Fast light / redox dual cure two part structural adhesive
A dual cure adhesive with a fluorescent dye enhances light-curing speed, ensuring rapid initial bonding and maintaining final strength through a two-part composition with (meth) acrylate components, amines, and photoinitiators, addressing the need for fast curing without compromising bonding strength.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HENKEL KGAA
- Filing Date
- 2024-12-17
- Publication Date
- 2026-06-25
AI Technical Summary
Existing adhesive compositions for bonding electronic components to substrates lack the ability to achieve fast curing speeds without compromising the final bonding strength and material properties.
A two-part, dual cure adhesive composition that utilizes a fluorescent dye to enhance light-curing speed, combining a first part with (meth) acrylate components, amines, and photoinitiators with a second part containing peroxide, allowing for initial bonding strength through light curing and final bonding strength through redox curing.
The composition achieves rapid initial bonding through light curing and maintains excellent final bonding strength through redox curing, reducing processing time while preserving material properties.
Smart Images

Figure PCTCN2024140025-APPB-I100001 
Figure PCTCN2024140025-APPB-I100002 
Figure PCTCN2024140025-APPB-I100003
Abstract
Description
[Corrected under Rule 26, 05.03.2025]FAST LIGHT / REDOX DUAL CURE TWO PART STRUCTURAL ADHESIVEBACKGROUNDField
[0001] The present invention relates to the use of a two-part, dual cure adhesive composition to join a magnet and substrate. The adhesive composition uses a fluorescent dye to enhance the light-curing speed to produce a fast-curing adhesive composition.Brief Description of Related Technology
[0002] U.S. Patent No. 6,080,450 relates to a UV-curable, polymerizable acrylate composition for use as a coating material, as an ink, or as an adhesive, which exhibits good depth of cure despite the presence of significant fluorescing agent. The patent does not contemplate increasing curing speed when using a fluorescent dye. In fact, the inventors were more concerned with being able to incorporate high levels of the fluorescing agent without detriment to the curing properties of the formulation.
[0003] U.S. Patent No. 8,382,929 describes a type of dual cure 2-component methyl methacrylate adhesive, which can be cured by light and redox reaction. Fluorescent dye is not used in the formulation. Light cure is conducted simultaneously with or subsequent to the redox cure to solidify the tacky surface instead of achieving sufficient bonding strength.
[0004] U.S. Patent No. 9,039,852 describes a method of bonding two substrates having a shadow area and a transparent area by using UV redox dual cure acrylate adhesives. Fluorescent dye was not used in the adhesive. The multifunctional acrylate oligomer was the main component which could be UV cured within seconds without fluorescent dye.SUMMARY
[0005] The present invention solves the problem of providing a two-part (meth) acrylate component adhesive composition with reduced processing time for bonding electronic components onto substrates while not impacting the original bond strength and material properties.
[0006] The overflow of the adhesive composition applied between the electronic components and the substrate can be first cured by light to form an initial bonding strength and prevent the part from moving (fixture strength) . The adhesive under the substrate is cured by redox reaction to provide a final excellent bonding strength. The invention uses fluorescent dyes in the adhesive composition to increase the light curing rate without affecting the final bonding strength by redox curing.
[0007] One advantageous aspect of the present invention provides a magnet joined to a substrate by a two-part, dual cure fast curing adhesive composition including:a first part which includes:i. at least one (meth) acrylate component in amounts of about 20 to 80 wt. %of the total composition;ii. an amine in amounts of about 0.01%to about 5.0% by wt. of the total composition;iii. a photoinitiator in amounts of about 0.5 to about 6%by wt. of the total composition; anda second part which includes:i. peroxide;wherein a fluorescent dye capable of enhancing light-curing speed is present in either one of or both of the first part or the second part, in amounts of about 0.01 to about 0.2 wt%; andwherein the substrate is selected from the group consisting of C5 coated steel, stainless steel, aluminum, and anodized aluminum.
[0008] Another advantageous aspect of the present invention provides a method of manufacturing a laminated article which includes using a two-part, dual cure fast curing adhesive composition including:a first part which includes:i. at least one (meth) acrylate component in amounts of about 20 to 80 wt. %of the total composition;ii. an amine in amounts of about 0.01%to about 5.0% by wt. of the total composition;iii. a photoinitiator in amounts of about 0.5 to about 6%by wt. of the total composition; anda second part which includes:i. a peroxide;wherein a fluorescent dye capable of enhancing light-curing speed is present in either one of or both of the first part or the second part, in amounts of about 0.01 to about 0.2 wt% of the total composition;said method including:a) depositing a layer of the second part composition, onto one of or both of the first substrate surface and second substrate surface;b) depositing a layer of the first part composition, onto one of or both of the first substrate surface and second substrate surface; andc) mating the first and second substrates having the first part and / or second part compositions to form a laminated article;d) permitting the adhesive composition to cure; and wherein one of the first and second substrates is a magnet and the other substrate is selected from the group consisting of C5 coated steel, stainless steel, aluminum, and anodized aluminum.
