Conductive probe, its manufacturing method and probe card device with conductive probe

Abstract

A conductive probe, its manufacturing method, and a probe card device having the conductive probe are disclosed. The conductive probe includes a cylindrical body. The cylindrical body defines a length direction and has a first contact surface and a second contact surface opposite to each other along this length direction. The first contact surface is cross-shaped or X-shaped for contacting a conductive protrusion of a test object. Thus, through this structure, the conductive probe disclosed herein can reduce the size of the needle mark produced on the conductive protrusion, thereby avoiding a reduction in the conductivity efficiency of the conductive probe and the reliability of the semiconductor device.

Description

Technical Field

[0001] This invention relates to a conductive probe, particularly a conductive probe with a cross-shaped end face, a method for manufacturing the probe, and a probe card device having the conductive probe. Background Technology

[0002] Generally, semiconductor devices, such as dies and wafers, are placed in a test bench during the chip probe (CP) stage. The probes on the probe card above the test bench are controlled to press down on the conductive pillars of the semiconductor device to perform electrical testing on the semiconductor device.

[0003] However, when the probes of the probe card press against the conductive bumps of the semiconductor device one by one, each probe inevitably presses against the surface of the corresponding conductive bump, causing pin marks (such as scratches or dents) of a specific size on the top surface of the conductive bump. If the size of these pin marks is too large, it will reduce the conductivity of each conductive bump, thereby affecting the reliability of the semiconductor device.

[0004] It is evident that the aforementioned technology still has inconveniences and shortcomings, requiring further improvement. Therefore, effectively addressing these inconveniences and shortcomings is a crucial research and development issue and a pressing goal for improvement in related fields. Summary of the Invention

[0005] One object of the present invention is to provide a conductive probe, a method for manufacturing the same, and a probe card device having the conductive probe, in order to solve the difficulties mentioned in the prior art.

[0006] An embodiment of the present invention provides a conductive probe. The conductive probe includes a columnar body. The columnar body defines a length direction and has a first contact surface and a second contact surface along this length direction. The first contact surface and the second contact surface are opposite to each other, and the first contact surface is cross-shaped or X-shaped for contacting a conductive protrusion of a test object.

[0007] According to one or more embodiments of the present invention, in the conductive probe described above, the first contact surface includes a central region, two first extension regions, and two second extension regions. These first extension regions extend outward from two opposite ends of the central region and extend coaxially along a first axial direction, which is orthogonal to the length direction. These second extension regions extend outward from the other two opposite ends of the central region and extend coaxially along a second axial direction, which intersects the first axial direction and is orthogonal to the length direction. One of the first extension regions is located between these second extension regions, and one of the second extension regions is located between these first extension regions.

[0008] According to one or more embodiments of the present invention, in the above-described conductive probe, the angle between the first extension region and the second extension region is a positive angle, and the first axis and the second axis are orthogonal to each other.

[0009] According to one or more embodiments of the present invention, in the above-described conductive probe, the angle between the first extension region and the second extension region is an obtuse angle, and the angle between the first extension region and the other second extension region is an acute angle.

[0010] According to one or more embodiments of the present invention, in the above-described conductive probe, the columnar body further has an arc-shaped recess located in the central region for receiving a portion of the conductive protrusion.

[0011] According to one or more embodiments of the present invention, in the above-mentioned conductive probe, the columnar body is a cross-shaped column, and a cross-section of the columnar body is cross-shaped.

[0012] According to one or more embodiments of the present invention, in the conductive probe described above, the columnar body is composed of a first segment and a second segment coaxially connected to each other. A cross-section of the first segment is cross-shaped, and the shape of the cross-section of the first segment differs from the shape of the cross-section of the second segment. A first contact surface is one end face of the first segment, and a second contact surface is one end face of the second segment.

[0013] According to one or more embodiments of the present invention, in the above-described conductive probe, the length ratio of the first segment to the second segment is 3:7 or 2:8.

[0014] According to one or more embodiments of the present invention, in the above-described conductive probe, the columnar body includes two first recesses and two second recesses. The first recesses are respectively recessed on one side of the columnar body and extend along the length direction. The second recesses are respectively recessed on the other side of the columnar body and extend along the length direction. One end face of the columnar body defines the first contact surface through the first and second recesses.

