Chip processing device

Abstract

Provided is a chip processing device capable of suppressing a stop time of chip re-affixing processing which takes place during replacement of a storage-side sheet or a supply-side sheet.　A chip processing device 10 comprises a conveyance unit 11 that moves a chip W acquired from a supply-side sheet S1 to which a plurality of chips W are affixed and affixes the chip W to a storage-side sheet T1 disposed at an affixing position P. The chip processing device 10 comprises: a storage-side rotating body 14 to which a plurality of storage-side sheets T1-T5 are fixed and which disposes one of the plurality of storage-side sheets T1-T5 at the affixing position P; and a storage-side driving means that rotates the storage-side rotating body 14 to move the storage-side sheet T1 disposed at the affixing position P to another position and disposes another storage-side sheet T2-T5 at the affixing position P.

Description

Chip processing device 【0001】 The present invention relates to a chip processing device that performs predetermined processing on chips. 【0002】 As described in Patent Document 1, a dicing machine attaches chips attached to one sheet (hereinafter referred to as the "supply-side sheet") to another sheet (hereinafter referred to as the "storage-side sheet"). When all the chips on the supply-side sheet are removed by the dicing machine, the supply-side sheet is replaced with another supply-side sheet to which chips are attached, and when the attachment of chips to the attachable area of the storage-side sheet is completed, the storage-side sheet is replaced with a storage-side sheet to which no chips are attached. 【0003】 Further, when the dicing machine attaches the chips attached to the supply-side sheet to the storage-side sheet corresponding to each rank based on the inspection results of the ranking of the chips performed in the previous process, the storage-side sheet is replaced with another storage-side sheet before the attachment of the chips to the attachable area of the storage-side sheet is completed. Specifically, assuming that chips of ranks A and B are attached to the supply-side sheet, when all the chips of rank A on the supply-side sheet are attached to the storage-side sheet for rank A, the storage-side sheet is replaced with the storage-side sheet for rank B. 【0004】 Japanese Unexamined Patent Application Publication No. 2022-45511 【0005】 Here, the dicing machine needs to stop the chip replacement process while replacing the supply-side sheet or the storage-side sheet. The present invention has been made in view of such circumstances, and an object thereof is to provide a chip processing device capable of suppressing the stop time of the chip replacement process that occurs when replacing the storage-side sheet or the supply-side sheet. 【0006】A chip processing apparatus according to the first invention in line with the above objective is a chip processing apparatus having a transport unit that moves chips obtained from a supply-side sheet on which a plurality of chips are attached and attaches them to a storage-side sheet arranged at an attachment position, comprising: a storage-side rotating body on which a plurality of storage-side sheets are fixed and which places one of the plurality of storage-side sheets at the attachment position; and a storage-side driving means that rotates the storage-side rotating body to move the storage-side sheet that was placed at the attachment position to another position and place the other storage-side sheet at the attachment position. 【0007】 A chip processing apparatus according to a second invention in line with the above objective is a chip processing apparatus having a transport unit that moves chips acquired from a supply-side sheet, which is arranged at an acquisition position with a plurality of chips attached to it, and attaches them to a storage-side sheet, comprising: a supply-side rotating body on which a plurality of the supply-side sheets are fixed and which arranges one of the plurality of supply-side sheets at the acquisition position; and a supply-side driving means that rotates the supply-side rotating body to move the supply-side sheet that was arranged at the acquisition position to another position and arrange the other supply-side sheet at the acquisition position. 【0008】 The chip processing apparatus according to the first invention includes a storage-side rotating body on which a plurality of storage-side sheets are fixed and which positions one of the plurality of storage-side sheets at the attachment position, and a storage-side driving means that rotates the storage-side rotating body to move the storage-side sheet that was positioned at the attachment position to another position and position the other storage-side sheet at the attachment position. As such, it is possible to suppress the downtime of the chip replacement process that occurs when replacing a storage-side sheet. 【0009】 The chip processing apparatus according to the second invention includes a supply-side rotating body on which a plurality of supply-side sheets are fixed and which positions one of the plurality of supply-side sheets at the acquisition position, and a supply-side driving means that rotates the supply-side rotating body to move the supply-side sheet that was positioned at the acquisition position to another position and position another supply-side sheet at the acquisition position. As such, it is possible to suppress the downtime of the chip replacement process that occurs when replacing a supply-side sheet. 