[0009] Yet another advantageous aspect of the present invention provides a method of manufacturing a consumer electronic component which includes using a two-part, dual cure fast curing adhesive composition including:a first part which includes:i. at least one (meth) acrylate component in amounts of about 20 to 80 wt. %of the total composition;ii. an amine in amounts of about 0.01%to about 5.0% by wt. of the total composition;iii. a photoinitiator in amounts of about 0.5 to about 6%by wt. of the total composition; anda second part which includes:i. peroxide;wherein a fluorescent dye capable of enhancing light-curing speed is present in either one of or both of the first part or the second part, in amounts of about 0.01 to about 0.2 wt. %of the total composition;said method including:a) depositing a layer of the second part composition, onto one of or both of the first substrate surface and second substrate surface;b) depositing a layer of the first part composition, onto one of or both of the first substrate surface and second substrate surface; andc) mating the first and second substrates having the first part and / or second part compositions to form the consumer electronic component;d) permitting the adhesive composition to cure; and wherein one of the first and second substrates is a magnet and the other substrate is selected from the group consisting of C5 coated steel, stainless steel, aluminum, and anodized aluminum.DETAILED DESCRIPTION
[0010] One aspect of the invention relates to a magnet including one magnet layer joined to a substrate by a two-part, dual cure fast curing adhesive composition. The magnet layer and substrates layer may be made from C5 coated steel, stainless steel, mild steel, aluminum, or anodized aluminum.
[0011] The terms “C5 coated steel, ” “C5 electrical steel, ” and “CS / EC-5 electrical steel” as used herein indicate a type of low surface energy steel coating and are used interchangeably. CS / EC-5 electrical steel may have certain advantages such as increased insulation properties, resistance against annealing, and improved weldability.
[0012] The first part of the two-part, dual cure fast-curing adhesive composition includes: at least one (meth) acrylate component in amounts of about 20 to 80 wt. %of the total composition; an amine; and a photoinitiator. The components of the first part are further described below.(Meth) Acrylate Component
[0013] Any suitable material which contains at least one group having the following formula: where R is selected from H, halogen, or C1 to C10 hydrocarbyl, may be used.
[0014] The useful amount of the (meth) acrylate component typically ranges from about 20 weight percent to about 80 weight percent of the total composition. Desirably, the inventive compositions contain from about 50 weight percent to about 70 weight percent of (meth) acrylate component.
[0015] In addition, the (meth) acrylate component may include the free acid version of the monomer. A suitable example includes (meth) acrylic acid and 2-carboxyethyl acrylate or derivatives thereof, which may be present in an amount of about 0.25 weight percent to about 20 weight percent of the first part composition.
[0016] The (meth) acrylate component may be present in the form of a polymer, a monomer, or a combination thereof. When present in the form of a polymer, the (meth) acrylate component may be a polymer chain to which is attached at least one of the above-indicated groups. The groups may be located at a pendant or a terminal position of the backbone, or a combination thereof.
[0017] Advantageously, at least two such groups may be present, and may be located at terminal positions. The (meth) acrylate component may have a polymer chain constructed from polyvinyl, polyether, polyester, polyurethane, polyamide, epoxy, vinyl ester, phenolic, amino resin, oil based, and the like, as is well known to those skilled in the art, or random or block combinations thereof.
