Bitter plate-based magnet devices and reactor apparatus using same
The biter plate-based magnet device and reactor device address the challenge of large reactor size by enabling high current density in a miniaturized form with efficient cooling and reduced mechanical stress.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
- Filing Date
- 2025-12-29
- Publication Date
- 2026-07-09
AI Technical Summary
Existing reactors in power systems are large and heavy, posing installation and cost burdens due to the need for high reactance values.
A biter plate-based magnet device and reactor device utilizing stacked conductor and insulator plates with specific radial slots and flanges, enabling high current density in a miniaturized form.
Achieves high current density in a compact design, facilitating efficient cooling and reducing mechanical stress while maintaining uniform current flow.
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Figure KR2025022972_09072026_PF_FP_ABST
Abstract
Description
Biter plate-based magnet device and reactor device using the same
[0001] The present disclosure relates to a biter plate-based magnet device and a reactor device using the same.
[0002] A reactor is a device that can be connected to a power system to provide inductive reactance. Depending on their function, reactors can be classified into series reactors, shunt reactors, and reactors for power converters. Reactors used in power systems typically have large volume and weight to achieve high reactance values, which has posed a significant burden in terms of installation and cost.
[0003] Accordingly, there is a need to develop a miniaturized reactor with a new structure capable of achieving high current density in a small volume.
[0004] The present disclosure aims to solve these problems by providing a biter plate-based magnet device and a reactor device using the same.
[0005] According to one embodiment of the present disclosure, a biter plate-based magnet device may be provided. The magnet device may include an upper lead plate; a plurality of conductor plates; a plurality of insulator plates; and a lower lead plate. The magnet device may be formed to have a center hole. The conductor plates and the insulator plates may be stacked such that an insulator plate is disposed between each of the two conductor plates. Each conductor plate may be formed to have a first radial slot, and each insulator plate may be formed to have a second radial slot having a width in the circumferential direction wider than the radial slot of the conductor plate.
[0006] Additionally, the conductor plates and the insulator plates may be stacked in such a manner that one conductor plate and one insulator plate are stacked such that one radial end of the first radial slot of the one conductor plate and one radial end of the second radial slot of the one insulator plate are aligned, and the next conductor plate and the next insulator plate are rotated by a predetermined angle such that one radial end of the first radial slot of the next conductor plate and one radial end of the second radial slot of the next insulator plate are aligned.
[0007] Additionally, the upper lead plate may be laminated to contact the uppermost conductor plate, and the lower lead plate may be laminated to contact the lowest conductor plate.
[0008] In addition, the upper lead plate and the lower lead plate may each be formed to have a contact portion for electrical connection protruding from an outer part.
[0009] Additionally, the magnet device may further include an upper flange and a lower flange. An upper insulator plate may be disposed between the upper flange and the upper lead plate, and a lower insulator plate may be disposed between the lower flange and the lower lead plate.
[0010] In addition, a plurality of holes may be formed radially at predetermined intervals in the circumferential direction in each of the conductor plates, the insulator plates, the upper lead plate, the lower lead plate, the upper flange, and the lower flange.
[0011] In addition, the plurality of holes each have an elliptical shape and can form a wavy path in the circumferential direction.
[0012] In addition, grooves may be formed at predetermined intervals on the outer circumference of each of the conductor plates, the insulator plates, the upper lead plate, and the lower lead plate.
[0013] Additionally, the upper flange and the lower flange may have outer protrusions formed thereon that correspond to the positions of some of the grooves and have holes for fixing the magnet device.
[0014] In addition, the conductor plate may be made of copper or a copper alloy.
[0015] According to one embodiment of the present disclosure, a reactor device may be provided. The reactor device may include a magnet device based on a beater plate.
