Power conversion device

Abstract

The embodiments of the present application relate to the technical field of electronic devices. Provided is a power conversion device, which is used to solve the problem of a high temperature in an inner cavity of the power conversion device. A plurality of electronic devices are provided on a first surface of a circuit board. The circuit board is disposed in a housing, and a cover plate of the housing faces the first surface of the circuit board. A first plate is disposed between the cover plate and the circuit board and faces the circuit board. A first channel is formed between the first plate and the cover plate, and a second channel is formed between the first plate and the circuit board. A second channel opening and a first channel opening are in communication with the first channel and the second channel, respectively. A fan is disposed at the second channel opening. A direction of an airflow flowing through the first channel opening is opposite a direction of an airflow flowing through the second channel opening. Under the guidance of the fan, air in the second channel flows into the first channel to perform heat exchange with the cover plate so as to reduce the temperature thereof, and the air in the first channel flows into the second channel, thereby reducing the temperature of the inner cavity of the housing and improving the heat dissipation capability inside the power conversion device.

Description

Power conversion device

[0001] This application claims priority to Chinese Patent Application No. 202411999596.0, filed with the State Intellectual Property Office of China on December 31, 2024, entitled "Power Conversion Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic device technology, and in particular to a power conversion device. Background Technology

[0003] A power conversion device is a device that converts electrical energy from one form to another. For example, an inverter is used to convert direct current (DC) to alternating current (AC). A power conversion device typically includes a housing, a circuit board inside the housing, and various components on the circuit board (such as power modules, inductors, and capacitors). These components generate a significant amount of heat during operation. If heat cannot be dissipated in a timely manner, it will affect the efficiency and lifespan of the circuit board and its components, thus impacting the normal operation of the power conversion device.

[0004] In existing technologies, fans are typically installed inside the casing of power conversion devices. The blowing or drawing air from the fans accelerates the airflow around the circuit board and its components, carrying away the heat emitted by the circuit board and its components, thus achieving a heat dissipation effect. However, this method results in a relatively high cavity temperature inside the casing, leading to poor heat dissipation for the circuit board and its components. Summary of the Invention

[0005] This application provides a power conversion device to improve the heat dissipation capacity inside the power conversion device.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] A first aspect of this application provides a power conversion device, comprising a circuit board, a housing, a first plate, a fan, at least one first channel port, and a second channel port. The circuit board includes a first surface on which a plurality of electronic components are disposed. The circuit board is located within the housing, which includes a cover plate facing the first surface of the circuit board. The first plate faces the first surface of the circuit board and is disposed between the cover plate and the circuit board. A first channel is formed between the first plate and the cover plate, and a second channel is formed between the first plate and the circuit board. Each first channel port connects the first channel and the second channel. The second channel port connects the first channel and the second channel, and the fan is disposed at the second channel port. The direction of airflow through the first channel port is opposite to the direction of airflow through the second channel port.

[0008] In the power conversion device disclosed in this application, a first plate is provided, forming a first channel between the first plate and a cover plate, and a second channel between the first plate and a circuit board. That is, the space on the side of the circuit board facing the cover plate is divided into a first channel and a second channel. The second channel is closer to the circuit board, i.e., closer to the heat source, while the first channel is farther from the circuit board, i.e., farther from the heat source. The air in the second channel can exchange heat with the circuit board and the electronic components on the first surface of the circuit board to remove heat from the circuit board and the electronic components on the first surface. The air in the first channel can exchange heat with the cover plate to lower the temperature of the air in the first channel. Under the guidance of a fan, the air in the second channel can circulate with the air in the first channel through the first channel opening and the second channel opening. The direction of the airflow through the first channel opening is opposite to the direction of the airflow through the second channel opening; therefore, the first channel, the second channel, the first channel opening, and the second channel opening can form an air circulation loop. This can be understood as follows: the hotter air in the second channel can enter the first channel for cooling. The hotter air exchanges heat with the cover plate in the first channel, transforming into cooler air. This cooler air in the first channel can then enter the second channel to dissipate heat from the circuit board and the electronic components on the first surface. Compared to existing technologies where the space on the side of the circuit board facing the cover plate is not divided, the air circulation between the first and second channels improves the heat dissipation of the circuit board and the electronic components on its first surface, reduces the temperature inside the power conversion device cavity (i.e., the temperature inside the outer casing), and enhances the internal heat dissipation capacity of the power conversion device.

[0009] Furthermore, compared to the existing technology where the space on the side of the circuit board facing the cover is not divided, the space of the first channel is smaller, allowing air to converge into the first channel. This increases the airflow time within the first channel, thereby enhancing the convective heat transfer between the space on the side of the circuit board facing the cover and the external environment. This allows the heat carried by the air in the space on the side of the circuit board facing the cover to be transferred to the cover more efficiently. In other words, the heat generated by the circuit board and the electronic devices on the first surface of the circuit board can be transferred to the cover more efficiently. The cover can then conduct the heat out to the external environment, thereby reducing the temperature inside the casing and improving the heat dissipation effect of the circuit board and the electronic devices on it.

[0010] In some examples, a fan is used to guide air from the first channel to the second channel. Driven by the fan, air from the first channel flows through the second channel opening into the second channel, and air from the second channel flows through the first channel opening into the first channel, forming an air circulation loop and enabling airflow between the second and first channels.

[0011] In other examples, a fan is used to guide air from the second channel into the first channel. Driven by the fan, air in the second channel flows through the second channel opening into the first channel, and air in the first channel flows through the first channel opening into the second channel, forming an air circulation loop and enabling air exchange between the second and first channels.

[0012] In one alternative implementation, a second channel port is disposed on the first plate. The fan is disposed opposite to at least one of a plurality of electronic devices.

[0013] Because the electronic components on the first surface of the circuit board generate a high amount of heat, this heat easily accumulates on the board, potentially leading to localized overheating. Therefore, a fan is positioned opposite at least one of the multiple electronic components—for example, opposite the component generating the most heat. This fan's airflow accelerates the heat exchange between the air and the electronic components, improving the heat dissipation efficiency and preventing heat buildup on the circuit board, thus ensuring safe operation.

[0014] In some examples, the fan is a horizontal fan. Compared to a vertical fan, a horizontal fan configuration reduces the space the fan occupies in the thickness direction of the circuit board, thereby helping to reduce the size and space occupied by the power conversion device in the thickness direction of the circuit board.

[0015] In this example, the fan can be any of the following: axial fan, centrifugal fan, or mixed-flow fan. An axial fan is one where the airflow direction is parallel to the fan axis. A centrifugal fan is one where the airflow direction is perpendicular to the fan axis. A mixed-flow fan is one where the airflow direction intersects the fan axis.

[0016] In one alternative embodiment, the housing includes a back plate disposed opposite to the cover plate, and a plurality of sidewalls located between the cover plate and the back plate, wherein a first sidewall of the plurality of sidewalls is spaced from the edge of the first plate to form a first channel opening.

[0017] This can be understood as the first channel opening being located between the edge of the first sidewall and the first plate, thus the first channel opening is independent of the first plate. This not only reduces manufacturing costs but also allows for more flexible design of the first channel opening. The position and size of the first channel opening can be adjusted according to actual needs. For example, in different power conversion devices, the position and size of the first channel opening can be adjusted by changing the position of the first plate, based on the circuit board's location and the distribution of electronic components. This ensures the adjusted first channel opening can fit the circuit board and meet the heat dissipation requirements of different power conversion devices.

[0018] In one alternative implementation, the fan's air inlet faces the second channel, and the fan's air outlet faces the first channel. Multiple electronic devices include a first device, and the second channel opening is closer to the first device than the first channel opening.

[0019] This can be understood as follows: the air in the second channel enters the fan's air inlet and then enters the first channel from the fan's air outlet. The fan is used to transport the air in the second channel to the first channel.

[0020] Driven by the fan, air continuously flows from the second channel into the first channel, increasing the air pressure within the first channel. This allows air to enter the second channel from the first channel opening. The fan then continuously draws air from the second channel back into the first channel, creating an air circulation loop. The fan accelerates the airflow in both channels, improving the heat dissipation efficiency of the circuit board and its electronic components.

[0021] In some examples, the first device is one of the electronic devices that generates the most heat among multiple electronic components. Since the fan is positioned at the second channel opening and is used to deliver air from the second channel to the first channel, the second channel opening is closer to the first device than the first channel opening. This allows the fan to preferentially draw air from the vicinity of the first device into the first channel, increasing the airflow velocity near the first device, improving its heat dissipation efficiency, and preventing heat buildup near the first device that could lead to localized overheating of the circuit board.

[0022] In some examples, the fan is positioned opposite the first device to further improve the heat dissipation efficiency of the first device.

[0023] In one alternative implementation, the fan's air inlet faces the first channel, and the fan's air outlet faces the second channel. Multiple electronic components include a second component, with the fan positioned opposite to the second component.

[0024] This can be understood as follows: the air in the first channel enters the fan's air inlet and then enters the second channel from the fan's air outlet. The fan is used to transport the air in the first channel to the second channel.

[0025] Under the influence of the fan, air continuously flows from the first channel into the second channel, increasing the air pressure in the second channel. This allows air from the second channel to enter the first channel from the inlet. The fan continuously draws air from the first channel into the second channel, creating an air circulation loop. The fan accelerates the airflow in both channels, improving the heat dissipation efficiency of the circuit board and its electronic components.

[0026] In some examples, the second device is one of the electronic components that generates the most heat. The fan is positioned opposite the second device, allowing the air drawn into the second channel by the fan to exchange heat with the second device first, effectively reducing its temperature. Because the air drawn into the second channel by the fan is at a lower temperature, the heat dissipation efficiency of the second device is improved, preventing heat buildup at the second device and thus avoiding localized overheating of the circuit board.

[0027] In one alternative embodiment, the housing includes a back plate disposed opposite to the cover plate, and a plurality of sidewalls located between the cover plate and the back plate, the edge of the first plate abutting against a first sidewall among the plurality of sidewalls. A first channel opening is disposed on the first plate.

[0028] For example, the first channel opening can be formed on the first plate by cutting, stamping or molding, which is convenient for processing, saves assembly steps and assembly difficulty, and improves the assembly efficiency of the power conversion device.

[0029] In one optional implementation, the fan's air inlet faces the second channel, and the fan's air outlet faces the first channel. At least one first channel port includes multiple first channel ports, with each of the multiple first channel ports corresponding to a specific set of electronic components.

[0030] This can be understood as follows: the air in the second channel enters the fan's air inlet and then enters the first channel from the fan's air outlet. The fan is used to transport the air in the second channel to the first channel.

[0031] Driven by the fan, air continuously flows from the second channel into the first channel, increasing the air pressure within the first channel. This allows air to enter the second channel from the first channel opening. The fan then continuously draws air from the second channel back into the first channel, creating an air circulation loop. The fan accelerates the airflow in both channels, improving the heat dissipation efficiency of the circuit board and its electronic components.

[0032] By strategically placing multiple first channel ports and corresponding electronic components, directional airflow is directed to cool these components, thereby improving their heat dissipation efficiency. Specifically, the air flowing from each first channel port into the second channel preferentially cools the electronic component positioned opposite that first channel port, enhancing heat dissipation efficiency and preventing heat buildup at the electronic components that could lead to localized overheating of the circuit board.

[0033] In one alternative implementation, the diameter of the first channel opening is smaller than the diameter of the second channel opening.

[0034] In some examples, a single first channel opening is used. Since the diameter of the first channel opening is smaller than that of the second channel opening, air flowing from the second channel into the first channel accumulates within the first channel, gradually increasing the pressure until it exceeds that of the second channel. Driven by the pressure difference between the first and second channels, the air in the first channel flows from the first channel to the second channel through the first channel opening, with the air velocity increasing near the first channel opening to achieve a jet effect. Because the diameter of the first channel opening remains constant, the airflow rate through it per unit time also increases, improving the heat dissipation efficiency of the circuit board and its electronic components. Furthermore, the air exiting the first channel opening tends to diffuse, mixing with the surrounding air and thus rapidly reducing the air temperature in the second channel.

[0035] In some examples, there are multiple first channel ports, and the sum of the diameters of the multiple first channel ports is smaller than the diameter of the second channel port, so that each first channel port has the function of jetting, thereby further improving the heat dissipation efficiency inside the housing.

[0036] In one alternative embodiment, the first plate includes a first protrusion facing the circuit board. The first protrusion includes a first surface opposite to the circuit board, and a first channel opening is formed on the first surface.

[0037] Compared to a case where the surface of the first board facing the circuit board is flat, the first protrusion reduces the distance between the first channel opening and the circuit board. Since the first surface faces the circuit board, air flowing into the second channel from the first channel opening can directly reach the circuit board and the electronic components on it. Furthermore, because the distance between the first channel opening and the circuit board is reduced, the air directly reaching the circuit board and electronic components is at a lower temperature, thus further improving the heat dissipation efficiency of the circuit board and its electronic components.

[0038] In this example, the first protrusion may include one or more.

[0039] In one alternative embodiment, the first protrusion further includes a second surface that extends along the thickness direction of the circuit board and has a first channel opening.

[0040] In some examples, the electronic component to be cooled on the circuit board can be positioned opposite the second surface, i.e., the first protrusion is located on one side of the electronic component to be cooled. Air flowing into the second channel from the first channel opening on the second surface can dissipate heat from the electronic component to be cooled, thereby improving the heat dissipation efficiency of the electronic component to be cooled while reducing the size of the housing in the thickness direction of the circuit board, i.e., reducing the size of the power conversion device in the thickness direction of the circuit board.