[0018] The polymer chain may be formed by polymerization of vinyl monomers. Illustrative examples of such vinyl monomers are methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, n-pentyl (meth) acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth) acrylate, n-heptyl (meth) acrylate, n-octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, dodecyl (meth) acrylate, phenyl (meth) acrylate, tolyl (meth) acrylate, benzyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, stearyl (meth) acrylate, glycidyl (meth) acrylate, isobornyl (meth) acrylate) , 2-aminoethyl (meth) acrylate, γ- (meth) acryloyloxypropyltrimethoxysilane, (meth) acrylic acid-ethylene oxide adduct, trifluoromethylmethyl (meth) acrylate, 2-trifluoromethylethyl (meth) acrylate, 2-perfluoroethylethyl (meth) acrylate, 2-perfluoroethyl-2-perfluorobutylethyl (meth) acrylate, 2-perfluoroethyl (meth) acrylate, perfluoromethyl (meth) acrylate, diperfluoromethylmethyl (meth) acrylate, 2-perfluoromethyl-2-perfluoroethylmethyl (meth) acrylate, 2-perfluorohexylethyl (meth) acrylate, 2-perfluorodecylethyl (meth) acrylate, 2-perfluorohexadecylethyl (meth) acrylate, ethoxylated trimethylolpropane triacrylate, trimethylol propane trimethacrylate, dipentaerythritol monohydroxypentaacrylate, pentaerythritol triacrylate, ethoxylated trimethylolpropane triacrylate, 1, 6-hexanedioldiacrylate, neopentyl glycoldiacrylate, pentaerythritol tetraacrylate, 1, 2-butylene glycoldiacrylate, trimethylopropane ethoxylate tri (meth) acrylate, glyceryl propoxylate tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol monohydroxy penta (meth) acrylate, tri (propylene glycol) di (meth) acrylate, neopentylglycol propoxylate di (meth) acrylate, 1, 4-butanediol di (meth) acrylate, polyethyleneglycol di (meth) acrylate, triethyleneglycol di (meth) acrylate, butylene glycol di (meth) acrylate and ethoxylated bisphenol A di (meth) acrylate. These monomers may be used each alone or a plurality of them may be copolymerized.
[0019] Particularly desirable (meth) acrylate ester monomers include those where the alcohol portion of the ester group contains 1-8 carbon atoms. For instance, 2-ethylhexyl methacrylate, hydroxyethyl methacrylate, cyclohexyl methacrylate, ethyl methacrylate, 1, 3-butanedioldimethacrylate, butyl methacrylate and methyl methacrylate are examples.Amines
[0020] The inventive compositions include at least one amine that acts as a catalyst by accelerating or otherwise promoting curing of the inventive compositions. The amines desirably are tertiary or sterically hindered. Suitable amines include, for example, tertiary amines represented by the formula NR3, where R is selected from alkyl, aryl, alkaryl, or aralkyl radicals, including C1-10 alkyl, C6-18 aryl, C7-15 alkaryl, and C7-15 aralkyl radicals. Suitable hindered amines also include secondary amines, such as HNR2, where R is a C4-10 alkyl. For example, alkyl groups such as tertiary butyl, or neopentyl, sterically shield the hydrogen bound to the nitrogen atom, and are suitable substituents in this component. For either tertiary amines or secondary amines, the R groups may be linked so that the nitrogen is embedded within a cyclic structure.
[0021] Particularly useful amines for inclusion in the present inventive compositions include, for example, 1, 8-diazabicyclo (5.4.0) undec-7-ene (DBU) , 1, 4-diazabicyclo (2.2.2) octane (DABCO) , triethylamine, and substituted guanidines, such as tetramethylguanidine (TMG) , toluidines such as dialkyl toluidine like dimethyl-p-toluidine (DMPT) , diethyl-p-toluidene (DEPT) , dihydroxy ethyl p-toluidine, and dimethyl-o-toluidine (DMOT) , anilines such as dialkyl anilines like dimethyl aniline, dihydroxyethyl aniline, acyl thiourea, benzoyl-thiourea, and aryl-thiourea.
[0022] The amine can be present in an amount from about 0.01 weight percent to about 5 weight percent. Desirably, the amine is present in an amount from about 0.05 weight percent to about 2 weight percent. More desirably, the amine is present in amount from about 0.3 weight percent to about 0.7 weight percent.Photoinitiators
[0023] Suitable photoinitiators exhibit light absorption spectrums that are distinct from those of the resins in which they are used, as well as other additives in the adhesive. Examples of such photoinitiators include, but are not limited to, 2, 4, 6-trimethylbenzoyldiphenyl phosphine oxide (TPO) , ethyl phenyl (2, 4, 6-trimethylbenzoyl) phosphinate (TPO-L) , polymeric TPO-L (such as Omnipol TP from iGM Resins) , and combinations thereof.
[0024] The amount of the photoinitiator may be in a range of about 0.5 wt. %to about 6 wt. %, and more desirably about 2 wt. %to about 4 wt. %based upon the total weight of the composition.
[0025] The second part of the inventive adhesive composition includes a peroxide.Peroxide
[0026] The peroxide includes benzoyl peroxide, lauroyl peroxide, tetramethyl butyl hydroperoxide, tert-amyl hydroperoxide, tert-butylperoxybenzoate, and cumene hydroperoxide.
