Conductive paste composition and electronic apparatus device

The conductive paste composition addresses dispersibility and structural issues by using a (meth)acrylic resin with controlled molecular weight and polyalkylene oxide distribution, ensuring improved dispersibility and blister resistance, thus enhancing the quality of electronic devices.

WO2026141123A1PCT designated stage Publication Date: 2026-07-02SEKISUI CHEMICAL CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2025-12-18
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Conventional conductive paste compositions face issues with dispersibility of inorganic particles, storage stability, void and pinhole generation during firing, and blister resistance, primarily due to the use of (meth)acrylic resins with polyalkylene oxide moieties that lead to structural defects in electronic devices.

Method used

A conductive paste composition utilizing (meth)acrylic resin with specific molecular weight ranges, polyalkylene oxide group distribution, and functional groups to enhance dispersibility, storage stability, and blister resistance, incorporating silver or copper conductive particles and a solvent with a controlled boiling point.

Benefits of technology

The composition achieves improved dispersibility of conductive particles, reduces voids and pinholes, and enhances electrode adhesion, resulting in superior blister resistance and production of high-quality electronic devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure JPOXMLDOC01-APPB-T000001
    Figure JPOXMLDOC01-APPB-T000001
  • Figure JPOXMLDOC01-APPB-T000002
    Figure JPOXMLDOC01-APPB-T000002
  • Figure JPOXMLDOC01-APPB-T000003
    Figure JPOXMLDOC01-APPB-T000003
Patent Text Reader

Abstract

The present invention is a conductive paste composition that contains a (meth)acrylic resin (A), inorganic particles (B), and a solvent (C). The (meth)acrylic resin (A) has a weight average molecular weight (Mw) of 20,000-600,000 and includes at least 50 wt% of a segment derived from a (meth)acrylic acid alkyl ester having an alkyl branched structure in an ester substituent thereof and 5-40 wt% of a segment derived from a (meth)acrylic acid ester in which an ester substituent thereof is a polyalkylene oxide group having a distribution in a chain length thereof. In the polyalkylene oxide group, the ratio (XP / ML) of the peak top molecular weight (XP) and the molecular weight variance width (ML) as evaluated by LC-MS is 0.5-1.5. The inorganic particles (B) include conductive particles having an average particle size of 0.01-10 µｍ. The solvent (C) is an organic solvent having a boiling point of 200-250°C.
Need to check novelty before this filing date? Find Prior Art