Chuck for die level test

Abstract

This chuck for a die level test comprises: a plate having a plurality of vacuum adsorption holes defined on the upper surface thereof, and supporting a plurality of dies; and alignment patterns disposed adjacent to the vacuum adsorption holes when viewed in a plan view.

Description

Chuck for die level testing

[0001] The present invention relates to a chuck for die level testing.

[0002] After the manufacturing process is completed, the quality of semiconductor devices is determined through electrical characteristic testing. During this process, the die under test is loaded into test equipment, and the test is performed through contact with each probe tip of a probe card.

[0003] The probe tip contacts the electrode pad or solder bump of the die and determines electrical characteristics such as conduction status by applying a test signal to the electrical circuit connected to each electrode.

[0004] For such tests to be performed smoothly, a chuck is required that can stably support the test subject and precisely align its position.

[0005] The present invention provides a chuck for die level testing comprising an alignment pattern disposed on the upper surface of a mobile chuck.

[0006] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art to which the present invention pertains from the description below.

[0007] A chuck for die level testing according to one embodiment of the present invention comprises a mobile chuck having a plurality of vacuum suction holes defined on an upper surface and supporting a plurality of dies, and a chuck base disposed below the mobile chuck and supporting the mobile chuck, wherein the mobile chuck may include a plate having the vacuum suction holes defined on an upper surface and an alignment pattern disposed adjacent to the vacuum suction holes when viewed in a planar view.

[0008] According to one embodiment of the present invention, a mobile chuck may include a plate and an alignment pattern disposed on the upper surface of the plate. When dies are disposed on the upper surface of the mobile chuck that is expanded or contracted, the dies can be aligned with respect to the alignment pattern. Accordingly, the dies can be easily aligned on the mobile chuck.

[0009] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

[0010] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention.

[0011] Figure 2 is a plan view of the mobile chuck shown in Figure 1.

[0012] FIG. 3 is a plan view of a mobile chuck according to one embodiment of the present invention.

[0013] FIG. 4 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0014] FIGS. 5a to 5k are cross-sectional views illustrating the sorter chamber of FIG. 4.

[0015] FIG. 6 is a plan view of the mobile chuck and dies shown in FIG. 5k.

[0016] FIG. 7 is a plan view illustrating a mobile chuck being transported by a loader.

[0017] Figure 8 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0018] FIG. 9 is a perspective view of a chuck for die level testing according to one embodiment of the present invention.

[0019] FIG. 10 is a plan view of the mobile chuck shown in FIG. 9.

[0020] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components.

[0021] The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention.

[0022] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical ideas of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention.

[0023] In the following description, descriptions of some components may be omitted to clarify the features of the present invention.

[0024] In the following description, the term "connection" refers to one or more members being connected to each other in a manner that allows for fluid communication. In one embodiment, the connection may be formed by members such as a conduit, a pipe, or a piping system. In the following description, the term "connection" may be used interchangeably with the meaning that one or more members are "fluidly connected" to each other.

[0025] In the following description, the term "conduction" means that one or more components are connected to each other to transmit current or electrical signals. In one embodiment, the conduction may be formed in a wired form by a conductor member, etc., or in a wireless form such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may include the meaning of "communication."

[0026] As used in the following description, the term "fluid" refers to any form of substance that flows due to an external force and whose shape or volume, etc., can be deformed. In one embodiment, the fluid may be a liquid such as water or a gas such as air.

[0027] The terms "upper side," "lower side," "left side," "right side," "front side," and "rear side" used in the following description shall be understood by referring to the coordinate system depicted throughout the attached drawings.

[0028]

[0029] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2 is a plan view of the mobile chuck shown in FIG. 1. FIG. 3 is a plan view of the mobile chuck according to one embodiment of the present invention.

[0030] Referring to FIGS. 1 and 2, a chuck (1) for die level testing may include a mobile chuck (11) and a chuck base (12). For example, the mobile chuck (11) may have a disc shape. However, this is exemplary and the shape of the mobile chuck (11) is not limited thereto.

