Curable silicone composition, cured product thereof, and production method therefor

A balanced curable silicone composition with specific components ensures high hardness and moldability, addressing the limitations of existing compositions by providing easy handling and superior mechanical strength with uniformity and fluidity for semiconductor device encapsulation.

WO2026141133A1PCT designated stage Publication Date: 2026-07-02DOW TORAY CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
DOW TORAY CO LTD
Filing Date
2025-12-18
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Existing curable silicone compositions used in encapsulants for optical materials and semiconductor devices lack sufficient hardness at room temperature, compression moldability, and maintain poor hot-melt properties when formulated into pellets or tablets, leading to impaired mechanical strength and fluidity at high temperatures.

Method used

A curable silicone composition containing specific components such as an organopolysiloxane resin, organohydrogenpolysiloxane, thermoplastic resin fine particles, and functional inorganic fillers, with a balanced ratio to achieve high hardness, low melt viscosity, and excellent moldability, allowing easy granulation and tabletization, and forming a cured product with superior mechanical strength and fluidity.

Benefits of technology

The composition provides a cured product with high hardness at room temperature, easy handling, and excellent fluidity at high temperatures, suitable for molding processes like transfer, compression, and press molding, while maintaining mechanical strength and uniformity.

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Abstract

[Problem] To provide a composition which can contain a large amount of a functional inorganic filler, is sufficiently hard at room temperature in an uncured state, has sufficient hardness even when compression-molded, has excellent hot melt properties and the like characterized by high fluidity at high temperatures, and gives a cured product. [Solution] Provided is a curable silicone composition characterized by: comprising (A) an organopolysiloxane resin that has a softening point of 30°C or more, has a curing reactive functional group, and contains 20 mol% or more of a T-unit, (B) an organohydrogenpolysiloxane, (C) hydrosilylation reaction catalyst-containing thermoplastic fine resin particles, (D) a functional inorganic filler, and (E) an organopolysiloxane resin that does not have a hydrosilyl reactive functional group in the molecule, that has a silanol group content of 5.0 mol% or less, and that contains 20 mol% or more of a T-unit; and exhibiting hot melt properties as a whole. Also provided are a molded product of the curable silicone composition and a use thereof.
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