Deflection correction apparatus, semiconductor device handling apparatus, semiconductor device testing apparatus, and bridge beam

Abstract

A semiconductor device testing apparatus (1A) comprises: a bridge beam (50A) that includes a beam-shaped main body unit (51), to which a probe card (20) is attached, and a pressing apparatus (60), which presses the probe card (20); a displacement meter (90) that detects a first deflection amount (De1) of the main body unit (51); and a handler control apparatus (35A) that controls the pressing apparatus (60) so as to correct a second deflection amount (De2) of the probe card (20) on the basis of the first deflection amount (De1).

Description

Deflection correction device, semiconductor device handling device, semiconductor device testing device, and bridge beam

[0001] The present invention relates to a deflection correction device, a semiconductor device handling device, a semiconductor device testing device, and a bridge beam.

[0002] In the field of semiconductor testing, a test system is known that comprises a probe card, a prober connected to the probe card, and a tester electrically connected to the prober (see, for example, Patent Document 1).

[0003] This probe includes a head plate and a bridge beam (see Patent Document 1 (paragraph

[0018] and Figure 1)), and a probe card is attached to this bridge beam via contact tabs (see Patent Document 1 (paragraph

[0027] and Figures 6A, 6B, 8A, and 8B)).

[0004] Japanese Patent Publication No. 2024-152593

[0005] In the test system described above, when testing a semiconductor device, the semiconductor device is pressed against a probe card, causing the terminals of the semiconductor device to come into contact with the contactor on the probe card.

[0006] However, the pressure applied to the probe card can cause it to bend, which can lead to poor contact between the terminal and the contactor.

[0007] The problem that the present invention aims to solve is to provide a deflection correction device, a semiconductor device handling device, a semiconductor device testing device, and a bridge beam that can improve the contact stability between terminals and contactors.

[0008] [1] Aspect 1 of the present invention is a deflection correction device comprising a beam-shaped main body to which a probe card is attached, a first pressing device for pressing the probe card, a bridge beam mounted on a semiconductor device handling device, a detection unit for detecting a first deflection amount of the main body, and a control device for controlling the first pressing device to correct a second deflection amount of the probe card based on the first deflection amount detected by the detection unit.

[0009] [2] Aspect 2 of the present invention is a deflection correction device according to Aspect 1, wherein the detection unit may include a displacement meter for measuring the first deflection amount.

[0010] [3] Aspect 3 of the present invention is a deflection correction device according to Aspect 2, wherein the displacement meter is provided so as to face the main body on a test head to which the probe card is electrically connected, and may be a deflection correction device for measuring a displacement amount of the main body.

[0011] [4] Aspect 4 of the present invention is a deflection correction device according to Aspect 2, wherein the displacement meter is provided on the main body so as to face a test head to which the probe card is electrically connected, and may be a deflection correction device for measuring a displacement amount of the main body.

[0012] [5] Aspect 5 of the present invention is a deflection correction device according to Aspect 1, wherein the detection unit may include a load cell for detecting a load applied to the main body, and a first estimation unit for estimating the first deflection amount based on the load detected by the load cell.

[0013] [6] Aspect 6 of the present invention is a deflection correction device according to Aspect 5, wherein the control device further includes a calculation unit for calculating a correction amount based on the first deflection amount estimated by the first estimation unit, the first estimation unit stores a correlation between the load applied to the main body and the first deflection amount, and further includes a storage unit for outputting the first deflection amount corresponding to the load detected by the load cell to the calculation unit

[0014] [7] Aspect 7 of the present invention is the deflection correction device of Aspect 1, wherein the semiconductor device handling device includes a second pressing device that presses the semiconductor device toward the probe card, and the second pressing device includes a holding portion that holds the semiconductor device and a motor as a driving source, and a first driving portion that moves the holding portion toward the probe card. The detection portion may include a torque detection portion that detects the torque of the motor and a second estimation portion that estimates the first deflection amount based on the torque detected by the torque detection portion.

[0015] [8] Aspect 8 of the present invention is the deflection correction device of Aspect 7, wherein the control device further includes a calculation portion that calculates a correction amount based on the first deflection amount estimated by the second estimation portion. The second estimation portion further includes a storage portion that stores the correlation between the torque and the first deflection amount and outputs the first deflection amount corresponding to the torque detected by the torque detection portion to the calculation portion.

[0016] [9] Aspect 9 of the present invention is the deflection correction device of Aspect 1, wherein the detection portion includes a strain gauge provided on the main body portion and having an electrical resistance value that changes according to the first deflection amount, and a third estimation portion that estimates the first deflection amount based on the electrical resistance value of the strain gauge.

[0017]

[10] Aspect 10 of the present invention is the deflection correction device of Aspect 9, wherein the control device further includes a calculation portion that calculates a correction amount based on the first deflection amount detected by the third estimation portion. The third estimation portion further includes a storage portion that stores the correlation between the electrical resistance value and the first deflection amount and outputs the first deflection amount corresponding to the electrical resistance value detected by the strain gauge to the calculation portion.

[0018]

[11] Embodiment 11 of the present invention is a deflection correction device according to any of embodiments 1 to 10, wherein the deflection correction device further comprises a calculation unit that calculates a correction amount based on the first deflection amount detected by the detection unit, the first pressing device comprises a pressing unit that presses the probe card and a second drive unit that moves the pressing unit toward the probe card, and the control device is a deflection correction device that controls the second drive unit so that the second drive unit moves the pressing unit by a correction amount in the pressing direction.

[0019]

[12] Embodiment 12 of the present invention is a deflection correction device of Embodiment 11 in which the second drive unit is a piezo actuator that can expand and contract in response to the applied voltage.

