Electronic apparatus comprising flexible connection member

Abstract

An electronic apparatus according to an embodiment of the present disclosure comprises: a conductive segment that forms a portion of a side surface of the electronic apparatus and has a key hole formed therein; a communication circuit that transmits and / or receives RF signals through the conductive segment; a side key disposed in the key hole; a switch configured to be pressed by the side key; and a flexible connection member that transmits a signal acquired by the switch, wherein the flexible connection member includes a signal contact that is exposed to the outside so as to transmit the signal, and an inductor coil disposed to overlap the signal contact at least partially, the inductor coil includes a first coil and a second coil disposed below the first coil, and the first coil and the second coil can be connected to each other so as to create a magnetic field in the same direction.

Description

Electronic device including a flexible connection member

[0001] The embodiments disclosed in this document relate to electronic devices, for example, electronic devices including a flexible connecting member.

[0002] The term "electronic device" may refer to devices that perform specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, or in-vehicle navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can recently be integrated into a single electronic device, such as a mobile communication terminal. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, or functions such as schedule management or electronic wallets are being integrated into a single electronic device.

[0003] The information described above may be provided as background art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device comprises: a conductive segment forming a part of the side of the electronic device and having a keyhole formed therein; a communication circuit electrically connected to the conductive segment to transmit and / or receive an RF (radio frequency) signal through the conductive segment; a side key disposed in the keyhole and exposed to the outside of the electronic device; a switch disposed inside the side key and configured to be pressed by the side key; and a flexible connection member electrically connected to the switch to transmit a signal obtained by the switch, wherein the flexible connection member comprises a signal contact exposed to the outside to transmit a signal obtained by the switch, and an inductor coil disposed below the signal contact so as to overlap at least partially with the signal contact and connected to the signal contact, wherein the inductor coil comprises a first coil disposed below the signal contact and a second coil disposed below the first coil, and the first coil and the second coil may be connected to each other to form a magnetic field in the same direction.

[0005] According to one embodiment of the present disclosure, an electronic device comprises: a conductive segment forming a part of the side of the electronic device and having a key hole formed therein; a communication circuit electrically connected to the conductive segment to transmit and / or receive an RF (radio frequency) signal through the conductive segment; a side key disposed in the key hole and exposed to the outside of the electronic device; a switch disposed inside the side key and configured to be pressed by the side key; and a flexible connection member electrically connected to the switch to transmit a signal obtained by the switch, wherein the flexible connection member may comprise a first conductive layer having a signal contact configured to transmit a signal obtained by the switch; a second conductive layer disposed below the first conductive layer, comprising an inductor coil that at least partially overlaps with the signal contact; and a third conductive layer disposed below the second conductive layer, comprising a conductive plate that at least partially overlaps with the inductor coil.

[0006] According to one embodiment of the present disclosure, an electronic device comprises: a conductive segment forming a part of the side of the electronic device and having a keyhole formed therein; a communication circuit electrically connected to the conductive segment to transmit and / or receive an RF (radio frequency) signal through the conductive segment; a side key disposed in the keyhole and exposed to the outside of the electronic device; a switch disposed inside the side key and configured to be pressed by the side key; and a flexible connection member electrically connected to the switch to transmit a signal obtained by the switch, wherein the flexible connection member may comprise an externally exposed signal contact and a ground contact, an inductor coil disposed to overlap at least partially with the signal contact and connected to the signal contact, a signal line electrically connecting the switch and the coil, and a conductive portion disposed facing the ground contact to form a capacitor and connected in parallel to the signal line together with the inductor coil.

[0007] According to one embodiment of the present disclosure, an electronic device comprises: a conductive segment forming a part of the side of the electronic device and having a key hole formed therein; a communication circuit electrically connected to the conductive segment to transmit and / or receive an RF (radio frequency) signal through the conductive segment; a side key disposed in the key hole and exposed to the outside of the electronic device; a switch disposed inside the side key and configured to be pressed by the side key; and a flexible connection member electrically connected to the switch to transmit a signal obtained by the switch, wherein the flexible connection member may include a signal line extending from the switch to transmit a signal obtained by the switch, and a ground plane disposed to overlap at least partially with the signal line, and comprising a ground slot extending to intersect the signal line when viewed from above the ground plane.

[0008] The aspects, configurations, and / or advantages described above regarding various embodiments of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0010] FIG. 2 illustrates an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0011] FIG. 3 illustrates an electronic device in a folded state according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a rear view of a part of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is a circuit diagram of a flexible connecting member according to one embodiment of the present disclosure.

[0015] FIG. 7 illustrates the layout of a first conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0016] FIG. 8 illustrates the layout of a second conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0017] FIG. 9 illustrates the layout of a third conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0018] FIG. 10 is an enlarged view of a portion of the second conductive layer shown in FIG. 8.

[0019] FIG. 11 is an enlarged view of a portion of the third conductive layer shown in FIG. 9.

[0020] FIG. 12 is an enlarged view of a portion of the second conductive layer shown in FIG. 8.

[0021] FIG. 13 illustrates the results of an antenna radiation efficiency experiment for a first electronic device according to a first comparative embodiment, a second electronic device according to a second comparative embodiment, and an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 14 illustrates the layout of a first conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0023] FIG. 15 illustrates the layout of a second conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0024] FIG. 16 illustrates the layout of a third conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0025] FIG. 17 illustrates the layout of a first conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0026] FIG. 18 illustrates the layout of a second conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0027] FIG. 19 illustrates the layout of a third conductive layer of a flexible connecting member according to one embodiment of the present disclosure.

[0028] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described herein may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0029] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0030] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include plural meanings. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0031] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0033] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0034] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0035] The number of processors (120) may be one or more. For example, the processor (120) may have the structure of a multi-core processor such as a dual core, a quad core, or a hexa core.

[0036] The processor (120) can control the operations of the electronic device (101) by executing instructions stored in memory (130). For example, the processor (120) may correspond to a plurality of processors that divide and collectively perform a plurality of operations among the processors.

[0037] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0041] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0042] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0043] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0047] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0049] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0052] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0054] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0057] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0058] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0060] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0061] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] The description of the electronic device (101) described with reference to FIG. 1 may be applied substantially identically to the electronic device (200) described with reference to FIG. 2 through 19, to the extent that they are not arranged with each other. As an example, the description of the components of the electronic device (101) shown in FIG. 1 (e.g., input module (150), communication module (190), and / or antenna module (197)) may be applied substantially identically to the components of the electronic device (200) described with reference to FIG. 2 through 19 (e.g., side key (225), communication circuit, and / or conductive segment (221S)) to the extent that they are not arranged with each other.

[0063] FIG. 2 illustrates an electronic device (200) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 illustrates an electronic device (200) in a folded state according to one embodiment of the present disclosure. FIG. 4 is an exploded perspective view of an electronic device (200) according to one embodiment of the present disclosure.

[0064] Referring to FIGS. 2 to 4, according to one embodiment of the present disclosure, an electronic device (200) may include a first housing (210), a second housing (220), a hinge assembly (202), a hinge cover (230) covering a foldable portion of the housing (201), and / or a display (240) disposed on the housing (201).

[0065] According to one embodiment of the present disclosure, the surface formed by the display (240) may be named as the front surface of the electronic device (200) (e.g., a first front surface (210a) and a second front surface (220a)). And, the surface opposite to the front surface may be named as the rear surface of the electronic device (200) (e.g., a first rear surface (210b) and a second rear surface (220b)). The surface connecting the front surface and the rear surface of the electronic device (200) and surrounding the space between the front surface and the rear surface of the electronic device (200) may be named as the side surface of the electronic device (200) (e.g., a first side surface (211a) and a second side surface (221a)).

[0066] According to one embodiment of the present disclosure, the housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), a second rear cover (290), and a hinge assembly (202) in which the first housing (210) and the second housing (220) are joined. The hinge assembly (202) may provide a folding axis (FA) that serves as a reference for folding or unfolding of the electronic device (200).

[0067] According to one embodiment of the present disclosure, at least a portion of the first housing (210) and the second housing (220) may be formed of a metal or non-metal material having a selected size of rigidity to support the display (240). At least a portion formed of the metal material may provide a ground plane of the electronic device (200).

[0068] According to one embodiment of the present disclosure, the electronic device (200) may include a structure into which a digital pen can be inserted. For example, a hole (223) into which the digital pen can be inserted may be formed on the side of the first housing (210) or the side of the second housing (220) of the electronic device (200).

