Galvanometer correction method, device, program product, and laser processing method

Abstract

This application provides a galvanometer calibration method, device, program product, and laser processing method. The method first detects that the galvanometer calibration plate is in the calibration position of the laser processing equipment. Then, using a reader on the laser processing equipment, it reads the non-volatile memory chip integrated on the galvanometer calibration plate to obtain management information, including used area information. Based on the used area information, it determines at least one usable calibration area on the galvanometer calibration plate. It then controls the laser processing equipment to perform a galvanometer calibration operation based on any usable calibration area. Upon completion of the galvanometer calibration operation, it updates the used area information stored in the non-volatile memory chip using the reader. This achieves automated management of the galvanometer calibration plate's usage status, reduces manual intervention, and significantly improves calibration accuracy and success rate.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and in particular relates to a galvanometer correction method, equipment, program product and laser processing method. Background Technology

[0002] In the field of laser processing, the galvanometer is a core component for achieving high-precision beam scanning and control, and its calibration accuracy directly affects the quality of processes such as circuit board drilling and cutting. The galvanometer calibration plate, as a key tool in the calibration process, provides a standard reference matrix for detecting and compensating for geometric distortions during galvanometer scanning.

[0003] In related technologies, the use of galvanometer calibration plates typically relies on manual management of their status. Operators need to determine which areas on the calibration plate have not been used based on experience or paper records, and manually move the calibration plate to the corresponding position to perform the calibration operation. After calibration, the usage status is often marked manually or with paper labels for reference in the next use, but the calibration efficiency and accuracy are low, and the management of calibration plates is difficult. Summary of the Invention

[0004] This application provides a galvanometer calibration method, equipment, program product, and laser processing method, which can improve the calibration accuracy and calibration success rate.

[0005] A first aspect of this application provides a galvanometer calibration method, comprising: when a galvanometer calibration plate is detected to be in a calibration station of a laser processing equipment, reading a non-volatile memory chip integrated on the galvanometer calibration plate using a reader / writer on the laser processing equipment to obtain management information of the galvanometer calibration plate, wherein the management information includes used area information; determining at least one available calibration area on the galvanometer calibration plate based on the used area information; controlling the laser processing equipment to perform a galvanometer calibration operation based on any available calibration area; and updating the used area information stored in the non-volatile memory chip via the reader / writer when the galvanometer calibration operation is completed.

[0006] In the technical solution of this application, the available calibration area is automatically determined by reading the used area information stored in the chip on the galvanometer calibration board, and the used area information is updated after calibration is completed. This ensures that each galvanometer calibration is performed in the correct available calibration area, realizes automated management of the galvanometer calibration board usage status, reduces manual intervention, and significantly improves calibration accuracy and calibration success rate.

[0007] Optionally, in one possible implementation of the first aspect, the management information further includes coordinate information of multiple preset correction areas on the galvanometer calibration plate; the aforementioned determination of at least one usable correction area on the galvanometer calibration plate based on the used area information includes: filtering out unused preset correction areas from the coordinate information of the multiple preset correction areas based on the used area information; and determining the unused preset correction areas as usable correction areas. Thus, by presetting the coordinate information of multiple correction areas in the management information and filtering out unused preset correction areas as usable correction areas based on the used area information, automatic identification and precise positioning of usable correction areas are achieved, providing an accurate spatial basis for subsequent automated calibration.

[0008] Optionally, in another possible implementation of the first aspect, the aforementioned controlled laser processing equipment performs a galvanometer correction operation based on any available correction area, including: determining a target correction area from at least one available correction area and obtaining the coordinate information corresponding to the target correction area; adjusting the position of the target correction area according to the coordinate information corresponding to the target correction area so that the target correction area is within the processing field of view of the laser processing equipment; and performing a galvanometer correction operation based on the target correction area after the target correction area is within the processing field of view. Thus, by determining the target correction area from the available correction areas and obtaining its coordinate information, and adjusting the position of the target correction area to be within the processing field of view, automatic and precise positioning of the correction area to the processing field of view is achieved, avoiding positioning errors introduced by manually moving the correction plate.

[0009] Optionally, in another possible implementation of the first aspect, the aforementioned control of the laser processing equipment to perform galvanometer calibration based on any available calibration area includes: controlling the laser beam of the laser processing equipment to mark according to a preset target array based on any available calibration area to generate reference marks for galvanometer calibration; acquiring an image containing the reference marks, and performing galvanometer calibration based on the image containing the reference marks. Thus, by controlling the laser beam to mark according to a preset target array within the available calibration area to generate reference marks, and acquiring an image for galvanometer calibration, the specific implementation of the galvanometer calibration operation is completed, ensuring the automation and repeatability of the calibration process.

[0010] Optionally, in another possible implementation of the first aspect, the aforementioned management information further includes the validity period of the galvanometer calibration plate; before controlling the laser processing equipment to perform galvanometer calibration operations based on any available calibration area, the method further includes: determining whether the current time has exceeded the validity period; if the current time has exceeded the validity period, stopping the galvanometer calibration operation and outputting a corresponding prompt message. Thus, by reading the validity period of the galvanometer calibration plate and determining whether it has expired before performing calibration, stopping the operation and outputting a prompt when it has expired, the expired calibration plate is automatically intercepted, preventing a decrease in calibration accuracy due to material aging.

[0011] Optionally, in another possible implementation of the first aspect, the management information further includes the total number of available areas and the count of used areas on the galvanometer calibration plate. Before determining at least one available calibration area on the galvanometer calibration plate based on the used area information, the method further includes: stopping the galvanometer calibration operation and outputting a corresponding prompt message when the used area count has reached the total number of available areas. Thus, by reading the total number of available areas and the count of used areas on the calibration plate, determining whether the area has been exhausted before calibration, stopping the operation and outputting a prompt when the area is exhausted, avoids calibration failures or misuse of marked areas interfering with visual recognition due to the exhaustion of the physical area of ​​the calibration plate.