[0016] According to one embodiment of the present disclosure, a three-phase reactor device may be provided. The three-phase reactor device may include a first magnet device; a second magnet device; and a third magnet device. The first magnet device, the second magnet device, and the third magnet device may each be formed to have a central hole through which a first leg, a second leg, and a third leg of a core can pass. Each of the first magnet device, the second magnet device, and the third magnet device may include an upper lead plate; a plurality of conductor plates; a plurality of insulator plates; and a lower lead plate. The conductor plates and the insulator plates may be stacked such that an insulator plate is disposed between each of the two conductor plates. Each conductor plate is formed to have a first radial slot, and each insulator plate may be formed to have a second radial slot having a width in the circumferential direction wider than the radial slot of the conductor plate.
[0017] According to the present disclosure, by implementing a biter plate-based magnet device and a reactor device using the same, it is possible to achieve high current density in a low volume and also enable the fabrication of a miniaturized reactor.
[0018] In addition, according to the present disclosure, a beater plate-based reactor device can be implemented that maintains a uniform current, enables efficient cooling, and reduces mechanical stress.
[0019] FIG. 1 is a schematic drawing showing an exemplary reactor device according to one embodiment of the present disclosure.
[0020] FIG. 2 is an exemplary drawing showing a stacked structure of a magnet device according to one embodiment of the present disclosure.
[0021] FIG. 3 is an exemplary drawing showing a conductor plate and an insulator plate according to one embodiment of the present disclosure.
[0022] FIG. 4 is an exemplary drawing showing a lead plate and a flange according to one embodiment of the present disclosure.
[0023] FIG. 5 is an exemplary drawing showing a stacked flange and a lead plate according to one embodiment of the present disclosure.
[0024] FIG. 6 is an exemplary drawing showing a core structure according to one embodiment of the present disclosure.
[0025] FIG. 7 is an exemplary drawing showing a three-phase reactor device composed of a magnet device and a core according to one embodiment of the present disclosure.
[0026] FIG. 8 is an exemplary drawing showing a magnet device fixed using an external protrusion of a flange according to one embodiment of the present disclosure.
[0027] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, it should be noted that in assigning reference numerals to the components of each drawing, the same components are given the same reference numeral whenever possible, even if they are shown in different drawings. Furthermore, in describing the present invention, if it is determined that a detailed description of related known components or functions could obscure the essence of the invention, such detailed description is omitted.
[0028] Various aspects of the present invention are described below. It should be understood that the inventions presented herein may be embodied in a wide variety of forms, and that any specific structure, function, or all thereof presented herein are merely illustrative. Based on the inventions presented herein, those skilled in the art will understand that any one aspect presented herein may be embodied independently of any other aspects, and that two or more such aspects may be combined in various ways. For example, an apparatus may be embodied or a method may be practiced using any number of aspects described herein. Furthermore, such an apparatus may be embodied or such a method may be practiced using structures, functions, or structures and functions other than those described herein, in addition to or other than these aspects.
[0029] A bitter plate (or bitter magnet) has been proposed as a novel magnet structure capable of generating high magnetic fields. A bitter plate can be constructed using stacked conductive plates and can achieve high current density in a small volume.
[0030] The present disclosure aims to provide a reactor device utilizing such a beater plate-based magnet device, which can not only achieve high current density in a low volume but also enable the fabrication of a miniaturized reactor.
[0031] FIG. 1 is a schematic drawing showing an exemplary reactor device according to one embodiment of the present disclosure.
[0032] As illustrated in FIG. 1, a reactor device (100) according to the present disclosure may include a magnet device (200) and a core (300).
[0033] The magnet device (200) may be configured based on a beater plate and may be formed to have a central hole through which the core (300) can pass. The detailed structure of the magnet device (200) will be described later in relation to FIG. 2.
[0034] In one embodiment, when the reactor device (100) is implemented as a single phase, the reactor device (100) may be composed of one magnet device (200) and a core (300) (e.g., rod-shaped) (i.e., iron core).
[0035] In one embodiment, as illustrated in FIG. 1, when the reactor device (100) is implemented in three phases, the core (300) may have a rectangular structure and may be composed of legs (310-1, 310-2, 310-3) and an upper yoke (320) and a lower yoke (330) connecting each leg. Each magnet device (200-1, 200-2, 200-3) may be arranged so that each leg (310-1, 310-2, 310-3) penetrates a central hole.