[0041] In one optional embodiment, a plurality of electronic devices include a third device and a fourth device, which are spaced apart. A first protrusion includes a first portion and a second portion, the second portion being closer to the circuit board than the first portion. A first surface is disposed on the first portion, with a first channel opening on the first surface opposite to the surface of the third device facing away from the circuit board. A second surface is disposed on the second portion, located between the third and fourth devices, with the first channel opening on the second surface opposite to the surface of the third device facing the fourth device.

[0042] This can be understood as follows: the first channel opening on the first part is opposite to the surface of the third device that is away from the circuit board, and the first channel opening on the second part is opposite to the surface of the third device that faces the fourth device.

[0043] In this way, the air flowing out of the first channel on the first part into the second channel can dissipate heat on the surface of the third device away from the circuit board, and the air flowing out of the first channel on the second part into the second channel can dissipate heat on the surface of the third device facing the fourth device. That is, multi-faceted air supply and heat dissipation of the third device are realized, thereby further improving the heat dissipation effect of the third device.

[0044] In some examples, the first channel opening on the first part faces the surface of the fourth device away from the circuit board, while the first channel opening on the second part faces the surface of the fourth device facing the third device. In this way, air flowing from the first channel opening on the first part into the second channel can dissipate heat from the surface of the fourth device away from the circuit board, and air flowing from the first channel opening on the second part into the second channel can dissipate heat from the surface of the fourth device facing the third device. This achieves multi-directional airflow cooling for the fourth device, further improving its heat dissipation effect.

[0045] In one alternative embodiment, the plurality of electronic devices includes a fifth device. A groove is included on the surface of the first board facing the circuit board, and the fifth device is accommodated within the groove. At least one surface of the groove opposite to the fifth device has a first channel opening.

[0046] In some examples, a first channel opening is provided on one surface of the groove opposite to the fifth device, and air flowing out from the first channel opening into the second channel can preferentially dissipate heat from the surface of the fifth device opposite to the first channel opening.

[0047] In some examples, the groove has multiple first channel openings on the surfaces opposite to the fifth device, from which air flows out of the second channel, preferentially dissipating heat from the fifth device and the surface opposite to the corresponding first channel opening, thereby achieving multi-faceted airflow heat dissipation of the fifth device and further improving the heat dissipation effect of the fifth device.

[0048] In one alternative embodiment, a heat sink is provided on the surface of the circuit board facing the first board, and the first channel opening is disposed opposite to the heat sink.

[0049] In this example, the heat sink is opposite to the first channel opening. The air flowing from the first channel opening into the second channel can dissipate heat from the heat sink to improve its heat dissipation efficiency, which in turn can improve the heat dissipation efficiency of electronic devices connected to the heat sink.

[0050] In some examples, there may be multiple first channel ports positioned opposite the heat sink, each capable of dissipating heat from the heat sink. The use of multiple first channel ports can further improve the heat dissipation efficiency of the heat sink.

[0051] In some examples, the heat sink may include a circuit board heat sink and a relay heat sink.

[0052] In one optional embodiment, the cover plate is provided with a plurality of toothed plates in the direction facing the first plate, and the plurality of toothed plates are spaced apart.

[0053] The toothed fins allow heat to be transferred from the air in the first channel to the fins, which then transfer the heat to the cover plate. The cover plate exchanges heat with the external environment, reducing its temperature and consequently lowering the air temperature in the first channel. The toothed fins also increase the contact area between the air in the first channel and the cover plate, thereby improving the heat dissipation efficiency between the cover plate and the external environment.

[0054] Multiple heat dissipation fins are spaced apart to form airflow channels between adjacent fins. These channels guide the airflow within the first channel, allowing it to flow smoothly and continuously, creating a stable and continuous airflow field. This facilitates more efficient heat transfer from the cover plate to the external environment. Without these channels, airflow within the first channel would flow in different directions, potentially disrupting the flow and reducing heat dissipation efficiency.

[0055] In some examples, the toothed plate is integrally molded with the cover plate to reduce machining and assembly steps.

[0056] In one alternative implementation, the projections of a plurality of toothed blades on the first plate are located around the fan, and in a direction parallel to the cover plate, each toothed blade extends from one end near the fan to an opposite sidewall.

[0057] Because the air temperature entering the first channel from the second channel is higher, and the air entering the first channel from the second channel tends to accumulate between the fan and the cover plate, it affects the heat dissipation efficiency in the first channel.

[0058] To reduce the likelihood of hot air accumulating between the fan and the cover plate in the first channel, the projections of multiple toothed blades on the first plate are positioned around the fan. This can be understood as the fan's projection on the cover plate not covering the toothed blades. This provides sufficient space for the hot air entering the first channel, ensuring that the airflow speed between the fan and the cover plate is undisturbed, thus reducing the possibility of hot air accumulating between the fan and the cover plate. Conversely, if the fan's projection on the cover plate covers the toothed blades, some of the air entering the first channel flows onto the blades, which create resistance to the airflow, slowing down the airflow speed between the fan and the cover plate. This would exacerbate the accumulation of hot air between the fan and the cover plate in the first channel.

[0059] In this example, in a direction parallel to the cover plate, each tooth extends from one end near the fan to the opposite sidewall to increase the length of the guide channel formed between the two tooth plates. This is more conducive to the formation of a stable and continuous flow field when the airflow flows in the first channel, so that heat can be transferred more effectively from the cover plate to the external environment.

[0060] In one alternative embodiment, the spacing between two adjacent teeth in at least a portion of the plurality of toothed plates increases in the direction away from the fan.

[0061] When the fan inlet faces the second channel, the fan guides the air in the second channel into the first channel. At least some of the toothed plates increase the spacing between two adjacent toothed plates in the direction away from the fan, and the cross-sectional area of ​​the airflow channel formed between two adjacent toothed plates increases, so as to reduce the air velocity in the first channel and increase the heat exchange time between the air in the first channel and the toothed plates and the cover plate, thereby improving the heat exchange efficiency.

[0062] When the fan's air inlet faces the first channel, the fan guides the air from the first channel into the second channel. The distance between two adjacent toothed plates increases in the direction away from the fan, and correspondingly, the distance between two adjacent toothed plates decreases in the direction closer to the fan. As the airflow approaches the fan, the airflow channel formed between two adjacent toothed plates decreases, and the airflow velocity increases. With the same fan power, this increases the amount of air entering the second channel, which is beneficial for improving the heat dissipation efficiency of electronic devices. In an optional embodiment, the toothed plates have an arc-shaped profile.

[0063] This can be understood as the toothed blades being arc-shaped. Correspondingly, an arc-shaped flow channel is formed between two adjacent toothed blades. The arc-shaped flow channel can guide the airflow more smoothly, reducing sudden changes or obstructions in the airflow within the flow channel, thus reducing airflow energy loss and helping to ensure that the airflow flows in a more stable and continuous manner.

[0064] In addition, the arc-shaped guide channel generates less turbulence and eddies when guiding airflow, thus reducing noise and vibration.

[0065] In one optional embodiment, the cover plate is provided with multiple heat dissipation fins in the direction away from the first plate, and the multiple heat dissipation fins are spaced apart. The distance between two adjacent heat dissipation fins is d1, and the distance between two adjacent fins is d2, where d2 ≤ d1.

[0066] A smaller spacing d2 between two adjacent toothed plates increases the contact area between the plates and the air in the first channel, thus improving the heat exchange efficiency between the cover plate and the air in the first channel. Under the action of the fan, reducing the spacing d2 between two adjacent toothed plates helps to improve the forced convection cooling effect.

[0067] A larger spacing d1 between two adjacent heat dissipation fins ensures natural convection cooling between the outer side of the cover plate and the external environment, improving the heat exchange efficiency between the cover plate and the external environment. If the spacing d1 between two adjacent heat dissipation fins is smaller, their respective thermal boundary layers will come into contact with each other, resulting in still, high-temperature air filling the space between the two heat dissipation fins. This reduces the effective heat dissipation area of ​​the heat dissipation fins and severely affects the heat exchange between the cover plate and the external environment. The thermal boundary layer refers to a relatively still, high-temperature air layer that adheres to the surface of the heat dissipation fins, where the air velocity decreases and the temperature rises due to friction and heat transfer.

[0068] In some embodiments, d2≤9mm, d1≥9mm.

[0069] In one optional implementation, the angle α between the opening direction of the fan's air inlet and the plane where the first plate is located satisfies: 0°<α≤90°.

[0070] When the angle α between the opening direction of the fan's air inlet and the plane of the first plate is 0°, the opening direction of the fan's air inlet is parallel to the plane of the first plate, and the fan is a vertical fan. This application makes the fan a horizontal fan by using 0°<α≤90°. The horizontal fan reduces the space occupied by the fan in the thickness direction of the first plate, which is beneficial to the miniaturization of the power conversion device.

[0071] When the angle α between the opening direction of the fan's air inlet and the plane where the first plate is located is 90°, the opening direction of the fan's air inlet is perpendicular to the plane where the first plate is located, so that air can be blown into the first channel or drawn out from the first channel in a direction perpendicular to the plane where the first plate is located.

[0072] When the angle α between the opening direction of the fan's air inlet and the plane where the first plate is located satisfies: 0°<α<90°, the angle between the opening direction of the fan's air inlet and the plane where the first plate is located is an acute angle, so that air can be blown into the first channel or drawn out from the first channel in a direction inclined to the plane where the first plate is located.

[0073] In a scenario where the fan inlet faces the second channel, the fan inlet is directed towards components on the circuit board that generate significant heat (such as the inverter module) or components that are thermal bottlenecks. In a scenario where the fan inlet faces the first channel, the fan outlet is directed towards components on the circuit board that generate significant heat (such as the inverter module) or components that are thermal bottlenecks. A thermal bottleneck module refers to a module whose generated heat cannot be effectively dissipated, leading to excessively high temperatures.

[0074] In one optional embodiment, the cover plate is provided with a plurality of toothed plates in the direction facing the first plate, and the plurality of toothed plates are spaced apart.

[0075] The effect of having multiple toothed plates on the cover plate facing the first plate has been described above and will not be repeated here.

[0076] In one optional embodiment, the fan is located between the projections of two portions of the toothed plates on the first plate. At least one of the height of the toothed plates and the spacing between two adjacent toothed plates is different, so as to change the height of the toothed plates or the spacing between adjacent toothed plates according to the position of the fan, the installation angle, etc., to further improve the heat dissipation effect.

[0077] For example, if the fan is off-center from the first plate, the length of one set of teeth in the two sets of toothed plates will be shorter than the length of the teeth in the other set. By increasing the height of one set of teeth or the spacing between two adjacent teeth, the contact area between one set of teeth and the air in the first channel can be increased, thereby improving the heat dissipation efficiency.

[0078] In one optional embodiment, the distance between two adjacent teeth in one part of the two toothed plates is d3, and the distance between two adjacent teeth in the other part of the two toothed plates is d4. The air inlet of the fan faces one part of the toothed plates, where d4≤d3, or the air outlet of the fan faces one part of the toothed plates, where d3≤d4.

[0079] In a scenario where the fan's air inlet faces a portion of the toothed plates, the fan guides the hot air in the first channel to the second channel. Due to the fan's tilt, the air entering the second channel flows away from a portion of the toothed plates in a direction parallel to the first plate, and enters the location of another portion of the toothed plates through the second channel opening. By reducing the spacing d4 between two adjacent toothed plates in the other portion, the toothed plates are made more densely distributed, increasing the heat exchange area between the other portion of the toothed plates and the air, reducing the temperature of the air flowing to the fan's air inlet, and thus improving heat dissipation.

[0080] In a scenario where the fan's outlet is directed towards one of the two sets of toothed blades, the fan guides hot air from the second channel into the first channel. Due to the fan's tilt, most of the air guided to the first channel is delivered to one set of toothed blades. By reducing the spacing d3 between two adjacent toothed blades in this set, the toothed blades are made more densely distributed, increasing the heat exchange area between the toothed blades and the air, thereby improving heat dissipation.

[0081] In one optional embodiment, the height of one portion of the toothed blades is h1, and the height of the other portion of the toothed blades is h2. The fan's air inlet faces one portion of the toothed blades, where h2 ≥ h1; or, the fan's air outlet faces one portion of the toothed blades, where h1 ≥ h2.

[0082] In a scenario where the fan's air inlet faces a portion of the toothed plates, the fan guides the hot air in the first channel to the second channel. Due to the fan's tilt, the air entering the second channel flows away from a portion of the toothed plates in a direction parallel to the first plate, and enters the location of another portion of the toothed plates through the second channel opening. By increasing the height h2 of the toothed plates in the other portion, the heat exchange area between the other portion of the toothed plates and the air is increased, reducing the temperature of the air flowing to the fan's air inlet, thereby improving heat dissipation.

[0083] In a scenario where the fan's air outlet faces one of the two toothed sections, the fan guides hot air from the second channel into the first channel. Due to the fan's tilt, most of the air guided to the first channel is delivered to one of the toothed sections. By increasing the height h1 of the toothed section, the heat exchange area between that section and the air is increased, thereby improving heat dissipation.

[0084] In one alternative embodiment, the plurality of electronic devices includes a sixth device that contacts a cover plate. The portion of the cover plate that contacts the sixth device is closer to the circuit board than the first plate.

