Chuck for die level test and die level test equipment comprising same

Abstract

The chuck for a die level test comprises: a mobile chuck supporting a plurality of dies; and a chuck base disposed under the mobile chuck, wherein the mobile chuck may include a plate having a plurality of vacuum suction holes defined therein, and partition walls disposed on the upper surface of the plate and surrounding at least one vacuum suction hole in plan view.

Description

Chuck for die level testing and die level testing equipment including the same

[0001] The present invention relates to a chuck for die level testing and a die level testing device including the same.

[0002] After the manufacturing process is completed, the quality of semiconductor devices is determined through electrical characteristic testing. During this process, the die under test is loaded into test equipment, and the test is performed through contact with each probe tip of a probe card.

[0003] As an example of a test, the probe tip contacts the electrode pad or solder bump of the die and determines electrical characteristics such as conduction status by applying a test signal to the electrical circuit connected to each electrode.

[0004] When inspection is performed with the die placed on a frame and a film placed on the frame, problems may arise regarding the range limitations of the inspection temperature and the inability to precisely control the heat due to thermal resistance caused by the film.

[0005] In addition, when a die is transferred from a film onto a chuck containing a coolant channel to perform various types of tests, space for a frame and space for a module to be placed in each test space may be required. Consequently, the volume occupied by the test space may increase.

[0006] In addition, when the dies are transferred onto the chuck, the relative positions between adjacent dies must be fixed. That is, they must be fixed in preset positions to ensure stable contact with the probe tip.

[0007] The object of the present invention is to provide a die level test chuck comprising bulkheads surrounding a plurality of dies and a die level test equipment comprising the same.

[0008] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art to which the present invention pertains from the description below.

[0009] A chuck for die level testing according to one embodiment of the present invention includes a mobile chuck that supports a plurality of dies and a chuck base disposed below the mobile chuck, and the mobile chuck may include a plate in which a plurality of vacuum suction holes are defined, and a partition wall disposed on the upper surface of the plate and surrounding at least one vacuum suction hole when viewed in a planar view.

[0010] A die level test equipment according to one embodiment of the present invention comprises a chamber in which an inspection space is defined internally, a mobile chuck including partitions disposed in the inspection space and defining a groove in which dies are disposed, a chuck base disposed below the mobile chuck, and a probe tip disposed on the mobile chuck and including an inspection tip and a probe partition adjacent to the inspection tip, wherein when the inspection tip contacts any one of the dies, any one of the partitions and the probe partition may contact each other.

[0011] According to one embodiment of the present invention, the mobile chuck may include bulkheads. The dies may be enclosed and fixed by the bulkheads. Accordingly, misalignment of the dies can be prevented.

[0012] According to one embodiment of the present invention, the bulkheads of the mobile chuck are in contact with the probe bulkheads to seal the dies. Accordingly, gas injection to prevent arc generation can be facilitated.

[0013] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

[0014] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention.

[0015] Figure 2 is a plan view of the mobile chuck shown in Figure 1.

[0016] FIG. 3 is a cross-sectional view of the bulkheads and plates corresponding to the line I-I' shown in FIG. 2.

[0017] FIG. 4 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0018] FIGS. 5a through 5k are cross-sectional views illustrating the sorter chamber of FIG. 4. FIG. 6 is a plan view of the mobile chuck and dies shown in FIG. 5k.

[0019] FIG. 6 is a plan view illustrating the mobile chuck and dies placed on the upper surface of the mobile chuck as illustrated in FIG. 5k.

[0020] FIG. 7 is a plan view illustrating a mobile chuck being transported by a loader.

[0021] Figure 8 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0022] FIG. 9 is a plan view of a mobile chuck according to one embodiment of the present invention.

[0023] FIG. 10 is a cross-sectional view of a bulkhead corresponding to the line II-II' shown in FIG. 9.

[0024] FIG. 11 is a plan view of a mobile chuck according to one embodiment of the present invention.

[0025] FIG. 12 is a cross-sectional view of a mobile chuck and a die corresponding to the line III-III' shown in FIG. 11.

[0026] FIG. 13 is a plan view of a mobile chuck according to one embodiment of the present invention.

[0027] The configuration illustrated in the image corresponds to a preferred embodiment of the present invention and does not represent all technical ideas of the present invention; therefore, various equivalents and modifications that may replace the configuration may exist at the time of filing the present invention.

