Prober and measurement method using same
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO SEIMITSU CO LTD
- Filing Date
- 2025-10-10
- Publication Date
- 2026-07-02
Smart Images

Figure JP2025036008_02072026_PF_FP_ABST
Abstract
Claims
1. A method for measuring a prober having a chuck with an adsorption groove formed on its upper surface for applying negative pressure for adsorption, comprising: placing a workpiece to be measured on the upper surface of the chuck; adjusting the adsorption force due to the negative pressure according to the characteristics or condition of the workpiece; and bringing a probe into contact with the workpiece to perform a measurement.
2. The probe measurement method according to claim 1, wherein the step of adjusting the adsorption force is to adjust the adsorption force based on the temperature of the workpiece at the time of measurement.
3. The probe measurement method according to claim 2, wherein the step of adjusting the adsorption force is to acquire temperature information of the workpiece by bringing the probe into contact with the workpiece.
4. The probe measurement method according to claim 1, wherein the step of adjusting the suction force is to adjust the suction force based on the magnitude of the frictional resistance of the workpiece in contact with the upper surface of the chuck.
5. The probe measurement method according to any one of claims 1 to 4, wherein at least two levels are set as the adjustment level of the adsorption force, and the step of adjusting the adsorption force is to adjust the adsorption force in stages according to the characteristics or condition of the workpiece.
6. A prober for performing measurements by bringing a probe into contact with a workpiece, comprising: a chuck having a suction groove formed on its upper surface for applying negative pressure to attract the workpiece; a pressure adjustment unit for adjusting the suction force due to the negative pressure; and a control unit for controlling the pressure adjustment unit, wherein the control unit controls the pressure adjustment unit according to the characteristics or condition of the workpiece placed on the chuck, and adjusts the suction force due to the negative pressure.
7. The prober according to claim 6, wherein the control unit maintains an adjustment standard that associates information of the workpiece to be measured with the level of the suction force, acquires information of the workpiece placed on the chuck, identifies a level corresponding to the acquired workpiece information based on the adjustment standard, and controls the pressure adjustment unit so that the suction force becomes the identified level.
8. The prober according to claim 7, further comprising a pressure sensor for detecting negative pressure supplied to the chuck, wherein the control unit performs feedback control so that the pressure detected by the pressure sensor approaches a target pressure corresponding to the level of the suction force.
9. The prober according to claim 6, further comprising a temperature adjustment unit that adjusts the temperature of the chuck by heating or cooling the chuck, wherein the control unit controls the pressure adjustment unit based on the temperatures of both the workpiece and the chuck.