[0020]

[13] Aspect 13 of the present invention is a deflection correction device according to aspect 11, wherein the second drive unit includes a wedge portion having an inclined surface that contacts the pressing portion, and a third drive unit that moves the wedge portion in a direction perpendicular to the pressing direction.

[0021]

[14] Embodiment 14 of the present invention is a deflection correction device according to any of embodiments 1 to 13, wherein the first pressing device is a deflection correction device arranged on the main body so as to contact the central part of the probe card.

[0022]

[15] Embodiment 15 of the present invention is a deflection correction device according to any of embodiments 1 to 14, wherein the first pressing device is a deflection correction device fixed to the main body so as to be interposed between the main body and the probe card.

[0023]

[16] Embodiment 16 of the present invention is a semiconductor device handling apparatus for handling a semiconductor device, comprising a deflection correction device according to any of embodiments 1 to 15 and a second pressing device for pressing the semiconductor device toward the probe card.

[0024]

[17] Embodiment 17 of the present invention is a semiconductor device testing apparatus for testing a semiconductor device, comprising: a semiconductor device handling apparatus according to Embodiment 16; a probe card; and a test head electrically connected to the probe card and performing testing of the semiconductor device.

[0025]

[18] Embodiment 18 of the present invention is a bridge beam to be mounted on a semiconductor device handling apparatus, the bridge beam comprising a beam-shaped main body to which probe cards are attached, and a first pressing device provided on the main body, which presses the probe cards in order to correct a second amount of deflection of the probe cards based on a first amount of deflection of the main body when deflection occurs in the main body.

[0026]

[19] Aspect 19 of the present invention is a bridge beam according to aspect 18, wherein the bridge beam is a bridge beam equipped with a measuring unit for measuring the first amount of deflection or for measuring a physical quantity that changes according to the first amount of deflection.

[0027] In this invention, the second deflection amount of the probe card can be corrected based on the first deflection amount of the beam-shaped main body of the bridge beam mounted on the semiconductor device handling apparatus, thereby improving the contact stability between the terminals of the semiconductor device and the contactor of the probe card.

[0028] Figure 1 is a schematic side view showing a semiconductor device testing apparatus in the first embodiment of the present invention, showing the state before the DUT is pressed against the probe card. Figure 2 is a schematic side view showing a semiconductor device testing apparatus in the first embodiment of the present invention, showing the state after the DUT has been pressed against the probe card. Figure 3 is a schematic block diagram of a semiconductor device testing apparatus in the first embodiment of the present invention. Figures 4(a) and 4(b) are cross-sectional views for explaining the pressing operation by the pressing device in the first embodiment of the present invention, where Figure 4(a) shows a state in which there is no deflection in the main body of the bridge beam, and Figure 4(b) shows a state in which there is deflection in the main body of the bridge beam. Figures 5(a) and 5(b) are cross-sectional views for explaining the pressing operation by the pressing device in a modified example of the first embodiment of the present invention, where Figure 5(a) shows a state in which there is no deflection in the main body of the bridge beam, and Figure 5(b) shows a state in which there is deflection in the main body of the bridge beam. Figure 6 is a flowchart explaining the method for correcting the second deflection amount of the probe card in the first embodiment of the present invention. Figure 7 is a schematic side view showing a semiconductor device test apparatus in a comparative example, showing the DUT pressed against the probe card. Figure 8 is a schematic side view showing a semiconductor device test apparatus in a modified example of the first embodiment of the present invention, showing the state before the DUT is pressed against the probe card. Figure 9 is a schematic side view showing a semiconductor device test apparatus in a second embodiment of the present invention, showing the state before the DUT is pressed against the probe card. Figure 10 is a schematic block diagram of the semiconductor device test apparatus in the second embodiment of the present invention. Figure 11 is a schematic side view showing a semiconductor device test apparatus in a third embodiment of the present invention, showing the state before the DUT is pressed against the probe card. Figure 12 is a schematic block diagram of the semiconductor device test apparatus in the third embodiment of the present invention.

[0029] Embodiments of the present invention will be described below with reference to the drawings.

[0030] <First Embodiment>

[0031] Figure 1 is a schematic side view of the semiconductor device testing apparatus 1A in the first embodiment, showing the state before the DUT 100 is pressed against the probe card 20. Figure 2 is a schematic side view of the semiconductor device testing apparatus 1A in the first embodiment, showing the state after the DUT 100 has been pressed against the probe card 20. Figure 3 is a schematic block diagram of the semiconductor device testing apparatus 1A in the first embodiment.

[0032] As shown in Figure 1, the semiconductor device testing apparatus 1A in this embodiment is a device for testing the electrical characteristics of the DUT 100. The semiconductor device testing apparatus 1A brings the terminals 101 of the DUT 100 into contact with the probes 23 of the probe card 20, and then performs the test on the DUT 100.

[0033] DUT100 is, for example, a bare die (bare chip) that has been separated into individual pieces by dicing a semiconductor wafer. Alternatively, DUT100 may be a chip fabricated on the semiconductor wafer before dicing. DUT100 corresponds to an example of a "semiconductor device" in the embodiment of the present invention. In this embodiment, for convenience, the case of testing one bare die is illustrated, but multiple bare dies may be tested simultaneously.

[0034] This semiconductor device testing apparatus 1A comprises a test head 10, a probe card 20, a handler 30, a bridge beam 50A, and a displacement meter 90. The handler 30 corresponds to an example of a "semiconductor device handling apparatus" in an embodiment of the present invention.

[0035] The test head 10 is a device that transmits test signals from the mainframe (not shown) to the DUT 100. The test head 10 is electrically connected to the probe card 20 via a cable or the like.

