Radioisotope apparatuses for thermal applications

Abstract

Broadly speaking, the present invention relates to a radioisotope apparatus for a thermal application, wherein the apparatus comprises a Radioisotope Heating Unit (RHU) component and a mounting component. The RHU component is configured to be securely integrated into the mounting component. Consequently, the apparatus is designed for safe and shielded installation on payloads.

Description

Radioisotope apparatuses for thermal applicationsTechnical Field

[0001] The present invention relates to heat-emitting apparatuses, and in particular to radioisotope apparatuses for thermal applications.Background of Invention

[0002] Radiation-based power systems are widely used in both space and terrestrial applications for energy production and experimental measurements. These systems can generate heat directly (e.g. as Radioisotope Heating Units (RHUs)) or convert heat into electricity. Disadvantageously, due to their high radioactivity levels, often ranging from hundreds of GBq to TBq, these devices necessitate rigorous public safety measures.

[0003] While the physical process of using radioisotopes for heat production is well understood, engineering these materials into products that can be safely and effectively integrated into space hardware or terrestrial applications is complex. This process requires ensuring the successful containment of the isotopes throughout all operational phases, allowing for safe use and integration, and meeting competitive cost, regulatory standards and mass requirements.

[0004] The present applicant has recognized the above-mentioned or related shortcomings and the need to provide an improved radioisotope apparatus for thermal applications.

[0005] The above discussion of the background to the disclosure is intended to facilitate an understanding of the disclosure. However, it is to be appreciated that the discussion is not an acknowledgement or admission that any aspect of the discussion was part of the common general knowledge of a skilled addressee as at the priority date of this application.Summary of Invention

[0006] In one aspect, provided herein is a radioisotope apparatus for a thermal application comprising: a radioisotope heating unit (RHU) component configured to generate heat; a mounting component configured to house the RHU component; wherein the RHU component comprises a first integration member; wherein the mounting component comprises a second integration member; and wherein the first integration member is configured to mate with the second integration memberto provide a releasable integration of the RHU component within the mounting component.

[0007] In one or more examples, the first integration member comprises a stepped profile; the second integration member comprises at least one tab; and the first integration member and the second integration member form a bayonet locking mechanism.

[0008] In one or more examples, the first integration member comprises at least one locking pocket; the second integration member comprises at least one spring, at least one locking ball and at least one locking sleeve; and the first integration member and the second integration member form a locking-ball mechanism.

[0009] In one or more examples, at least one locking sleeve comprises at least one groove; wherein at least one groove matches the shape of the at least one locking pocket.

[0010] In one or more examples, the mounting component comprises a mounting interface; and wherein the mounting interface is attachable to a payload.

[0011] In one or more examples, the mounting interface is made of a low-conductivity material.

[0012] In one or more examples, an external surface of the mounting component is covered by a low-emissivity coating.

[0013] In one or more examples, the RHU component comprises a radiation source. In some examples, the radiation source is a low-activity radiation material.

[0014] In an example, the low-activity radiation material comprises a low A2 beta-emitting material. In another example, the low-activity radiation material comprises an alpha-emitting material. This could include isotopes such as Americium-241 or Polonium-210. In another example, the low-activity radiation material comprises a gamma-emitting material. Examples could include isotopes like Cobalt-60 or Cesium-137.

[0015] In one or more examples, the RHU component comprises a first shell; wherein the first shell is configured to absorb radiation from the radiation source and convert the absorbed radiation into heat. In an example, the the first shell is configured to absorb beta radiation and convert the absorbed beta radiation into heat.

[0016] In one or more examples, the first shell is made of a low Z material.

[0017] In one or more examples, the RHU component comprises a radiation shielding material.

[0018] In one or more examples, the RHU component comprises a second shell; wherein the second shell is configured to be handled by an operative.

[0019] In one or more examples, the second shell is made of titanium.

[0020] In one or more examples, the weight of the apparatus is less than 180g.

[0021] In one or more examples, the apparatus further comprises a heat transfer interface.

[0022] In one or more examples, the heat transfer interface comprises at least one heat bridge.

