Processing device, substrate processing device, method for producing semiconductor apparatus, and program

Abstract

The present invention comprises: a display unit capable of displaying a recipe, in which conditions for processing a substrate is defined for each of a plurality of steps, on an edit screen which includes a setting value display region for displaying, in a table format defined by the axis of the steps and the axis of a plurality of items constituting the conditions, a plurality of setting values set at intersections between the plurality of items and the plurality of steps, and includes a setting value selection instruction region configured to be able to receive an operation instruction including at least a selection operation for the plurality of setting values, and which is configured such that the plurality of setting values are editable; and a control unit capable of performing control to receive an operation instruction regarding the setting values for the setting value selection instruction region, execute the operation instruction for the plurality of setting values displayed in the setting value display region, and edit the edit screen.

Description

Processing apparatus, substrate processing apparatus, method for manufacturing semiconductor device, and program

[0001] The present disclosure relates to a processing apparatus, a substrate processing apparatus, a method for manufacturing a semiconductor device, and a program.

[0002] In the manufacturing process of a semiconductor device, a recipe used may be edited, and processing may be performed on a substrate (see, for example, Patent Document 1).

[0003] International Publication No. 2019 / 186649

[0004] The present disclosure provides a technology capable of improving work efficiency during recipe editing.

[0005] According to one aspect of the present disclosure, there is provided a technology including a display unit capable of displaying an edit screen including a set value display area in which a plurality of set values set at intersections of the plurality of items and the plurality of steps are displayed in a table format defined by an axis of the steps and an axis of the plurality of items constituting the conditions for processing a substrate, and a set value selection instruction area configured to be able to receive an operation instruction including at least a selection operation on the plurality of set values, and a control unit configured to receive an operation instruction of a set value for the set value selection instruction area and execute the operation instruction on the plurality of set values displayed in the set value display area to control editing of the edit screen.

[0006] According to the present disclosure, work efficiency during recipe editing can be improved.

[0007] Figure 1 is a perspective view showing an example of a substrate processing apparatus according to the embodiment. Figure 2 is a cross-sectional view of the substrate processing apparatus according to the embodiment, viewed from the side. Figure 3 is a block diagram showing an example of the functional configuration of the control device provided in the substrate processing apparatus according to the embodiment. Figure 4 is a diagram showing an example of a recipe editing screen according to the embodiment. Figure 5 is a diagram showing an example of a recipe editing screen displayed when the display switching button is pressed in the recipe editing screen of Figure 4. Figure 6 is a diagram showing an example of a setting value selection instruction area displayed in the recipe editing screen according to the embodiment. Figures 7(A) and 7(B) are flowcharts showing the range selection process in the recipe editing screen according to the embodiment.

[0008] Hereinafter, one aspect of this disclosure will be described with reference primarily to Figures 1 to 7. Note that the drawings used in the following description are all schematic, and the dimensional relationships and proportions of the elements shown in the drawings do not necessarily correspond to reality. Furthermore, the dimensional relationships and proportions of the elements do not necessarily correspond between multiple drawings. Elements that are substantially the same as those described in multiple drawings will be given the same reference numeral, and their descriptions will be omitted. Moreover, this disclosure is not limited in any way to the following embodiments, and can be implemented with appropriate modifications within the scope of this disclosure.

[0009] First, an overview of the substrate processing apparatus according to this embodiment will be described with reference to Figures 1 and 2.

[0010] Figure 1 is a perspective view showing an example of a substrate processing apparatus 10 according to this embodiment. Figure 2 is a cross-sectional view of the substrate processing apparatus 10 according to this embodiment, viewed from the side. Figures 1 and 2 show a vertical substrate processing apparatus 10 as an example of a substrate processing apparatus. The substrate processed in the substrate processing apparatus 10 is shown as an example of a semiconductor wafer made of silicon or the like. In this specification, the term "wafer" may mean the wafer itself or a laminate of a wafer and a predetermined layer or film formed on its surface. In this specification, the term "surface of the wafer" may mean the surface of the wafer itself or the surface of a predetermined layer formed on the wafer. In this specification, when it is written that "a predetermined layer is formed on the wafer," it may mean that the predetermined layer is directly formed on the surface of the wafer itself or that the predetermined layer is formed on a layer or the like that is formed on the wafer. In this specification, the term "substrate" is used in the same sense as when the term "wafer" is used.

[0011] As shown in Figures 1 and 2, the substrate processing apparatus 10 includes a housing 111. A pod loading / unloading port 112 is provided in the front wall 111a of the housing 111, connecting the inside and outside of the housing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (loading / unloading port opening / closing mechanism) 113. A load port (substrate transport container transfer table) 114 is installed on the front front side of the pod loading / unloading port 112.

[0012] The pod 110 is a sealed substrate transport container, and is configured to be loaded onto the load port 114 by an in-process transport device (not shown) and unloaded from the load port 114.

[0013] A rotating pod shelf (substrate transport container storage shelf) 105 is installed in the upper part of the enclosure 111, approximately in the center in the front-to-back direction. The rotating pod shelf 105 is equipped with multiple shelves (substrate transport container mounting shelves) 117, which are configured to store pods 110 with at least one pod placed on them.

[0014] A pod opener (a mechanism for opening and closing the lid of a substrate transport container) 121 is provided below the rotating pod shelf 105. The pod opener 121 has a configuration that allows it to place a pod 110 on top of it and to open and close the lid of the pod 110.