[0027] The peroxide is present in amount of about 1 wt. %to about 5 wt. %of the total composition.Additional Components in the Second PartEpoxy Resins
[0028] The epoxy resin is an optional component, but when present may include cycloaliphatic epoxides, epoxy novolac resins, bisphenol-A epoxy resins, bisphenol-F epoxy resins, bisphenol-A epichlorohydrin based epoxy resin, alkyl epoxides, limonene dioxides, and polyepoxides.
[0029] A desirable resin component is a cycloaliphatic epoxide sold by Dow Chemical under the brand name CYRACURE UVR-6110. UVR-6110 has the following structure:
[0030] Another suitable resin component is a bisphenol based liquid epoxy resin, such as those sold under the trade name “D.E.R. ” by Dow Chemical. For description of these epoxy resins, see http: / / epoxy. dow. com / epoxy / products / prod / liquid. htm. Examples of “D.E.R. ” products that are suitable for this invention include D.E.R. 332 (diglycidyl ether of bisphenol-A) ; D.E.R. 330 (low viscosity, undiluted, bisphenol-A liquid epoxy resin) ; D.E.R. 383 (low viscosity, undiluted, bisphenol-A liquid epoxy resin) ; D.E.R. 354 (standard, bisphenol-F based liquid epoxy resin) ; D.E.R. 351 (low viscosity, liquid bisphenol-A / F resin blend) ; D.E.R. 352 (low viscosity, liquid bisphenol-A / F resin blend) ; D.E.R. 324 (aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin) ; D.E.R. 323 (aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin) ; D.E.R. 325 (aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin) ; and D.E.R. 353 (aliphatic glycidyl ether reactive diluent, modified liquid epoxy resin) . A different brand of a bisphenol based liquid epoxy resin suitable for use in this invention is EPONTM Resin 828, derived from bisphenol A and epichlorohydrin, and commercially available from Hexion Specialty Chemicals. See http: / / www. hexionchem. com / pds / E / EPONTM Resin 828. pdf.
[0031] Another suitable resin component is an epoxy novolac resin, which are products of epichlorohydrin and phenol-formaldehyde novolac, and sold under the trade name D.E.N. by Dow Chemical. For a description of these epoxy resins, see http: / / epoxy. dow. com / epoxy / products / prod / nov. htm. Examples of “D.E.N. ” products that are suitable for this invention include D.E.N. 431 (low viscosity semi-solid epoxy novolac resin) ; and D.E.N. 438 (semi-solid epoxy novolac resin) .
[0032] Other suitable epoxy resins include polyepoxides curable with catalyst or hardeners at ambient temperatures or at suitable elevated temperature. Examples of these polyepoxides include polyglycidyl and poly (β-methylglycidyl) ethers obtainable by reaction of a compound containing at least two free alcoholic hydroxyl and / or phenolic hydroxyl groups per molecule with the appropriate epichlorohydrin under alkaline conditions or, alternatively, in the presence of an acidic catalyst and subsequent treatment with alkali. These ethers may be made from acyclic alcohols such as ethylene glycol, diethylene glycol, and higher poly (oxyethylene) glycols, propane-1, 2-diol and poly (oxypropylene) glycols, propane-1, 3-diol, butane-1, 4-diol, poly (oxytetramethylene) glycols, pentane-1, 5-diol, hexane-2, 4, 6-triol, glycerol, 1, 1, 1-trimethylolpropane, pentaerythritol, sorbitol, and poly (epichlorohydrin) ; from cycloaliphatic alcohols, such as resorcinol, quinitol, bis (4-hydroxycyclohexyl) methane, 2, 2-bis (4-hydroxycyclohexyl) propane, and 1, 1-bis (hydroxymethyl) -cyclohex-3-ene; and from alcohols having aromatic nuclei, such as N, N-bis (2-hydroxyethyl) aniline and p, p'-bis (2-hydroxyethylamino) diphenylmethane. Alternatively they may be made from mononuclear phenols, such as resorcinol and hydroquinone, and from polynuclear phenols, such as bis (4-hydroxyphenyl) methane, 4, 4'-dihydroxydiphenyl, bis (4-hydroxyphenyl) sulphone, 1, 1, 2, 2-tetrabis (4-hydroxyphenyl) ethane, 2, 2, -bis (4-hydroxyphenyl) propane (otherwise known as bisphenol A) , 2, 2-bis (3, 5-dibromo-4-hydroxyphenyl) propane, and novolacs formed from aldehydes such as formaldehyde, acetaldehyde, chloral, and furfuraldehyde, with phenols such as phenol itself, and phenols substituted in the ring by chlorine atoms or by alkyl groups each containing up to nine carbon atoms, such as 4-chlorophenol, 2-methylphenol, and 4-t-butylphenol.