[0012] Optionally, in another possible implementation of the first aspect, the management information further includes the available dimensions of the galvanometer calibration plate, the dimensions required for a single calibration, the safety distance between adjacent calibration areas, and the count of used areas. Before determining at least one usable calibration area on the galvanometer calibration plate based on the used area information, the method further includes: calculating the total number of usable areas of the galvanometer calibration plate based on the available dimensions of the galvanometer calibration plate, the dimensions required for a single calibration, and the safety distance between adjacent calibration areas; stopping the galvanometer calibration operation when the used area count reaches the total number of usable areas, and outputting a corresponding prompt message. Thus, by reading the available dimensions of the calibration plate, the dimensions required for a single calibration, and the safety distance, calculating the total number of usable areas, and stopping the operation when the used area count reaches that number, the dynamic calculation of the total number of usable areas and the automatic determination of the lifespan are achieved.

[0013] Optionally, in another possible implementation of the first aspect, the management information further includes the material type of the galvanometer calibration plate; the aforementioned galvanometer calibration operation includes: matching the corresponding laser process parameters from a preset laser parameter library according to the material type; and performing the galvanometer calibration operation using the laser process parameters. Thus, by reading the material type of the calibration plate and matching the corresponding laser process parameters, and then performing the calibration operation using the matched parameters, automatic adaptation between the laser parameters and the calibration plate material is achieved, ensuring the consistency of the calibration effect and avoiding calibration errors caused by improper parameter settings.

[0014] Optionally, in another possible implementation of the first aspect, the management information further includes the thickness of the galvanometer calibration plate; before performing the galvanometer calibration operation, the method further includes: determining the target position coordinates of the motion platform of the laser processing equipment in the direction perpendicular to the processing surface of the galvanometer calibration plate, based on the thickness of the galvanometer calibration plate; controlling the motion platform to move to the target position coordinates so that the focus of the laser beam of the laser processing equipment is located on the processing surface of the galvanometer calibration plate. Thus, by reading the thickness of the calibration plate and determining the target position coordinates of the motion platform in the direction perpendicular to the processing surface, and controlling the platform to move to that position so that the focus of the laser beam is located on the processing surface of the calibration plate, laser focusing accuracy is ensured, eliminating the need for manual focusing.

[0015] Optionally, in another possible implementation of the first aspect, updating the used area information stored in the non-volatile memory chip via a reader / writer includes: writing the used area identifier corresponding to the galvanometer calibration operation, the device identifier performing the galvanometer calibration operation, and the timestamp of the galvanometer calibration operation into the non-volatile memory chip. Thus, by writing the used area identifier, device identifier, and timestamp into the non-volatile memory chip, a detailed record of the calibration board's usage is established, providing a data foundation for subsequent usage status queries, historical tracing, and cross-device information synchronization.

[0016] Optionally, in another possible implementation of the first aspect, the aforementioned galvanometer calibration plate is used for galvanometer calibration operations on multiple laser processing devices. That is, the relay use of a single galvanometer calibration plate between different devices improves the utilization rate of the calibration plate and reduces usage costs.

[0017] A second aspect of this application provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the galvanometer correction method of the first aspect described above.

[0018] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the galvanometer correction method of the first aspect described above.

[0019] A fourth aspect of this application provides a computer program product that, when run on an electronic device, causes the electronic device to perform the galvanometer correction method of the first aspect described above.

[0020] The fifth aspect of this application provides a laser processing method, comprising: first, calibrating a galvanometer using the galvanometer calibration method of the first aspect described above; and then performing laser processing on the workpiece to be processed using the calibrated galvanometer.

[0021] The sixth aspect of this application provides a laser processing apparatus, comprising: a laser for emitting a laser beam; a beam control system including a beam deflection mechanism for transmitting, controlling, and deflecting the laser beam; a motion platform for carrying a workpiece to be processed or a galvanometer correction plate; and a reader for reading and writing non-volatile memory chips integrated on the galvanometer correction plate.

[0022] It is understood that the beneficial effects of the second to sixth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a laser processing device provided in an embodiment of this application; Figure 2 This is a schematic flowchart of a galvanometer correction method provided in an embodiment of this application; Figure 3 This is a schematic diagram illustrating the structure of a galvanometer correction plate and a radio frequency identification (RFID) chip provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a galvanometer correction plate and an RFID chip provided in an embodiment of this application; Figure 5 This is a schematic diagram of another structure of a galvanometer correction plate and an RFID chip provided in an embodiment of this application; Figure 6 This is a schematic diagram of another structure of a galvanometer correction plate and an RFID chip provided in an embodiment of this application; Figure 7This is a schematic diagram of the processable area of ​​a galvanometer correction plate provided in an embodiment of this application; Figure 8 This application provides a laser processing method according to an embodiment. Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0025] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0026] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0027] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0029] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0031] It should be understood that the sequence number of each step in this embodiment does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of this application embodiment.

[0032] In related technologies, the use of galvanometer calibration plates typically relies on manual management of their status. Operators need to determine which areas on the calibration plate have not been used based on experience or paper records, and manually move the calibration plate to the corresponding position to perform the calibration operation. After calibration, the usage status is often marked manually or with paper labels for reference in the next use, but the calibration efficiency and accuracy are low, and the management of calibration plates is difficult.

[0033] In view of this, embodiments of this application provide a galvanometer calibration method, device, program product, and laser processing method. First, when the galvanometer calibration plate is detected to be in the calibration station of the laser processing equipment, a reader on the laser processing equipment reads the non-volatile memory chip integrated on the galvanometer calibration plate to obtain management information of the galvanometer calibration plate, including used area information. Based on the used area information, at least one usable calibration area on the galvanometer calibration plate is determined. The laser processing equipment is then controlled to perform a galvanometer calibration operation based on any usable calibration area. Upon completion of the galvanometer calibration operation, the used area information stored in the non-volatile memory chip is updated via the reader. Thus, by reading the used area information stored in the chip on the galvanometer calibration plate, usable calibration areas are automatically determined, and the used area information is updated after calibration, ensuring that each galvanometer calibration is performed in the correct usable calibration area. This achieves automated management of the galvanometer calibration plate's usage status, reduces manual intervention, and significantly improves calibration accuracy and success rate.

