Semiconductor device

The semiconductor device achieves precise positioning and assembly of semiconductor modules and covers through innovative integration of positioning pins and projections, enhancing electrical connections and accommodating diverse configurations.

WO2026126711A1 Publication Date: 2026-06-18FUJI ELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
FUJI ELECTRIC CO LTD
Filing Date
2025-11-07
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing semiconductor devices face challenges in precisely positioning the semiconductor module and cover due to variations in their configurations, leading to potential misalignment and assembly issues.

⚗Method used

A semiconductor device design featuring a cover with positioning pins, through holes, and projections that integrate with the semiconductor module's control terminals and main terminals, allowing for precise alignment and fixation using a cooler, along with a wiring board mounting system that utilizes positioning pins and bosses for high-precision assembly.

🎯Benefits of technology

Enables high-precision positioning and easy assembly of semiconductor modules and covers, facilitating efficient electrical connections and accommodating various configurations of wiring boards and modules while ensuring structural integrity and ease of transportation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention realizes a semiconductor device comprising a semiconductor module and a cover positioned with high precision.　A semiconductor device (1) is provided with semiconductor modules (10A-10C) and a cover (20). The semiconductor modules (10A-10C) have, on an upper surface of a case formed of a resin, a control terminal (13) and main terminals (12a-12d). The cover (20) has: a fixing portion (22) that is fixed to a cooler (30) provided on a lower side of the semiconductor modules (10A-10C); a cover body (21) that covers at least a part of an upper surface of each of the semiconductor modules (10A-10C), and a positioning pin (21d) that is disposed on an upper surface (21c) of the cover body; and a through hole (21a) through which the control terminal (13) is inserted. A protrusion (11f) is provided on the upper surface of each of the semiconductor modules (10A-10C), the protrusion (11f) fitting into an opening (21b) provided in the cover (20) and being formed integrally with the resin that holds the control terminal (13).
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