[0033] Poly (N-glycidyl) compounds include, for example, those obtained by dehydrochlorination of the reaction products of epichlorohydrin with amines containing at least two amino-hydrogen atoms, such as aniline, n-butylamine, bis (4-aminophenyl) methane, and bis (4-methylaminophenyl) methane; triglycidyl isocyanurate; and N, N'-diglycidyl derivatives of cyclic alkylene ureas, such as ethylene urea and 1, 3-propyleneureas, and of hydantoins such as 5, 5-dimethylhydantoin.
[0034] Epoxide resins having the 1, 2-epoxide groups attached to different kinds of hetero atoms may be employed, e.g., the N, N, O-triglycidyl derivative of 4-aminophenol, the glycidyl ether-glycidyl ester of salicylic acid, N-glycidyl-N'- (2-glycidyloxypropyl) -5, 5-dimethylhydantoin, and 2-glycidyloxy-1, 3-bis (5, 5-dimethyl-1-glycidylhydantoin-3-yl) propane.
[0035] Epoxides derived from oils, such as epoxidized soybean oil, epoxidized castor oil, and the like are also suitable. Epoxides derived from or capable of being derived from the per-acid oxidation of unsaturation are also suitable, including epoxidized liquid rubber.Plasticizer
[0036] Plasticizers are an optional component, but when present may be any liquid or soluble compound that assists with the flexibility of the reactive composition and / or may act as a carrier vehicle for other components of the composition. Examples include aromatic sulfonamides, aromatic phosphate esters, alkyl phosphate esters, dialkylether aromatic esters, polymeric plasticizers, dialkylether diesters, polyglycol diesters, tricarboxylic esters, polyester resins, aromatic diesters, aromatic triesters (trimellitates) , aliphatic diesters, epoxidized esters, chlorinated hydrocarbons, aromatic oils, alkylether monoesters, naphthenic oils, alkyl monoesters, paraffinic oils, silicone oils, di-n-butyl phthalate, diisobutyl phthalate, di-n-hexyl phthalate, di-n-heptyl phthalate, di-2-ethylhexyl phthalate, 7cgc-phthalate (linear and branched) , diisoctyl phthalate, linear 6c, 8c, 10c phthalate, diisononyl phthalate, linear 8c-10c phthalate, linear 7c-11c phthalate, diisodecyl phthalate, linear 9c-11c phthalate, diundecyl phthalate, diisodecyl glutarate, di-2-ethylhexyl adipate, di-2-ethylhexyl azelate, di-2-ethylhexyl sebacate, di-n-butyl sebacate, diisodecyl adipate, triethylene glycol caprate-caprylate, triethylene glycol 2-ethylhexanote, dibutoxyethyl adipate, dibutoxyethoxyethyl adipate, dibutoxyethoxyethyl formal, dibutoxyethoxyethyl sebacate, tri-2-ethylhexyl trimellitate, tri- (7c-gc (linear) ) trimellitate, tri- (8c-10c (linear) ) trimellitate, triethyl phosphate, triisopropyl phenyl phosphate, tributyl phosphate, 2-ethylhexyl diphenyl phosphate, trioctyl phosphate, isodecyl diphenyl phosphate triphenyl phosphate, triaryl phosphate synthetic, tributoxyethyl phosphate, tris (-chloroethyl) phosphate, butylphenyl diphenyl phosphate, chlorinated organic phosphate, cresyl diphenyl phosphate, tris (dichloropropyl phosphate, isopropylphenyl diphenyl phosphate, trixylenyl phosphate, tricresyl phosphate, and diphenyl octyl phosphate.Other Additives
[0037] The second part may contain other additives, such as fillers, lubricants, thickeners, and coloring agents. The fillers provide bulk without sacrificing significant strength of the adhesive and can be selected from high or low density fillers.
[0038] Of particular interest are low density fillers, because the resulting final product has an otherwise lower density than a product without the filler, yet has essentially the same range of strength characteristics as if the filler was not present.Fluorescent Dye
[0039] A fluorescent dye capable of enhancing light-curing speed is present in either one of or both of the first part or the second part. The fluorescent dye may include, but is not limited to, 2, 5-bis (5-tert-butyl-2-benzoxazolyl) thiophene (BBOT) or fluoranthene. The dye is present in amounts of about 0.01 to about 0.2 wt%of the total composition.Additional Components and / or Additives
[0040] The adhesive composition of the present invention may further include additional components and / or additives.