[0023] In one or more examples, the apparatus is configured to be used in space.Brief Description of Drawings

[0024] Various embodiments / examples will now be described in greater detail with reference to the accompanying drawings in which like features are represented by like numerals. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles. It is to be understood that the embodiments / examples shown are examples only and are not to be taken as limiting the scope as defined in the claims appended hereto. Various embodiments / examples and modifications thereof will become apparent to those skilled in the art from the detailed description herein by reference to the figures. In the following description, various embodiments are described with reference to the following drawings, in which:

[0025] Figure 1 depicts an exploded perspective view of a radioisotope apparatus of the present techniques;

[0026] Figure 2 depicts a perspective view of the radioisotope apparatus with a cross-sectional view of the RHU component, wherein the RHU component is secured in the mounting component, and the mounting component is depicted transparently;

[0027] Figure 3 depicts a perspective view of the RHU component being inserted into or removed from the mounting component, wherein the mounting component is attached to a wall of a payload;

[0028] Figure 4 depicts a side view of the RHU component being inserted into or removed from the mounting component, wherein the mounting component is attached to a wall of a payload;

[0029] Figure 5 depicts Figure 1 with additional details A and B focusing on the bayonet locking mechanism;

[0030] Figure 6 depicts a perspective view of the radioisotope apparatus, wherein the RHU component is secured within the mounting component, and the mounting component is depicted transparently to highlight the detail C of the bayonet locking mechanism;

[0031] Figure 7 depicts a side cross-sectional view of the radioisotope apparatus, wherein the RHU component is secured within the mounting component with detail D highlighting the bayonet locking mechanism;

[0032] Figure 8 depicts a perspective view of the radioisotope apparatus with a cross-sectional view of the RHU component, wherein the RHU component is secured in the mounting component via a locking-ball mechanism, and the mounting component is depicted transparently;

[0033] Figure 9 depicts a side cross-sectional view of the radioisotope apparatus, wherein the RHU component is secured within the mounting component, with details E and F highlighting the locking-ball mechanism; and

[0034] Figure 10 depicts a perspective view of the radioisotope apparatus, wherein the RHU component is secured within the mounting component, and the radioisotope apparatus comprises two thermal straps.Detailed Description

[0035] Broadly speaking, the present techniques relate to a radioisotope apparatus for a thermal application, wherein the apparatus comprises a Radioisotope Heating Unit (RHU) component and a mounting component. The RHU component is configured to be securely and releasably integrated into the mounting component. Consequently, the apparatus is designed for safe and shielded installation on payloads. The apparatus may further comprise a heat transfer interface to maximize the utility of the generated heat.

[0036] The features which are the same or substantially similar retain the same reference numbers in the Figures and throughout the description. Therefore, a repeated description of such features is omitted.

[0037] All examples of the present techniques may be combined together, unless it is explicitly stated otherwise.

[0038] Figure 1 depicts an exploded perspective view of a radioisotope apparatus 1 of the present techniques. Figure 2 depicts a perspective view of the radioisotope apparatus 1 with a cross-sectional view of the RHU component 10, wherein the RHU component 10 is secured in the mounting component 20, and the mounting component 20 is depicted transparently. Figure 3 depicts a perspective view of the RHU component 10 being inserted into or removed from the mounting component 20, wherein the mounting component 20 is attached to a wall of a payload 90. Figure 4 depicts a side view of the RHU component 10 being inserted into or removed from the mounting component 20, wherein the mounting component 20 is attached to a wall of a payload 90. Figure 5 depicts Figure 1 with additional details A and B focusing on the bayonet locking mechanism. Figure 6 depicts a perspective view of the radioisotope apparatus 1 , wherein the RHU component 10 is secured within the mounting component 20, and the mounting component 20 is depicted transparently to highlight the detail C of the bayonet locking mechanism. Figure 7 depicts a side cross-sectional view of the radioisotope apparatus 1 , wherein the RHU component 10 is secured within the mounting component 20 with detail D highlighting the bayonet locking mechanism.

[0039] Radioisotope apparatus 1 comprises a Radioisotope Heating Unit (RHU) component 10 and the mounting component 20. The apparatus 1 may be used to generate heat for at least one thermal application. The apparatus 1 is the assembly of the RHU component 10 and the mounting component 20.

[0040] The RHU component 10 is configured to be releasably integrated with the mounting component 20. The RHU component 10 may be cylindrical. However, it will be appreciated that the RHU component 10 may have a different shape, based on the shape of the mounting component 20.

[0041] The RHU component 10 may comprise a radiation source 14. The radiation source 14 may emit radiation which generates heat for at least one thermal application. The radiation source 14 may be a radioisotope.

