Chuck for die level test

Abstract

The chuck for a die level test comprises: a mobile chuck supporting a plurality of dies; and a chuck base disposed under the mobile chuck to support the mobile chuck, wherein the mobile chuck has, defined on the upper surface thereof, a plurality of vacuum suction holes for suctioning the dies, and the mobile chuck and the chuck base are separable.

Description

Chuck for die level testing

[0001] The present invention relates to a chuck for die level testing.

[0002] After the manufacturing process is completed, semiconductor devices are determined to be good by inspecting their electrical characteristics. During this process, the die under test is loaded into test equipment, and various tests are performed through contact with each probe tip of a probe card.

[0003] As an example of a test, the probe tip contacts the electrode pad or solder bump of the die and determines electrical characteristics such as conduction status by applying a test signal to the electrical circuit connected to each electrode.

[0004] When inspection is performed with the die placed on a frame and a film placed on the frame, problems may arise regarding the range limitations of the inspection temperature and the inability to precisely control the heat due to thermal resistance caused by the film.

[0005] In addition, when a die is transferred from a film onto a chuck containing a coolant channel to perform various types of tests, space for a frame and space for a module to be placed in each test space may be required. Consequently, the volume occupied by the test space may increase.

[0006] The objective of the present invention is to provide a die level test chuck that can reduce the volume of the test space of the dies and precisely control the temperature of the dies.

[0007] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art to which the present invention pertains from the description below.

[0008] A chuck for die level testing according to one embodiment of the present invention includes a mobile chuck that supports a plurality of dies and a chuck base disposed below the mobile chuck to support the mobile chuck, wherein a plurality of vacuum suction holes for adsorbing the dies are defined on the upper surface of the mobile chuck, and the mobile chuck and the chuck base may be separable.

[0009] According to one embodiment of the present invention, dies can be placed on a mobile chuck within a sorter chamber. The dies can be provided to each test space in a state where they are placed on the mobile chuck. Accordingly, a separate space for placing the dies on the chuck in each test space can be omitted. Thus, the volume of the test space can be reduced.

[0010] According to one embodiment of the present invention, a chuck for die level testing may include a detachable mobile chuck and a chuck base. Accordingly, a process of placing dies on the upper surface of a mobile chuck and a process of testing the dies placed on the upper surface of another mobile chuck can be performed simultaneously. Therefore, the testing process time can be shortened.

[0011] According to one embodiment of the present invention, the dies can be placed directly on the upper surface of a mobile chuck. Accordingly, when heat generated from the dies is transferred toward the mobile chuck and chuck base to cool them, or when heat generated from the chuck base is transferred toward the dies to heat them, the temperature of the dies can be easily controlled.

[0012] The effects of the present invention are not limited to the effects described above, and are derived from the configuration of the invention described in the detailed description of the present invention or the claims.

[0013] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention.

[0014] Figure 2 is a plan view of the mobile chuck shown in Figure 1.

[0015] FIG. 3 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0016] FIGS. 4a through 4k are cross-sectional views illustrating the sorter chamber of FIG. 3. FIG. 5 is a plan view of the mobile chuck and dies shown in FIG. 4k.

[0017] FIG. 5 is a plan view illustrating the mobile chuck and dies placed on the upper surface of the mobile chuck as illustrated in FIG. 4k.

[0018] FIG. 6 is a plan view illustrating a mobile chuck being transported by a loader.

[0019] Figure 7 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0020] FIGS. 8A and FIGS. 8B are embodiments of the present invention

[0021] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components.

[0022] The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention.

[0023] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical ideas of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention.

[0024] In the following description, descriptions of some components may be omitted to clarify the features of the present invention.

[0025] In the following description, the term "connection" refers to one or more members being connected to each other in a manner that allows for fluid communication. In one embodiment, the connection may be formed by members such as a conduit, a pipe, or a piping system. In the following description, the term "connection" may be used interchangeably with the meaning that one or more members are "fluidly connected" to each other.

[0026] In the following description, the term "conduction" means that one or more components are connected to each other to transmit current or electrical signals. In one embodiment, the conduction may be formed in a wired form by a conductor member, etc., or in a wireless form such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may include the meaning of "communication."