[0069] According to one embodiment of the present disclosure, the sensor area (224) may be formed to have a predetermined area adjacent to one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated examples. According to one embodiment, components for performing various functions embedded in the electronic device (200) may be visually exposed to the front of the electronic device (200) through the sensor area (224) or through one or more openings provided in the sensor area (224). In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0070] According to one embodiment of the present disclosure, the first rear cover (280) may be disposed on one side of the folding axis (FA). The edge of the first rear cover (280) may be supported by the first housing (210). The second rear cover (290) may be disposed on the other side of the folding axis (FA). The edge of the second rear cover (290) may be supported by the second housing (220).

[0071] According to one embodiment of the present disclosure, the first rear cover (280) and the second rear cover (290) may have shapes that are substantially symmetric to each other with respect to the folding axis (FA). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetric shapes, and in one embodiment, the electronic device (200) may include the first rear cover (280) and the second rear cover (290) of various shapes.

[0072] According to one embodiment of the present disclosure, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which components of the electronic device (200) (e.g., a printed circuit board, or a battery) are accommodated. According to one embodiment, one or more components may be placed or visually exposed on the rear of the electronic device (200). For example, at least a portion of a sub-display (e.g., a sub-display (244)) may be visually exposed through the first rear area (282) of the first rear cover (280). Alternatively, the first rear cover (280) may be replaced by the sub-display (244). In one embodiment, one or more components or sensors may be visually exposed through the second rear area (292) of the second rear cover (290). In various embodiments, the sensor may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0073] According to one embodiment of the present disclosure, a front camera visually exposed to the front of the electronic device (200) through one or more openings provided in a sensor area (224) or a camera module (206) visually exposed through a second rear area (292) of a second rear cover (290) may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0074] Referring to FIG. 3, according to one embodiment of the present disclosure, a hinge cover (230) may cover at least a portion of the outer side of the hinge assembly (202). The hinge cover (230) may be positioned between the first housing (210) and the second housing (220) to cover an internal component (e.g., the hinge assembly (202)). It may be located on the lateral sides of the first housing (210) and the second housing (220).

[0075] According to one embodiment of the present disclosure, the hinge cover (230) may be covered by a part of the first housing (210) and the second housing (220) or exposed to the outside depending on the state of the electronic device (200) (unfolded state or folded state). For example, when the electronic device (200) is in an unfolded state, the hinge cover (230) may be substantially covered by the first housing (210) and the second housing (220), and when it is in a folded state, the outer surface of the hinge cover (230) may be exposed to the outside.

[0076] According to one embodiment of the present disclosure, as shown in FIG. 2, when the electronic device (200) is in an unfolded state, the hinge cover (230) may be covered by the first housing (210) and the second housing (220) and not exposed. As another example, as shown in FIG. 2, when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge cover (230) may be exposed to the outside between the first housing (210) and the second housing (220). As yet another example, when the first housing (210) and the second housing (220) are in an intermediate state with a certain angle, the hinge cover (230) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be smaller than in the fully folded state. In one embodiment, the hinge cover (230) may include a curved surface.

[0077] According to one embodiment of the present disclosure, the display (240) may include a first region (241, region) disposed in a first housing (210) and a second region (242, region) disposed in a second housing (220). The display (240) may include a flexible third region (243, region) connecting the first region (241) and the second region (242). The third region (243) may be located between the first region (241) and the second region (242).

[0078] According to one embodiment of the present disclosure, the first region (241) and the second region (242) of the display (240) may have a shape that is substantially symmetric to each other with respect to the third region (243). According to one embodiment (not shown), the second region (242), unlike the first region (241), may include a notch cut according to the presence of the sensor region (224), but otherwise may have a shape that is symmetric to the first region (241). For example, the first region (241) and the second region (242) may include a portion in which the shape is symmetric to each other, and may also include a portion in which the shape is not symmetric to each other.

[0079] According to one embodiment of the present disclosure, the display (240) may mean a display in which at least some area can be deformed into a flat or curved surface. According to one embodiment, the display (240) may include a third area (243), a first area (241) disposed on one side (e.g., the left side of the third area (243) shown in FIG. 2) relative to the third area (243), and a second area (242) disposed on the other side (e.g., the right side of the third area (243) shown in FIG. 2). The division of the areas of the display (240) is exemplary, and the display (240) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 1, the area of ​​the display (240) may be divided by a third area (243) extended parallel to the Y-axis or a folding axis (FA), but in one embodiment, the area of ​​the display (240) may be divided based on another foldable part (e.g., a foldable part parallel to the X-axis) or another folding axis (FA).

[0080] According to one embodiment of the present disclosure, the electronic device (200) may include a housing (201), a display (240), a hinge assembly (202), a battery (250) and / or a substrate (260). The housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and / or a second rear cover (290).

[0081] According to one embodiment of the present disclosure, the housing (201) may include a first housing (210), a second housing (220), a hinge cover (230), a first rear cover (280) and / or a second rear cover (290). In one embodiment, a hinge assembly (202) is disposed inside the housing (201) to rotatably connect the first housing (210) and the second housing (220). The first housing (210) and the second housing (220) may be coupled to both sides of the hinge assembly (202).

[0082] According to one embodiment of the present disclosure, the first housing (210) may include a first support area (212) capable of supporting a component of the electronic device (200) (e.g., a first circuit board (262) and / or a first battery (252)). The first support area (212) may be referred to as a first support plate or a first support bracket. The first housing (210) may include a first side wall (211) surrounding at least a portion of the first support area (212). The first side wall (211) may include a first side (e.g., a first side (211a)) of the electronic device (200).

[0083] According to one embodiment, the second housing (220) may include a second support area (222) capable of supporting a component of the electronic device (200) (e.g., a second circuit board (264) and / or a second battery (254)). The second support area (222) may be named a second support plate or a second support bracket. The second housing (220) may include a second side wall (221) surrounding at least a portion of the second support area (222). The second side wall (221) may include a second side (e.g., a second side (221a)) of the electronic device (200).

[0084] According to one embodiment of the present disclosure, the electronic device (200) may include a display (240) and a sub-display (244). The description of the display (240) (e.g., a first area (241), a second area (242), and a third area (243)) described with reference to FIGS. 2 and 3 may be applied substantially the same to the sub-display (244) to the extent that they are not positioned relative to each other.

[0085] According to one embodiment of the present disclosure, the sub-display (244) can display a screen in a direction different from the display area (241, 242). For example, the sub-display (244) can output a screen in a direction opposite to the first area (241). According to one embodiment, the sub-display (244) can be placed on the first rear cover (280).

[0086] According to one embodiment of the present disclosure, the battery (250) may include a first battery (252) disposed within a first housing (210) and a second battery (254) disposed within a second housing (220). According to one embodiment, the first battery (252) may be disposed on a first circuit board (262), and the second battery (254) may be disposed on a second circuit board (264).

[0087] According to one embodiment of the present disclosure, the substrate portion (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220). According to one embodiment, the substrate portion (260) may include at least one flexible printed circuit board (266) for electrically connecting the first circuit board (262) and the second circuit board (264). The flexible printed circuit board (266) may be disposed across a hinge assembly (202). The flexible printed circuit board (266) may be disposed across a folding axis (FA). According to one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed inside a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (200) may be disposed on the first circuit board (262) and the second circuit board (264).

[0088] According to one embodiment of the present disclosure, the electronic device (200) may include a speaker module (208) (e.g., the audio module (170) of FIG. 1). According to one embodiment, the speaker module (208) may convert an electrical signal into sound. According to one embodiment, the speaker module (208) may be placed inside a space formed by a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290).

[0089] A flexible connecting member according to one embodiment of the present disclosure (e.g., the flexible connecting member (300) of FIG. 5), described below with reference to FIG. 5 to 19, may be understood as being independent of the hinge assembly (202) of the electronic device (200) described with reference to FIG. 2 to 4 and / or the folding and / or unfolding of the electronic device (200) by the hinge assembly (202). That is, the flexible connecting member according to one embodiment of the present disclosure (e.g., the flexible connecting member (300) of FIG. 5) may be applied substantially the same way to an electronic device (not shown) in which the hinge assembly (202) is omitted.

[0090] FIG. 5 is a rear view of a part of an electronic device (200) according to one embodiment of the present disclosure.

[0091] Referring to FIG. 5, according to one embodiment of the present disclosure, an electronic device (200) may include a conductive segment (221S) forming part of a side (221a) of the electronic device (200). A plurality of conductive segments (221S) may be arranged to form a side (211a, 221a, see FIG. 2) of the electronic device (200). A plurality of conductive segments (221S) may be spaced apart from each other. A conductive segment (221S) may include a keyhole. As an example, a conductive segment (221S) may be understood as an elongated metal (e.g., titanium) member.