[0036] The probe card 20 enters the inside of the handler 30 through an opening 331 formed in the upper base 33 of the handler 30. The probe card 20 is fixed to the handler 30 via a bridge beam 50A.

[0037] The probe card 20 comprises a wiring board 21, a frame 22, and a plurality of probes 23. The wiring board 21 is a printed circuit board. This wiring board 21 is held in a frame-shaped frame 22. The frame 22 has a first fixing part 221. This first fixing part 221 is connected to a second fixing part 511 of the main body 51 of the bridge beam 50A, fixing the wiring board 21 to the bridge beam 50A.

[0038] The first and second fixing parts 221 and 511 are not particularly limited, but may be cam mechanisms. For example, the second fixing part 511 may be a cylindrical cam with a groove, and the first fixing part 221 may be a cam follower that follows the groove. Alternatively, the first and second fixing parts 221 and 511 may be fixed by fastening with bolts or the like.

[0039] The probe 23 is an electrical probe that contacts the terminal 101 of the DUT 100. Multiple probes 23 are electrically connected to the wiring board 21 and are arranged on the wiring board 21 to correspond to the multiple terminals 101 of the DUT 100.

[0040] While not particularly limited, specific examples of the probe 23 include, for example, a pogo pin, a vertical probe needle, a cantilever-type probe needle, an anisotropic conductive rubber sheet, a bump provided on a membrane, or a probe manufactured using MEMS technology.

[0041] The handler 30 comprises a lower base 31, an outer frame 32, an upper base 33, a support frame 34, a handler control device 35A, and a conveying device 40. The lower base 31 supports the outer frame 32, the support frame 34, and the conveying device 40. The outer frame 32 is erected on the lower base 31, and the upper base 33 is provided on the outer frame 32. The upper base 33 has an opening 331, through which the bridge beam 50A is supported by the support frame 34.

[0042] The support frame 34 is erected on the lower base 31 and supports the bridge beam 50A. Although not particularly limited, the support frame 34 may be equipped with an angle adjustment mechanism to adjust the inclination angle of the bridge beam 50A with respect to the horizontal plane in order to position the bridge beam 50A horizontally. This angle adjustment device can be used to adjust the parallelism between the probe 23 and the DUT 100. Alternatively, the angle adjustment device may adjust the parallelism between the probe 23 and the holding part 41 (described later).

[0043] The handler control device 35A controls the drive of the transport device 40. This handler control device 35A is composed of a processing unit equipped with a CPU, ROM, RAM, and an input / output interface, etc. The handler control device 35A corresponds to an example of a "control device" in an embodiment of the present invention.

[0044] As shown in Figure 3, the handler control device 35A includes a calculation unit 36, a first control unit 37, and a second control unit 38. The calculation unit 36 ​​calculates a correction amount C based on the measurement value of the displacement meter 90. In this embodiment, the correction amount C is the first deflection amount De of the main body 51 of the bridge beam 50A, which will be described later. １ It is approximately the same quantity as (C = De １ The calculation unit 36 ​​outputs this correction amount C to the first control unit 37.

[0045] The first control unit 37 controls the drive of the second drive unit 64 of the pressing device 60 of the bridge beam 50A. Specifically, as shown in Figures 1 and 2, the first control unit 37 controls the second drive unit 64 to move the pressing unit 62 (see Figures 4(a) and 4(b)) in the -Z direction by the correction amount described above. As will be described later, the pressing device 60 in this embodiment is a piezo actuator device, so the first control unit 37 is not particularly limited, but is a piezo drive circuit that controls the operation of multiple piezo elements 65 included in the piezo actuator device.

[0046] As shown in Figure 3, the second control unit 38 controls the drive of the motor 421 of the first drive unit 42 of the transport device 40. Specifically, as shown in Figures 1 and 2, the second control unit 38 controls the first drive unit 42 to move the holding unit 41 (see Figures 1 and 2) in the +Z direction. This second control unit 38 is, for example, a motor drive circuit, although it is not particularly limited.

[0047] As shown in Figure 1, the conveying device 40 is a device that holds the DUT 100 and conveys (handles) the DUT 100. This conveying device 40 comprises a holding unit 41 and a first drive unit 42. The DUT 100 is placed on the holding unit 41, and the holding unit 41 holds the DUT 100. The conveying device 40 corresponds to an example of the "second pressing device" in an embodiment of the present invention.

[0048] The first drive unit 42 can move in the X, Y, and Z directions in the figure, and can also rotate around the Z axis. The first drive unit 42 is installed on the lower base 31 such that the holding part 41 faces the probe 23 of the probe card 20 in the Z axis direction in the figure. As shown in Figure 2, when the first drive unit 42 raises the holding part 41 (moves in the +Z direction), the terminal 101 of the DUT 100 comes into contact with the probe 23.

[0049] As shown in Figure 3, the first drive unit 42 includes a motor 421 and a conversion mechanism (not shown). The conversion mechanism is a mechanism that converts the rotational motion of the motor 421 into linear motion along the Z direction, and is not particularly limited, but may be a ball screw mechanism or the like.

[0050] As shown in Figure 1, the bridge beam 50A is mounted on the handler 30. This bridge beam 50A is fixed on the support frame 34 so as to be located within the opening 331 of the upper base 33. The bridge beam 50A is fixed to the upper surface of the support frame 34 by bolts (not shown), although this is not particularly limited. The bridge beam 50A is also spanned across the upper side of the opening 341 of the support frame 34.

