Laser machining head for laser cladding with wire and method

The laser processing head with external sensor devices for comprehensive contamination monitoring addresses the challenge of fixed maintenance intervals, ensuring efficient and quality-maintained laser cladding processes.

WO2026139357A1PCT designated stage Publication Date: 2026-07-02PRECITEC GMBH

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
PRECITEC GMBH
Filing Date
2025-12-18
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Conventional laser processing heads for coaxial laser cladding with wire struggle with monitoring the degree of contamination of protective glass, leading to unnecessary lens replacements and impaired cladding quality due to fixed maintenance intervals.

Method used

A laser processing head with a monitoring device comprising sensor devices arranged outside the beam path, utilizing scattered laser radiation and thermal detection to monitor the protective glass comprehensively, allowing for demand-based maintenance.

Benefits of technology

Enables precise monitoring of protective glass contamination, reducing unnecessary replacements and maintaining laser performance quality by converting fixed intervals to demand-based maintenance.

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Abstract

The invention relates to a laser machining head for laser cladding with wire. The laser machining head comprises a collimation optical unit for collimating a laser beam. The laser machining head comprises a focusing optical unit for focusing the laser beam. The laser machining head comprises a protective glass. The laser machining head comprises a wire guide device for feeding the wire into a process zone. The protective glass has a central bore in order to guide the wire coaxially to a beam path of the laser beam through the bore. The laser machining head also comprises a monitoring device for monitoring the entire surface of the protective glass with respect to the degree of soiling by means of at least three sensor devices that are arranged outside the beam path in the laser machining head.
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