[0028] In the following description, descriptions of some components may be omitted to clarify the features of the present invention.

[0029] In the following description, the term "connection" refers to one or more members being connected to each other in a manner that allows for fluid communication. In one embodiment, the connection may be formed by members such as a conduit, a pipe, or a piping system. In the following description, the term "connection" may be used interchangeably with the meaning that one or more members are "fluidly connected" to each other.

[0030] In the following description, the term "conduction" means that one or more components are connected to each other to transmit current or electrical signals. In one embodiment, the conduction may be formed in a wired form by a conductor member, etc., or in a wireless form such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may include the meaning of "communication."

[0031] As used in the following description, the term "fluid" refers to any form of substance that flows due to an external force and whose shape or volume, etc., can be deformed. In one embodiment, the fluid may be a liquid such as water or a gas such as air.

[0032] The terms "upper side," "lower side," "left side," "right side," "front side," and "rear side" used in the following description shall be understood by referring to the coordinate system depicted throughout the attached drawings.

[0033]

[0034] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2 is a plan view of the mobile chuck shown in FIG. 1. FIG. 3 is a cross-sectional view of bulkheads and plates corresponding to the line I-I' shown in FIG. 2.

[0035] Referring to FIGS. 1 and 2, a chuck (1) for die level testing may include a mobile chuck (11) and a chuck base (12). For example, the mobile chuck (11) may have a disc shape. However, this is exemplary and the shape of the mobile chuck (11) is not limited thereto.

[0036] The mobile chuck (11) may include a plate (110) and a plurality of partitions (111). The plate (110) may have a disc shape. The upper surface of the plate (110) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1). However, the shape of the plate (110) is not limited thereto.

[0037] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the front and back surfaces of each member. In this specification, "on a plane" may be defined as a state viewed from the third direction (DR3). Hereinafter, the first to third directions (DR1, DR2, DR3) refer to the same reference numeral in the direction indicated by the first to third direction axes, respectively.

[0038] A plurality of vacuum suction holes (110a) may be defined on the upper surface of the plate (110). The vacuum suction holes (110a) are connected to an external vacuum pump, and when the vacuum pump is operated, the vacuum suction holes (110a) can be converted to a vacuum state. Accordingly, a plurality of dies (218, see FIG. 6) to be described later can be fixed on the upper surface of the mobile chuck (11).

[0039] The vacuum adsorption holes (110a) may be arranged in a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). The vacuum adsorption holes (110a) may be arranged in multiple rows and multiple columns. The rows may correspond to the first direction (DR1), and the columns may correspond to the second direction (DR2).

[0040] For example, among the rows of vacuum suction holes (110a) arranged in the first direction (DR1), the row adjacent to the edge of the mobile chuck (11) may contain fewer vacuum suction holes (110a) than the row placed in the center of the mobile chuck (11). Additionally, among the columns of vacuum suction holes (110a) arranged in the second direction (DR2), the column adjacent to the edge of the mobile chuck (11) may contain fewer vacuum suction holes (110a) than the column placed in the center of the mobile chuck (11). However, this is exemplary, and the arrangement of the vacuum suction holes (110a) may also change depending on the arrangement of the dies (218, see FIG. 6).

[0041] The shape of the vacuum suction holes (110a) may be changed. For example, the vacuum suction holes (110a) may have a shape corresponding to a circle. However, it is not limited thereto, and the shape of the vacuum suction holes (110a) may be changed depending on the area of ​​the dies (218, see FIG. 6) or the spacing between adjacent dies (218, see FIG. 6).

[0042] Referring to FIGS. 1 to 3, a plurality of partitions (111) may be disposed on the upper surface of the plate (110). For example, the partitions (111) may have a square frame shape. A groove (111a) may be defined by the partitions (111).

[0043] The partitions (111) may surround at least one vacuum suction hole (110a) defined on the upper surface of the plate (110). For example, when viewed in a planar view, each of the partitions (111) may be positioned adjacent to a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a). The partitions (111) may be arranged in a first direction (DR1) and a second direction (DR2). When viewed in a planar view, each of the partitions (111) may surround a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a).

[0044] Dies (218, see FIG. 6) can be placed on vacuum suction holes (110a) within the groove (111a). When viewed in a planar view, the partitions (111) can surround the dies (218, see FIG. 6). Accordingly, the partitions (111) can prevent the position of the dies (218, see FIG. 6) from changing. Thus, the alignment of the dies (218, see FIG. 6) can be prevented. The fixation of the dies (218, see FIG. 6) by the partitions (111) will be described in detail below.