[0085] The heat generated by the sixth device during operation can be transferred to the inner wall of the cover plate. Since the outer wall of the cover plate is in contact with the external environment—that is, its temperature is lower than the inner wall—a temperature difference is formed, allowing heat from the inner wall to be transferred to the outer wall. The outer wall of the cover plate can exchange heat with the external environment; this can be understood as the external environment cooling the outer wall. The temperature difference between the outer and inner walls allows heat from the inner wall to be continuously transferred to the outer wall. Similarly, the heat from the sixth device can be continuously transferred to the inner wall of the cover plate.

[0086] Therefore, by having the sixth device contact the inner wall of the cover plate, the heat generated by the sixth device during operation can be dissipated, thereby reducing the possibility of reduced efficiency and lifespan of the sixth device due to its inability to dissipate heat in time.

[0087] In addition, it can also reduce the possibility that the heat generated by the sixth device during operation will affect the internal temperature of the casing, ensuring the working efficiency and service life of the circuit board and other electronic devices on the circuit board.

[0088] In one alternative embodiment, heat dissipation fins are provided on the side of the cover plate opposite to the first plate and in the area corresponding to the sixth device.

[0089] The arrangement of heat dissipation fins can increase the contact area between the area of ​​the cover plate corresponding to the sixth device and the external environment, thereby improving the heat dissipation efficiency between the area of ​​the cover plate corresponding to the sixth device and the external environment, and thus improving the heat dissipation efficiency of the sixth device.

[0090] In some examples, multiple heat sink fins are arranged side-by-side on the side of the cover plate opposite to the first plate and corresponding to the sixth device, all extending in the same direction. This ensures a stable and continuous airflow field as the air passes through the heat sink fins, which helps to transfer heat more efficiently from the fins to the surrounding environment. If the extension direction of the heat sink fins is disordered, it may interfere with the airflow and reduce heat dissipation efficiency.

[0091] In addition, within a limited space, having multiple heat dissipation fins extend in the same direction can maximize the use of space, making the arrangement of multiple heat dissipation fins more compact and efficient.

[0092] In some examples, the heat sink fins are integrally molded with the cover plate to reduce manufacturing and assembly steps.

[0093] In one optional embodiment, a power device is disposed on a second surface of the circuit board away from the first surface, the power device is in contact with a backplate, and a heat dissipation fin is disposed on the side of the backplate away from the circuit board.

[0094] Power devices, such as power transistors and power modules, generate heat that can be transferred to the backplane during operation. Because the backplane is in contact with the external environment—that is, the temperature of the outer wall surface of the backplane is lower than the temperature of the inner wall surface—a temperature difference is formed. Therefore, the temperature of the inner wall surface of the backplane can be continuously transferred to the outer wall surface. The outer wall surface of the backplane can exchange heat with the external environment; this can be understood as the external environment cooling the outer wall surface of the backplane. The temperature difference between the outer and inner walls of the backplane allows the heat from the inner wall surface to be continuously transferred to the outer wall surface. Similarly, the heat from the power devices can be continuously transferred to the inner wall surface of the backplane.

[0095] By having the power device in contact with the inner wall of the backplate, the heat generated during the operation of the power device can be dissipated, thereby achieving heat dissipation of the power device and reducing the possibility of reduced working efficiency and shortened service life of the power device due to the inability to dissipate heat in time.

[0096] In addition, it can reduce the possibility that the heat generated by the power devices during operation will affect the internal temperature of the casing, thus ensuring the working efficiency and lifespan of the circuit board inside the casing and other electronic devices on the circuit board.

[0097] The arrangement of heat sink fins can increase the contact area between the backplate and the external environment, thereby improving the heat dissipation efficiency between the backplate and the external environment, and thus improving the heat dissipation efficiency of power devices.

[0098] In some examples, the heat sink comprises multiple fins arranged side-by-side on the backplate facing away from the circuit board, all extending in the same direction. This ensures a stable and continuous airflow field as the air passes over the fins, facilitating more efficient heat transfer from the fins to the surrounding environment. If the fins extend in a disordered manner, it may disrupt airflow and reduce heat dissipation efficiency.

[0099] In addition, within a limited space, having multiple heat dissipation fins extend in the same direction can maximize the use of space, making the arrangement of multiple heat dissipation fins more compact and efficient.

[0100] In some examples, the heat sink fins are integrally molded with the backplate to reduce manufacturing and assembly steps. Attached Figure Description

[0101] Figure 1 is a schematic diagram of a photovoltaic power generation system provided in an embodiment of this application;

[0102] Figure 2 is a schematic diagram of a power conversion device provided in an embodiment of this application;

[0103] Figure 3 is a partial exploded view of the power conversion device in Figure 2;

[0104] Figure 4 is a side view of the power conversion device in Figure 2;

[0105] Figure 5 is a cross-sectional view along line AA in Figure 4;

[0106] Figure 6 is a cross-sectional view along line BB in Figure 4;

[0107] Figure 7 is a schematic diagram of the internal structure of a power conversion device provided in an embodiment of this application, showing an axial fan;

[0108] Figure 8 is a schematic diagram of the internal structure of a power conversion device provided in an embodiment of this application, showing a centrifugal fan;

[0109] Figure 9 is a schematic diagram of the internal structure of a power conversion device provided in an embodiment of this application, showing the first device;

[0110] Figure 10 is a schematic diagram of the structure of the first protrusion in a power conversion device provided in an embodiment of this application, showing the circuit board, the third device and the fourth device;

[0111] Figure 11 is a schematic diagram of the structure of the first protrusion in a power conversion device provided in an embodiment of this application, showing the circuit board and the fifth device;

[0112] Figure 12 is a partial structural diagram of a power conversion device provided in an embodiment of this application;

[0113] Figure 13 is a schematic diagram of the heat sink in a power conversion device according to an embodiment of this application, showing the circuit board heat sink;

[0114] Figure 14 is a schematic diagram of the structure of a heat sink in a power conversion device provided in an embodiment of this application, showing a relay heat sink;

[0115] Figure 15 is a schematic diagram of the structure of a capacitor in a power conversion device provided in an embodiment of this application;

[0116] Figure 16 is one of the internal structural schematic diagrams of a power conversion device provided in an embodiment of this application;

[0117] Figure 17 is a second schematic diagram of the internal structure of a power conversion device provided in an embodiment of this application, showing the second device;

[0118] Figure 18 is a third schematic diagram of the internal structure of a power conversion device provided in an embodiment of this application;

[0119] Figure 19A is a schematic diagram of the structure of a shell cover provided in an embodiment of this application;

[0120] Figure 19B is a partial structural schematic diagram of a shell cover provided in an embodiment of this application;

[0121] Figure 20 is one of the structural schematic diagrams of a toothed plate provided in an embodiment of this application. The toothed plate has arc-shaped teeth.

[0122] Figure 21 is a second schematic diagram of the structure of a toothed plate provided in an embodiment of this application. The toothed plate has straight teeth.

[0123] Figure 22 is a third schematic diagram of the structure of a toothed plate provided in an embodiment of this application. The toothed plate is a helical tooth.

[0124] Figure 23 is a fourth structural schematic diagram of a toothed plate provided in an embodiment of this application. The toothed plate is a circular arc tooth.

[0125] Figure 24 is a fifth schematic diagram of the structure of a toothed plate provided in an embodiment of this application, in which multiple toothed plates are arranged radially;

[0126] Figure 25 is a sixth schematic diagram of the structure of a toothed plate provided in an embodiment of this application, wherein multiple toothed plates are arranged radially;

[0127] Figure 26 is a partial cross-sectional view of another power conversion device provided in an embodiment of this application;

[0128] Figure 27 is a second partial cross-sectional view of another power conversion device provided in an embodiment of this application;

[0129] Figure 28 is a schematic diagram of the shell cover in Figure 26;

[0130] Figure 29 is a partial sectional view of the shell cover in Figure 28;

[0131] Figure 30 is a schematic diagram of the shell cover in Figure 27;

[0132] Figure 31 is a partial sectional view of the shell cover in Figure 30.

[0133] Reference numerals: 100-Photovoltaic power generation system; 10-Photovoltaic module; 101-Photovoltaic string; 20-Power conversion device; 01-Circuit board; 1-Electronic device; 11-First device; 12-Second device; 131-Third device; 132-Fourth device; 133-Fifth device; 14-Sixth device; 15-Power device; 16-Heat sink; 161-Circuit board heat sink; 162-Relay heat sink; 17-Thermal conductive interface material layer; 18-Capacitor; 19-Relay; 011-First surface; 012-Second surface; 02-Outer shell; 21-Shell cover; 211-Cover plate; 22-Shell shell; 221-Back plate; 23-Side wall; 231-First side wall; 03-First plate; 3-First protrusion; 311-First surface; 312-Second surface; 32-First part; 33-Second part; 34-Groove; 041-First channel; 042-Second channel; 051-First channel opening; 052-Second channel opening; 06-Fan; 061-Air inlet; 062-Air outlet; 071-Gergling fin; 072-Heat dissipation fin; 08-Airflow channel. Detailed Implementation

[0134] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0135] In this application, unless otherwise expressly specified and limited, the terms "upper", "lower", "front", "back", "left", "right", etc., indicating orientation or positional relationship may be defined relative to the orientation of the components schematically placed in the accompanying drawings. These directional terms may be relative concepts, used for relative description and clarification, and may change accordingly depending on the orientation of the components in the accompanying drawings. They should not be construed as limitations on this application.

[0136] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0137] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0138] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, when describing pipelines or channels, the terms "connection" and "linkage" as used in this application have the meaning of establishing electrical conductivity. The specific meaning needs to be understood in conjunction with the context.

[0139] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0140] In the accompanying drawings of the embodiments of this application, solid structures such as parts and components are represented by guide lines; hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with arrows.

[0141] This application provides a photovoltaic power generation system. A photovoltaic power generation system refers to a power generation system that directly converts solar radiation energy into electrical energy using the photovoltaic effect of photovoltaic cells.

[0142] Figure 1 illustrates a schematic diagram of a photovoltaic power generation system 100. Referring to Figure 1, the photovoltaic power generation system 100 includes a photovoltaic module 10 and a power conversion device 20, which is connected to the photovoltaic module 10.

[0143] The photovoltaic module 10 converts solar energy into direct current (DC) power. A power conversion device 20 is connected to the photovoltaic module 10, for example, via a cable. Therefore, the DC power output from the photovoltaic module 10 can be transmitted to the power conversion device 20. The power conversion device 20 can convert the input DC power into alternating current (AC), or convert the DC power into DC power with different voltage values, to power external devices.

[0144] In some examples, the power conversion device 20 can be an inverter, which includes a DC-AC conversion circuit. The inverter is able to convert the DC power output from the photovoltaic module 10 into AC power to power external devices (such as the power grid). In some implementations, the inverter may also include a DC-DC conversion circuit.

[0145] In other examples, the power conversion device 20 is a DC-DC converter. The DC-DC converter can convert the DC power output from the photovoltaic module 10 into DC power with different voltage values. For example, the DC-DC converter can convert the DC power output from the photovoltaic module 10 into DC power with a lower voltage value. Alternatively, the DC-DC converter can convert the DC power output from the photovoltaic module 10 into DC power with a higher voltage value.

[0146] In this example, referring to Figure 1, the photovoltaic module 10 includes multiple photovoltaic modules 10 connected in series to form a photovoltaic (PV) string 101.

[0147] Other structures can be selectively designed between the photovoltaic module 10 and the power conversion device 20 according to actual needs. For example, a photovoltaic optimizer can be provided between the photovoltaic module 10 and the power conversion device 20. The photovoltaic optimizer is connected to both the photovoltaic module 10 and the power conversion device 20. The photovoltaic optimizer can track the maximum power point of the photovoltaic module 10 so that the photovoltaic module 10 can output maximum power to improve the power generation of the photovoltaic power generation system 1000. The working principles and connection forms of the photovoltaic module 10, the photovoltaic optimizer, and the power conversion device 20 are well known to those skilled in the art, and will not be described in detail here.

[0148] The above example illustrates the application of power conversion device 20 in a photovoltaic power generation system 1000. In other embodiments of this application, power conversion device 20 can also be other forms of power conversion device, such as an AC-DC converter. This application does not impose any special limitations on the specific form of power conversion device 20.

[0149] Figure 2 illustrates an exemplary structural schematic diagram of the power conversion device described above. Referring to Figure 2, the power conversion device 20 includes a housing 02, which includes a cover 21 and a housing 22. The cover 21 is connected to the housing 22.

[0150] In this example, to facilitate the replacement and maintenance of components inside the outer casing 02, the cover 21 is detachably connected to the casing 22. The connection method between the cover 21 and the casing 22 can be varied, such as snap-fit ​​connection or bolt connection. This embodiment of the application does not impose any special restrictions on the specific connection method between the cover 21 and the casing 22.

[0151] Figure 3 shows a partial exploded view of the power conversion device in Figure 2. Referring to Figure 3, the power conversion device 20 includes a circuit board 01. The circuit board 01 is located between a cover 21 and a housing 22. The circuit board 01 includes a first surface 011 and a second surface 012 disposed opposite each other in the thickness direction. The cover 21 includes a cover plate 211 facing the first surface 011 of the circuit board 01. The housing 22 includes a back plate 221 disposed opposite to the cover plate 211 facing the second surface 012 of the circuit board 01.