[0051] As described above, the probe card 20 is attached to this bridge beam 50A. As shown in Figure 2, the bridge beam 50A is a beam member that applies a reaction force to the probe card 20 in order to counteract the pressing force from the conveying device 40 when the DUT 100 is pressed against the probe card 20 by the conveying device 40.

[0052] As shown in Figures 1 and 2, the bridge beam 50A comprises a main body 51 and a pressing device 60. The main body 51 is a beam-shaped member that spans the support frame 34. Although not particularly limited, the main body 51 is made of a metal material and has higher rigidity than the probe card 20. As shown in Figure 2, the main body 51 flexes in the +Z direction because the pressing force from the transport device 40 is transmitted via the probe card 20.

[0053] The pressing device 60 is positioned so as to be sandwiched between the lower surface 51a of the main body 51 and the upper surface 21a of the wiring board 21. The pressing device 60 is positioned on the main body 51 so as to contact the central part of the probe card 20. Alternatively, the pressing device 60 may be positioned on the main body 51 so as to contact a part of the probe card 20 other than the central part.

[0054] This pressing device 60 can press the wiring board 21 of the probe card 20 downward (in the -Z direction). When the DUT 100 is pressed against the probe card 20, the pressing device 60 presses the probe card 20 from the opposite side of the DUT 100, thereby reducing the second amount of deflection De that occurs in the probe card 20. ２ This corrects the second deflection amount De ２ Reduce or offset.

[0055] Figures 4(a) and 4(b) are cross-sectional views illustrating the pressing operation by the pressing device 60 in the first embodiment. Figure 4(a) shows a state in which there is no deflection in the main body 51 of the bridge beam 50A, and Figure 4(b) shows a state in which deflection occurs in the main body 51 of the bridge beam 50A.

[0056] As shown in Figures 4(a) and 4(b), the pressing device 60 in this embodiment is not particularly limited, but is a so-called piezo actuator device. The piezo actuator (second drive unit 64) included in the piezo actuator device can adjust the pressing force with great precision, making it possible to adjust the pressing force applied to the probe card 20 with high accuracy. The pressing device 60 corresponds to an example of the "first pressing device" in the embodiment of the present invention.

[0057] The pressing device 60 includes a fixing part 61, a pressing part 62, a case 63, a second drive part 64, and an elastic body 66. The fixing part 61 is a plate-shaped member fixed to the lower surface 51a of the main body 51 of the bridge beam 50A. The fixing part 61 is not particularly limited, but is fixed to the main body 51 by bolts or the like (not shown).

[0058] On the other hand, the pressing portion 62 is in contact with the upper surface 21a of the wiring board 21 of the probe card 20. While the aforementioned fixing portion 61 is fixed to the main body portion 51, this pressing portion 62 can move relative to the main body portion 51. Specifically, the pressing portion 62 can move up and down along the Z direction in the figure.

[0059] Case 63 constitutes the housing of the pressing device 60. This case 63 houses a part of the pressing section 62, a second drive section 64, and an elastic body 66. Inside this case 63, the second drive section 64 is interposed between the fixed section 61 and the pressing section 62.

[0060] In this embodiment, the second drive unit 64 is a piezoelectric actuator. This second drive unit 64 includes a plurality of piezoelectric elements 65 (eight in this example). The plurality of piezoelectric elements 65 are stacked along the Z direction in the figure. Each piezoelectric element 65 is connected to an electrode (not shown), and a voltage is applied to it from the first control unit (see Figure 3) 37 via this electrode. The piezoelectric elements 65 can expand and contract along the Z direction in response to the voltage applied from the first control unit 37. The expansion and contraction of the piezoelectric elements 65 can adjust the pressing force applied to the probe card 20 from the pressing unit 62. For example, in the pressing device 60 in Figure 4(b), the pressing force is increased by expanding the piezoelectric elements 65 by applying a voltage higher than the voltage applied to the piezoelectric elements 65 in Figure 4(a). Therefore, although the bridge beam 50A in Figure 4(b) is deflected, the probe card 20 does not deflect in accordance with this deflection of the bridge beam 50A and is not deflected.

[0061] The elastic body 66 is housed inside the case 63 and interposed between the case 63 and the second drive unit 64. The elastic body 66 applies a load to the second drive unit 64 via the pressing part 62 through its elastic force. The elastic body 66 is not particularly limited, but a helical spring or the like can be used. The elastic body 66 may be omitted.

[0062] Furthermore, a pressing device other than the piezo actuator device described above may be used as the pressing device 60. Figures 5(a) and 5(b) are cross-sectional views illustrating the pressing operation by the pressing device 70 in a modified example of the first embodiment. Figure 5(a) shows a state in which there is no deflection in the main body 51 of the bridge beam 50A, and Figure 5(b) shows a state in which deflection occurs in the main body 51 of the bridge beam 50A.

[0063] As shown in Figures 5(a) and 5(b), the pressing device 70 in this modified example is a so-called wedge-type Z actuator device. In a wedge-type Z actuator device, the third drive unit 72 that utilizes the wedge portion 73 can adjust its stroke (displacement) with great precision, making it possible to adjust the stroke of the probe card 20 with high accuracy.

[0064] As shown in Figures 5(a) and 5(b), the pressing device 70 includes a base 71, a third drive unit 72, and a stage 76. The base 71 is fixed to the main body 51 of the bridge beam 50A. The base 71 is not particularly limited, but is fixed to the main body 51 by bolts or the like (not shown). The base 71 also holds the third drive unit 72.