[0045] Referring to FIG. 1, the chuck base (12) may have a cylindrical shape. The thickness of the chuck base (12) may be thicker than the thickness of the mobile chuck (11).

[0046] The chuck base (12) can be placed below the mobile chuck (11). The mobile chuck (11) can be separated from the chuck base (12). If the arrangement of the dies (218, see FIG. 6) is changed, it may be necessary to replace the mobile chuck (11) with one in which vacuum suction holes (110a) corresponding to the changed arrangement of the dies (218, see FIG. 6) are defined. In this case, the inspection process of the dies can be performed by replacing only the mobile chuck (11) without changing the chuck base (12). Accordingly, even if the arrangement shape of the dies (218, see FIG. 6) is changed, dies (218, see FIG. 6) having various arrangement shapes can be inspected quickly and easily.

[0047] The chuck base (12) can be placed directly on the lower surface of the mobile chuck (11). That is, the mobile chuck (11) can be placed directly on the upper surface of the chuck base (12). As the chuck base (12) comes into direct contact with the mobile chuck (11), heat generated from the dies (218, see FIG. 6) can be conducted to the mobile chuck (11) and the chuck base (12).

[0048] The chuck base (12) may include a temperature sensor (121) and a temperature controller (122). The chuck base (12) can measure the temperature of the dies (2187, see FIG. 6) by measuring the heat conducted from the dies (218, see FIG. 6) through the temperature sensor (121).

[0049] Additionally, the chuck base (12) can cool the dies (218, see FIG. 6) through the temperature controller (122) or heat the dies (218, see FIG. 6) by generating heat through the temperature controller (122). Although not illustrated, the temperature controller (122) may, by example, include a coolant channel and a heater. The temperature controller (122) can cool the dies through the coolant channel or heat the dies through the heater.

[0050]

[0051] FIG. 4 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0052] Referring to FIG. 4, the inspection equipment (2) may include a sorter chamber (21), a loader (22), and a test chamber (23). The sorter chamber (21) may place dies (218, FIG. 6) on a mobile chuck (11, FIG. 1).

[0053] The loader (22) can transfer the mobile chuck (11, see FIG. 1) from the sorter chamber (21) to the test chamber (23). The test chamber (23) can inspect the electrical characteristics of the dies (218, see FIG. 6) placed on the upper surface of the mobile chuck (11, see FIG. 1) using a probe tip (234, see FIG. 8).

[0054] The process of placing dies (218, see FIG. 6) on the upper surface of a mobile chuck (11, see FIG. 1) in a sorter chamber (21), and the inspection of the electrical characteristic state of the dies (218, see FIG. 6) in a test chamber (23) will be described in detail below.

[0055]

[0056] FIGS. 5a through 5k are cross-sectional views illustrating the sorter chamber of FIG. 4. FIG. 6 is a plan view of the mobile chuck and dies shown in FIG. 5k.

[0057] For example, FIGS. 5a through 5k are cross-sectional views of a sorter chamber viewed from a second direction (DR2).

[0058] For example, FIGS. 5b through 5k are cross-sectional views illustrating the process of placing dies (218) on a mobile chuck (11).

[0059] Among the components shown in FIGS. 5a to 6, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0060] Referring to FIG. 5a, the sorter chamber (21) may include a first chamber (210), an upper base (211), a picker (212), a plurality of transfer units (213), a first lower base (214), a first chuck (215), and a second chuck (216). The first chamber (210) may define a receiving space (2101) inside. The upper base (211), the picker (212), the transfer units (213), the first lower base (214), the first chuck (215), and the second chuck (216) may be received in the receiving space (2101).

[0061] An entrance (2102) may be defined on one side adjacent to the first chuck (215) among the two sides of the first chamber (210) that are opposite each other in the first direction (DR1). The entrance (2102) may connect the outside of the first chamber (210) with the receiving space (2101). Accordingly, the film assembly (217, see FIG. 5b) and the mobile chuck (11, see FIG. 5g) may be provided to the receiving space (2101) through the entrance (2102).