[0031] The mobile chuck (11) may include a plate (110) and a plurality of alignment patterns (111). The plate (110) may have a disc shape. However, the shape of the plate (110) is not limited thereto. The upper surface of the plate (110) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1). The upper surface of the plate (110) may correspond to the upper surface of the mobile chuck (11).

[0032] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the front and back surfaces of each member. In this specification, "on a plane" may be defined as a state viewed from the third direction (DR3). Hereinafter, the first to third directions (DR1, DR2, DR3) refer to the same reference numeral in the direction indicated by the first to third direction axes, respectively.

[0033] A plurality of vacuum suction holes (110a) can be defined on the upper surface of the plate (110).

[0034] The vacuum suction holes (110a) are connected to an external vacuum pump, and when the vacuum pump is operated, the vacuum suction holes (110a) can be converted to a vacuum state. Accordingly, a plurality of dies (218, see FIG. 6) to be described later can be fixed on the upper surface of the mobile chuck (11).

[0035] The vacuum adsorption holes (110a) can be arranged in a first direction (DR1) and a second direction (DR2). The vacuum adsorption holes (110a) can be arranged in multiple rows and multiple columns. The rows correspond to the second direction (DR2), and the columns correspond to the first direction (DR1).

[0036] The shape of the vacuum suction holes (110a) may be changed. For example, the vacuum suction holes (110a) may have a shape corresponding to a circle. However, it is not limited thereto, and the shape of the vacuum suction holes (110a) may be changed depending on the area of ​​the dies (218, see FIG. 6) or the spacing between adjacent dies (218, see FIG. 6).

[0037] Alignment patterns (111) can be placed on the upper surface of the plate (110). When viewed in a planar view, the alignment patterns (111) can be adjacent to the vacuum suction holes (110a).

[0038] For example, the number of alignment patterns (111) may be equal to the number of vacuum suction holes (110a). Each alignment pattern (111) may be positioned adjacent to a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a). When viewed in a planar view, the alignment patterns (111) may be adjacent to the upper left side of each of the vacuum suction holes (110a).

[0039] For example, the alignment patterns (111) in FIGS. 1 to 3 may have a cross shape, but the shape of the alignment patterns (111) is not limited thereto.

[0040] As the alignment patterns (111) are adjacent to the vacuum suction holes (110a), when dies (218, see FIG. 6) are placed on the vacuum suction holes (110a), the dies (218, see FIG. 6) can be aligned with respect to their relative positions with respect to the alignment patterns (111). Thus, the arrangement of the dies (218, see FIG. 6) can be facilitated. The arrangement of the dies (218, see FIG. 6) will be described in detail below.

[0041] Referring to FIG. 3, alignment patterns (111) can be placed on both sides of each row of vacuum suction holes (110a). A pair of alignment patterns (111) can be placed on both sides of a corresponding row of vacuum suction holes (110a). By a pair of alignment patterns (111), dies (218, see FIG. 6) can be easily arranged in multiple rows.

[0042] Referring to FIGS. 1 and 2, the chuck base (12) may be positioned below the mobile chuck (11). The mobile chuck (11) may be separated from the chuck base (12). When the arrangement of the dies (218, see FIG. 6) is changed, it may be necessary to replace the mobile chuck (11) with one in which vacuum suction holes (110a) corresponding to the changed arrangement of the dies (218, see FIG. 6) are defined. In this case, the inspection process of the dies can be performed by replacing only the mobile chuck (11) without changing the chuck base (12). Accordingly, even if the arrangement shape of the dies (218, see FIG. 6) is changed, dies (218, see FIG. 6) having various arrangement shapes can be inspected quickly and easily.

[0043] The chuck base (12) can be placed directly on the lower surface of the mobile chuck (11). That is, the mobile chuck (11) can be placed directly on the upper surface of the chuck base (12). As the chuck base (12) comes into direct contact with the mobile chuck (11), heat generated from the dies (218, see FIG. 6) can be conducted to the mobile chuck (11) and the chuck base (12).