[0015] An embodiment of the present invention provides a conductive probe. The conductive probe includes a first segment. The first segment includes a central axis, two first side wings, and two second side wings. The central axis has a length direction. The first side wings are respectively located on two opposite sides of the central axis and extend together along the length direction. The second side wings are respectively located on two other opposite sides of the central axis and extend together along the length direction. One of the first side wings is located between the second side wings, and one of the second side wings is located between the first side wings. The central axis, the first side wings, and the second side wings together form a contact surface along the length direction, and the contact surface is used to contact a conductive protrusion of an object to be tested.

[0016] According to one or more embodiments of the present invention, in the above-described conductive probe, the angle between the first wing and the second wing is a positive angle.

[0017] According to one or more embodiments of the present invention, in the above-described conductive probe, the angle between the first wing and the second wing is an obtuse angle, and the angle between the first wing and the other second wing is an acute angle.

[0018] According to one or more embodiments of the present invention, in the above-mentioned conductive probe, the first section further has an arc-shaped recess, which is recessed on the contact surface to receive a portion of the conductive protrusion.

[0019] According to one or more embodiments of the present invention, in the above-described conductive probe, the contact surface is cross-shaped or X-shaped.

[0020] According to one or more embodiments of the present invention, the conductive probe further includes a second segment. The second segment is coaxially connected to the first segment, and the cross-section of the second segment is rectangular.

[0021] According to one or more embodiments of the present invention, in the above-described conductive probe, the length ratio of the first segment to the second segment is 3:7 or 2:8.

[0022] An embodiment of the present invention provides a probe card device. The probe card device includes a circuit board, a probe module, a space transition layer, and at least one conductive probe as described above. The circuit board has multiple contacts. The probe module includes a probe holder and multiple positioning ports. These positioning ports are arranged in an array, and each positioning port is disposed on the probe holder. The space transition layer is located between the circuit board and the probe module and has multiple circuit paths. The conductive probe is fixed in one of the positioning ports and is electrically connected to one of the contacts through one of the circuit paths.

[0023] According to one or more embodiments of the present invention, in the above-described conductive probe, the columnar body is directly clamped by the two opposing inner sides of the positioning port and positioned on the needle carrier.

[0024] According to one or more embodiments of the present invention, in the above-mentioned conductive probes, these positioning ports are respectively cross-shaped, X-shaped or rectangular.

[0025] An embodiment of the present invention provides a method for manufacturing a conductive probe, comprising the following steps: providing a substrate; forming a first photoresist layer on the substrate; etching a first columnar groove on the first photoresist layer; forming a first metal layer on the first columnar groove and the first photoresist layer; forming a second photoresist layer on the side of the first metal layer opposite to the substrate; etching a second columnar groove on the second photoresist layer; forming a second metal layer in the second columnar groove, and integrally formed with the first metal layer to form a conductive probe; and removing the substrate, the first photoresist layer, and the second photoresist layer to remove the conductive probe, wherein the conductive probe has a cross-shaped cross section.

[0026] Thus, through the architecture described in the above embodiments, the conductive probe disclosed herein can reduce the size of the pin marks generated on the conductive protrusions, thereby avoiding a reduction in the conductivity efficiency of the conductive probe and the reliability of the semiconductor device.

[0027] The above description is only used to illustrate the problem to be solved by the present invention, the technical means to solve the problem, and the effects produced, etc. The specific details of the present invention will be described in detail in the following embodiments and related drawings. Attached Figure Description

[0028] To make the above and other objects, features, advantages and embodiments of the present invention more apparent and understandable, the accompanying drawings are described below:

[0029] Figure 1 This is a perspective view of a conductive probe according to an embodiment of the present invention;

[0030] Figure 2A for Figure 1 A partial side view of a conductive probe contacting a conductive protrusion of a test object;

[0031] Figure 2B for Figure 2A Top view;

[0032] Figure 3 This is a perspective view of a conductive probe according to an embodiment of the present invention;

[0033] Figure 4A This is a perspective view of a conductive probe according to an embodiment of the present invention;

[0034] Figure 4B for Figure 4A A partial side view of a conductive probe contacting a conductive protrusion of a test object;

[0035] Figure 5 This is a perspective view of a conductive probe according to an embodiment of the present invention;

[0036] Figure 6A This is a schematic diagram of a probe card device according to an embodiment of the present invention;

[0037] Figure 6B for Figure 6A A front view of the needle carrier;

[0038] Figure 7 A flowchart illustrating a method for manufacturing a conductive probe according to an embodiment of the present invention; and

[0039] Figures 8A to 8H for Figure 7 The operation diagram for each step.