[0062] The upper base (211) may be positioned on the upper side of the receiving space (2101). The upper base (211) may be positioned on the inner side of the first chamber (210) defining the receiving space (2101). The upper base (211) may be fixed to the inner side of the first chamber (210) to fix the fixed picker (212) and the transfer parts (213) so as to face the first chuck (215) and the second chuck (216) in the third direction (DR3).

[0063] The picker (212) is fixed to the upper base (211) and can face the first chuck (215) and the second chuck (216) in the third direction (DR3). The picker (212) can be moved back and forth in the third direction (DR3). As the picker (212) moves back and forth in the third direction (DR3), the distance between the picker (212) and the first chuck (215), and between the picker (212) and the second chuck (216) can be varied. Hereinafter, a direction parallel to the third direction (DR3) is defined as the upper direction, and a direction parallel to the opposite direction of the third direction (DR3) can be defined as the lower direction.

[0064] The transfer members (213) can be fixed to the upper base (211). For example, the transfer members (213) can be fixed to the upper base (211) in a first direction (DR1). The transfer members (213) can face each other in a third direction (DR3) with the first chuck (215) and the second chuck (216). The transfer members (213) can be reciprocated in the third direction (DR3). As the transfer members (213) reciprocate in the third direction (DR3), the distance between the transfer members (213) and the first chuck (215), and between the transfer members (213) and the second chuck (216) can be varied.

[0065] The first lower base (214) may be positioned at the bottom of the receiving space (2101). The first lower base (214) may be positioned below the picker (212) and the transfer units (213). The first lower base (214) may face the picker (212) and the transfer units (213) in a third direction (DR3).

[0066] The first lower base (214) can be reciprocated in the first direction (DR1). Accordingly, the first lower base (214) can be moved to overlap with the picker (212) or the transport units (213) in the third direction (DR3) or not overlap.

[0067] The first chuck (215) may be placed on the first lower base (214). For example, the first chuck (215) may be placed on the upper surface of the first lower base (214). As the first chuck (215) is connected to the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the first chuck (215) may reciprocate in the first direction (DR1).

[0068] The first chuck (215) may include a first support member (2151), a first stage (2152), and a plurality of first lifts (2153). The first support member (2151) may be disposed on the upper surface of the first lower base (214). The first support member (2151) may have a column shape extending in a third direction (DR3). The first support member (2151) may reciprocate in the third direction (DR3).

[0069] The first stage (2152) may be placed on the first support member (2151). As the first stage (2152) is placed on the first support member (2151), when the first support member (2151) moves back and forth in the third direction (DR3), the first stage (2152) may move back and forth in the third direction (DR3).

[0070] The upper surface of the first stage (2152) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). The upper surface of the first stage (2152) may support a film assembly (217, see FIG. 5b) and a mobile chuck (11, see FIG. 5g) to be described later.

[0071] The first lifts (2153) may be positioned around the first stage (2152). Although not illustrated, when viewed in a planar view, the first lifts (2152) may be positioned adjacent to the side of the first stage (2152).

[0072] The upper surface of the first lifts (2153) may be positioned below the upper surface of the first stage (2152). The height of the upper surface of the first lifts (2153) may be positioned below the height of the upper surface of the first stage (2152).

[0073] The first lifts (2153) can be reciprocated in the third direction (DR3). Although not illustrated, the first lifts (2153) can be connected to a separate cylinder to be reciprocated in the third direction (DR3).

[0074] As the second chuck (216) is connected to the first lower base (214), when the first lower base (214) moves back and forth in the first direction (DR1), the second chuck (216) can also move back and forth in the first direction (DR1).

[0075] The second chuck (216) may include a second support member (2161) and a second stage (2162). The second support member (2161) may have a columnar shape extending in a third direction (DR3). The second support member (2161) may reciprocate in the third direction (DR3). The movement of the second support member (2161) will be described in detail in FIG. 5f.

[0076] The second stage (2162) may be placed on the second support (2161). The upper surface of the second stage (2162) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The second stage (2162) may support a film assembly (217, see FIG. 5g).

[0077] Although not illustrated, the sorter chamber (21) may further include a sorter picker that aligns the dies (218, see FIG. 5k) when placing the dies (218, see FIG. 5k) described later onto the mobile chuck (11, see FIG. 5k).

[0078] Referring to FIG. 5b, a film assembly (217) and a plurality of dies (218) may be provided within a first chamber (210). The film assembly (217) and the dies (218) may be provided to a receiving space (2101) through an entrance (2102). The film assembly (217) may include a frame and a film placed on the frame. The dies (218) may be placed on the upper surface of the film.

