Cooling device
The cooling device addresses refrigerant leakage issues by integrating a heat diffusion device with a recessed first container, enhancing contact area and reliability, thus improving heat transfer efficiency and flexibility in component placement.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NIDEC CORP(JP)
- Filing Date
- 2025-12-25
- Publication Date
- 2026-07-02
AI Technical Summary
Existing cooling devices face reliability issues due to potential refrigerant leaks at connection points between the cover member and vapor chamber, compromising the integrity and efficiency of heat transfer.
A cooling device design featuring a separate heat diffusion device with a second container and a cooling member having a first container with recesses, where the heat diffusion device's cylinder portion is partially inserted into the recess, eliminating the need for direct connections and enhancing contact area for efficient heat transfer.
The design significantly reduces refrigerant leakage risks, ensuring high reliability and improved heat transfer efficiency by increasing contact area between components, allowing flexible placement and efficient cooling of heat-generating elements.
Smart Images
Figure JP2025045623_02072026_PF_FP_ABST
Abstract
Description
Cooling device
[0009] ,
[0001] This disclosure relates to a cooling device. This application claims priority based on Japanese Patent Application No. 2024-232517 filed in Japan on December 27, 2024, and incorporates its content herein by reference.
[0002] Conventionally, as a method for cooling heat-generating bodies such as CPUs (Central Processing Units), a cooling method using a cooling member such as a cold plate is known. A flow path is formed inside the cold plate, and a refrigerant such as cold water flows through the flow path (see, for example, Patent Document 1).
[0003] Also, a technique is known in which a vapor chamber, which is a heat diffusion device, is interposed between the heat-generating body and the cold plate. The vapor chamber transports heat from a high-temperature part to a low-temperature part by utilizing the latent heat associated with the evaporation and condensation of the working fluid enclosed inside. By interposing the vapor chamber, the heat of the heat-generating body can be spread in the planar direction and then transmitted to the cold plate.
[0004] Conventionally, a heat conduction member having a vapor chamber provided with a plurality of heat conduction cylinders on one main surface, a cover member covering one main surface of the vapor chamber, and an inlet through which a refrigerant flows and an outlet through which the refrigerant flows into a space formed by the cover member and the vapor chamber is known.
[0005] U.S. Patent Application Publication No. 2016 / 0227672
[0006] In the heat conduction member (hereinafter referred to as a cooling device) described in Patent Document 1, it is necessary to connect the cover member to the vapor chamber with a connecting portion or the like. In such a case, when a refrigerant flows into the space formed by the cover member and the vapor chamber, there is a risk that the refrigerant in the space will leak out of the cooling device from the connecting portion.
[0007] Therefore, the realization of a cooling device with excellent reliability is expected.
[0008] This disclosure provides a cooling device with excellent reliability.
[0009] A cooling device according to one aspect of the present disclosure comprises a cooling member and a heat diffusion device. The heat diffusion device is a separate component from the cooling member. The cooling member has a refrigerant inlet and outlet, and a first container connecting the inlet and outlet. The heat diffusion device has a working fluid and a second container in which the working fluid is disposed. The second container has a horizontally extending flat plate portion and a cylindrical portion extending from the flat plate portion, and the first container has a recess in its outer surface, with at least a portion of the cylindrical portion disposed in the recess.
[0010] The cooling device described herein offers excellent reliability.
[0011] Figure 1 is a schematic cross-sectional view of a cooling device according to an embodiment. Figure 2 is a schematic plan view of a cooling device according to an embodiment. Figure 3 is a schematic perspective view of a cooling member according to an embodiment. Figure 4 is a schematic plan view of a cooling device according to a first modified example. Figure 5 is a schematic plan view of a cooling device according to a second modified example. Figure 6 is a schematic plan view showing another example of a cooling device according to a second modified example. Figure 7 is a schematic cross-sectional view of a cooling device according to a third modified example. Figure 8 is a schematic plan view showing another example of a cooling device according to a third modified example. Figure 9 is a schematic cross-sectional view of a cooling device according to a fourth modified example. Figure 10 is a schematic cross-sectional view of a cooling device according to a fifth modified example. Figure 11 is a schematic cross-sectional view of a cooling device according to a sixth modified example. Figure 12 is a schematic cross-sectional view of a cooling device according to a seventh modified example.