[0152] During assembly, the circuit board 01 can be first fixed to the housing 22, and then the cover 21 can be connected to the housing 22, so that the circuit board 01 is located inside the outer shell 02. The outer shell 02 can protect the circuit board 01, such as by preventing impact, waterproofing, and insulation.

[0153] Referring to Figure 3, a plurality of electronic devices 1 are disposed on the first surface 011 of the circuit board 01, including a sixth device 14. A power device 15 is disposed on the second surface 012 of the circuit board 01.

[0154] Figure 4 shows an exemplary side view of the power conversion device in Figure 2. Figure 5 shows a cross-sectional view along line AA in Figure 4. Referring to Figures 4 and 5, the housing 22 includes a back plate 221 facing the second surface 012 of the circuit board 01. A power device 15 protrudes from the second surface 012 of the circuit board 01, and the end face of the power device 15 away from the circuit board 01 contacts the inner wall surface of the back plate 221.

[0155] The heat generated by the power device 15 during operation can be transferred to the inner wall surface of the backplate 221. Since the outer wall surface of the backplate 221 is in contact with the external environment (i.e., its temperature is lower than that of its inner wall surface), a temperature difference is formed, allowing the heat from the inner wall surface of the backplate 221 to be transferred to its outer wall surface. The outer wall surface of the backplate 221 can exchange heat with the external environment; this can be understood as the external environment cooling the outer wall surface of the backplate 221. The temperature difference between the outer and inner walls of the backplate 221 allows heat from the inner wall surface to be continuously transferred to the outer wall surface. Similarly, the heat from the power device 15 can be continuously transferred to the inner wall surface of the backplate 221.

[0156] Therefore, by having the power device 15 in contact with the backplate 221, the heat generated by the power device 15 during operation can be dissipated, thereby achieving heat dissipation of the power device 15 and reducing the possibility of reduced operating efficiency and lifespan due to inadequate heat dissipation. Additionally, it also reduces the possibility of the heat generated by the power device 15 affecting the internal temperature of the housing 02, ensuring the operating efficiency and lifespan of other components within the housing 02, such as the circuit board 01 and other electronic devices on the circuit board 01.

[0157] Due to the influence of surface roughness, gaps may exist on the inner wall surface of the backplate 221 and the surface in contact with the power device 15, which reduces the contact area between the power device 15 and the inner wall surface of the backplate 221, thereby reducing the heat dissipation efficiency of the power device 15. To improve the heat dissipation efficiency of the power device 15, referring to Figures 2 and 5, a thermally conductive interface material layer 17 can be provided between the power device 15 and the backplate 221. The thermally conductive interface material layer 17 can fill the gaps between the backplate 221 and the power device 15, increasing the contact area between the power device 15 and the backplate 221, thereby ensuring the heat dissipation efficiency of the power device 15.

[0158] The thermal interface material layer 17 can be selectively designed according to actual needs. For example, the thermal interface material layer 17 can be a thermal grease layer, a thermal pad, a thermal gel layer, a thermal phase change material layer, a thermal adhesive layer, etc. The specific form of the thermal interface material layer 17 is not specially limited in the embodiments of this application.

[0159] Furthermore, referring to Figures 2 and 5, heat dissipation fins 072 are provided on the side of the backplate 221 facing away from the circuit board 01, i.e., on the outer wall surface of the backplate 221. One end of the heat dissipation fin 072 is connected to the backplate 221, and the other end extends in the direction away from the circuit board 01. The provision of heat dissipation fins 072 increases the contact area between the backplate 221 and the external environment, thereby improving the heat dissipation efficiency between the backplate 221 and the external environment. In addition, the provision of heat dissipation fins 072 allows the temperature of the backplate 221 to be transferred to the heat dissipation fins 072, thus further improving the heat dissipation efficiency of the backplate 221, and consequently improving the heat dissipation efficiency of the power device 15.

[0160] In some examples, referring to Figure 2, the outer wall of the backplate 221 is provided with multiple heat dissipation fins 072. These fins are arranged side-by-side on the side of the backplate 221 facing away from the circuit board 01, and all fins extend in the same direction, forming a channel for airflow between adjacent fins. This ensures a stable and continuous airflow field as the air passes through the fins, facilitating more efficient heat transfer from the fins to the surrounding environment. If the fins extend in a disordered manner, it may interfere with airflow and reduce heat dissipation efficiency. Furthermore, within a limited space, having multiple fins extend in the same direction maximizes space utilization, making the fins more compact and efficient.

[0161] In some embodiments, referring to FIG2, the distance between two adjacent heat dissipation fins 072 on the outer wall surface of the back plate 221 is d. d cannot be too small. If d is too small, the thermal boundary layers of the multiple heat dissipation fins 072 will come into contact with each other, resulting in the space between two adjacent heat dissipation fins 072 being filled with static high-temperature air. The effective heat dissipation area of ​​the heat dissipation fins 072 is reduced, which in turn seriously affects the heat exchange between the back plate 221 and the external environment.

[0162] The thermal boundary layer refers to a relatively static, high-temperature air layer that is in close contact with the surface of the heat dissipation fin 072 when the air flows over it. Due to friction and heat transfer, the air flow rate slows down and the temperature rises.

[0163] In some embodiments, d ≥ 9 mm to ensure natural convection heat dissipation between the outer side of the backplate 221 and the external environment, thereby improving the heat exchange efficiency between the backplate 221 and the external environment. In some examples, the heat dissipation fins on the outer wall of the backplate 221 can be straight teeth, corrugated teeth, or helical teeth.

[0164] In some examples, power devices 15 may include multiple devices, such as power transistors and power modules. Since power devices 15 generate a lot of heat, heat dissipation through contact between the power devices 15 and the backplane 221 ensures that the heat generated during operation is quickly dissipated. In other embodiments, power devices 15 may be other types of devices. This application does not impose special limitations on the number or specific form of power devices 15. Those skilled in the art can selectively design according to actual needs.

[0165] Referring to FIG5, the cover 21 includes a cover plate 211 facing the first surface of the circuit board 01, and the cover plate 211 and the back plate 221 are located on different sides of the thickness direction of the circuit board 01 and are disposed opposite to each other. A sixth device 14 protrudes from the first surface 011 of the circuit board 01, and the end face of the sixth device 14 away from the circuit board 01 contacts the inner wall surface of the cover plate 211.

[0166] The heat generated by the sixth device 14 during operation can be transferred to the inner wall surface of the cover plate 211. Since the outer wall surface of the cover plate 211 is in contact with the external environment—that is, the temperature of the outer wall surface of the cover plate 211 is lower than the temperature of the inner wall surface—a temperature difference is formed, thus the temperature of the inner wall surface of the cover plate 211 can be transferred to the outer wall surface. The outer wall surface of the cover plate 211 can exchange heat with the external environment; this can be understood as the external environment cooling the outer wall surface of the cover plate 211. The temperature difference between the outer and inner wall surfaces of the cover plate 211 allows the heat from the inner wall surface to be continuously transferred to the outer wall surface. Similarly, the heat from the sixth device 14 can be continuously transferred to the inner wall surface of the cover plate 211.

[0167] Therefore, by having the sixth device 14 contact the inner wall of the cover plate 211, the heat generated by the sixth device 14 during operation can be dissipated, thereby achieving heat dissipation for the sixth device 14 and reducing the possibility of reduced operating efficiency and lifespan due to insufficient heat dissipation. Additionally, it also reduces the possibility of the heat generated by the sixth device 14 affecting the internal temperature of the housing 02, ensuring the operating efficiency and lifespan of other components within the housing 02, such as the circuit board 01 and other components on the circuit board 01.

[0168] Referring to Figures 2 and 5, a thermally conductive interface material layer 17 is provided between the sixth device 14 and the cover plate 211. The thermally conductive interface material layer 17 can fill the gap between the cover plate 211 and the sixth device 14 to increase the contact area between the sixth device 14 and the cover plate 211, thereby ensuring the heat dissipation efficiency of the sixth device 14. The reason for providing the thermally conductive interface material layer 17 between the sixth device 14 and the cover plate 211 is the same as the reason for providing the thermally conductive interface material layer 17 between the power device 15 and the back plate 221. Furthermore, the specific form of the thermally conductive interface material has been described above, and will not be repeated here.

[0169] Additionally, referring to Figures 4 and 5, heat dissipation fins 072 are provided on the outer wall surface of the cover plate 211. One end of the heat dissipation fin 072 is connected to the outer wall surface of the cover plate 211, and the other end extends in a direction away from the circuit board 01. The provision of heat dissipation fins 072 can increase the contact area between the outer wall surface of the cover plate 211 and the external environment, thereby improving the heat dissipation efficiency between the cover plate 211 and the external environment.

[0170] In some examples, the sixth device 14 may be an electronic device with high heat generation on the first surface 011 of the circuit board 01. To improve the heat dissipation efficiency of the sixth device 14, referring to Figures 4 and 5, a heat dissipation fin 072 is provided on the side of the cover plate 211 opposite to the first plate 03 and corresponding to the area of ​​the sixth device 14. The provision of the heat dissipation fin 072 can increase the contact area between the area of ​​the cover plate 211 corresponding to the sixth device 14 and the external environment, thereby improving the heat dissipation efficiency between the area of ​​the cover plate 211 corresponding to the sixth device 14 and the external environment, and thus improving the heat dissipation efficiency of the sixth device 14.

[0171] In some examples, multiple heat dissipation fins 072 are included, and the projection of the multiple heat dissipation fins 072 onto the cover plate 211 covers the area of ​​the cover plate 211 corresponding to the sixth device 14. Since the sixth device 14 generates a high amount of heat, meaning the temperature of the area of ​​the cover plate 211 in contact with the sixth device 14 (hereinafter referred to as the contact area) is also high, covering the contact area of ​​the cover plate 211 with the projection of the multiple heat dissipation fins 072 increases the contact area between the contact area of ​​the cover plate 211 and the external environment, thereby further improving the heat dissipation efficiency of the sixth device 14. Furthermore, the heat from the sixth device 14 can also be transferred to the heat dissipation fins 072 through the cover plate 211, thus further improving the heat dissipation efficiency of the cover plate 211, and consequently, the heat dissipation efficiency of the sixth device 14.

[0172] Furthermore, since the sixth device 14 has limited dimensions in the thickness direction of the circuit board 01, to ensure contact between the sixth device 14 and the inner wall surface of the cover plate 211, a portion of the cover plate 211 is typically recessed towards the circuit board 01. This reduces the distance between the inner wall surface of the recessed portion of the cover plate 211 and the sixth device 14, thus facilitating contact between the sixth device 14 and the inner wall surface of the cover plate 211. Multiple heat dissipation fins 072 can be disposed on the outer surface of the recessed portion of the cover plate 211, with the outer end faces of the heat dissipation fins 072 flush with the outermost surface of the cover plate 211, thereby improving the aesthetic appearance of the power conversion device. In other examples, multiple heat dissipation fins 072 are provided on the entire outer wall surface of the cover plate 211, spaced apart, with airflow channels formed between adjacent heat dissipation fins 072 to ensure heat dissipation efficiency at every location of the cover plate 211.

[0173] In some embodiments, referring to FIG4, the distance between two adjacent heat dissipation fins 072 on the outer wall surface of the cover plate 211 is d1. d1 cannot be too small. If d1 is too small, the thermal boundary layers of the multiple heat dissipation fins 072 will contact each other, resulting in the space between two adjacent heat dissipation fins 072 being filled with static high-temperature air. The effective heat dissipation area of ​​the heat dissipation fins 072 is reduced, which in turn seriously affects the heat exchange between the cover plate 211 and the external environment.

[0174] In some embodiments, d1≥9mm, so as to ensure the natural convection heat dissipation effect between the outer side of the cover plate 211 and the external environment, and improve the heat exchange efficiency between the cover plate 211 and the external environment.

[0175] The arrangement of multiple heat dissipation fins 072 on the cover plate 211, which are arranged side by side and extend in the same direction, is the same as that of multiple heat dissipation fins 072 on the back plate and has the same effect. This application will not elaborate further here.

[0176] In some examples, the heat dissipation fins 072 on the outer wall of the cover plate 211 can be straight teeth, corrugated teeth, or helical teeth.

[0177] In some examples, the sixth device 14 can be selectively designed according to actual needs. Furthermore, the sixth device 14 can be configured as one or more as needed. This application does not impose special limitations on the number or specific form of the sixth device 14.

[0178] Figure 6 shows a cross-sectional view along line BB in Figure 4, where the toothed plates inside the cover 21 have been removed to avoid interference. Referring to Figure 6, the power conversion device 20 includes a first plate 03, a fan 06, and a first channel opening 051. The first plate 03 is disposed between the cover plate 211 and the circuit board 01, forming a first channel 041 between the first plate 03 and the cover plate 211, and a second channel 042 between the first plate 03 and the circuit board 01. The fan 06 connects the first channel 041 and the second channel 042. Multiple first channel openings 051 are included, each connecting the first channel 041 and the second channel 042. A second channel opening 052 connects the first channel 041 and the second channel 042. The fan 06 is disposed at the second channel opening 052. The direction of airflow through the first channel opening 051 is opposite to the direction of airflow through the second channel opening 052.