[0034] To illustrate the technical solution of this application, specific embodiments are described below.

[0035] Specifically, Figure 1A schematic diagram of the structure of a laser processing device provided in an embodiment of this application is shown. Figure 1 As shown, the laser processing equipment includes: A laser is used to emit a laser beam; a beam control system, including a beam deflection mechanism, is used to transmit, control, and deflect the laser beam; a motion platform is used to support the workpiece to be processed or the galvanometer correction plate; and a reader / writer is used to read and write the non-volatile memory chip integrated on the galvanometer correction plate.

[0036] In this embodiment, the beam deflection mechanism is a galvanometer, also known as a galvanometric scanner or a high-speed scanning galvanometer system. It is a high-speed, high-precision beam deflection control device based on the galvanometer principle. Its core function is to achieve precise control of the laser beam direction through rapid and precise mechanical motion control methods such as the rapid and precise oscillation of the reflecting mirror.

[0037] In this embodiment, the aforementioned galvanometer calibration plate is a key tool for the precision calibration of the laser galvanometer system. The galvanometer calibration plate provides a precise reference matrix to detect and compensate for geometric distortions during galvanometer scanning, ensuring high precision in laser processing. The material is not limited; common materials include glass, ceramics, thermal paper, and various polymer materials. In high-precision applications, quartz glass or microcrystalline ceramics with low thermal expansion coefficients are often used, but these are costly.

[0038] In some embodiments of this application, the laser can be a solid-state laser (e.g., nanosecond laser, picosecond laser, femtosecond laser, etc.), a gas laser (e.g., a CO2 laser), or other types of lasers, and this application does not impose any limitations on this. A laser capable of providing suitable laser pulse wavelength and pulse frequency parameters can be selected according to processing requirements. The power, spot size, and pulse count of the laser beam emitted by the laser can all be set according to processing requirements.

[0039] exist Figure 1 Based on the structure of the laser processing equipment shown. Figure 2 A schematic flowchart of a galvanometer correction method provided in an embodiment of this application is shown. Figure 2 As shown, the galvanometer correction method may include the following steps: Step 201: When the galvanometer calibration plate is detected to be in the calibration position of the laser processing equipment, the non-volatile memory chip integrated on the galvanometer calibration plate is read by the reader on the laser processing equipment to obtain the management information of the galvanometer calibration plate, wherein the management information includes the information of the used area.

[0040] In this embodiment of the application, a non-volatile memory chip is integrated on the galvanometer calibration board, which is used to store relevant data of the galvanometer calibration board.

[0041] As one possible implementation, the non-volatile memory chip can be a radio frequency identification (RFID) chip, and correspondingly, the reader / writer on the laser processing equipment is an RFID reader / writer. The RFID reader / writer can be installed below or near the calibration plate placement position in the laser processing equipment to establish a contactless communication connection with the RFID chip, thereby enabling data reading and writing.

[0042] In some other implementations, the non-volatile memory chip can also be implemented using other contactless short-range communication technologies, such as Near Field Communication (NFC) tags, with the corresponding reader / writer being an NFC reader / writer. NFC technology, as a derivative application of RFID, is also applicable to the technical solution of this application. Furthermore, active electronic tags such as Bluetooth tags can be used, or memory chips with physical read / write contacts can be used to achieve data reading and writing through contact. It should be noted that while the solution using a QR code and camera can read information, it cannot achieve dynamic data writing and updating, and therefore cannot meet the requirement of real-time updating of used area information in this application, and is not considered a preferred solution.

[0043] For ease of explanation, the following descriptions will use RFID chips as an example.

[0044] In one embodiment, the RFID chip can be attached to the bottom surface of the galvanometer calibration plate, such as... Figure 3 As shown. Attaching the chip to the bottom surface avoids any potential impact on the laser processing area of ​​the calibration board surface, while the ample space on the bottom surface facilitates chip installation and fixation.

[0045] In other implementations, such as Figure 4 and Figure 5 As shown, the RFID chip can be attached to non-laser marking areas such as the upper edge of the galvanometer calibration plate to avoid affecting the laser processing in the calibration area. Attaching it to the upper edge facilitates operation when the chip is damaged or needs replacement, and because it is located in the edge area, it will not interfere with laser marking within the calibration area.

[0046] In some other implementations, such as Figure 6 As shown, in addition to being attached to the bottom or top edge of the galvanometer calibration plate, the RFID chip can also be attached to a corner area on the front of the galvanometer calibration plate. This corner area is located in the non-laser processing area of ​​the calibration plate, and is usually far away from the effective area for marking targets in the center of the calibration plate, so it will not interfere with laser marking or visual recognition during the calibration process.

[0047] In this embodiment, the management information of the galvanometer calibration board refers to data pre-stored in a non-volatile memory chip, used to describe the board's own attributes and usage status. This management information includes at least used area information. The used area information indicates which areas on the galvanometer calibration board have been used for galvanometer calibration operations; for example, it can be recorded using a used area identifier list or a used area count. Through the used area information, the system can accurately grasp the current usage status of the calibration board and avoid reusing the same area.

[0048] In some embodiments of this application, the management information may also include more data fields to support richer automated management functions. As an example, Table 1 shows the data structure that may be included in the RFID tag provided in the embodiments of this application.