[0015] A pod transport mechanism (container transport mechanism) 118 is installed between the load port 114, the rotating pod rack 105, and the pod opener 121, and is configured to transport pods 110 between the load port 114, the rotating pod rack 105, and the pod opener 121.

[0016] A sub-casing 119 is provided at the lower part of the enclosure 111, approximately in the center in the front-to-back direction, extending to the rear end. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 are provided on the front wall 119a of the sub-casing 119 for loading and unloading wafers 200 as substrates into and out of the sub-casing 119.

[0017] The pod opener 121 includes a mounting base 122 on which the pod 110 is placed, and an opening / closing mechanism 123 for opening and closing the lid of the pod 110. The pod opener 121 is configured to open and close the wafer entrance / exit of the pod 110 by opening and closing the lid of the pod 110, which is placed on the mounting base 122, using the opening / closing mechanism 123.

[0018] The sub-enclosure 119 constitutes a transfer chamber 124 that is airtight from the space (pod transfer space) where the pod transport mechanism 118 and the rotating pod shelf 105 are located. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front area of ​​the transfer chamber 124. The wafer transfer mechanism 125 is configured to allow a predetermined number of wafers 200 (5 in Figure 2) to move linearly in the horizontal direction, rotate horizontally, or move up and down. The wafer transfer mechanism 125 is configured to load and unload wafers 200 into and out of the boat (substrate holder) 217.

[0019] A waiting area 126 is provided in the rear region of the transfer chamber 124 to house and hold the boat 217, and a vertical processing furnace 202 is provided above the waiting area 126. The processing furnace 202 is also called a processing container for processing the wafer 200.

[0020] Next, the operation of the substrate processing device 10 will be described.

[0021] When a pod 110 is supplied to the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113. The pod 110 on the load port 114 is loaded into the interior of the housing 111 through the pod loading / unloading port 112 by the pod transport mechanism 118 and placed on a designated shelf 117 of the rotating pod rack 105. After being temporarily stored on the rotating pod rack 105, the pod 110 is transported by the pod transport mechanism 118 from the shelf 117 to one of the pod openers 121 and transferred to the mounting platform 122, or it is transferred directly from the load port 114 to the mounting platform 122.

[0022] The pod 110, placed on the mounting table 122, has its open end face pressed against the opening edge of the wafer loading / unloading port 120 on the front wall 119a of the sub-housing 119, and the lid is removed by the opening / closing mechanism 123, opening the wafer entrance / exit.

[0023] When the pod 110 is opened by the pod opener 121, the wafer transfer mechanism 125 takes the wafer 200 out of the pod 110, carries it to the standby unit 126, and loads (charges) it into the boat 217.

[0024] Once a predetermined number of wafers 200 are loaded into the boat 217, the furnace opening of the processing furnace 202, which had been closed by the furnace opening shutter 147, is opened by the furnace opening shutter 147. Subsequently, the boat 217 is raised by the boat elevator 115 and loaded into the processing chamber 201.

[0025] After loading, the furnace opening is hermetically sealed by the seal cap 219. In this embodiment, at this timing (after loading), there is a purging process (pre-purging process) in which the processing chamber 201 is replaced with an inert gas.

[0026] The processing chamber 201 is evacuated by a vacuum pump (not shown) to achieve a desired pressure (vacuum level). The processing chamber 201 is also heated to a predetermined temperature by a heater (not shown) to achieve a desired temperature distribution.

[0027] Furthermore, a processing gas controlled to a predetermined flow rate is supplied by a processing gas supply source (not shown), and as the processing gas flows through the processing chamber 201, it comes into contact with the surface of the wafer 200, and a predetermined process is performed on the surface of the wafer 200. In addition, the processing gas after the reaction is exhausted from the processing chamber 201 by a gas exhaust mechanism (not shown). Note that the processing gas referred to here is the gas supplied into the processing chamber 201. These same conditions apply in the following explanation.

[0028] Once the pre-set processing time has elapsed, inert gas is supplied from an inert gas supply source (not shown), replacing the processing chamber 201 with inert gas and returning the pressure in the processing chamber 201 to atmospheric pressure (after-purge process). Then, the boat 217 is lowered via the seal cap 219 by the boat elevator 115. The processing time referred to here means the time during which the processing is continued. These terms are also used in the following explanation.

[0029] For the removal of the processed wafers 200, the wafers 200 and pods 110 are discharged outside the housing 111 in the reverse procedure of the above description. Unprocessed wafers 200 are then loaded into boats 217, and batch processing of wafers 200 is performed. Alternatively, pods 110 containing processed wafers 200 may be temporarily stored on a rotating pod shelf 105, and then transported from shelf 117 to load port 114 by a pod transport mechanism 118, and discharged outside the housing 111.

[0030] As shown in Figures 1 and 2, the substrate processing apparatus 10 includes a control device 100. The control device 100 controls the substrate processing apparatus 10. The control device 100 may be built into the substrate processing apparatus 10, or it may be provided externally so as to be accessible from the substrate processing apparatus 10.

[0031] Next, with reference to Figure 3, the configuration of the control system of the substrate processing apparatus 10 according to this embodiment will be described. Figure 3 is a block diagram showing an example of the functional configuration of the control device 100 provided in the substrate processing apparatus 10 according to this embodiment.

[0032] As shown in Figure 3, the substrate processing apparatus 10 includes a control device (main controller) 100 as a control unit, an external communication unit 301, an external storage unit 302, an operation unit 303, a display unit 304, a process control unit 305, and a drive control unit 306.

[0033] The control device 100 includes a CPU (Central Processing Unit) 100a, a RAM (Random Access Memory) 100b, a storage unit 100c, and an I / O port 100d.