[0040] [Symbol Explanation]

[0041] 10-15: Conductive probes

[0042] 100, 101: Column body

[0043] 102: Length direction

[0044] 110, 110A: First contact surface

[0045] 111: Central District

[0046] 112: First Extension Zone

[0047] 113: Second Extension Area

[0048] 120, 121: Second contact surface

[0049] 130: Central axis

[0050] 140: First flank

[0051] 150: Second flank

[0052] 160: First notch

[0053] 170: Second notch

[0054] 210: First Section

[0055] 220: Second Section

[0056] 221: End face

[0057] 230:Arc-shaped concave part

[0058] 300: Probe Card Device

[0059] 310: Circuit board

[0060] 311:Contact

[0061] 320: Intermediary layer

[0062] 321: Conductive Channel

[0063] 330: Space Transformation Layer

[0064] 331: Circuit Path

[0065] 340: Probe Module

[0066] 341: Upper guide plate

[0067] 342: Lower guide plate

[0068] 343: Needle Carrier

[0069] 344: Positioning Port

[0070] 345: Inner side

[0071] 401-408: Steps

[0072] 410:Substrate

[0073] 411: Silicon substrate

[0074] 412: Metallic coating

[0075] 420: First photoresist layer

[0076] 421: Noodles

[0077] 430: First columnar groove

[0078] 440: First metal layer

[0079] 441: Part

[0080] 442: The other part

[0081] 450: Second photoresist layer

[0082] 451: One side

[0083] 460: Second columnar groove

[0084] 470: Second metal layer

[0085] A1: First Axial Direction

[0086] A2: Second Axial Direction

[0087] C: Vertex

[0088] DUT: Test Material

[0089] L: Guide protrusion

[0090] M: Needle marks

[0091] Q: Quadrant

[0092] θ1, θ2, θ: included angle Detailed Implementation

[0093] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, these practical details are not essential in the various embodiments of the invention. Furthermore, for the sake of simplicity, some known and conventional structures and elements will be illustrated in the drawings in a simple schematic manner.

[0094] Figure 1 This is a perspective view of a conductive probe 10 according to an embodiment of the present invention. Figure 2A for Figure 1 A partial side view of the conductive probe 10 contacting the conductive protrusion L of a test object (DUT). Figure 2B for Figure 2A The top view. (e.g.) Figures 1 to 2B As shown, the conductive probe 10 includes a columnar body 100. The columnar body 100 defines a length direction 102, and has a first contact surface 110 and a second contact surface 120 opposite to each other along this length direction 102. The first contact surface 110 is cross-shaped. Therefore, when the conductive probe 10 presses against a device under test (DUT), the DUT is a semiconductor device, such as a die or wafer. The conductive probe 10 contacts one of the conductive protrusions L (e.g., a copper pillar) of the DUT through its first contact surface 110 to create a needle mark M of a specific size on the top surface of the conductive protrusion L. In this embodiment, for example, the conductive probe 10 is a small-sized micro probe fabricated by microelectromechanical processes; however, the present invention is not limited thereto.

[0095] Thus, its cross-shaped end face design can constrain the needle mark M within... Figure 2B By expanding the four quadrants Q in the model, the conductive probe 10 in this embodiment not only reduces the contact area between the conductive probe 10 and the conductive protrusion L, but also reduces the size of the needle mark M pressed out by the conductive probe 10 against the conductive protrusion L (such as an area reduction rate of 44.4%), thereby improving the conductivity efficiency of the conductive probe 10 and the reliability of the semiconductor device.

[0096] For example, compared to the known shape where the size of the needle mark M pressed into the conductive protrusion L accounts for 25-36% of the total area of ​​the conductive protrusion L, the cross-shaped first contact surface 110 in this embodiment can reduce the size of the needle mark M to 23-32%, meaning there is a 2-4% improvement potential. Thus, because the smaller the size of the needle mark M, the less residue remains on the top surface plating of the conductive protrusion L, the less chance of residue falling off, and the less material loss of the top surface plating, thereby improving the conductivity efficiency of the conductive probe 10 and the reliability of the semiconductor device.