[0065] The third drive unit 72 comprises a wedge portion 73, a motor 74, and a conversion mechanism 75. The wedge portion 73 is a wedge-shaped member and is arranged to be movable relative to the base 71 along the X direction. The motor 74 is driven by power supplied from the first control unit 37 (see Figure 3). The motor 74 is not particularly limited, but examples include a servo motor or a pulse motor. In this case, the first control unit 37 is a motor drive circuit. The conversion mechanism 75 converts the rotational motion of the motor 74 into linear motion along the X direction, causing the wedge portion 73 to move linearly. As a result, the conversion mechanism 75 moves the wedge portion 73 in a direction (X direction) perpendicular to the pressing direction (-Z direction) of the probe card 20.

[0066] The stage 76 is positioned on the inclined surface 73a of the wedge portion 73 and is in contact with the probe card 20. The stage 76 includes an inclined surface 76a that contacts the inclined surface 73a of the wedge portion 73. As the wedge portion 73 moves along the X direction, the stage 76 slides along the inclined surface 73a of the wedge portion 73. This allows it to move relative to the stage in the Z direction, and the pressing force applied from the stage 76 to the probe card 20 can be adjusted. For example, in the pressing device 70 in Figure 5(b), the pressing force from the stage 76 is increased by sliding the wedge portion 73 in the +X direction. The stage 76 corresponds to an example of a "pressing portion" in an embodiment of the present invention.

[0067] In addition to the pressing devices 60 and 70 described above, other pressing devices can be used that can adjust the pressing force on the probe card 20 by electrical control. For example, although not specifically shown, a cam mechanism may be used as the pressing device. For example, the cam mechanism may include at least a cam fixed to the bridge beam 50A and a cam follower that is movable in the Z direction by the rotational motion of the cam, and the probe card 20 may be pressed by the cam follower.

[0068] As shown in Figures 1 and 2, the displacement meter 90 in this embodiment is positioned on the lower surface 10a of the test head 10. The lower surface 10a of the test head 10 in this embodiment faces the main body 51 of the bridge beam 50A. Since the displacement meter 90 in this embodiment is positioned on the test head 10, which is hardly affected by the deflection of the probe card 20, the first deflection amount De of the main body 51 is not affected. １ It can detect them with high accuracy.

[0069] This displacement gauge 90 measures the first amount of deflection De of the main body 51 of the bridge beam 50A. １ The displacement sensor 90 in this embodiment is not particularly limited, but is a laser displacement sensor. The displacement sensor 90 measures the change in distance from the displacement sensor 90 to the main body 51, thereby detecting the first deflection amount of the main body 51 (the relative displacement amount of the main body 51 with respect to the test head 10) De １ The displacement gauge 90 directly measures the first deflection amount De１ Output it to the calculation unit 36.

[0070] For example, as shown in FIG. 1, when the DUT 100 is not pressed against the probe card 20, the distance from the displacement gauge 90 to the main body portion 51 is d １ On the other hand, as shown in FIG. 2, when the DUT 100 is pressed against the probe card 20, the distance from the displacement gauge 90 to the main body portion 51 is d １ from d ２ to d １ decreases (d ２ > d １ ). The displacement gauge 90 in the present embodiment directly measures the first deflection amount De ２ by measuring such a displacement amount Δd of the distance (= d １ - d １ ). (De

[0071] As shown in FIG. 3, in such a semiconductor device test apparatus 1A, the displacement gauge 90 constitutes a detection unit 80A that detects the first deflection amount De １ . Further, the bridge beam 50A, the displacement gauge 90, and the handler control device 35A constitute a deflection correction device 2A.

[0072] In the above embodiment, the displacement gauge 90 is disposed on the test head 10, but it is not limited thereto. As in the following modification example, the bridge beam 50A may include a displacement gauge 52. FIG. 8 is a schematic side view showing the semiconductor device test apparatus 1A in the modification example of the first embodiment, and is a view showing a state before the DUT 100 is pressed against the probe card 20.

[0073] As shown in FIG. 8, the bridge beam 50A in this modification example includes a displacement gauge 52. The displacement gauge 52 is disposed on the upper surface 51b of the main body portion 51 of the bridge beam 50A. This upper surface 51b faces the lower surface 10a of the test head.

[0074] Similar to the above displacement gauge 90, this displacement gauge 52 also measures the first deflection amount (the relative displacement amount of the main body portion 51 with respect to the test head 10) De １The displacement sensor 52 in this modified example is not particularly limited, but is a laser displacement sensor. The displacement sensor 52 measures the change in distance from the displacement sensor 52 to the lower surface 10a of the test head 10, thereby measuring the relative displacement of the upper surface 51b of the main body 51 with respect to the lower surface 10a of the test head 10. As a result, the displacement sensor 52 detects the first deflection amount De of the main body 51. １ It directly measures the displacement. This displacement gauge 52 also corresponds to an example of a "detection unit" in an embodiment of the present invention.

[0075] In the above embodiment, a displacement meter 90 is provided on the test head 10, and a pressing device 60 is provided on the bridge beam 50A. Therefore, when incorporating the correction function by the deflection correction device 2A into an existing semiconductor device test apparatus, it is necessary to modify at least the test head and the bridge beam. On the other hand, as in this modified example, since the bridge beam 50A is equipped with a displacement meter 52, it is not necessary to modify the test head in an existing semiconductor device test apparatus, and only the bridge beam needs to be modified, so the correction function by the deflection correction device 2A can be easily incorporated into an existing semiconductor device test apparatus.

[0076] The second deflection amount De of the semiconductor device testing apparatus 1A, as measured by the deflection correction device 2A, will be described below with reference to Figures 1 to 4 and Figure 6. ２ The correction method will be explained. Figure 6 shows the second deflection amount De of the probe card 20 in the first embodiment. ２ This is a flowchart explaining the correction method.