[0027] As used in the following description, the term "fluid" refers to any form of substance that flows due to an external force and whose shape or volume, etc., can be deformed. In one embodiment, the fluid may be a liquid such as water or a gas such as air.

[0028] The terms "upper side," "lower side," "left side," "right side," "front side," and "rear side" used in the following description shall be understood by referring to the coordinate system depicted throughout the attached drawings.

[0029]

[0030] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2 is a plan view of a mobile chuck shown in FIG. 1.

[0031] Referring to FIGS. 1 and 2, a chuck (1) for die level testing may include a mobile chuck (11) and a chuck base (12). For example, the mobile chuck (11) may have a disc shape. The upper surface of the mobile chuck (11) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). However, this is exemplary, and the shape of the mobile chuck (11) is not limited thereto.

[0032] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the front and back surfaces of each member. In this specification, "on a plane" may be defined as a state viewed from the third direction (DR3). Hereinafter, the first to third directions (DR1, DR2, DR3) refer to the same reference numeral in the direction indicated by the first to third direction axes, respectively.

[0033] A plurality of vacuum suction holes (110) may be defined on the upper surface of the mobile chuck (11). The vacuum suction holes (110) are connected to an external vacuum pump, and when the vacuum pump is operated, the vacuum suction holes (110) can be converted to a vacuum state. Accordingly, a plurality of dies (218, see FIG. 5) to be described later can be fixed on the upper surface of the mobile chuck (11).

[0034] The vacuum suction holes (110) may be arranged in a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). The vacuum suction holes (110) may be arranged in multiple rows and multiple columns. The rows may correspond to the first direction (DR1), and the columns may correspond to the second direction (DR2).

[0035] For example, among the rows of vacuum suction holes (110) arranged in the first direction (DR1), the row adjacent to the edge of the mobile chuck (11) may contain fewer vacuum suction holes (110) than the row placed in the center of the mobile chuck (11). Additionally, among the columns of vacuum suction holes (110) arranged in the second direction (DR2), the column adjacent to the edge of the mobile chuck (11) may contain fewer vacuum suction holes (110) than the column placed in the center of the mobile chuck (11). However, this is exemplary, and the arrangement of the vacuum suction holes (110) may be changed depending on the arrangement of the dies (218, see FIG. 5).

[0036] The shape of the vacuum suction holes (110) may be changed. For example, the vacuum suction holes (110) may have a shape corresponding to a circle. However, not limited thereto, the shape of the vacuum suction holes (110) may be changed depending on the area of ​​the dies (218, see FIG. 5) or the spacing between adjacent dies (218, see FIG. 5). The shape of the vacuum suction holes (110) will be described in detail in FIG. 8a through 8b.

[0037] The chuck base (12) may have a cylindrical shape. The thickness of the chuck base (12) may be thicker than the thickness of the mobile chuck (11). The chuck base (12) may be placed below the mobile chuck (11).

[0038] The mobile chuck (11) can be separated from the chuck base (12). When the arrangement of the dies (218, see FIG. 5) is changed, it may be necessary to replace the mobile chuck (11) with one that has vacuum suction holes (110) defined corresponding to the changed arrangement of the dies (218, see FIG. 5). In this case, the inspection process of the dies can be performed by replacing only the mobile chuck (11) without changing the chuck base (12). Accordingly, even if the arrangement shape of the dies (218, see FIG. 5) is changed, dies (218, see FIG. 5) having various arrangement shapes can be inspected quickly and easily.

[0039] The chuck base (12) can be placed directly on the lower surface of the mobile chuck (11). That is, the mobile chuck (11) can be placed directly on the upper surface of the chuck base (12). As the chuck base (12) comes into direct contact with the mobile chuck (11), heat generated from the dies (218, see FIG. 5) can be conducted to the mobile chuck (11) and the chuck base (12).

[0040] The chuck base (12) may include a temperature sensor (121) and a temperature controller (122). The chuck base (12) can measure the temperature of the dies (2187, see FIG. 5) by measuring the heat conducted from the dies (218, see FIG. 5) through the temperature sensor (121).