【0010】This is an explanatory diagram of a chip processing apparatus according to the first embodiment of the present invention. This is an explanatory diagram of the chip processing apparatus. This is a block diagram showing the connection of the central control means. This is a flowchart showing the chip replacement process. This is an explanatory diagram of a chip processing apparatus according to the second embodiment of the present invention. This is a partially omitted plan view of a chip processing apparatus according to the third embodiment of the present invention. This is a partially omitted side view of the chip processing apparatus. 【0011】 Next, with reference to the attached drawings, embodiments of the present invention will be described to facilitate understanding of the present invention. As shown in Figures 1 and 2, the chip processing apparatus 10 according to the first embodiment of the present invention is a device equipped with a transport unit 11 that moves chips W obtained from supply-side sheets S1 and S2 to which a plurality of chips W are attached, and attaches them to storage-side sheets T1 to T5 arranged at attachment positions P. These will be described in detail below. 【0012】 As shown in Figures 1 and 2, the supply-side sheets S1 and S2 are attached to the ring-shaped members J1 and J2 respectively, while the storage-side sheets T1 to T5 are attached to the ring-shaped members K1 to K5 respectively, while stretched over them. The chip W is, for example, a diode, transistor, capacitor, inductor, IC (Integrated Circuit), resistor, filter, bare die, memory, LED, or various sensors, but is not limited to these. 【0013】 As shown in Figures 1, 2, and 3, the chip processing apparatus 10 includes a supply-side rotating body 12 to which multiple (up to two in this embodiment) supply-side sheets S1 and S2 can be fixed, a supply-side fixing means 13 for fixing ring-shaped members J1 and J2 to fix the supply-side sheets S1 and S2 to the supply-side rotating body 12, a storage-side rotating body 14 to which multiple (up to five in this embodiment) storage-side sheets T1 to T5 can be fixed, and a storage-side fixing means 15 for fixing the storage-side sheets T1 to T5 to the storage-side rotating body 14. Note that the maximum number of supply-side sheets that can be fixed to the supply-side rotating body is not limited to two, and the maximum number of storage-side sheets that can be fixed to the storage-side rotating body is not limited to five. 【0014】In this embodiment, the supply-side rotating body 12 and the storage-side rotating body 14 are arranged with a gap between them, as shown in Figures 1 and 2, and the transport unit 11 is positioned between the supply-side rotating body 12 and the storage-side rotating body 14. Therefore, the supply-side rotating body 12, the transport unit 11, and the storage-side rotating body 14 are arranged in line with the flow of the chips W being transported. In plan view, the supply-side rotating body 12 and the storage-side rotating body 14 are each approximately circular in shape. The supply-side rotating body 12 is rotatable with respect to a vertical axis of rotation 16 provided at the center of the supply-side rotating body 12, and the storage-side rotating body 14 is rotatable with respect to a vertical axis of rotation 17 provided at the center of the storage-side rotating body 14. 【0015】 As shown in Figure 3, the chip processing apparatus 10 comprises a supply-side driving means 18 that applies rotational force to the supply-side rotating body 12 via a rotating shaft 16, a supply-side control means 19 that controls the supply-side driving means 18, a storage-side driving means 20 that applies rotational force to the storage-side rotating body 14 via a rotating shaft 17, and a storage-side control means 21 that controls the storage-side driving means 20. In this embodiment, the supply-side driving means 18 and the storage-side driving means 20 are each composed of motors, and the supply-side control means 19 and the storage-side control means 21 are each composed of electronic circuits or the like. 【0016】 As shown in Figures 1 and 2, two supply-side sheets S1 and S2 can be fixed to the supply-side rotating body 12 at a distance of 180 degrees in the circumferential direction of the supply-side rotating body 12. In this embodiment, the supply-side fixing means 13 for fixing the supply-side sheets S1 and S2 to the supply-side rotating body 12 is a mechanism attached to the supply-side rotating body 12 that grips the ring-shaped members J1 and J2 respectively (however, it is not limited to this type). 【0017】 The supply-side fixing means 13 grips the ring-shaped member J1 to fix the supply-side sheet S1 to the supply-side rotating body 12, and grips the ring-shaped member J2 to fix the supply-side sheet S2 to the supply-side rotating body 12. The supply-side fixing means 13 can be composed of a clamping mechanism that grips the ring-shaped members J1 and J2 and a control unit that controls the operation of the clamping mechanism. 【0018】The supply-side rotating body 12 rotates 180 degrees clockwise or counterclockwise (i.e., the difference in circumferential angles of the two supply-side sheets S1 and S2 fixed to the supply-side rotating body 12) by the operation of the supply-side driving means 18, and then stops. With the supply-side rotating body 12 stopped, one of the two supply-side sheets S1 and S2 fixed to the supply-side rotating body 12 is positioned at an acquisition position Q near the transport unit 11, and the other is positioned at a supply-side exchange position L which is at a distance from the acquisition position Q. 