[0034] The control device 100 is connected to the operation unit 303 and the display unit 304, and is also connected to the process control unit 305 and the drive control unit 306 via the I / O port 100d. Since the control device 100 is electrically connected to each of the process control unit 305 and the drive control unit 306 via the I / O port 100d, it is configured to enable the transmission and reception of various data, as well as the download and upload of various files.

[0035] The control device 100 is connected to an external host computer (not shown) via an external communication unit 301. Therefore, even if the substrate processing device 10 is installed in a cleanroom, the host computer can be located in an office or other location outside the cleanroom. The control device 100 is also connected to an external storage unit 302, which serves as a mounting unit for inserting and removing a USB (Universal Serial Bus) memory, an example of a recording medium.

[0036] The operation unit 303 has an integrated display unit 304, or is connected to the display unit 304 via a video cable or the like. The display unit 304 is, for example, a liquid crystal display panel. The display unit 304 is configured to display various operation screens for operating the substrate processing apparatus 10. The operation screens include a substrate processing recipe editing screen 12 for controlling the process system controlled by the process control unit 305 and the drive system controlled by the drive control unit 306. The display unit 304 is configured to display the substrate processing recipe editing screen 12 in which processing procedures and processing conditions are defined. The operation unit 303 is configured to allow editing of the processing procedures and processing conditions of the recipe via the recipe editing screen 12. The operation unit 303 also outputs the information displayed on the display unit 304 to a device such as a USB memory inserted into the external storage unit 302. The operation unit 303 receives input data (input instructions) from the operation screens displayed on the display unit 304 and transmits the input data to the control device 100. Furthermore, the operation unit 303 is configured to receive instructions (control instructions) to execute any board processing recipe (also called a process recipe) from among the multiple recipes stored in the RAM 100b or the memory unit 100c, and to transmit these instructions to the control device 100. The operation unit 303 and the display unit 304 may be configured as touch panels. Here, the operation unit 303 and the display unit 304 are provided separately from the control device 100, but they may also be integrated into the control device 100.

[0037] The process control unit 305 includes a temperature control unit 307, a gas flow rate control unit 308, and a pressure control unit 309, etc. The temperature control unit 307, gas flow rate control unit 308, and pressure control unit 309, etc., each constitute a subcontroller and are electrically connected to the process control unit 305. Therefore, it is configured to enable the transmission and reception of various data, as well as the download and upload of various files. Although the process control unit 305 and each subcontroller (temperature control unit 307, gas flow rate control unit 308, and pressure control unit 309, etc.) are shown separately in the diagram, they may also be configured as an integrated unit.

[0038] The temperature control unit 307 is configured to control the processing temperature based on the set values ​​for each zone set in the recipe and the measured values ​​detected by temperature sensors (not shown) installed in each zone. The temperature control unit 307 is configured to adjust the temperature inside the processing chamber 201 or the temperature of the wafer 200 by controlling the temperature of the heaters (not shown) in each zone. Here, processing temperature refers to the temperature of the wafer 200 or the temperature inside the processing chamber 201.

[0039] The gas flow control unit 308 is configured to adjust the gas flow rate into the processing chamber 201 to a desired rate based on the set value set in the recipe and the measurement value detected by the gas flow sensor (not shown). The gas flow control unit 308 is also configured to control the opening and closing operation of the valves in accordance with the open and closed state of the valves set in the recipe. The gas flow control unit 308 is configured to adjust the gas flow rate into the processing chamber 201 by controlling the opening and closing of the valves and the mass flow controller (MFC), which is a flow controller (flow control unit).

[0040] The pressure control unit 309 is configured to control the processing pressure based on the set value set in the recipe and the pressure value detected by the pressure sensor (not shown). The pressure control unit 309 is configured to control the switching (on / off) of the pressure regulator and the vacuum pump so that the pressure in the processing chamber 201 becomes the desired pressure at the desired timing. The processing pressure referred to here means the pressure inside the processing chamber 201.

[0041] The drive control unit 306 includes a transport control unit 311, a rotation control unit 312, and a lifting control unit 313, etc. Although the drive control unit 306 and the transport control unit 311, rotation control unit 312, and lifting control unit 313 are shown as separate components, they may be integrated into a single unit.

[0042] The transport control unit 311 is configured to control the transport operations of, for example, the boat elevator 115, the pod transport mechanism 118, and the wafer transfer mechanism 125.

[0043] The rotation control unit 312 is configured to control the rotation operations of, for example, the pod transfer mechanism 118, the wafer transfer mechanism 125, the rotary shaft 116 disposed at the center of the rotary pod rack 105, and the like.

[0044] The lifting control unit 313 is configured to control the lifting operations of, for example, the boat elevator 115, the pod transfer mechanism 118, and the wafer transfer mechanism 125, and the like.

[0045] Note that the control device 100, the process control unit 305, and the drive control unit 306 according to the present embodiment can be realized using a normal computer system, rather than a dedicated system. For example, by installing a program for executing the above-described processing from a recording medium (such as a CD-ROM, USB, etc.) storing the program into a general-purpose computer, each controller for executing a predetermined process can be configured.

[0046] And the means for supplying these programs is arbitrary. In addition to being supplied via a predetermined recording medium as described above, it may be supplied via, for example, a communication line, a communication network, and a communication system.