[0077] The correction method in the first embodiment is not particularly limited, but is repeatedly performed from the time the DUT 100 is pressed against the probe card 20 (see Figure 2) until the DUT 100 is removed from the probe card 20. In this correction method, first, as shown in Figure 6, in step S101, the displacement amount Δd of the main body 51 of the bridge beam 50A is measured by the displacement meter 90 (see Figures 1 and 2), thereby determining the first deflection amount De １ It detects.

[0078] Next, in step S102, the calculation unit 36 ​​(see Figure 3) calculates the first deflection amount De detected by the displacement meter 90. １ Based on this, the correction amount C is calculated. This correction amount C is not particularly limited, but the first deflection amount De １ It is the same value (C = De １ ). Then, the calculation unit 36 ​​outputs a correction amount C to the first control unit 37.

[0079] Next, in step S103, the first control unit 37 (see Figure 3) controls the second drive unit 64 of the pressing device 60 based on the correction amount C. Specifically, the first control unit 37 applies a voltage to the second drive unit 64 such that it expands in the -Z direction by the correction amount C. As a result, the second drive unit 64 is controlled to move the pressing unit 62 in the -Z direction by the correction amount C, as shown in Figure 4(b).

[0080] Figure 7 is a schematic side view of the semiconductor device testing apparatus 1C in the comparative example, showing the state in which the DUT 100 is pressed against the probe card 20C. As shown in Figure 7, when the transport device 40C presses the DUT 100 against the probe card 20C, the first deflection amount Dc of the main body portion 51C of the bridge beam 50C １ And the second deflection amount Dc of the probe card 20C １ And are almost the same amount (Dc １ = Dc ２ ).

[0081] Therefore, in the correction method of the first embodiment, by setting the correction amount C to the same amount as the displacement amount Δd of the main body portion 51 of the bridge beam 50A, the second deflection amount De of the probe card 20 is corrected as shown in Figure 2. ２ It can be reduced to almost zero (De ２ = 0).

[0082] In the correction method of the first embodiment, the correction amount C does not have to be set to the same value as the displacement amount Δd. At a minimum, the second deflection amount De of the probe card 20 ２ It is sufficient that the correction amount C can be reduced, and it may be greater than 0 and less than Δd (0 < C < Δd).

[0083] Furthermore, when using the pressing device 70 shown in Figure 5, the first control unit 37 determines the amount of movement M of the wedge portion 73 necessary to move the stage 76 in the -Z direction by a correction amount C. ｘ The first control unit 37 then calculates the movement amount M of the wedge portion 73. ｘ The power required to move by a certain amount in the X direction is calculated, and the calculated power is supplied to the motor 74. In this case, the amount of movement M ｘ This is calculated based on the correction amount C and the inclination angle θ of the slope 73a of the wedge portion 73. Specifically, the amount of movement M required to lower the stage 76 by the correction amount C. ｘ This is calculated by the formula (C / tanθ) (M ｘ (= C / tanθ). The handler control device 35A may further include a movement amount calculation unit that calculates the movement amount Mx separately from the first control unit 37.

[0084] Next, in step S104, it is determined whether the DUT 100 is in contact with the probe card 20. As a method for determining contact, for example, the main frame (not shown) can detect whether the terminal 101 of the DUT 100 and the probe 23 of the probe card 20 are electrically connected, and if the terminal 101 and the probe 23 are electrically connected, it can be determined that the DUT 100 is in contact with the probe card 20. Alternatively, an imaging device such as a camera may be used to directly detect whether the DUT 100 is in contact with the probe card 20.

[0085] If it is determined in step S104 that the DUT 100 is in contact with the probe card 20, the process returns to the detection step in step S101 for detecting the first deflection amount De1. In this way, the correction method in the first embodiment is repeatedly executed as long as the DUT 100 is in contact with the probe card 20. On the other hand, if it is determined in step S104 that the DUT 100 is separated from the probe card 20, the correction method in the first embodiment is terminated.

[0086] Furthermore, the correction method shown in steps S101 to S103 of Figure 6 may be repeatedly executed at a predetermined cycle in the state before the DUT 100 is pressed against the probe card 20 (see Figure 1). In this case, the determination step in step S104 of Figure 6 is omitted. For example, before the DUT 100 is pressed against the probe card 20, there may be deflection in the probe card 20 and the main body 51. In such cases as well, the correction method shown in steps S101 to S103 can be used to correct the second deflection amount De of the probe card 20. ２ It can be corrected.

[0087] Furthermore, in the state before pressing the DUT 100 against the probe card 20, the first deflection amount De of the main body 51 １ It can also be 0 (De １ (=0). In this case, the correction amount C mentioned above also becomes 0 (C=0). In other words, in this case, the correction operation by the pressing device 60 shown in step S103 is not performed.

[0088] The semiconductor device testing apparatus 1C in the comparative example shown in Figure 7 does not include the deflection correction device 2A (see Figure 3) in the first embodiment. In this case, when the DUT 100 is pressed against the probe card 20C, the second deflection amount DC of the probe card 20C ２ This is not corrected. As a result, the probe 23C of the probe card 20C tilts inward due to the bending of the probe card 20C. Consequently, even if the transport device 40C positions the terminal 101 of the DUT facing the probe 23C and then presses the DUT 100 against the probe card 20C, the tilt of the probe 23C causes the tip of the probe 23C to shift from the position of the terminal 101. Therefore, in the comparative example, poor contact occurs between the probe 23C and the terminal 101.

[0089] In contrast, in the semiconductor device testing apparatus 1A of the first embodiment, as shown in Figure 2, the second deflection amount De of the probe card 20 ２ By correcting this, the deflection of the probe card 20 can be reduced or offset. This improves the contact stability between the probe 23 and the terminal 101.