【0019】 Therefore, the supply-side rotating body 12 will position one of the multiple supply-side sheets S1 and S2 at the acquisition position Q. The supply-side driving means 18 will rotate the supply-side rotating body 12 to move the supply-side sheets S1 and S2 that were positioned at the acquisition position Q to the supply-side exchange position L (i.e., a position different from the acquisition position Q), and position the supply-side sheets S1 and S2 that were positioned at the supply-side exchange position L (other supply-side sheets S1 and S2 from the perspective of the supply-side sheets S1 and S2 that were positioned at the acquisition position Q) at the acquisition position Q. 【0020】 Here, acquisition position Q refers to the position where the supply sheets S1 and S2 located at acquisition position Q are acquired by the transport unit 11. Supply side replacement position L refers to the position where the supply sheets S1 and S2 located at supply side replacement position L are replaced with another supply sheet (on which multiple chips W are attached). 【0021】 In this embodiment, the supply-side fixing means 13 continues to fix the two supply-side sheets S1 and S2 to the supply-side rotating body 12 until the supply-side sheets S1 and S2, which were positioned at the acquisition position Q, move to the supply-side exchange position L by the rotation of the supply-side rotating body 12. After the supply-side sheets S1 and S2 are positioned at the supply-side exchange position L, the fixing of the supply-side sheets S1 and S2 is released. 【0022】Furthermore, five storage-side sheets T1 to T5 can be fixed to the storage-side rotating body 14 at intervals in the circumferential direction of the storage-side rotating body 14 (in this embodiment, they are equally spaced, but they do not have to be equally spaced). In this embodiment, a storage-side fixing means 15 is used that fixes the storage-side sheets T1 to T5 to the storage-side rotating body 14 by negative pressure and releases the storage-side sheets T1 to T5 from the storage-side rotating body 14 by venting to the atmosphere or by positive pressure (however, the storage-side fixing means 15 is not limited to this type). 【0023】 The storage-side fixing means 15 can be composed of a vacuum pump, a plurality of solenoid valves, and a control unit consisting of an electronic circuit that controls the vacuum pump and the plurality of solenoid valves. The storage-side fixing means 15 can individually switch between fixing and releasing each of the storage-side seats T1 to T5 to the storage-side rotating body 14. 【0024】 The storage-side rotating body 14 rotates clockwise or counterclockwise by an angle of 72 degrees (i.e., the difference in the circumferential angle of the storage-side rotating body 14 between the five storage-side sheets T1 to T5 fixed to the storage-side rotating body 14) or multiples of that angle (for example, twice) by the operation of the storage-side driving means 20, and then stops. With the storage-side rotating body 14 stopped, one of the five storage-side sheets T1 to T5 fixed to the storage-side rotating body 14 is placed at an attachment position P near the transport unit 11, and the other one is placed at a storage-side exchange position M which is at a distance from the attachment position P. 【0025】 Therefore, the storage-side rotating body 14 places one of the multiple storage-side sheets T1 to T5 at the attachment position P. The storage-side driving means 20 rotates the storage-side rotating body 14 to move the storage-side sheets T1 to T5 that were placed at the attachment position P to a different position (storage-side exchange position M or another position), and places one of the storage-side sheets T1 to T5 that were placed at a different position from the attachment position P (other storage-side sheets T1 to T5 from the perspective of the storage-side sheets T1 to T5 that are moved to a different position from the attachment position P) at the attachment position P. 【0026】The attachment position P refers to the position where the storage-side sheets T1 to T5, located at attachment position P, are attached to the chip W by the transport unit 11. The storage-side replacement position M refers to the position where the storage-side sheets T1 to T5, located at storage-side replacement position M, are replaced with a different storage-side sheet (this storage-side sheet does not have the chip W attached to it). In Figure 1, the area enclosed by the dashed lines of the supply-side sheets S1 and S2 and the storage-side sheets T1 to T5 indicates the area where the chip W can be attached. 【0027】 Here, when moving the storage-side sheets T1 to T5, which were positioned at the attachment position P, to the storage-side replacement position M, the storage-side fixing means 15 continues to fix the five storage-side sheets T1 to T5 to the storage-side rotating body 14 until the storage-side sheets T1 to T5, which were positioned at the attachment position P, move from the attachment position P to the storage-side replacement position M by the rotation of the storage-side rotating body 14. After the storage-side sheets T1 to T5 are positioned at the storage-side replacement position M, the fixing of the storage-side sheets T1 to T5 is released. 【0028】 The movement of storage-side sheets T1 to T5 from the attachment position P to the storage-side replacement position M is performed, for example, when chips W have been attached to all of the chip W planned attachment areas of storage-side sheets T1 to T5 placed at attachment position P, and the storage-side sheets T1 to T5 that have moved to the storage-side replacement position M are replaced with other storage-side sheets. As shown in Figure 3, the supply-side fixing means 13 and the storage-side fixing means 15 are connected to a central control means 22 which is connected to the supply-side control means 19 and the storage-side control means 21. The central control means 22 can be configured with a CPU, memory, and communication device, etc. 