[0042] In some examples, the radiation source 14 may comprise, for example, predominantly betaemitting isotopes such as Strontium-90, Thallium-204, Thulium-170, Thulium-171 , Europium-155, Promethium-147, or alternatively isotopes such as Plutonium-238, Americium 241 , Polonium 210, Curium-244, Europium-152, Europium-154.

[0043] In some examples, the radiation source 14 may comprise a low A2 beta emitting material. The low A2 beta emitting material may be, for example, Strontium-89, Yttrium-90, Thallium-204 Thulium- 170, Thulium-171 , Europium-155. Therefore, advantageously, the use of highly regulated sources, such as Plutonium-238, may be avoided which increases the overall safety of the apparatus 1 and the safety of the personnel while handling apparatus 1. Moreover, advantageously, when the radiation source 14 comprises a low A2 beta emitting material, the licensing process is streamlined (e.g. NSPM-20) which enhances the suitability of the apparatus 1 for commercial space missions.

[0044] The RHU component 10 may comprise a first shell 13. The first shell 13 may surround the radiation source 14. The first shell 13 may be a pellet cladding shell. The first shell 13 is configured to contain the isotope, enabling safe handling by preventing dispersion and allowing irradiation without significant neutron capture or the generation of unwanted byproducts. The first shell 13 is configured to absorb beta radiation and transform it into heat. Advantageously, the first shell 13 is configured to allow heat generated by the radiation source 14 to pass through efficiently.

[0045] The first shell 13 may be made of a low Z material. The low Z material efficiently stops beta radiation while creating heat, while creating the least amount of x-rays in the process through bremsstrahlung. The first shell 13 may be made of aluminium. In some examples, the first shell 13 may be made of titanium, silicon, lithium borate, or any other similar suitable material.

[0046] The RHU component 10 may comprise a radiation shielding material 12. The radiation shielding material 12 may surround the first shell 13. The radiation shielding material 12 may surround the radiation source 14. Advantageously, the radiation shielding material 12 is configured to reduce the passage of harmful ionizing radiation, such as X-rays and gamma rays, emitted by the radiation source 14.

[0047] The radiation shielding material 12 may be made of a high Z material. Beneficially, high Z material attenuates photon emissions (e.g. x-rays and gamma radiation), which are the main concern for the dose to operators or electronics. The radiation shielding material 12 may be made of lead, gold, tungsten or any other similar material.

[0048] The RHU component 10 may comprise a second shell 11 . The second shell 11 is configured to seal the internal components of the RHU component 10. The second shell 11 comprises the firstintegration component 15. The second shell 11 may be manually handled by an operative. The second shell 11 may be manually handled by an operative and / or a robot.

[0049] The second shell 11 may be made of strong and machinable material. In some examples, the second shell 11 may be made of steel and / or stainless steel and / or titanium. Titanium may be particularly beneficial in an instance that the apparatus 1 is used in space applications due to its lower weight, non-magnetism and non-galling properties.

[0050] The radioisotope apparatus 1 comprises a mounting component 20. The mounting component 20 is configured to be attachable to a payload. The mounting component 20 may be attached to a wall 90 of a payload. The mounting component 20 is configured to receive the RHU component 10. The mounting component 20 is configured to releasably house the RHU component 10. The mounting component 20 is configured to transfer the heat generated by the RHU component 10 to at least one heat application. The mounting component 20 may be made of a light machinable material. The mounting component 20 may be made of a thermally conductive material.

[0051] The mounting component 20 may comprise a mounting interface 23. The mounting interface 23 is configured to attach the mounting component 20 to a payload. The mounting interface 23 may be configured to attach the mounting component 20 to a wall 90 of a payload. The mounting interface 23 may be attached to a structure. The mounting interface 23 may be made of at least one low-conductivity material.

[0052] The mounting interface 23 may be a flange. In some examples, fasteners may be used to attach the mounting interface 23 to a payload or any other similar structure. The fasteners may be bolts and / or rivets. The fasteners may be made of at least one low-conductivity material. The fasteners and the mounting interface 23 may be separated by at least one intermediate component. The intermediate component may be a washer and / or standoffs and / or plugs. The intermediate component may be made of at least one low-conductivity material. It will be appreciated that by using low-conductivity materials for the mounting interface 23, the heat generated by the RHU component 10 may be conveyed to a useful thermal application more easily and less heat is dissipated to the surrounding structure.