[0041] Additionally, the chuck base (12) can cool the dies (218, see FIG. 5) through the temperature controller (122) or heat the dies (218, see FIG. 5) by generating heat through the temperature controller (122). Although not illustrated, the temperature controller (122) may, by example, include a coolant channel and a heater. The temperature controller (122) can cool the dies through the coolant channel or heat the dies through the heater.

[0042]

[0043] FIG. 3 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0044] Referring to FIG. 3, the inspection equipment (2) may include a sorter chamber (21), a loader (22), and a test chamber (23). The sorter chamber (21) may place dies (218, FIG. 5) on a mobile chuck (11, FIG. 1).

[0045] The loader (22) can transfer the mobile chuck (11, see FIG. 1) from the sorter chamber (21) to the test chamber (23). The test chamber (23) can inspect the electrical characteristics of the dies (218, see FIG. 5) placed on the upper surface of the mobile chuck (11, see FIG. 1) using a probe card (217, see FIG. 7).

[0046] The process of placing dies (218, see FIG. 5) on the upper surface of a mobile chuck (11, see FIG. 1) in a sorter chamber (21), and the inspection of the electrical characteristic state of the dies (218, see FIG. 5) in a test chamber (23) will be described in detail below.

[0047]

[0048] FIGS. 4a through 4k are cross-sectional views illustrating the sorter chamber of FIG. 3. FIG. 5 is a plan view of the mobile chuck and dies shown in FIG. 4k.

[0049] For example, FIGS. 4a through 4k are cross-sectional views of a sorter chamber viewed from a second direction (DR2).

[0050] For example, FIGS. 4b through 4k are cross-sectional views illustrating the process of placing dies (218) on a mobile chuck (11).

[0051] Among the components shown in FIGS. 4a to 5, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0052] Referring to FIG. 4a, the sorter chamber (21) may include a first chamber (210), an upper base (211), a picker (212), a plurality of transfer units (213), a first lower base (214), a first chuck (215), and a second chuck (216). The first chamber (210) may define a receiving space (2101) inside. The upper base (211), the picker (212), the transfer units (213), the first lower base (214), the first chuck (215), and the second chuck (216) may be received in the receiving space (2101).

[0053] An entrance (2102) may be defined on one side adjacent to the first chuck (215) among the two sides of the first chamber (210) that are opposite each other in the first direction (DR1). The entrance (2102) may connect the outside of the first chamber (210) with the receiving space (2101). Accordingly, the film assembly (217, see FIG. 4b) and the mobile chuck (11, see FIG. 4g) may be provided to the receiving space (2101) through the entrance (2102).

[0054] The upper base (211) may be positioned on the upper side of the receiving space (2101). The upper base (211) may be positioned on the inner side of the first chamber (210) defining the receiving space (2101). The upper base (211) may be fixed to the inner side of the first chamber (210) to fix the fixed picker (212) and the transfer parts (213) so as to face the first chuck (215) and the second chuck (216) in the third direction (DR3).

[0055] The picker (212) is fixed to the upper base (211) and can face the first chuck (215) and the second chuck (216) in the third direction (DR3). The picker (212) can be moved back and forth in the third direction (DR3). As the picker (212) moves back and forth in the third direction (DR3), the distance between the picker (212) and the first chuck (215), and between the picker (212) and the second chuck (216) can be varied. Hereinafter, a direction parallel to the third direction (DR3) is defined as the upper direction, and a direction parallel to the opposite direction of the third direction (DR3) can be defined as the lower direction.

[0056] The transfer members (213) can be fixed to the upper base (211). For example, the transfer members (213) can be fixed to the upper base (211) in a first direction (DR1). The transfer members (213) can face each other in a third direction (DR3) with the first chuck (215) and the second chuck (216). The transfer members (213) can be reciprocated in the third direction (DR3). As the transfer members (213) reciprocate in the third direction (DR3), the distance between the transfer members (213) and the first chuck (215), and between the transfer members (213) and the second chuck (216) can be varied.

[0057] The first lower base (214) may be positioned at the bottom of the receiving space (2101). The first lower base (214) may be positioned below the picker (212) and the transfer units (213). The first lower base (214) may face the picker (212) and the transfer units (213) in a third direction (DR3).