【0029】 The central control means 22 is connected to a supply-side exchange mechanism 23 that replaces supply-side sheets S1 and S2, which have been released from their fixation to the supply-side rotating body 12 at the supply-side exchange position L, with another supply-side sheet, and a storage-side exchange mechanism 24 that replaces storage-side sheets T1 to T5, which have been released from their fixation to the storage-side rotating body 14 at the storage-side exchange position M, with another storage-side sheet. The supply-side exchange mechanism 23 and the storage-side exchange mechanism 24 can each be configured by a hand-type robot (however, they are not limited to hand-type robots). 【0030】 Furthermore, in this embodiment, each chip W attached to the supply-side sheet S1 (the same applies to the supply-side sheet S2 and the supply-side sheet placed on the supply-side rotating body 12 by the supply-side exchange mechanism 23) undergoes a quality ranking inspection in advance (in the previous process). Here, each chip W is ranked into five ranks (n chips) A, B, C, D, and E, and five (n) storage-side sheets T1 to T5 are used as targets for attaching rank A, rank B, rank C, rank D, and rank E chips, respectively. Note that n is an integer of 2 or more. 【0031】 The central control means 22 is connected to a storage means 25 that stores rank information for each chip W attached to the supply sheets S1, S2 and the supply sheet replacement mechanism 23 which are arranged on the supply rotating body 12 (hereinafter, when referring to the supply sheets and the supply sheets S1, S2, they will be described as "supply sheets S1, S2, etc."). The storage means 25 can be made of a storage medium such as memory and also stores information on the position of each chip W on the supply sheets S1, S2, etc. 【0032】 As shown in Figures 1, 2, and 3, the transport unit 11 includes a chip acquisition means 27 for acquiring chips W attached to supply-side sheets S1 and S2 located at acquisition position Q, a chip moving means 28 for acquiring and moving chips W from the chip acquisition means 27, and a chip attachment means 29 for acquiring chips W from the chip moving means 28 and attaching them to storage-side sheets T1 to T5 located at attachment position P. Note that in Figure 1, the chip acquisition means 27 and chip attachment means 29 are not shown. 【0033】In this embodiment, as shown in Figures 2 and 3, a push-up mechanism 30 connected to a central control means 22 is provided below the supply-side sheets S1 and S2 positioned at the acquisition position Q. The push-up mechanism 30 receives a command signal from the central control means 22 and pushes up predetermined locations on the supply-side sheets S1 and S2 positioned at the acquisition position Q, along with the chip W attached to those locations, bringing the chip W closer to the chip acquisition means 27. The relative position of the member of the push-up mechanism 30 that pushes up the chip W with respect to the supply-side rotating body 12 can be changed. 【0034】 The chip acquisition means 27 adsorbs the chip W that has been pushed up by the push-up means 30, removes it from the supply-side sheets S1 and S2, and provides the chip W to the chip moving means 28. The chip moving means 28 has a rotating body 31 equipped with adsorption parts that each adsorb a plurality of chips W. Due to the intermittent rotation of the rotating body 31, each chip W adsorbed by the rotating body 31 moves toward the chip attachment means 29. Near the chip moving means 28, a mechanism can be provided to perform a predetermined process (such as visual inspection or laser marking) on ​​the chip W adsorbed by the chip moving means 28. 【0035】 The chip attachment means 29 picks up the chip W that the chip moving means 28 has picked up and attaches the chip W to the storage side sheets T1 to T5 located at the attachment position P. In this embodiment, the chip acquisition means 27 and the chip attachment means 29 each have multiple suction parts for picking up chips, but they may each have only one suction part. Also, the chip acquisition means 27, the chip moving means 28 and the chip attachment means 29 may support the chip W by a method other than suction (for example, gripping). 【0036】Furthermore, in this embodiment, the relative position adjustment of the suction portion of the chip acquisition means 27, which acquires the chips W on the supply-side sheets S1 and S2, is performed by moving the suction portion of the chip acquisition means 27. However, the supply-side sheets S1 and S2 may be made movable relative to the supply-side rotating body 12, and the same position adjustment may be performed by moving the supply-side sheets S1 and S2. The same applies to the relative position adjustment of the suction portion of the chip attachment means 29, which attaches the chips W to the storage-side sheets T1 to T5. As in this embodiment, the same position adjustment may be performed by moving the suction portion of the chip attachment means 29, or the storage-side sheets T1 to T5 may be made movable relative to the storage-side rotating body 14, and the same position adjustment may be performed by moving the storage-side sheets T1 to T5. 【0037】 Furthermore, in this embodiment, a supply-side imaging means 32 is provided for imaging the chips W that are attracted to the chip acquisition means 27 on the supply-side sheets S1 and S2 located at the acquisition position Q, and a storage-side imaging means 33 is provided for imaging the locations on the storage-side sheets T1 to T5 located at the attachment position P where the chips W are attached. The supply-side imaging means 32 and the storage-side imaging means 33 are connected to the central control means 22. 