[0097] More specifically, the first contact surface 110 includes a central region 111, two first extension regions 112, and two second extension regions 113. These first extension regions 112 extend outward from two opposite ends of the central region 111 and extend coaxially along a first axial direction A1, which is orthogonal to the length direction 102. These second extension regions 113 extend outward from the other two opposite ends of the central region 111 and extend coaxially along a second axial direction A2, which intersects the first axial direction A1 and is orthogonal to the length direction 102. One of the first extension regions 112 is located between the second extension regions 113, and one of the second extension regions 113 is located between the first extension regions 112. Figure 1 As shown, the angle θ between the first extension region 112 and the second extension region 113 is approximately 90 degrees (i.e., a positive angle), and the first axis A1 and the second axis A2 are orthogonal to each other. The central region 111, the first extension region 112, and the second extension region 113 are all rectangular, so that they together form the aforementioned cross-shaped end face.

[0098] Therefore, when the conductive probe 10 touches the conductive protrusion L of the test object DUT, since the vertex C of the conductive protrusion L corresponds to the central area 111 of the first contact surface 110, the first extension area 112 and the second extension area 113 of the conductive protrusion L can symmetrically contact the conductive protrusion L, thereby providing an anti-slip effect.

[0099] For example, in this embodiment, the columnar body 100 is a cross-shaped column extending along a straight line, meaning that any cross-section of the columnar body 100 is cross-shaped. More specifically, the conductive probe 10 includes a central axis 130, two first side wings 140, and two second side wings 150. The central axis 130 is a rectangular column with a length direction 102 as described above. The first side wings 140 are located on two opposite sides of the central axis 130 and extend together along the length direction 102. The second side wings 150 are located on two other opposite sides of the central axis 130 and extend together along the length direction 102. One of the first side wings 140 is located between the second side wings 150, and one of the second side wings 150 is located between the first side wings 140. The central axis 130, the first side wings 140, and the second side wings 150 together form the first contact surface 110 as described above along the length direction 102. In other words, the columnar body 100 includes two first recesses 160 and two second recesses 170. The first recesses 160 are respectively recessed on one side of the columnar body 100 and extend along the length direction 102. The second recesses 170 are respectively recessed on the other side of the columnar body 100 and extend along the length direction 102. The end face of the columnar body 100, through the first recesses 160 and the second recesses 170, jointly defines a first contact surface 110. In this embodiment, as... Figure 1 As shown, the angle θ between each first wing 140 and its adjacent second wing 150 is approximately 90 degrees (i.e., a positive angle).

[0100] Thus, if the current distribution inside the conductive probe 10 is uneven, according to the skin effect, the current inside the conductive probe 10 will concentrate on the surface of the conductor. Therefore, since the conductive probe 10 in this embodiment is a cross-shaped or X-shaped column, compared with the known rectangular column design, the conductive probe 10 in this embodiment does not increase the total surface area of ​​the conductive probe 10, nor does it affect the current flow rate of the conductive probe 10.

[0101] Figure 3 This is a perspective view of a conductive probe 11 according to an embodiment of the present invention. Figure 3As shown, the conductive probe 11 in this embodiment and Figure 1 The conductive probe 10 is largely the same as the first section 210, except that the conductive probe 11 in this embodiment also includes a second section 220. The second section 220 is connected to the cross-shaped prism (hereinafter referred to as the first section 210) and is coaxial with the first section 210. In other words, the cross-shaped prism (hereinafter referred to as the first section 210) is connected to the end face 221 of the second section 220 opposite to the second contact surface 121, and the length direction 102 is the axis of the first section 210 and the second section 220.

[0102] The shape of the second segment 220 differs from that of the first segment 210. For example, the second segment 220 is a rectangular prism extending along a straight line, meaning that any cross-section of the second segment 220 is rectangular, and the second contact surface 121 is the rectangular end face of the second segment 220 relative to the first segment 210. Thus, since the conductive probe 11 in this embodiment is not entirely a cross-shaped prism structure, the overall structural strength of the conductive probe 11 can be relatively improved.