[0047] The control device 100 is configured as a computer including a CPU 100a, a RAM 100b, a storage unit 100c, and an I / O port 100d. In the storage unit 100c, various recipe files such as recipes in which processing procedures and processing conditions are defined, control program files for executing these recipe files, parameter files (setting value files) for setting processing procedures and processing conditions, error processing program files and error processing parameter files, as well as various screen files including an input screen for inputting process parameters, various icon files, etc. (none of which are shown) are stored. Note that the control device 100 is connected to a network such as the Internet, a LAN (Local Area Network), or a WAN (Wide Area Network) using the external communication unit 301, and is capable of communicating with external devices via the network.

[0048] Further, as the storage unit 100c, for example, an HDD (Hard Disk Drive), an SSD (Solid State Drive), a flash memory, or the like is used. A recipe editing processing program for executing the recipe editing process according to the present embodiment is stored in the storage unit 100c.

[0049] The recipe editing processing program may be, for example, pre-installed in the substrate processing apparatus 10. The recipe editing processing program may be recorded on a non-volatile recording medium, distributed via a network, and appropriately installed in the substrate processing apparatus 10. Examples of the non-volatile recording medium include a CD-ROM, a magneto-optical disk, an HDD, a DVD-ROM, a flash memory, a memory card, and a USB.

[0050] That is, the recipe editing processing program is a program (also referred to as a program product) for causing a computer to execute, in the substrate processing apparatus 10, a procedure for editing a recipe that defines the processing procedure and processing conditions of the wafer 200, and a procedure for processing the wafer 200 using the edited recipe.

[0051] Next, an example of the recipe editing process according to the present embodiment will be described. FIG. 4 is a diagram showing an example of a recipe editing screen 12 displayed on the display unit 304. The recipe editing screen 12 is display-controlled by the control device 100 according to an operation of the operation unit 303 and is displayed on the display unit 304.

[0052] On the recipe editing screen 12, the processing procedure in one step of the semiconductor device manufacturing process, the processing conditions in each processing procedure, and a plurality of set values of the processing conditions in each processing procedure are configured to be editable. Here, editing includes adding or deleting a processing procedure, adding or deleting a processing condition, inputting, copying, pasting, changing, deleting, etc. of set values that are parameters of each processing condition in each processing procedure.

[0053] The manufacturing process for semiconductor devices involves numerous processing steps, each with a large number of processing conditions. Therefore, in the tabular recipe editing screen, the display area per cell for entering settings is small, and the spacing between adjacent cells is narrow. This can lead to errors, especially when working in a cleanroom, due to the use of protective gloves and cleanroom clothing, potentially resulting in decreased work efficiency.

[0054] In this embodiment, editing of the setting values ​​in the setting value display area 14 is performed on the recipe editing screen 12 by issuing operation instructions to the setting value selection instruction area 16. That is, the recipe editing screen 12 is provided with a setting value selection instruction area 16 as an auxiliary tool for recipe editing operations, separate from the setting value display area 14 which displays the setting values ​​of each item that are processing conditions in each of the multiple steps that constitute the processing procedure. By performing operations in the setting value display area 14 using the setting value selection instruction area 16, the operator can avoid errors and suppress a decrease in work efficiency.

[0055] The recipe editing screen 12 includes a setting value display area 14, a setting value selection instruction area 16, a display switching button, which is a display switching icon 18, and display position switching buttons, which are display position switching icons 20A to 20D.

[0056] The recipe editing screen 12 has multiple levels. The setting value display area 14 and the setting value selection instruction area 16 are located on different levels and are configured to be displayed independently. This makes it easier to manage the setting value display area 14 and the setting value selection instruction area 16. As shown in Figure 4, the setting value selection instruction area 16 is configured to be displayed overlaid on top of the setting value display area 14. By displaying the setting value selection instruction area 16, which is used to give operation instructions, in the foreground in this way, it becomes easier to edit the setting values.

[0057] The setting value display area 14 is configured in a table format in which the recipe for processing the wafer 200 is defined for each of several steps, with the steps on the vertical axis (Y-axis, also called columns) and the items constituting the conditions in each step on the horizontal axis (X-axis, also called rows), and the setting value is displayed at the intersection of the two axes.

[0058] Multiple items consist of several types, such as processing temperature, gas flow rate, processing pressure, and valve opening / closing. Set values ​​include multiple types of set values, such as temperature set values ​​for each zone, MFC flow rate set values, pressure values, and valve opening / closing operations.

[0059] The setting value selection instruction area 16 is configured to accept operation instructions that include at least one selection operation for multiple setting values ​​in the setting value display area 14, and is configured to allow editing of the setting value at the intersection of the two axes.

[0060] Furthermore, when the control device 100 receives an operation instruction for a setting value in the setting value selection instruction area 16, it is configured to execute an operation instruction on the cell (hereinafter referred to as the target cell) that is the selected setting value displayed in the setting value display area 14 to edit the recipe editing screen 12. In addition, the control device 100 is configured to be able to edit multiple setting values ​​displayed in the setting value display area 14 by receiving an operation instruction for a setting value in the setting value selection instruction area 16.

[0061] The display switching icon 18 is configured to switch the display mode of the setting value selection instruction area 16. For example, by pressing the display switching icon 18, the setting value selection instruction area 16 can be hidden, preventing it from being displayed superimposed on the setting value display area 14. Alternatively, by pressing the display switching icon 18, the setting value selection instruction area 16 can be displayed side-by-side with the setting value display area 14, as shown in Figure 5.