[0036] The core (300) can be manufactured with dimensions much smaller than those of existing products (e.g., coil-based power reactors), and exemplary dimensions are shown in Table 1.
[0037]
[0038] FIG. 2 is an exemplary drawing showing a stacked structure of a magnet device according to one embodiment of the present disclosure. FIG. 3 is an exemplary drawing showing a conductor plate and an insulator plate according to one embodiment of the present disclosure. FIG. 4 is an exemplary drawing showing a lead plate and a flange according to one embodiment of the present disclosure. FIG. 5 is an exemplary drawing showing a stacked flange and a lead plate according to one embodiment of the present disclosure. FIG. 6 is an exemplary drawing showing a core structure according to one embodiment of the present disclosure.
[0039] As illustrated in FIG. 2, the magnet device (200) may include an upper flange (210), an upper lead plate (230), a plurality of conductor plates (240-1, 240-2,...), a plurality of insulator plates (250-1, 250-2,...), a lower lead plate (270), and a lower flange (280). Additionally, an upper insulator plate (220) may be disposed between the upper flange (210) and the upper lead plate (230), and a lower insulator plate (270) may be disposed between the lower flange (280) and the lower lead plate (260). In this embodiment, the stacked flanges and plates (210–280) may be formed as circular plates having a central hole through which the core (300) can pass.
[0040] As illustrated in FIG. 2, conductor plates (240) and insulator plates (250) can be stacked such that an insulator plate is placed between each of the two conductor plates. Additionally, each conductor plate (240) may be formed to have a first radial slot (241), and each insulator plate (250) may be formed to have a second radial slot (251) having a width that is wider in the circumferential direction than the first radial slot (241) of the conductor plate (240) (Fig. 3). In one embodiment, the conductor plate (240) may be made of copper or a copper alloy, but is not limited thereto, and other conductive materials that satisfy the required conductivity, strength, etc. may be applied. In one embodiment, the conductor plate (240) may be formed to have a greater thickness than the insulator plate (250), and, for example, the thickness of the conductor plate (240) may be 1.5 mm and the thickness of the insulator plate (250) may be 0.5 mm.
[0041] Furthermore, for current movement through the plates, conductor plates (240) and insulator plates (250) are stacked such that one conductor plate (240) and one insulator plate (250) are aligned with one radial end (e.g., left end) of the first radial slot (241) of the conductor plate (240) and one radial end (e.g., left end) of the second radial slot (251) of the insulator plate (250), and the next conductor plate (240) and the next insulator plate (250) are rotated by a predetermined angle (e.g., 30 degrees) so that one radial end (e.g., left end) of the first radial slot (241) of the conductor plate (240) and one radial end (e.g., left end) of the second radial slot (251) of the insulator plate (250) are aligned. In this manner, they can be stacked sequentially. Through this stacking method, the conductor plates (240) and the insulator plates (250) can have a stacked structure as shown in FIG. 2.
[0042] The upper lead plate (230) may be stacked to contact the upper conductor plate (240), and the lower lead plate (260) may be stacked to contact the lower conductor plate (240). Additionally, the upper lead plate (230) and the lower lead plate (260) may each be formed to have a contact portion (231) (i.e., an electrical terminal) for electrical connection protruding from an outer portion (Fig. 4). In one embodiment, the lead plates (230, 260) may be formed to have a thickness greater than that of the conductor plate (240), and, for example, the thickness of the lead plates (230, 260) may be 3 mm.
[0043] When current is applied to the magnet device (200) through the contact portion (231) of the upper lead plate (230) and the lower lead plate (260), as shown in FIG. 2, the current can flow from the lead plates (230, 260) to the conductor plates (240) through the contact, and can flow through each conductor plate (240) through the movement of current through the plates.
[0044] The upper flange (210) and the lower flange (280) may be arranged to fix and compress the plates (220–270) stacked between them. In one embodiment, the flanges (210, 280) may be made of stainless steel, but are not limited thereto and may be made of other materials that satisfy the required strength. In one embodiment, the flanges (210, 280) may have sufficient thickness to fix and support the plates of the magnet device (200), and, for example, the thickness of the flanges (210, 280) may be 10 mm.
