Curable silicone composition and cured product therefrom

The curable silicone composition balances hardness, strength, and viscoelastic properties by using specific organopolysiloxane resins and fillers, addressing the limitations of conventional compositions in semiconductor and display devices.

WO2026141135A1PCT designated stage Publication Date: 2026-07-02DOW TORAY CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
DOW TORAY CO LTD
Filing Date
2025-12-18
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Conventional curable silicone compositions struggle to balance high hardness and strength with excellent viscoelastic properties such as stress damping, vibration absorption, and shock absorption, particularly in applications requiring large-area adhesion and sealing, like semiconductor and display devices.

Method used

A curable silicone composition comprising organopolysiloxane resins with and without curing-reactive functional groups, along with a long-chain linear organopolysiloxane, in specific mass% ranges, and optionally including functional fillers, to achieve a cured product with high hardness, strength, and permanent elongation properties, while maintaining viscoelastic behavior.

Benefits of technology

The cured product exhibits high mechanical strength, excellent permanent elongation, and viscoelastic properties, effectively damping stress and absorbing vibrations and shocks, suitable for applications in flexible and foldable devices, vibration absorption members, and semiconductor components.

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Abstract

[Problem] The purpose of the present invention is to provide: a curable silicone composition, a cured product from which exhibits high hardness and mechanical strength (including tensile strength and elongation percentage) near room temperature, exceptional permanent elongation characteristics, and exceptional viscoelastic characteristics such as stress damping, vibration absorption, and impact absorption, the curable silicone composition achieving these characteristics in a well-balanced manner; and the use of the curable silicone composition. [Solution] A curable silicone composition containing, within specific ranges in terms of mass%, (A1) an organopolysiloxane resin that has a curing-reactive functional group containing a carbon-carbon double bond, (A2) an organopolysiloxane resin that does not have the curing-reactive functional group, and (B) a linear organopolysiloxane that is of a specific chain length and has the curing-reactive functional group, the curable silicone composition also containing (C) a curing agent, where the total amount of components (A1) and (A2) is 55 mass% or less, and the mass ratio of the total amount of components (A1) and (A2) to the amount of component (B) is 2.0 or less; a cured product of the curable silicone composition; and the use of the curable silicone composition in semiconductor applications and the like.
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