[0044] The chuck base (12) may include a temperature sensor (121) and a temperature controller (122). The chuck base (12) can measure the temperature of the dies (2187, see FIG. 6) by measuring the heat conducted from the dies (218, see FIG. 6) through the temperature sensor (121).

[0045] Additionally, the chuck base (12) can cool the dies (218, see FIG. 6) through the temperature controller (122) or heat the dies (218, see FIG. 6) by generating heat through the temperature controller (122). Although not illustrated, the temperature controller (122) may, by example, include a coolant channel and a heater. The temperature controller (122) can cool the dies through the coolant channel or heat the dies through the heater.

[0046]

[0047] FIG. 4 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0048] Referring to FIG. 4, the inspection equipment (2) may include a sorter chamber (21), a loader (22), and a test chamber (23). The sorter chamber (21) may place dies (218, FIG. 6) on a mobile chuck (11, FIG. 1).

[0049] The loader (22) can transfer the mobile chuck (11, see FIG. 1) from the sorter chamber (21) to the test chamber (23). The test chamber (23) can inspect the electrical characteristics of the dies (218, see FIG. 6) placed on the upper surface of the mobile chuck (11, see FIG. 1) using a probe tip (234, see FIG. 8).

[0050] The process of placing dies (218, see FIG. 6) on the upper surface of a mobile chuck (11, see FIG. 1) in a sorter chamber (21), and the inspection of the electrical characteristic state of the dies (218, see FIG. 6) in a test chamber (23) will be described in detail below.

[0051]

[0052] FIGS. 5a through 5k are cross-sectional views illustrating the sorter chamber of FIG. 4. FIG. 6 is a plan view of the mobile chuck and dies shown in FIG. 5k.

[0053] For example, FIGS. 5a through 5k are cross-sectional views of a sorter chamber viewed from a second direction (DR2).

[0054] For example, FIGS. 5b through 5k are cross-sectional views illustrating the process of placing dies (218) on a mobile chuck (11).

[0055] Among the components shown in FIGS. 5a to 6, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0056] Referring to FIG. 5a, the sorter chamber (21) may include a first chamber (210), an upper base (211), a picker (212), a plurality of transfer units (213), a first lower base (214), a first chuck (215), and a second chuck (216).

[0057] The first chamber (210) may define a receiving space (2101) inside. The upper base (211), picker (212), transfer parts (213), first lower base (214), first chuck (215), and second chuck (216) may be received in the receiving space (2101).

[0058] An entrance (2102) may be defined on one side adjacent to the first chuck (215) among the two sides of the first chamber (210) that are opposite each other in the first direction (DR1). The entrance (2102) may connect the outside of the first chamber (210) with the receiving space (2101). Accordingly, the film (217, see FIG. 5b) and the mobile chuck (11, see FIG. 5g) may be provided to the receiving space (2101) through the entrance (2102).

[0059] The upper base (211) may be positioned on the upper side of the receiving space (2101). The upper base (211) may be positioned on the inner side of the first chamber (210) defining the receiving space (2101). The upper base (211) may be fixed to the inner side of the first chamber (210) to fix the fixed picker (212) and the transfer parts (213) so as to face the first chuck (215) and the second chuck (216) in the third direction (DR3).

[0060] The picker (212) is fixed to the upper base (211) and can face the first chuck (215) and the second chuck (216) in the third direction (DR3). The picker (212) can be moved back and forth in the third direction (DR3). As the picker (212) moves back and forth in the third direction (DR3), the distance between the picker (212) and the first chuck (215), and between the picker (212) and the second chuck (216) can be varied. Hereinafter, a direction parallel to the third direction (DR3) is defined as the upper direction, and a direction parallel to the opposite direction of the third direction (DR3) can be defined as the lower direction.