[0103] Furthermore, in order to improve the structural strength of the conductive probe 11, in this embodiment, the length ratio of the first segment 210 to the second segment 220 is 3:7 or 2:8. However, the present invention is not limited to the length ratio of the first segment 210 to the second segment 220, and those skilled in the art can adjust the length ratio of the first segment 210 to the second segment 220 according to actual needs or limitations.

[0104] Figure 4A This is a perspective view of a conductive probe 12 according to an embodiment of the present invention. Figure 4B for Figure 4A A partial side view of a conductive probe 12 contacting a conductive protrusion L of a device under test (DUT). (See attached image.) Figure 4A and Figure 4B As shown, the conductive probe 12 in this embodiment and Figure 1 The conductive probe 10 is largely the same as that of the conductive probe 12, except that the first contact surface 110 of the conductive probe 12 has an arc-shaped recess 230, most of which is located in the central region 111 and recessed towards the second contact surface 120. Therefore, when the first contact surface 110 of the conductive probe 12 contacts the conductive protrusion L of the test object (DUT), the arc-shaped recess 230 of the first contact surface 110 can receive a portion of the conductive protrusion L, which not only allows the central region 111 of the first contact surface 110 to be more easily positioned at the apex C of the conductive protrusion L, but also reduces the chance of the conductive probe 12 sliding away from the conductive protrusion L. However, the present invention is not limited to this; in other embodiments, the conductive probe 12 of this embodiment may also be equipped with... Figure 3 The second section 220.

[0105] Figure 5This is a perspective view of a conductive probe 13 according to an embodiment of the present invention. Figure 5 As shown, the conductive probe 13 in this embodiment and Figure 1 The conductive probe 10 is roughly the same as the one in this embodiment, except that, compared to the columnar body 100 which is a cross-shaped column, the columnar body 101 in this embodiment is an X-shaped column with any cross-section being X-shaped, and the first contact surface 110A is X-shaped.

[0106] More specifically, the first axis A1 and the second axis A2 intersect each other, but are not orthogonal to each other. The angle θ1 between the first wing 140 and one of the second wing 150 is an acute angle, and the angle θ2 between the first wing 140 and the other second wing 150 is an obtuse angle. Similarly, the angle θ1 between the first extension region 112 and the second extension region 113 is an acute angle, and the angle θ2 between the first extension region 112 and the other second extension region 113 is an obtuse angle. However, the invention is not limited thereto; in other embodiments, the conductive probe 13 of this embodiment may also be equipped with... Figure 3 The second section 220.

[0107] Figure 6A This is a schematic diagram of a probe card device 300 according to an embodiment of the present invention. Figure 6B for Figure 6A A front view of the probe holder 343 of the probe card device 300. (See image below.) Figure 6A and Figure 6BAs shown, the probe card device 300 includes a circuit board 310, an interposer layer 320, a space transition layer 330, a probe module 340, and a plurality of conductive probes 14. The circuit board 310 has a plurality of contacts 311. These contacts 311 are spaced apart on the circuit board 310. The interposer layer 320 is located between the circuit board 310 and the space transition layer 330, and the interposer layer 320 is configured with a plurality of conductive channels 321. These conductive channels 321 are spaced apart on the interposer layer 320. Each conductive channel 321 is electrically connected to one of the contacts 311. The space transition layer 330 is located between the interposer layer 320 and the probe module 340, and the space transition layer 330 is configured with a plurality of circuit paths 331. These circuit paths 331 are spaced apart on the space transition layer 330. Each circuit path 331 is electrically connected to one of the conductive channels 321. The probe module 340 includes an upper guide plate 341, a lower guide plate 342, a probe holder 343, and multiple positioning ports 344. The probe holder 343 is sandwiched between the upper guide plate 341 and the lower guide plate 342. The positioning ports 344 are arranged in an array on the probe holder 343, and each positioning port 344 extends through the probe holder 343. Each conductive probe 14 is fixed in one of the positioning ports 344. The second contact surface 120 of each conductive probe 14 is electrically connected to one of the circuit paths 331, and is electrically connected to the contact 311 of the circuit board 310 through the corresponding circuit path 331. Its first contact surface 110 is used to electrically connect to the conductive protrusion L (Figure 2) of the test object (DUT). It should be understood that the second contact surface 120 only needs to directly press against the circuit path 331, without soldering it to the circuit path 331.