[0053] The mounting interface 23 may be made of materials that are strong and have a low thermal conductivity. In some examples, the mounting interface 23 may be made of high-performance plastics. High-performance plastics may be used in space applications as long as their outgassing properties are compatible with space environment requirements. The mounting interface 23 may be made of PEEK and / or Ultem and / or hard polystyrene, etc. The mounting interface 23 may be made of ceramic-based materials if their mechanical properties support fastening.

[0054] The mounting component 20 may comprise a housing 24. The housing 24 is configured to house the RHU component 10 within the mounting component 20. The housing 24 may be a cylindrical compartment. It will be appreciated that the housing 24 may have different shapes to allow housing of the RHU component 10.

[0055] The external surface of housing 24 may be covered by a low emissivity coating. In some examples, the external surface of the mounting component 20 may be covered by a low-emissivity coating. In some examples, the external surface of housing 24 / mounting component 20 may be covered by a first coating and a second coating. The first coating may be a highly reflective material with low emissivity (e.g. polished silver, gold, aluminium). The second coating may be an optically neutral material to protect the first coating (e.g. ITO, SiO). Thus, advantageously, the second coating protects the first coating from oxidation and tarnish.

[0056] The housing 24 may be made of a light machinable material. The housing 24 may be made of a thermally conductive material. The housing 24 may be made of a material which supports secure attachment of the RHU component 10 in the housing 24, while not significantly contributing to payload weight. The housing 24 may be made of aluminium.

[0057] The mounting component 20 comprises an opening 25 through which the RHU component 10 can be inserted into the housing 24. The RHU component 10 may be removed from the housing 24 through the same opening 25. The size of the opening 25 may be based on the size of the RHU component 10.

[0058] The RHU component 10 comprises a first integration member 15 and the mounting component 20 comprises a second integration member 28.

[0059] The first integration member 15 may be positioned on the second shell 11. The first integration member 15 is configured to mate with the second integration member 28 of the mounting component 20 to provide a secure, releasable connection of the RHU component 10 within the mounting component 20.

[0060] The second integration member 28 may be positioned on the inside of the housing 24. The second integration member 28 is configured to mate with the first integration member 15 of the RHU component 10 to securely, releasably house the RHU component 10 within the mounting component 20.

[0061] In one or more examples, the first integration member 15 and the second integration member 28 may form a bayonet locking mechanism.

[0062] As shown in Detail A of Figure 5, the first integration member may comprise a stepped profile / groove 16. As shown in Detail B of Figure 5, the second integration member 28 may comprise at least one tab. In some examples, the stepped profile 16 is continuous. The continuous stepped profile provides incremental, reversible, deformation of the material as the RHU component 10 is turned, creating a positively loaded connection. In some examples, the second integration member may comprise the stepped profile and the first integration member may comprise the corresponding mating tab / s.

[0063] The tab of the second integration member 28 may be configured to intake the stepped profile 16 of the RHU component 10. Thus, advantageously, the first integration member 15 and thesecond integration member 28 may be locked in together via a bayonet locking mechanism. The bayonet locking mechanism securely and releasably houses the RHU component 10 within the mounting component 20. Advantageously, the removal and insertion of the RHU component 10 may be easy, fast and repeatable.

[0064] The stepped profile 16 is configured to provide incremental interference with the mating tab in the mounting component 20 to create a positively loaded connection between the integration member 15 and the mounting component 20. Advantageously, this helps to keep the RHU component 10 and the mounting component 20 tightly secured and prevents accidental disengagement under normal usage or vibration.

[0065] The bayonet locking mechanism is a twist-locking mechanism. As shown in detail C of Figure 6, to establish the bayonet locking mechanism between the RHU component 10 and the mounting component 20, the first integration member 15 is aligned with the second integration member 28 (e.g. the stepped profile 16 may be aligned with the tab / s of the second integration member 28). Then, the first integration member 15 and the second integration member 28 are inserted together. The first integration member 15 is then twisted or rotated within the second integration member 28. This motion causes the first integration member 15 to slide into a locked position thus holding the RHU component 10 and the mounting component 20 securely in place. To remove the RHU component 10 from the mounting component 20, reverse the twisting motion to disengage the first integration member 15 from the second integration member 28.

[0066] In one or more examples, the first integration member 15 and the second integration member 28 may form a locking-ball mechanism.