[0061] The transfer members (213) can be fixed to the upper base (211). For example, the transfer members (213) can be fixed to the upper base (211) in a first direction (DR1). The transfer members (213) can face each other in a third direction (DR3) with the first chuck (215) and the second chuck (216). The transfer members (213) can be reciprocated in the third direction (DR3). As the transfer members (213) reciprocate in the third direction (DR3), the distance between the transfer members (213) and the first chuck (215), and between the transfer members (213) and the second chuck (216) can be varied.

[0062] The first lower base (214) may be positioned at the bottom of the receiving space (2101). The first lower base (214) may be positioned below the picker (212) and the transfer units (213). The first lower base (214) may face the picker (212) and the transfer units (213) in a third direction (DR3).

[0063] The first lower base (214) can be reciprocated in the first direction (DR1). Accordingly, the first lower base (214) can be moved to overlap with the picker (212) or the transport units (213) in the third direction (DR3) or not overlap.

[0064] The first chuck (215) may be placed on the first lower base (214). For example, the first chuck (215) may be placed on the upper surface of the first lower base (214). As the first chuck (215) is connected to the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the first chuck (215) may reciprocate in the first direction (DR1).

[0065] The first chuck (215) may include a first support member (2151), a first stage (2152), and a plurality of first lifts (2153). The first support member (2151) may be disposed on the upper surface of the first lower base (214). The first support member (2151) may have a column shape extending in a third direction (DR3). The first support member (2151) may reciprocate in the third direction (DR3).

[0066] The first stage (2152) may be placed on the first support member (2151). As the first stage (2152) is placed on the first support member (2151), when the first support member (2151) moves back and forth in the third direction (DR3), the first stage (2152) may move back and forth in the third direction (DR3).

[0067] The upper surface of the first stage (2152) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). The upper surface of the first stage (2152) may support a film assembly (217, see FIG. 5b) and a mobile chuck (11, see FIG. 5g) to be described later.

[0068] The first lifts (2153) may be positioned around the first stage (2152). Although not illustrated, when viewed in a planar view, the first lifts (2152) may be positioned adjacent to the side of the first stage (2152).

[0069] The upper surface of the first lifts (2153) may be positioned below the upper surface of the first stage (2152). The height of the upper surface of the first lifts (2153) may be positioned below the height of the upper surface of the first stage (2152).

[0070] The first lifts (2153) can be reciprocated in the third direction (DR3). Although not illustrated, the first lifts (2153) can be connected to a separate cylinder to be reciprocated in the third direction (DR3).

[0071] The second chuck (216) may be placed on the first lower base (214). For example, the second chuck (216) may be placed on the upper surface of the first lower base (214). The first chuck (215) and the second chuck (216) may be arranged in the first direction (DR1). The first chuck (215) may be closer to the entrance (2102) than the second chuck (216).

[0072] As the second chuck (216) is connected to the first lower base (214), when the first lower base (214) moves back and forth in the first direction (DR1), the second chuck (216) can also move back and forth in the first direction (DR1).

[0073] The second chuck (216) may include a second support member (2161) and a second stage (2162). The second support member (2161) may have a columnar shape extending in a third direction (DR3). The second support member (2161) may reciprocate in the third direction (DR3). The movement of the second support member (2161) will be described in detail in FIG. 5f.

[0074] The second stage (2162) may be placed on the second support (2161). The upper surface of the second stage (2162) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The second stage (2162) may support a film (217, see FIG. 5g).

[0075] Although not illustrated, the sorter chamber (21) may further include a sorter picker that aligns the dies (218, see FIG. 5k) when placing the dies (218, see FIG. 5k) described later onto the mobile chuck (11, see FIG. 5k).

[0076] Referring to FIG. 5b, a film assembly (217) and a plurality of dies (218) may be provided within a first chamber (210). The film assembly (217) and the dies (218) may be provided to a receiving space (2101) through an entrance (2102). The film assembly (217) may include a frame and a film placed on the frame. The dies (218) may be placed on the upper surface of the film.