[0108] More specifically, the positioning opening 344 is cross-shaped, and its size is less than or equal to the size of the columnar body 100, so that the columnar body 100 is directly clamped by the two opposing inner sides 345 of the positioning opening 344 and positioned on the needle carrier 343. However, the present invention is not limited to this; in other embodiments, the positioning opening 344 may also be X-shaped or rectangular.

[0109] Figure 7 This is a flowchart illustrating a method for manufacturing a conductive probe according to an embodiment of the present invention. Figures 8A to 8H for Figure 7 A schematic diagram illustrating each step of the operation. (For example...) Figure 7 , Figures 8A to 8H As shown, the method for manufacturing a conductive probe includes steps 401 to 408, as follows.

[0110] In step 401, a substrate 410 is provided. Figure 8A In step 402, a first photoresist layer 420 is formed on one side of the substrate 410. Figure 8B In step 403, a first columnar groove 430 is etched onto the first photoresist layer 420. Figure 8CIn step 404, a first metal layer 440 is formed on the first columnar groove 430 and the first photoresist layer 420. Figure 8D In step 405, a second photoresist layer 450 is formed on one side 451 of the first metal layer 440 opposite to the substrate 410. Figure 8E In step 406, a second columnar groove 460 is etched onto the second photoresist layer 450. Figure 8F In step 407, a second metal layer 470 is formed within the second columnar groove 460, and is integrally formed with the first metal layer 440 to form a conductive probe 15. Figure 8G In step 408, the substrate 410, the first photoresist layer 420, and the second photoresist layer 450 are removed to extract the conductive probe 15 with the cross-shaped cross section. Figure 8G and Figure 8H ).

[0111] like Figure 8A As shown, in step 401, more specifically, a metal plating layer 412 is formed on the outer surface of a silicon substrate 411 through an electroplating process. Figure 8C As shown, in step 403, more specifically, the first columnar groove 430 is etched on the side 421 of the first photoresist layer 420 opposite to the substrate 410 through photolithography exposure, development, and etching processes. The first columnar groove 430 is straight and extends along the aforementioned length direction 102 (refer to...). Figure 1 The first columnar groove 430 extends, and any cross-section of the first columnar groove 430 is rectangular. For example... Figure 8D As shown, in step 404, more specifically, a portion 441 of the first metal layer 440 completely fills the first columnar groove 430, and another portion 442 of the first metal layer 440 covers this side 421 of the first photoresist layer 420 opposite to the substrate 410. Figure 8F As shown, in step 406, more specifically, the second columnar groove 460 is etched on the side 451 of the second photoresist layer 450 opposite to the substrate 410 through photolithography exposure, development, and etching processes. The second columnar groove 460 is straight and extends along the aforementioned length direction 102 (see reference). Figure 1 The second columnar groove 460 extends, and any cross-section of the second columnar groove 460 is rectangular, and the second columnar groove 460 is parallel to the first columnar groove 430, the size of the second columnar groove 460 being equal to the size of the first columnar groove 430. For example... Figure 8G As shown, in step 407, more specifically, the second metal layer 470 completely fills the second columnar groove 460 and is located only within the second columnar groove 460.

[0112] Finally, the embodiments disclosed above are not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit and scope of the present invention are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the scope defined in the appended claims.

Claims

1. An electrically conductive probe, characterized by, Include: A columnar body is defined along a length direction. The columnar body has a first contact surface and a second contact surface that are opposite to each other along the length direction. The first contact surface is cross-shaped or X-shaped and is used to contact a guide protrusion of an object to be tested. The columnar body also includes two first recesses and two second recesses. The first recesses are respectively recessed on one side of the columnar body and extend along the length direction. The second recesses are respectively recessed on the other side of the columnar body and extend along the length direction. An end face of the columnar body defines the first contact surface through the first recesses and the second recesses.

2. The electrically conductive probe of claim 1, wherein, The first contact surface includes: A central district; Two first extension regions extend outward from two opposite ends of the central region and coaxially along a first axis orthogonal to the length direction; as well as Two second extension regions extend outward from the other two opposite ends of the central region and coaxially along a second axis that intersects the first axis and is orthogonal to the length direction. One of the first extension regions is located between the second extension regions, and one of the second extension regions is located between the first extension regions.

