Test device

Abstract

A testing apparatus includes: a probe card including a support portion and a probe portion, the probe portion having a probe for contacting a non-photosensitive area of ​​a chip under test, the support portion protruding from the probe portion; a support member having a first side and a second side opposite to each other along a first direction, the first side being fixed to the support portion; and a test light source supported by the second side of the support member, with the light-emitting surface of the test light source facing the probe portion.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a testing device. Background Technology

[0002] In semiconductor manufacturing, chip probing (CP) is a crucial testing step. CP testing is used to perform electrical performance tests on each chip before wafer dicing. If the chip under test is an optoelectronic device (such as an image sensor or photodiode), a test light source must be used to simulate actual lighting conditions during the testing process.

[0003] The effective area of ​​the test light source is a key parameter in CP testing. The effective area refers to the range of illumination that the test light source can provide to the device under test (DUT) under specific test conditions, ensuring compliance with test standards. When performing CP testing on image sensors, the effective area of ​​the test light source must cover all pixels of the image sensor to guarantee the accuracy of the test results. Utility Model Content

[0004] The technical objective of this utility model embodiment is to provide a testing device that is beneficial for increasing the effective area of ​​the test light source in CP testing.

[0005] In view of this, the present invention provides a testing device, comprising: a probe card including a support portion and a probe portion, the probe portion having a probe for contacting a non-photosensitive area of ​​a chip under test, the support portion protruding from the probe portion; a support member having a first side and a second side opposite to each other along a first direction, the first side being fixed to the support portion; and a test light source supported by the second side of the support member, the light-emitting surface of the test light source facing the probe portion.

[0006] Optionally, the support member is hollow, and the inner wall of the support member is mirrored.

[0007] Optionally, the second side of the support member has a first blocking portion, which is used to restrict the movement of the test light source.

[0008] Optionally, the support member is obtained through a blackening process.

[0009] Optionally, the support portion has a first threaded hole, and the support member has a through second threaded hole; the testing device further includes: a first threaded fastener, which passes through the second threaded hole and is fixed to the first threaded hole.

[0010] Optionally, it further includes: a light-shielding member disposed between the support member and the test light source; wherein the projection of the support member on the plane where the probe card is located is within the range of the projection of the light-shielding member on the plane where the probe card is located.

[0011] Optionally, the light-shielding member has a first surface and a second surface facing each other, the second surface having a second blocking portion for restricting the movement of the test light source.

[0012] Optionally, the light-shielding element is in the form of a sheet.

[0013] Optionally, the support portion has a third screw hole, the support member has a through fourth screw hole, and the light-shielding member has a through fifth screw hole; the testing device further includes: a second threaded fastener, which passes through the fifth screw hole and the fourth screw hole in sequence and is fixed to the third screw hole.

[0014] Optionally, the probe card is also used to support a lens located between the chip under test and the test light source. The height of the support is determined based at least on the reference focal length of the lens and the height of the support portion, wherein the height of the support refers to the distance between the first side and the second side.

[0015] Compared with the prior art, the technical solution of this utility model embodiment has the following beneficial effects:

[0016] This utility model provides a testing device, including: a probe card, comprising a support portion and a probe portion, the probe portion having a probe for contacting a non-photosensitive area of ​​a chip under test, the support portion protruding from the probe portion; a support member having a first side and a second side opposite to each other along a first direction, the first side being fixed to the support portion; and a test light source supported by the second side of the support member, with the light-emitting surface of the test light source facing the probe portion.

[0017] In the above solution, a support is provided in the testing device to elevate the test light source, thereby increasing the distance between the test light source and the probe card, and thus increasing the effective area of ​​the test light source. This helps ensure that all chips under test on the probe card are within the effective area of ​​the light source. Therefore, the solution of this utility model embodiment can increase the effective area of ​​the test light source without increasing the size of the light source itself, meeting the testing needs of testing larger-sized chips or multiple chips simultaneously.

[0018] Furthermore, the inner wall of the support is mirrored. This structure allows the light emitted from the test light source to undergo multiple reflections on the inner wall before finally reaching the photosensitive surface of the chip under test. This structure not only ensures that the test light completely covers the photosensitive area of ​​the chip under test, increasing the testing accuracy of edge pixels, but also increases the light intensity through multiple reflections to compensate for the light intensity loss caused by the elevated test light source.