[0077] The film assembly (217) provided in the receiving space (2101) may be provided on the first chuck (215). The film assembly (217) may be placed on the upper surface of the first stage (2152). The film assembly (217) may be placed on the first lifts (2153).

[0078] The upper surface of the film assembly (217) may have a predetermined adhesive force. Dies (218) may be placed on the film assembly (217). The film assembly (217) may secure the dies (218) with a predetermined adhesive force. Accordingly, the dies (218) may be prevented from detaching from the film assembly (217) due to external vibration or shock. Additionally, the adhesive force may have a strength adjusted so that the dies (218) can be easily separated from the film assembly (217).

[0079] Referring to FIG. 5c, the first lifts (2153) can be moved upward. As the first lifts (2153) move upward, the film assembly (217) and dies (218) placed on the first lifts (2153) can be moved upward.

[0080] The transfer units (213) can be moved downward from the upper base (211) toward the first lower base (214). As the transfer units (213) move downward and the film assembly (217) and dies (218) move upward, the distance between the film assembly (217) and the transfer units (213) can be reduced.

[0081] Referring to FIG. 5d, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the first chamber (210) that is spaced apart from the entrance (2102).

[0082] When the first lower base (214) moves in the first direction (DR1), the first chuck (215) and the second chuck (216) can be moved in the first direction (DR1). When the first chuck (215) moves in the first direction (DR1), the film assembly (217) and the dies (218) can be moved in the first direction (DR1) and placed under the transport units (213).

[0083] Referring to FIG. 5e, the transfer units (213) can lift opposite sides of the film assembly (217) in an upward direction in a first direction (DR1). The transfer units (213) can transfer the film assembly (217) and the dies (218) upward from the first chuck (215).

[0084] After the film assembly (217) and dies (218) are moved upward, the first lifts (2153) can be moved downward.

[0085] Referring to FIG. 5f, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0086] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and placed under the transfer sections (213).

[0087] After the second chuck (216) is placed below the transfer sections (213), the second support section (2161) can be moved upward. When the second support section (2161) is moved upward, the second stage (2162) can be moved upward. As the second stage (2162) moves upward, the distance to the third direction (DR3) between the transfer sections (213) and the second stage (2162) can be reduced.

[0088] The second stage (2162) moves upward toward the film assembly (217) so that the upper surface of the second stage (2162) can come into contact with the lower surface of the film assembly (217). The second stage (2162) can support the film assembly (217). The second stage (2162) can support dies (218) placed on the film assembly (217).

[0089] Referring to FIG. 5g, after the film assembly (217) and dies (218) are placed on the upper surface of the second stage (2162), the second support (2161) and the second stage (2162) can be moved downward.

[0090] The mobile chuck (11) may be provided within the first chamber (210). The mobile chuck (11) may be provided in the receiving space (2101) through the entrance (2102). When the film assembly (217) is placed on the upper surface of the second stage (2162), the mobile chuck (11) may be provided on the upper surface of the first stage (2152). The mobile chuck (11) may be placed on the first lifts (2153).

[0091] Referring to FIG. 5h, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0092] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and overlap with the picker (212) in the third direction (DR3).

[0093] Referring to FIGS. 5i and 5j, the picker (212) can be moved downward. The picker (212) can be moved toward the film assembly (217) and the dies (218).

[0094] At least one of the second support (2161) or the picker (212) can be moved in a third direction (DR3). For example, the second support (2161) can be moved in an upward direction. When the second support (2161) is moved in an upward direction, the second stage (2162) can be moved in an upward direction. When the second stage (2162) is moved in an upward direction, the film assembly (217) and dies (218) placed on the upper surface of the second stage (2162) can be moved in an upward direction.

[0095] However, not limited thereto, the second support member (216) may be fixed, and the picker (212) may be moved downward toward the second support member (216). Additionally, the picker (212) may be fixed, and the second support member (216) may be moved upward toward the picker (212).