[0045] In one embodiment, the magnet device (200) may be formed to have an effective cooling structure for maintaining the temperature of the magnet device (200) with low power. To this end, a plurality of holes (410) may be formed radially at predetermined intervals in the circumferential direction on each of the conductor plates (240), insulator plates (220, 250, 270), upper lead plate (230), lower lead plate (260), upper flange (210), and lower flange (280). In one embodiment, these plurality of holes may each have an elliptical shape and form a wavy path in the circumferential direction (Figs. 3 and 4). By configuring these elliptical wavy holes on the plates, current can flow uniformly in the magnet device (200), enable efficient heat transfer and cooling, and reduce mechanical stress.
[0046] In one embodiment, grooves (420) may be formed on the outer circumference of each plate at predetermined intervals (e.g., 30-degree intervals) on the conductor plates (240), insulator plates (220, 250, 270), upper lead plate (230), and lower lead plate (260) (Figs. 3 and 4). Additionally, outer protrusions (211) having holes for fixing the magnet device (200) may be formed on the upper flange (210) and lower flange (280), corresponding to the positions of some of the grooves formed on the plates (e.g., four positions at 90-degree intervals) (Figs. 4 and 5). Through this structure, as exemplified in FIG. 8, the plates of the magnet device (200) can be firmly fixed and compressed using the outer protrusions (211) of the flanges (210, 280) through bolts / nuts or other coupling structures.
[0047] As shown in the exemplary dimensions in FIGS. 3 and 4, the magnet device (200) can be implemented with a beater plate-based structure that achieves high current density while having much smaller dimensions (e.g., plate diameter 174 mm) compared to existing products (e.g., coil-based power reactors). In one embodiment, by applying 25 stacks of conductor plates and the aforementioned exemplary thicknesses (flange thickness 10 mm, lead plate thickness 3 mm, conductor plate thickness 1.5 mm, insulator plate thickness 0.5 mm), a magnet device (200) with a height of approximately 76.5 mm and a plate diameter of approximately 174 mm can be implemented.
[0048] Additionally, as shown in the exemplary dimensions in FIG. 6, the core (300) can also be implemented with dimensions much smaller than those of existing products. In the example of FIG. 6, the width / depth and height of the leg (310) penetrating each magnet device (200) may be 46 mm and 150 mm, respectively, and the length of the yoke (320, 330) may be 414 mm.
[0049] FIG. 7 is an exemplary drawing showing a three-phase reactor device composed of a magnet device and a core according to one embodiment of the present disclosure.
[0050] As illustrated in FIG. 7, the three-phase reactor device (100) may include a first magnet device (200-1), a second magnet device (200-2), a third magnet device (200-3), and a core (300). Each leg (310-1, 310-2, 310-3) of the core (300) may be configured to penetrate the center hole of each magnet device (200-1, 200-2, 200-3). Additionally, each magnet device (200-1, 200-2, 200-3) may be formed to have a stacked structure based on a beater plate as described above in relation to FIGS. 2 to 4.
[0051] A reactor device (100) utilizing a biter plate-based magnet device (200) according to the present disclosure is a miniaturized reactor having a high current density and can be applied to various devices such as a reactor for a power converter, a reactor for a vehicle, a reactor for a Flexible AC Transmission System (FACTS), a starting reactor, a shunt reactor, and a current limiting reactor.
[0052] In an additional embodiment, the magnet device (200) according to the present disclosure may be applied to a coreless air-core reactor device.
[0053] In addition, in an additional embodiment, a biter plate-based transformer device can be implemented by applying a magnet device (200) according to the present disclosure to each of the primary and secondary windings of the transformer.
[0054] The description of the presented embodiments is provided so that any person skilled in the art may use or practice the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments without departing from the scope of the present invention. Thus, the present invention is not limited to the embodiments presented herein, but should be interpreted in the broadest possible scope consistent with the principles and novel features presented herein.