[0019] Furthermore, the second side of the support member has a first blocking portion, which restricts the movement of the test light source. This design avoids light leakage caused by the movement of the test light source 22 during testing, thus improving test accuracy.

[0020] Furthermore, the support member is obtained through a blackening process. By blackening the support member 21, the surface of the support member 21 becomes black. Utilizing the light-absorbing properties of black, it is beneficial to suppress interference from external light. Attached Figure Description

[0021] Figure 1 This is a top view of a probe card;

[0022] Figure 2 This is a side view schematic diagram of a testing device according to an embodiment of the present utility model;

[0023] Figure 3 yes Figure 2 Top view of the middle support member 21;

[0024] Figure 4 This is a top view schematic diagram of another testing device in an embodiment of this utility model;

[0025] Figure 5 yes Figure 4 Top view of the middle support member 41;

[0026] Figure 6 yes Figure 4 A top view of the central shading element 43. Detailed Implementation

[0027] In chip testing (CP), the probe card is one of the core components. During the wafer testing phase, the probe card is used to connect the die under test (DUT) to the testing equipment, and its structural design directly affects the testing accuracy, reliability, and efficiency.

[0028] Reference Figure 1 , Figure 1 This is a top view diagram of a probe card. (Example) Figure 1As shown, the probe card 10 includes a substrate 11, probe sections 12, and an interface 13. The probe card 10 includes multiple probe sections 12, each probe section 11 having multiple probes for testing a single chip. The interface 13 is used for electrical connection with testing equipment. The substrate 11 supports the probes and provides an electrical connection path between the probes and the interface 13.

[0029] In addition, the probe card 10 also includes a support structure 14, which protrudes from the probe portion 12. In practical applications, the support structure is usually an epoxy resin frame, a metal ring, or a plastic bracket, etc.

[0030] In current CP testing, in order to ensure the stability of the test light source during testing, the test light source is usually placed directly on the support structure 14 to simulate actual lighting conditions.

[0031] As shown in the background art, the effective area of ​​the test light source needs to cover the entire pixel area of ​​the chip under test to ensure the accuracy of the test results. However, as the chip size increases, the wafer area in CP testing also increases, which may result in the effective area of ​​the light source not being able to completely cover the photosensitive area of ​​the chip. Alternatively, in order to increase the number of simultaneous CP tests, the number of probes 12 on the probe card 10 may be increased in the future. If the test light source remains unchanged, the effective area of ​​the light source may not be able to completely cover the photosensitive area of ​​the chip under test.

[0032] In view of this, the present invention provides a testing device, comprising: a probe card including a support portion and a probe portion, the probe portion having a probe for contacting a non-photosensitive area of ​​a chip under test, the support portion protruding from the probe portion; a support member having a first side and a second side opposite to each other along a first direction, the first side being fixed to the support portion; and a test light source supported by the second side of the support member, the light-emitting surface of the test light source facing the probe portion.

[0033] In the above solution, a support is provided in the testing device to elevate the test light source, thereby increasing the distance between the test light source and the probe card, and thus increasing the effective area of ​​the test light source. This helps ensure that all chips under test on the probe card are within the effective area of ​​the light source. Therefore, the solution of this utility model embodiment can increase the effective area of ​​the test light source without increasing the size of the light source itself, meeting the testing needs of testing larger-sized chips or multiple chips simultaneously.

[0034] Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same parts in each drawing. The embodiments are merely illustrative, and of course, partial substitutions or combinations can be made to the structures shown in different embodiments. In the variations, descriptions of matters common to Embodiment 1 are omitted, and only the differences are described. In particular, the same effects produced by the same structure will not be mentioned one by one in each embodiment.

[0035] Example 1

[0036] Reference Figure 2 , Figure 2 This is a side view schematic diagram of a testing device according to an embodiment of this utility model.

[0037] like Figure 2 As shown, the testing device 2 may include: a probe card 20, a support 21, and a test light source 22.

[0038] The probe card 20 may include a probe section (such as...) Figure 1 The chip 23 includes a probe portion 12 and a support portion 202. The probe portion includes a probe 201, which is used to contact a non-photosensitive area of ​​the chip under test 23. More specifically, the probe 201 contacts an electrical contact point on a non-photosensitive area of ​​the chip under test 23.