[0092] According to one embodiment of the present disclosure, an electronic device (200) may include a communication circuitry (e.g., a communication module (190) of FIG. 1) electrically connected to the conductive segment (221S) to transmit and / or receive an RF (radio frequency) signal through the conductive segment (221S). The conductive segment (221S) may be connected to the communication circuitry of the electronic device (200). The conductive segment (221S) connected to the communication circuitry may function as an antenna element configured to transmit and / or receive an RF signal.

[0093] According to one embodiment of the present disclosure, the electronic device (200) may include a side key (225) disposed in the keyhole of the conductive segment (221S). As an example, the side key (225) may be configured to be pressed by external pressure (e.g., user action) by being visually and / or tactilely exposed to the outside of the electronic device (200).

[0094] According to one embodiment of the present disclosure, the electronic device (200) may include switches (S1, S2) disposed inside the side key (225) and configured to be pressed by the side key (225). A predetermined signal may be obtained through the switches (S1, S2) pressed by the side key (225), and said obtained signal may be transmitted to a printed circuit board (e.g., the second circuit board (264) of FIG. 4) inside the electronic device (200) through a flexible connecting member (300). As an example, the switches (S1, S2) and / or the side key (225) may include an elastic member (e.g., a spring) configured to provide a restoring force. The flexible connecting member (300) may be named a first flexible connecting member.

[0095] According to one embodiment of the present disclosure, the electronic device (200) may include a flexible connection member (300) electrically connected to the switches (S1, S2) to transmit a signal obtained by the switches (S1, S2). The flexible connection member (300) may be positioned adjacent to a conductive segment (221S) including the keyhole. The flexible connection member (300) may be positioned between the switches (S1, S2) and a printed circuit board (e.g., the second circuit board (264) of FIG. 4) inside the electronic device (200). The switches (S1, S2) and the printed circuit board (e.g., the second circuit board (264) of FIG. 4) inside the electronic device (200) may be connected through the flexible connection member (300).

[0096] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a first portion (301) that extends (or is positioned substantially parallel to) the side (211a, 221a, see FIG. 2) of the electronic device (200). The first portion (301) may be spaced inward from the switch (S1, S2) (in a direction toward the interior of the electronic device (200)).

[0097] The flexible connecting member (300) may include a second portion (302) that extends (or is positioned substantially parallel) to the front (210a, 220a, see FIG. 2) and / or rear (210b, 220b, see FIG. 2) of the electronic device (200). The flexible connecting member (300) may include a third portion (303) that is bent between the first portion (301) and the second portion (302). The first portion (301) and the second portion (302) may be connected to each other by the third portion (303). A signal obtained by the switch (S1, S2) may pass sequentially through the first portion (301), the third portion (303), and the second portion (302) and be transmitted to a printed circuit board (e.g., the second circuit board (264) of FIG. 4).

[0098] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a stiffener (340). The stiffener (340) may be configured to support a portion of the flexible connecting member (300). The stiffener (340) may be disposed on one side (e.g., below) of a first portion (301) and / or a second portion (302) of the flexible connecting member (300).

[0099] In the following description, with reference to FIGS. 6 to 19, embodiments in which a flexible connecting member (e.g., the flexible connecting member (300) of FIGS. 6 to 13) is connected to a switch (S1, S2) are described, but the present disclosure also includes embodiments in which the flexible connecting member is connected to an electronic component other than the switch (S1, S2) (e.g., camera module (206)) while being positioned adjacent to an antenna element (e.g., conductive segment (221S)).

[0100] FIG. 6 is a circuit diagram of a flexible connecting member (300) according to one embodiment of the present disclosure.

[0101] Referring to FIG. 6, a flexible connection member (300) according to one embodiment of the present disclosure may include at least one signal contact (311, 312) exposed to the outside to transmit a signal obtained by switches (S1, S2). The flexible connection member (300) may include a plurality of circuit elements (L1, L2, L3, L4, C1, C2, C3, C4) disposed between the signal contact (311, 312) and the switches (S1, S2). Interference (e.g., parasitic resonance) caused by an RF signal transmitted and / or received through a conductive segment (221S) being induced into the flexible connection member (300) may be reduced by the plurality of circuit elements (L1, L2, L3, L4, C1, C2, C3, C4). For example, the first inductor (L1) and the first capacitor (C1) can function as a low-pass filter, and the second inductor (L2) and the second capacitor (C2) can function as a low-pass filter. For example, the third inductor (L3) and the third capacitor (C3) can function as a notch filter, and the fourth inductor (L4) and the fourth capacitor (C4) can function as a notch filter. The inductor coils (L1, L2, L3, L4) and capacitors (C1, C2, C3, C4) according to one embodiment of the present disclosure, illustrated in FIG. 6, will be described in detail later with reference to FIG. 7 to 12.

[0102] FIG. 7 illustrates the layout of a first conductive layer (310) of a flexible connecting member (300) according to one embodiment of the present disclosure. FIG. 8 illustrates the layout of a second conductive layer (320) of a flexible connecting member (300) according to one embodiment of the present disclosure. FIG. 9 illustrates the layout of a third conductive layer (330) of a flexible connecting member (300) according to one embodiment of the present disclosure.

[0103] Referring to FIGS. 7 through 9, a flexible connecting member (300) according to one embodiment of the present disclosure may include a plurality of conductive layers (310, 320, 330). The plurality of conductive layers (310, 320, 330) may include a first conductive layer (310), a second conductive layer (320) disposed below the first conductive layer (310), and a third conductive layer (330) disposed below the second conductive layer (320). Each of the conductive layers (310, 320, 330) may include an insulating layer (e.g., a polyimide layer) and a conductive material (e.g., a trace, a via, or a ground), and FIGS. 7 through 9 respectively illustrate top views of the first conductive layer (310), the second conductive layer (320), and the third conductive layer (330).

[0104] According to one embodiment of the present disclosure, each of the plurality of conductive layers (310, 320, 330) of the flexible connecting member (300) may include a first region (310-1, 320-1, 330-1) disposed in a first portion (301). Each of the plurality of conductive layers (310, 320, 330) of the flexible connecting member (300) may include a second region (310-2, 320-2, 330-2) disposed in a second portion (302). Each of the plurality of conductive layers (310, 320, 330) of the flexible connecting member (300) may include a third region (310-3, 320-3, 330-3) disposed in a third portion (303).

[0105] According to one embodiment of the present disclosure, at least one signal contact (311, 312) and at least one ground contact (313) may be included that are electrically connected to an electronic component (e.g., the second circuit board of FIG. 4). The ground contact (313) may be positioned between the first signal contact (311) and the second signal contact (312). The signal contacts (311, 312) and the ground contact (313) may be exposed to the outside of the flexible connection member (300). The contacts may be named as pins or pads. As an example, the electronic component and the flexible connection member (300) may be electrically connected by a conductive clip positioned on the surface of the electronic component contacting the contacts (311, 312, 313) of the flexible connection member (300).

[0106] According to one embodiment of the present disclosure, signal contacts (311, 312) and ground contacts (313) may be arranged adjacent to each other. Signal contacts (311, 312) and ground contacts (313) may be arranged in a first portion (301) of a flexible connection member (300). A signal may be transmitted from the flexible connection member (300) to the electronic component through the signal contacts (311, 312). The ground contact (313) may be electrically connected to the ground circuit of the electronic component.

[0107] According to one embodiment of the present disclosure, a flexible connection member (300) may include a first signal contact (311) and a second signal contact (312) configured to transmit different signals. The flexible connection member (300) may include a first signal line (311A, 311B) connecting a first switch (S1, see FIG. 5) and the first signal contact (311). The flexible connection member (300) may include a second signal line (312A, 312B) connecting a second switch (S2, see FIG. 5) and the second signal contact (312). The arrows shown in FIG. 7 can be understood as a flow in which, when a signal is acquired through the first switch (S1), the acquired signal is transmitted toward the first signal contact (311) through the first signal lines (311A, 311B), and when a signal is acquired through the second switch (S2), the acquired signal is transmitted toward the second signal contact (312) through the second signal lines (312A, 312B).