[0058] The first lower base (214) can be reciprocated in the first direction (DR1). Accordingly, the first lower base (214) can be moved to overlap with the picker (212) or the transport units (213) in the third direction (DR3) or not overlap.

[0059] The first chuck (215) may be placed on the first lower base (214). For example, the first chuck (215) may be placed on the upper surface of the first lower base (214). As the first chuck (215) is connected to the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the first chuck (215) may reciprocate in the first direction (DR1).

[0060] The first chuck (215) may include a first support member (2151), a first stage (2152), and a plurality of first lifts (2153). The first support member (2151) may be disposed on the upper surface of the first lower base (214). The first support member (2151) may have a column shape extending in a third direction (DR3). The first support member (2151) may reciprocate in the third direction (DR3).

[0061] The first stage (2152) may be placed on the first support member (2151). As the first stage (2152) is placed on the first support member (2151), when the first support member (2151) moves back and forth in the third direction (DR3), the first stage (2152) may move back and forth in the third direction (DR3).

[0062] The upper surface of the first stage (2152) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). The upper surface of the first stage (2152) may support a film assembly (217, see FIG. 4b) and a mobile chuck (11, see FIG. 4g) to be described later.

[0063] The first lifts (2153) may be positioned around the first stage (2152). Although not illustrated, when viewed in a planar view, the first lifts (2152) may be positioned adjacent to the side of the first stage (2152).

[0064] The upper surface of the first lifts (2153) may be positioned below the upper surface of the first stage (2152). The height of the upper surface of the first lifts (2153) may be positioned below the height of the upper surface of the first stage (2152).

[0065] The first lifts (2153) can be reciprocated in the third direction (DR3). Although not illustrated, the first lifts (2153) can be connected to a separate cylinder to be reciprocated in the third direction (DR3).

[0066] The second chuck (216) may be placed on the first lower base (214). For example, the second chuck (216) may be placed on the upper surface of the first lower base (214). As the second chuck (216) is connected to the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the second chuck (216) may reciprocate in the first direction (DR1).

[0067] The first chuck (215) and the second chuck (216) may be arranged in the first direction (DR1). The first chuck (215) may be closer to the entrance (2102) than the second chuck (216).

[0068] The second chuck (216) may include a second support member (2161) and a second stage (2162). The second support member (2161) may have a columnar shape extending in a third direction (DR3). The second support member (2161) may move back and forth in the third direction (DR3). The movement of the second support member (2161) will be described in detail in FIG. 4f.

[0069] The second stage (2162) may be placed on the second support (2161). The upper surface of the second stage (2162) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The second stage (2162) may support a film assembly (217, see FIG. 5g).

[0070] Although not illustrated, the sorter chamber (21) may further include a sorter picker that aligns the dies (218, see FIG. 4k) when placing the dies (218, see FIG. 4k) described later onto the mobile chuck (11, see FIG. 4k).

[0071] Referring to FIG. 4b, a film assembly (217) and a plurality of dies (218) may be provided within a first chamber (210). The film assembly (217) and the dies (218) may be provided to a receiving space (2101) through an entrance (2102). The film assembly (217) may include a frame and a film placed on the frame. The dies (218) may be placed on the upper surface of the film.

[0072] The film assembly (217) provided in the receiving space (2101) may be provided on the first chuck (215). The film assembly (217) may be placed on the upper surface of the first stage (2152). The film assembly (217) may be placed on the first lifts (2153).

[0073] The upper surface of the film assembly (217) may have a predetermined adhesive force. Dies (218) may be placed on the film assembly (217). The film assembly (217) may secure the dies (218) with a predetermined adhesive force. Accordingly, the dies (218) may be prevented from detaching from the film assembly (217) due to external vibration or shock. Additionally, the adhesive force may have a strength adjusted so that the dies (218) can be easily separated from the film assembly (217).

[0074] Referring to FIG. 4c, the first lifts (2153) can be moved upward. As the first lifts (2153) move upward, the film assembly (217) and dies (218) placed on the first lifts (2153) can be moved upward.