[0012] The embodiments for implementing the cooling device according to this disclosure (hereinafter referred to as "Embodiments") will be described in detail below with reference to the drawings. However, this disclosure is not limited by these embodiments. Furthermore, each embodiment can be combined as appropriate, provided that the processing content is not inconsistent. Also, the same parts are denoted by the same reference numerals in each of the following embodiments, and redundant descriptions are omitted.
[0013] Furthermore, in the drawings referenced below, for the sake of clarity, mutually orthogonal X, Y, and Z axis directions are sometimes defined, and a Cartesian coordinate system is shown with the positive Z axis pointing vertically upward.
[0014] (Embodiment) First, the configuration of the cooling device 100 according to the embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic cross-sectional view of the cooling device 100 according to the embodiment. Figure 2 is a schematic plan view of the cooling device 100 according to the embodiment. Figure 3 is a schematic perspective view of the cooling member 1 according to the embodiment. For ease of understanding, the number of recesses 14 in the cooling member 1, or the arrangement of the heat diffusion device 2 and the heating element W, differs in Figures 1 to 3. Also, in Figure 2, the recesses 14 of the cooling member 1 are shown with dotted lines, and the heating element W and the heat diffusion device 2 are shown with solid lines. Also, in Figure 3, only the openings of the recesses 14 are shown with dotted lines.
[0015] As shown in Figures 1 and 2, the cooling device 100 comprises a cooling member 1 and a heat diffusion device 2. The heat diffusion device 2 is a separate component from the cooling member 1.
[0016] The cooling member 1 has a refrigerant inlet 11 and outlet 12, and a first container 10 connecting the inlet 11 and the outlet 12.
[0017] The inlet 11 is connected to the inside of the first container 10 and serves as the inlet for the refrigerant to flow into the cooling member 1. The outlet 12 is connected to the inside of the first container 10 and serves as the outlet for the refrigerant to flow out of the inside of the cooling member 1. In other words, the refrigerant that flows in from the inlet 11 passes through the inside of the first container 10 and flows out from the outlet 12.
[0018] The inlet 11 and outlet 12 are located in the first container 10. The first container 10 is a container in which an internal space 13 through which a refrigerant flows is formed. The first container 10 may be made of a material with excellent thermal conductivity, such as metal. For example, the first container 10 has two openings that penetrate in the X-axis direction. Specifically, the two openings are provided on two outer surfaces 10a and 10b of the first container 10, which are arranged opposite each other in the X-axis direction, with the internal space 13 of the first container 10 in between. The openings may also be provided on the top surface of the first container 10. One end of a cylindrical member is inserted into each of the two openings. The other end of each cylindrical member protrudes outward from the first container 10. The cooling member 1 has cylindrical members as the inlet 11 and outlet 12, respectively.
[0019] The first container 10 has a recess 14 on its outer surface. Specifically, the recess 14 is located on one of two outer surfaces that are arranged opposite each other in the Z-axis direction, with the internal space 13 of the first container 10 in between. In the example of Figure 1, the recess 14 is located on the outer surface 10c on the negative Z-axis side of the first container 10. The outer surface 10c is the surface facing the heat diffusion device 2, which will be described later. The outer surface 10c may be a rectangle in plan view. In other words, as shown in Figures 2 and 3, the first container 10 may be a rectangle in plan view from a direction perpendicular to the outer surface 10c (in this case, the Z-axis direction).
[0020] The recess 14 is recessed in the direction away from the heat diffusion device 2 relative to the outer surface 10c (in this case, the positive Z-axis direction). As shown in Figure 1, the recess 14 may be linearly recessed in the direction away from the heat diffusion device 2 relative to the outer surface 10c. Not limited to the example in Figure 1, the recess 14 may be obliquely recessed in the direction away from the heat diffusion device 2 relative to the outer surface 10c. Furthermore, the recess 14 may be curvedly recessed in the direction away from the heat diffusion device 2 relative to the outer surface 10c.
[0021] As shown in Figure 2, the recess 14 may be circular in shape when viewed from above. However, the shape of the recess 14 is not limited to this. Examples of other shapes will be explained in the second modification.