[0108] According to one embodiment of the present disclosure, the first signal line (311A, 311B) may include a first section (311A) and a second section (311B) disposed in the first conductive layer (310). The first section (311A) and the second section (311B) of the first signal line (311A, 311B) may be spaced apart from each other on the first conductive layer (310) and may be connected to each other through another conductive layer (e.g., a second conductive layer (320) and / or a third conductive layer (330)). The first section (311A) of the first signal line (311A, 311B) may be disposed in a first region (310-1) of the first conductive layer (310) located in a first part (301) of the flexible connecting member (300). The second section (311B) of the first signal line (311A, 311B) may be placed in the second region (310-2) of the first conductive layer (310) located in the second part (302) of the flexible connection member (300). The first signal contact (311) may be electrically connected to the first switch (S1, see FIG. 5), and the signal obtained by the first switch (S1, see FIG. 5) may be transmitted to the outside of the flexible connection member (300) through the first signal contact (311).

[0109] According to one embodiment of the present disclosure, the second signal line (312A, 312B) may include a first section (312A) and a second section (312B) disposed on the first conductive layer (310). The first section (312A) and the second section (312B) of the second signal line (312A, 312B) may be spaced apart from each other on the first conductive layer (310) and may be connected to each other through another conductive layer (e.g., a second conductive layer (320) and / or a third conductive layer (330)). The first section (312A) of the second signal line (312A, 312B) may be disposed in a first region (310-1) of the first conductive layer (310) located in a first part (301) of the flexible connecting member (300). The second section (311B) of the second signal line (312A, 312B) may be placed in the second region (310-2) of the first conductive layer (310) located in the second part (302) of the flexible connection member (300). The second signal contact (312) may be electrically connected to the second switch (S2, see FIG. 5), and the signal obtained by the second switch (S2, see FIG. 5) may be transmitted to the outside of the flexible connection member (300) through the second signal contact (312).

[0110] According to one embodiment of the present disclosure, the flexible connecting member (300) may include inductor coils (L11, L12, L21, L22). The inductor coils (L11, L12, L21, L22) may be embedded in the flexible connecting member (300) in the form of conductive traces formed in the conductive layers (e.g., second conductive layer (320) and third conductive layer (330)) of the flexible connecting member (300).

[0111] According to one embodiment of the present disclosure, a flexible connection member (300) may include a first inductor coil (L11, L12) disposed below the first signal contact (311) so as to overlap at least partially with the first signal contact (311). The first inductor coil (L11, L12) may include a first coil (L12) disposed in the second conductive layer (320) and a second coil (L11) disposed in the third conductive layer (330). A magnetic field generated by the first inductor coil (L11, L12) may pass through the first signal contact (311). As an example, the first inductor coil (L11, L12) may be configured to form a magnetic field directed toward the first signal contact (311). The first coil (L12) and the second coil (L11) of the first inductor coils (L11, L12) can be connected to each other to form a magnetic field in the same direction (e.g., the -Z direction in FIG. 5). The first inductor coils (L11, L12) can be configured to form a first inductor (L1, see FIG. 6) connected to a first signal contact (311).

[0112] According to one embodiment of the present disclosure, a flexible connection member (300) may include a second inductor coil (L21, L22) disposed below the second signal contact (312) so as to overlap at least partially with the second signal contact (312). The second inductor coil (L21, L22) may include a first coil (L22) disposed in the second conductive layer (320) and a second coil (L21) disposed in the third conductive layer (330). A magnetic field generated by the second inductor coil (L21, L22) may pass through the second signal contact (312). As an example, the second inductor coil (L21, L22) may be configured to form a magnetic field directed toward the second signal contact (312). The first coil (L22) and the second coil (L21) of the second inductor coil (L21, L22) can be connected to each other to form a magnetic field in the same direction (e.g., the -Z direction in FIG. 5). The second inductor coil (L21, L22) can be configured to form a second inductor (L2, see FIG. 6) connected to the second signal contact (312).

[0113] According to one embodiment of the present disclosure, a first signal line (311A, 311B) connected to a first inductor coil (L11, L12) may be configured to form a third inductor (L3, see FIG. 6). A second signal line (312A, 312B) connected to a second inductor coil (L21, L22) may be configured to form a fourth inductor (L4, see FIG. 6).

[0114] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a first conductive portion (C11, C12) disposed below the ground contact (313) so as to be coupled to a first region of the ground contact (313). The first conductive portion (C11, C12) may be connected in parallel to the first inductor coil (L11, L12). The first conductive portion (C11, C12) and the first region of the ground contact (313) may be configured to form a first capacitor (C1, see FIG. 6).

[0115] According to one embodiment of the present disclosure, the first conductive portion (C11, C12) may be in the form of a conductive plate formed in a conductive layer (e.g., a second conductive layer (320) and a third conductive layer (330)) of a flexible connecting member (300) and may be embedded in the flexible connecting member (300). The first conductive portion (C11, C12) may include a first conductive plate (C12) disposed in the second conductive layer (320) and a second conductive plate (C11) disposed in the third conductive layer (330). The second conductive plate (C11) may be disposed below the first conductive plate (C12) so as to overlap at least partially with the first conductive plate (C12). The first conductive plate (C12) and the second conductive plate (C11) of the first conductive portion (C11, C12) may be connected to each other through at least one via. Therefore, the capacitance of the first conductive portion (C11, C12) can be maximized relative to the same area (e.g., the XY area of ​​Fig. 5).

[0116] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a second conductive portion (C21, C22) disposed below the ground contact (313) so as to be coupled to a second region of the ground contact (313). The first region and the second region of the ground contact (313) may be understood as two regions that do not overlap each other on the ground contact (313). The second conductive portion (C21, C22) may be connected in parallel to the second inductor coil (L21, L22). The second conductive portion (C21, C22) and the second region of the ground contact (313) may be configured to form a second capacitor (C2, see FIG. 6).

[0117] According to one embodiment of the present disclosure, the second conductive portion (C21, C22) may be in the form of a conductive plate formed in a conductive layer (e.g., a second conductive layer (320) and a third conductive layer (330)) of the flexible connecting member (300) and may be embedded in the flexible connecting member (300). The second conductive portion (C21, C22) may include a first conductive plate (C22) disposed in the second conductive layer (320) and a second conductive plate (C21) disposed in the third conductive layer (330). The second conductive plate (C21) may be disposed below the first conductive plate (C22) so as to overlap at least partially with the first conductive plate (C22). The first conductive plate (C22) and the second conductive plate (C21) of the second conductive portion (C21, C22) may be connected to each other through at least one via. Therefore, the capacitance of the second conductive portion (C21, C22) can be maximized relative to the same area (e.g., the XY area of ​​Fig. 5).

[0118] According to one embodiment of the present disclosure, a flexible connecting member (300) may include a plurality of grounding surfaces (G1, G21, G22, G23, G31, G32). The plurality of grounding surfaces (G1, G21, G22, G23, G31, G32) may be electrically connected to a grounding contact (313). At least one grounding surface (G1, G23) may be electrically connected to a grounding contact (313).

[0119] According to one embodiment of the present disclosure, at least one ground plane (G1, G23) may be disposed in a third portion (303) of a flexible connecting member (300). The at least one ground plane (G1, G23) may be disposed in some of the third regions (310-3, 320-3, 330-3) of a plurality of conductive layers (310, 320, 330) of the flexible connecting member (300) (e.g., third regions (310-3, 320-3) of the first conductive layer (310) and the second conductive layer (320)). Thus, the flexibility of the third portion (303) of the flexible connecting member (300) can be ensured. According to another embodiment of the present disclosure, a ground plane (G33) may also be disposed in a third region (330-3) of the third conductive layer (330).

[0120] For convenience of explanation, the grounding surface (G1) placed in the first conductive layer (310) may be named the first grounding surface. For convenience of explanation, the grounding surfaces (G21, G22, G23) placed in the second conductive layer (320) may be named the second-1 grounding surface (G21), the second-2 grounding surface (G22), and the second-3 grounding surface (G23). For convenience of explanation, the grounding surfaces (G31, G32, G33) placed in the third conductive layer (330) may be named the third-1 grounding surface (G31), the third-2 grounding surface (G32), and the third-3 grounding surface (G33).

[0121] According to one embodiment of the present disclosure, a first ground plane (G1) and a second-third ground plane (G23) may be disposed in a third portion (303) of a flexible connecting member (300). The second-third ground plane (G23) may be disposed below the first ground plane (G1) so as to overlap at least partially with the first ground plane (G1). Although not illustrated, according to another embodiment, a ground plane (e.g., a third-third ground plane (G33)) may be disposed in a region of a third conductive layer (330) (e.g., a third region (330-3)) that overlaps at least partially with the second-third ground plane (G23).