[0041] Optional additives, such as, but not limited to, stabilizers, fillers, defoamers, pigments, coloring agents, plasticizers, viscosity modifiers, tougheners, coupling agents, adhesion promoters, humectants, tackifiers, flame retardants, wetting agents, thixotropic and / or rheology agents, corrosion inhibitors, fluorescence additives, antioxidants, and combinations thereof may be included in the compositions of the present invention.
[0042] For example, the first part of the composition may include a non-reactive polymeric toughener, a reactive polymeric toughener, a core-shell impact modifier, a free radical inhibitor, an adhesion promotor, an acid monomer, a rheology modifier, or combinations thereof.
[0043] Examples of non-reactive polymeric tougheners include, but are not limited to, styrene-butadiene-styrene copolymers (SBS) , styrene-isoprene / butadiene-styrene copolymers (SIBS) , styrene-ethylene / butylene-styrene copolymers (SEBS) , styrene-ethylene / propylene-styrene copolymers (SEPS) , methyl methacrylate-n-butyl acrylate-methyl methacrylate copolymers, methyl methacrylate- (2-ethylhexyl methacrylate / n-butyl acrylate) -methyl methacrylate copolymers, methyl methacrylate- (methyl acrylate / n-butyl acrylate) -methyl methacrylate copolymers, and nitrile butadiene rubber (NBR) . The non-reactive polymeric toughener may be present in the composition in about 5 wt. %to about 30 wt. %.
[0044] Desirable reactive polymeric tougheners include those that are vinyl terminated, such as (meth) acrylate terminated polymeric tougheners, like (meth) acrylate terminated polybutadiene, (meth) acrylate terminated butadiene / acrylonitrile copolymer, (meth) acrylate terminated urethane.
[0045] Examples of a core-shell impact modifier include, but are not limited to, shell: poly (methyl methacrylate; and core: acrylonitrile-butadiene-styrene (ABS) , methacrylate-butadiene-styrene (MBS) and methacrylate-acrylonitrile-butadiene-styrene (MARS) polymers. A core-shell impact modifier may be present in the compositions disclosed herein in amounts of about 0 wt. %to about 30 wt. %of the total composition.
[0046] Examples of useful free radical inhibitors include, but are not limited to, butylated hydroxytoluene (BHT) , benzoquinones such as naphthoquinone, hydroquinone, and ethyl hydroquinone. The free radical inhibitor may be present less than 0.1 wt. %of the total composition.
[0047] Examples of useful adhesion promoters which may be optionally included, but are not limited to, are phosphate-ester-based adhesion promoters with (meth) acrylate functional group (s) , including 2-meth acryloyloxyethyl phosphate, bis- (2-methacryloyl-oxyethyl phosphate) , 2-acryloyloxyethyl phosphate, bis- (2-acryloyloxyethyl phosphate) , methyl- (2-methacryloyloxyethyl phosphate) , ethyl- (2-methacryloyl-oxyethyl phosphate) , and a mixture of 2-hydroxyethyl methacrylate monophosphate and diphosphate esters.
[0048] Examples of useful acid monomers which may be optionally included, but are not limited to, are (meth) acrylic acid, and 2-carboxyethyl acrylate. The acid monomers may be present in about 0 wt. %to about 12 wt. %based upon the total weight of the composition.
[0049] A rheology modifier may optionally be present in the composition in about 0 wt. %to about 5 wt. %based upon the total weight of the composition.
[0050] Additionally, the second part of the composition may also include a plasticizer, viscosity modifier, or combinations thereof. Examples of plasticizers include, but are not limited to, benzoate plasticizers, epoxy resins, and polyalkylene polyols. Examples of viscosity modifiers include, but are not limited to, polyethylene having a number average molecular weight (Mn) from 500 to 7500; petroleum waxes, such as paraffin wax and microcrystalline wax; synthetic waxes made by polymerizing carbon monoxide and hydrogen, such as Fischer-Tropsch wax; polyolefin waxes; and, hydrogenated animal, fish or vegetable oils. The viscosity modifier may be present in about 5 to about 20 wt. %.
[0051] The compositions generally provide a die shear force of greater than 30N after 40 seconds of UV curing.EXAMPLESExample 1
[0052] Component 8192R, a commercially available two-part methyl methacrylate adhesive (2k MMA) was used as a base to formulate samples 1-14. The formulation for part one (A) and part two (B) of 8192R is provided below along with the details of the formulations for samples 1-14 where varying amounts of different photoinitiators and fluorescent dyes were tested.