【0038】 The central control means 22 acquires the image captured by the supply-side imaging means 32, and based on the image, the chip acquisition means 27 pre-detects the position of the next chip W to be acquired from the supply-side sheets S1 and S2 located at the acquisition position Q. The chip acquisition means 27 acquires the corresponding chip W based on the position information of the next chip W to be acquired detected by the central control means 22. 【0039】The supply-side imaging means 32 may have an imaging range that can image the entire area where chips W can be attached to the supply-side sheets S1 and S2 located at the acquisition position Q, or it may be designed so that the imaging range can be moved. This is to accommodate the fact that the last chip W acquired by the chip acquisition means 27 and the next chip W to be acquired are often not adjacent, and to detect the position of the next chip W to be acquired when one of the supply-side sheets S1 and S2 located at the acquisition position Q is replaced with the other. 【0040】 The central control means 22 acquires an image captured by the storage-side imaging means 33 and, based on that image, detects in advance the location where the next chip W will be attached on the storage-side sheets T1 to T5 arranged at the attachment position P. The chip attachment means 29 attaches the chip W to the corresponding location based on the location information of the next chip W to be attached detected by the central control means 22. 【0041】 The storage-side imaging means 33 may have an imaging range that can image any location within the attachable area of ​​the chip W on the storage-side sheets T1 to T5 arranged at the attachment position P, for example, by imaging the entire attachable area of ​​the chip W on the storage-side sheets T1 to T5 arranged at the attachment position P, or it may be designed so that the imaging range can be moved. Accurately positioning the chip W on the storage-side sheets T1 to T5 in this way is preferable from the viewpoint of preventing adjacent chips W from touching or being separated by more than an acceptable distance. 【0042】 The central control means 22 detects, in addition to the rank information and position information of each chip W attached to the supply sheets S1, S2, etc., stored in the storage means 25, the current position of the supply sheets S1, S2 fixed to the supply rotating body 12, the order of the chips W acquired by the transport unit 11 from the supply sheets S1, S2, the progress of attaching the chips W to each of the storage sheets T1 to T5 (to what extent the chips W have been attached to each of the storage sheets T1 to T5), and the current position of the storage sheets T1 to T5 fixed to the storage rotating body 14. 【0043】 Based on this information, the central control means 22 transmits command signals to the supply-side fixing means 13, the storage-side fixing means 15, the supply-side control means 19, the storage-side control means 21, the supply-side switching mechanism 23, the storage-side switching mechanism 24, the chip acquisition means 27, the chip transfer means 28, the chip sticking means 29, and the pushing means 30, and performs the replacement process of the chip W through the following steps. 【0044】 <Step 01> As shown in FIG. 4, the supply-side sheets S1 and S2 to which the chip W is attached are arranged on the supply-side rotating body 12 by the supply-side switching mechanism 23 (at this time, the supply-side rotating body 12 rotates as appropriate), and are fixed to the supply-side rotating body 12 by the supply-side fixing means 13. At the same time, the storage-side sheets T1 to T5 to which the chip W is not attached are arranged on the storage-side rotating body 14 by the storage-side switching mechanism 24 (at this time, the storage-side rotating body 14 rotates as appropriate), and are fixed to the storage-side rotating body 14 by the storage-side fixing means 15. 【0045】 <Step 02> The supply-side rotating body 12 rotates to place the supply-side sheet S1 (which may be the supply-side sheet S2) at the acquisition position Q, and the storage-side rotating body 14 rotates to place the storage-side sheet T1 (which may be the storage-side sheet T2) at the sticking position P. 【0046】 <Step 03> The transport unit 11 acquires the chip W of rank A attached to the supply-side sheet S1 arranged at the acquisition position Q. 【0047】 <Step 04> After one chip W of rank A is acquired from the supply-side sheet S1, it is determined whether there is still a chip W of rank A left on the supply-side sheet S1. In this embodiment, the central control means 22 and the supply-side control means 19 have previously detected the timing when all the chips W of rank A are removed from the supply-side sheet S1. 【0048】<Step 05> When it is determined in Step 04 that no chip W of Rank A remains on the supply-side sheet S1 (when all the chips W of Rank A pasted on the supply-side sheet S1 have been removed), the conveyance unit 11 acquires a chip W of Rank B from the supply-side sheet S1 arranged at the acquisition position Q. 