[0067] Figure 8 depicts a perspective view of the radioisotope apparatus 1 with a cross-sectional view of the RHU component 10, wherein the RHU component 10 is secured in the mounting component 20 via a locking-ball mechanism, and the mounting component 20 is depicted transparently. Figure 9 depicts a side cross-sectional view of the radioisotope apparatus 1 , wherein the RHU component 10 is secured within the mounting component 20, with details E and F highlighting the locking-ball mechanism.

[0068] In some examples, a locking-ball mechanism is used to releasably secure the RHU component 10 within the housing component 20 instead of the bayonet locking mechanism. In other words, the first integration member 15 and the second integration member 28 may form a locking-ball mechanism. The skilled person will appreciate that the components of apparatus 1 are substantially similar. The difference is that the locking-ball mechanism is used instead of the bayonet locking mechanism.

[0069] To implement the locking-ball mechanism between the RHU component 10 and the mounting component 20, the second integration member 28 comprises a spring 31 , a locking sleeve 33 and a locking ball 32 and the first integration member 15 comprises a locking pocket 17. In some examples, the second integration member 28 comprises at least one spring 31 , at least one lockingsleeve 33 and at least one locking ball 32 and the first integration member 15 comprises at least one locking pocket 17.

[0070] The locking ball 32 may be shaped as a sphere. The locking ball 32 may be rigid enough to keep the RHU component 10 secured within the mounting component 20.

[0071] The spring 31 may be used to apply pressure to the locking sleeve 33 in the closed position so that the plain profile of the locking sleeve 33 prevents the locking ball 32 from moving out of the locking pocket 17. The locking ball 32 applies enough pressure to the RHU component 10 to remain within mounting component 20. Thus, a positively loaded connection between the RHU component 10 and the mounting component 20 is achieved.

[0072] The second integration member 28 may comprise at least one locking sleeve 33. The locking sleeve 33 may be configured to accommodate the spring 31. The locking sleeve 33 may comprise at least one groove 35. The groove 35 matches the shape of the locking pocket 17. The locking sleeve 33 may comprise a plain profile.

[0073] The locking pocket 17 is configured to accommodate the locking ball 32. The locking pocket 17 is configured to accommodate the locking ball 32 so that the RHU component 10 is securely housed within the mounting component 20. The locking pocket 17 may be slanted. The first integration feature 15 may comprise at least one locking pocket 17.

[0074] When the RHU component 10 is releasably integrated into the mounting component 20, the locking ball 32 of the mounting component 20 enters the locking pocket 17 of the RHU component 10. The locking sleeve 33 covers the locking ball 32 with a plain profile in the closed position (Detail E of Figure 9) and is forced into the closed position by the spring 31. The locking sleeve 33, forward to the locking ball 32 position, is a groove 35, matching in shape that of the locking pocket 17, which can accommodate the locking ball 32 when the locking sleeve 33 and the spring 31 are pressed back into the open position (Detail F of Figure 9). This leaves the locking ball 32 free to move between locking pocket 17 and the equivalent pocket / groove 35 in the locking sleeve 33. Pulling the RHU component 10 out (for disconnection / disassembly) forces the locking ball 32 into the groove 35 in the locking sleeve 33, due to the slanted / drafted profile of the locking pocket 17.

[0075] Advantageously, by using the locking-ball mechanism, the RHU component 10 may be securely and releasably housed within the mounting component 20 without using any torque / torsional forces.

[0076] Advantageously, by using the bayonet locking mechanism or locking-ball mechanism, the integration of the RHU component 10 within the mounting component 20 is achieved quickly and reliably.

[0077] Advantageously, by using the bayonet locking mechanism or the locking-ball mechanism, the integration of the RHU component 10 within the mounting component 20 may be achieved reversibly and repeatedly.

[0078] Advantageously, by using the bayonet locking mechanism or the locking-ball mechanism, a positively loaded connection between the RHU component 10 and the mounting component 20 may be achieved. In other words, the releasable integration of the RHU component 10 within the mounting component 20 is a positively loaded connection.

[0079] The RHU component 10 may have a diameter of 24 mm and a length of 28 mm. The RHU component 10 may weigh approximately 135g. The housing 24 of the mounting component 20 may have a diameter of 26mm. The mounting interface 23 may have a diameter of 46 mm. The mounting component 20 may weigh about 45 g. Therefore, advantageously, the weight of the apparatus 1 may be less than 180 grams. Minimizing the weight of the apparatus is advantageous, particularly in space applications, where every gram matters due to the significant costs involved.