[0062] In other words, the control device 100 is configured to switch the display mode of the setting value selection instruction area 16 in response to the operation of the display switching icon 18, so as shown in Figure 4, it is displayed superimposed on the front of the setting value display area 14, so as shown in Figure 5, it is displayed next to the setting value display area 14, or the setting value selection instruction area 16 is hidden. This allows the setting value display area 14 to be displayed without any part of it being hidden, depending on the application.

[0063] The display position switching icons 20A to 20D are located at the top of the recipe editing screen 12 and are configured to allow switching the display position of the setting value selection instruction area 16 on the recipe editing screen 12 to the lower left, upper left, upper right, and lower right of the recipe editing screen 12, respectively. For example, by pressing the display position switching icon 20A, the display position of the setting value selection instruction area 16 can be made to overlap the setting value display area 14 in the lower left of the recipe editing screen 12.

[0064] In other words, the control device 100 is configured to switch the display position of the setting value selection instruction area 16 on the recipe editing screen 12 in response to the operation of the display position switching icons 20A to 20D. Furthermore, as shown in Figure 4, for example, the control device 100 is configured to have a different display color for the currently selected display position switching icon 20C than for the other display position switching icons 20A, 20B, and 20D. The display position switching icons 20A to 20D may also be placed at the four corners of the recipe editing screen 12. This prevents the target cell selected in the setting value display area 14 from being obscured by the setting value selection instruction area 16.

[0065] In Figure 5, when the setting value selection instruction area 16 is displayed next to the setting value display area 14 by operating the display switching icon 18, the display position switching icons 20A to 20D are hidden. However, the display position of the setting value selection instruction area 16 may also be switched while the display position switching icons 20A to 20D are displayed. In this case, the setting value selection instruction area 16 may be displayed outside the setting value display area 14 in accordance with the operation of the display position switching icons 20A to 20D. This can further improve operability.

[0066] Furthermore, the control device 100 is configured to switch the display position of the setting value selection instruction area 16 on the recipe editing screen 12 according to the position of the target cell selected in the setting value display area 14. Specifically, when the target cell selected in the setting value display area 14 approaches or is hidden by the setting value selection instruction area 16, the setting value selection instruction area 16 is configured to move to a position that does not overlap the selected target cell. This prevents the target cell selected in the setting value display area 14 from being obscured by the setting value selection instruction area 16. It also reduces the amount of operation required from the operator.

[0067] Next, the details of the setting value selection instruction area 16 will be explained using Figure 6.

[0068] The setting value selection instruction area 16 includes the selection item display area 22, the cell selection buttons Target1 key 24A and Target2 key 24B, the movement instruction button cross cursor key 26, the confirmation button Enter key 28, the range selection button Bridge key 30, the cancel button Cancel key 32, the edit button Edit key 34, the multiple cell selection button Ctrl key 36, the copy button Copy key 38, the paste button Paste key 40, the scroll control button Scroll Lock key 42, and the reframe button Reframe key 44. Note that none of the keys are always displayed; they may be shown or hidden depending on the state of each key. Alternatively, each key may be disabled depending on its state. This makes it possible to prevent erroneous operations. Furthermore, the arrangement of the keys is not limited to this; the arrangement can be changed to suit the user's preferences.

[0069] The selection item display area 22 displays the step name and item name, which are the names of the vertical and horizontal axes of the target cell selected in the setting value display area 14.

[0070] The Target1 key 24A instructs the start of cell selection in the setting value display area 14. The Target2 key 24B instructs the selection of the second cell displayed in the setting value display area 14. Then, using the target cell selected by pressing the Target1 key 24A as the starting point and the target cell selected by pressing the Target2 key 24B as the ending point, the system instructs the selection of multiple cells between the starting point and the ending point.

[0071] The cross cursor keys 26 instruct the selected target cell in the setting value display area 14 to move up, down, left, or right. The control device 100 is configured to switch the position of the selected target cell in the setting value display area 14 based on the operation instructions given by the cross cursor keys 26. Note that the cross cursor keys 26 may not only move the target cell up, down, left, or right, but may also include buttons to instruct movement in directions such as diagonally up-left, diagonally down-left, diagonally up-right, and diagonally down-right. An input area may also be provided to specify the coordinates indicating the position of the target cell. This makes it possible to move the target cell to the position of the cell being instructed, even when the cells on the recipe editing screen 12 are small and it is difficult to select the cell to be instructed.

[0072] Furthermore, the control device 100 is configured to switch the display of the target cell being instructed to move in the setting value display area 14 to a display color indicating that it is moving, while the movement of the selected target cell in the setting value display area 14 is instructed by the cross cursor keys 26. In addition, the control device 100 is configured to switch the display of a cell that has been deselected in the setting value display area 14 to a display color indicating deselection, the same as the unselected color of any other cell that is not selected, using the cross cursor keys 26. This allows the operator to clearly understand the position of the selected target cell in the setting value display area 14.

[0073] The Enter key 28 is configured to confirm the process when pressed. When the Enter key 28 is pressed, the selected cell may switch from its selected color to a different confirmation color.

[0074] The Bridge key 30 is pressed after two target cells have been selected by pressing the Target1 key 24A and the Target2 key 24B, thereby selecting a range between the target cell selected by the Target1 key 24A and the target cell selected by the Target2 key 24B. The control device 100 then switches the color of the range selected by the Target1 key 24A and the Target2 key 24B to a range selection color. In other words, the control device 100 changes the display color of the target cells that are selected in the set value display area 14 to a different color from the cells that are not selected in the range. This allows the operator to easily understand the range that has been selected in the set value display area 14.