[0049] Table 1

[0050] In this embodiment, some or all of the fields in the aforementioned management information can be pre-written into a non-volatile memory chip by the manufacturer when the galvanometer calibration plate leaves the factory. For example, information describing the inherent attributes of the calibration plate, such as product identification, material type, thickness, size, production date, and expiration date, is usually determined and written at the time of manufacture. Information such as the total number of usable areas and coordinate information can be calculated based on the physical dimensions of the calibration plate and the preset dimensions required for a single calibration, and then written. This will be explained in detail in subsequent embodiments. Dynamically changing usage status information, such as the used area count, last use timestamp, and machine number, is updated in real time by the laser processing equipment during the use of the calibration plate.

[0051] In this embodiment, the system can detect that the galvanometer calibration plate has been placed at the calibration station and is ready to start work in various ways. For example, it can be detected by a position sensor, manually triggered and confirmed by an operator through a human-machine interface, or continuously polled by an RFID reader; when the reader successfully reads a valid RFID tag, the calibration plate is considered to be in place. Preferably, automatic detection can be achieved by polling with an RFID reader: when the galvanometer calibration plate is placed at the calibration station, the distance between the RFID reader and the RFID chip is shortened to within communication range, and the reader can automatically identify and read the information in the chip without the need for additional sensors or manual operation.

[0052] Once the galvanometer calibration plate is detected in place, the system can automatically activate the RFID reader to read all the management information stored in the non-volatile memory chip. The read information is then transmitted to the system for use in subsequent steps.

[0053] In some embodiments of this application, for a new calibration board being used for the first time, its used area information may be in an initial state. For example, the used area count may be 0, or the used area list may be empty. In this case, the management information obtained in step 201 will serve as the initial basis for subsequent steps. For calibration boards that have already been used, their management information already includes usage records. For example, a used area count of 3 indicates that three areas have been used, and the last used area is recorded using a timestamp, while the machine number records which machines used each area. This information obtained in step 201 will reflect the current true state of the calibration board, providing an accurate basis for subsequent usable area determination, lifespan assessment, etc.

[0054] It should be noted that the above embodiments enable the automatic acquisition of the galvanometer calibration plate status without the need for manual review of paper records or manual input of parameters. This lays a data foundation for subsequent functions such as automatic planning of calibration areas, automatic configuration of process parameters, and automatic judgment of the calibration plate's effectiveness. It also avoids the problem of confusion in usage status caused by errors or omissions in manual recording.

[0055] Step 202: Based on the used area information, determine at least one available correction area on the galvanometer correction plate.

[0056] In this embodiment, the available calibration area refers to the blank area on the galvanometer calibration plate that has not yet been used for galvanometer calibration operations. Based on the used area information read in step 201, the system can accurately identify which areas have been occupied, thereby determining the set of currently available areas. Used area information can be recorded in various forms, such as a list of used area identifiers, a count of used areas combined with area arrangement rules, etc. Based on this information and a preset area division method, the system can calculate the currently available calibration area.

[0057] As one possible implementation, the galvanometer calibration board is divided into multiple preset calibration areas at the time of manufacture or upon first use. Each preset calibration area has unique coordinate information, which is stored as part of the management information in a non-volatile memory chip. For example, Figure 7 The illustration shows a schematic diagram of the processable area of ​​a galvanometer correction plate according to an embodiment of this application. The correction plate is divided into a grid-like area of ​​3 rows and 7 columns, with a total of 21 preset correction areas. Each area corresponds to a set of starting coordinates (such as the coordinates of the upper left corner) and area size. Each preset correction area contains a 2×2 dot matrix example, which is used for galvanometer correction. In practical applications, the number and arrangement of areas can be designed according to the size of the correction plate, the area required for a single correction, and the safety distance between adjacent areas, and are not limited to the 3×7 grid shown in the illustration.

[0058] In one embodiment, the management information also includes coordinate information of multiple preset correction areas on the galvanometer calibration plate. Step 202 may specifically include the following steps: filtering out unused preset correction areas from the coordinate information of the multiple preset correction areas based on the used area information; and determining the unused preset correction areas as available correction areas. Thus, by presetting the coordinate information of multiple correction areas in the management information and filtering out unused preset correction areas as available correction areas based on the used area information, the automatic identification and precise positioning of available correction areas are achieved, providing an accurate spatial basis for subsequent automated calibration.

[0059] It should be noted that the used area information can record the numbers or coordinates of the preset calibration areas that have already been used, for example, stored in the form of a bitmap or list. After reading this information, the system iterates through the coordinates of all preset calibration areas and filters out those areas that are not marked as used, as available calibration areas. This method is simple to implement, does not require dynamic calculation of area positions, and is suitable for calibration boards with fixed area divisions.

[0060] In one embodiment, before determining the available correction area, the system first needs to determine whether the galvanometer correction plate still has usable correction capability, i.e., whether there are unused correction areas. Specifically, the management information may also include the total number of available areas of the galvanometer correction plate and the count of used areas. Before step 202 above, if the count of used areas has reached the total number of available areas, the galvanometer correction operation can be stopped and a corresponding prompt message can be output. Thus, by reading the total number of available areas and the count of used areas of the correction plate, it is determined whether the area has been exhausted before correction is performed. If the area has been exhausted, the operation is stopped and a prompt is output, thereby avoiding the problems of correction failure or misuse of marked areas interfering with visual recognition due to the exhaustion of the physical area of ​​the correction plate.

[0061] It should be noted that the total number of available areas is a preset fixed value, calculated and written to the chip at the factory based on the calibration board size and the area required for a single calibration. The used area count increases with each calibration operation. When the used area count equals the total number of available areas, it indicates that all areas of the calibration board have been used up. Continuing to attempt calibration at this point will result in no available areas, and the system should promptly terminate the process and prompt the operator to replace the calibration board. This judgment step effectively avoids invalid operations or misuse of marked areas due to area exhaustion.