[0053] The following photoinitiators were tested: TPO-L: Ethyl Phenyl (2, 4, 6-trimethylbenzoyl) phosphinate; Omnipol TP: Poly (oxy-1, 2-ethanediyl) , α, α', α″-1, 2, 3-propanetriyltris [ω- [ [phenyl (2, 4, 6-trimethylbenzoyl) phosphinyl] oxy] ; OmniRad 819: Bis (2, 4, 6-Trimethylbenzoyl) phenylphosphine oxide; TPO: Diphenyl (2, 4, 6-trimethylbenzoyl) phosphine oxide; OmniRad DETX: 2, 4-diethyl-gH-thioxanthen-9-one; and OmniRad 184: Hydroxycyclohexyl phenyl ketone. The following fluorescent dyes were tested: BBOT: 2, 5-Bis (5-tert-butyl-2-benzoxazolyl) thiophene and Fluoranthene.Formulation for Part A Formulation for Part B Compositions 2K MMA = two-part methyl methacrylate adhesivesExample 2 -DUAL CURE 2K MMA WITH AND WITHOUT FLUORESCENT DYE Example 3 -STANDARD DUAL CURE 2K MMA WITH DIFFERENT LOADINGS OF PHOTO INITIATOR Example 4 -DUAL CURE 2K MMA WITH DIFFERENT FLUORESCENT DYES AND DIFFERENT LOADINGS OF FLUORESCENT DYE Example 5 -DUAL CURE 2K MMA WITH DIFFERENT PHOTO INITIATORS Example 6 -DUAL CURE 2K MMA CURED UNDER DIFFERENT PERIODS OF TIME. Example 7 -DUAL CURE 2K MMA CURED BY UV (365 NM) AND VISIBLE (405 NM) LIGHT Example 8 -DUAL CURE 2K MMA CURED BY REDOX SUS = stainless steelAnAl = anodized aluminumPC = polycarbonateAF = adhesive failureCF = cohesive failureMAF = mixed adhesive failure
[0054] Conclusions: Tensile lap shear strengths of 2k MMA cured by redox are not affected by presence of the photoinitiator and fluorescent dye.TEST METHODS
[0055] Viscosity: tested on Modular Compact Rheometer MCR302e made by Anton Paar using a pair of parallel plate with 25 mm diameter.
[0056] Tensile lap shear strength: according to ASTM D1002 and ASTM D3163. Bonding area is 1 inch x 1 / 2 inch for metals and 1 inch x 1 / 4 inch for PC, adhesive thickness is controlled by 5 mil spacer beads. Pulling rate is 10 mm / min.
[0057] Tensile test: according to ASTM D638, sample dimension: type IV and thickness is 0.75 mm.
[0058] Tensile lap shear and tensile tests were tested on Instron 68TM-R using a 30 kN static load cell.
[0059] Exotherm test: Before testing, cartridge was placed under 20℃ for over 12 hours. 15 g of Part A and Part B (10 / 1 volume ratio) were dispensed through a mixing nozzle into a plastic beaker. A K-type thermocouple was immediately inserted into the adhesive to measure and record the temperature change with time.Example 9
[0060] Standard and inventive fast-curing light / redox dual cure two-part methyl methacrylate adhesives (2k MMA) were applied between an anodized aluminum coupon and a bare glass substrate. Both 2k MMA compositions have the same formulation except the inventive fast-curing light / redox 2k MMA contains fluorescent dye. The adhesives on the substrates were subsequently cured by light radiation (Henkel EQ CL30 LED Flood 405) for 30 and 45 seconds. Die shear force (a force sufficient to shear the die from its mounting or equal to twice the minimum specified shear strength, whichever occurs first, shall be applied to the die) was tested immediately after light curing. After 45 seconds of light exposure, fast light / redox 2k MMA achieved 40 N of die shear force while the standard one did not cure. As a result, the presence of fluorescent dye increased the light curing rate significantly.