[0096] When the film assembly (217) and the dies (218) move in an upward direction, the distance in the third direction (DR3) between the dies (218) and the picker (212) can be reduced. The picker (212) can come into contact with the dies (218). The picker (212) can adsorb the dies (218). When the picker (212) adsorbs the dies (218), the second chuck (216) and the film assembly (217) can move in a downward direction. Accordingly, the dies (218) can be separated from the film assembly (217).

[0097] Referring to FIG. 5k, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the chamber.

[0098] The first chuck (215) placed on the first lower base (214) and the mobile chuck (11) placed on the first chuck (215) can be moved in the first direction (DR1). The mobile chuck (11) can be moved in the first direction (DR1) and placed under the picker (212).

[0099] After the mobile chuck (11) is placed below the picker (212), the first support member (2151) can be moved upward. When the first support member (2151) is moved upward, the mobile chuck (11) placed on the upper surface of the first support member (2151) can be moved upward. The distance in the third direction (DR3) between the upper surface of the mobile chuck (11) and the picker (212) can be reduced.

[0100] Referring to FIG. 5k and FIG. 6, the upper surface of the mobile chuck (11) may come into contact with dies (218) adsorbed to the picker (212). After the dies (218) come into contact with the upper surface of the mobile chuck (11), the picker (212) may place the dies (218) on the upper surface of the mobile chuck (11). The dies (218) may be placed directly on the upper surface of the mobile chuck (11).

[0101] When the dies (218) are placed on the upper surface of the mobile chuck (11), the position of the dies (218) can be determined based on the alignment patterns (111). Although not illustrated, the sorter chamber (21) may further include a vision camera. The vision camera can acquire position information of the dies (218) and the alignment patterns (111) and, based thereon, align or correct the relative position between the dies (218) and the alignment patterns (111). For example, at least one of the vertices of the dies (218) can be aligned so as to overlap with the center of the alignment patterns (111).

[0102] Meanwhile, the plate (110) may expand or contract due to heat, and accordingly, the position of the alignment patterns (111) formed on the plate (110) may also change. In this state, when the dies (218) are placed on the upper surface of the plate (110) based on the alignment mark (111), the relative position between the dies (218) may change as the plate (110) is subsequently restored to its original shape. Accordingly, the spacing between the dies (218) can be maintained constant by aligning based on the alignment patterns (111).

[0103] Accordingly, the dies (218) can be precisely arranged on the upper surface of the mobile chuck (11) using alignment patterns (111), thereby improving alignment accuracy.

[0104] Dies (218) can be placed on vacuum suction holes (110a). Dies (218) can be arranged to correspond to the arrangement of vacuum suction holes (110a). That is, each die (218) can be placed on a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a).

[0105] When the die (218) overlaps with the vacuum suction holes (110a), a vacuum pump connected to the outside of the mobile chuck (11) can operate to convert the vacuum suction holes (110a) into a vacuum state. Accordingly, the die (218) can be fixed on the upper surface of the mobile chuck (11).

[0106]

[0107] FIG. 7 is a plan view illustrating a mobile chuck being transported by a loader.

[0108] Among the components shown in FIG. 7, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0109] Referring to FIG. 5k and FIG. 7, after the dies (218) are placed on the upper surface of the mobile chuck (11), the mobile chuck (11) and the dies (218) can be discharged from the receiving space (2101) by a loader (22). The mobile chuck (11) and the dies (218) can be discharged from the first chamber (210) through the entrance (2102).

[0110] The mobile chuck (11) and dies (218) can be transferred from the sorter chamber (21) to the test chamber (23). Although not illustrated, a vacuum pump may be connected to the mobile chuck (11), and the vacuum suction holes (110a) may be maintained in a vacuum state. Accordingly, the position of the dies (218) can be prevented from shifting due to shaking or impact occurring during the transfer process.

[0111]

[0112] Figure 8 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0113] For example, FIG. 8 is a cross-sectional view of the test chamber (23) viewed from the second direction (DR2).