[0075] When the Edit key 34 is pressed, the setting value of the selected target cell in the setting value display area 14 can be edited. Multiple cells of the same type can be edited simultaneously. Specifically, when the Edit key 34 is pressed, the setting value editing screen is displayed. The setting value editing screen includes an input range display area showing the range of inputtable setting values, a value input area for direct value input, a numeric keypad, an initial value display area showing the initial value, and a difference display area showing the difference from the initial value. This helps prevent user errors.

[0076] Furthermore, the control device 100 is configured to prevent editing if, when an edit instruction is received in response to an operation instruction for the setting value selection instruction area 16, and multiple cells are selected within the setting value display area 14, editing is not permitted if different types are included among the multiple cells. Specifically, for example, if the Edit key 34 is pressed while a range is selected in the setting value display area 14, editing is not permitted if the items of the selected cells include processing temperature and gas flow rate. This prevents incorrect input of setting values.

[0077] The Ctrl key 36 allows you to select multiple cells consecutively by using the cross cursor keys 26 to select cells in the up, down, left, and right directions, starting from the target cell selected in the setting value display area 14 when the Target1 key 24A is pressed. Alternatively, when pressing the Ctrl key 36, you may directly select cells in the setting value display area 14 to select multiple non-consecutive cells.

[0078] When the Copy key 38 is pressed, it temporarily stores the setting value of the selected target cell in the setting value display area 14 in the RAM 100b and puts it into a retained state (also called a stored state or copy state). The Copy key 38 can also temporarily store the setting values ​​of multiple target cells selected in a range in the setting value display area 14 in the RAM 100b and put them into a retained state.

[0079] In other words, the control device 100 can temporarily store one or more setting values ​​of the target cells selected or range-selected in the setting value display area 14 in the RAM 100b by operation instructions to the setting value selection instruction area 16. At this time, the information temporarily stored in the RAM 100b includes the setting values ​​of the selected or range-selected cells and the type of the corresponding cell. The information temporarily stored in the RAM 100b can be erased by pressing the Cancel key 32.

[0080] The Paste key 40 pastes (overwrites, or changes) the setting value of a cell that is currently in a holding state to the target cell selected in the setting value display area 14. The Paste key 40 can also paste the setting values ​​of multiple cells that are currently in a holding state to multiple target cells that are selected as a range in the setting value display area 14 at once. In other words, the control device 100 can change one or more setting values ​​of selected or range-selected target cells in the setting value display area 14 to one or more setting values ​​that are currently in a holding state.

[0081] At this time, the control device 100 controls the system to perform editing (also called pasting, overwriting, or changing) if the type of setting value of the cell being held is the same as the type of setting value of the target cell at the editing destination (also called the paste destination, overwrite destination, or change destination). In this case, the control device 100 controls the system to display on the recipe editing screen 12 that an editing operation has been performed by the operation unit 303.

[0082] Furthermore, the control device 100 controls the system so that it does not perform editing if the type of setting value of the cell being held is different from the type of setting value of the target cell to be edited. In other words, when the control device 100 receives an editing instruction while the cell's setting value is being held by an operation instruction to the setting value selection instruction area 16, it is configured to control the system so that it does not allow editing if the type of target cell selected in the setting value display area 14 is different.

[0083] In other words, when the control device 100 receives an instruction to edit a setting value in another cell by assigning it to the setting value selection instruction area 16, it is configured to prevent editing if the type of setting value item in the cell being held is different from the type of setting value item in the target cell selected in the setting value display area 14 to be edited. In this case, the control device 100 controls the recipe editing screen 12 to display a message indicating that the editing operation by the operation unit 303 will not be performed.

[0084] Furthermore, when the control device 100 receives an instruction to assign and change multiple items through an operation instruction to the setting value selection instruction area 16, it is configured to control the device to change each item if the type of each item in the multiple cells held is the same as the type of each item in the target cells selected in the range in the setting value display area 14. Conversely, it is configured to control the device to not allow changes if the type of each item in the multiple cells held is different from the type of each item in the target cells selected in the range in the setting value display area 14. This prevents incorrect input of setting values ​​while improving work efficiency.

[0085] Specifically, for example, if an operation instruction is given to the setting value selection instruction area 16 and the item in the cell being held relates to the processing temperature, and the item in the target cell to which the data will be pasted relates to the gas flow rate, the system is configured not to perform pasting even if the Paste key 40 is pressed. For example, the display unit 304 will display a message such as, "The cell you are trying to edit contains the gas flow rate setting value. Temperature values ​​cannot be pasted."

[0086] When the Scroll Lock key 42 is pressed, the entire table can be moved without changing the position of the selected target cell in the setting value display area 14.

[0087] The Refram key 44 can display the target cell in the center of the recipe editing screen 12 if the position of the target cell selected in the setting value display area 14 exceeds the display range of the setting value display area 14.

[0088] Furthermore, when operating using a keyboard, operation instructions can be given to the setting value selection instruction area 16 using the same operations as those performed on the keyboard.

[0089] Next, an example of the recipe editing process according to this embodiment will be described with reference to Figures 7(A) and 7(B). Figures 7(A) and 7(B) are flowcharts showing an example of the recipe editing process.

[0090] (Step S11) First, in step S11, the process of selecting the starting cell to be edited in the setting value display area 14 will be explained. The selection of the starting cell is performed by the following steps S21 to S27.

[0091] In step S21, the Target1 key 24A in the setting value selection instruction area 16 is pressed.

[0092] Next, in step S22, the cell to be edited is selected in the setting value display area 14.

[0093] Next, in step S23, the display color of the selected cell in the setting value display area 14 is switched.