[0022] The heat diffusion device 2 is interposed between the cooling member 1 and the heat-generating element W to be cooled. The heat diffusion device 2 is in thermal contact with the heat-generating element W. As shown in Figure 1, the heat diffusion device 2 may be in direct contact with the heat-generating element W, or it may be indirectly in contact via a heat transfer member such as a heat transfer sheet.
[0023] The heat diffusion device 2 comprises a working fluid and a second container 20 in which the working fluid is disposed.
[0024] The working fluid is sealed inside the second container 20. The working fluid can be, for example, water, hydrocarbon compounds, organic liquids (such as ethanol and methanol), or ammonia.
[0025] The second container 20 has a flat plate portion 21 and a cylinder portion 22. The flat plate portion 21 extends horizontally (in the X-axis and Y-axis directions). The flat plate portion 21 has an outer surface 21a that is in contact with the heating element W and an outer surface 21b located opposite to the outer surface 21a. The outer surface 21b is the surface facing the cooling member 1. The outer surfaces 21a and 21b may be rectangular in plan view. In other words, as shown in Figure 2, the second container 20 may be rectangular in plan view when viewed from a direction perpendicular to the outer surface 21a (in this case, the Z-axis direction).
[0026] The cylinder portion 22 extends from the flat plate portion 21. As shown in Figure 1, the cylinder portion 22 may extend linearly in the direction away from the heating element W (in this case, the positive Z-axis direction) relative to the outer surface 21b of the flat plate portion 21. Not limited to the example in Figure 1, the cylinder portion 22 may extend diagonally in the direction away from the heating element W relative to the outer surface 21b. Alternatively, the cylinder portion 22 may extend curvedly in the direction away from the heating element W relative to the outer surface 21b.
[0027] As shown in Figure 1, the flat plate portion 21 and the cylinder portion 22 are hollow. The interior of the flat plate portion 21 and the interior of the cylinder portion 22 are connected. Wicks 25 are provided on the inner walls of the flat plate portion 21 and the cylinder portion 22. In Figure 1, the wicks 25 are located along the entire inner wall of the cylinder portion 22, but the wicks 25 may be located along only a part of the inner wall of the cylinder portion 22. Also, the wicks 25 may extend in a columnar shape in the vertical direction (in this case, the Z-axis direction) of the flat plate portion 21.
[0028] At least a portion of the cylinder portion 22 is positioned in the recess 14. Specifically, at least the tip portion of the entire cylinder portion 22 may be positioned in the recess 14. Here, the tip portion may be the portion including the tip 22a of the three parts obtained by dividing the cylinder portion 22 into three equal parts in the longitudinal direction of the cylinder portion 22.
[0029] The second container 20 may be made of a metal such as copper.
[0030] In the cooling device 100 configured as described above, the heat from the heat-generating element W is transported to a location away from the heat-generating element W by utilizing the vaporization and liquefaction cycle of the working fluid sealed inside the heat diffusion device 2. By interposing the heat diffusion device 2 between the heat-generating element W and the cooling member 1, the heat from the heat-generating element W can be spread horizontally and then transmitted to the cooling member 1. The refrigerant circulating within the cooling member 1 then exchanges heat with the heat-generating element W via the heat diffusion device 2, thereby cooling the heat-generating element W.
[0031] In the heat conduction member described in Patent Document 1, the cover member needs to be connected to the vapor chamber at a connection point or the like. In such a case, there is a risk that the refrigerant in the space formed between the cover member and the vapor chamber may leak out of the heat conduction member from the connection point.
[0032] On the other hand, in the cooling device 100 according to the embodiment, the internal space 13 through which the refrigerant flows is formed solely by the cooling member 1, so the above-mentioned connection part is unnecessary. Therefore, the refrigerant is less likely to leak from the cooling device 100. Accordingly, the cooling device 100 according to the embodiment is highly reliable. Furthermore, because the cooling device 100 according to the embodiment has a recess 14 and a cylinder portion 22, the contact area between the cooling member 1 and the heat diffusion device 2 is increased, and the heat from the heat-generating element W can be transferred to the cooling member 1 more efficiently, resulting in superior cooling efficiency.