[0090] <Second Embodiment>

[0091] Figure 9 is a schematic side view showing the semiconductor device testing apparatus 1B in the second embodiment, and shows the state before the DUT 100 is pressed against the probe card 20. Figure 10 is a schematic block diagram of the semiconductor device testing apparatus 1B in the second embodiment.

[0092] In the semiconductor device testing apparatus 1B of the second embodiment, (1) instead of displacement gauges 90 and 52 that can directly measure the displacement of the main body 51, the first deflection amount De １ (2) The measuring unit 53 measures a physical quantity that changes in accordance with (2) the handler control device 35B measures the first deflection d based on the physical quantity １ The second embodiment differs from the first embodiment in that it includes an estimation unit 39 for estimating the value. However, the configurations other than (1) and (2) are the same as those of the first embodiment. Below, only the differences between the semiconductor device testing apparatus 1B in the second embodiment and the first embodiment will be described, and parts that have the same configuration as in the first embodiment will be denoted by the same reference numerals and their description will be omitted.

[0093] As shown in Figure 9, the bridge beam 50B in the second embodiment is equipped with a measuring unit 53 provided on the main body 51. This measuring unit 53 is not particularly limited, but is a load cell or a strain gauge. A load cell can measure the load applied to the main body 51 of the bridge beam 50B. On the other hand, a strain gauge measures the first deflection amount of the main body 51 of the bridge beam 50B. １ The electrical resistance value, which changes accordingly, can be measured. "Load" and "electrical resistance value" correspond to examples of "physical quantities that change according to the first amount of deflection" in the embodiment of the present invention.

[0094] As shown in Figure 10, the handler control device 35B in the second embodiment includes an estimation unit 39. This estimation unit 39 determines the first deflection amount De １ Based on the physical quantity that changes in accordance with, the first deflection De １The estimation unit 39 in this embodiment includes a storage unit 391. This storage unit 391 stores the above physical quantity and the first deflection amount De １ It stores the correlation with. In addition, the memory unit 391 stores the first deflection amount De corresponding to the physical quantity input from the measurement unit 53. １ The result is output to the calculation unit 36. The estimation unit 39 corresponds to an example of the "first estimation unit" or "third estimation unit" in an embodiment of the present invention.

[0095] The above correlation is related to the second deflection amount De in this embodiment. ２ Before performing the correction method, it is sufficient to obtain the following beforehand. More specifically, for example, for each probe card 20 corresponding to the type of DUT 100, the measurement unit 53 measures a physical quantity (specifically, the load or electrical resistance value mentioned above), and at the same time, the first deflection amount De is measured using a displacement meter or the like. １ The first deflection amount De is determined from these measurement results. １ A map is created, and the created map is input into the storage unit 391 for storage.

[0096] In such a semiconductor device testing apparatus 1B, the first deflection amount De １ It is not measured directly but detected by estimation. That is, in step S101 in Figure 6, the first deflection amount De １ Instead of measuring the first deflection amount De １ The estimation is performed. For this reason, in the second embodiment, the measurement unit 53 and the estimation unit 39 constitute the detection unit 80B. In addition, the bridge beam 50B, the detection unit 80B, and the handler control device 35B constitute the deflection correction device 2B.

[0097] In the semiconductor device testing apparatus 1B of the second embodiment described above, it is also possible to improve the contact stability between the probe 23 and the terminal 101.

[0098] <Third Embodiment>

[0099] Figure 11 is a schematic side view showing the semiconductor device testing apparatus 1D in the third embodiment, and shows the state before the DUT 100 is pressed against the probe card 20. Figure 12 is a schematic block diagram of the semiconductor device testing apparatus 1D in the third embodiment.

[0100] In the semiconductor device testing apparatus 1D of the third embodiment, (3) instead of the measuring unit 53, a torque detection unit 381 is provided to detect the torque of the motor 421 of the transport device 40, and (4) based on the detected torque, a first deflection amount De １ The third embodiment differs from the second embodiment in that it estimates [something]. However, the configurations other than (3) and (4) are the same as those of the second embodiment. Below, only the differences between the semiconductor device testing apparatus 1D in the third embodiment and the second embodiment will be described, and parts that are the same as those in the second embodiment will be denoted by the same reference numerals and their description will be omitted.

[0101] In the third embodiment, the bridge beam 50D is not provided with the displacement meters 90, 52 and the measuring unit 53. In this third embodiment, the first deflection amount De is determined based on the torque of the motor 421, which is the drive source of the first drive unit 42 of the conveying device 40. １ This estimation unit 39 is an example of a "second estimation unit" in an aspect of the present invention.

[0102] Specifically, the handler control device 35D includes a torque detection unit 381. This torque detection unit 381 estimates the torque exerted by the motor 421 by detecting the power output from the second control unit 38 to the motor 421. The torque may be estimated based on a correlation between power and torque, which has been acquired. This correlation may be acquired by prior measurement. Alternatively, a motor with a known correlation may be used.

[0103] In the third embodiment, the storage unit 391 stores the above-mentioned torque and the first deflection amount De １ The correlation with is stored. Furthermore, this correlation is similar to that of the second deflection amount De in this embodiment. ２ It's best to obtain this information beforehand, before performing the correction method.

[0104] The estimation unit 39 determines the first deflection amount De based on the estimated torque output from the torque detection unit 381. １ Specifically, the storage unit 391 of the estimation unit 39 stores a first deflection amount De corresponding to the estimated torque. １ The result is output to the calculation unit 36.