[0062] In another embodiment, the total number of usable areas of the calibration plate is not fixed, but can be dynamically calculated based on the actual process configuration during use. For example, different equipment may use different dimensions required for a single calibration, or operators may want to adjust the safety distance between areas to optimize utilization. Specifically, the management information also includes the available dimensions of the galvanometer calibration plate, the dimensions required for a single calibration, the safety distance between adjacent calibration areas, and the count of used areas. Before step 202 above, the total number of usable areas of the galvanometer calibration plate can be calculated based on the available dimensions of the galvanometer calibration plate, the dimensions required for a single calibration, and the safety distance between adjacent calibration areas. When the count of used areas reaches the total number of usable areas, the galvanometer calibration operation is stopped, and a corresponding prompt message is output. Thus, by reading the available dimensions of the calibration plate, the dimensions required for a single calibration, and the safety distance, the total number of usable areas is calculated, and the operation is stopped when the count of used areas reaches that number, thereby realizing the dynamic calculation of the total number of usable areas and the automatic determination of the lifespan.

[0063] It should be noted that the available dimensions refer to the total length and width of the effective area available for laser processing on the galvanometer calibration plate, which can be read from management information or obtained automatically by the vision system recognizing the boundaries. The dimensions required for a single calibration refer to the outer contour dimensions of the target array required to perform one galvanometer calibration, determined by the current galvanometer calibration process configuration. The safety distance is the minimum interval reserved to prevent the spread of heat-affected zones from adjacent areas or misjudgments during visual inspection. The system calculates the theoretical maximum number of reuses (i.e., the total number of available areas) according to the following formula: ; in, Indicates the total number of available zones; Indicates the length of the available dimensions; Indicates the width of the available dimensions; Indicates the length of the dimension required for a single calibration; Indicates the width required for a single calibration; Indicates a safe distance.

[0064] It should be understood that the above formula is an exemplary calculation method. In practical applications, the corresponding calculation formula can be adopted according to the arrangement direction (such as arrangement along only one direction, or two-dimensional array arrangement). The calculated total number of usable areas can be written into the non-volatile memory chip as part of the management information for subsequent lifetime determination. Through dynamic calculation, the calibration board can flexibly adjust the number of reuses under different equipment and process parameters, improving the applicability and utilization rate of the calibration board.

[0065] It should be noted that when there are multiple available calibration areas on the calibration plate, the available calibration areas determined in step 202 are a set containing multiple candidate areas. In some implementations, the process of determining available calibration areas can be combined with the area arrangement order, for example, using them sequentially from left to right or from top to bottom. In this case, the system can directly calculate the coordinates of the next area to be used based on the count of used areas. This sequential calculation method does not require storing a list of coordinates for all areas; it only needs to know the area arrangement rules and the count of used areas.

[0066] The above steps enable the automatic identification and determination of the usable area of ​​the galvanometer correction plate, providing an accurate basis for subsequent automatic movement to the target area and execution of correction, and avoiding errors that may be caused by manual searching and judgment.

[0067] Step 203: Control the laser processing equipment to perform galvanometer calibration operation based on any available calibration area.

[0068] In this embodiment, step 203 is the core execution step of galvanometer calibration. Based on the determination of at least one available calibration area in step 202, the system selects one as the target calibration area and controls the laser processing equipment to complete the laser marking and image acquisition processing required for calibration within that area, ultimately achieving error compensation for the galvanometer. Throughout the process, the system automatically completes a series of operations based on relevant parameters in the management information, without manual intervention.

[0069] In one embodiment, before performing the galvanometer calibration operation, it is also necessary to determine whether the galvanometer calibration plate has exceeded its shelf life (i.e., expiration date). Specifically, the management information also includes the expiration date of the galvanometer calibration plate. Based on the expiration date, it can be determined whether the current time has exceeded the expiration date. If the current time has exceeded the expiration date, the galvanometer calibration operation is stopped, and a corresponding prompt message is output. Thus, by reading the expiration date of the galvanometer calibration plate and determining whether it has expired before performing calibration, stopping the operation and outputting a prompt when it has expired, the expired calibration plate is automatically intercepted, preventing a decrease in calibration accuracy due to material aging.

[0070] It should be noted that the expiration date is the preset shelf life expiration date of the galvanometer calibration board at the factory, stored in a non-volatile memory chip. After reading the management information, the system obtains the current system time and compares it with the expiration date. If the current time is later than the expiration date, it indicates that the calibration board has exceeded its specified service life and may have problems such as material aging, moisture absorption, or oxidation. Continued use may lead to a decrease in calibration accuracy or even calibration failure. In this case, the system immediately terminates the calibration process and outputs a prompt message through the human-machine interface or indicator lights to remind the operator to replace the calibration board. This automatic verification mechanism effectively prevents quality risks caused by using expired calibration boards.

[0071] In one embodiment, step 203 may specifically include the following steps: determining a target correction area from at least one available correction area and obtaining the coordinate information corresponding to the target correction area; adjusting the position of the target correction area according to the coordinate information corresponding to the target correction area so that the target correction area is within the processing field of view of the laser processing equipment; and performing a galvanometer correction operation based on the target correction area after the target correction area is within the processing field of view. Thus, by determining the target correction area from the available correction areas and obtaining its coordinate information, and adjusting the position of the target correction area to be within the processing field of view, automatic and precise positioning of the correction area to the processing field of view is achieved, avoiding positioning errors introduced by manually moving the correction plate.

[0072] As a specific implementation method, the galvanometer correction plate can be moved from the correction station to the processing position by controlling the motion platform of the laser processing equipment, so that the center of the target correction area or a specific position is aligned with the center of the processing field of view of the laser processing equipment.

[0073] It should be noted that the calibration station described in the foregoing embodiments refers to the position where the galvanometer calibration plate is initially placed on the laser processing equipment, typically a fixed initial placement area on the equipment, used to complete the reading in step 201 and the area determination in step 202. The processing position, on the other hand, refers to the position where, after position adjustment, the target calibration area is precisely aligned with the processing field of view for the specific calibration operation to be performed.

[0074] As another specific implementation method, if the laser processing equipment has the ability to adjust the coordinate offset of the galvanometer, the origin of the processing coordinate system can be translated to the target correction area by adjusting the deflection angle of the galvanometer without moving the correction plate, thus achieving the positioning of the area. At this time, the correction station coincides with the processing position, and no physical movement is required.