[0033] As shown in Figure 2, the first container 10 may have a plurality of recesses 14. In this case, the cylinder portion 22 of the heat diffusion device 2 may be placed in at least one of the plurality of recesses 14. In other words, there may be recesses 14 into which the cylinder portion 22 is not inserted, so the cylinder portion 22 can be inserted into any of the plurality of recesses 14. Therefore, the cooling device 100 offers excellent flexibility in the placement of the heat diffusion device 2 relative to the cooling member 1.
[0034] The multiple recesses 14 may be arranged at equal intervals along the in-plane direction (X-axis direction and Y-axis direction) of the outer surface 10c (see Figure 1).
[0035] As shown in Figure 2, the cooling device 100 may have multiple heat diffusion devices 2. In this case, multiple heat diffusion devices 2 may be arranged around a single cooling member 1.
[0036] With this configuration, multiple cooling members 1 are not required for multiple heat diffusion devices 2. Therefore, the number of pipes connecting each cooling member 1 can be reduced, and the possibility of refrigerant leaking from the pipes can be reduced, resulting in a highly reliable cooling system 100. In addition, the number of connections connecting the external manifold (not shown) to the inlet 11 and the external manifold to the outlet 12 can also be reduced, thus reducing the possibility of refrigerant leaking from these connections, resulting in a highly reliable cooling system 100.
[0037] As shown in Figure 2, one cooling member 1 may overlap with multiple heat-generating elements W in a plan view. In this case, each of the multiple heat diffusion devices 2 may be in contact with each of the multiple heat-generating elements W. That is, multiple heat-generating elements W may be arranged on a single cooling member 1 via multiple heat diffusion devices 2.
[0038] With this configuration, the cooling member 1 can be positioned regardless of the size or location of each of the multiple heat-generating elements W. Furthermore, the layout of the heat-generating elements W can be freely changed based on the cooling member 1.
[0039] Although Figures 1 and 2 show an example in which the first container 10 has multiple recesses 14, the number of recesses 14 is not limited to this, and the first container 10 only needs to have at least one recess 14.
[0040] Similarly, although Figures 1 and 2 show an example in which the second container 20 has multiple cylinder portions 22, the number of cylinder portions 22 is not limited to this, and the second container 20 only needs to have at least one cylinder portion 22.
[0041] As described above, in the cooling device 100 according to the embodiment, the internal space 13 through which the refrigerant flows is formed only by the cooling member 1. Therefore, it is difficult for the refrigerant to leak from the cooling device 100. Thus, the cooling device 100 according to the embodiment is excellent in reliability. Further, since the cooling device 100 according to the embodiment has the concave portions 14 and the cylinder portions 22, the contact area between the cooling member 1 and the heat diffusion device 2 is increased, and the heat of the heating element W can be more efficiently transmitted to the cooling member 1. Therefore, the cooling efficiency is excellent.
[0042] (First Modified Example) FIG. 4 is a schematic plan view of a cooling device 100 according to the first modified example.
[0043] The size of the diameter of one of the plurality of concave portions 14 in the cooling member 1 may be different from the size of the diameter of the other concave portions 14. In the example of FIG. 4, the size of the diameter of the concave portion 14A of the cooling member 1 is different from the size of the diameter of the concave portion 14B. Specifically, the diameter of the concave portion 14A is larger than the diameter of the concave portion 14B.
[0044] According to such a configuration, the cooling member 1 can arrange a plurality of heat diffusion devices 2 having different cylinder portion 22 diameters. That is, the heat diffusion device 2 can be arranged on the cooling member 1 without depending on the size of the diameter of each cylinder portion 22 of the plurality of heat diffusion devices 2.
[0045] (Second Modified Example) FIG. 5 is a schematic plan view of a cooling device 100 according to the second modified example. FIG. 6 is a schematic plan view showing another example of the cooling device 100 according to the second modified example. In the embodiment, an example in which the concave portion 14 of the cooling member 1 is circular in plan view has been shown, but the shape of the concave portion 14 is not limited to this.
[0046] The concave portion 14 of the cooling member 1 may be linear and extend along the in-plane direction (X-axis direction and Y-axis direction) of the outer surface 10c in plan view. In the example of FIG. 5, the concave portion 14 is linear and extends along the X-axis direction.