[0079] The film assembly (217) provided in the receiving space (2101) may be provided on the first chuck (215). The film assembly (217) may be placed on the upper surface of the first stage (2152). The film assembly (217) may be placed on the first lifts (2153).

[0080] The upper surface of the film assembly (217) may have a predetermined adhesive force. Dies (218) may be placed on the film assembly (217). The film assembly (217) may secure the dies (218) with a predetermined adhesive force. Accordingly, the dies (218) may be prevented from detaching from the film assembly (217) due to external vibration or shock. Additionally, the adhesive force may have a strength adjusted so that the dies (218) can be easily separated from the film assembly (217).

[0081] Referring to FIG. 5c, the first lifts (2153) can be moved upward. As the first lifts (2153) move upward, the film assembly (217) and dies (218) placed on the first lifts (2153) can be moved upward.

[0082] The transfer units (213) can be moved downward from the upper base (211) toward the first lower base (214). As the transfer units (213) move downward and the film assembly (217) and dies (218) move upward, the distance between the film assembly (217) and the transfer units (213) can be reduced.

[0083] Referring to FIG. 5d, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the first chamber (210) that is spaced apart from the entrance (2102).

[0084] When the first lower base (214) moves in the first direction (DR1), the first chuck (215) and the second chuck (216) can be moved in the first direction (DR1). When the first chuck (215) moves in the first direction (DR1), the film assembly (217) and the dies (218) can be moved in the first direction (DR1) and placed under the transport units (213).

[0085] Referring to FIG. 5e, the transfer units (213) can lift opposite sides of the film assembly (217) in an upward direction in a first direction (DR1). The transfer units (213) can transfer the film assembly (217) and the dies (218) upward from the first chuck (215).

[0086] After the film assembly (217) and dies (218) are moved upward, the first lifts (2153) can be moved downward.

[0087] Referring to FIG. 5f, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0088] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and placed under the transfer sections (213).

[0089] After the second chuck (216) is placed below the transfer sections (213), the second support section (2161) can be moved upward. When the second support section (2161) is moved upward, the second stage (2162) can be moved upward. As the second stage (2162) moves upward, the distance to the third direction (DR3) between the transfer sections (213) and the second stage (2162) can be reduced.

[0090] The second stage (2162) moves upward toward the film assembly (217) so that the upper surface of the second stage (2162) can come into contact with the lower surface of the film assembly (217). The second stage (2162) can support the film assembly (217). The second stage (2162) can support dies (218) placed on the film assembly (217).

[0091] Referring to FIG. 5g, after the film assembly (217) and dies (218) are placed on the upper surface of the second stage (2162), the second support (2161) and the second stage (2162) can be moved downward.

[0092] The mobile chuck (11) may be provided within the first chamber (210). The mobile chuck (11) may be provided in the receiving space (2101) through the entrance (2102). When the film assembly (217) is placed on the upper surface of the second stage (2162), the mobile chuck (11) may be provided on the upper surface of the first stage (2152). The mobile chuck (11) may be placed on the first lifts (2153).

[0093] Referring to FIG. 5h, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0094] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and overlap with the picker (212) in the third direction (DR3).

[0095] Referring to FIGS. 5i and 5j, the picker (212) can be moved downward. The picker (212) can be moved toward the film assembly (217) and the dies (218).

[0096] At least one of the second support (2161) or the picker (212) can be moved in a third direction (DR3). For example, the second support (2161) can be moved in an upward direction. When the second support (2161) is moved in an upward direction, the second stage (2162) can be moved in an upward direction. When the second stage (2162) is moved in an upward direction, the film assembly (217) and dies (218) placed on the upper surface of the second stage (2162) can be moved in an upward direction.

[0097] However, not limited thereto, the second support member (216) may be fixed, and the picker (212) may be moved downward toward the second support member (216). Additionally, the picker (212) may be fixed, and the second support member (216) may be moved upward toward the picker (212).

[0098] When the film assembly (217) and the dies (218) move in an upward direction, the distance in the third direction (DR3) between the dies (218) and the picker (212) can be reduced. The picker (212) can come into contact with the dies (218). The picker (212) can adsorb the dies (218). When the picker (212) adsorbs the dies (218), the second chuck (216) and the film assembly (217) can move in a downward direction. Accordingly, the dies (218) can be separated from the film assembly (217).

