Defect inspection method and defect inspection device

The defect inspection method for silicon carbide substrates uses PL imaging and threshold-based analysis to efficiently detect defects by integrating pixel brightness and recognizing defect shapes, addressing inefficiencies in existing methods.

WO2026126722A1 Publication Date: 2026-06-18ITES CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
ITES CO LTD
Filing Date
2025-11-12
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Existing defect inspection methods for silicon carbide substrates are inefficient due to high data processing requirements, leading to prolonged inspection times, especially when dealing with large numbers of pixels.

⚗Method used

A defect inspection method and apparatus that utilizes photoluminescence (PL) imaging, integrating pixel brightness values by rows and columns, and threshold-based determination to identify defects, followed by aspect ratio analysis and shape recognition to differentiate between completed and expanded stacking faults.

🎯Benefits of technology

Enables efficient detection of defects in silicon carbide substrates by reducing data processing and identifying potential expanded defects quickly, thus improving inspection speed and accuracy.

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Abstract

Provided is a defect inspection method making it possible to efficiently detect a defect present in a silicon carbide substrate in a short period of time.　The defect inspection method for detecting a defect present in a silicon carbide substrate 100 comprises: an irradiation step for irradiating the entire silicon carbide substrate 100 with inspection light L1 to cause the silicon carbide substrate 100 to emit PL light; an imaging step for imaging the silicon carbide substrate 100 emitting the PL light; an integration step for calculating, for a PL emission image that has been imaged in the imaging step and includes a plurality of pixels arrayed in a matrix including a plurality of rows and a plurality of columns, an integrated value obtained by integrating luminance values of the pixels for each row and / or column; an acquisition step for acquiring the luminance values of the pixels in the rows and / or columns in which the integrated value is greater than or equal to a certain value; and a first determination step for determining that the pixels are deposit pixels when the luminance values of the pixels acquired in the acquisition step are greater than or equal to a threshold.
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