[0047] According to such a configuration, the cylinder portion 22 with respect to the cooling member 1 can be moved in the extending direction of the concave portion 14, and the degree of freedom in arranging the heat diffusion device 2 with respect to the cooling member 1 can be improved.
[0048] As shown in FIG. 6, the plurality of recesses 14 may include a plurality of first recesses 14C arranged at intervals along a first direction (here, the Y-axis direction) in the in-plane direction of the outer surface 10c, and a plurality of second recesses 14D arranged at intervals along a second direction (here, the X-axis direction) orthogonal to the first direction. That is, the plurality of linear recesses 14 may be arranged in a grid pattern in plan view. Thereby, the degree of freedom in arranging the heat diffusion device 2 with respect to the cooling member 1 can be further improved.
[0049] In the examples of FIGS. 5 and 6, an example in which the recess 14 extends along the X-axis direction or the Y-axis direction has been shown, but the direction in which the recess 14 extends is not limited to this. The recess 14 may extend obliquely with respect to the X-axis direction or the Y-axis direction. Further, the recess 14 may extend in a curved shape along the in-plane direction.
[0050] (Third Modified Example) FIG. 7 is a schematic cross-sectional view of a cooling device 100 according to the third modified example. FIG. 8 is a schematic plan view showing another example of the cooling device 100 according to the third modified example.
[0051] As shown in FIGS. 7 and 8, a space may be located between the cooling member 1 and the heat diffusion device 2. For example, as shown in FIG. 7, a space may be located between the bottom surface 14a of the recess 14 and the tip 22a of the cylinder portion 22. In other words, such a space is a space surrounded by the bottom surface 14a of the recess 14, the side surface 14b, and the tip 22a of the cylinder portion 22.
[0052] According to such a configuration, the heat diffusion device 2 in which the height of the cylinder portion 22 is smaller than the depth of the recess 14 can also be arranged on the cooling member 1. Since the outer surface 10c of the cooling member 1 and the outer surface 21b of the heat diffusion device 2 are in contact, a large contact area between the cooling member 1 and the heat diffusion device 2 can be ensured.
[0053] Further, as shown in FIG. 8, a space may be located between the outer surface 10c of the cooling member 1 and the outer surface 21b of the heat diffusion device 2. In other words, such a space is a space surrounded by the outer surface 10c of the cooling member 1, the outer surface 21b of the heat diffusion device 2, and the side surface 14b of the recess 14. [[ID=仃]]
[0054] With this configuration, a heat diffusion device 2 in which the height of the cylinder portion 22 is greater than the depth of the recess 14 can also be placed in the cooling member 1.
[0055] Furthermore, the examples in Figures 7 and 8 are not limited to those shown. Spaces may exist both between the bottom surface 14a of the recess 14 and the tip 22a of the cylinder portion 22, and between the outer surface 10c of the cooling member 1 and the outer surface 21b of the heat diffusion device 2. Also, a space may exist between the side surface 14b of the recess 14 and the outer circumferential surface of the cylinder portion 22.
[0056] (Fourth Modification) Figure 9 is a schematic cross-sectional view of the cooling device 100 according to the fourth modification.
[0057] The distance between the tip 22a of the cylinder portion 22 of one of the multiple heat diffusion devices 2 of the cooling member 1 and the bottom surface 14a of the recess 14 may differ from the distance between the tip 22a of the cylinder portion 22 of the other heat diffusion devices 2 and the bottom surface 14a of the recess 14. In the example of Figure 9, the distance L1 between the tip 22a of the cylinder portion 22 of heat diffusion device 2A and the bottom surface 14a of the recess 14 is different from the distance L2 between the tip 22a of the cylinder portion 22 of heat diffusion device 2B and the bottom surface 14a of the recess 14. Specifically, distance L1 is greater than distance L2.
[0058] With this configuration, the cooling member 1 can accommodate multiple heat diffusion devices 2 with different cylinder portions 22 heights. In other words, the heat diffusion devices 2 can be arranged on the cooling member 1 without depending on the height of each of the cylinder portions 22 of the multiple heat diffusion devices 2.
