Base material for mounting electronic device and roll-shaped package of same
The substrate for electronic devices uses a metal foil and hygroscopic resin layer to block and absorb moisture, addressing the issues of moisture saturation and rust on electrodes, maintaining a dry environment and enhancing device longevity.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOYO SEIKAN GRP HLDG LTD
- Filing Date
- 2025-12-03
- Publication Date
- 2026-06-18
AI Technical Summary
Existing moisture-absorbing sheets and sealing materials for electronic devices fail to maintain a dry environment within the devices due to saturation of desiccants and moisture release, leading to rust on metal electrodes and reduced conductivity.
A substrate for mounting electronic devices comprising a metal foil with a protective resin layer, a hygroscopic resin layer, and an electrode foil, where the hygroscopic resin layer chemically captures moisture and the metal foil blocks most moisture penetration, preventing rust on patterned electrode surfaces.
The substrate effectively maintains a dry environment within electronic devices by absorbing trace moisture and preventing rust on electrode foils, ensuring long-term device performance and reliability.
Smart Images

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