[0039] Furthermore, the probe section may also include a carrier section 25, which can be used to carry the chip under test 23.

[0040] It should be noted that, in the scheme of this application, the non-photosensitive area of ​​the chip under test 23 refers to the non-photosensitive area on the photosensitive surface of the chip under test 23. The non-photosensitive surface of the chip under test 23 is in contact with the carrier portion 25.

[0041] Furthermore, the support portion 202 protrudes from the probe portion. Specifically, the support portion 202 protruding from the probe portion means that, in the first direction, the upper end of the support portion 202 is higher than the upper end of the probe portion. The chip under test 23 may be an image sensor.

[0042] It should be noted that in this document, the first direction refers to the optical axis direction of the chip under test. In the accompanying drawings, the U direction represents the upward direction along the first direction, and the D direction represents the downward direction along the first direction. It should also be noted that the number of chips under test 23 and the number of probe sections in the accompanying drawings are merely examples, and this embodiment of the invention does not limit the number of chips under test 23 and the number of probe sections. For more information on the probe sections, please refer to the above description of the probe section 12, and for more information on the support section 202, please refer to the above description of the support structure 14.

[0043] Furthermore, the support member 21 is disposed above the support portion 202.

[0044] Specifically, the support member 21 has a first side and a second side along the first direction. The first side of the support member 21 is fixed to the support portion 202, and the second side of the support member 21 supports the test light source 22. In other words, the lower end of the support member 21 is fixed to the support portion 202, and the test light source 22 is disposed at the upper end of the support member 21.

[0045] Furthermore, the emitting surface of the test light source 22 faces the probe section. Specifically, the emitting surface of the test light source 22 faces the photosensitive surface of the chip under test 23.

[0046] It should be noted that the test light source 22 can be any light source capable of being used for CP testing, and this embodiment of the present invention does not limit the type or model of the test light source 22. For example, the test light source 22 can be a DC-driven light source. Also for example, the effective area of ​​the test light source 22 can be 110mm × 110mm, or it can be 150mm × 150mm.

[0047] Therefore, compared to the solution of directly mounting the test light source 22 on the support 202, Figure 2 In the illustrated scheme, the test light source 22 is elevated, increasing the distance between the test light source 22 and the chip under test 23. This increased distance is equivalent to the height of the support member 21. Figure 2 As shown, the height of the support member 21 is the distance H between the first side and the second side.

[0048] Reference Figure 3 , Figure 3 yes Figure 2 A top view of the middle support member 21.

[0049] like Figure 2 and Figure 3 As shown, the support member 21 may include a first main body 211 and a first blocking part 212, wherein the first blocking part 212 is located on the second side of the support member 21 and is used to restrict the movement of the test light source 22.

[0050] Specifically, the first blocking portion 212 protrudes from the upper surface of the first main body portion 211, and the size of the first blocking portion 212 is adapted to the test light source 22 to restrict the movement of the test light source 22. This design avoids light leakage caused by the movement of the test light source 22 during testing, thus improving test accuracy. In specific implementations, the height of the first blocking portion 212 can be greater than, equal to, or less than the thickness of the test light source 22. The height of the first blocking portion 212 can refer to its height in the first direction, and the thickness of the test light source 22 can refer to its height in the first direction. Therefore, when the height of the first blocking portion 212 is greater than or equal to the thickness of the test light source 22, the movement of the test light source 22 can be effectively restricted.

[0051] Furthermore, the “height of the support member 21” mentioned above may refer to the height of the first main body 211.

[0052] In one possible implementation, the first main body 211 is hollow so that light emitted from the test light source 22 can pass through the support 21 and illuminate the photosensitive surface of the chip under test 23. More specifically, the hollow portion of the first main body 211 extends through the first and second sides of the support 21 to form a light path.

[0053] Furthermore, the inner wall of the first main body 211 can be mirrored. In other words, the inner wall of the first main body 211 can be mirrored. This structure allows the light emitted from the test light source 22 to undergo multiple reflections on the inner wall before illuminating the photosensitive surface of the chip under test 23. This structure not only helps ensure that the test light completely covers the photosensitive area of ​​the chip under test 23, increasing the testing accuracy of the edge pixels of the chip under test 23, but also helps increase the light intensity through multiple reflections to compensate for the light intensity loss caused by the elevated position of the test light source 22.