【0049】 Then, after the pasting of the chip W of Rank A, which the conveyance unit 11 acquired immediately before a chip W of Rank B, onto the storage-side sheet T1 is completed, the storage-side control means 21 controls the storage-side drive means 20 to rotate the storage-side rotating body 14, moves the storage-side sheet T1 from the pasting position P to another position, and arranges a storage-side sheet T2 (that is, a storage-side sheet different from the storage-side sheet T1) at the pasting position P. Thereafter, the chip W of Rank B is pasted onto the storage-side sheet T2. <Step 06> When it is determined in Step 04 that a chip W of Rank A remains on the supply-side sheet S1, it is determined whether or not there remains an empty area on the storage-side sheet T1 for pasting all the chips W of Rank A that the conveyance unit 11 is sucking. In the present embodiment, the central control means 22, the supply-side control means 19, and the storage-side control means 21 have detected in advance the timing when the empty area on the storage-side sheet T1 disappears. And when it is determined that an empty area remains on the storage-side sheet T1, the process returns to Step 03, and the conveyance unit 11 newly acquires a chip W of Rank A from the supply-side sheet S1. 【0050】 <Step 07> On the other hand, when it is determined in Step 06 that no corresponding empty area remains on the storage-side sheet T1, the conveyance unit 11 acquires a chip W of Rank E (a rank different from Rank A) from the supply-side sheet S1. 【0051】Then, after all of the rank A chips W that the transport unit 11 has picked up have been attached to the storage-side sheet T1, the storage-side control means 21 controls the storage-side drive means 20 to rotate the storage-side rotating body 14, moving the storage-side sheet T1 from the attachment position P to the storage-side replacement position M, and placing the storage-side sheet T5 at the attachment position P. After that, the storage-side replacement mechanism 24 retrieves the storage-side sheet T1 that has been placed at the storage-side replacement position M and released from its fixed position, and places another storage-side sheet that does not have chips W attached to it at the storage-side replacement position M (a predetermined part of the storage-side rotating body 14). 【0052】 When replacing this storage sheet T1 with another storage sheet, the rank E chip W that was attached to the supply sheet S1 is attached to the storage sheet T5 located at the attachment position P. Therefore, in this embodiment, it is possible to attach chips W to other storage sheets while the storage sheet replacement process is underway. 【0053】 The same procedure is followed until all chips W of ranks A to E are removed from the supply sheet S1. Chips W of ranks A, B, C, D, and E are removed sequentially from the supply sheet S1 and attached to the storage sheets T1 to T5, respectively. After all chips W of ranks A to E have been removed from the supply sheet S1, the supply rotating body 12 rotates to position the supply sheet S2 at the acquisition position Q and the supply sheet S1 at the supply exchange position L, and the transfer of chips W from the supply sheet S2 to the storage sheets T1 to T5 begins. Meanwhile, the supply sheet S1 positioned at the supply exchange position L is replaced by the supply exchange mechanism 23 with another supply sheet to which chips W have been attached. 【0054】Accordingly, in this embodiment, the storage-side control means 21 controls the storage-side drive means 20 based on the rank information of the chips W obtained from the supply-side sheets S1 and S2, to position one of the multiple storage-side sheets T1 to T5 fixed to the storage-side rotating body 14 (the optimal one) at the attachment position P. Here, the process of positioning the supply-side sheet S2 at the acquisition position Q where the supply-side sheet S1 was positioned can be performed solely by the rotation of the supply-side rotating body 12, and the process of positioning the storage-side sheets T2 to T5 at the attachment position P where the storage-side sheet T1 was positioned can be performed solely by the rotation of the storage-side rotating body 14, thus reducing the time required for these processes. 【0055】 In the chip processing apparatus 10 described so far, the supply-side sheets S1 and S2 are fixed to the supply-side rotating body 12 in a horizontal position, that is, perpendicular to the rotation axis 16 of the supply-side rotating body 12, and the storage-side sheets T1 to T5 are fixed to the storage-side rotating body 14 in a horizontal position, that is, perpendicular to the rotation axis 17 of the storage-side rotating body 14, but the apparatus is not limited to this configuration. 【0056】 For example, as shown in Figure 5, the chip processing apparatus 50 according to the second embodiment of the present invention, the supply-side sheets S11 and S12 may be attached to ring-shaped members J11 and J12 respectively and fixed to the supply-side rotating body 51 in a state parallel to the rotation axis of the supply-side rotating body 51. In this embodiment, as shown in Figure 5, the storage-side sheets T11 and T12 are also attached to ring-shaped members K11 and K12 respectively and fixed to the storage-side rotating body 52 in a state parallel to the rotation axis of the storage-side rotating body 52. 【0057】 The transport unit 53 of the chip processing device 50 comprises a rotating body 55 that rotates around a rotation axis 54 parallel to the rotation axes of the supply-side rotating body 51 and the storage-side rotating body 52, and a plurality of suction parts (an example of a chip support part) 56 each capable of adsorbing (supporting) chips W. The plurality of suction parts 56 are arranged around the rotating body 55 so as to surround it, and move in accordance with the intermittent rotation of the rotating body 55. Each suction part 56 is provided so as to be able to move back and forth in a direction perpendicular to the rotation axis 54 relative to the rotating body 55. 