[0099] Referring to FIG. 5k, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the chamber.

[0100] The first chuck (215) placed on the first lower base (214) and the mobile chuck (11) placed on the first chuck (215) can be moved in the first direction (DR1). The mobile chuck (11) can be moved in the first direction (DR1) and placed under the picker (212).

[0101] After the mobile chuck (11) is placed below the picker (212), the first support member (2151) can be moved upward. When the first support member (2151) is moved upward, the first stage (2152) and the mobile chuck (11) placed on the first stage (2152) can be moved upward. The distance in the third direction (DR3) between the upper surface of the mobile chuck (11) and the picker (212) can be reduced.

[0102]

[0103] FIG. 6 is a plan view illustrating the mobile chuck and dies placed on the upper surface of the mobile chuck as illustrated in FIG. 5k.

[0104] Among the components shown in FIG. 6, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0105] Referring to FIG. 5k and FIG. 6, the dies (218) may be placed within grooves (111a) defined by partitions (111). The shape of the grooves (111a) may correspond to the shape of the dies (218). For example, the shape of the grooves (111a) may be a shape corresponding to a rectangle.

[0106] When viewed in a planar view, the bulkheads (111) can surround the dies (218). As the bulkheads (111) surround the dies (217), the position of the dies (218) can be fixed inside the grooves (111a) by the bulkheads (111). Accordingly, the alignment of the dies (218) can be prevented.

[0107] The upper surface of the plate (110) may come into contact with dies (218) adsorbed to the picker (212). The picker (212) may place the dies (218) on the upper surface of the plate (110). The dies (218) may be placed directly on the upper surface of the plate (110).

[0108] Dies (218) can be placed on vacuum suction holes (110a). Each die (218) can be placed on a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a).

[0109] When the die (218) overlaps with the vacuum suction holes (110a), a vacuum pump connected to the outside of the mobile chuck (11) can operate to convert the vacuum suction holes (110a) into a vacuum state. Accordingly, the die (218) can be fixed on the upper surface of the mobile chuck (11).

[0110]

[0111] FIG. 7 is a plan view illustrating a mobile chuck being transported by a loader.

[0112] Among the components shown in FIG. 7, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0113] Referring to FIG. 5k and FIG. 7, after the dies (218) are placed on the upper surface of the mobile chuck (11), the mobile chuck (11) and the dies (218) can be discharged from the receiving space (2101) by a loader (22). The mobile chuck (11) and the dies (218) can be discharged from the first chamber (210) through the entrance (2102).

[0114] The mobile chuck (11) and dies (218) can be transferred from the sorter chamber (21) to the test chamber (23). Although not illustrated, a vacuum pump may be connected to the mobile chuck (11), and the vacuum suction holes (110a) may be maintained in a vacuum state. Additionally, the dies (218) may be fixed on the upper surface of the plate (110, see FIG. 6) by partitions (111, see FIG. 6). Accordingly, the position of the dies (218) can be prevented from shifting due to shaking or impact occurring during the transfer process.

[0115]

[0116] Figure 8 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0117] For example, FIG. 8 is a cross-sectional view of the test chamber (23) viewed from the second direction (DR2).

[0118] Among the components shown in FIG. 8, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0119] Referring to FIG. 8, the test chamber (23) may include a second chamber (230), a second lower base (231), a third support (232), a probe card (233), and a probe tip (234). The second chamber (230) may define an inspection space (2301) capable of accommodating the second lower base (231), the third support (232), the probe card (233), and the probe tip (234). The second chamber (230) may be referred to as the chamber (230).

[0120] The second lower base (231) may be positioned at the bottom within the second chamber (230). The second lower base (231) may be positioned on the bottom surface of the second chamber (230).

[0121] The third support member (232) may be placed on the second lower base (231). The third support member (232) may reciprocate in the third direction (DR3) on the second lower base (231).

[0122] The chuck base (12) can be placed on the third support (232). The mobile chuck (11) can be placed on the chuck base (12) by a loader (22, see FIG. 7). The mobile chuck (11) can be placed directly on the upper surface of the chuck base (12).

[0123] The probe card (233) may be positioned above the second lower base (231) and the third support (232) within the second chamber (230). The probe card (233) may face the second lower base (231) and the third support (232) in a third direction (DR3).