[0054] In specific implementations, the first main body 211 and the first blocking part 212 can be integrally formed. In other possible implementations, the first blocking part 212 can also be fixed to the first main body 211 by other appropriate fixing methods (such as welding, gluing, etc.).

[0055] In specific implementations, the support member 21 can be obtained through a blackening process. That is, the surface of the support member 21 is black. It should be noted that the specific process of the blackening process is not limited in this embodiment of the invention. For example, it can be a hot blackening process, a steam blackening process, a room temperature blackening process, etc. By blackening the support member 21, the surface of the support member 21 is made black. Utilizing the light-absorbing properties of black, it is beneficial to suppress interference from external light.

[0056] In a specific implementation, the support portion 202 has a first threaded hole (not shown), and the support member 21 has a through second threaded hole 213. More specifically, the first main body portion 211 is provided with a through second threaded hole 213 along a first direction. Furthermore, the testing device 2 also includes a first threaded fastener (not shown), which passes through the second threaded hole 213 and is fixed in the first threaded hole. Thus, the support member 21 is fixed to the support portion 202. The first threaded fastener can be a bolt, nut, screw assembly, etc., but is not limited to these.

[0057] It should be noted that the present invention does not limit the position of the first screw hole, the number and position of the second screw holes 213.

[0058] In the CP test, a lens 24 is also positioned above the chip under test 23, between the chip under test 23 and the test light source 24. Specifically, the lens 23 can be fixedly embedded in each through-hole of the probe card 20 (e.g., Figure 1 In the probe section 12 shown, the lens 24 does not contact the chip under test 23. It should be noted that in this embodiment, the "lens" is part of the testing system and is a dedicated lens module for the chip under test 23. Different models of the chip under test 23 correspond to different lenses 24. The "lens" in this embodiment can also be called a "lens," "lens module," etc. In CP testing, the testing system may also include filters, such as a light-diffusing filter, an infrared filter, a Mylar filter, etc.

[0059] In practice, to ensure the accuracy of the test results, the chip under test 23 needs to be located on the focal plane of the lens 24.

[0060] In this embodiment, by providing the support member 21, the distance between the lens 24 and the test light source 22 can be increased, while the distance between the lens 24 and the photosensitive surface of the chip under test 23 remains unchanged.

[0061] In a specific implementation, the height of the support member 21 can be determined based on the reference focal length of the lens 24 and the distance between the lens and the test light source 22. For example, the height of the support member 21 can be the reference focal length of the lens 24 minus the distance between the lens 24 and the test light source 22. The reference focal length of the lens 24 can be its minimum focusing distance. In a specific implementation, the height of the support member 21 is not less than 2 millimeters.

[0062] Example 2

[0063] Reference Figure 4 , Figure 4This is a side view schematic diagram of another testing device in an embodiment of this utility model. Specifically, the testing device 4 may include: a probe card 20, a support member 41, a test light source 22, and a light shield 43.

[0064] As described above, the probe card 20 may include a probe portion and a support portion 202. The probe 201 of the probe portion is used to contact the non-photosensitive area of ​​the chip under test 23. The support portion 202 protrudes from the probe portion.

[0065] Furthermore, the support member 41 is disposed above the support portion 202, and the light-shielding member 43 is disposed above the support member 41.

[0066] Specifically, the support member 41 has a first side and a second side along the first direction. The first side of the support member 41 is fixed to the support portion 202, and the second side of the support member 41 is fixed to the light-shielding member 43. In other words, the lower end of the support member 21 is fixed to the support portion 202, and the upper end of the support member 41 is fixed to the light-shielding member 43. The light-shielding member 43 is sheet-shaped.

[0067] Reference Figure 5 and Figure 6 , Figure 5 yes Figure 4 Top view of the middle support member 41 Figure 6 yes Figure 4 A perspective view of the light-shielding component 43.

[0068] In one possible implementation, the support portion has a third threaded hole (not shown), the support member 41 has a through fourth threaded hole 411, and the light-shielding member 43 has a through fifth threaded hole 432. Furthermore, the testing device 4 may also include a second threaded fastener, which passes sequentially through the fifth threaded hole 432 and the fourth threaded hole 411, and is fixed in the third threaded hole. The second threaded fastener may be a bolt, nut, or screw assembly, but is not limited to these.