[0105] In such a semiconductor device testing apparatus 1D, the first deflection amount De １ It is not measured directly, but detected by estimation based on torque. That is, in step S101 in Figure 6, the first deflection amount De １ Instead of measuring the first deflection amount De based on torque １ The estimation is performed. For this reason, in the third embodiment, the torque detection unit 381 and the estimation unit 39 constitute the detection unit 80D. In addition, the bridge beam 50D, the detection unit 80D, and the handler control device 35D constitute the deflection correction device 2D.

[0106] In the semiconductor device testing apparatus 1D of the second embodiment described above, it is also possible to improve the contact stability between the probe 23 and the terminal 101.

[0107] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit it. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0108] For example, in the first to third embodiments, the calculation unit 36, the first control unit 37, and the estimation unit 39 are illustrated as being part of the functions of the handler control devices 35A, 35B, and 35D, but the invention is not limited thereto. These functions may be functions of the tester's mainframe (not shown), or they may be control devices independent of the handler 30 and the mainframe.

[0109] Furthermore, the number of pressing devices 60 and 70 is not limited to one, and bridge beams 50A to 50B may be equipped with multiple pressing devices 60 and 70. Similarly, the number of displacement gauges 90 and 52 and measuring units 53 is not limited to one, and semiconductor device test apparatuses 1A, 1B, and 1D may be equipped with multiple displacement gauges 90 and 52, or multiple measuring units 53.

[0110] 1A, 1B, 1D... Semiconductor device testing equipment 2A, 2B, 2D... Deflection correction device 10... Test head 20... Probe card 30... Handler 35A, 35B, 35D... Handler control device 36... Calculation unit 37, 38... First and second control units 381... Torque detection unit 39... Estimation unit 40... Transport device 42... First drive unit 50A, 50B, 50D... Bridge beam 51... Main body 52... Displacement meter 53... Measurement unit 60, 70... Pressing device 62... Pressing unit 64... Second drive unit 72... Third drive unit 73... Wedge unit 76... Stage 80A, 80B, 80D... Detection unit 90... Displacement meter 100... DUT

Claims

1. A deflection correction device comprising: a bridge beam mounted on a semiconductor device handling apparatus, comprising: a beam-shaped main body portion to which a probe card is attached; a first pressing device for pressing the probe card; a detection unit for detecting a first deflection amount of the main body portion; and a control device for controlling the first pressing device to correct a second deflection amount of the probe card based on the first deflection amount detected by the detection unit.

2. A deflection correction device according to claim 1, wherein the detection unit includes a displacement meter for measuring the first amount of deflection.

3. A deflection correction device according to claim 2, wherein the displacement meter is provided on a test head to which the probe card is electrically connected, so as to face the main body, and the device measures the amount of displacement of the main body.

4. A deflection correction device according to claim 2, wherein the displacement meter is provided on the main body so as to face the test head to which the probe card is electrically connected, and the deflection correction device measures the amount of displacement of the main body.

5. A deflection correction device according to claim 1, wherein the detection unit includes a load cell for detecting a load applied to the main body, and a first estimation unit for estimating the first amount of deflection based on the load detected by the load cell.

6. A deflection correction device according to claim 1, wherein the semiconductor device handling device comprises a second pressing device for pressing a semiconductor device toward the probe card, the second pressing device comprises a holding portion for holding the semiconductor device, and a first driving portion including a motor as a driving source for moving the holding portion toward the probe card, and the detection portion comprises a torque detection portion for detecting the torque of the motor, and a second estimation portion for estimating the first deflection amount based on the torque detected by the torque detection portion.

7. A deflection correction device according to claim 1, wherein the detection unit includes a strain gauge provided on the main body and having an electrical resistance value that changes according to the first amount of deflection, and a third estimation unit that estimates the first amount of deflection based on the electrical resistance value of the strain gauge.

8. A deflection correction device according to any one of claims 1 to 7, wherein the control device further comprises a calculation unit that calculates a correction amount based on the first deflection amount detected by the detection unit, the first pressing device comprises a pressing unit that presses the probe card, and a second drive unit that moves the pressing unit toward the probe card, and the control device controls the second drive unit so that the second drive unit moves the pressing unit by a correction amount in the pressing direction.

9. A deflection correction device according to claim 8, wherein the second drive unit is a piezo actuator that can expand and contract in response to an applied voltage.

10. A deflection correction device according to claim 8, wherein the second drive unit includes a wedge portion having an inclined surface that contacts the pressing portion, and a third drive unit that moves the wedge portion in a direction perpendicular to the pressing direction.

11. A deflection correction device according to any one of claims 1 to 10, wherein the first pressing device is disposed on the main body so as to contact the central part of the probe card.

12. A deflection correction device according to any one of claims 1 to 11, wherein the first pressing device is fixed to the main body so as to be interposed between the main body and the probe card.

13. A semiconductor device handling apparatus for handling semiconductor devices, comprising: a deflection correction device according to any one of claims 1 to 12; and a second pressing device for pressing a semiconductor device toward the probe card.

14. A semiconductor device testing apparatus for testing semiconductor devices, comprising: a semiconductor device handling apparatus according to claim 13; a probe card; and a test head electrically connected to the probe card for performing tests on the semiconductor device.

15. A bridge beam to be mounted on a semiconductor device handling apparatus, the bridge beam comprising: a beam-shaped main body portion to which probe cards are attached; and a first pressing device provided on the main body portion, which presses the probe cards in order to correct a second amount of deflection of the probe cards based on a first amount of deflection of the main body portion when deflection occurs in the main body portion.

16. A bridge beam according to claim 15, wherein the bridge beam comprises a measuring unit for measuring the first amount of deflection or for measuring a physical quantity that changes according to the first amount of deflection.

Images