[0124] The probe tip (234) may be placed on the lower surface of the probe card (233) facing the second lower base (231). The probe tip (234) may extend downward from the probe card (233).

[0125] The probe tip (234) may include a body portion (2341), a probe partition (2342), and an inspection pin (2344). The body portion (2341) may extend in a third direction (DR3) from the probe card (233). The probe partition (2342) may extend in a third direction (DR3) from the body portion (2341). When viewed from a second direction (DR2), the probe partition (2342) may extend in a third direction (DR3) from the lower surface of the body portion (2341) facing the mobile chuck (11). Although the probe partition (2342) is shown as a plurality in FIG. 8, substantially the probe partition (2342) may be formed integrally in a ring shape or a frame shape.

[0126] The inspection pin (2344) can be placed in the pin receiving groove (2343) defined by the probe partition (2342). When viewed from the second direction (DR2), the inspection pin (2344) can be placed between the probe partitions (2342). Although not illustrated, the inspection pin (2344) can be surrounded by the probe partitions (2342).

[0127] The probe card (233) may be a device that connects the dies (218) and a tester (not shown) to check the operation of the dies (218). After the probe tip (234) connected to the probe card (233) contacts the dies (218), it can determine whether the dies (218) are defective based on the signal that returns after sending electricity to the dies (218).

[0128] When the third support member (232) moves upward, the chuck base (12) and the mobile chuck (11) can be moved upward. Accordingly, the dies (218) placed on the upper surface of the mobile chuck (11) can be tested by contacting the probe tip (234). The dies (218) can be contacted by the test pin (2344).

[0129] For example, in FIG. 8, one probe tip (234) is shown, but is not limited thereto, and multiple probe tips (234) may be provided, and multiple probe tips (234) may simultaneously contact the dies (218).

[0130] When the dies (218) and the inspection pin (2344) come into contact with each other, one of the partitions (111) may come into contact with the probe partition (2342). The groove (111a) and the pin receiving groove (2343) may be sealed from the outside by the partition (11) and the probe partition (2342).

[0131] Accordingly, it may be easy to inject gas into the groove (111a) and the pin receiving groove (2343) to prevent arcs or sparks from occurring due to high power during the inspection process.

[0132]

[0133] FIG. 9 is a plan view of a mobile chuck according to one embodiment of the present invention. FIG. 10 is a cross-sectional view of a bulkhead corresponding to the line II-II' shown in FIG. 9.

[0134] Among the components shown in FIGS. 9 and 10, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0135] Referring to FIGS. 9 and 10, the groove (111a) may be defined by the inner surfaces (111c) of the bulkheads (111). The upper surfaces (111b) of the bulkheads (111) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2).

[0136] The bulkheads (111a) may include guide surfaces (111d). The guide surfaces (111d) may be positioned between the inner surfaces (111c) and the upper surfaces (111b). The guide surfaces (111d) may extend from the upper surfaces (111b) toward the inner surfaces (111c). The guide surfaces (111d) may connect the upper surfaces (111b) and the inner surfaces (111c) to each other. When viewed in a planar view, the upper surfaces (111b) may surround the guide surfaces (111d).

[0137] The guide surfaces (111d) may have an incline. Accordingly, when the dies (218, see FIG. 6) are placed into the grooves (111a), even if they are placed on the guide surfaces (111d), they can be moved along the guide surfaces (111d) and seated within the grooves (111a). Thus, the dies (218, see FIG. 6) can be stably placed within the grooves (111a).

[0138]

[0139] FIG. 11 is a plan view of a mobile chuck according to one embodiment of the present invention. FIG. 12 is a cross-sectional view of a mobile chuck and a die corresponding to the line III-III' shown in FIG. 11.

[0140] Among the components shown in FIGS. 11 and 12, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0141] Referring to FIGS. 11 and 12, a partition (111-2) may be placed on the edge of the mobile chuck (11). The partition (111-2) may have a ring-shaped form. When viewed in a planar view, the partition (111-2) may surround a plurality of dies (218). The partition (111-2) may prevent the dies (218) from moving out of the mobile chuck (11).

[0142]

[0143] FIG. 13 is a plan view of a mobile chuck according to one embodiment of the present invention.