[0179] By setting the first plate 03, a first channel 041 is formed between the first plate 03 and the cover plate 211, and a second channel 042 is formed between the first plate 03 and the circuit board 01. That is, the space on the side of the circuit board 01 facing the cover plate 211 is divided into the first channel 041 and the second channel 042. The second channel 042 is closer to the circuit board 01, that is, closer to the heat source, while the first channel 041 is farther away from the circuit board 01, that is, farther away from the heat source.

[0180] Under the airflow from the fan 06, the air in the second channel 042 can exchange heat with the circuit board 01 and the electronic devices 1 on the first surface 011 of the circuit board 01 (i.e., the devices located in the second channel 042 on the circuit board 01), thereby removing heat from the circuit board 01 and the electronic devices 1 on the first surface 011 of the circuit board 01. The air in the first channel 041 can exchange heat with the cover plate 211 to reduce the air temperature in the first channel 041.

[0181] Under the guidance of the fan, the air in the second channel 042 can circulate with the air in the first channel 041 through the first channel opening 051 and the second channel opening 052. The direction of the airflow through the first channel opening 051 is opposite to the direction of the airflow through the second channel opening 052. Therefore, the first channel 041, the second channel 042, the first channel opening 051, and the second channel opening 052 can form an air circulation loop. It can be understood that the hotter air in the second channel 042 can enter the first channel 041 for cooling. The hotter air exchanges heat with the cover plate 211 in the first channel 041 to become cooler air. The cooler air in the first channel 041 can enter the second channel 042 to dissipate heat from the circuit board 01 and the electronic devices 1 on the first surface 011 of the circuit board 01. Compared to the prior art where the space on the side of the circuit board 01 facing the cover plate 211 is not divided, the air in the first channel 041 and the air in the second channel 042 circulate, which can improve the heat dissipation effect of the circuit board 01 and the electronic device 1 of the circuit board 01.

[0182] Furthermore, compared to the prior art where the space on the side of the circuit board 01 facing the cover plate 211 is not divided, the space of the first channel 041 is smaller, allowing air to converge into the first channel 041. This increases the airflow time within the first channel 041, thereby enhancing the convective heat transfer between the space on the side of the circuit board 01 facing the cover plate 211 and the external environment. This allows the heat carried by the air in the space on the side of the circuit board 01 facing the cover plate 211 to be transferred to the cover plate 211 more efficiently. In other words, the heat generated by the circuit board 01 and the electronic devices 1 on the circuit board 01 can be transferred to the cover plate 211 more efficiently. The cover plate 211 can then conduct the heat to the external environment to reduce the temperature inside the outer casing 02 and improve the heat dissipation effect of the circuit board 01 and the electronic devices 1 on the circuit board 01.

[0183] Referring to Figure 6, the second channel port 052 is disposed on the first plate 03. The fan 06 is disposed opposite to at least one of the plurality of electronic devices 1.

[0184] Since the electronic devices 1 on the first surface 011 of the circuit board 01 typically generate a high amount of heat, this heat easily accumulates on the circuit board 01, potentially leading to localized overheating. Therefore, the fan 06 is positioned opposite to at least one of the multiple electronic devices 1, for example, opposite to the electronic device with the highest heat generation among the multiple electronic devices 1. This arrangement, through the airflow of the fan 06, accelerates the heat exchange between the air and the electronic devices 1, improving the heat dissipation efficiency of the electronic devices 1. This prevents heat accumulation on the circuit board 01 and ensures its safe operation.

[0185] In some examples, fan 06 is used to guide air from the first channel 041 into the second channel 042. That is, fan 06 blows air into the second channel 042, and the air in the second channel 042 can flow along the second channel 042 to the first channel opening 051, and enter the first channel 041 through the first channel opening 051 for cooling, avoiding heat accumulation in the second channel 042 and ensuring the safe operation of circuit board 01.

[0186] In other examples, fan 06 is used to guide air from the second channel 042 into the first channel 041. That is, fan 06 blows air into the first channel 041. Since the electronic device integration area 1 is closer to fan 06, air between the devices in the electronic device integration area 1 can preferentially enter the fan and then into the first channel 041. This also prevents heat accumulation in the electronic device integration area 1, ensuring its safe operation. Air in the second channel 042 can quickly enter the first channel 041 for cooling under the guidance of fan 06. The cooled air can flow along the first channel 041 to the first channel opening 051 and then enter the second channel 042 through the first channel opening 051. Therefore, heat accumulation in the second channel 042 is prevented, ensuring the safe operation of the circuit board 01.

[0187] In other embodiments, the fan 06 can also be mounted on other structures. For example, the fan 06 may be located between the side wall 23 of the housing 02 and the first plate 03, and the fan 06 may be fixed to the side wall 23 or the cover plate 211. In the above examples, one fan 06 may be provided, or multiple fans may be provided. For example, when one fan 06 is provided, the fan 06 may be an axial fan, that is, the airflow direction of the fan 06 is parallel to the axis of the fan 06. The fan 06 may also include a centrifugal fan, that is, the airflow direction of the fan 06 is perpendicular to the axis of the fan 06. The fan 06 may also be a mixed-flow fan, that is, the airflow direction of the fan 06 intersects the axis of the fan 06, that is, it is located between the airflow direction of the axial fan and the airflow direction of the centrifugal fan. The principles and structures of axial fans, centrifugal fans, and mixed-flow fans are well known to those skilled in the art, and will not be described in detail here.

[0188] Figure 7 illustrates, by way of example, a schematic diagram of the internal structure of a power conversion device provided in the first embodiment of this application. The fan 06 is an axial fan, meaning the airflow direction of the fan 06 is parallel to the axial direction of the fan 06.

[0189] Referring to Figure 7, fan 06 is mounted on the first plate 03. The air inlet of fan 06 faces the second channel 042, and the air outlet of fan 06 faces the first channel 041. This can be understood as air entering the second channel through the fan's air inlet and exiting through the fan's air outlet into the first channel. The fan is used to transport air from the second channel to the first channel. In other words, fan 06 draws air from the second channel 042. Air from the second channel 042 flows into the air inlet of fan 06 and exits through the fan's air outlet into the first channel 041. Air from the first channel 041 flows into the first channel opening 051 and along the first channel opening 051 into the second channel 042, thus enabling air circulation between the second channel 042 and the first channel 041.

[0190] The location of the first channel opening 051 can be varied, and those skilled in the art can selectively design it according to actual needs. For example, in some examples, referring to Figure 7, the housing 02 includes multiple sidewalls 23 located between the cover plate 211 and the back plate 221. The multiple sidewalls 23 include a first sidewall 231, which is spaced from the edge of the first plate 03 to form the first channel opening 051. It can be understood that the first channel opening 051 is independent of the first plate 03. In this way, not only is the manufacturing cost low, but the design of the first channel opening 051 is also more flexible. The position and size of the first channel opening 051 can be adjusted according to actual needs. For example, in different power conversion devices, the position and size of the first channel opening 051 can be adjusted by adjusting the position of the first plate 03 according to the setting position of the circuit board 01 and the distribution of electronic components 1, so that the adjusted first channel opening 051 can be adapted to the circuit board 01 to meet the heat dissipation requirements of different power conversion devices.

[0191] In other examples (i.e., the examples shown in Figures 9 and 10 below), the housing 02 includes a plurality of sidewalls 23 located between the cover plate 211 and the back plate 221. The plurality of sidewalls 23 include a first sidewall 231, the edge of the first plate 03 abutting against the first sidewall 231, and a first channel opening 051 disposed on the first plate 03. For example, the first channel opening 051 can be formed on the first plate 03 by means of cutting, stamping, or die forming, which is convenient for processing, saves assembly steps and assembly difficulty, and improves the assembly efficiency of the power conversion device.

[0192] Figure 8 illustrates an exemplary internal structure diagram of a power conversion device. The fan 06 is a centrifugal fan, meaning the airflow direction of the fan 06 is perpendicular to its axial direction.

[0193] In some examples, the axis of fan 06 can be perpendicular or substantially perpendicular to cover plate 211. Since the airflow direction at the outlet of fan 06 is perpendicular to its axis, it can be understood that the airflow direction at the outlet of fan 06 is parallel or approximately parallel to cover plate 211. Therefore, the air entering the first channel 041 from the inlet of fan 06 can flow parallel to cover plate 211. This arrangement allows the hotter air entering the first channel 041 from the second channel 042 to quickly diffuse outwards, achieving rapid cooling of the hotter air entering the first channel 041. This reduces the possibility of hotter air accumulating between fan 06 and cover plate 211, ensuring that air from the second channel 042 can flow smoothly into the first channel 041, and improving the convective heat transfer efficiency between the side of circuit board 01 facing cover plate 211 and the external environment.

[0194] The term "basically perpendicular" refers to the positional relationship between the axis of the fan 06 and the cover plate 211, which is not absolutely perpendicular. For example, the angle between the axis of the fan 06 and the cover plate 211 is within 10°.

[0195] Furthermore, the embodiment shown in Figure 8 differs from the embodiment shown in Figure 7 in that the specific form of the fan 06 is different, that is, the airflow direction of the fan 06 is different. Other structures and advantages of the embodiment shown in Figure 8 have been described above and will not be repeated here.

[0196] Figure 9 illustrates an exemplary structural diagram of a power conversion device. Referring to Figure 9, the first surface of the circuit board 01 includes multiple electronic components 1, with a fan 06 positioned opposite to a first component 11 among the multiple electronic components 1. The first component 11 can be one of the electronic components 1 that generates more heat, such as a circuit board heat sink. This application does not impose any special limitations on the specific form of the first component 11; those skilled in the art can selectively implement it according to actual needs. Furthermore, the advantages of the fan 06 being positioned opposite the electronic components 1 have been described above and will not be repeated here.

[0197] In this example, referring to Figure 9, the edge of the first plate 03 abuts against the first sidewall 231. A first channel opening 051 is provided on the first plate 03.

[0198] For example, the first channel opening 051 can be formed on the first plate 03 by cutting, stamping, or die forming, which is convenient for processing, saves assembly steps and assembly difficulty, and improves the assembly efficiency of the power conversion device. In some examples, the first channel opening 051 corresponds to the electronic device 1 of the circuit board 01. For example, the electronic device 1 with high heat generation can be positioned opposite the first channel opening 051 so that the air flowing into the second channel 042 from the first channel opening 051 can preferentially dissipate heat from the electronic device 1, thereby improving the heat dissipation efficiency of the electronic device 1.

[0199] Referring to Figure 9, the power conversion device includes a second channel port 052, which connects to the first channel 041 and the second channel 042. The diameter of the first channel port 051 is smaller than the diameter of the second channel port 052.

[0200] In some examples, a single first channel opening 051 is provided. Since the diameter of the first channel opening 051 is smaller than that of the second channel opening 052, air flowing into the first channel 041 from the second channel 042 accumulates within the first channel 041, gradually increasing the pressure until it exceeds that of the second channel 042. Under the pressure difference between the first and second channels 041, the air in the first channel 041 flows through the first channel opening 051 from the first channel 041 to the second channel 042, and the air velocity near the first channel opening 051 increases, achieving a jet flow. Because the diameter of the first channel opening 051 remains constant, the airflow through it per unit time also increases, improving the heat dissipation efficiency of the circuit board 01 and the electronic components on it. Furthermore, after exiting the first channel opening 051, the air tends to diffuse, mixing with the surrounding air and rapidly reducing the air temperature in the second channel 042.

[0201] In some examples, multiple first channel ports 051 are configured. To ensure that the first channel ports 051 have a jetting function, the sum of the diameters of the multiple first channel ports 051 can be smaller than the diameter of the second channel port 052. In addition to the advantages described above, multiple first channel ports 051 can be spaced apart on the first plate 03 so that air can enter the second channel 042 from different positions to achieve the purpose of localized heat dissipation at multiple locations.

[0202] In addition, to further improve the heat dissipation effect, the first channel port 051 can be positioned opposite to the electronic device 1 on the circuit board 01 for directional airflow heat dissipation, that is, the air flowing into one first channel port 051 dissipates heat from one electronic device 1. The number, size, and shape of the first channel ports 051 can be designed according to the number, size, and shape of the devices to be cooled, as well as the heat dissipation requirements, etc., and this application does not impose any special restrictions on them.

[0203] To further improve the heat dissipation efficiency within the casing 02, referring to Figure 9, the first plate 03 includes a first protrusion 3, which faces the circuit board 01. The first protrusion 3 includes a first surface 311, which faces the circuit board 01, and a first channel opening 051 is formed on the first surface 311. Compared to the case where the surface of the first plate 03 facing the circuit board 01 is flat, the arrangement of the first protrusion 3 reduces the distance between the first channel opening 051 and the circuit board 01. Since the first surface 311 faces the circuit board 01, the air flowing into the second channel 042 from the first channel opening 051 can be directly blown onto the circuit board 01 and the electronic components on the circuit board 01. Furthermore, because the distance between the first channel opening 051 and the circuit board 01 is reduced, the temperature of the air directly blown onto the circuit board 01 and the electronic components is lower, thus further improving the heat dissipation efficiency of the circuit board 01 and the electronic components on the circuit board 01.

[0204] In this example, the first protrusion 3 can be selectively designed according to actual heat dissipation requirements. For example, multiple first channel ports 051 include first channel port a and first channel port b. First channel port a corresponds to the electronic device a to be cooled, and first channel port b corresponds to the electronic device b to be cooled. The electronic device a generates more heat, while the electronic device b generates less heat. Therefore, the distance between first channel port a and circuit board 01 can be reduced by the first protrusion 3, while the distance between first channel port b and circuit board 01 remains unchanged. Alternatively, if the electronic device a to be cooled has a smaller dimension in the thickness direction of circuit board 01, and the electronic device b to be cooled has a smaller dimension in the thickness direction of circuit board 01, then the distance between first channel port a and circuit board 01 can be reduced by the first protrusion 3, while the distance between first channel port b and circuit board 01 does not need to be reduced.