3. The electrically conductive probe of claim 2, wherein, The angle between one of the first extension regions and one of the second extension regions is a positive angle, and the first axis and the second axis are orthogonal to each other.

4. The electrically conductive probe of claim 2, wherein, The angle between one of the first extension regions and one of the second extension regions is an obtuse angle, and the angle between the first extension region and the other of the second extension regions is an acute angle.

5. The electrically conductive probe of claim 2, wherein, The columnar body further has an arc-shaped recess located in the central area to receive a portion of the guide protrusion.

6. The conductive probe according to claim 1, characterized in that, The columnar body is a cross-shaped column, and one cross section of the columnar body is cross-shaped.

7. The conductive probe according to claim 1, characterized in that, The columnar body is composed of a first segment and a second segment coaxially connected to each other. One cross-section of the first segment is cross-shaped, and the shape of this cross-section of the first segment is different from the shape of one cross-section of the second segment. The first contact surface is one end face of the first segment, and the second contact surface is one end face of the second segment.

8. The conductive probe according to claim 7, characterized in that, The length ratio of the first segment to the second segment is 3:7 or 2:

8.

9. A conductive probe, characterized in that, Include: A first segment, containing: A central axis having a length direction; Two first flanks are located on opposite sides of the central axis and extend together along the length direction; and The two second flanks are located on the other two opposite sides of the central axis, and extend together along the length direction. One of the first side wings is located between the second side wings, and one of the second side wings is located between the first side wings. The first side wings and the second side wings together form four notches. Each of the notches is defined on one of the first side wings and one of the second side wings and extends along the length direction. The central shaft, the first side wings, the second side wings and the notches together form a contact surface along the length direction. The contact surface is used to contact a guide protrusion of an object under test.

10. The conductive probe according to claim 9, characterized in that, The angle between one of the first wings and one of the second wings is a positive angle.

11. The conductive probe according to claim 9, characterized in that, The angle between one of the first wings and one of the second wings is obtuse, and the angle between the first wing and the other of the second wings is acute.

12. The conductive probe according to claim 9, characterized in that, The first section further has an arc-shaped recess that is recessed into the contact surface to receive a portion of the guide protrusion.

13. The conductive probe according to claim 9, characterized in that, The contact surface is cross-shaped or X-shaped.

14. The conductive probe according to claim 9, characterized in that, Also includes: A second segment is coaxially connected to the first segment, wherein the cross-section of the second segment is rectangular.

15. The conductive probe according to claim 14, characterized in that, The length ratio of the first segment to the second segment is 3:7 or 2:

8.

16. A probe card device, characterized in that, Include: A circuit board with multiple contacts; A probe module includes a needle carrier and a plurality of positioning ports arranged in an array, and each of the positioning ports is disposed on the needle carrier. A spatial transition layer, located between the circuit board and the probe module, has multiple circuit paths; and At least one conductive probe as described in claim 1 is fixed within one of the positioning ports and electrically connected to one of the contacts through one of the circuit paths.

17. The probe card device according to claim 16, characterized in that, The cylindrical body is directly clamped by the two opposing inner sides of one of the positioning ports and positioned on the needle carrier.

18. The probe card device according to claim 16, characterized in that, These positioning ports are respectively cross-shaped, X-shaped, or rectangular.

19. A method for manufacturing a conductive probe, characterized in that, Include: Provide a substrate; A first photoresist layer is formed on the substrate; A first columnar groove is etched into the first photoresist layer; A first metal layer is formed on the first columnar groove and the first photoresist layer; A second photoresist layer is formed on the side of the first metal layer opposite to the substrate; A second columnar groove is etched into the second photoresist layer; A second metal layer is formed within the second columnar groove, and integrally formed with the first metal layer to form a conductive probe; and Remove the substrate, the first photoresist layer, and the second photoresist layer to retrieve the conductive probe, wherein the conductive probe includes a columnar body defining a length direction. The columnar body has a first contact surface and a second contact surface opposite to each other along the length direction. The first contact surface is cross-shaped or X-shaped and is used to contact a conductive protrusion of a test object. The columnar body also includes two first recesses and two second recesses. The first recesses are respectively recessed on one side of the columnar body and extend along the length direction. The second recesses are respectively recessed on the other side of the columnar body and extend along the length direction. One end face of the columnar body defines the first contact surface through the first recesses and the second recesses.

Images