[0144] Among the components shown in FIG. 13, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0145] Referring to FIG. 13, the partition (111-3) may include a first partition (111-3a), a plurality of second partitions (111-3b), and a plurality of third partitions (111-3c). The first partition (111-3a) may be placed on the edge of the plate (110). The first partition (111-3a) may have a circular shape.

[0146] The second bulkheads (111-3b) may extend in a second direction (DR2). The second bulkheads (111-3b) may be arranged in a first direction (DR1). The third bulkheads (111-3c) may extend in the first direction (DR1). The third bulkheads (111-3c) may be arranged in a second direction (DR2). The second bulkheads (111-3b) and the third bulkheads (111-3c) may intersect each other.

[0147]

[0148] Although embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification. Those skilled in the art who understand the spirit of the present invention may easily propose other embodiments within the scope of the same spirit by adding, changing, deleting, or adding components, and such embodiments shall also be considered to fall within the scope of the spirit of the present invention.

[0149] The mobile chuck may include bulkheads. The dies may be enclosed and secured by the bulkheads. Accordingly, since misalignment of the dies can be prevented, the present invention has high industrial applicability.

Claims

1. A mobile chuck supporting multiple dies; It includes a chuck base positioned below the mobile chuck, and The above mobile chuck is, A plate having a plurality of defined vacuum adsorption holes; and A chuck for die level testing comprising a bulkhead disposed on the upper surface of the above plate and surrounding at least one vacuum suction hole when viewed in a planar view.

2. In Paragraph 1, The above bulkhead is provided in multiple numbers, and Each of the above bulkheads is a die level test chuck surrounding a corresponding vacuum suction hole among the above vacuum suction holes.

3. In Paragraph 2, A chuck for die level testing arranged such that, when viewed from the above plane, the bulkheads are arranged in a first direction and a second direction intersecting the first direction.

4. In Paragraph 2, The above bulkheads have a square frame shape defining the groove, and Each of the above bulkheads is, Inner surface defining the above groove; An upper plane parallel to a plane defined by a first direction and a second direction intersecting the first direction; and A chuck for die level testing that is positioned between the inner surface and the upper surface, connects the inner surface and the upper surface, and includes a guide surface having an incline.

5. In Paragraph 1, The above bulkhead is a chuck for die level testing placed at the edge of the above plate.

6. In Paragraph 5, The above bulkhead is, A first bulkhead disposed at the edge of the above plate and having a ring shape; A plurality of second partitions surrounded by the first partition; and A die level test chuck comprising a plurality of third walls that are surrounded by the first wall and intersect the second wall.

7. In Paragraph 1, The above dies are a chuck for die level testing that is placed directly on the upper surface of the mobile chuck.

8. In Paragraph 7, The above dies are placed on the vacuum adsorption holes, and A chuck for die level testing in which, when the above dies are placed on the above vacuum adsorption holes, the vacuum adsorption holes are converted to a vacuum state.

9. A chamber with an internal inspection space defined; A mobile chuck comprising bulkheads that are disposed in the above inspection space and define a groove in which dies are disposed; A chuck base positioned below the above mobile chuck; and A probe tip disposed on the mobile chuck and comprising an inspection tip and a probe partition adjacent to the inspection tip, A die level test equipment in which, when the above-mentioned inspection tip contacts any one of the above-mentioned dies, any one of the above-mentioned bulkheads and the probe bulkhead come into contact with each other.

10. In Paragraph 9, The above mobile chuck is, A die level test apparatus further comprising a plate that supports the above bulkheads and the above dies and has defined vacuum adsorption holes.

11. In Paragraph 10, The above bulkheads are provided in a plurality, and each of the above bulkheads surrounds a corresponding vacuum adsorption hole among the above vacuum adsorption holes, forming a die level test equipment.

12. In Paragraph 11, Each of the above bulkheads is, Inner surface defining the above groove; An upper plane parallel to a plane defined by a first direction and a second direction intersecting the first direction; and A die level test device comprising a guide surface having an incline, which is positioned between the inner surface and the upper surface and connects the inner surface and the upper surface.

13. In Paragraph 10, The above bulkhead is a die level test equipment placed at the edge of the above plate.

14. In Paragraph 13, A first bulkhead disposed at the edge of the above plate and having a ring shape; Second partitions surrounded by the first partition, extending in a first direction, and arranged in a second direction intersecting the first direction; and A die level test equipment comprising third bulkheads that are surrounded by the first bulkhead, extend in the second direction, and arranged in the first direction.

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