[0114] Among the components shown in FIG. 8, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0115] Referring to FIGS. 7 and 8, the test chamber (23) may include a second chamber (230), a second lower base (231), a third support (232), a probe card (233), and a probe tip (234). The second chamber (230) may define an inspection space (230a) capable of accommodating the second lower base (231), the third support (232), the probe card (233), and the probe tip (234).

[0116] An inspection entrance (230b) may be defined on either side of the two opposing sides of the second chamber (230) in the first direction (DR1). The inspection entrance (230b) may connect the inspection space (230b) to the outside of the test chamber (230). In FIG. 7, a mobile chuck (11) and dies (218) may be provided to the inspection space (230a) through the inspection entrance (230b) by a loader (22).

[0117] The second lower base (231) may be placed at the bottom within the inspection space (230a). The second lower base (231) may be placed on the bottom surface of the second chamber (230).

[0118] The third support member (232) may be placed on the second lower base (231). The third support member (232) may reciprocate in the third direction (DR3) on the second lower base (231).

[0119] The chuck base (12) can be placed on the third support (232). The mobile chuck (11) can be placed on the chuck base (12) by the loader (22). The mobile chuck (11) can be placed directly on the upper surface of the chuck base (12).

[0120] As the chuck base (12) and the mobile chuck (11) are in direct contact and the dies (218) are in direct contact with the mobile chuck (11), heat generated from the dies (218) can be conducted to the mobile chuck (11) and the chuck base (12). A temperature sensor (121, see FIG. 1) on the chuck base (12) can measure the conducted heat to measure the temperature of the dies (218). Accordingly, the temperature of the dies (218) can be measured more accurately through the temperature sensor (121, see FIG. 1).

[0121] Additionally, when the dies (218) are heated or cooled using the temperature controller (122) for testing, the heat transfer efficiency between the temperature controller (122) and the dies (218) can be improved.

[0122] The probe card (233) may be positioned above the second lower base (231) and the third support (232) within the second chamber (230). The probe card (233) may face the second lower base (231) and the third support (232) in a third direction (DR3).

[0123] The probe tip (234) may be placed on the lower surface of the probe card (233) facing the second lower base (231). The probe tip (234) may extend downward from the probe card (233).

[0124] The probe card (233) may be a device that connects the dies (218) and a tester (not shown) to check the operation of the dies (218). After the probe tip (234) connected to the probe card (233) contacts the dies (218), it can determine whether the dies (218) are defective based on the signal that returns after sending electricity to the dies (218).

[0125] When the third support member (232) moves upward, the chuck base (12) and the mobile chuck (11) can be moved upward. Accordingly, the dies (218) placed on the upper surface of the mobile chuck (11) can be tested by contacting the probe tip (234).

[0126] For example, in FIG. 8, one probe tip (234) is shown, but is not limited thereto, and multiple probe tips (234) may be provided, and multiple probe tips (234) may simultaneously contact the dies (218).

[0127]

[0128] FIG. 9 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 10 is a plan view of a mobile chuck shown in FIG. 9.

[0129] Among the components shown in FIGS. 9 and 10, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0130] Referring to FIGS. 9 and 10, the mobile chuck (11) may further include a plurality of partitions (112). The partitions (112) may be disposed on the upper surface of the plate (110). The partitions (112) may be in the shape of a frame. For example, in FIGS. 9 and 10, the partitions (112) may have a square frame shape defining a groove (112a) in the center.

[0131] The partitions (112) may surround at least one vacuum suction hole (110a) defined on the upper surface of the plate (110). For example, when viewed in a planar view, each of the partitions (112) may be positioned adjacent to a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a). The partitions (112) may be arranged in a first direction (DR1) and a second direction (DR2). When viewed in a planar view, each of the partitions (112) may surround a corresponding vacuum suction hole (110a) among the vacuum suction holes (110a).