[0059] (Fifth Modification) Figure 10 is a schematic cross-sectional view of the cooling device 100 according to the fifth modification.
[0060] The thickness of the flat plate portion 21 of one of the multiple heat diffusion devices 2 of the cooling member 1 may differ from the thickness of the flat plate portion 21 of the other heat diffusion devices 2. In the example in Figure 10, the thickness D1 of the flat plate portion 21 of heat diffusion device 2C is different from the thickness D2 of the flat plate portion 21 of heat diffusion device 2D. Specifically, thickness D1 is greater than thickness D2.
[0061] With this configuration, the cooling member 1 can accommodate multiple heat diffusion devices 2 with different thicknesses of the flat plate portion 21. In other words, the heat diffusion devices 2 can be arranged on the cooling member 1 without depending on the thickness of each of the flat plate portions 21 of the multiple heat diffusion devices 2.
[0062] (Sixth Modification) Figure 11 is a schematic cross-sectional view of the cooling device 100 according to the sixth modification.
[0063] As shown in Figure 11, the cooling device 100 may have a heat conductive member 40 located between the recess 14 and the cylinder portion 22. The heat conductive member 40 may be located on the bottom surface 14a and the side surface 14b of the recess 14. Specifically, the heat conductive member 40 may be located between the bottom surface 14a and the side surface 14b of the recess 14 and the outer surface of the cylinder portion 22.
[0064] In this way, the cooling device 100 has a heat conductive member 40, which allows for thermal connection between the heat diffusion device 2 and the cooling member 1, thereby improving the heat transfer efficiency from the heat diffusion device 2 to the cooling member 1. Furthermore, the mechanical strength of the cooling device 100 can be ensured by filling the gap between the bottom surface 14a and side surface 14b of the recess 14 of the cooling member 1 and the cylinder portion 22 of the heat diffusion device 2 with the heat conductive member 40.
[0065] The heat conduction member 40 may be made of rubber. Specifically, the heat conduction member 40 may have higher elasticity or ductility than the cooling member 1 and the heat diffusion device 2. This allows for stress relief between the cooling member 1 and the heat conduction member 40, resulting in superior reliability for the cooling member 1.
[0066] (Seventh Modification) Figure 12 is a schematic cross-sectional view of the cooling device 100 according to the seventh modification.
[0067] As shown in Figure 12, the cooling device 100 may include a plurality of cooling members 1 and a plurality of pipes 51, 52 connecting the plurality of cooling members 1. At least one heat diffusion device 2 may be interposed between each cooling member 1 and the heat-generating element W. By including a plurality of cooling members 1 in this way, the cooling device 100 can be made even more efficient at cooling.
[0068] Furthermore, as shown in Figure 12, for example, if the heating element W is provided on a plane parallel to the direction of gravity (negative Z-axis direction), the inlet 11 and outlet 12 of the cooling member 1 may be provided in the order of inlet 11 and outlet 12 in the direction of gravity. This allows the refrigerant to flow from the inlet 11 to the outlet 12 in accordance with gravity.