[0075] The transfer units (213) can be moved downward from the upper base (211) toward the first lower base (214). As the transfer units (213) move downward and the film assembly (217) and dies (218) move upward, the distance between the film assembly (217) and the transfer units (213) can be reduced.

[0076] Referring to FIG. 4d, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the first chamber (210) that is spaced apart from the entrance (2102).

[0077] When the first lower base (214) moves in the first direction (DR1), the first chuck (215) and the second chuck (216) can be moved in the first direction (DR1). When the first chuck (215) moves in the first direction (DR1), the film assembly (217) and the dies (218) can be moved in the first direction (DR1) and placed under the transport units (213).

[0078] Referring to FIG. 4e, the transfer units (213) can lift opposite sides of the film assembly (217) in an upward direction in a first direction (DR1). The transfer units (213) can transfer the film assembly (217) and the dies (218) upward from the first chuck (215).

[0079] After the film assembly (217) and dies (218) are moved upward, the first lifts (2153) can be moved downward.

[0080] Referring to FIG. 4f, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0081] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and placed under the transfer sections (213).

[0082] After the second chuck (216) is placed below the transfer sections (213), the second support section (2161) can be moved upward. When the second support section (2161) is moved upward, the second stage (2162) can be moved upward. As the second stage (2162) moves upward, the distance to the third direction (DR3) between the transfer sections (213) and the second stage (2162) can be reduced.

[0083] The second stage (2162) moves upward toward the film assembly (217) so that the upper surface of the second stage (2162) can come into contact with the lower surface of the film assembly (217). The second stage (2162) can support the film assembly (217). The second stage (2162) can support dies (218) placed on the film assembly (217).

[0084] Referring to FIG. 4g, after the film assembly (217) and dies (218) are placed on the upper surface of the second stage (2162), the second support (2161) and the second stage (2162) can be moved downward.

[0085] The mobile chuck (11) may be provided within the first chamber (210). The mobile chuck (11) may be provided in the receiving space (2101) through the entrance (2102). When the film assembly (217) is placed on the upper surface of the second stage (2162), the mobile chuck (11) may be provided on the upper surface of the first stage (2152). The mobile chuck (11) may be placed on the first lifts (2153).

[0086] Referring to FIG. 4h, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0087] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and overlap with the picker (212) in the third direction (DR3).

[0088] Referring to FIGS. 4i and 4j, the picker (212) can be moved downward. The picker (212) can be moved toward the film assembly (217) and the dies (218).

[0089] At least one of the second support (2161) or the picker (212) can be moved in a third direction (DR3). For example, the second support (2161) can be moved in an upward direction. When the second support (2161) is moved in an upward direction, the second stage (2162) can be moved in an upward direction. When the second stage (2162) is moved in an upward direction, the film assembly (217) and dies (218) placed on the upper surface of the second stage (2162) can be moved in an upward direction.

[0090] However, not limited thereto, the second support member (216) may be fixed, and the picker (212) may be moved downward toward the second support member (216). Additionally, the picker (212) may be fixed, and the second support member (216) may be moved upward toward the picker (212).

[0091] When the film assembly (217) and the dies (218) move in an upward direction, the distance in the third direction (DR3) between the dies (218) and the picker (212) can be reduced. The picker (212) can come into contact with the dies (218). The picker (212) can adsorb the dies (218). When the picker (212) adsorbs the dies (218), the second chuck (216) and the film assembly (217) can move in a downward direction. Accordingly, the dies (218) can be separated from the film assembly (217).

[0092] Referring to FIG. 4k, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the chamber.

[0093] The first chuck (215) placed on the first lower base (214) and the mobile chuck (11) placed on the first chuck (215) can be moved in the first direction (DR1). The mobile chuck (11) can be moved in the first direction (DR1) and placed under the picker (212).

[0094] After the mobile chuck (11) is placed below the picker (212), the first support member (2151) can be moved upward. When the first support member (2151) is moved upward, the first stage (2152) and the mobile chuck (11) placed on the first stage (2152) can be moved upward. The distance in the third direction (DR3) between the upper surface of the mobile chuck (11) and the picker (212) can be reduced.

[0095] FIG. 5 is a plan view illustrating the mobile chuck and dies placed on the upper surface of the mobile chuck as illustrated in FIG. 4k.