[0069] It should be noted that the present invention does not limit the fixing method between the support member 41, the support part 202 and the light shield 43.

[0070] Furthermore, the test light source 22 is mounted on the light-shielding plate 43. More information about the test light source 22 can be found in the description above.

[0071] Specifically, the light-shielding member 43 is hollow, and the support member 41 is hollow. The hollow part of the support member 41 is aligned with the hollow part of the light-shielding member 43 so that the light emitted by the test light source 22 can pass through the light-shielding member 43 and the support member 41 to illuminate the photosensitive surface of the chip under test 23.

[0072] In this embodiment, the projection of the support member 41 onto the plane of the probe card 20 is within the projection range of the light-shielding member 43 onto the plane of the probe card 20. In a specific implementation, the light-shielding member 43 may be blackened.

[0073] like Figure 4 and Figure 6 As shown, the light-shielding sheet 43 may include a second main body portion 433 and a second blocking portion 431. The second blocking portion 431 protrudes from the upper surface of the second main body portion 433, that is, in the first direction, the upper end of the second blocking portion 431 is above the upper end of the second main body portion 433.

[0074] Furthermore, the dimensions of the second blocking portion 432 are adapted to the test light source 22 to restrict the movement of the test light source 22. In a specific implementation, the height of the second blocking portion 431 can be greater than, equal to, or less than the thickness of the test light source 22. The height of the second blocking portion 431 can refer to the height of the second blocking portion 212 in the first direction. This design avoids light leakage caused by the movement of the test light source 22 during testing, thus improving the accuracy of the test.

[0075] In a specific implementation, the second main body 433 and the second blocking part 431 can be integrally formed. In other possible implementations, the second blocking part 431 can be fixed to the second main body 433 by other appropriate fixing methods (such as welding, gluing, etc.).

[0076] For more details on Example 2, please refer to the relevant description of Example 1, which will not be repeated here.

[0077] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0078] In this application's embodiments, "multiple" refers to two or more. The descriptions of "first," "second," etc., appearing in this application's embodiments are merely illustrative and for distinguishing the described objects; they do not indicate any order and do not imply a specific limitation on the number of devices in this application's embodiments, nor do they constitute any limitation on the embodiments of this application. Although the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

[0079] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A test device, characterized by include: A probe card includes a support portion and a probe portion, wherein the probe portion has a probe for contacting a non-photosensitive area of ​​a chip under test, and the support portion protrudes from the probe portion. The support member has a first side and a second side opposite to each other along a first direction, the first side being fixed to the support portion; The test light source is supported by the second side of the support member, and the light-emitting surface of the test light source faces the probe portion.

2. The test device of claim 1, wherein, The support is hollow, and its inner wall is mirrored.

3. The test device of claim 1, wherein, The second side of the support has a first blocking portion, which is used to restrict the movement of the test light source.

4. The testing apparatus according to claim 1, characterized in that, The support component is obtained through a blackening process.

5. The testing apparatus according to claim 1, characterized in that, The support portion has a first screw hole, and the support member has a through second screw hole; The testing device further includes: a first threaded fastener, which passes through the second threaded hole and is fixed to the first threaded hole.

6. The testing apparatus according to claim 1, characterized in that, Also includes: A light-shielding component is disposed between the support component and the test light source; The projection of the support member onto the plane where the probe card is located is within the range of the projection of the light-shielding member onto the plane where the probe card is located.

7. The testing apparatus according to claim 6, characterized in that, The light-shielding member has a first surface and a second surface facing each other, the second surface having a second blocking portion for restricting the movement of the test light source.

8. The testing apparatus according to claim 6, characterized in that, The light-shielding element is sheet-shaped.

9. The testing apparatus according to claim 6, characterized in that, The support portion has a third screw hole, the support member has a through fourth screw hole, and the light-shielding member has a through fifth screw hole; The testing device further includes a second threaded fastener, which passes through the fifth threaded hole and the fourth threaded hole in sequence and is fixed to the third threaded hole.

10. The testing apparatus according to claim 1, characterized in that, The probe card is also used to support a lens located between the chip under test and the test light source. The height of the support is determined based at least on the reference focal length of the lens and the height of the support portion, wherein the height of the support refers to the distance between the first side and the second side.

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