Claims
1.A magnet comprising: one magnet joined to a substrate by a two-part, dual cure, fast curing adhesive composition comprising:a first part comprising:i. at least one (meth) acrylate component in amounts of about 20 to 80 wt. %of the total composition;ii. an amine in amounts of about 0.01%to about 5%by wt. of the total composition;iii. a photoinitiator in amounts of about 0.5 to about 6%by wt. of the total composition; anda second part comprising:i. peroxide;wherein a fluorescent dye capable of enhancing light-curing speed is present in either one of or both of the first part or the second part, in amounts of about 0.01 to about 0.2 wt%of the total composition; andwherein the substrate is selected from the group consisting of C5 coated steel, stainless steel, aluminum, and anodized aluminum.2.The magnet of claim 1, wherein the (meth) acrylate monomers are selected from the group consisting of methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, glycidyl ether (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, trimethyl cyclohexyl (meth) acrylate, lauryl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and combinations thereof.3.The magnet of claim 1, wherein the amine is selected from the group consisting of dimethyl para-toluidine, 2, 2′- (p-tolylimino) diethanol, and combinations thereof.4.The magnet of claim 1, wherein the photoinitiator is selected from the group consisting of 2, 4, 6-trimethylbenzoyldiphenyl phosphine oxide (TPO) , ethyl phenyl (2, 4, 6-trimethylbenzoyl) phosphinate (TPO-L) , polymeric TPO-L, and combinations thereof.5.The magnet of claim 1, wherein the fluorescent dye is 2, 5-bis(5-tert-butyl-2-benzoxazolyl) thiophene or fluoranthene.6.The magnet of claim 1, wherein the adhesive composition further comprises a non-reactive polymeric toughener, reactive polymeric toughener, core-shell impact modifier, a free radical inhibitor, adhesion promoter, acid monomers, rheology modifier, or combinations thereof.7.The magnet of claim 1, wherein the adhesive composition further comprises a plasticizer, a viscosity modifier, or combinations thereof.8.The magnet of claim 1, wherein the die shear force is greater than 30N after 40 seconds of UV curing.9.A method of manufacturing a laminated article comprising using a two-part, dual cure fast curing adhesive composition comprising:a first part comprising:i. at least one (meth) acrylate component in amounts of about 20 to 80 wt. %based on the total composition;ii. an amine present in amounts of about 0.01%to about 5.0%by wt. of the total composition;iii. a photoinitiator present in amounts of about 0.5 to about 6%by wt. of the total composition;a second part comprising:ii. peroxide;wherein a fluorescent dye capable of enhancing light-curing speed is present in either one or both of the first part or the second part, in amounts of about 0.01%to about 0.2 wt%based on the total composition;said method comprising:a) depositing a layer of the second part composition, onto one or both of the first substrate surface and second substrate surface;b) depositing a layer of the first part composition, onto one of or both of the first substrate surface and second substrate surface; andc) mating the first and second substrates having the first part and / or second part compositions to form a laminated article;d) permitting the adhesive composition to cure; andwherein one substrate is a magnet and another substrate is a C5 coated steel, stainless steel, aluminum, or anodized aluminum.10.The method of claim 9, wherein the (meth) acrylate monomers are selected from the group consisting of methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, phenoxyethyl (meth) acrylate, isobornyl (meth) acrylate, glycidyl ether (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, trimethyl cyclohexyl (meth) acrylate, lauryl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and combinations thereof.11.The method of claim 9, wherein the amine is selected from the group consisting of dimethyl para-toluidine, 2, 2′- (p-tolylimino) diethanol, and combinations thereof.12.The method of claim 9, wherein the photoinitiator is selected from the group consisting of 2, 4, 6-trimethylbenzoyldiphenyl phosphine oxide (TPO) , ethyl phenyl (2, 4, 6-trimethylbenzoyl) phosphinate (TPO-L) , polymeric TPO-L, and combinations thereof.13.The method of claim 9, wherein the fluorescent dye is 2, 5-bis (5-tert-butyl-2-benzoxazolyl) thiophene or fluoranthene.14.The method of claim 9, wherein the adhesive composition further comprises a non-reactive polymeric toughener, reactive polymeric toughener, core-shell impact modifier, a free radical inhibitor, adhesion promoter, acid monomers, rheology modifier, or combinations thereof.15.The method of claim 9, wherein the adhesive composition further comprises a plasticizer, a viscosity modifier, or combinations thereof.16.A method of manufacturing consumer electronic component comprising using a two-part, dual cure fast curing adhesive composition comprising:a first part comprising:i. at least one (meth) acrylate monomers in amounts of about 20 to 80 weight%of the total composition;ii. an amine present in amounts of about 0.01%to about 5.0%by wt. of the total composition;iii. a photoinitiator present in amounts of about 0.5 to about 6%by wt. of the total composition; anda second part comprising:ii. peroxide;wherein a fluorescent dye capable of enhancing light-curing speed is present in either one or both of the first part or the second part, in amounts of about 0.01 to about 0.2 wt%of the total composition;said method comprising:a) depositing a layer of the second part composition, onto one or both of the first substrate surface and second substrate surface;b) depositing a layer of the first part composition, onto one of or both of the first substrate surface and second substrate surface; andc) mating the first and second substrates having the first part and / or second part compositions to form a consumer electronic component;d) permitting the adhesive composition to cure; andwherein one substrate is a magnet and another substrate is a C5 coated steel, stainless steel, aluminum, or anodized aluminum.