[0132] As illustrated in FIG. 10, the dies (218) can be placed on the vacuum suction holes (110a) within the groove (112a). When viewed in a planar view, the partitions (112) can surround the dies (218). Accordingly, the position of the dies (218) can be prevented from changing. Thus, the alignment of the dies (218, see FIG. 6) can be prevented.

[0133] Align patterns (111a) can be placed on the upper surface of the bulkheads (112). When viewed in a planar view, the alignment patterns (111a) may have a shape corresponding to a part of the edge of the bulkheads (112). For example, the alignment patterns (111a) may be a shape that is an inverted “L” shape in the up-down or left-right direction.

[0134] As the alignment patterns (111a) are positioned on the upper surface of the bulkheads (112), the difference between the height of the alignment patterns (111a) and the height of the upper surface of the dies (218) can be reduced. Accordingly, when a vision camera (not shown) captures the alignment patterns (111a) and the dies (218) from above, the positional information error of the alignment patterns (111a) and the dies (218) can be reduced. Thus, the dies (218) can be accurately arranged according to a set arrangement.

[0135]

[0136] Although embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification. Those skilled in the art who understand the spirit of the present invention may easily propose other embodiments within the scope of the same spirit by adding, changing, deleting, or adding components, and such embodiments shall also be considered to fall within the scope of the spirit of the present invention.

[0137] A mobile chuck may include a plate and an alignment pattern disposed on the upper surface of the plate. When dies are disposed on the upper surface of the mobile chuck that is expanded or contracted, the dies can be aligned with respect to the alignment pattern. Accordingly, since the dies can be easily aligned on the mobile chuck, the present invention is industrially applicable.

Claims

1. A plate having a plurality of vacuum suction holes defined on its upper surface and supporting a plurality of dies; and A die level test chuck comprising an alignment pattern disposed adjacent to the vacuum suction holes when viewed in a planar view.

2. In Paragraph 1, The above vacuum adsorption holes are arranged in multiple rows and multiple columns, and The above alignment patterns are provided in multiple numbers, and the alignment patterns are arranged on both sides of the rows, and A chuck for die level testing in which the plurality of columns correspond to a first direction and the plurality of rows correspond to a second direction intersecting the first direction.

3. In Paragraph 2, A die level test chuck in which, when viewed from the above plane, the dies are placed on the upper surface of the plate, at least one of the vertices of the dies is adjacent to the alignment patterns.

4. In Paragraph 3, A die level test chuck having shapes corresponding to the vertices of the dies when viewed on the above plane.

5. In Paragraph 1, A mobile chuck comprising the above plate and the above alignment pattern; and A chuck for die level testing comprising a chuck base positioned below the mobile chuck and supporting the mobile chuck.

6. In Paragraph 5, The above mobile chuck is, It includes a plurality of partitions disposed on the upper surface of the above plate, and The above alignment pattern is a chuck for die level testing placed on the above bulkheads.

7. In Paragraph 6, The above bulkheads have a frame shape, When viewed in the above plane, each of the above bulkheads is a die level test chuck surrounding a corresponding vacuum suction hole among the above vacuum suction holes.

8. In Paragraph 7, A die level test chuck having a plurality of alignment patterns, each of which is disposed on the upper surface of a corresponding bulkhead among the bulkheads.

9. In Paragraph 6, When viewed from the above plane, the above bulkheads have a rectangular frame shape, When viewed in a planar view, the alignment pattern is a chuck for die level testing positioned adjacent to at least one of the multiple vertices.

10. In Paragraph 5, The above mobile chuck is a chuck for die level testing in which the upper surface of the chuck base is directly placed.

11. In Paragraph 10, The above dies are a chuck for die level testing that is placed directly on the upper surface of the mobile chuck.

12. In Paragraph 1, The above alignment pattern is provided in multiple numbers, and Each of the above alignment patterns is a die level test chuck positioned adjacent to a corresponding vacuum suction hole among the above vacuum suction holes.

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