[0096] Among the components shown in FIG. 5, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0097] Referring to FIG. 4k and FIG. 5, the upper surface of the mobile chuck (11) may come into contact with dies (218) adsorbed to the picker (212). After the dies (218) come into contact with the upper surface of the mobile chuck (11), the picker (212) may place the dies (218) on the upper surface of the mobile chuck (11). The dies (218) may be placed directly on the upper surface of the mobile chuck (11).

[0098] Dies (218) can be placed on vacuum suction holes (110). Dies (218) can be arranged to correspond to the arrangement of vacuum suction holes (110). That is, each die (218) can be placed on a corresponding vacuum suction hole (110) among the vacuum suction holes (110).

[0099] For example, in FIG. 5, the number of vacuum suction holes (110) and the number of dies (218) are the same, but are not limited thereto, and multiple dies (218) may be arranged on a single vacuum suction hole (110). Additionally, a single die (218) may be arranged on multiple vacuum suction holes (110).

[0100] When the die (218) overlaps with the vacuum suction holes (110), a vacuum pump connected to the outside of the mobile chuck (11) can operate to convert the vacuum suction holes (110) into a vacuum state. Accordingly, the die (218) can be fixed on the upper surface of the mobile chuck (11).

[0101]

[0102] FIG. 6 is a plan view illustrating a mobile chuck being transported by a loader.

[0103] Among the components shown in FIG. 6, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0104] Referring to FIG. 4k and FIG. 6, after the dies (218) are placed on the upper surface of the mobile chuck (11), the mobile chuck (11) and the dies (218) can be discharged from the receiving space (2101) by a loader (22). The mobile chuck (11) and the dies (218) can be discharged from the first chamber (210) through the entrance (2102).

[0105] The mobile chuck (11) and dies (218) can be transferred from the sorter chamber (21) to the test chamber (23). Although not illustrated, a vacuum pump may be connected to the mobile chuck (11), and the vacuum suction holes (110) may be maintained in a vacuum state. Accordingly, the position of the dies (218) can be prevented from shifting due to shaking or impact occurring during the transfer process.

[0106]

[0107] Figure 7 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0108] For example, FIG. 7 is a cross-sectional view of the test chamber (23) viewed from the second direction (DR2).

[0109] Among the components shown in FIG. 7, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0110] Referring to FIG. 7, the test chamber (23) may include a second chamber (230), a second lower base (231), a third support (232), a probe card (233), and a probe tip (234). The second chamber (230) may define a space capable of accommodating the second lower base (231), the third support (232), the probe card (233), and the probe tip (234).

[0111] The second lower base (231) may be positioned at the bottom within the second chamber (230). The second lower base (231) may be positioned on the bottom surface of the second chamber (230).

[0112] The third support member (232) may be placed on the second lower base (231). The third support member (232) may reciprocate in the third direction (DR3) on the second lower base (231).

[0113] The chuck base (12) can be placed on the third support (232). The mobile chuck (11) can be placed on the chuck base (12) by a loader (22, see FIG. 6). The mobile chuck (11) can be placed directly on the upper surface of the chuck base (12).

[0114] As the chuck base (12) and the mobile chuck (11) are in direct contact and the dies (218) are in direct contact with the mobile chuck (11), heat generated from the dies (218) can be conducted to the mobile chuck (11) and the chuck base (12). A temperature sensor (121, see FIG. 1) on the chuck base (12) can measure the conducted heat to measure the temperature of the dies (218). Accordingly, the temperature of the dies (218) can be measured more accurately through the temperature sensor (121, see FIG. 1).

[0115] Additionally, when the dies (218) are heated or cooled using the temperature controller (122) for testing, the heat transfer efficiency between the temperature controller (122) and the dies (218) can be improved.

[0116] The probe card (233) may be positioned above the second lower base (231) and the third support (232) within the second chamber (230). The probe card (233) may face the second lower base (231) and the third support (232) in a third direction (DR3).

[0117] The probe tip (234) may be placed on the lower surface of the probe card (233) facing the second lower base (231). The probe tip (234) may extend downward from the probe card (233).