[0075] In this embodiment, the selection of the target correction region can follow a preset order rule, such as using regions sequentially from smallest to largest according to their numbers, or using them one by one according to row and column order. The system can calculate the next region number to be used based on the count of already used regions and read the starting coordinates corresponding to that region from the management information. The processing field of view (FOV) refers to the effective area of ​​a single imaging operation by the vision system. Ensuring that the target correction region is completely within the FOV is crucial to avoid historical marking marks and the current target point appearing simultaneously in the FOV and interfering with image recognition. After the position adjustment is completed, the system continues to perform subsequent correction operations.

[0076] In one embodiment, the laser beam of the laser processing equipment can first be controlled to mark a preset target array based on any available calibration area, generating reference marks for galvanometer calibration; then, an image containing the reference marks is acquired, and galvanometer calibration is performed based on the image containing the reference marks. Thus, by controlling the laser beam to mark a preset target array within the available calibration area to generate reference marks, and acquiring images for galvanometer calibration, the specific implementation of the galvanometer calibration operation is completed, ensuring the automation and repeatability of the calibration process.

[0077] It should be noted that the preset target array refers to the array arranged according to certain rules (such as...). Figure 6 The 2×2 or 5×5 dot array shown in the diagram represents several tiny markers ablated or etched in the correction area. These markers serve as the spatial reference for the galvanometer correction. After the laser processing equipment marks the target array within the target correction area, it can use a vision system (e.g., a high-resolution camera) to capture images of the area containing all target points. The system analyzes the images, identifies the actual coordinates of each target point, compares them with the theoretical positions, and calculates the geometric distortion error during the galvanometer scanning process. Based on this error data, the system generates compensation parameters for the galvanometer, which are used to correct beam deflection in subsequent actual processing, thereby achieving high-precision processing.

[0078] In this embodiment of the application, before performing the galvanometer correction operation, the system can automatically configure appropriate laser process parameters and focal length position according to the material and thickness of the correction plate to ensure the consistency and accuracy of the correction effect.

[0079] In one embodiment, the management information may further include the material type of the galvanometer calibration plate. The galvanometer calibration operation may specifically include: matching the corresponding laser process parameters from a preset laser parameter library based on the material type; and performing the galvanometer calibration operation using the laser process parameters. Thus, by reading the material type of the calibration plate and matching the corresponding laser process parameters, and then performing the calibration operation using the matched parameters, automatic adaptation between the laser parameters and the calibration plate material is achieved, ensuring the consistency of the calibration effect and avoiding calibration errors caused by improper parameter settings.

[0080] It should be noted that different materials used for galvanometer calibration plates (such as ceramic, quartz, and gold-plated aluminum) exhibit varying characteristics in terms of laser absorption rate, thermal effect, and damage threshold. Therefore, different laser power, frequency, and scanning speed parameters are required for marking to obtain clear and accurate target points. The preset laser parameter library can be stored in the local memory of the laser processing equipment or in a non-volatile memory chip. After reading the material type, the system automatically searches the parameter library, matches the most suitable process parameters for the current material, and applies them to the target marking process. This process is fully automated, avoiding errors that may arise from manual parameter selection, and also improving calibration efficiency and consistency.

[0081] In one embodiment, the management information may further include the thickness of the galvanometer calibration plate. Before performing the galvanometer calibration operation, the target position coordinates (i.e., Z-axis coordinates) of the motion platform of the laser processing equipment in the direction perpendicular to the processing surface of the galvanometer calibration plate can be determined based on the thickness of the galvanometer calibration plate. The motion platform is then controlled to move to the target position coordinates so that the focal point of the laser beam from the laser processing equipment is located on the processing surface of the galvanometer calibration plate. Thus, by reading the thickness of the calibration plate and determining the target position coordinates of the motion platform in the direction perpendicular to the processing surface, and controlling the platform to move to that position so that the focal point of the laser beam is located on the processing surface of the calibration plate, laser focusing accuracy is ensured, eliminating the need for manual focusing.

[0082] It should be noted that laser processing typically requires the laser beam to be precisely focused on the workpiece surface to achieve optimal energy density and processing accuracy. Since different calibration plates have varying thicknesses, using a fixed Z-axis position may cause the focus to deviate from the processing surface, affecting the quality of the target points. Therefore, based on the thickness information, the required Z-axis offset can be calculated, and the motion platform (or a dedicated Z-axis drive mechanism) can be controlled to move up and down in a direction perpendicular to the processing surface, ensuring that the processing surface of the calibration plate is precisely at the focal plane. It should be understood that the above focusing process can be completed after moving to the target calibration area but before marking, ensuring that the laser beam is marked in the optimal focused state.

[0083] In this embodiment, the multiple automated configurations involved in step 203 (such as material matching and thickness focusing) can be executed in parallel or sequentially, which together ensure the accuracy and reliability of the galvanometer calibration operation. Through step 203, this embodiment achieves full-process automation from area positioning and parameter configuration to calibration execution, significantly reducing manual intervention and improving calibration efficiency and consistency.

[0084] Step 204: After the galvanometer calibration operation is completed, update the used area information stored in the non-volatile memory chip through the reader / writer.

[0085] In this embodiment, step 204 is the closed-loop step of the entire galvanometer calibration method. After the galvanometer calibration operation in step 203 is successfully completed, the system needs to write back the state changes generated during this use to the non-volatile memory chip of the galvanometer calibration board in real time to ensure that the management information of the calibration board remains up-to-date and accurate. This update operation is fundamental to ensuring the traceability of the calibration board and its subsequent automated use, making the calibration board itself a data carrier carrying complete usage records, so that its historical state can still be checked even when it is removed from a specific device or network environment.