[0205] In addition, the number of the first protrusion 3 can be set to one or more, and those skilled in the art can choose according to actual heat dissipation requirements.

[0206] In addition, the difference between the embodiment shown in FIG9 and the embodiment shown in FIG7 is that the position and arrangement of the first channel opening 051 and whether the first protrusion 3 is provided on the first plate 03 are different. Other structures and advantages of the embodiment shown in FIG9 have been described above and will not be repeated here.

[0207] Figure 10 illustrates an exemplary structural schematic diagram of a first protrusion in a power conversion device. Referring to Figure 10, the first protrusion 3 includes a second surface 312, which extends along the thickness of the circuit board 01, and a first channel opening 051 is provided on the second surface 312.

[0208] In this example, the electronic device to be cooled on the circuit board 01 can be positioned opposite the second surface 312, that is, the first protrusion 3 is located on one side of the electronic device to be cooled, and air flowing into the second channel from the first channel opening 051 on the second surface 312 can dissipate heat from the electronic device to be cooled. This arrangement can improve the heat dissipation efficiency of the electronic device to be cooled while reducing the size of the casing in the thickness direction of the circuit board 01, that is, reducing the size of the power conversion device in the thickness direction of the circuit board.

[0209] For example, referring to Figure 10, a third device 131 and a fourth device 132 are disposed on the surface of the circuit board 01 facing the first plate 03, and the third device 131 and the fourth device 132 are disposed at intervals. The third device 131 and the fourth device 132 can be of various types. For example, the third device 131 and the fourth device 132 may generate a high amount of heat and be located at a large distance from the first plate 03. For example, the third device 131 and the fourth device 132 may be capacitors or relays, etc. This application does not impose specific limitations on the specific form of the third device 131 and the fourth device 132.

[0210] To improve the heat dissipation efficiency of the third device 131, referring to FIG10, the first protrusion 3 includes a first portion 32 and a second portion 33, with the second portion 33 being closer to the circuit board 01 than the first portion 32. A first surface 311 is disposed on the first portion 32, and a first channel opening 051 on the first surface 311 is opposite to the surface of the third device 131 facing away from the circuit board 01. A second surface 312 is disposed on the second portion 33, which is located between the third device 131 and the fourth device 132, and the first channel opening 051 on the second surface 312 is opposite to the surface of the third device 131 facing the fourth device 132.

[0211] This can be understood as follows: the first channel opening 051 on the first part 32 is opposite to the surface of the third device 131 facing away from the circuit board 01, and the first channel opening 051 on the second part 33 is opposite to the surface of the third device 131 facing the fourth device 132.

[0212] In this way, the air flowing out from the first channel opening 051 on the first part 32 into the second channel 042 can dissipate heat on the surface of the third device 131 away from the circuit board 01, and the air flowing out from the first channel opening 051 on the second part 33 into the second channel 042 can dissipate heat on the surface of the third device 131 facing the fourth device 132. That is, multi-faceted air supply and heat dissipation of the third device 131 are realized, thereby further improving the heat dissipation effect of the third device 131.

[0213] To further improve the heat dissipation efficiency of the third device 131, heat dissipation can also be achieved on the side of the third device 131 facing away from the fourth device 132. For example, the first plate 03 is provided with another first protrusion located on the side of the third device 131 facing away from the fourth device 132. A first channel opening 051 is provided on the surface of the first protrusion facing the third device 131, and the air flowing out of the first channel opening 051 into the second channel 042 can dissipate heat from the surface of the third device 131 facing away from the fourth device 132. In other embodiments, heat dissipation can also be achieved on other sides of the third device 131, and this application does not impose specific limitations on this.

[0214] In other examples, to improve the heat dissipation efficiency of the fourth device 132, referring to Figure 10, the first channel opening 051 on the first part 32 faces the surface of the fourth device 132 away from the circuit board 01, and the first channel opening 051 on the second part 33 faces the surface of the fourth device 132 facing the third device 131. In this way, the air flowing out of the first channel opening 051 on the first part 32 into the second channel 042 can dissipate heat on the surface of the fourth device 132 away from the circuit board 01, and the air flowing out of the first channel opening 051 on the second part 33 into the second channel 042 can dissipate heat on the surface of the fourth device 132 facing the third device 131. That is, multi-faceted airflow heat dissipation of the fourth device 132 is achieved, thereby further improving the heat dissipation effect of the fourth device 132.

[0215] To further improve the heat dissipation efficiency of the fourth device 132, heat dissipation can also be performed on the side of the fourth device 132 facing away from the third device 131. For example, the first plate 03 is provided with another first protrusion, which is located on the side of the fourth device 132 facing away from the third device 131. The surface of the first protrusion facing the fourth device 132 is provided with a first channel opening 051, and the air flowing out of the first channel opening 051 into the second channel 042 can dissipate heat from the surface of the fourth device 132 facing away from the third device 131. In other embodiments, heat dissipation can also be performed on other sides of the fourth device 132, and this application does not impose specific limitations on this.

[0216] Figure 11 illustrates an exemplary structural schematic of a first protrusion in a power conversion device. Referring to Figure 11, a fifth device 133 is disposed on the surface of the circuit board 01 facing the first plate 03. The fifth device 133 can take many forms; for example, in some examples, the fifth device is a capacitor. This application does not impose specific limitations on the specific form of the fifth device 133.

[0217] The surface of the first plate 03 facing the circuit board 01 includes a groove 34, in which the fifth device 133 is housed. At least one surface of the groove 34 opposite to the fifth device 133 has a first channel opening 051.

[0218] In some examples, the fifth device 133 has a top surface facing away from the circuit board and two sides disposed opposite to it.

[0219] Referring to Figure 11, a first channel opening 051 is provided on the surface of the groove 34 opposite to the top surface of the fifth device 133. Air flowing out of the first channel opening 051 into the second channel 042 can preferentially dissipate heat from the top surface of the fifth device 133. A first channel opening 051 is also provided on the surface of the groove 34 opposite to the side surface of the fifth device 133. Air flowing out of the first channel opening 051 into the second channel 042 can preferentially dissipate heat from the side surface of the fifth device 133.

[0220] Therefore, by opening the first channel opening 051 on the surface of the groove 34 opposite to the fifth device 133, multi-faceted air supply and heat dissipation of the fifth device 133 can be achieved, further improving the heat dissipation effect of the fifth device 133.

[0221] The surface of the groove 34 opposite to the fifth device 133 can be one or more. Furthermore, the number of first channel openings 051 on one surface can be one or more. This application does not impose specific limitations in this regard, and those skilled in the art can selectively design according to actual needs.

[0222] In some examples, the groove 34 can be set at the position where the first protrusion 3 is provided on the first plate 03, that is, the groove 34 is set on the surface of the first protrusion 3 facing the circuit board 01. This can reduce the distance between the groove 34 and the circuit board 01, so as to reduce the size of the first plate 03 in the thickness direction of the circuit board 01 while ensuring the heat dissipation efficiency of the fifth device 133. That is, the size of the power conversion device in the thickness direction of the circuit board 01 is reduced.

[0223] Figure 12 illustrates a partial structural diagram of a power conversion device. Referring to Figure 12, the first plate 03 is provided with three first channel ports 051, namely, first channel port A, first channel port B and first channel port C. First channel port A is disposed opposite to the circuit board heat sink 161, first channel port B is disposed opposite to the capacitor 18, and first channel port C is disposed opposite to the relay 19, so as to dissipate heat from the circuit board heat sink 161, the capacitor 18 and the relay 19 respectively, reducing the possibility of local overheating.

[0224] Figure 13 illustrates an exemplary structural diagram of a heat sink in a power conversion device. Referring to Figure 13, a heat sink 16 is disposed on the surface of the circuit board 01 facing the first plate 03. This heat sink 16 is a circuit board heat sink 161, and the first channel opening 051 is disposed opposite to the circuit board heat sink 161. The circuit board heat sink 161 contacts the circuit board 01 to dissipate heat from the circuit board 01. A thermally conductive interface material layer 17 is disposed between the circuit board heat sink 161 and the circuit board 01. The thermally conductive interface material layer 17 can fill the gap between the circuit board heat sink 161 and the circuit board 01 to increase the contact area between the circuit board heat sink 161 and the circuit board 01, thereby ensuring the heat dissipation efficiency of the circuit board 01.

[0225] In this example, the circuit board heat sink 161 is opposite to the first channel port 051. The air flowing out of the first channel port 051 into the second channel 042 can dissipate heat from the circuit board heat sink 161 to improve the heat dissipation efficiency of the circuit board heat sink 161, thereby improving the heat dissipation efficiency of the circuit board 01.

[0226] In some examples, the first channel port 051 disposed opposite to the circuit board heat sink 161 may include multiple first channel ports 051, each capable of dissipating heat from the circuit board heat sink 161. The arrangement of multiple first channel ports 051 can increase the amount of air jetted onto the circuit board heat sink 161, thereby further improving the heat dissipation efficiency of the circuit board heat sink 161.

[0227] In other embodiments, referring to FIG13, a first channel opening 051 can be provided around the heat sink of the circuit board 01. The air flowing out of the first channel opening 051 into the second channel 042 can also dissipate heat from the circuit board heat sink 161, so as to further improve the heat dissipation efficiency of the circuit board heat sink 161.

[0228] In some examples, the first channel opening 051 opposite to the circuit board heat sink 161 and the first channel opening 051 circumferentially surrounding the circuit board heat sink 161 can be respectively provided on the surface of the first protrusion 3 facing the circuit board 01, so that the distance between the first channel opening 051 and the circuit board 01 is reduced, so as to reduce the size of the first plate 03 in the thickness direction of the circuit board 01 while ensuring the heat dissipation efficiency of the circuit board heat sink 161, that is, reduce the size of the power conversion device in the thickness direction of the circuit board 01.

[0229] Figure 14 illustrates an exemplary structural schematic of a heat sink in a power conversion device. Referring to Figure 14, a relay 19 and a heat sink 16 are disposed on the surface of circuit board 01 facing the first plate 03. The heat sink 16 is a relay heat sink 162. Multiple first channel ports 051 are included, one first channel port 051 is disposed opposite to the relay 19, and another first channel port 051 is disposed opposite to the relay heat sink 162. The relay heat sink 162 is used to dissipate heat from the relay 19.

[0230] In this example, relay 19 is opposite to the first channel port 051. Air flowing from the first channel port 051 into the second channel 042 can dissipate heat from relay 19, thereby improving the heat dissipation efficiency of relay 19. Relay heat sink 162 is opposite to the first channel port 051. Air flowing from the first channel port 051 into the second channel 042 can dissipate heat from relay heat sink 162, thereby improving the heat dissipation efficiency of relay heat sink 162, which in turn improves the heat dissipation efficiency of relay 19.

[0231] By directing airflow to cool the relay 19 and the relay heat sink 162, the heat dissipation efficiency of the relay 19 can be improved, and the occurrence of local overheating at the relay 19 can be reduced.

[0232] In some examples, the first channel port 051 opposite to the relay 19 and the first channel port 051 opposite to the relay heat sink 162 can be respectively disposed on the surface of the first protrusion 3 facing the circuit board 01, so that the distance between the first channel port 051 and the circuit board 01 is reduced, so as to reduce the size of the first plate 03 in the thickness direction of the circuit board 01 while ensuring the heat dissipation efficiency of the relay 19 and the relay heat sink 162, that is, reduce the size of the power conversion device in the thickness direction of the circuit board 01.

[0233] Figure 15 illustrates an exemplary structural diagram of a capacitor in a power conversion device. Referring to Figure 15, a capacitor 18 is disposed on the surface of the circuit board 01 facing the first plate 03. The surface of the first plate 03 facing the circuit board 01 includes a groove 34, in which the capacitor 18 is housed. A first channel opening 051 is provided on each surface within the groove 34 opposite to the capacitor.

[0234] In this way, the air flowing out from the three first channel ports 051 into the second channel 042 can dissipate heat on the surface of capacitor 18 away from the circuit board 01 and on the two opposite sides of capacitor 18, thereby achieving multi-faceted air supply and heat dissipation of capacitor 18, which further improves the heat dissipation effect of capacitor 18 and reduces the occurrence of local overheating at capacitor 18.

[0235] Figure 16 illustrates one of the internal structural schematic diagrams of a power conversion device. Referring to Figure 16, the fan 06 is located outside the area of ​​the multiple electronic components 1. Since the size of the second channel port 052 is larger than the size of the first channel port 051, placing the fan 06 outside the area of ​​the multiple electronic components 1 provides more space for the first channel port 051, allowing more first channel ports 051 opposite to the electronic components 1 to be arranged on the first plate 03, thereby improving the heat dissipation efficiency inside the housing 02.

[0236] Referring to Figure 16, the air inlet of fan 06 faces the second channel 042, and the air outlet of fan 06 faces the first channel 041. It can be understood that the air in the second channel 042 enters the air inlet of fan 06 and enters the first channel 041 from the air outlet of fan 06. Therefore, fan 06 is used to transport the air in the second channel 042 to the first channel 041.