[0122] According to one embodiment of the present disclosure, a second-1 ground plane (G21) and a third-1 ground plane (G31) may be disposed in a first portion (301) of a flexible connection member (300). The third-1 ground plane (G31) may be disposed below the second-1 ground plane (G21) so as to overlap at least partially with the second-1 ground plane (G21). The second-1 ground plane (G21) and the third-1 ground plane (G31) may be connected to each other through vias. The second-1 ground plane (G21) may be disposed below the first section (311A) of the first signal line (311A, 311B) so as to overlap at least partially with the first section (311A) of the first signal line (311A, 311B). The second-1 ground plane (G21) and / or the third-1 ground plane (G31) and the first section (311A) of the first signal line (311A, 311B) may be configured to form a third capacitor (C3, see FIG. 6).

[0123] According to one embodiment of the present disclosure, a second-2 ground plane (G22) and a third-2 ground plane (G32) may be disposed in a first portion (301) of a flexible connection member (300). The third-2 ground plane (G32) may be disposed below the second-2 ground plane (G22) so as to overlap at least partially with the second-2 ground plane (G22). The second-2 ground plane (G22) and the third-2 ground plane (G32) may be connected to each other through vias. The second-2 ground plane (G32) may be disposed below the first section (312A) of the second signal line (312A, 312B) so as to overlap at least partially with the first section (312A) of the second signal line (312A, 312B). The second-2nd ground plane (G22) and / or the third-2nd ground plane (G32) and the first section (312A) of the second signal line (312A, 312B) may be configured to form a fourth capacitor (C4, see FIG. 6).

[0124] FIG. 10 is an enlarged view of a portion of the second conductive layer (320) shown in FIG. 8. FIG. 11 is an enlarged view of a portion of the third conductive layer (330) shown in FIG. 9.

[0125] According to one embodiment of the present disclosure, the inner end (L121) of the first coil (L12) of the first inductor coil (L11, L12) and the inner end (L112) of the second coil (L11) may overlap at least partially with the first signal contact (311). The inner end (L121) of the first coil (L12) of the first inductor coil (L11, L12) and the inner end (L112) of the second coil (L11) may be connected through a via. Accordingly, by connecting the first coil (L12) and the second coil (L11) placed on different conductive layers (320, 330) through vias, the flux density of the magnetic field line passing through the first signal contact (311) can be increased, and accordingly, the inductance capacity of the first inductor coils (L11, L12) can be increased relative to the same area (e.g., the XY area of ​​FIG. 5).

[0126] According to one embodiment of the present disclosure, the direction in which the first coil (L12) of the first inductor coil (L11, L12) is wound from the inner end (L121) to the outer end (L122) may be opposite to the direction in which the second coil (L11) is wound from the inner end (L112) to the outer end (L111). A signal obtained by the first switch (S1, see FIG. 5) may flow along the first inductor coil (L11, L12) in a first signal transmission direction (LD1) (counterclockwise in FIG. 10 and FIG. 11) and be transmitted to the first signal contact (311).

[0127] According to one embodiment of the present disclosure, the inner end (L221) of the first coil (L22) and the inner end (L212) of the second coil (L21) of the second inductor coil (L21, L22) may overlap at least partially with the second signal contact (312). The inner end (L221) of the first coil (L22) and the inner end (L212) of the second coil (L21) of the second inductor coil (L21, L22) may be connected through a via. Accordingly, by connecting the first coil (L22) and the second coil (L21) placed on different conductive layers (320, 330) through vias, the flux density of the magnetic field line passing through the second signal contact (312) can be increased, and accordingly, the inductance capacity of the second inductor coils (L21, L22) can be increased relative to the same area (e.g., the XY area of ​​FIG. 5).

[0128] According to one embodiment of the present disclosure, the direction in which the first coil (L22) of the second inductor coil (L21, L22) is wound from the inner end (L221) to the outer end (L222) may be opposite to the direction in which the second coil (L21) is wound from the inner end (L212) to the outer end (L211). A signal obtained by the second switch (S2, see FIG. 5) may flow along the second inductor coil (L21, L22) in a second signal transmission direction (LD2) (clockwise in FIG. 10 and FIG. 11) and be transmitted to the second signal contact (311).

[0129] According to one embodiment of the present disclosure, the second conductive plate (C21) of the second conductive portion (C21, C22) may be connected in parallel to the second coil (L21). According to one embodiment of the present disclosure, the second conductive plate (C11) of the first conductive portion (C11, C12) may be connected in parallel to the second coil (L11).

[0130] FIG. 12 is an enlarged view of a portion of the second conductive layer (320) shown in FIG. 8.

[0131] Referring to FIG. 12, according to one embodiment of the present disclosure, the flexible connecting member (300) may include a second-1 ground plane (G21) and a second-2 ground plane (G22) disposed in a first region (320-1) of the second conductive layer (320). The second-1 ground plane (G21) may be disposed below the first section (311A) of the first signal line (311A, 311B, see FIG. 7) so as to overlap at least partially with the first section (311A) of the first signal line (311A, 311B, see FIG. 7). The second-2 ground plane (G22) may be positioned below the first section (312A) of the first signal line (312A, 312B, see FIG. 7) so as to overlap at least partially with the first section (312A) of the second signal line (312A, 312B, see FIG. 7).

[0132] According to one embodiment of the present disclosure, the second-1 ground plane (G21) may include a first ground slot (O1) extended to intersect the first section (311A) of the first signal line (311A, 311B, see FIG. 7) when viewed from above the second-1 ground plane (G21). The first ground slot (O1) may be extended to intersect the first section (311A) of the first signal line (311A, 311B, see FIG. 7) at least once when viewed from above the second-1 ground plane (G21).

[0133] According to one embodiment of the present disclosure, the second-2 ground plane (G22) may include a second ground slot (O2) extended to intersect the first section (312A) of the second signal line (312A, 312B, see FIG. 7) when viewed from above the second-2 ground plane (G22). The second ground slot (O2) may be extended to intersect the first section (312A) of the second signal line (312A, 312B, see FIG. 7) at least once when viewed from above the second-2 ground plane (G22).

[0134] As an example, according to one embodiment of the present disclosure, the length (D) of the first ground slot (O1) and / or the second ground slot (O2) may be designed to be substantially equal to half the wavelength of the RF signal transmitted and / or received through the conductive segment (221S) according to [Equation 1] below. In [Equation 1] below, c represents the speed of light, e represents the effective permittivity, D represents the length of the ground slots (O1, O2), and f represents the frequency of the RF signal transmitted and / or received through the conductive segment (221S).

[0135] [Mathematical Formula 1]

[0136]

[0137] FIG. 13 illustrates the results of an antenna radiation efficiency experiment for a first electronic device according to a first comparative embodiment, a second electronic device according to a second comparative embodiment, and an electronic device (200) according to an embodiment of the present disclosure. The experimental results for the electronic device (200) according to an embodiment of the present disclosure may be represented by a first graph (P). The experimental results for the first electronic device according to a first comparative embodiment may be represented by a second graph (Q). The experimental results for the second electronic device according to a second comparative embodiment may be represented by a third graph (R). The first electronic device and the second electronic device according to the first comparative embodiment and the second comparative embodiment may be understood as embodiments in which at least some of the plurality of circuit elements (L1, L2, L3, L4, C1, C2, C3, C4) described with reference to FIG. 6 to FIG. 12 are lacking compared to the electronic device (200) according to an embodiment of the present disclosure.

[0138] Referring to the second plot (Q) and the third plot (R) of FIG. 13, it can be seen that in the case of the first electronic device and the second electronic device according to the comparative embodiment, the radiation efficiency of the antenna radiator (e.g., the conductive segment (221S) of FIG. 5) drops sharply in a specific band. This can be understood as being caused by parasitic resonance resulting from a portion of the radio waves being induced by a flexible connecting member (e.g., the flexible connecting member (300) of FIG. 5) placed around the antenna radiator (e.g., the conductive segment (221S) of FIG. 5). Referring to the second diagram (Q) and the first diagram (P) of FIG. 13, in the case of an electronic device (200) according to one embodiment of the present disclosure, it can be seen that parasitic resonance occurring in a flexible connecting member (300) is suppressed by a plurality of circuit elements (L1, L2, L3, L4, C1, C2, C3, C4) described with reference to FIG. 6 to FIG. 12.

[0139] FIG. 14 illustrates the layout of a first conductive layer (1310) of a flexible connecting member according to one embodiment of the present disclosure. FIG. 15 illustrates the layout of a second conductive layer (1320) of a flexible connecting member according to one embodiment of the present disclosure. FIG. 16 illustrates the layout of a third conductive layer (1330) of a flexible connecting member according to one embodiment of the present disclosure. A flexible connecting member according to one embodiment of the present disclosure described with reference to FIG. 14 to 16 may be named a second flexible connecting member.