[0069] Furthermore, this technology can also take the following configurations: (1) A cooling device comprising a cooling member and a heat diffusion device which is a separate component from the cooling member, wherein the cooling member has a refrigerant inlet and outlet and a first container connecting the inlet and the outlet, the heat diffusion device has a working fluid and a second container in which the working fluid is disposed, the second container has a horizontally extending flat plate portion and a cylinder portion extending from the flat plate portion, the first container has a recess that is recessed in its outer surface, and at least a part of the cylinder portion is disposed in the recess. (2) The cooling device according to (1), wherein the first container has a plurality of recesses and the cylinder portion is disposed in at least one of the plurality of recesses. (3) The cooling device according to (2), wherein the recess is circular in shape in plan view, and the diameter of one of the plurality of recesses is different from the diameter of the other recesses. (4) The cooling device according to (2), wherein the recess is a straight line extending in a straight or curved manner along the in-plane direction of the outer surface of the first container facing the cylinder portion in a plan view. (5) The cooling device according to (4), wherein the plurality of recesses have a plurality of first recesses spaced apart along a first direction in the in-plane direction and a plurality of second recesses spaced apart along a second direction perpendicular to the first direction. (6) The cooling device according to any one of (2) to (5), wherein it has a plurality of heat diffusion devices, and the plurality of heat diffusion devices are arranged with respect to one cooling member. (7) The cooling device according to (6), wherein the heat diffusion device is interposed between the cooling member and the heating element, one cooling member overlaps with the plurality of heating elements in a plan view, and each of the plurality of heat diffusion devices is in contact with each of the plurality of heating elements. (8) The cooling device according to (6) or (7), wherein the distance between the tip of the cylinder portion of one of the plurality of heat diffusion devices and the bottom surface of the recess is different from the distance between the tip of the cylinder portion of the other heat diffusion devices and the bottom surface of the recess. (9) The cooling device according to any one of (1) to (8), further comprising a heat conductive member located between the recess and the cylinder portion. (10) The cooling device according to (9), wherein the heat conductive member is located on the bottom surface and the side surface of the recess.(11) The cooling device according to any one of (1) to (10), wherein the inlet and outlet are provided in the order of the inlet and outlet in the direction of gravity. (12) The cooling device according to any one of (1) to (11), comprising a plurality of cooling members that overlap a plurality of heating elements in a plan view, and a plurality of pipes connecting the plurality of cooling members, wherein at least one heat diffusion device is interposed between each of the cooling members and the heating element.
[0070] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. Indeed, the above embodiments can be embodied in a variety of forms. Furthermore, the above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.
[0071] 1 Cooling member 2 Heat diffusion device 10 First container 11 Inlet 12 Outlet 13 Internal space 14 Recess 20 Second container 21 Flat plate section 22 Cylinder section 22a Tip 25 Wick 40 Heat conducting member 100 Cooling device W Heating element
Claims
1. A cooling device comprising a cooling member and a heat diffusion device which is a separate member from the cooling member, wherein the cooling member has a refrigerant inlet and outlet and a first container connecting the inlet and the outlet, the heat diffusion device has a working fluid and a second container in which the working fluid is disposed, the second container has a horizontally extending flat plate portion and a cylinder portion extending from the flat plate portion, the first container has a recess in its outer surface, and at least a part of the cylinder portion is disposed in the recess.
2. The cooling device according to claim 1, wherein the first container has a plurality of recesses, and the cylinder portion is disposed in at least one of the plurality of recesses.
3. The cooling device according to claim 2, wherein the recess is circular in shape when viewed from above, and the diameter of one of the plurality of recesses is different from the diameter of the other recesses.
4. The cooling device according to claim 2, wherein the recess is a straight line extending in a straight or curved manner along the in-plane direction of the outer surface of the first container that faces the cylinder portion, in a plan view.
5. The cooling device according to claim 4, wherein the plurality of recesses comprises a plurality of first recesses arranged at intervals along a first direction in the in-plane direction and a plurality of second recesses arranged at intervals along a second direction perpendicular to the first direction.
6. The cooling device according to claim 2, wherein it has a plurality of heat diffusion devices, and the plurality of heat diffusion devices are arranged on one of the cooling members.
7. The cooling apparatus according to claim 6, wherein the heat diffusion device is interposed between the cooling member and the heating element, one of the cooling members overlaps with a plurality of heating elements in a plan view, and each of the plurality of heat diffusion devices is in contact with each of the plurality of heating elements.
8. The cooling device according to claim 6, wherein the distance between the tip of the cylinder portion of one of the plurality of heat diffusion devices and the bottom surface of the recess is different from the distance between the tip of the cylinder portion of the other heat diffusion devices and the bottom surface of the recess.
9. The cooling device according to claim 1, further comprising a heat conductive member located between the recess and the cylinder portion.
10. The cooling device according to claim 9, wherein the heat conductive member is located on the bottom surface and side surface of the recess.
11. The cooling device according to claim 1, wherein the inlet and outlet are provided in the order of the inlet and outlet in the direction of gravity.
12. The cooling device according to claim 1, comprising a plurality of cooling members that overlap with a plurality of heating elements in a plan view, and a plurality of pipes connecting the plurality of cooling members, wherein at least one heat diffusion device is interposed between each of the cooling members and the heating element.