[0237] Multiple first channel ports 051 are configured one-to-one with multiple electronic devices 1 to provide directional airflow cooling for the multiple electronic devices 1, thereby improving the heat dissipation efficiency of the multiple electronic devices 1. Specifically, the air flowing into the second channel 042 from each first channel port 051 preferentially cools the electronic device 1 that is positioned opposite to that first channel port 051, thereby improving the heat dissipation efficiency of the electronic device 1 and preventing heat accumulation at the electronic device 1, which could lead to localized overheating of the circuit board 01.

[0238] Figure 17 illustrates a second exemplary internal structure diagram of a power conversion device. Figure 18 illustrates a third exemplary internal structure diagram of a power conversion device. Referring to Figures 17 and 18, the air inlet of the fan 06 faces the first channel 041, and the air outlet of the fan 06 faces the second channel 042. Multiple electronic devices 1 include a second device 12, and the fan 06 is arranged opposite to the second device 12.

[0239] This can be understood as follows: the air in the first channel 041 enters the air inlet of the fan 06 and enters the second channel 042 from the air outlet of the fan 06. The fan 06 is used to transport the air in the first channel 041 to the second channel 042.

[0240] Referring to Figure 17, fan 06 is located in the middle region of the plurality of electronic devices 1, and fan 06 is positioned opposite to the second device 12 located in the middle position among the plurality of electronic devices 1. Referring to Figure 18, fan 06 is located at the edge of the plurality of electronic devices 1, and fan 06 is positioned opposite to the second device 12 at the outermost edge among the plurality of electronic devices 1. The fan 06 is positioned opposite to the second device 12 to provide directional airflow for heat dissipation of the second device 12, thereby improving the heat dissipation efficiency of the second device 12.

[0241] In this example, fan 06 can be set to one, or multiple. For example, when multiple fans 06 are set, each fan 06 is positioned opposite a single electronic device to be cooled, thereby achieving directional airflow for heat dissipation of multiple electronic devices. Furthermore, the placement of the fans 06 can be determined according to actual heat dissipation requirements, and this embodiment does not impose any special restrictions on this.

[0242] Figure 19A illustrates an exemplary structural diagram of a housing cover applied to the aforementioned power conversion device. Referring to Figure 19A, a plurality of toothed plates 071 are provided on the inner wall surface of the cover plate 211. One end of each toothed plate 071 is connected to the inner wall surface of the cover plate 211, and the first end extends in a direction away from the inner wall surface of the cover plate 211. The plurality of toothed plates 071 are spaced apart, and a flow guiding channel 08 is formed between two adjacent toothed plates 071.

[0243] The toothed fin 071 allows the air in the first channel 041 to transfer heat to the toothed fin 071, which then transfers the heat to the cover plate 211. The cover plate 211 then exchanges heat with the external environment, thus achieving heat dissipation. Therefore, the toothed fin 071 increases the contact area between the air in the first channel 041 and the cover plate 211, thereby improving the heat dissipation efficiency between the cover plate 21 and the external environment.

[0244] Multiple heat dissipation fins 072 are spaced apart, and a guide channel 08 is formed between two adjacent fins 071. The guide channel 08 guides the air in the first channel 041, allowing the air to flow along the guide channel 08. This creates a stable and continuous airflow field within the first channel 041, which helps to transfer heat more effectively from the cover plate 211 to the external environment. Without the guide channel 08, the airflow in the first channel 041 would flow in different directions, potentially disrupting the airflow and reducing heat dissipation efficiency.

[0245] In some examples, the end of the toothed plate 071 facing away from the cover plate 211 may be connected to the first plate 03 shown in Figure 2, or it may not be connected. Furthermore, the toothed plate 071 and the cover plate 21 may be separate components or an integral structural unit. Those skilled in the art can design selectively according to actual needs.

[0246] In some examples, referring to Figures 2, 9 and 19A, the projections of a plurality of toothed blades 071 on the first plate 03 are located around the fan, and in a direction parallel to the cover plate 211, each toothed blade 071 extends from one end near the fan 06 to an opposite sidewall 23.

[0247] Because the air temperature entering the first channel 041 from the second channel 042 is relatively high, and the air entering the first channel 041 from the second channel 042 tends to accumulate between the fan 06 and the cover plate 211, it affects the heat dissipation efficiency of the first channel 041.

[0248] To reduce the likelihood of hot air accumulating between the fan 06 and the cover plate 211 in the first channel 041, the projections of multiple toothed blades 071 on the first plate 03 are positioned around the fan 06. This means that the projection of the fan 06 onto the cover plate 211 does not cover the toothed blades 071. This provides sufficient space for the hot air entering the first channel 041, ensuring that the airflow speed between the fan 06 and the cover plate 211 is undisturbed, thus reducing the possibility of hot air accumulating between the fan 06 and the cover plate 211. Conversely, if the projection of the fan 06 onto the cover plate 211 covers the toothed blades 071, some of the air entering the first channel 041 will flow onto the toothed blades 071. The toothed blades 071 will then resist the airflow, slowing down the airflow speed between the fan 06 and the cover plate 211, thereby exacerbating the accumulation of hot air between the fan 06 and the cover plate 211.

[0249] Figure 19B is a partial structural schematic diagram of a shell cover provided in an embodiment of this application. Referring to Figure 19B, the distance between two adjacent heat dissipation fins 072 on the outer wall surface of the cover plate 211 is d1. The distance between two adjacent toothed plates 071 on the inner wall surface of the cover plate 211 is d2. Wherein, d2≤d1.

[0250] The smaller spacing d2 between two adjacent toothed fins 071 on the inner wall of the cover plate 211 increases the contact area between the toothed fins 071 and the air, thereby improving the heat exchange efficiency between the cover plate 211 and the air in the first channel 041 in Figure 6. Under the action of the fan 06, reducing d2 further enhances the forced convection cooling effect. The larger spacing d1 between two adjacent heat dissipation fins on the outer wall of the cover plate 211 has already been described above and will not be repeated here.

[0251] By setting d2≤d1, the forced convection cooling effect inside the cover plate 211 and the natural convection cooling effect outside the cover plate 211 are further improved, which in turn helps to improve the heat dissipation capacity of the power conversion device cavity and reduce the temperature inside the power conversion device cavity.

[0252] In some embodiments, d2 ≤ 9 mm, d1 ≥ 9 mm. The values ​​of d1 and d2 can be selectively designed according to actual needs. Figures 20 to 25 exemplarily illustrate six structural schematic diagrams of the toothed plates applied to the above-described power conversion device.

[0253] Referring to Figure 20, the profile of the toothed plate 071 is arc-shaped. This can be understood as the toothed plate 071 having arc-shaped teeth. Correspondingly, an arc-shaped guide channel 08 is formed between two adjacent toothed plates 071. The arc-shaped guide channel 08 can guide the airflow more smoothly, reducing sudden changes in airflow direction or obstruction within the guide channel 08, thus reducing airflow energy loss and helping to ensure a more stable and continuous airflow. Furthermore, the arc-shaped guide channel 08 generates less turbulence and eddies when guiding airflow, thereby reducing noise and vibration.

[0254] Referring to Figure 21, the toothed plate 071 has straight teeth. Correspondingly, two adjacent toothed plates 071 form a straight guide channel 08. The toothed plate 071 has straight teeth, which is low in cost and easy to manufacture.

[0255] Referring to Figure 22, the toothed plate 071 has helical teeth. Correspondingly, two adjacent toothed plates 071 form an inclined guide channel 08. The helical teeth of the toothed plate 071 are low in cost and easy to manufacture.

[0256] Referring to Figure 23, the toothed blade 071 is an arc-shaped tooth. Multiple toothed blades 071 have different diameters. Toothed blades 071 of the same diameter are arranged at intervals around the circumference of the fan 06, while toothed blades 071 of different diameters are staggered in the radial direction of the fan 06 to form a guide channel 08 similar to an island.

[0257] Referring to FIG24, the plurality of toothed plates 071 are arranged radially. That is, the plurality of toothed plates 071 include a plurality of toothed plates and a plurality of toothed plates b. The plurality of toothed plates a are closer to the fan 06 than the plurality of toothed plates b. The projections of the plurality of toothed plates a and the plurality of toothed plates b on the first plate 03 in FIG6 are all arranged circumferentially around the fan 06, and the end of each toothed plate b is located between two toothed plates a.

[0258] Referring to Figure 25, the toothed plates 071 are straight teeth, and multiple toothed plates 071 are arranged radially. The projections of the multiple toothed plates 071 on the first plate 03 in Figure 6 are arranged circumferentially around the fan 06. The spacing d2 between two adjacent toothed plates 071 in at least a portion of the multiple toothed plates 071 increases in the direction away from the fan 06.

[0259] Referring to Figures 7 and 25, when the air inlet of the fan 06 faces the second channel 042, the fan 06 is used to guide the air in the second channel 042 into the first channel 041. At least some of the toothed plates 071 have an increased spacing d2 between two adjacent toothed plates 071 in the direction away from the fan 06, and the cross-sectional area of ​​the guide channel formed between two adjacent toothed plates 071 is increased, so as to reduce the air velocity in the first channel 041 and increase the heat exchange time between the air in the first channel 041 and the inner wall surface of the toothed plates 071 and the cover plate 211, thereby improving the heat exchange efficiency.

[0260] Referring to Figures 17 and 25, when the air inlet of the fan 06 faces the first channel 041, the fan 06 guides the air in the first channel 041 into the second channel 042. The distance d2 between two adjacent toothed plates 071 increases in the direction away from the fan 06, and correspondingly, the distance d2 between two adjacent toothed plates 071 decreases in the direction closer to the fan 06. During the process of air flowing from the first channel 041 to the fan 06, the cross-sectional area of ​​the guide channel 08 formed between two adjacent toothed plates 071 decreases, and the airflow velocity increases. Under the same power of the fan 06, this increases the amount of air entering the second channel 042, which is beneficial to improving the heat dissipation efficiency of the electronic devices in the second channel 042.

[0261] In the embodiments shown in Figures 20 to 25, a plurality of toothed plates 071 are evenly distributed on the cover plate 211. In other embodiments of this application, the plurality of toothed plates 071 are arranged in a suitable manner on the cover plate 211. For example, some of the toothed plates 071 are evenly spaced, while others are non-uniformly spaced. Furthermore, in some toothed plates 071, the spacing between adjacent toothed plates 071 at different positions is the same, while in others, the spacing between adjacent toothed plates 071 at different positions is different. This is not specifically limited in the art, and those skilled in the art can selectively design according to actual needs.

[0262] In other embodiments, the toothed fin 071 can also be in other suitable forms, and this application does not impose specific limitations on it. Those skilled in the art can selectively set it according to actual needs. In addition, the heat dissipation fins 072 disposed on the outer peripheral surface of the housing 02 can have different structures from the toothed fin 071, or they can have the same structure, and this application does not impose limitations on it either.

[0263] In the power conversion device provided in this application, the angle α between the opening direction of the air inlet 061 of the fan 06 and the plane where the first plate 03 is located satisfies: 0°<α≤90°.

[0264] When the angle α between the opening direction of the air inlet 061 of fan 06 and the plane where the first plate 03 is located is 0°, fan 06 is a vertical fan. However, this application makes fan 06 a horizontal fan by using 0°<α≤90°. Compared with a vertical fan, the horizontal fan configuration can reduce the space occupied by fan 06 in the thickness direction of circuit board 01, thereby helping to reduce the size of power conversion device 20 in the thickness direction of circuit board 01. The principle, structure and installation method of horizontal fan are well known to those skilled in the art, and will not be described in detail here.

[0265] In the embodiments shown in Figures 6 to 18, the angle α between the opening direction of the air inlet of the fan 06 and the plane where the first plate 03 is located is 90°. The opening direction of the air inlet of the fan 06 is perpendicular to the plane where the first plate 03 is located, so as to blow air into the first channel 041 or draw air from the first channel 041 in a direction perpendicular to the plane where the first plate 03 is located.

[0266] In the embodiments shown in Figures 7, 8, 9 and 16, the air inlet of the fan 06 faces the second channel 042, and the fan 06 draws air from the second channel 042 and blows air into the first channel 041 in a direction perpendicular to the plane where the first plate 03 is located.

[0267] In the embodiments shown in Figures 17 and 18, the air inlet of the fan 06 faces the first channel 041, and the fan 06 draws air from the first channel 041 and blows air into the second channel 042 in a direction perpendicular to the plane where the first plate 03 is located.

[0268] Figure 26 is a partial cross-sectional view of another power conversion device provided in an embodiment of this application, and Figure 27 is a second partial cross-sectional view of another power conversion device provided in an embodiment of this application. Unlike the embodiments shown in Figures 6 to 18, in the embodiments given in Figures 26 and 27, the angle α between the opening direction of the air inlet 061 of the fan 06 and the plane where the first plate 03 is located satisfies: 0° < α < 90°.

[0269] When the angle α between the opening direction of the air inlet 061 of the fan 06 and the plane where the first plate 03 is located satisfies: 0°<α<90°, the angle between the opening direction of the air inlet 061 of the fan 06 and the plane where the first plate 03 is located is an acute angle, so that air can be blown into the first channel 041 or drawn out from the first channel 041 in a direction inclined to the plane where the first plate 03 is located.