【0058】Multiple suction units 56 are positioned such that one suction unit 56 is positioned opposite the supply-side sheet S11 located at the acquisition position Q1, and moves forward in a direction perpendicular to the supply-side sheet S11 to directly acquire the chip W from the supply-side sheet S11. Another suction unit 56 is positioned opposite the storage-side sheet T11 located at the attachment position P1, and moves forward together with the attached chip W in a direction perpendicular to the storage-side sheet T11 to directly attach the chip W to the storage-side sheet T11. 【0059】 The supply-side sheets S11 and S12, while attached to the ring-shaped members J11 and J12 respectively, are removed from the supply-side rotating body 51 by the supply-side replacement mechanism at the supply-side replacement position L1 and replaced with new supply-side sheets attached to the ring-shaped members. The storage-side sheets T11 and T12, while attached to the ring-shaped members K11 and K12 respectively, are removed from the storage-side rotating body 52 by the storage-side replacement mechanism at the storage-side replacement position M1 and replaced with new storage-side sheets attached to the ring-shaped members. 【0060】 It goes without saying that three or more supply-side sheets may be fixed to the supply-side rotating body 51, and three or more storage-side sheets may be fixed to the storage-side rotating body 52. ​​Also, there may be two or more supply-side rotating bodies and storage-side rotating bodies each provided around the transport unit 53 (the same applies to the chip processing device 10). 【0061】 Furthermore, in the chip processing device 10 (and similarly in the chip processing device 50), the rotation axis 16 of the supply-side rotating body 12 and the rotation axis 17 of the storage-side rotating body 14 are both aligned vertically, but this is not limited to this configuration. For example, as shown in Figures 6 and 7 of the chip processing device 60 according to the third embodiment of the present invention, the rotation axis 62 of the supply-side rotating body 61 and the rotation axis 64 of the storage-side rotating body 63 may both be arranged horizontally. 【0062】As shown in Figures 6 and 7, the transport unit 65 of the chip processing device 60 has multiple suction parts 67 attached at intervals to the outer circumference of a disc-shaped rotating body 66 that rotates around a vertically positioned rotation axis, allowing it to move back and forth. Multiple supply-side sheets S21 and S22 are fixed to the supply-side rotating body 61, attached to ring-shaped members J21 and J22 respectively (more than three supply-side sheets may be fixed). Multiple storage-side sheets T21 and T22 are fixed to the storage-side rotating body 63, attached to ring-shaped members K21 and K22 respectively (more than three storage-side sheets may be fixed). 【0063】 In this embodiment, as shown in Figure 7, the acquisition position Q2 where the transport unit 65 acquires chips W from the supply-side sheets S21 and S22 is located above the supply-side exchange position L2, and the attachment position P2 where the transport unit 65 attaches chips W to the storage-side sheets T21 and T22 is located above the storage-side exchange position M2. 【0064】 The supply-side sheet S21, which was located at the acquisition position Q2, and the supply-side sheet S22, which was located at the supply-side replacement position L2, are positioned at the supply-side replacement position L2 and acquisition position Q2, respectively, by the rotation of the supply-side rotating body 61. The storage-side sheet T21, which was located at the attachment position P2, and the storage-side sheet T22, which was located at the storage-side replacement position M2, are positioned at the storage-side replacement position M2 and attachment position P2, respectively, by the rotation of the storage-side rotating body 63. 【0065】 Although embodiments of the present invention have been described above, the present invention is not limited to the above-described forms, and any changes to conditions that do not depart from the gist of the invention are all within the scope of application of the present invention. For example, the invention may include a supply-side rotating body to which only one supply-side sheet is fixed, and a storage-side rotating body to which multiple storage-side sheets are fixed, or it may include a supply-side rotating body to which multiple supply-side sheets are fixed, and a storage-side rotating body to which only one storage-side sheet is fixed. 【0066】Different ranks of chips may be attached to a single storage-side sheet. Furthermore, the number of push-up means is not limited to one. For example, if multiple supply-side sheets are fixed to the supply-side rotating body, the same number of push-up means as the number of supply-side sheets fixed to the supply-side rotating body may be provided, and a different push-up means may be assigned to each supply-side sheet. In addition, it is not necessary to provide either the supply-side replacement mechanism or the storage-side replacement mechanism, or both. If such a mechanism is not provided, for example, a person will replace the supply-side sheets or storage-side sheets. Multiple supply-side replacement positions or multiple storage-side replacement positions can be provided. 【0067】 The fixing of the storage-side sheet by the storage-side fixing means may be designed to be temporarily released before the storage-side sheet, which was positioned at the attachment point, moves to the storage-side replacement point by the rotation of the storage-side rotating body (for example, a design can be adopted in which the storage-side rotating body is temporarily paused midway, and the fixing of the storage-side sheet is released during that pause). The same applies to the fixing of the supply-side sheet by the supply-side fixing means. 