Connector, circuit board assembly, and electronic device

By employing a connector and a first substrate design in the connector, the elastic deformation of the bending path is used to achieve a tight connection between the connector and the other end connector, solving the problem of poor signal integrity caused by excessive stub length and improving signal transmission quality.

WO2026144135A1PCT designated stage Publication Date: 2026-07-09HUAWEI TECH CO LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2025-07-31
Publication Date
2026-07-09

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    Figure CN2025111885_09072026_PF_FP_ABST
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Abstract

The present application relates to the technical field of electronic devices, and discloses a connector, a circuit board assembly, and an electronic device. The connector comprises a coupling, a first substrate, and a first wiring layer. The coupling comprises a first wiring terminal, and the coupling is configured to be inserted into a peer connector in a first direction, so that the first wiring terminal is electrically connected to a second wiring terminal of the peer connector. The first substrate is located on the side of the coupling facing away from the first direction and is connected to the coupling. A first section of the first substrate comprises a first end and a second end in the first direction, and extends from the first end to the second end along a bending path. The first wiring layer is disposed on the first substrate, extends from at least the first end to the second end of the first section, and is electrically connected to the first wiring terminal. When the coupling is inserted into the peer connector, the first section elastically deforms to provide an acting force for the coupling, so that the coupling is tightly connected to the peer connector. Thus, an incomplete engagement distance can be reduced, thereby reducing the length of a stub and improving signal integrity.
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