[0055] (Explanation of symbols)
[0056] 100: Reactor device
[0057] 200: Magnet device
[0058] 210: Upper flange
[0059] 220: Upper insulator plate
[0060] 230: Upper lead plate
[0061] 240: Conductor plate
[0062] 250: Insulator plate
[0063] 260: Lower lead plate
[0064] 270: Lower insulator plate
[0065] 280: Lower flange
[0066] 300: Core
[0067] 310: Leg
[0068] 320: Upper yoke
[0069] 330: Lower yoke
Claims
1. As a beater plate-based magnet device, Upper lead plate; Multiple conductor plates; A plurality of insulating plates; and Lower lead plate Includes, The above magnet device is formed to have a central hole, and The above conductor plates and the above insulator plates are stacked such that an insulator plate is placed between each of the two conductor plates, and Each conductor plate is formed to have a first radial slot, and each insulator plate is formed to have a second radial slot having a width in the circumferential direction wider than the first radial slot of the conductor plate, and The above conductor plates and the above insulator plates are, A conductor plate and an insulator plate are stacked such that one radial end of a first radial slot of the conductor plate and one radial end of a second radial slot of the insulator plate are aligned, and the next conductor plate and the next insulator plate are rotated by a predetermined angle so that one radial end of a first radial slot of the next conductor plate and one radial end of a second radial slot of the next insulator plate are aligned, in such a manner that they are stacked. Magnet device.
2. In Paragraph 1, The upper lead plate is stacked to contact the uppermost conductor plate, and the lower lead plate is stacked to contact the lowest conductor plate. Magnet device.
3. In Paragraph 1, The upper lead plate and the lower lead plate are each formed to have a contact portion for electrical connection protruding from an outer portion. Magnet device.
4. In Paragraph 3, The above magnet device further includes an upper flange and a lower flange, and An upper insulator plate is disposed between the upper flange and the upper lead plate, and a lower insulator plate is disposed between the lower flange and the lower lead plate. Magnet device.
5. In Paragraph 4, A plurality of holes are formed radially at predetermined intervals in the circumferential direction in each of the conductor plates, the insulator plates, the upper lead plate, the lower lead plate, the upper flange, and the lower flange. Magnet device.
6. In Paragraph 5, The plurality of holes each have an elliptical shape and form a wavy path in the circumferential direction. Magnet device.
7. In Paragraph 4, In the above conductor plates, the above insulator plates, the above upper lead plate, and the above lower lead plate, grooves are formed at predetermined intervals on the outer circumference of each plate. Magnet device.
8. In Paragraph 7, The upper flange and the lower flange are formed with outer protrusions having holes for fixing the magnet device, corresponding to the positions of some of the grooves. Magnet device.
9. In Paragraph 1, The above conductor plate is made of copper or a copper alloy. Magnet device.
10. As a reactor device, A magnet device comprising any one of claims 1 to 9, Reactor device. As a 11.3 phase reactor device, First magnet device; A second magnet device; and It includes a third magnet device, The first magnet device, the second magnet device, and the third magnet device are each formed to have a central hole through which the first leg, the second leg, and the third leg of the core can pass, and Each of the above-mentioned first magnet device, the above-mentioned second magnet device, and the above-mentioned third magnet device is, Upper lead plate; Multiple conductor plates; A plurality of insulating plates; and Lower lead plate Includes, The above conductor plates and the above insulator plates are stacked such that an insulator plate is placed between each of the two conductor plates, and Each conductor plate is formed to have a first radial slot, and each insulator plate is formed to have a second radial slot having a width in the circumferential direction wider than the radial slot of the conductor plate, and The above conductor plates and the above insulator plates are, A conductor plate and an insulator plate are stacked such that one radial end of a first radial slot of the conductor plate and one radial end of a second radial slot of the insulator plate are aligned, and the next conductor plate and the next insulator plate are rotated by a predetermined angle so that one radial end of a first radial slot of the next conductor plate and one radial end of a second radial slot of the next insulator plate are aligned, in such a manner that they are stacked. 3-phase reactor device.