[0094] Next, in step S24, the cell is moved up, down, left, or right using the cross cursor keys 26 in the setting value selection instruction area 16.

[0095] Next, in step S25, the selected position of the cell in the setting value display area 14 moves up, down, left, or right in response to the movement operation using the cross cursor keys 26.

[0096] Next, in step S26, the display color of the selected cell in the setting value display area 14 is switched.

[0097] Next, in step S27, it is determined whether or not the Enter key 28 has been pressed. If it has not been pressed, the process returns to step S24, and the state of waiting for the selection position to be confirmed continues. If it has been pressed, the cell selection position is confirmed, and the position of the starting cell is confirmed.

[0098] (Step S12) Next, the process of selecting the end cell to be edited in the setting value display area 14 in step S12 will be described. The selection of the end cell is performed by steps S21 to S27 described above.

[0099] In step S21, the Target2 key 24B in the setting value selection instruction area 16 is pressed.

[0100] Next, in step S22, the cell to be edited is selected in the setting value display area 14.

[0101] Next, in step S23, the display color of the selected cell in the setting value display area 14 is switched.

[0102] Next, in step S24, the cell is moved up, down, left, or right using the cross cursor keys 26 in the setting value selection instruction area 16.

[0103] Next, in step S25, the selected position of the cell in the setting value display area 14 moves up, down, left, or right in response to the movement operation using the cross cursor keys 26.

[0104] Next, in step S26, the display color of the selected cell in the setting value display area 14 is switched.

[0105] Next, in step S27, it is determined whether or not the Enter key 28 has been pressed. If it has not been pressed, the process returns to step S24, and the state of waiting for the selection position to be confirmed continues. If it has been pressed, the selection position of the cell is confirmed, and the position of the final cell is confirmed.

[0106] (Step S13) Next, when the Bridge key 30 is pressed, the cells between the start cell selected by the Target1 key 24A and the end cell selected by the Target2 key 24B are continuously selected as a range, and multiple target cells are made available for editing. At this time, the display color of the range selected target cells in the setting value display area 14 is switched to a different color from the other cells.

[0107] In other words, the control device 100, in response to an operation instruction for the setting value selection instruction area 16, specifies the position of the start cell and the position of the end cell in the setting value display area 14, and instructs range selection when the Bridge key 30 is pressed. The control device 100 then displays the multiple target cells that have been selected within the range in the setting value display area 14 differently from the cells that have not been selected by the range selection. That is, it makes it possible to identify that a range has been selected.

[0108] As described above, in this embodiment, in the recipe editing screen 12, the operation instructions for editing the multiple setting values ​​selected in the setting value display area 14 are given in the setting value selection instruction area 16. This helps to avoid errors and suppress a decrease in work efficiency.

[0109] In the above description, a substrate processing apparatus according to the embodiment was used as an example, but the embodiment may also be in the form of a program that causes a computer to execute the functions of the substrate processing apparatus. The embodiment may also be in the form of a non-temporary recording medium that is readable by a computer that stores these programs.

[0110] Furthermore, the configuration of the substrate processing apparatus described in the above embodiment is merely an example, and may be modified as needed without departing from the main purpose.

[0111] Furthermore, the program processing flow described in the above embodiment is just one example, and unnecessary steps may be deleted, new steps added, or the processing order rearranged, as long as it does not deviate from the main purpose.

[0112] Furthermore, although the above embodiment describes a case in which the process according to the embodiment is realized by a software configuration using a computer by executing a program, the embodiment is not limited to this. The embodiment may also be realized by a hardware configuration or a combination of a hardware configuration and a software configuration.

[0113] Furthermore, the above embodiments described an example of forming a film using a batch-type substrate processing apparatus that processes multiple substrates at once. This disclosure is not limited to the above embodiments and can be suitably applied, for example, when forming a film using a single-wafer substrate processing apparatus that processes one or several substrates at once. Furthermore, the above embodiments described an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace. This disclosure is not limited to the above embodiments and can be suitably applied when forming a film using a substrate processing apparatus having a cold-wall type processing furnace.

[0114] Even when using these substrate processing devices, each process can be performed using the same processing procedures and conditions as in the above embodiment, and the same effects as in the above embodiment can be obtained.

[0115] 200 Wafer (substrate) 10 Substrate processing device 12 Recipe editing screen (editing screen) 14 Setting value display area 16 Setting value selection instruction area 100 Control device (control unit) 304 Display unit

Claims

1. A processing apparatus comprising: a display unit capable of displaying an editable screen in which the multiple setting values ​​are editable, and which displays a recipe in which the conditions for processing a substrate are defined for each of the multiple steps, in a tabular format defined by the axis of the step and the axis of the multiple items constituting the conditions, with the multiple setting values ​​set at the intersection of the multiple items and the multiple steps; and a setting value selection instruction area configured to accept operation instructions that include at least a selection operation for the multiple setting values; and a control unit capable of receiving operation instructions for the setting values ​​to the setting value selection instruction area and controlling the execution of the operation instructions for the multiple setting values ​​displayed in the setting value display area to edit the editable screen.

2. The processing apparatus according to claim 1, wherein the setting value selection instruction area is configured to be displayed superimposed on the setting value display area.

3. The apparatus according to claim 2, wherein the setting value selection instruction area is configured to be displayed in front of the setting value display area.

4. The processing apparatus according to claim 1, wherein the setting value selection instruction area is configured to be displayed alongside the setting value display area.