【0068】 The number, arrangement, and shape of each component of the chip processing device do not need to be the same as in the above embodiment. For example, the supply-side rotating body and the storage-side rotating body do not need to be approximately circular. Also, the rotation axes of the supply-side rotating body and the storage-side rotating body do not need to be actual components, but may be conceptual rotation axes. The rotation axis of the rotating body of the transport unit does not need to be vertically arranged, and may be horizontally arranged, for example. 【0069】10: Chip processing device, 11: Transport unit, 12: Supply side rotating body, 13: Supply side fixing means, 14: Storage side rotating body, 15: Storage side fixing means, 16, 17: Rotating shaft, 18: Supply side driving means, 19: Supply side control means, 20: Storage side driving means, 21: Storage side control means, 22: Central control means, 23: Supply side exchange mechanism, 24: Storage side exchange mechanism, 25: Memory means, 27: Chip acquisition means, 28: Chip moving means, 29: Chip attachment means, 30: Push-up means, 31: Rotating body, 32: Supply side imaging means, 33: Storage side imaging means, 50: Chip processing device, 51: Supply side rotating body, 52: Storage side rotating body, 53: Transport unit, 54: Rotating shaft, 55: Rotating body, 56: Suction part, 60: Chip processing device, 61: Supply side rotating body, 62: Rotating shaft, 63: Storage side rotating body, 64: Rotating shaft, 65: Conveying unit, 66: Rotating body, 67: Suction part, J1, J2, J11, J12, J21, J22: Ring-shaped member, K1-K5, K11, K12, K21, K22: Ring-shaped member, L, L1, L2: Supply side replacement position, M, M1, M2: Storage side replacement position, P, P1, P2: Attachment position, Q, Q1, Q2: Acquisition position, S1, S2, S11, S12, S21, S22: Supply side sheet, T1-T5, T11, T12, T21, T22: Storage side sheet, W: Chip

Claims

1. A chip processing apparatus having a transport unit that moves chips obtained from a supply-side sheet on which multiple chips are attached and attaches them to a storage-side sheet positioned at an attachment location, the chip processing apparatus comprising: a storage-side rotating body on which multiple storage-side sheets are fixed and which positions one of the multiple storage-side sheets at the attachment location; and a storage-side driving means that rotates the storage-side rotating body to move the storage-side sheet that was positioned at the attachment location to another position and position the other storage-side sheet at the attachment location.

2. The chip processing apparatus according to claim 1, further comprising storage-side fixing means for fixing the plurality of storage-side sheets to the storage-side rotating body, wherein the storage-side fixing means continues to fix the plurality of storage-side sheets to the storage-side rotating body until the storage-side sheet, which was positioned at the attachment position, moves to a storage-side replacement position at a distance from the attachment position by the rotation of the storage-side rotating body, and releases the storage-side sheet when it is positioned at the storage-side replacement position.

3. The chip processing apparatus according to claim 1, further comprising a storage side replacement mechanism for replacing the storage side sheet, which has been released from its fixation to the storage side rotating body at a storage side replacement position having distance from the aforementioned attachment position, with another storage side sheet.

4. The chip processing apparatus according to any one of claims 1 to 3, further comprising: a storage means for storing rank information of each chip attached to the supply-side sheet; and a storage-side control means for controlling the storage-side drive means based on the rank information of the chips acquired by the transport unit from the supply-side sheet, to position one of the plurality of storage-side sheets fixed to the storage-side rotating body at the attachment position.

5. A chip processing apparatus having a transport unit for moving chips acquired from a supply-side sheet, which is positioned at an acquisition position with multiple chips attached to it, and attaching them to a storage-side sheet, wherein the chip processing apparatus comprises a supply-side rotating body on which multiple supply-side sheets are fixed, and which positions one of the multiple supply-side sheets at the acquisition position, and a supply-side driving means for rotating the supply-side rotating body to move the supply-side sheet that was positioned at the acquisition position to another position, and positioning the other supply-side sheet at the acquisition position.

6. The chip processing apparatus according to claim 5, further comprising supply-side fixing means for fixing the plurality of supply-side sheets to the supply-side rotating body, wherein the supply-side fixing means continues to fix the plurality of supply-side sheets to the supply-side rotating body until the supply-side sheet, which was positioned at the acquisition position, moves to a supply-side replacement position at a distance from the acquisition position by the rotation of the supply-side rotating body, and releases the supply-side sheet when it is positioned at the supply-side replacement position.

7. The chip processing apparatus according to claim 5, further comprising a supply-side replacement mechanism for replacing the storage-side sheet, which has been released from its fixation to the supply-side rotating body at a supply-side replacement position having distance from the acquisition position, with another supply-side sheet.

Images