[0140] The description regarding the components of a flexible connection member (300) according to one embodiment of the present disclosure described with reference to FIGS. 5 to 13 (e.g., first conductive layer (310), second conductive layer (320), third conductive layer (330), first signal contact (311), second signal contact (312), ground contact (313), first region (310-1, 320-1, 330-1), second region (310-2, 320-2, 330-2), third region (310-3, 320-3, 330-3)) according to one embodiment of the present disclosure described with reference to FIGS. 14 to 16 (e.g., first conductive layer (1310), second conductive layer (1320), third conductive layer (1330), first signal contact (1311), second signal contact (1312), ground) The contact point (1313), the first region (1310-1, 1320-1, 1330-1), the second region (1310-2, 1320-2, 1330-2), and the third region (1310-3, 1320-3, 1330-3)) can be applied substantially identically within a range that is not mutually arranged.

[0141] Referring to FIGS. 14 to 16, according to one embodiment of the present disclosure, the second flexible connection member may include a first conductive layer (1310) comprising signal contacts (1311, 1312) configured to transmit a signal obtained by the switches (S1, S2). The second flexible connection member may include a second conductive layer (1320) disposed below the first conductive layer (1310). The second flexible connection member may include a third conductive layer (1330) disposed below the second conductive layer (1320).

[0142] According to one embodiment of the present disclosure, the second flexible connecting member may include a first inductor coil (L01) and a second inductor coil (L02) disposed in the second conductive layer (1320). The first inductor coil (L01) may be disposed below the first signal contact (1311) so as to overlap at least partially with the first signal contact (1311). The second inductor coil (L02) may be disposed below the second signal contact (1312) so as to overlap at least partially with the second signal contact (1312).

[0143] According to one embodiment of the present disclosure, the second flexible connecting member may include a first conductive plate (C01) disposed on a third conductive layer (1330). The first conductive plate (C01) may be disposed below the first inductor coil (L01) so as to overlap at least partially with the first inductor coil (L01). As an example, the first conductive plate (C01) may be disposed below the outer end of the first inductor coil (L01).

[0144] According to one embodiment of the present disclosure, the second flexible connecting member may include a second conductive plate (C02) disposed on the third conductive layer (1330). The second conductive plate (C02) may be disposed below the second inductor coil (L02) so as to overlap at least partially with the second inductor coil (L02). As an example, the second conductive plate (C02) may be disposed below the outer end of the second inductor coil (L02).

[0145] According to one embodiment of the present disclosure, the second flexible connecting member may include a ground portion (G01, G02) disposed on the second conductive layer (1320). The ground portion (G01, G02) may include a ground plane (G01) and a ground line (G02) extending from the ground plane (G01). The ground line (G02) may include at least one line section (G04, G06) and at least one coil section (G03, G05, G07) disposed to surround the inductor coil (L01, L02). The line section (G04, G06) and at least one coil section (G03, G05, G07) of the ground line (G02) may at least partially surround the first inductor coil (L01) and / or the second inductor coil (L02).

[0146] According to one embodiment of the present disclosure, at least one coil section (G03, G05, G07) may be wound in a spiral shape. FIG. 15 illustrates, by way of example, a ground line (G02) comprising a first coil section (G03), a second coil section (G05), and a third coil section (G07). A first line section (G04) may be positioned between the first coil section (G03) and the second coil section (G05). A second line section (G06) may be positioned between the second coil section (G05) and the third coil section (G07). The first line section (G04) may extend along the circumference of a first inductor coil (L01). The second line section (G06) may extend along the circumference of a second inductor coil (L02).

[0147] According to one embodiment of the present disclosure, the first signal contact (1311) may partially overlap with the first coil section (G03). The first signal contact (1311) may partially overlap with the first inductor coil (L01). The second signal contact (1312) may partially overlap with the third coil section (G07). The second signal contact (1312) may partially overlap with the second inductor coil (L02). The ground contact (1313) may partially overlap with the second coil section (G05). The ground contact (1313) may partially overlap with the first inductor coil (L01). The second coil section (G03) may be positioned between the first inductor coil (L01) and the second inductor coil (L02).

[0148] According to one embodiment of the present disclosure, the first inductor coil (L01) may have a shape in which it is wound inward from one end toward the center (L011) and then wound outward from the center (L011) toward the other end. The direction in which the first inductor coil (L01) is wound inward from the one end toward the center (L011) may be opposite to the direction in which it is wound outward from the center (L011) toward the other end. The center (L011) may be named as the inflection point of the first inductor coil (L01). The first inductor coil (L01) may be configured to form a magnetic field directed toward the first signal contact (1311). The above-mentioned one end and the other end of the first inductor coil (L01) may be located on the outside of the spiral structure as both ends of the first inductor coil (L01).

[0149] According to one embodiment of the present disclosure, the second inductor coil (L02) may have a shape in which it is wound inward from one end toward the center (L021) and then wound outward from the center (L021) toward the other end. The direction in which the second inductor coil (L02) is wound inward from the one end toward the center (L021) may be opposite to the direction in which it is wound outward from the center (L021) toward the other end. The center (L021) may be named as the inflection point of the second inductor coil (L02). The second inductor coil (L02) may be configured to form a magnetic field directed toward the second signal contact (1312). The above-mentioned one end and the other end of the second inductor coil (L02) may be located on the outside of the spiral structure as both ends of the second inductor coil (L02).

[0150] According to one embodiment of the present disclosure, the first coil section (G03) may have a shape in which it is wound inward from one end toward the center (G031) and then wound outward from the center (G031) toward the other end. The second coil section (G05) may have a shape in which it is wound inward from one end toward the center (G051) and then wound outward from the center (G051) toward the other end. The third coil section (G07) ​​may have a shape in which it is wound inward from one end toward the center (G071) and then wound outward from the center (G071) toward the other end.

[0151] The spiral structure of the inductor coils (L01, L02) of the second flexible connecting member described with reference to FIGS. 14 to 16 can be applied substantially the same way to the inductor coils (L11, L12, L21, L22) of the flexible connecting member (300) described with reference to FIGS. 5 to 12, in a range that is not arranged with respect to each other.

[0152] FIG. 17 illustrates the layout of a first conductive layer (2310) of a flexible connecting member according to one embodiment of the present disclosure. FIG. 18 illustrates the layout of a second conductive layer (2320) of a flexible connecting member according to one embodiment of the present disclosure. FIG. 19 illustrates the layout of a third conductive layer (2330) of a flexible connecting member according to one embodiment of the present disclosure. A flexible connecting member according to one embodiment of the present disclosure described with reference to FIG. 17 through 19 may be named a third flexible connecting member.

[0153] The description regarding the components of a flexible connection member (300) according to one embodiment of the present disclosure described with reference to FIGS. 5 to 13 (e.g., first conductive layer (310), second conductive layer (320), third conductive layer (330), first signal contact (311), second signal contact (312), ground contact (313), first region (310-1, 320-1, 330-1), second region (310-2, 320-2, 330-2), third region (310-3, 320-3, 330-3)) according to one embodiment of the present disclosure described with reference to FIGS. 17 to 19 (e.g., first conductive layer (2310), second conductive layer (2320), third conductive layer (2330), first signal contact (2311), second signal contact (2312), ground) The contact point (2313), the first area (2310-1, 2320-1, 2330-1), the second area (2310-2, 2320-2, 2330-2), and the third area (2310-3, 2320-3, 2330-3)) can be applied substantially identically within the range that is not mutually arranged.

[0154] Referring to FIGS. 17 through 19, according to one embodiment of the present disclosure, the third flexible connecting member may include a first inductor coil (L001) and a second inductor coil (L002) disposed in a second conductive layer (2320). The first inductor coil (L001) may overlap at least partially with a portion of the first signal contact (2311) and the ground contact (2313). The second inductor coil (L002) may overlap at least partially with a portion of the second signal contact (2312) and the ground contact (2313).

[0155] According to one embodiment of the present disclosure, the first inductor coil (L001) may have a shape in which it is wound inward from one end toward the center (L003) and then wound outward from the center (L003) toward the other end. The direction in which the first inductor coil (L001) is wound inward from the one end toward the center (L003) may be opposite to the direction in which it is wound outward from the center (L003) toward the other end. The center (L003) may be named as the inflection point of the first inductor coil (L001). The first inductor coil (L001) may be configured to form a magnetic field directed toward the first signal contact (2311). The above-mentioned one end and the other end of the first inductor coil (L001) may be located on the outside of the spiral structure as both ends of the first inductor coil (L001).