[0118] The probe card (233) may be a device that connects the dies (218) and a tester (not shown) to check the operation of the dies (218). After the probe tip (234) connected to the probe card (233) contacts the dies (218), it can determine whether the dies (218) are defective based on the signal that returns after sending electricity to the dies (218).

[0119] When the third support member (232) moves upward, the chuck base (12) and the mobile chuck (11) can be moved upward. Accordingly, the dies (218) placed on the upper surface of the mobile chuck (11) can be tested by contacting the probe tip (234).

[0120] For example, in FIG. 7, one probe tip (234) is shown, but is not limited thereto, and multiple probe tips (234) may be provided, and multiple probe tips (234) may simultaneously contact the dies (218).

[0121] The mobile chuck (11) can be separated from the chuck base (12). Accordingly, while the dies (218) placed on the upper surface of the mobile chuck (11) are being tested, the process of placing the dies (218) on another mobile chuck (11) can be carried out simultaneously within the sorter chamber (21, see FIG. 3). As shown in FIG. 7, when the testing of the dies (218) is finished, the mobile chuck (11) is removed from the chuck base (12), and another mobile chuck (11) and other dies (218) can be placed sequentially in time on the chuck base (12). Accordingly, the inspection time of the dies (218) can be shortened.

[0122]

[0123] FIGS. 8A and FIGS. 8B are plan views illustrating vacuum adsorption holes according to one embodiment of the present invention.

[0124] Among the components shown in FIGS. 8a and 8b, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0125] Referring to FIGS. 8a and 8b, the shape of the vacuum suction holes (110a, 110b) can be changed according to the size of the dies (218, see FIG. 5). For example, it can be changed to the shape of the vacuum suction holes (110a) shown in FIG. 8a, or the shape of the vacuum suction holes (110b) shown in FIG. 8b.

[0126] As the shape of the vacuum suction holes (110a, 110b) changes, the area of ​​the dies (218, see FIG. 5) changes, but the dies (218, see FIG. 5) can be stably fixed to the mobile chuck (11, see FIG. 7).

[0127]

[0128] Although embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification. Those skilled in the art who understand the spirit of the present invention may easily propose other embodiments within the scope of the same spirit by adding, changing, deleting, or adding components, and such embodiments shall also be considered to fall within the scope of the spirit of the present invention.

[0129] Dies can be provided in each test space while placed on a mobile chuck. Accordingly, a separate space for placing dies on the chuck in each test space can be omitted, and since the volume of the test space can be reduced, the present invention has high industrial applicability.

Claims

1. A mobile chuck supporting multiple dies; and It includes a chuck base positioned below the mobile chuck to support the mobile chuck, and A plurality of vacuum suction holes for adsorbing the dies are defined on the upper surface of the mobile chuck, and The above-mentioned mobile chuck and the above-mentioned chuck base are separable chucks for die level testing.

2. In Paragraph 1, The above dies are a chuck for die level testing that is placed directly on the upper surface of the mobile chuck.

3. In Paragraph 1, The above vacuum adsorption holes are arranged in multiple rows and multiple columns, and A chuck for die level testing in which the above rows correspond to a first direction and the above columns correspond to a second direction intersecting the first direction.

4. In Paragraph 3, The above vacuum suction holes are a chuck for die level testing arranged in correspondence with the arrangement of the above dies.

5. In Paragraph 1, The above mobile chuck is a chuck for die level testing that is placed directly on the upper surface of the chuck base.

6. In Paragraph 5, The above chuck base includes a temperature sensor, and the temperature sensor is a chuck for die level testing that measures the temperature of the mobile chuck.

7. In Paragraph 5, The above chuck base includes a heater, and the heater is a chuck for die level testing that heats the mobile chuck.

8. In Paragraph 5, The above chuck base includes a cooler, and The above chuck base is a chuck for die level testing that cools the above mobile chuck.

9. In Paragraph 1, The above vacuum suction hole is a die level test chuck that is converted to a vacuum state when the dies are placed on the upper surface of the mobile chuck.

10. In Paragraph 1, A chuck for die level testing in which the size of the above vacuum adsorption holes is proportional to the area of ​​the above dies.

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