High-thermal-conductivity magnesium-based composite material and preparation method therefor
By introducing thermally conductive reinforcing agents and metal element powders into magnesium alloys and employing a semi-solid injection molding process, the problems of poor thermal conductivity and difficult molding in magnesium alloy composites have been solved, resulting in magnesium alloy composites with high thermal conductivity and good formability.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-10-20
- Publication Date
- 2026-07-09
AI Technical Summary
Existing magnesium alloy composites have poor thermal conductivity, making it difficult to uniformly disperse the thermally conductive reinforcing phase and resulting in poor interfacial bonding, which leads to increased thermal resistance. Furthermore, traditional processes are not suitable for forming complex structures.
By introducing thermally conductive reinforcement and first metallic element powder into magnesium alloys and using a semi-solid injection molding process, a uniform dispersion of thermally conductive reinforcement and intermetallic compound is formed, constructing a three-dimensional heat conduction pathway and improving interfacial bonding.
It significantly improves the thermal conductivity and formability of magnesium alloy composites, achieving a combination of high thermal conductivity and good formability, making it suitable for large-scale production.
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Figure CN2025128660_09072026_PF_FP_ABST