[0270] In the embodiment shown in Figure 26, the air inlet 061 of the fan 06 faces the second channel 042. Under the guidance of the fan 06, the air in the second channel 042 enters the first channel 041 from the second channel opening 052. The fan 06 plays the role of drawing air from the second channel 042. The hot air of the device or area facing the air inlet 061 of the fan 06 is uniformly drawn to the air inlet 061 of the fan 06 to improve the heat dissipation efficiency of the device facing the air inlet 061 of the fan 06.

[0271] In some embodiments, referring to FIG26, the device facing the air inlet 061 of the fan 06 is a device in the circuit board 01 that generates a large amount of heat or a heat dissipation bottleneck device. Devices that generate a large amount of heat can be of various types, such as inverter modules and power inductors. Heat dissipation bottleneck devices refer to devices whose generated heat cannot be effectively dissipated, resulting in excessively high temperatures, such as grid-connected relays, inverter capacitors, photovoltaic common-mode inductors, and photovoltaic relays.

[0272] In the embodiment shown in Figure 27, the air inlet 061 of the fan 06 faces the first channel 041. Under the guidance of the fan 06, the air in the first channel 041 enters the second channel 042 from the second channel opening 052. The fan 06 blows air into the second channel 042. The cooler air delivered by the fan 06 to the second channel 042 is directly delivered to the device or area facing the air outlet 062 of the fan 06, and carries away the heat generated therefrom, so as to improve the heat dissipation efficiency of the device facing the air outlet 062 of the fan 06.

[0273] In some embodiments, referring to FIG27, the device facing the air outlet 062 of the fan 06 is a device in the circuit board 01 that generates a large amount of heat or a heat dissipation bottleneck device. Devices that generate a large amount of heat can be of various types, such as inverter modules and power inductors. Heat dissipation bottleneck devices refer to devices whose generated heat cannot be effectively dissipated, resulting in excessively high temperatures, such as grid-connected relays, inverter capacitors, photovoltaic common-mode inductors, and photovoltaic relays.

[0274] In some embodiments, the inner wall surface of the cover plate 211 includes a plurality of toothed slats 071, which are arranged at intervals. The fan 06 is located between the projections of two portions of the toothed slats 071 onto the first plate. At least one of the height of the toothed slats 071 and the spacing between two adjacent toothed slats 071 is different, so as to change the height of the toothed slats 071 or the spacing between adjacent toothed slats 071 according to the position of the fan 06, the installation angle, etc., to further improve the heat dissipation effect.

[0275] Figure 28 is a schematic diagram of the shell cover structure in Figure 26. Referring to Figure 28, one part of the toothed plates in the two-part toothed plate is shown as dashed box A1, and another part of the toothed plates in the two-part toothed plate is shown as dashed box A2. The distance between two adjacent toothed plates 071 in one part of the toothed plate is d3, and the distance between two adjacent toothed plates 071 in the other part of the toothed plate is d4.

[0276] In some embodiments, d4≤d3.

[0277] Referring to Figures 26 and 28, the air inlet 061 of the fan 06 faces a portion of the toothed plates. Due to the tilt of the fan 06, the air entering the second channel 042 flows away from a portion of the toothed plates in a direction parallel to the first plate 03. After heat exchange with the electronic device 1 in the first channel 041, the hotter air preferentially enters the location of the other portion of the toothed plates through the second channel opening 052. By making d4 < d3, the distance d4 between two adjacent toothed plates 071 in the other portion of the toothed plates is reduced, making the other portion of the toothed plates more densely distributed. This increases the heat exchange area between the other portion of the toothed plates and the air, rapidly cooling the air flowing into the first channel 041, thereby reducing the temperature of the air flowing to the air inlet 061 of the fan 06 and improving heat dissipation.

[0278] In other embodiments of this application, d4 is equal to d3 for ease of processing.

[0279] Figure 29 is a partial sectional view of the shell cover in Figure 28. The height of toothed plate 071 in one part of the toothed plates is h1, and the height of toothed plate 071 in another part of the toothed plates is h2.

[0280] In some embodiments, h2 ≥ h1.

[0281] Referring to Figures 26, 28, and 29, the air inlet 061 of the fan 06 faces a portion of the toothed plates. By increasing h2 > h1, the height h2 of the toothed plate 071 in the other portion of the toothed plates is increased, thereby increasing the heat exchange area between the other portion of the toothed plates and the air. This rapidly cools the air flowing into the first channel 041, thereby reducing the temperature of the air flowing to the air inlet 061 of the fan 06 and improving heat dissipation.

[0282] In other embodiments of this application, h2 is equal to h1 for ease of processing.

[0283] In other embodiments of this application, heat dissipation can be improved according to other needs. For example, referring to Figures 26 and 28, the fan 06 is tilted, causing hotter air to preferentially enter the area shown in the dashed box A2. In order to improve heat dissipation, the fan 06 is made closer to a part of the toothed plate 071 to increase the length of the toothed plate 071 in another part of the toothed plate, thereby increasing the contact area between a part of the toothed plate and the air in the first channel 041, thereby improving the heat dissipation efficiency.

[0284] Figure 30 is a schematic diagram of the shell cover in Figure 27. Unlike the embodiment shown in Figure 28, d3 ≤ d4.

[0285] Referring to Figures 27 and 30, the air outlet 062 of the fan 06 faces a portion of the toothed blades 071. Due to the tilt of the fan 06, the hot air output by the fan 06 is directly delivered to a portion of the toothed blades 071. By reducing the distance d3 between two adjacent toothed blades 071 through d3 < d4, the toothed blades 071 are more densely distributed, which rapidly cools the air flowing into the first channel 041, thereby reducing the temperature of the air flowing to the opening 051 of the first channel and improving heat dissipation.

[0286] In other embodiments of this application, d4 is equal to d3 for ease of processing.

[0287] Figure 31 is a partial cross-sectional view of the shell cover in Figure 30. Unlike the embodiment shown in Figure 29, h1 ≥ h2.

[0288] Referring to Figures 27, 30, and 31, the air inlet 061 of the fan 06 faces a portion of the toothed plates 071. By increasing h1 > h2, the height h1 of the toothed plates 071 is increased, thereby increasing the heat exchange area between the toothed plates 071 and the air. This rapidly cools the air flowing into the first channel 041, thereby reducing the temperature of the air flowing to the first channel opening 051 and improving heat dissipation.

[0289] In other embodiments of this application, h2 is equal to h1 for ease of processing.

[0290] In other embodiments of this application, heat dissipation can be improved according to other needs. For example, the fan 06 is tilted, causing hotter air to preferentially enter the area shown in the dashed box A1. In order to improve heat dissipation, the fan 06 is moved further away from a portion of the toothed plates to increase the length of the toothed plate 071 in a portion of the toothed plates, thereby increasing the contact area between a portion of the toothed plates and the air in the first channel 041, thereby improving heat dissipation efficiency.

[0291] In other embodiments of this application, apart from the areas shown by dashed boxes A1 and A2, the height, length, spacing, etc. of the other teeth 071 of the plurality of teeth 071 can be designed according to actual needs to improve heat dissipation. This application does not impose any special restrictions on this.

[0292] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device, characterized in that, include: A circuit board, the circuit board including a first surface on which a plurality of electronic devices are disposed; A housing, wherein the circuit board is located within the housing, the housing including a cover plate facing a first surface of the circuit board; A first plate, the first plate facing the first surface of the circuit board and disposed between the cover plate and the circuit board, a first channel is formed between the first plate and the cover plate, and a second channel is formed between the first plate and the circuit board; At least one first channel port, each first channel port connecting the first channel and the second channel; A second channel opening connects the first channel and the second channel; A fan is located at the second channel opening; The direction of the airflow passing through the first channel opening is opposite to the direction of the airflow passing through the second channel opening.

2. The power conversion device according to claim 1, characterized in that, The second channel opening is located on the first plate; The fan is positioned opposite to at least one of the plurality of electronic devices.

3. The power conversion device according to claim 1 or 2, characterized in that, The housing also includes a back plate disposed opposite to the cover plate, and a plurality of side walls located between the cover plate and the back plate, wherein a first side wall of the plurality of side walls is spaced apart from the edge of the first plate to form the first channel opening.

4. The power conversion device according to claim 3, characterized in that, The air inlet of the fan faces the second channel, and the air outlet of the fan faces the first channel; The plurality of electronic devices includes a first device, wherein the second channel port is closer to the first device than the first channel port.

5. The power conversion device according to claim 3, characterized in that, The air inlet of the fan faces the first channel, and the air outlet of the fan faces the second channel; The plurality of electronic devices includes a second device, and the fan is disposed opposite to the second device.

6. The power conversion device according to claim 1 or 2, characterized in that, The housing also includes a back plate disposed opposite to the cover plate, and a plurality of side walls located between the cover plate and the back plate, wherein the edge of the first plate abuts against a first side wall among the plurality of side walls; The first channel opening is located on the first plate.

7. The power conversion device according to claim 6, characterized in that, The air inlet of the fan faces the second channel, and the air outlet of the fan faces the first channel; The at least one first channel port includes multiple first channel ports, and the multiple first channel ports and the multiple electronic devices are configured in a one-to-one correspondence.

8. The power conversion device according to claim 7, characterized in that, The diameter of the first channel opening is smaller than the diameter of the second channel opening.

9. The power conversion device according to claim 7 or 8, characterized in that, The first plate includes a first protrusion, which is disposed toward the circuit board; The first protrusion includes a first surface, which is opposite to the circuit board, and the first channel opening is formed on the first surface.

10. The power conversion device according to claim 9, characterized in that, The first protrusion also includes a second surface that extends along the thickness direction of the circuit board, and the second surface has the first channel opening.

11. The power conversion device according to claim 10, characterized in that, The plurality of electronic devices includes a third device and a fourth device, wherein the third device and the fourth device are arranged at intervals; The first protrusion includes a first portion and a second portion, wherein the second portion is closer to the circuit board than the first portion; The first surface is disposed on the first portion, and the first channel opening on the first surface is opposite to the surface of the third device that is away from the circuit board; The second surface is disposed on the second portion, which is located between the third device and the fourth device, and the first channel opening on the second surface is opposite to the surface of the third device facing the fourth device.

12. The power conversion device according to any one of claims 7-11, characterized in that, The plurality of electronic devices includes a fifth device; The surface of the first plate facing the circuit board includes a groove, and the fifth device is accommodated within the groove; The groove has the first channel opening on at least one surface opposite to the fifth device.

13. The power conversion device according to any one of claims 7-12, characterized in that, A heat sink is provided on the surface of the circuit board facing the first board, and the first channel opening is positioned opposite to the heat sink.

14. The power conversion device according to any one of claims 1-13, characterized in that, The cover plate has a plurality of toothed plates arranged in the direction facing the first plate, and the plurality of toothed plates are spaced apart.

15. The power conversion device according to claim 14, characterized in that, The projections of the plurality of toothed blades on the first plate are located around the fan, and in a direction parallel to the cover plate, each of the toothed blades extends from one end near the fan to one of the opposite sidewalls.

16. The power conversion device according to claim 15, characterized in that, In at least a portion of the plurality of toothed plates, the spacing between two adjacent toothed plates increases in the direction away from the fan.

17. The power conversion device according to any one of claims 14-16, characterized in that, The toothed plate has an arc-shaped outline.

18. The power conversion device according to any one of claims 14-17, characterized in that, The cover plate is provided with a plurality of heat dissipation fins in the direction away from the first plate, and the plurality of heat dissipation fins are spaced apart. The distance between two adjacent heat dissipation fins is d1, and the distance between two adjacent toothed fins is d2, where d2 ≤ d1.

19. The power conversion device according to any one of claims 1-13, characterized in that, The angle α between the opening direction of the fan's air inlet and the plane where the first plate is located satisfies: 0°<α≤90°.

20. The power conversion device according to claim 19, characterized in that, The cover plate has a plurality of toothed plates arranged in the direction facing the first plate, and the plurality of toothed plates are spaced apart.

21. The power conversion device according to claim 20, characterized in that, The fan is located between the projections of two portions of the toothed plates onto the first plate, wherein at least one of the height of the toothed plates and the spacing between two adjacent toothed plates is different.

22. The power conversion device according to claim 21, characterized in that, The distance between two adjacent teeth in one part of the two toothed plates is d3, and the distance between two adjacent teeth in the other part of the two toothed plates is d4. The air inlet of the fan faces the portion of the toothed blades, where d4≤d3, or the air outlet of the fan faces the portion of the toothed blades, where d3≤d4.

23. The power conversion device according to claim 21, characterized in that, The height of one part of the toothed plate in the two-part toothed plate is h1, and the height of the other part of the toothed plate in the two-part toothed plate is h2; The air inlet of the fan faces the portion of the toothed plates, h2≥h1, or the air outlet of the fan faces the portion of the toothed plates, h1≥h2.

24. The power conversion device according to any one of claims 1-23, characterized in that, The plurality of electronic devices includes a sixth device, which is in contact with the cover plate; The portion of the cover plate that contacts the sixth device is closer to the circuit board than the portion of the first plate.

25. The power conversion device according to claim 24, characterized in that, The cover plate has heat dissipation fins on the side facing away from the first plate and in the area corresponding to the sixth device.

26. The power conversion device according to any one of claims 1-25, characterized in that, The housing also includes a back plate disposed opposite to the cover plate. A power device is disposed on the second surface of the circuit board away from the first surface. The power device is in contact with the back plate. A heat dissipation fin is disposed on the side of the back plate away from the circuit board.

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