[0086] This involves establishing a communication connection with a non-volatile memory chip via a reader / writer to write updated data to a designated storage area of ​​the chip. The written data includes at least updates to information about used areas, such as marking the target calibration area that has just been calibrated as "used" and incrementing the used area count accordingly.

[0087] In one embodiment, step 204 may specifically include the following steps: writing the used area identifier corresponding to the galvanometer calibration operation, the device identifier that performed the galvanometer calibration operation, and the timestamp of the galvanometer calibration operation into a non-volatile memory chip. Thus, by writing the used area identifier, device identifier, and timestamp into the non-volatile memory chip, a detailed record of the calibration board's usage is established, providing a data foundation for subsequent usage status queries, historical tracing, and cross-device information synchronization.

[0088] It should be noted that the used area identifier is used to uniquely identify the calibration area used in this calibration, and can be in the form of area number, area coordinates, or area name. The device identifier is used to record which laser processing equipment performed this calibration, facilitating subsequent tracking of the use of the same calibration board by different equipment. The timestamp records the precise time of completion of this calibration, providing data support for condition analysis and lifetime prediction. By writing this multi-dimensional information, a complete calibration board usage log is accumulated in the non-volatile memory chip, recording in detail the time, equipment, and specific area of ​​each calibration.

[0089] In some embodiments of this application, the update operation may also include writing the result data of this calibration, such as the error value of the galvanometer calibration, compensation parameters, and calibration quality evaluation. This data can serve as evidence of the calibration plate's effectiveness and can also be used for subsequent analysis of equipment status or calibration plate performance degradation trends. For example, if the error value of a certain calibration is abnormally large, it may indicate that the calibration plate is nearing the end of its lifespan or that the equipment needs maintenance.

[0090] In this embodiment, after updating the used area information, the system can also synchronize the updated data to the central database on the network side as needed to achieve full lifecycle traceability across devices and factories. Specifically, while updating the RFID chip locally, the laser processing equipment can upload the calibration record (including used area identifier, equipment identifier, timestamp, error value, etc.) to the central server via the network. The central database aggregates the usage data of all calibration boards, forming a complete traceability archive, supporting functions such as remote query, statistical analysis, and lifespan warning. This extended solution is particularly suitable for smart factory environments with networked management.

[0091] In one embodiment of this application, the galvanometer calibration board can be used for galvanometer calibration operations on multiple laser processing devices. For example, after a calibration board completes a calibration on one device, the used area information in its non-volatile memory chip is immediately updated. Subsequently, the calibration board can be transferred to another laser processing device for continued use. After reading the chip information, the second device can accurately determine which areas are occupied, and thus select the next available area from the unused areas for calibration. This cross-machine relay mode allows a calibration board to circulate among multiple devices until all areas are used up, greatly improving the utilization rate of the calibration board and reducing usage costs. At the same time, since all usage records are stored inside the chip, even in an environment without network connectivity, the status information of the calibration board remains complete and traceable, providing a convenient management solution that does not require the construction of an expensive Manufacturing Execution System (MES).

[0092] It should be noted that the above steps enable real-time updating and persistent storage of the galvanometer calibration plate's usage status, closing the loop of the automated "read-confirm-execute-update" process and ensuring the accuracy and traceability of the calibration plate's status information throughout its entire lifecycle.

[0093] The galvanometer calibration method disclosed in the above embodiments of this application firstly, when the galvanometer calibration plate is detected to be in the calibration station of the laser processing equipment, reads the non-volatile memory chip integrated on the galvanometer calibration plate through a reader / writer on the laser processing equipment to obtain the management information of the galvanometer calibration plate, wherein the management information includes used area information; based on the used area information, at least one available calibration area on the galvanometer calibration plate is determined; the laser processing equipment is controlled to perform a galvanometer calibration operation based on any available calibration area; when the galvanometer calibration operation is completed, the used area information stored in the non-volatile memory chip is updated through the reader / writer. Thus, by reading the used area information stored in the chip on the galvanometer calibration plate, the available calibration area is automatically determined and the used area information is updated after calibration, thereby ensuring that each galvanometer calibration is performed in the correct available calibration area, realizing automated management of the galvanometer calibration plate's usage status, reducing manual intervention, and significantly improving calibration accuracy and calibration success rate.

[0094] Based on the aforementioned embodiments, Figure 8 A schematic flowchart of a laser processing method is shown. Figure 8 As shown, the laser processing method may include the following steps: Step 801: The galvanometer is calibrated using the galvanometer calibration method described in the previous embodiment.

[0095] The specific implementation process and principle of step 801 above can be found in the detailed description of the above embodiments, and will not be repeated here.

[0096] Step 802: Laser processing is performed on the workpiece to be processed using a calibrated galvanometer.

[0097] In this embodiment, by using the aforementioned automated galvanometer calibration method to calibrate the galvanometer, the scanning accuracy of the galvanometer system is ensured to be in the optimal state. Then, the workpiece to be processed is processed based on the calibrated galvanometer, which can significantly improve the quality and consistency of laser processing and avoid processing defects caused by galvanometer errors. At the same time, the entire calibration process is highly automated and requires no manual intervention, which improves the overall operating efficiency and intelligence level of the laser processing equipment.

[0098] Figure 9 This is a schematic diagram of the structure of the electronic device provided in an embodiment of this application. For example... Figure 9 As shown, the electronic device 900 of this embodiment includes: at least one processor 910 ( Figure 9 The diagram shows only one processor, a memory 920, and a computer program 921 stored in the memory 920 and executable on the at least one processor 910, wherein the processor 910 executes the computer program 921 to implement the steps in the above-described laser processing method embodiments.

[0099] The electronic device 900 can be a desktop computer, laptop, handheld computer, cloud server, or other computing device. This electronic device may include, but is not limited to, a processor 910 and a memory 920. Those skilled in the art will understand that... Figure 9 This is merely an example of electronic device 900 and does not constitute a limitation on electronic device 900. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, etc.

