of claims 1 to 6" in claim 7 at the time of filing, and the technical idea of changing "the control device according to claim 1 or 2" to "the control device according to any one of claims 1 to 7" in claim 8 at the time of filing are also disclosed. 【0044】 The present disclosure can be used in the technical field of devices that perform processes such as picking and arranging parts. 【0045】 10 Mounting system, 11 Printing device, 12 Printing inspection device, 13 Mounting device, 14 Mounting inspection device, 18 Management device, 20 Control device, 21 Control unit, 22 Storage unit, 24 Height-limiting information, 25 Substrate processing unit, 26 Component supply unit, 27 Feeder, 28 Mounting imaging unit, 30 Mounting unit, 31 Head movement unit, 32 Mounting head, 33 Sampling member, 34 Object imaging unit, 35 Lifting unit, 41 Component, 42 Main body, 43 Protrusion, 44 Tapered portion, 45 Tip portion, Aa Position acquisition area, Ad Detection area, Ap Predetermined area, H Height, Hs Reference height, P Component, S Substrate.

Claims

1. A control device used in a mounting apparatus that includes a mounting unit for picking up a part having a main body and one or more protrusions formed on the main body and placing it on a workpiece, the control device comprising: a control unit that acquires a detection area detected by a detection unit that detects the distance to the part over a predetermined area, and acquires the position of the protrusion using a position acquisition area limited from the acquired detection area based on the distance between the detection unit and the part.

2. The control device according to claim 1, wherein the control unit acquires a height histogram of the protruding portion based on the distance between the detection unit and the component, and sets the upper predetermined percentage of the height histogram values ​​within the detection area as the position acquisition area.

3. The control device according to claim 2, wherein the control unit acquires the position of the protruding portion as the average position of the top predetermined percentage of the height histogram.

4. The control device according to claim 1 or 2, wherein the control unit acquires the position of the protrusion using the detection area detected by the detection unit when the tip of the protrusion has a predetermined planar area, and acquires the position of the protrusion using the position acquisition area which limits the detection area when the tip of the protrusion does not have a predetermined planar area.

5. The control device according to claim 4, wherein the control unit determines whether or not the tip of the protruding portion has a predetermined planar area based on the distance detected by the detection unit.

6. The control device according to claim 4, wherein the control unit determines whether or not the tip of the protruding portion has a predetermined planar area based on the shape information of the component stored in the memory unit.

7. The control device according to claim 1 or 2, wherein the control unit acquires a height histogram of the protruding portion based on the distance between the detection unit and the component, and when the height histogram is within a first range, the position acquisition area is defined as the value of a first proportion of the height histogram within the detection area, while when the height histogram is within a second range which is larger than the first range, the position acquisition area is defined as the value of a second proportion which is narrower than the first proportion.

8. An assembly apparatus comprising: an assembly unit that collects a part having a main body and one or more protrusions formed on the main body and places it on an object to be processed; a detection unit that detects the distance to the part over a predetermined area; and a control device according to claim 1 or 2.

9. The mounting apparatus according to claim 8, wherein the control unit determines whether or not a component having a protrusion can be used based on the acquired position of the protrusion.

10. An information processing method to be performed by a control device of a mounting apparatus, which includes a mounting unit that takes a part having a main body and one or more protrusions formed on the main body and places it on a workpiece, comprising: (a) a step of acquiring a detection area detected by a detection unit that detects the distance to the part over a predetermined area from the detection unit; and (b) a step of acquiring the position of the protrusion using a position acquisition area limited from the detection area acquired in step (a) based on the distance between the detection unit and the part.

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