[0156] According to one embodiment of the present disclosure, the second inductor coil (L002) may have a shape in which it is wound inward from one end toward the center (L004) and then wound outward from the center (L004) toward the other end. The direction in which the second inductor coil (L002) is wound inward from the one end toward the center (L004) may be opposite to the direction in which it is wound outward from the center (L004) toward the other end. The center (L004) may be named as the inflection point of the second inductor coil (L002). The second inductor coil (L002) may be configured to form a magnetic field directed toward the second signal contact (2312). The above-mentioned one end and the other end of the second inductor coil (L002) may be located on the outside of the spiral structure as both ends of the second inductor coil (L002).

[0157] According to one embodiment of the present disclosure, the third flexible connection member may include a conductive plate (C001) disposed in the third conductive layer (2330). The conductive plate (C001) may be disposed below the first inductor coil (L001) and the second inductor coil (L002) so as to overlap at least partially with the first inductor coil (L001) and the second inductor coil (L002). The conductive plate (C001) may be disposed below the first signal contact (2311), the second signal contact (2312), and the ground contact (2313) so as to overlap with the first signal contact (2311), the second signal contact (2312), and the ground contact (2313).

[0158] According to one embodiment of the present disclosure, the third flexible connecting member may include a ground portion (G001, G002) disposed on the second conductive layer (2320). The ground portion (G001, G002) may include a ground plane (G001) and a ground line (G002) extending from the ground plane (G001). The ground line (G002) may include a line section (G003) passing between the first inductor coil (L001) and the second inductor coil (L002). The line section (G003) may be extended to cross between the first inductor coil (L001) and the second inductor coil (L002).

[0159] An electronic device may include an antenna configured to generate an RF (radio frequency) signal and a flexible connection member (e.g., FPCB (flexible printed circuit board)) configured to transmit the signal. However, as electronic devices become thinner and smaller, the distance between the antenna and the flexible connection member is becoming increasingly closer, and consequently, interference (e.g., parasitic resonance) caused by the electromagnetic waves of the antenna may occur in the flexible connection member. Accordingly, much research is being conducted on methods to reduce interference occurring in the flexible connection member caused by electromagnetic waves from the antenna.

[0160] The problem to be solved in the present disclosure may be to provide a circuit arrangement within a flexible connecting member that can reduce interference (e.g., parasitic resonance) caused by external electromagnetic waves.

[0161] The problems to be solved in this disclosure are not limited to those mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0162] An electronic device according to various embodiments of the present disclosure can reduce interference (e.g., parasitic resonance) caused by external electromagnetic waves occurring in the flexible connection member through circuit elements (e.g., inductors and / or capacitors) inside the flexible connection member.

[0163] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the above description.

[0164] According to one embodiment of the present disclosure, the electronic device (200) may include a conductive segment (221S) having a keyhole formed therein, which forms a part of the side (221a) of the electronic device (200).

[0165] According to one embodiment of the present disclosure, the electronic device (200) may include a communication circuit electrically connected to the conductive segment (221S) to transmit and / or receive an RF (radio frequency) signal through the conductive segment (221S).

[0166] According to one embodiment of the present disclosure, the electronic device (200) may include a side key (225) disposed in the key hole and exposed to the outside of the electronic device (200).

[0167] According to one embodiment of the present disclosure, the electronic device (200) may include switches (S1, S2) disposed inside the side key (225) and configured to be pressed by the side key (225).

[0168] According to one embodiment of the present disclosure, the electronic device (200) may include a flexible connection member (300) electrically connected to the switches (S1, S2) to transmit a signal obtained by the switches (S1, S2).

[0169] According to one embodiment of the present disclosure, the flexible connection member (300) may include signal contacts (311, 312) exposed to the outside to transmit a signal obtained by the switch (S1, S2).

[0170] According to one embodiment of the present disclosure, the flexible connection member (300) may include an inductor coil (L1, L2) positioned below the signal contact (311, 312) so as to overlap at least partially with the signal contact (311, 312).

[0171] According to one embodiment of the present disclosure, the inductor coils (L1, L2) can be connected to the signal contacts (311, 312).

[0172] According to one embodiment of the present disclosure, the inductor coil (L1, L2) may include a first coil (L12, L22) disposed below the signal contact (311, 312) and a second coil (L11, L21) disposed below the first coil (L12, L22).

[0173] According to one embodiment of the present disclosure, the inductor coils (L1, L2) may be connected to each other such that the first coil (L12, L22) and the second coil (L11, L21) form a magnetic field in the same direction.

[0174] According to one embodiment of the present disclosure, the inner end (L121, L221) of the first coil (L12, L22) and the inner end (L112, L212) of the second coil (L11, L21) may overlap with the signal contact (311, 312).

[0175] According to one embodiment of the present disclosure, the inner ends (L121, L221) of the first coil (L12, L22) and the inner ends (L112, L212) of the second coil (L11, L21) can be connected through vias.

[0176] According to one embodiment of the present disclosure, the direction in which the first coil (L12, L22) is wound from the inner end (L121, L221) to the outer end (L122, L222) may be opposite to the direction in which the second coil (L11, L21) is wound from the inner end (L112, L212) to the outer end (L111, L211).

[0177] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a first portion (301) that extends substantially parallel to the side (221a) of the electronic device (200) and is spaced inward from the switch (S1, S2).

[0178] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a second portion (302) that extends substantially parallel to the front (220a) or rear (220b) of the electronic device (200) and has the signal contact (311, 312) disposed therein.

[0179] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a third part (303) that bends between the first part (301) and the second part (302).

[0180] According to one embodiment of the present disclosure, a third portion (303) of a flexible connecting member (300) may include at least one ground plane (G1, G23).

[0181] According to one embodiment of the present disclosure, the at least one ground plane (G1, G23) may be disposed in at least one of a plurality of conductive layers (310, 320, 330) included in the third part (303) of the flexible connecting member (300).

[0182] According to one embodiment of the present disclosure, the flexible connection member (300) may include a ground contact (313) that is exposed to the outside and electrically connected to the signal contact (311, 312).

[0183] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a conductive portion (C11, C12, C21, C22) disposed below the ground contact (313) so as to be coupled to the ground contact (313).

[0184] According to one embodiment of the present disclosure, the conductive portions (C11, C12, C21, C22) of the flexible connecting member (300) can be electrically connected to the inductor coils (L1, L2).

[0185] According to one embodiment of the present disclosure, the conductive portions (C11, C12, C21, C22) may be connected in parallel to the inductor coils (L1, L2).

[0186] According to one embodiment of the present disclosure, the conductive portion (C11, C12, C21, C22) may include a first conductive plate (C12, C22) disposed below the ground contact (313).

[0187] According to one embodiment of the present disclosure, the conductive portion (C11, C12, C21, C22) may include a second conductive plate (C11, C21) disposed below the first conductive plate (C12, C22) so as to overlap with the first conductive plate (C12, C22).

[0188] According to one embodiment of the present disclosure, the second conductive plate (C11, C21) may be electrically connected to the first conductive plate (C12, C22).

[0189] According to one embodiment of the present disclosure, the second conductive plate (C11, C21) is connected in parallel to the second coil (L11, L21), and the first conductive plate (C12, C22) is connected to the second conductive plate (C11, C21) through a via, in an electronic device.

[0190] According to one embodiment of the present disclosure, the flexible connecting member (300) may include signal lines (311A, 312A) connecting the switch (S1, S2) and the inductor coil (L1, L2).

[0191] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a ground plane (G21, G22) disposed below the signal lines (311A, 312A).

[0192] According to one embodiment of the present disclosure, the ground plane (G21, G22) may include a ground slot (O1, O2) extended to intersect the signal line (311A, 312A) when viewed from above the ground plane (G21, G22).

[0193] According to one embodiment of the present disclosure, the signal lines (311A, 312A) and the ground planes (G21, G22) may be disposed in the first portion (301) of the flexible connection member (300).

[0194] According to one embodiment of the present disclosure, the length of the ground slot (O1, O2) may be substantially equal to half the wavelength of the RF signal transmitted and / or received through the conductive segment (221S).

[0195] According to one embodiment of the present disclosure, the signal contacts (311, 312) may include a first signal contact (311) and a second signal contact (312) that are arranged adjacent to each other and configured to transmit different signals.

[0196] According to one embodiment of the present disclosure, the inductor coils (L1, L2) may include a first inductor coil (L11, L12) disposed below the first signal contact (311).

[0197] According to one embodiment of the present disclosure, the inductor coils (L1, L2) may include a first inductor coil (L21, L22) disposed below the second signal contact (312).