[0100] The processor 910 may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0101] In some embodiments, the memory 920 may be an internal storage unit of the electronic device 900, such as a hard disk or memory of the electronic device 900. In other embodiments, the memory 920 may be an external storage device of the electronic device 900, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the electronic device 900. Furthermore, the memory 920 may include both internal and external storage units of the electronic device 900. The memory 920 is used to store the operating system, applications, boot loader, data, and other programs, such as the program code of the computer program. The memory 920 can also be used to temporarily store data that has been output or will be output.

[0102] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0103] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0104] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0105] In the embodiments provided in this application, it should be understood that the disclosed devices / electronic devices and methods can be implemented in other ways. For example, the device / electronic device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual couplings or direct couplings or communication connections may be through some interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0106] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0107] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0108] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0109] The implementation of all or part of the processes in the methods of the above embodiments can also be accomplished by a computer program product. When the computer program product is run on an electronic device, the electronic device can implement the steps in the various method embodiments described above.

[0110] The embodiments described above are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A galvanometer calibration method, characterized in that, include: When the galvanometer calibration plate is detected to be in the calibration position of the laser processing equipment, the non-volatile memory chip integrated on the galvanometer calibration plate is read by the reader on the laser processing equipment to obtain the management information of the galvanometer calibration plate, wherein the management information includes information on the used area; Based on the used area information, at least one available correction area on the galvanometer correction plate is determined; The laser processing equipment is controlled to perform a galvanometer calibration operation based on any of the available calibration areas; Once the galvanometer calibration operation is completed, the used area information stored in the non-volatile memory chip is updated via the reader / writer.

2. The method according to claim 1, characterized in that, The management information also includes coordinate information of multiple preset correction areas on the galvanometer calibration plate; determining at least one usable correction area on the galvanometer calibration plate based on the used area information includes: From the coordinate information of the plurality of preset correction regions, unused preset correction regions are filtered out based on the used region information; The unused preset correction area is determined as the available correction area.

3. The method according to claim 2, characterized in that, The control of the laser processing equipment to perform galvanometer calibration operations based on any of the available calibration regions includes: Determine the target correction region from the at least one available correction region, and obtain the coordinate information corresponding to the target correction region; Based on the coordinate information corresponding to the target correction area, the position of the target correction area is adjusted so that the target correction area is within the processing field of view of the laser processing equipment; After the target correction area is located within the processing field of view, the galvanometer correction operation is performed based on the target correction area.

4. The method according to claim 1, characterized in that, The control of the laser processing equipment to perform galvanometer calibration operations based on any of the available calibration regions includes: Based on any of the available correction regions, the laser beam of the laser processing equipment is controlled to mark according to a preset target array to generate reference marks for galvanometer correction. An image containing the reference markers is acquired, and galvanometer correction is performed based on the image containing the reference markers.

5. The method according to claim 1, characterized in that, The management information also includes the validity period of the galvanometer calibration plate; before controlling the laser processing equipment to perform galvanometer calibration operation based on any of the available calibration areas, the method further includes: Based on the validity period, determine whether the current time has exceeded the validity period; If the current time exceeds the validity period, the galvanometer calibration operation will be stopped and a corresponding prompt message will be output.

6. The method according to claim 1, characterized in that, The management information also includes the total number of available areas and the count of used areas on the galvanometer correction plate; before determining at least one available correction area on the galvanometer correction plate based on the used area information, the method further includes: If the count of used areas has reached the total number of available areas, the galvanometer calibration operation is stopped and a corresponding prompt message is output.

7. The method according to claim 1, characterized in that, The management information also includes the available dimensions of the galvanometer calibration plate, the dimensions required for a single calibration, the safety distance between adjacent calibration areas, and the count of used areas; before determining at least one available calibration area on the galvanometer calibration plate based on the used area information, the method further includes: The total number of usable areas of the galvanometer correction plate is calculated based on the available size of the galvanometer correction plate, the size required for a single correction, and the safety distance between adjacent correction areas. If the count of used areas has reached the total number of available areas, the galvanometer calibration operation is stopped and a corresponding prompt message is output.

8. The method according to claim 1, characterized in that, The management information also includes the material type of the galvanometer calibration plate; the execution of the galvanometer calibration operation includes: Based on the material type, the corresponding laser process parameters are matched from a preset laser parameter library; The galvanometer calibration operation is performed using the laser process parameters.

9. The method according to claim 1, characterized in that, The management information also includes the thickness of the galvanometer calibration plate; before performing the galvanometer calibration operation, the method further includes: Based on the thickness of the galvanometer correction plate, determine the target position coordinates of the motion platform of the laser processing equipment in the direction perpendicular to the processing surface of the galvanometer correction plate; The motion platform is controlled to move to the target position coordinates so that the focal point of the laser beam of the laser processing equipment is located on the processing surface of the galvanometer correction plate.

10. The method according to claim 1, characterized in that, The step of updating the used area information stored in the non-volatile memory chip via the reader / writer includes: The used area identifier corresponding to the galvanometer calibration operation, the device identifier that performed the galvanometer calibration operation, and the timestamp of the galvanometer calibration operation are written into the non-volatile memory chip.

11. The method according to any one of claims 1-10, characterized in that, The galvanometer calibration plate is used for galvanometer calibration operations on multiple laser processing equipment.

12. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 11.

13. A computer program product, characterized in that, The computer program product includes a computer program that, when run on an electronic device, causes the electronic device to perform the method as described in any one of claims 1 to 11.

14. A laser processing method, characterized in that, This includes calibrating the galvanometer using the method described in any one of claims 1-11; Laser processing is performed on the workpiece by calibrating the galvanometer.

15. A laser processing device, characterized in that, include: A laser, used to emit a laser beam; A beam control system, which includes a beam deflection mechanism, is used to transmit, control, and deflect a laser beam. Motion platform, used to support the workpiece to be processed or the galvanometer correction plate; A reader / writer that reads and writes to the non-volatile memory chip integrated on the galvanometer correction board.

Images