5. The processing apparatus according to claim 2, wherein the editing screen has multiple levels, and the setting value selection instruction area and the setting value display area are provided on different levels and are configured to be displayed independently.

6. The processing apparatus according to claim 1, wherein the editing screen includes a display switching button for switching the display mode of the setting value selection instruction area, and the control unit is configured to control the switching of the display mode of the setting value selection instruction area to either display it superimposed on the setting value display area or display it alongside the setting value display area, in response to the operation of the display switching button.

7. The processing apparatus according to claim 1, wherein the editing screen includes a display position switching button for switching the display position of the setting value selection instruction area, and the control unit is configured to control the switching of the display position of the setting value selection instruction area on the editing screen in response to the operation of the display position switching button.

8. The processing apparatus according to claim 1, wherein the control unit is configured to control the display position of the setting value selection instruction area on the editing screen according to the selection position of the setting value in the setting value display area.

9. The processing apparatus according to claim 1, wherein the control unit is configured to edit the plurality of setting values ​​displayed in the setting value display area by operation instructions for setting values ​​in the setting value selection instruction area.

10. The processing apparatus according to claim 1, wherein the setting value selection instruction area includes a move instruction button for instructing the movement of the selection position of the setting value displayed in the setting value display area, and the control unit is configured to control switching the selection position of the setting value displayed in the setting value display area based on the operation instruction of the selection position by the move instruction button.

11. The processing apparatus according to claim 10, wherein the control unit is configured to control the display of the setting value whose selection position in the setting value display area is being instructed to move, while the movement instruction button is instructing the movement of the selected position in the setting value display area, by switching the display color of the setting value whose selection position instructed to move in the setting value display area to a display color indicating that it is moving.

12. The processing apparatus according to claim 11, wherein the control unit is configured to control the display of a deselected setting value displayed in the setting value display area by the movement instruction button, and to switch the display color in the setting value display area to a display color indicating deselection.

13. The apparatus according to claim 10, wherein the control unit is configured to control the display of the setting value selected by range selection in the setting value display area when it receives an operation instruction for the setting value selection instruction area to select a setting value displayed in the setting value display area, so as to display the setting value selected by range selection differently from the setting value not selected by range selection.

14. The processing apparatus according to claim 1, wherein the plurality of items are composed of a plurality of types, and the control unit is configured to control the processing apparatus so as not to allow editing when it receives an edit instruction in the setting value display area with the plurality of items selected by an operation instruction to the setting value selection instruction area, and the selected plurality of items include a different type.

15. The processing apparatus according to claim 1, wherein the control unit is configured to hold the selected setting value of the setting value display area in response to an operation instruction for the setting value selection instruction area, and to control the other setting values ​​of the setting value display area to be changed to the held setting value.

16. The processing apparatus according to claim 15, wherein the plurality of items are composed of a plurality of types, and the control unit is configured to control the process so as not to permit the change when it receives an instruction to assign and change to another setting value by an operation instruction to the setting value selection instruction area, and the type of the item of the held setting value and the type of the item of the other setting value are different.

17. The processing apparatus according to claim 1, wherein the control unit is configured to hold the setting values ​​of the plurality of items in the selected setting value display area in response to an operation instruction for the setting value selection instruction area, and to control the setting values ​​of the other plurality of items in the setting value display area to be changed to the setting values ​​of the plurality of items that have been held.

18. The processing apparatus according to claim 17, wherein the plurality of items are composed of a plurality of types, and the control unit is configured to control the process so as not to permit the change when it receives an instruction to assign and change to one of the other plurality of items by means of an operation instruction to the setting value selection instruction area, and the types of each of the plurality of items that it has held are different from the types of each of the other plurality of items.

19. A substrate processing apparatus comprising: a display unit capable of displaying an editing screen configured to allow editing of the multiple setting values, which is set at the intersection of the multiple items and the multiple steps in a tabular format defined by the axis of the step and the axis of the multiple items constituting the conditions; a setting value selection instruction area configured to accept operation instructions that include at least a selection operation for the multiple setting values; a control unit capable of receiving operation instructions for the setting values ​​to the setting value selection instruction area and controlling the editing screen to edit the editing screen by executing the operation instructions for the multiple setting values ​​displayed in the setting value display area; and a processing container for processing the substrate.

20. A method for manufacturing a semiconductor device, comprising: a step of displaying an editing screen configured to allow editing of the multiple setting values, the editing screen having a setting value display area that displays a recipe for which the conditions for processing a substrate are defined for each of the multiple steps in a tabular format defined by the axis of the step and the axis of the multiple items constituting the conditions, the editing screen having a setting value selection instruction area configured to accept operation instructions that include at least a selection operation for the multiple setting values; a step of receiving operation instructions for the setting values ​​to the setting value selection instruction area, and editing the editing screen by executing the operation instructions for the multiple setting values ​​displayed in the setting value display area; and a step of processing the substrate.

21. A program that causes a computer to cause a substrate processing apparatus to execute the following steps: a setting value display area that displays a recipe for processing a substrate, in which conditions for processing a substrate are defined for each of the multiple steps, in a tabular format defined by the axis of the step and the axis of the multiple items constituting the conditions, with the multiple setting values ​​set at the intersection of the multiple items and the multiple steps; a setting value selection instruction area configured to accept operation instructions that include at least a selection operation for the multiple setting values, wherein the multiple setting values ​​are configured to be editable; a procedure to receive operation instructions for the setting values ​​to be set in the setting value selection instruction area, and to edit the edit screen by executing the operation instructions for the multiple setting values ​​displayed in the setting value display area; and a procedure to process the substrate.

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