[0198] According to one embodiment of the present disclosure, the flexible connection member (300) may include a ground contact (313) that is disposed between the first signal contact (311) and the second signal contact (312) and is exposed to the outside.

[0199] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a first conductive portion (C11, C12) disposed below the ground contact (313) so as to be coupled to a first region of the ground contact (313).

[0200] According to one embodiment of the present disclosure, the first conductive portion (C11, C12) may be connected in parallel to the first inductor coil (L11, L12).

[0201] According to one embodiment of the present disclosure, the flexible connecting member (300) may include a second conductive portion (C21, C22) disposed below the ground contact (313) so as to be coupled to a second region of the ground contact (313).

[0202] According to one embodiment of the present disclosure, the second conductive portion (C21, C22) may be connected in parallel to the second inductor coil (L1, L2).

[0203] According to one embodiment of the present disclosure, the flexible connecting member may include a first conductive layer (1310) comprising a signal contact (1311, 1312) configured to transmit a signal obtained by the switch (S1, S2).

[0204] According to one embodiment of the present disclosure, the flexible connecting member may include a second conductive layer (1320) disposed below the first conductive layer (1310).

[0205] According to one embodiment of the present disclosure, the second conductive layer (1320) may include an inductor coil (L01, L02) that overlaps at least partially with the signal contact (1311, 1312).

[0206] According to one embodiment of the present disclosure, the flexible connecting member may include a third conductive layer (1330) disposed below the second conductive layer (1320).

[0207] According to one embodiment of the present disclosure, the electronic device comprises a third conductive layer (1330) comprising a conductive plate (C01, C02) that is at least partially overlapped with the inductor coil (L01, L02).

[0208] According to one embodiment of the present disclosure, the flexible connecting member may include a ground line (G02) disposed on the second conductive layer (1320) and at least partially surrounding the inductor coil (L01, L02).

[0209] According to one embodiment of the present disclosure, the flexible connecting member may include a ground contact (1313) disposed on the first conductive layer (1310) and exposed to the outside.

[0210] According to one embodiment of the present disclosure, the ground line (G02) may include coil sections (G03, G05, G07) that are extended in a spiral shape and at least partially overlap with the ground contact (1313).

[0211] According to one embodiment of the present disclosure, the signal contacts (1311, 1312) may partially overlap with the coil sections (G03, G05, G07), and the ground contact (1313) may partially overlap with the inductor coils (L01, L02).

[0212] According to one embodiment of the present disclosure, the inductor coil (L01, L02) may have a shape in which it is wound inward from one end toward the center (L011, L021) and then wound outward from the center (L011, L021) toward the other end.

[0213] Although the present disclosure has been described by way of example with respect to various embodiments, it should be understood that the various embodiments are for illustrative purposes only and are not intended to limit the invention. It will be obvious to those skilled in the art that various changes in form and detailed configuration may be made without departing from the whole context of the present disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (200), A conductive segment (221S) that forms part of the side (221a) of the electronic device (200) and has a key hole formed therein; A communication circuit electrically connected to the conductive segment (221S) to transmit and / or receive an RF (radio frequency) signal through the conductive segment (221S); A side key (225) positioned in the key hole and exposed to the outside of the electronic device (200); A switch (S1, S2) disposed on the inner side of the side key (225) and configured to be pressed by the side key (225); and It includes a flexible connecting member (300) electrically connected to the switches (S1, S2) to transmit a signal obtained by the switches (S1, S2), and The above flexible connecting member (300) is: Signal contacts (311, 312) exposed externally to transmit signals obtained by the switches (S1, S2); and It includes an inductor coil (L11, L12, L21, L22) positioned below the signal contact (311, 312) so as to overlap at least partially with the signal contact (311, 312) and connected to the signal contact (311, 312), The above inductor coils (L11, L12, L21, L22) are, It includes a first coil (L12, L22) positioned below the signal contact (311, 312) and a second coil (L11, L21) positioned below the first coil (L12, L22), The first coil (L12, L22) and the second coil (L11, L21) are connected to each other to form a magnetic field in the same direction in an electronic device.

2. In Paragraph 1, The inner end (L121, L221) of the first coil (L12, L22) and the inner end (L112, L212) of the second coil (L11, L21) overlap with the signal contact (311, 312) of the electronic device.

3. In Paragraph 2, The inner ends (L121, L221) of the first coil (L12, L22) and the inner ends (L112, L212) of the second coil (L11, L21) are connected through vias in an electronic device.

4. In any one of paragraphs 1 to 3, An electronic device in which the direction in which the first coil (L12, L22) is wound from the inner end (L121, L221) to the outer end (L122, L222) is opposite to the direction in which the second coil (L11, L21) is wound from the inner end (L112, L212) to the outer end (L111, L211).

5. In any one of paragraphs 1 through 4, The above flexible connecting member (300) is, A first portion (301) that extends substantially parallel to the side (221a) of the electronic device (200) and is spaced inward from the switch (S1, S2); and An electronic device comprising a second portion (302) that extends substantially parallel to the front (220a) or rear (220b) of the electronic device (200) and has the signal contacts (311, 312) arranged thereon.

6. In Paragraph 5, The above flexible connecting member (300) is, It includes a third part (303) that is bent between the first part (301) and the second part (302) and includes at least one ground plane (G1, G23), and The above at least one ground plane (G1, G23) is, An electronic device disposed on at least one of a plurality of conductive layers (310, 320, 330) included in the third part (303) of the flexible connecting member (300).

7. In any one of paragraphs 1 through 6, The above flexible connecting member (300) is: A ground contact (313) exposed to the outside and electrically connected to the signal contacts (311, 312); and An electronic device comprising a conductive part (C11, C12, C21, C22) positioned below the ground contact (313) to be coupled to the ground contact (313) and electrically connected to the inductor coil (L11, L12, L21, L22).

8. In Paragraph 7, The above conductive parts (C11, C12, C21, C22) are electronic devices connected in parallel to the inductor coils (L11, L12, L21, L22).

9. In Paragraph 8, The above conductive parts (C11, C12, C21, C22) are: A first conductive plate (C12, C22) positioned below the ground contact (313); and An electronic device comprising a second conductive plate (C11, C21) positioned below the first conductive plate (C12, C22) so as to overlap with the first conductive plate (C12, C22) and electrically connected to the first conductive plate (C12, C22).

10. In Paragraph 9, An electronic device in which the second conductive plate (C11, C21) is connected in parallel to the second coil (L11, L21), and the first conductive plate (C12, C22) is connected to the second conductive plate (C11, C21) through a via.

11. In any one of paragraphs 7 through 10, The above flexible connecting member (300) is: Signal lines (311A, 312A) connecting the switches (S1, S2) and the inductor coils (L11, L12, L21, L22); and An electronic device comprising a ground plane (G21, G22) positioned below the signal lines (311A, 312A), the ground plane (G21, G22) including a ground slot (O1, O2) extended to intersect the signal lines (311A, 312A) when viewed from above the ground plane (G21, G22).

12. In Paragraph 11, The above flexible connecting member (300) is, A first portion (301) that extends substantially parallel to the side (221a) of the electronic device (200) and is spaced inward from the switch (S1, S2); and It includes a second part (302) that extends parallel to the front (220a) or rear (220b) of the electronic device (200) and has the signal contacts (311, 312) arranged thereon, The above signal lines (311A, 312A) and the above ground planes (G21, G22) are electronic devices disposed in the first part (301) of the flexible connection member (300).

13. In Article 11 or Article 12, The length of the above ground slots (O1, O2) is, An electronic device substantially identical to half the wavelength of the RF signal transmitted and / or received through the conductive segment (221S).

14. In any one of paragraphs 1 through 6, The above signal contacts (311, 312) are, It includes a first signal contact (311) and a second signal contact (312) arranged adjacent to each other and configured to transmit different signals, The above inductor coils (L11, L12, L21, L22) are, A first inductor coil (L11, L12) positioned below the first signal contact (311); and An electronic device comprising a first inductor coil (L21, L22) positioned below the second signal contact (312).

15. In Paragraph 14, The above flexible connecting member (300) is: A ground contact (313) disposed between the first signal contact (311) and the second signal contact (312) and exposed to the outside; A first conductive portion (C11, C12) positioned below the ground contact (313) to be coupled to a first region of the ground contact (313) and connected in parallel to the first inductor coil (L11, L12); and An electronic device comprising a second conductive portion (C21, C22) positioned below the ground contact (313) to be coupled to a second region of the ground contact (313) and connected in parallel to the first inductor coil (L21, L22).

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