[0080] In some examples, the RHU component 10 may have a diameter of more or less than 24 mm and a length of more or less than 28 mm. The RHU component 10 may weigh more or less than 135g. In some examples, the RHU component may weigh between 135g to 400g. In some examples, the RHU component may weigh between 400g to 700g. In some examples, the RHU component may weigh more than 700g.

[0081] In some examples, the housing 24 of the mounting component 20 may have a diameter of more or less than 26mm. The mounting interface 23 may have a diameter of more or less than 46 mm. The mounting component may weigh more or less than 45 g. In some examples, the mounting component may weigh between 45g to 200g. In some examples, the mounting component may weigh between 200g to 500g. In some examples, the mounting component may weigh more than 500g.

[0082] The skilled person will appreciate that the weight and the dimensions of the apparatus may be changed (e.g. during manufacturing) based on the desired application of the apparatus 1.

[0083] The radioisotope apparatus 1 may be connectable to a heat transfer interface for improved heat transfer between the radioisotope apparatus 1 and a heating application.

[0084] In other words, the apparatus 1 may comprise a heat transfer interface. The apparatus may be connectable to a heat transfer interface. Advantageously, by incorporating the heat transfer interface to the apparatus 1 and particularly to the mounting component 20, heat transfers from the RHU component 10 to the heat transfer interface through thermal conduction, while minimising heat transfer out of the mounting component 20 / RHU component 10 through thermal radiation or conduction to the mounting interface 23 and thus to the surrounding structures. This allows the heat generated by the RHU component 10 to be harnessed more efficiently. Thus, the generated heat may be used for thermal applications more effectively providing the apparatus 1 advantageous power / heat-per-gram performance.

[0085] Figure 10 depicts a perspective view of the radioisotope apparatus 1 , wherein the RHU component is secured within the mounting component 20, and the radioisotope apparatus 1 comprises two thermal straps 50.

[0086] The apparatus 1 may comprise a heat transfer interface.

[0087] In some examples, the heat transfer interface may comprise at least one thermal strap / heat bridge 50. In some examples, the apparatus may comprise two heat straps 50. The heat strap 50 may be connected to the apparatus 1 via heat transfer interface attaching means (e.g. screws 51). Two screws 51 may be used to connect the heat strap 50 to the apparatus 1. In some examples, more than two screws 51 may be used to connect the heat strap 50 to the apparatus 1 . The heat strap 50 may be connected to housing 24 via at least one screw 51 . In some examples, any other heat transfer interface attaching means may be used. The heat strap 50 may made of a high thermal conductivity material (e.g. copper, carbon fiber). The heat strap 50 may be flexible.

[0088] The heat strap 50 may be connected to a thermal application device. One end of the heat strap 50 is connected to the apparatus 1 to harness the heat generated by the RHU component 10, and the other end of the heat strap is connected to a thermal application device which utilizes the generated heat from the RHU component 10. The thermal application device may be electronics equipment and / or temperature-sensitive equipment and / or an energy system and / or any other device that utilizes thermal energy.

[0089] The apparatus 1 may further comprise a thermal paste to improve the conductivity of the generated heat from the radiation source 14 to a thermal application.

[0090] It will be appreciated that the heat transfer interface may comprise any other similar heat transfer interface and not merely a heat bridge.

[0091] It will be appreciated that apparatuses 1 may be integrated in tandem for modular / incremental power configuration. In some examples, the size of the housing may be increased to house more than one RHU component 10.

[0092] The apparatus may be suitable for space applications. For example, one exemplary application of the apparatus may be to support the survival of equipment in the extreme cold of space. Extreme cold space may be the lunar night which lasts approximately 14 Earth days with temperatures dropping below -100°C.

[0093] For another example, the apparatus may be used for late integration into a spacecraft. This apparatus, at least due to its locking mechanism, provides a quick way of integrating the RHU component into the mounting component. This beneficially allows for the radiation source / RHU component to be stored appropriately when not in use. Then, quick and safe integration of the RHU component within the mounting component may be achieved prior to launch.

[0094] The apparatus may be used in any sector requiring safe handling and transportation of systems that generate heat or power through radioactive decay. This includes fields such as remote scientific research, emergency power supply systems, and specialized industrial processes, where reliable and efficient heat or power sources are critical. In other words, the apparatus may be configuredfor use in space applications and / or remote scientific research and / or emergency power supply systems and / or specialized industrial processes.

