Laminate and metal-clad laminate

Abstract

The present invention provides a metal-clad laminate that can be suitably used as a material for printed wiring boards, exhibits excellent dimensional stability, and reduces transmission loss when used as a printed wiring board. The present invention provides a laminate which serves as an intermediate for manufacturing the metal-clad laminate described above, and which has a low coefficient of linear expansion and a low dielectric loss tangent. The present invention provides a printed wiring board in which circuits have been processed onto the metal-clad laminate.　The laminate is formed by stacking a resin layer (B1), a glass cloth-containing layer (A), and a resin layer (B2) in this order, wherein the resin layer (B1) and the resin layer (B2) each have a dielectric loss tangent Df of 0.0020 or less at 10 GHz.

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