[0095] Reference throughout this specification to “one embodiment”, “some embodiments” or “an embodiment” or “example” means that a particular feature, structure or characteristic described in connection with the embodiment / example is included in at least one embodiment of the present disclosure. Thus, appearances of the phrases “in one embodiment”, “in some embodiments” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner, as would be apparent to one of ordinary skill in the art from this disclosure, in one or more embodiments.

[0096] As used herein, unless otherwise specified the use of the ordinal adjectives "first", "second", "third", etc., to describe a common object, merely indicates that different instances of like objects are being referred to, and are not intended to imply that the objects so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.

[0097] It should be appreciated that in the above description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, Fig., or description thereof forthe purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. This method of disclosure, however, is not to be interpreted as reflecting an intention that the claims require more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this disclosure.

[0098] Furthermore, while some embodiments described herein include some but not other features included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the disclosure, and form different embodiments, as would be understood by those skilled in the art. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0099] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the disclosure may be practiced without these specific details. In other instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

[0100] Embodiments described herein are intended to cover any adaptations or variations of the present invention. Although the present invention has been described and explained in terms of particular exemplary embodiments / examples, one skilled in the art will realize that additional embodiments can be readily envisioned that are within the scope of the present invention.

[0101] In the claims below and the description herein, any one of the terms comprising, comprised of or which comprises is an open term that means including at least the elements / features that follow, but not excluding others. Thus, the term comprising, when used in the claims, should not be interpreted as being limitative to the means or elements or steps listed thereafter. For example, the scope of the expression a device comprising A and B should not be limited to devices consisting only of elements A and B. Any one of the terms including or which includes or that includes as used herein is also an open term that also means including at least the elements / features that follow the term, but not excluding others. Thus, including is synonymous with and means comprising. In other words, where any or all of the terms "comprise", "comprises", "comprised" or "comprising" are used in this specification (including the claims) they are to be interpreted as specifying the presence of the stated features, integers, steps or components, but not precluding the presence of one or more other features, integers, steps or components.

Claims

The claims defining the invention are as follows:1 . A radioisotope apparatus for a thermal application comprising: a radioisotope heating unit (RHU) component configured to generate heat; a mounting component configured to house the RHU component; wherein the RHU component comprises a first integration member; wherein the mounting component comprises a second integration member; and wherein the first integration member is configured to mate with the second integration member to provide a releasable integration of the RHU component within the mounting component.

2. The apparatus of claim 1 , wherein the first integration member comprises a stepped profile; the second integration member comprises at least one tab; and the first integration member and the second integration member form a bayonet locking mechanism.

3. The apparatus of claim 1 , wherein the first integration member comprises at least one locking pocket; the second integration member comprises at least one spring, at least one locking ball and at least one locking sleeve; and the first integration member and the second integration member form a locking-ball mechanism.

4. The apparatus of claim 3, wherein the at least one locking sleeve comprises at least one groove; wherein the at least one groove matches the shape of the at least one locking pocket.

5. The apparatus of any one of the preceding claims, wherein the mounting component comprises a mounting interface; and wherein the mounting interface is attachable to a payload.

6. The apparatus of claim 5, wherein the mounting interface is made of a low-conductivity material.

7. The apparatus of any one of the preceding claims, wherein an external surface of the mounting component is covered by a low-emissivity coating.

8. The apparatus of any one of the preceding claims, wherein the RHU component comprises a radiation source.

9. The apparatus of claim 8, wherein the RHU component comprises a first shell; wherein the first shell is configured to absorb radiation from the radiation source and convert the absorbed radiation into heat.

10. The apparatus of claim 9, wherein the first shell is made of a low Z material.11 . The apparatus of any one of the preceding claims, wherein the RHU component comprises a radiation shielding material.

12. The apparatus of any one of the preceding claims, whereinthe RHU component comprises a second shell; wherein the second shell is configured to be handled by an operative.

13. The apparatus of claim 12, wherein the second shell is made of titanium.

14. The apparatus of any one of the preceding claims, wherein the weight of the apparatus is less than 180g.

15. The apparatus of any one of the preceding claims, further comprising a heat transfer interface.

16. The apparatus of claim 15, wherein the heat transfer interface comprises at least one heat bridge.

17. The apparatus of any one of the preceding claims, wherein the apparatus is configured to be used in space.

18. The apparatus of claim 8, wherein the radiation source is a low-activity radioactive material.

19. The apparatus of claim 18, wherein the low-activity radioactive material is a low A2 beta-emitting material.

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